Drilling methods and drilling equipment

Abstract

This application discloses a drilling method and drilling apparatus. The drilling method includes: aligning and loading a product using a fixture mechanism; the product having a portion to be drilled penetrating the product; the fixture mechanism having two first through holes and a second through hole located between the two first through holes, the second through hole being used for alignment with the portion to be drilled in the product; activating a laser mechanism and emitting a laser beam through the second through hole of the fixture mechanism to irradiate and heat the side of the portion to be drilled facing the laser mechanism; when the duration of laser irradiation on the portion to be drilled is detected to be equal to a first preset duration, activating the drilling mechanism and performing a drilling operation on the side of the portion to be drilled away from the laser mechanism until the portion to be drilled is drilled through; when the duration of activation of the laser mechanism is detected to be equal to a second preset duration, deactivating the laser mechanism, wherein the sum of the first preset duration and the second preset duration is less than the drilling operation duration. This method can avoid wear and tear on the drilling mechanism and improve drilling efficiency.

Description

Technical Field

[0001] This application belongs to the field of equipment processing technology, and in particular relates to a drilling method and drilling apparatus. Background Technology

[0002] With the rapid development of electronic technology, drilling technology has been widely applied in fields such as industrial intelligent control systems, aerospace, new energy vehicle power supplies, charging piles, and information appliances. Current drilling technologies mostly involve clamping the workpiece stably and then controlling the high-speed rotation of the drilling equipment to perform the drilling feed. The efficiency of drilling directly depends on the relative strength between the drilling equipment and the workpiece, as well as the rotational speed of the drilling equipment during contact with the workpiece.

[0003] However, when processing high-strength materials / composite materials, the aforementioned drilling equipment suffers significant wear and tear, and its drilling efficiency is low. Summary of the Invention

[0004] This application provides a drilling method and drilling apparatus to solve the problems of significant drilling wear and low drilling efficiency.

[0005] A first aspect of this application provides a drilling method applied to a drilling apparatus. The drilling method includes: aligning and loading a product using a fixture mechanism, the product having a portion to be drilled penetrating the product; the fixture mechanism having two first through holes and a second through hole located between the two first through holes, the second through hole being used for alignment with the portion to be drilled in the product; activating a laser mechanism and emitting a laser beam through the second through hole in the fixture mechanism to irradiate and heat the side of the portion to be drilled facing the laser mechanism; when it is detected that the duration of laser irradiation of the portion to be drilled is equal to a first preset duration, activating the drilling mechanism and performing a drilling operation on the other side of the portion to be drilled away from the laser mechanism until the portion to be drilled is drilled through; when it is detected that the activation duration of the laser mechanism is equal to a second preset duration, deactivating the laser mechanism, wherein the sum of the first preset duration and the second preset duration is less than the drilling operation duration.

[0006] Furthermore, in the drilling method provided in the embodiments of this application, the laser mechanism includes a light source assembly, a laser mirror group, and a power detection assembly. Before activating the laser mechanism, the method further includes: activating the light source assembly and emitting a laser beam to irradiate the power detection assembly via the laser mirror group; determining the detection power corresponding to the power detection assembly; and adjusting the emission position of the light source assembly and the rotation position of the laser mirror group according to the detection power.

[0007] Further, in the drilling method provided in the embodiments of this application, the laser mirror assembly includes a first laser mirror and a second laser mirror, and the power detection component includes a first power detection component and a second power detection component. Adjusting the emission position of the light source assembly and the rotation position of the laser mirror assembly according to the detected power includes: adjusting the first laser mirror and the second laser mirror to a first preset position; turning on the light source assembly so that the laser passes through the first laser mirror and the second laser mirror to the first power detection component; determining a first power corresponding to the first power detection component and adjusting the emission position of the light source assembly according to the first power; rotating the first laser mirror so that the laser passes through a first through hole on the fixture mechanism to the second power detection component; determining a second power corresponding to the second power detection component and adjusting the rotation position of the first laser mirror according to the second power.

[0008] Furthermore, in the drilling method provided in the embodiments of this application, the laser mechanism further includes a through-hole detection component. After the drilling operation is stopped, the method further includes: turning on the through-hole detection component so that the laser passes through the second through-hole on the fixture mechanism; if the through-hole detection component receives a reflection signal corresponding to the laser, it is determined that the product has not been drilled through; if the through-hole detection component does not receive a reflection signal corresponding to the laser, it is determined that the product has been drilled through.

[0009] Furthermore, in the drilling method provided in the embodiments of this application, after the laser mechanism is activated, the method further includes: activating the jet assembly to spray gas onto the laser mirror group to clean the drill material on the surface of the laser mirror group.

[0010] Furthermore, in the drilling method provided in the embodiments of this application, the first preset duration is 0.3-0.7 seconds, the second preset duration is 0.3-0.7 seconds, and the heating temperature of the laser mechanism is 800-1000 degrees Celsius.

[0011] A second aspect of this application provides a drilling apparatus, comprising: a fixture mechanism for loading a product, the product having a portion to be drilled penetrating the product, the fixture mechanism having two first through holes and a second through hole located between the two first through holes, the second through hole being used for alignment with the portion to be drilled in the product; a laser mechanism disposed on one side of the fixture mechanism in a first direction for emitting a laser to irradiate and heat the portion to be drilled through the second through hole; and a drilling mechanism disposed on the other side of the fixture mechanism in the first direction, the drilling mechanism being used to perform a drilling operation on the side of the portion to be drilled opposite to the laser mechanism.

[0012] Furthermore, in the drilling apparatus provided in the embodiments of this application, the laser mechanism includes a light source assembly, a laser mirror group, and a power detection assembly. The light source assembly is disposed on one side of the laser mirror group in a second direction and is used to emit laser light to the laser mirror group. The laser mirror group is used to receive the laser light and transmit the laser light to the power detection assembly. The power detection assembly is used to detect the power of the laser light.

[0013] Furthermore, in the drilling device provided in the embodiments of this application, the product includes a first material layer and a second material layer. The material hardness of the first material layer is greater than that of the second material layer. A third through hole is provided on the second material layer. The third through hole is correspondingly arranged with the second through hole, so that the laser passing through the second through hole can pass through the third through hole to reach the first material layer and heat the first material layer. A material storage groove is provided at the position where the third through hole connects to the first material layer, so as to store the drill material during the drilling process.

[0014] Furthermore, in the drilling apparatus provided in the embodiments of this application, the first material layer is provided with the portion to be drilled, and the third through hole is aligned with the portion to be drilled.

[0015] The drilling method provided in this application embodiment involves a fixture mechanism irradiating a product to heat it. When the activation duration of the laser mechanism is detected to be equal to a first preset duration, the drilling mechanism is activated to perform a drilling operation on the heated product on the fixture mechanism until the product is drilled through. When the activation duration of the laser mechanism is detected to be equal to a second preset duration, the laser mechanism is deactivated. This method, through optical path design of the laser mechanism, ensures that the laser is precisely reflected at a designated location on the product, achieving heating and softening treatment of the product at that designated location. This reduces the stress on the drilling mechanism during drilling operations, thereby avoiding wear and tear on the drilling mechanism and improving drilling efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a drilling device provided in an embodiment of this application;

[0017] Figure 2A This is a first structural schematic diagram of a fixture mechanism provided in an embodiment of this application;

[0018] Figure 2B This is a schematic diagram of the second structure of a fixture mechanism provided in an embodiment of this application;

[0019] Figure 3 This is a schematic diagram of the structure of a laser mechanism provided in an embodiment of this application;

[0020] Figure 4This is a schematic diagram of the structure of a product provided in an embodiment of this application;

[0021] Figure 5 This is an application scenario diagram of a drilling method provided in an embodiment of this application;

[0022] Figure 6 This is a schematic flowchart of a drilling method provided in an embodiment of this application;

[0023] Figure 7 This is a schematic diagram of the adjustment process of a laser mirror assembly provided in the first embodiment of this application;

[0024] Figure 8 This is a schematic diagram of the adjustment process of the laser mirror assembly provided in the second embodiment of this application;

[0025] Figure 9 This is a schematic diagram of the drilling inspection process provided in the embodiments of this application.

[0026] Component symbol marking

[0027] Drilling device 1

[0028] Fixture mechanism 10

[0029] Through hole 11

[0030] First through hole 111

[0031] Second through hole 112

[0032] First positioning through hole 12

[0033] Laser mechanism 20

[0034] Light source component 21

[0035] Tilt adjustment knob 211

[0036] Light source displacement adjustment knob 212

[0037] Laser emitter 213

[0038] Laser Mirror Group 22

[0039] First laser mirror 221

[0040] Second laser mirror 222

[0041] Power detection component 23

[0042] First power detection component 231

[0043] Second power detection component 232

[0044] Base 25

[0045] Second positioning through hole 26

[0046] Positioning pin 27

[0047] Through-hole detection assembly 28

[0048] Drilling mechanism 30

[0049] Knife 31

[0050] Probe 32

[0051] Main bearing carrier 33

[0052] Transportation agencies 40

[0053] Electronic devices 50

[0054] Memory 51

[0055] Controller 52

[0056] Communication bus 53

[0057] Product 60

[0058] First material layer 61

[0059] Drilling section 611

[0060] Second material layer 62

[0061] Third through hole 621

[0062] First section 6211

[0063] 62111 Material Storage Tank

[0064] Second hole section 6212 Detailed Implementation

[0065] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0066] In the description of this application, it should be understood that the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, it should be noted that "a plurality of" means two or more, unless otherwise explicitly specified.

[0067] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0068] With the rapid development of electronic technology, composite components are increasingly used in 3C products in the field of information appliances. Composite components are formed by combining components of two or more different materials. Holes are drilled through the different components in the composite component to allow it to be assembled onto the product using fasteners or other parts. However, existing drilling technologies mostly involve clamping the workpiece and then controlling the drilling equipment to rotate at high speed to feed through the composite component. If the composite component is hard, the wear and tear on the drilling equipment is significant, and the drilling efficiency is low. In addition, gaps will form in the hole wall at the joints of different components, which are exposed to the outside and susceptible to corrosion.

[0069] In view of the above problems, it is necessary to provide a drilling method and drilling apparatus that can solve the problems of significant drilling wear, low drilling efficiency, and easy corrosion of the gaps in the hole wall at the connection of different components.

[0070] Figure 1 This is a schematic diagram of the structure of a drilling device provided in an embodiment of this application, as shown below. Figure 1As shown, the drilling device 1 includes a fixture mechanism 10, a laser mechanism 20, and a drilling mechanism 30. The fixture mechanism 10 is used to load a product 60. The fixture mechanism 10 has a through hole 11 extending along a first direction, and the product 60 covers one end of the through hole 11. The laser mechanism 20 is located on one side of the fixture mechanism 10 in the first direction and is used to emit a laser beam that irradiates the product 60 through the through hole 11, heating the product 60. The drilling mechanism 30 is located on the other side of the fixture mechanism 10 in the first direction and is used to perform drilling operations on the heated product 60. The first direction can be a vertical direction. In this embodiment, the laser mechanism 20 heats the product 60, softening the area of ​​the product 60 to be drilled, reducing the stress on the drilling mechanism 30 during drilling, thus avoiding wear and tear on the drilling mechanism 30 and improving drilling efficiency.

[0071] Figure 2A This is a first structural schematic diagram of a fixture mechanism provided in an embodiment of this application. Figure 2B This is a schematic diagram of the second structure of a fixture mechanism provided in an embodiment of this application, as shown below. Figure 2A and Figure 2B As shown, the through hole 11 includes a first through hole 111 and a second through hole 112. The first through hole 111 is located on the periphery of the second through hole 112, and the first through hole 111 and the second through hole 112 are connected along the first direction. The number and spacing of the first through hole 111 and the second through hole 112 can be set according to actual needs. For example, there can be two first through holes 111 and one second through hole 112, with the second through hole 112 located between the two first through holes 111. When the product 60 is mounted on the fixture mechanism 10, the product can cover one end of the first through hole 111 and the second through hole 112. The structure of the product 60 is adapted to the fixture mechanism 10, so that the product 60 can be accurately placed on the fixture mechanism 10.

[0072] In one embodiment, before drilling the product 60, the optical path of the laser emitted by the laser mechanism 20 needs to be detected and adjusted using the through hole 11, so that the laser can irradiate a designated position on the product 60 to achieve the heating treatment of the product 60. Specifically, the first through hole 111 is used for the laser to pass through and to detect the optical path of the laser; the second through hole 112 is used for the laser to pass through and to heat the product 60 carried on the fixture mechanism 10.

[0073] In one embodiment, the fixture mechanism 10 is further provided with a plurality of first positioning through holes 12, through which the laser mechanism 20 is connected. The number of the first positioning through holes 12 can be set according to actual needs. For example, the number of the first positioning through holes 12 is 4.

[0074] Figure 3 This is a schematic diagram of a laser mechanism provided in an embodiment of this application, as shown below. Figure 3 As shown, the laser mechanism 20 includes a light source assembly 21, a laser mirror group 22, a power detection component 23, and a base 25. The light source assembly 21 and the laser mirror group 22 are disposed on the base 25. The light source assembly 21 is positioned on one side of the laser mirror group 22 in a second direction, and is used to emit laser light to the laser mirror group 22 in the second direction, which then irradiates the power detection component 23. The power detection component 23 is used to detect the power of the laser light. The second direction can be horizontal. In one embodiment, the base 25 is provided with a plurality of second positioning through holes 26 and positioning pins 27. The plurality of second positioning through holes 26 are located at the same positions as the plurality of first positioning through holes 12. The positioning pins 27 connect the first positioning through holes 12 and the second positioning through holes 26, thereby connecting the fixture mechanism 10 and the laser mechanism 20. In one embodiment, the laser mechanism 20 further includes a jet assembly (not shown), which is located on the side of the laser mirror group 22 and is used to jet gas onto the laser mirror group 22 to clean the drill bit on the surface of the laser mirror group 22.

[0075] In one embodiment, the light source assembly 21 is used to emit laser light to the laser mirror group 22. The light source assembly 21 includes a tilt adjustment knob 211, a light source displacement adjustment knob 212, and a laser emitter 213. Both the tilt adjustment knob 211 and the light source displacement adjustment knob 212 are located on the laser emitter 213. The tilt adjustment knob 211 is used to adjust the laser emission angle of the laser emitter 213 in a first direction and a second direction. By adjusting the laser emission angle of the laser emitter 213 using the tilt adjustment knob 211, the laser emission path can be controlled. The light source displacement adjustment knob 212 can adjust the relative position of the laser emitter 213 and the laser mirror group 22 in the first direction and the second direction, causing the laser emitter 213 to move closer to or further away from the laser mirror group 22. By adjusting the position of the laser emitter 213 using the displacement adjustment knob, the laser emission path can be controlled.

[0076] In one embodiment, the laser mirror group 22 is used to receive the laser light. The laser mirror group 22 includes a first laser mirror 221 and a second laser mirror 222. The first laser mirror 221 is disposed on the periphery of the second laser mirror 222. The laser light emitted by the light source assembly 21 irradiates the first through-hole 111 via the first laser mirror 221 and passes through the first through-hole 111 to reach the power detection assembly 23. The laser light emitted by the light source assembly 21 irradiates the second through-hole 112 via the second laser mirror 222 and passes through the second through-hole 112 to reach the product. In one embodiment, for each first through-hole 111, there is a corresponding first laser mirror 221. For example, if there are two first through-holes 111, then there are also two first laser mirrors 221, and the first laser mirror 221 is disposed on the other side of the first through-hole 111 in the first direction. For the second through hole 112, there is also a corresponding second laser mirror 222. For example, if there is one second through hole 112, there is also one second laser mirror 222, and the second laser mirror 222 is disposed on one side of the second through hole 112 in the first direction (for example, the second laser mirror 222 is disposed below the second through hole 112).

[0077] In one embodiment, each laser mirror assembly 22 includes a rotating component and a reflecting mirror. The reflecting mirror is mounted inside the rotating component. By rotating the rotating component, the position of the laser beam illuminating the reflecting mirror can be controlled. In one embodiment, the rotating component is a full circular structure, and the reflecting mirror is a semi-circular mirror. The rotating component can control the laser beam to illuminating the reflecting mirror for emission, or it can directly penetrate the blank area without a reflecting mirror.

[0078] In one embodiment, the power detection component 23 is used to detect the power of the laser. The power detection component 23 includes a first power detection component 231 and a second power detection component 232. The first power detection component 231 is disposed on the other side of the laser mirror group 22 in the second direction, and is used to receive and determine the first power of the laser passing through the laser mirror group 22 (i.e., passing through the first laser mirror 221 and the second laser mirror 222 respectively). Then, optical path deviation information of the light source component 21 is determined based on the first power. The optical path deviation information refers to the positional deviation from a preset optical path. For example, the preset optical path has a corresponding first target power. The optical path deviation information is determined based on the power difference between the first power and the first target power. The larger the power difference, the larger the optical path deviation; the smaller the power difference, the smaller the optical path deviation. If the power difference is greater than a preset deviation value, the optical path deviation information is determined to have a deviation; if the power difference is less than or equal to the preset deviation value, the optical path deviation information is determined to have no deviation. The preset deviation value can be set according to actual needs and is not limited here. If the optical path deviation information indicates a deviation, the light source assembly 21 is adjusted to change the laser emission path, ensuring that the emission path has no deviation or a small deviation from the preset optical path. Adjusting the light source assembly 21 may include adjusting the tilt angle knob 211 and the light source displacement knob 212. In one embodiment, when determining the optical path deviation information of the light source assembly 21 through the first power detection assembly 231, the semi-circular reflector of each laser mirror group 22 can be placed below, allowing the laser light irradiated by the light source assembly 21 to directly pass through the mirrorless portion of each laser mirror group 22 to reach the first power detection assembly 231.

[0079] In one embodiment, the second power detection component 232 is disposed on one side of the first through hole 111 in the first direction, and is used to receive the laser light passing through the first through hole 111 and determine the second power of the laser light. For each first through hole 111, there is a corresponding second power detection component 232. For example, if there are two first through holes 112, namely first through hole B1 and first through hole B2, then there are also two second power detection components 232, namely second power detection component C1 and second power detection component C2. Thus, there are also two first laser mirrors, namely first laser mirror A1 and first laser mirror A2. First laser mirror A1 corresponds to first through hole B1, and first laser mirror A2 corresponds to first through hole B2. In one embodiment, the second power of the laser is determined by the second power detection component 232, which can detect whether the position of the laser mirror group 22 corresponding to the first through-hole 111 meets the preset alignment requirements. Further, the second power detection component C1 detects whether the first laser mirror A1 and the first through-hole B1 meet the preset alignment requirements, and the second power detection component C2 detects whether the first laser mirror A2 and the first through-hole B2 meet the preset alignment requirements. If the detection result indicates that the position of the laser mirror group 22 corresponding to the first through-hole 111 meets the preset alignment requirements, then there is no need to adjust the position of the laser mirror group 22 corresponding to the first through-hole 111. If the detection result indicates that the position of the laser mirror group 22 corresponding to the first through-hole 111 does not meet the preset alignment requirements, then the position of the laser mirror group 22 corresponding to the first through-hole 111 needs to be adjusted. Further, the position of the reflector in the laser mirror group 22 can be adjusted. Here, the preset alignment requirements refer to the second target power of the laser when the alignment is correct. For example, if the second target power is 100 watts, and the second power detection component 232 determines that the second power of the laser is 60 watts, then the position of the reflector in the laser mirror group 22 corresponding to the first through-hole 111 needs to be adjusted; if the second power detection component 232 determines that the second power of the laser is 100 watts, then the position of the reflector in the laser mirror group 22 corresponding to the first through-hole 111 does not need to be adjusted. In one embodiment, when the second power of the laser passing through the first through-hole 111 is determined by the second power detection component 232, the semi-circular emitting mirror of the laser mirror group 22 corresponding to the first through-hole 111 is placed on top, so that the laser irradiated by the light source component 21 passes through the first through-hole 111 and reaches the second power detection component 232 through the reflection of the reflector.

[0080] In one embodiment, the laser mechanism 20 may further include a through-hole detection component 28, which is disposed on one side of the laser mirror group 22 in the first direction. Further, the through-hole detection component 28 is disposed below the second laser mirror 222 in the first direction to emit laser light, allowing the laser to pass through the second laser mirror 222 (i.e., the laser passes through the non-reflective region of the second laser mirror) and irradiate the second through-hole 112 on the fixture mechanism 10. If the through-hole detection component 28 receives a reflection signal corresponding to the laser light, it determines that the product has not been drilled through, or that the drilling mechanism 30 is broken. In this case, it is necessary to continue drilling the drilling mechanism 30 or perform equipment testing on the drilling mechanism 30 to ensure the drilling effect. If the through-hole detection component 28 does not receive a reflection signal corresponding to the laser light, it determines that the product has been drilled through, and that the drilling mechanism 30 is not broken. This application embodiment uses a through-hole detection component 28 to detect the drilling mechanism 30, enabling timely re-drilling of products that have not been drilled through, thus ensuring the drilling effect of the product. Furthermore, the through-hole detection component 28 can detect whether the drilling mechanism 30 has experienced tool breakage, allowing for timely replacement when the drilling mechanism 30 is worn, avoiding the problem of poor drilling effect caused by using worn tools, and further ensuring the drilling effect of the product.

[0081] In one embodiment, the drilling mechanism 30 may include a cutting tool 31, a probe 32, and a main bearing carrier 33. The main bearing carrier 33 is used to mount the cutting tool 31, and the probe 32 is mounted on the cutting tool 31 for detecting the position and depth of the drill hole. The length of the probe 32 can be adjusted as needed for real-time monitoring during the drilling process. When the probe 32 enters the hole, it emits a detection signal to determine the position and depth of the drill hole. In this embodiment, the cutting tool 31 is a thermoelectric drill bit.

[0082] In one embodiment, the drilling device 1 further includes a transport mechanism 40 for carrying the fixture mechanism 10 with the clamped product and transporting the fixture mechanism 10 to the position corresponding to the laser mechanism 20. By controlling the lifting and lowering of the positioning pin 27 in the laser mechanism 20, the positioning pin 27 is inserted into the first positioning through hole 12 corresponding to the fixture mechanism 10, thereby realizing the connection between the fixture mechanism 10 and the laser mechanism 20.

[0083] Figure 4 This is a structural schematic diagram of a product provided in an embodiment of this application, such as... Figure 4As shown, the drilled product 60 can be a composite component, comprising a first material layer 61 and a second material layer 62. The hardness of the first material layer 61 (e.g., the first material layer 61 can be titanium or a titanium alloy layer) is greater than the hardness of the second material layer 62 (e.g., the second material layer 62 can be aluminum or an aluminum alloy layer). In one embodiment, the first material layer 61 has a drillable portion 611 penetrating the product. The projection area of ​​the drillable portion 611 in a first direction at least partially overlaps with the projection of the laser heating area. The drillable portion 611 is aligned with the second through hole 112 of the fixture mechanism. By setting the drillable portion 611, the drilling position of the product can be determined, ensuring the drilling effect of the product. In one embodiment, a third through hole 621 is provided on the second material layer 62, and the third through hole 621 is correspondingly provided with the second through hole 112, so that the laser passing through the second through hole 112 passes through the third through hole 621 to reach the first material layer 61 and heat the first material layer 61; the part to be drilled 611 is aligned with the third through hole 621, and after the part to be drilled 611 in the first material layer 61 is heated and softened, the drilling mechanism 30 is used to perform the drilling operation from the side of the part to be drilled 611 facing away from the laser mechanism 20, thereby reducing the stress of the drilling mechanism 30 when performing the drilling operation, thereby avoiding the wear of the drilling mechanism 30 and improving the drilling efficiency. In one embodiment, the third through hole includes a first hole segment 6211 and a second hole segment 6212. In a first direction, the projected area of ​​the first hole segment 6211 is larger than the projected area of ​​the second hole segment 6212. A material storage groove 62111 is provided on the first hole segment 6211 in an area larger than the projected area of ​​the second hole segment 6212. The material storage groove 62111 is connected to the first material layer and is used to store drill material (i.e., drill material from the first material layer 61) during the drilling process. This embodiment of the application provides a third through hole in the second material layer, and a material storage groove is provided at the location where the third through hole connects to the first material layer. By storing drill material during the drilling process in the material storage groove, overflow defects during drilling operations can be avoided. Furthermore, by wrapping the drill material on the hole wall of the product through the material storage groove, corrosion problems caused by gaps in the hole wall at the connection points of different components are avoided, thus improving the drilling effect of the product.

[0084] In one embodiment, when drilling the product 60 using the drilling device 1, the product 60 can first be clamped on the fixture mechanism 10, and the reference surfaces of the product 60 and the fixture mechanism 10 can be aligned and assembled. Then, the fixture mechanism 10 is transported to the position corresponding to the laser mechanism 20 by the transport mechanism 40. By controlling the lifting and lowering of the positioning pin 27 in the laser mechanism 20, the positioning pin 27 is inserted into the first positioning through hole 12 corresponding to the fixture mechanism 10, thereby realizing the connection between the fixture mechanism 10 and the laser mechanism 20. After that, the components of the laser mechanism 20 are arranged to realize the light processing. Finally, the drilling mechanism 30 is turned on to perform hot drilling on the product 60, and after the processing is completed, the drilling result is detected by the through hole detection component 28 to ensure the drilling effect.

[0085] The drilling apparatus provided in this application embodiment includes a fixture mechanism for loading a product. The product has a portion to be drilled penetrating the product. The fixture mechanism has two first through holes and a second through hole located between the two first through holes. The second through hole is used for alignment with the portion to be drilled in the product. A laser mechanism is disposed on one side of the fixture mechanism in a first direction and is used to emit laser light through the second through hole to irradiate and heat the portion to be drilled. A drilling mechanism is disposed on the other side of the fixture mechanism in the first direction and is used to perform drilling operations on the side of the portion to be drilled that is opposite to the laser mechanism. By designing the optical path of the laser mechanism, the apparatus enables the laser to precisely irradiate a designated position on the product, achieving heating and softening treatment of the product at that designated position. This reduces the stress on the drilling mechanism during drilling operations, thereby avoiding wear and tear on the drilling mechanism and improving drilling efficiency.

[0086] Figure 5 This is an application scenario diagram of a drilling method provided in an embodiment of this application, such as... Figure 5 As shown, the drilling device 1 is connected to the electronic device 50, which automates the drilling process. In one embodiment, the electronic device 50 can be integrated with the drilling device 1 into a single unit; in other embodiments, the electronic device 50 can also be connected to the drilling device 1. Figure 5The following description uses the connection between the drilling device 1 and the electronic device 50 as an example. For instance, a fixture mechanism 10 is used to align and load the product 60. The electronic device 50 controls the laser mechanism 20 to be turned on and emits a laser beam that irradiates and heats the side of the part to be drilled facing the laser mechanism 20 through the second through hole 112 of the fixture mechanism 10. When it is detected that the duration of laser irradiation on the part to be drilled is equal to a first preset duration, the drilling mechanism 30 is turned on to perform a drilling operation on the other side of the part to be drilled that is away from the laser mechanism 20 until the part to be drilled is drilled through. When it is detected that the duration of the laser mechanism 20 is equal to a second preset duration, the laser mechanism 20 is turned off.

[0087] like Figure 5 As shown, the electronic device 50 includes a memory 51, at least one controller 52, and at least one communication bus 53. In some embodiments, the at least one communication bus 53 is configured to enable communication between the memory 51 and the at least one controller 52, etc. The controller 52 is used to implement a drilling method when executing a computer program stored in the memory 51.

[0088] In some embodiments, electronic device 50 may also be connected to client device, which includes, but is not limited to, any electronic product that can interact with a client via a keyboard, mouse, remote control, touchpad or voice control device, such as personal computer, tablet computer, smartphone, digital camera, etc.

[0089] Those skilled in the art should understand that Figure 5 The structure of the electronic device 50 shown does not constitute a limitation of the embodiments of this application. The electronic device 50 may also include more or fewer other hardware or software, or different component arrangements than shown.

[0090] It should be noted that electronic device 50 is only an example. Other existing or future electronic products that are suitable for this application should also be included within the scope of protection of this application and are incorporated herein by reference.

[0091] Figure 6 This is a schematic flowchart of a drilling method provided in an embodiment of this application. The drilling method is applied in electronic devices, such as... Figure 6 As shown, the process includes the following:

[0092] S11, a fixture mechanism is used to align and load the product, the product having a hole to be drilled through the product, the fixture mechanism having two first through holes and a second through hole located between the two first through holes, the second through hole being used to align with the hole to be drilled in the product.

[0093] In one embodiment, the fixture mechanism has two first through holes and a second through hole located between the two first through holes, and the product has a portion to be drilled that penetrates the product. When the fixture mechanism is used to align and load the product, the second through hole is used to align with the portion to be drilled in the product, so that the product can be accurately placed on the fixture mechanism.

[0094] S12, the laser mechanism is activated and a laser is emitted to irradiate and heat the side of the part to be drilled facing the laser mechanism through the second through hole of the fixture mechanism.

[0095] In one embodiment, after detecting that a product is aligned and loaded on the fixture mechanism, the electronic device can send an opening command to the laser mechanism. Upon receiving the opening command, the laser structure emits a laser beam through the second through-hole of the fixture mechanism to irradiate and heat the side of the part of the product to be drilled facing the laser mechanism, thereby achieving a heating and softening treatment of the part of the product to be drilled. Exemplarily, the fixture mechanism may also be equipped with a gravity sensing component to monitor the gravity information of the product, which is then sent to the electronic device. After determining that a product is loaded on the fixture mechanism based on the gravity information, the electronic device sends an opening command to the laser mechanism. In other embodiments, the opening command can also be issued by a client device connected to the electronic device, such as a keyboard, mouse, remote control, touchpad, or voice control device, to instruct the laser mechanism to open and emit a laser beam.

[0096] S13, when it is detected that the duration of laser irradiation on the part to be drilled is equal to the first preset duration, the drilling mechanism is activated, and drilling operation is performed on the side of the part to be drilled that is opposite to the laser mechanism, until the part to be drilled is drilled through.

[0097] In one embodiment, the first preset duration can be determined based on the product's performance. For example, taking a product made of titanium as an example, to reduce the stress on the cutting tool and prevent changes in the titanium's crystal phase, the laser is activated approximately 0.3-0.7 seconds before the drilling operation, i.e., the first preset duration is 0.3-0.7 seconds. The product is heated to 800-1000 degrees Celsius by activating the laser mechanism before drilling begins.

[0098] S14, when it is detected that the opening duration of the laser mechanism is equal to the second preset duration, the laser mechanism is turned off, wherein the sum of the first preset duration and the second preset duration is less than the drilling operation duration.

[0099] In one embodiment, after the drilling mechanism is activated, the product is heated by the laser mechanism for a second preset time, which can be 0.3-0.7 seconds. When the activation time of the laser mechanism equals the second preset time, the laser mechanism is deactivated. At this time, the drilling mechanism may still be performing drilling operations until the product is drilled through. The duration for which the drilling mechanism performs drilling operations on the side of the part to be drilled that is opposite to the laser mechanism is recorded as the drilling operation duration. The sum of the first preset time and the second preset time is less than the drilling operation duration.

[0100] The drilling method provided in this application embodiment heats the part of the product to be drilled by activating a laser mechanism and emitting a laser beam through the second through hole of the fixture mechanism to irradiate the side of the part to be drilled facing the laser mechanism. Then, the drilling mechanism performs a drilling operation on the heated part of the product. This method, through optical path design of the laser mechanism, ensures that the laser beam is precisely reflected at a designated location on the product (i.e., the part to be drilled), achieving a softening treatment of the product at that designated location. This reduces the stress on the drilling mechanism during drilling operations, thereby avoiding wear and tear on the drilling mechanism and improving drilling efficiency.

[0101] In one embodiment, before activating the laser mirror assembly, the optical path and rotation position of the laser mirror assembly need to be adjusted to improve the accuracy of laser irradiation on the product position, thereby improving the accuracy of laser heating of the product and thus improving drilling efficiency. Figure 7 This is a schematic diagram illustrating the adjustment process of a laser mirror assembly according to the first embodiment of this application. The laser mirror assembly adjustment method is applied in electronic devices, such as... Figure 7 As shown, the process includes the following:

[0102] S21, turn on the light source assembly and emit laser light to irradiate the power detection assembly via the laser mirror group.

[0103] In one embodiment, the light source assembly is turned on, and the positions of the inner reflectors of the first and second laser mirrors in the laser mirror assembly are adjusted so that the laser can pass through the first and second laser mirrors and reach the corresponding power detection component. The power detection component includes a first power detection component and a second power detection component. The laser light passing through the first and second laser mirrors is irradiated by the first power detection component, which determines the detected power of the laser. The laser light passing through the first laser mirror is then irradiated by the second power detection component, which determines the detected power of the laser.

[0104] S22, determine the detection power corresponding to the power detection component.

[0105] In one embodiment, the detection power corresponding to the power detection component may include the detection power detected by the first power detection component (also referred to as "first power" in this application embodiment) and the detection power detected by the second power detection component (also referred to as "second power" in this application embodiment). The first power is used to determine whether the optical path of the laser emitted by the light source component has deviated, and the second power is used to determine the rotation position of the reflector in the laser mirror group.

[0106] S23, adjust the emission position of the light source assembly and the rotation position of the laser mirror assembly according to the detection power.

[0107] In one embodiment, the optical path deviation information of the light source component is determined based on the first power. The optical path deviation information refers to the positional deviation from a preset optical path. For example, the preset optical path has a corresponding first target power. The optical path deviation information is determined based on the power difference between the first power and the first target power. A larger power difference indicates a larger optical path deviation; a smaller power difference indicates a smaller optical path deviation. If the power difference is greater than a preset deviation value, the optical path deviation information is determined to exist; if the power difference is less than or equal to the preset deviation value, the optical path deviation information is determined to have no deviation. The preset deviation value can be set according to actual needs and is not limited here. If the optical path deviation information indicates a deviation, the light source component is adjusted to change the laser emission path, so that there is no deviation or a small deviation between the emission path and the preset optical path. In one embodiment, adjusting the emission position of the light source component may include adjusting the tilt angle and displacement of the light source component. The tilt angle refers to the laser emission angle of the light source component in a first direction and a second direction. By adjusting the laser emission angle of the light source component, the laser emission path can be controlled. Displacement refers to adjusting the relative position of the light source component and the laser mirror group in the first and second directions (the light source component moves closer to or further away from the laser mirror group). By adjusting the position of the light source component, the emission path of the laser can be controlled.

[0108] In one embodiment, the laser mirror assembly is assessed based on the second power to determine whether it meets the preset alignment requirements. If the detection result indicates that the position of the laser mirror assembly meets the preset alignment requirements, then no adjustment of the laser mirror assembly's position is necessary. If the detection result indicates that the position of the laser mirror assembly does not meet the preset alignment requirements, then the position of the laser mirror assembly needs to be adjusted. Furthermore, the position of the reflector within the laser mirror assembly can be adjusted. The preset alignment requirements may refer to the second target power of the laser when the alignment is correct.

[0109] In this embodiment, the optical path of the light source assembly and the rotation position of the laser mirror assembly are adjusted before the laser mirror assembly is turned on, so as to improve the accuracy of laser irradiation on the product position, thereby improving the accuracy of laser heating of the product and thus improving drilling efficiency.

[0110] In one embodiment, the laser mirror assembly includes a first laser mirror and a second laser mirror, and the power detection component includes a first power detection component and a second power detection component. The emission position of the light source assembly is adjusted according to the first power detected by the first power detection component, and the rotation position of the reflectors in the first laser mirror and the second laser mirror is adjusted according to the second power detected by the second power detection component. Figure 8 This is a schematic diagram of the adjustment process for the laser mirror assembly provided in the second embodiment of this application. The laser mirror assembly adjustment method is applied in electronic devices, such as... Figure 8 As shown, the process includes the following:

[0111] S31, adjust the first laser mirror and the second laser mirror to rotate to the first preset position.

[0112] S32, turn on the light source assembly, so that the laser passes through the first laser mirror and the second laser mirror to the first power detection assembly.

[0113] In one embodiment, when determining the optical path deviation information of the light source component through the first power detection component, the reflectors of the first laser mirror and the second laser mirror can be placed below (also referred to as the first preset position in this application), so that the laser irradiated by the light source component directly passes through the blank part of the first laser mirror and the second laser mirror to reach the first power detection component.

[0114] S33, determine the first power corresponding to the first power detection component, and adjust the emission position of the light source component according to the first power.

[0115] In one embodiment, the optical path deviation information of the light source component is determined based on the first power. The optical path deviation information refers to the deviation value between the first target power and the first power when there is no optical path deviation. The deviation value is preset, for example, 0. For example, if the first target power is 100 watts, then the optical path deviation information is determined to be without deviation based on the first power; if the first power is less than or greater than 100 watts, then the optical path deviation information is determined to have a deviation based on the first power. If the optical path deviation information indicates a deviation, the light source component is adjusted to change the laser emission path, making the deviation between the emission path and the preset optical path less than or equal to the preset deviation value. If the optical path deviation information is determined to be without deviation based on the first power, the first laser mirror is rotated, and the rotational position of each first laser mirror is adjusted so that the first laser mirror and the first through-hole in the fixture mechanism, and the second laser mirror and the second through-hole in the fixture mechanism, can meet the preset light alignment requirements.

[0116] S34, rotate the first laser mirror so that the laser passes through the first through hole on the fixture mechanism to the second power detection component.

[0117] S35, determine the second power corresponding to the second power detection component, and adjust the rotation position of the first laser mirror according to the second power.

[0118] In one embodiment, there are two first laser mirrors, namely first laser mirror A1 and first laser mirror A2, which are disposed around the periphery of the second laser mirror. There are two first through holes, namely first through hole B1 and first through hole B2. First laser mirror A1 corresponds to first through hole B1 and must meet a preset alignment requirement; first laser mirror A2 corresponds to first through hole B2 and must meet a preset alignment requirement. There are two second power detection components, namely second power detection component C1 and second power detection component C2. Second power detection component C1 is used to receive the laser light passing through first laser mirror A1 and detect its corresponding second power D1, and second power detection component C2 is used to receive the laser light passing through first laser mirror A2 and detect its corresponding second power D2.

[0119] In one embodiment, firstly, the first laser mirror A1 is rotated so that the laser emitted by the light source assembly passes through the reflector in the first laser mirror A1 and reaches the first through hole B1. The second power detection component C1 receives the laser passing through the first through hole B1 and detects its corresponding second power D1. Based on the second power D1, it is determined whether the position of the reflector in the first laser mirror A1 meets the preset alignment requirements. If the position of the reflector meets the preset alignment requirements, there is no need to adjust the first laser mirror A1. If the position of the reflector does not meet the preset alignment requirements, the position of the reflector in the first laser mirror A1 is adjusted until the position of the reflector meets the preset alignment requirements. Then, the first laser mirror A2 is rotated so that the laser emitted by the light source component passes through the blank area (i.e., the area without a reflector) of the first laser mirror A1, the blank area (i.e., the area without a reflector) of the second laser mirror, and the reflector in the first laser mirror A2 to reach the first through hole B2. The second power detection component C2 receives the laser passing through the first through hole B2 and detects its corresponding second power D2. Based on the second power D2, it is determined whether the position of the reflector in the first laser mirror A2 meets the preset alignment requirements. If the position of the reflector meets the preset alignment requirements, there is no need to adjust the first laser mirror A2. If the position of the reflector does not meet the preset alignment requirements, the position of the reflector in the first laser mirror A2 is adjusted until the position of the reflector meets the preset alignment requirements.

[0120] In this embodiment, before activating the laser mirror assembly, the emission position of the light source assembly and the rotation position of the reflectors of the first and second laser mirrors are adjusted so that the first laser mirror and the corresponding first through hole complete the light alignment process, thereby improving the accuracy of laser irradiation on the product position, thus improving the accuracy of laser heating of the product and improving drilling efficiency.

[0121] In one embodiment, the drilling rate of the drilling mechanism is set according to the thickness of the product. For example, if the product thickness is approximately 1.5 mm, the drilling rate can be 0.5 mm / sec. Thus, the overall processing time of the drilling mechanism is approximately 2-4 seconds. After the drilling mechanism completes the drilling operation, the tool is withdrawn from the hole to be drilled, and the drilling operation continues for the next product. During the above operation, it is necessary to check whether the hole to be drilled is completely drilled and whether there is any tool breakage to ensure the drilling effect. Figure 9 This is a schematic diagram of the drilling inspection process provided in an embodiment of this application. The drilling inspection method is applied in electronic devices, such as... Figure 9 As shown, the process includes the following:

[0122] S41, the through-hole detection component is activated, allowing the laser to pass through the second through-hole on the fixture mechanism.

[0123] In one embodiment, the through-hole detection component can emit a line laser and receive the reflected signal of the line laser, thereby activating the through-hole detection component and allowing the laser to pass through the second through-hole on the fixture mechanism.

[0124] S42, if the through-hole detection component receives a reflected signal corresponding to the laser, it is determined that the product has not been drilled through.

[0125] In one embodiment, if the through-hole detection component receives reflected laser light, it indicates that the product has not been drilled through, or that the cutting tool of the drilling mechanism has broken in the part to be drilled. In this case, it is necessary to continue to call the drilling mechanism to perform drilling operations or to perform equipment inspection on the drilling mechanism to ensure the drilling effect.

[0126] S43, if the through-hole detection component does not receive the reflection signal corresponding to the laser, it is determined that the product has been drilled through.

[0127] In one embodiment, if the through-hole detection component does not receive reflected laser light, it indicates that the product has been drilled through and the drilling tool of the drilling mechanism has not broken.

[0128] This application embodiment uses a through-hole detection component to emit a laser to detect whether the product has been drilled through. This allows for timely re-drilling of products that have not been drilled through, ensuring the drilling effect of the product. Furthermore, the through-hole detection component can detect whether the drilling mechanism has experienced tool breakage. If the drilling mechanism is worn out, it can be replaced in time to avoid using worn-out tools that result in poor drilling effect, further ensuring the drilling effect of the product.

[0129] In one embodiment, after activating the laser mirror assembly, the method further includes: activating the jet assembly to spray gas onto the laser mirror assembly, thereby cleaning the drill bit from the surface of the laser mirror assembly. This embodiment cleans the surface of the laser mirror assembly by activating the jet assembly, ensuring that the power of the laser emitted by the laser mirror assembly remains stable. This avoids the problem of laser power reduction due to surface contamination of the laser mirror assembly, improves the laser heating effect of the product, thereby avoiding wear and tear on the drilling mechanism and increasing drilling efficiency.

[0130] then Figure 5 Although not shown, the electronic device 50 may also include a power supply (such as a battery) for powering various components. Preferably, the power supply can be logically connected to at least one controller 52 via a power management device, thereby enabling functions such as managing charging and discharging through the power management device. The electronic device 50 may also include various sensors, Bluetooth modules, Wi-Fi modules, etc., which will not be described in detail here.

[0131] In some embodiments, the memory 51 stores a computer program that, when executed by at least one controller 52, implements all or part of the steps in the drilling method, as described above. The memory 51 includes a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), a one-time programmable read-only memory (OTPROM), an electrically-erasable programmable read-only memory (EEPROM), a compact disc read-only memory (CD-ROM) or other optical disc storage device, a magnetic disk storage device, a magnetic tape storage device, or any other computer-readable medium capable of carrying or storing data.

[0132] Furthermore, the computer-readable storage medium may primarily include a stored program area and a stored data area, wherein the stored program area may store the operating system, an application program required for at least one function, etc.; and the stored data area may store data created based on the use of the drilling apparatus 1, etc.

[0133] In some embodiments, at least one controller 52 is the control unit of the electronic device 50, connecting various components of the electronic device 50 via various interfaces and lines. It executes programs or modules stored in the memory 51 and calls data stored in the memory 51 to perform various functions of the drilling apparatus and process data. For example, when at least one controller 52 executes a computer program stored in a storage device, it implements all or part of the steps of the drilling method in the embodiments of this application; or it implements all or part of the functions of the electronic device 50. At least one controller 52 may be composed of integrated circuits, such as a single-packaged integrated circuit or multiple integrated circuits with the same or different functions, including combinations of one or more central processing units (CPUs), microprocessors, digital processing chips, graphics processors, and various control chips.

[0134] The integrated unit implemented as a software functional module described above can be stored in a computer-readable storage medium. This software functional module, stored in a storage medium, includes several instructions to cause a processor to execute portions of the methods described in the various embodiments of this application.

[0135] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of modules is only a logical functional division, and other division methods may be used in actual implementation.

[0136] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical units; they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0137] Furthermore, the functional modules in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or in the form of hardware plus software functional modules.

[0138] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be embraced within this application. No reference numerals in the claims should be construed as limiting the scope of the claims. Furthermore, it is clear that the word "comprising" does not exclude other elements or, and the singular does not exclude the plural. Multiple elements or devices recited in the specification may also be implemented by a single element or device through software or hardware. The terms "first," "second," etc., are used to indicate names and do not indicate any particular order.

[0139] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A drilling method applied to a drilling apparatus, characterized by, The drilling method comprises: loading a product in position by a jig mechanism, the product having a to-be-drilled part penetrating through the product, the jig mechanism being provided with two first through holes and a second through hole between the two first through holes, the second through hole being used for aligning with the to-be-drilled part of the product; turning on a laser mechanism and emitting laser to irradiate and heat a side of the to-be-drilled part facing the laser mechanism via the second through hole of the jig mechanism, the laser mechanism comprising a light source assembly, a laser mirror set and a power detection assembly, the laser mirror set comprising a first laser mirror and a second laser mirror, the first laser mirror being arranged on the periphery of the second laser mirror, the laser emitted by the light source assembly irradiating to the first through hole via the first laser mirror and passing through the first through hole to the power detection assembly, the laser emitted by the light source assembly irradiating to the second through hole via the second laser mirror and passing through the second through hole to the product, the power detection assembly comprising a first power detection assembly and a second power detection assembly, the first power detection assembly being arranged on the other side of the laser mirror set in a second direction, the second power detection assembly being arranged on one side of the first through hole in a first direction, before turning on the laser mechanism, the method further comprising: determining a first power of the laser passing through the first laser mirror and the second laser mirror by the first power detection assembly, the first power being used for determining whether the light path of the laser emitted by the light source assembly deviates, and receiving the laser passing through the first through hole by the second power detection assembly and determining a second power of the laser, the second power being used for determining the rotation position of the reflecting mirror in the first laser mirror; when it is monitored that the to-be-drilled part is irradiated by the laser for a first preset time length, turning on a drilling mechanism to perform drilling operation on the other side of the to-be-drilled part away from the laser mechanism until the to-be-drilled part is drilled through; when it is monitored that the laser mechanism is turned on for a second preset time length, turning off the laser mechanism, wherein the sum of the first preset time length and the second preset time length is less than the drilling operation time length.

2. The drilling method according to claim 1, wherein Before turning on the laser mechanism, the method further comprises: turning on the light source assembly and emitting laser to irradiate to the power detection assembly via the laser mirror set; determining the detection power corresponding to the power detection assembly; adjusting the emission position of the light source assembly and the rotation position of the laser mirror set according to the detection power.

3. The drilling method according to claim 2, wherein The adjusting the emission position of the light source assembly and the rotation position of the laser mirror set according to the detection power comprises: adjusting the first laser mirror and the second laser mirror to rotate to a first preset position; turning on the light source assembly so that the laser passes through the first laser mirror and the second laser mirror to the first power detection assembly respectively; determining the first power corresponding to the first power detection assembly and adjusting the emission position of the light source assembly according to the first power; rotating the first laser mirror so that the laser passes through the first through hole on the jig mechanism to the second power detection assembly; determining a second power corresponding to the second power detection component, and adjusting the rotation position of the first laser mirror according to the second power.

4. The drilling method according to claim 3, wherein The laser mechanism further comprises a through-hole detection component, and after stopping the drilling operation, the method further comprises: starting the through-hole detection component so that laser passes through the second through-hole on the jig mechanism; if the through-hole detection component receives a reflection signal corresponding to the laser, it is determined that the product is not drilled through; if the through-hole detection component does not receive a reflection signal corresponding to the laser, it is determined that the product is drilled through.

5. The method of drilling of claim 2, wherein, After starting the laser mechanism, the method further comprises: starting a gas jetting component so that gas is jetted to the laser mirror group to clean the drilling material on the surface of the laser mirror group.

6. The method of drilling of claim 1 wherein, The first preset time length is 0.3-0.7 seconds, the second preset time length is 0.3-0.7 seconds, and the heating temperature of the laser mechanism is 800-1000 degrees Celsius.

7. A drilling apparatus, characterized by The drilling device comprises: a jig mechanism for loading a product, the product having a to-be-drilled portion penetrating through the product, the jig mechanism being provided with two first through-holes and a second through-hole located between the two first through-holes, the second through-hole being used for alignment with the to-be-drilled portion of the product; a laser mechanism located at one side of the jig mechanism in a first direction, used for emitting laser to irradiate and heat the to-be-drilled portion via the second through-hole, the laser mechanism comprising a light source component, a laser mirror group, and a power detection component, the laser mirror group comprising a first laser mirror and a second laser mirror, the first laser mirror being located at the periphery of the second laser mirror, the light source component emitting laser to irradiate to the first through-hole via the first laser mirror and to pass through the first through-hole to the power detection component, the light source component emitting laser to irradiate to the second through-hole via the second laser mirror and to pass through the second through-hole to the product, the power detection component comprising a first power detection component and a second power detection component, the first power detection component being located at the other side of the laser mirror group in a second direction, the second power detection component being located at one side of the first through-hole in the first direction, the first power detection component being used for determining a first power of laser passing through the first laser mirror and the second laser mirror, the first power being used for determining whether the optical path of laser emitted by the light source component deviates, and the second power detection component being used for receiving laser passing through the first through-hole and determining a second power of the laser, the second power being used for determining the rotation position of a reflecting mirror in the first laser mirror; a drilling mechanism located at the other side of the jig mechanism in the first direction, and used for performing a drilling operation on the side of the to-be-drilled portion facing away from the laser mechanism.

8. The drilling apparatus of claim 7, wherein, The light source component is located at one side of the laser mirror group in a second direction, used for emitting laser to the laser mirror group and irradiating to the power detection component via the laser mirror group; and the power detection component is used for detecting the power of the laser. The light source component is located at one side of the laser mirror group in a second direction, used for emitting laser to the laser mirror group and irradiating to the power detection component via the laser mirror group; and the power detection component is used for detecting the power of the laser.

9. The drilling apparatus of claim 7, wherein, The product comprises a first material layer and a second material layer, the material hardness of the first material layer is greater than that of the second material layer, the second material layer is provided with a third through hole, the third through hole is arranged correspondingly with the second through hole, so that the laser passing through the second through hole passes through the third through hole to the first material layer to heat the first material layer; the position of the third through hole connected with the first material layer is provided with a material storage groove for storing drilling materials during drilling.

10. The drilling apparatus of claim 9, wherein, The first material layer is provided with the part to be drilled, and the third through hole is aligned with the part to be drilled.

Images