Lead layer, substrate and inductor

Abstract

The present invention relates to the field of inductor technology, and discloses a lead layer, a substrate, and an inductor, comprising an insulating layer and an electrode, wherein the insulating layer has an edge along the width direction of the lead layer, and the electrode is provided on the insulating layer. The electrode comprises a coil, a connection plate, and a lead portion, wherein the connection plate is provided at one end of the coil, and the lead portion is provided at the other end of the coil. The lead portion is located at an edge of the insulating layer along the length direction of the lead layer, and a projection of the lead portion on the surface of the insulating layer along the thickness direction of the lead layer is a distance d from the coil and the lead portion is spaced apart from the edge. The spacing distance between the lead portion and the edge is L, and L ≥ 0.5d. The lead layer, substrate, and inductor of the embodiments of the present invention can prevent plating solution from penetrating into the electrodes of the lead layer, reduce the risk of short circuiting of the inductor, and have a high production yield of the inductor.

Description

Technical Field

[0001] The present invention relates to the technical field of inductors, and in particular to a lead layer, a substrate and an inductor. Background Art

[0002] In related art, the inner electrodes of an inductor are usually electrically connected to the outer electrodes via a lead layer, specifically by extending the electrodes of the lead layer at the corners of the lead layer to contact and conduct with the outer electrodes.

[0003] However, the outer electrodes need to be chamfered at the corners, and the thickness of the outer electrodes at the corners is relatively small. When the inductor is electroplated, the plating solution easily penetrates from the corners through the outer electrodes into the electrodes of the lead layer, resulting in a high risk of short circuit in the inductor and a low yield rate in the preparation of the inductor. Summary of the Invention

[0004] The embodiments of the present invention disclose a lead layer, a substrate, and an inductor, which can prevent a plating solution from penetrating into electrodes of the lead layer, reduce the risk of a short circuit of the inductor, and have a high production yield of the inductor.

[0005] In a first aspect, an embodiment of the present invention discloses a lead layer, comprising an insulating layer and an electrode, wherein the insulating layer has an edge along the width direction of the lead layer, the electrode is provided on the insulating layer, the electrode comprises a coil, a connection pad, and a lead portion, the connection pad is provided at one end of the coil, the lead portion is provided at the other end of the coil, and the lead portion is located at an edge of one end of the insulating layer along the length direction of the lead layer;

[0006] Among them, along the projection of the thickness direction of the lead layer on the surface of the insulating layer, the distance between the coil and the edge is d, the lead portion is spaced apart from the edge, and the spacing distance between the lead portion and the edge is L, L≥0.5d.

[0007] As an optional implementation, in an embodiment of the present invention, the width of the insulating layer is w1, 1 / 3w1≤c≤1 / 2w1.

[0008] As an optional embodiment, in an embodiment of the present invention, the edge includes a first edge and a second edge opposite to each other along the width direction, and a projection along the thickness direction of the lead layer on the surface of the insulating layer is a distance d from the coil and the first edge, a distance d from the coil and the second edge, a spacing distance L between the lead portion and the first edge, and a spacing distance L between the lead portion and the second edge;

[0009] The values ​​of the spacing distance L between the lead-out portion and the first edge and the spacing distance L between the lead-out portion and the second edge are the same or different.

[0010] As an optional implementation, in an embodiment of the present invention, the width of the coil is w2, the length of the lead-out portion along the width direction is c, and c>w2.

[0011] As an optional implementation, in this embodiment of the present invention, c≤10w2.

[0012] As an optional embodiment, in an embodiment of the present invention, the coil includes a main body and an extension portion, the main body is constructed in a winding shape, one end of the main body is provided with the connecting disk, the extension portion is provided at the other end of the main body, the extension portion extends from the other end of the main body to the lead-out portion and is connected to the lead-out portion, and the extension direction of the extension portion is inclined to the length direction.

[0013] As an optional embodiment, in an embodiment of the present invention, the extension portion has a first side and a second side that are spaced apart along the projection of the lead layer on the surface of the insulating layer in the thickness direction, the first side extending from the other end of the main body portion to the lead-out portion and connected to the side of the lead-out portion facing the first edge, and the second side extending from the other end of the main body portion to the lead-out portion and connected to the side of the lead-out portion along the length direction toward the main body portion.

[0014] In the second aspect, an embodiment of the present invention discloses a substrate, comprising an inner electrode layer and a lead layer of the first aspect, wherein the inner electrode layer has an inner electrode, and the lead layer is provided on both sides of the inner electrode layer along the thickness direction, and the two ends of the inner electrode are respectively electrically connected to the connection plates of the lead layer located on both sides of the inner electrode layer.

[0015] In a third aspect, an embodiment of the present invention discloses an inductor, comprising a first external electrode, a second external electrode, and a substrate of the second aspect, wherein the first external electrode is disposed at one end of the substrate, and is electrically connected to the lead portion of one of the lead layers; the second external electrode is disposed at an end of the substrate facing away from the first external electrode, and is electrically connected to the lead portion of the other lead layer.

[0016] Compared with the prior art, the embodiments of the present invention have at least the following beneficial effects:

[0017] In an embodiment of the present invention, an electrode is provided through an insulating layer, a connection pad is provided at one end of the electrode, and a lead portion is provided at the other end. The lead portion is located at one end edge of the insulating layer along the length direction of the lead layer. At the same time, along the projection of the lead layer on the insulating layer in the thickness direction, the lead portion is spaced apart from the edge of the insulating layer in the width direction. Based on this, when the lead layer is applied to an inductor, the lead portion is located at one end edge of the insulating layer along the length direction of the lead layer, and is located in the middle position along the width direction, away from the corners of the lead layer. The lead portion can be electrically connected to the external electrode of the inductor. When the inductor is plated, the position of the external electrode corresponding to the lead portion is away from the corners of the lead layer. The thickness of the external electrode is relatively large, which can prevent the plating solution from seeping into the lead portion from the position of the external electrode corresponding to the lead portion, thereby reducing the risk of short circuit in the inductor and achieving a high production yield of the inductor.

[0018] Furthermore, the distance d between the coil and the edge and the spacing L between the lead portion and the edge satisfy L ≥ 0.5d. This reduces the risk of the plating solution seeping from the external electrode into the lead portion, causing the inductor to short-circuit, and improves the yield of the inductor manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this technical field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 This is a schematic structural diagram of a lead layer disclosed in the first embodiment of the present invention;

[0021] Figure 2 is a schematic structural diagram of the substrate disclosed in Example 2 of the present invention;

[0022] Figure 3 This is a schematic diagram of the exploded structure of the base disclosed in the second embodiment of the present invention;

[0023] Figure 4 is a schematic structural diagram of the inductor disclosed in the third embodiment of the present invention;

[0024] Figure 5 Schematic diagram of the internal structure of the inductor (with the inner electrode layer omitted) disclosed in the third embodiment of the present invention.

[0025] Description of main reference numerals

[0026] 100, lead layer; 10, insulating layer; 10a, first edge; 10b, second edge; 20, electrode; 21, coil; 211, main body; 212, extension portion; 212a, first side; 212b, second side; 22, connecting pad; 23, lead-out portion; 200, substrate; 201, inner electrode layer; 300, inductor; 30, first outer electrode; 31, second outer electrode; x, width direction; y, length direction. DETAILED DESCRIPTION

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0028] In the present invention, terms such as "upper," "lower," "left," "right," "front," "back," "top," "bottom," "inner," "outer," "center," "vertical," "horizontal," "transverse," and "longitudinal" indicate positions or locations based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe the present invention and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0029] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

[0030] Furthermore, the terms "installed," "disposed," "provided with," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on specific circumstances.

[0031] Furthermore, the terms "first," "second," etc., are primarily used to distinguish between different devices, elements, or components (which may or may not be of the same type and configuration), and are not intended to indicate or imply the relative importance or quantity of the devices, elements, or components indicated. Unless otherwise specified, "plurality" means two or more.

[0032] The present invention discloses a lead layer, a substrate and an inductor, which can prevent a plating solution from penetrating into an electrode of the lead layer, reduce the risk of a short circuit of the inductor, and have a high preparation yield of the inductor.

[0033] Example 1

[0034] See also Figure 1 , is a structural schematic diagram of a lead layer 100 provided in Example 1 of the present invention, the lead layer 100 includes an insulating layer 10 and an electrode 20, the insulating layer 10 has an edge along the width direction x of the lead layer 100, the electrode 20 is provided on the insulating layer 10, the electrode 20 includes a coil 21, a connecting pad 22 and a lead-out portion 23, the connecting pad 22 is provided at one end of the coil 21, and the lead-out portion 23 is provided at the other end of the coil 21, and the lead-out portion 23 is located at one end edge of the insulating layer 10 along the length direction y of the lead layer 100, and the projection on the surface of the insulating layer 10 along the thickness direction of the lead layer 100, the distance between the coil 21 and the edge is d, the lead-out portion 23 is spaced apart from the edge, and the spacing distance between the lead-out portion 23 and the edge is L, L≥0.5d.

[0035] Among them, such as Figure 1 As shown, the thickness direction is perpendicular to Figure 1 The direction of the paper.

[0036] In this embodiment, an electrode 20 is set through the insulating layer 10, a connecting pad 22 is set at one end of the electrode 20, and a lead-out portion 23 is set at the other end, and the lead-out portion 23 is located at one end edge of the insulating layer 10 along the length direction y of the lead layer 100. At the same time, along the projection of the lead-out portion 23 on the insulating layer 10 in the thickness direction of the lead layer 100, the lead-out portion 23 is spaced apart from the edge of the insulating layer 10 along the width direction x of the lead layer 100. Based on this, when the lead layer 100 is applied to the inductor, the lead portion 23 is located at one end edge of the insulating layer 10 along the length direction y of the lead layer 100, and is located in the middle position along the width direction x, away from the corners of the lead layer 100. The lead portion 23 can be electrically connected to the external electrode 20 of the inductor. When the inductor is plated, the position of the external electrode 20 corresponding to the lead portion 23 is away from the corners of the lead layer 100. The thickness of the external electrode 20 is large, which can prevent the plating solution from penetrating from the position of the external electrode 20 corresponding to the lead portion 23 to the lead portion 23, thereby reducing the risk of short circuit of the inductor, and the preparation yield of the inductor is high.

[0037] Furthermore, the distance d between the coil 21 and the edge and the spacing L between the lead portion 23 and the edge satisfy L ≥ 0.5d. This reduces the risk of the plating solution seeping from the external electrode 20 into the lead portion 23, causing the inductor to short-circuit, and improves the yield of the inductor manufacturing.

[0038] In addition, when the lead layer 100 is applied to the inductor, the position of the lead portion 23 on the insulating layer 10 is kept away from the edge of the insulating layer 10 along the width direction x of the lead layer 100, that is, away from the corner position of the lead layer 100. In this way, when the inductor is bumped, the lead portion 23 is kept away from the corner position of the inductor, which can avoid the situation where the thickness and strength of the external electrode 20 at the corner position are smaller, resulting in the impact force applied to the external electrode 20 being transmitted to the lead portion 23 and causing the electrode 20 to crack.

[0039] The corner positions are the four corner positions of the outer contour of the guide line layer 100, that is, the connection points of the two connected sides of the outer contour, such as Figure 1 , the lead layer 100 has four corner positions.

[0040] In some embodiments, the insulating layer 10 includes a first edge 10a and a second edge 10b opposite to each other along the width direction x, and the projection of the lead layer 100 on the surface of the insulating layer 10 along the thickness direction of the lead layer 100 is d. The distance between the coil 21 and the first edge 10a is d, and the distance between the coil 21 and the second edge 10b is d. The spacing distance between the lead portion 23 and the first edge 10a is L, and the spacing distance between the lead portion 23 and the second edge 10b is L. The spacing distance L between the lead portion 23 and the first edge 10a and the spacing distance L between the lead portion 23 and the second edge 10b are the same or different.

[0041] That is, the distance d between the coil 21 and the first edge 10a and the spacing distance L between the lead portion 23 and the first edge 10a satisfy L≥0.5d, and the distance d between the coil 21 and the second edge 10b and the spacing distance L between the lead portion 23 and the second edge 10b also satisfy L≥0.5d. The above distances are labeled with the same letters only to show that they meet the same value range L≥0.5d. The actual specific values ​​may be different or the same. For example, when the spacing distance L between the lead portion 23 and the first edge 10a is 0.2d, the spacing distance L between the lead portion 23 and the second edge 10b may be 0.3d. Alternatively, when the spacing distance L between the lead portion 23 and the first edge 10a is 0.4d, the spacing distance L between the lead portion 23 and the second edge 10b is also 0.4d.

[0042] The following description will be made with reference to the first edge 10a and the second edge 10b respectively.

[0043] For the first edge 10a, if L < 0.5d, the lead portion 23 is closer to the first edge 10a. When the lead layer 100 is applied to the inductor, the lead portion 23 is close to the location where the thickness of the external electrode 20 is smaller. The risk of the plating solution seeping from the external electrode 20 into the lead portion 23 causing a short circuit in the inductor is higher, and the inductor manufacturing yield is lower. Therefore, the spacing distance L between the lead portion 23 and the first edge 10a can be L ≥ 0.5d, which can reduce the risk of the plating solution seeping from the external electrode 20 into the lead portion 23 causing a short circuit in the inductor, and the inductor manufacturing yield is higher. The spacing distance L between the lead portion 23 and the first edge 10a can be 0.5d, 0.6d, 0.7d, 0.8d, 0.9d, d, 1.1d, etc., and this embodiment does not specifically limit this.

[0044] For the second edge 10b, if L < 0.5d, the lead portion 23 is closer to the second edge 10b. When the lead layer 100 is applied to the inductor, the lead portion 23 is close to the location where the thickness of the external electrode 20 is smaller. The risk of the plating solution seeping from the external electrode 20 into the lead portion 23 causing a short circuit in the inductor is higher, and the inductor manufacturing yield is lower. Therefore, the spacing distance L between the lead portion 23 and the second edge 10b can be L ≥ 0.5d, which can reduce the risk of the plating solution seeping from the external electrode 20 into the lead portion 23 causing a short circuit in the inductor, and the inductor manufacturing yield is higher. The spacing distance L between the lead portion 23 and the first edge 10a can be 0.5d, 0.6d, 0.7d, 0.8d, 0.9d, d, 1.1d, etc., and this embodiment does not specifically limit this.

[0045] Optionally, the width of the insulating layer 10 is w1, with 1 / 3w1 ≤ c ≤ 1 / 2w1. If c < 1 / 3w1, the length c of the lead portion 23 along the width direction x is small, and the area of ​​the lead portion 23 located at one end edge of the insulating layer 10 along the length direction y is small. This reduces the effective contact area for contact and conduction with the inductor's external electrode 20, making it difficult to ensure inductor performance. Furthermore, the inductor's DC resistance is high, resulting in significant power loss. If c > 1 / 2w1, the length c of the lead portion 23 along the width direction x is large, increasing the risk of cracking in the insulating layer 10 during sintering. Therefore, the length c of the lead portion 23 along the width direction x can be 1 / 3w1≤c≤1 / 2w1, and the lead portion 23 has a sufficient effective contact area for contact and conduction with the external electrode 20 to ensure the performance of the inductor, and can reduce the DC resistance of the inductor and reduce power loss. When the lead layer 100 is sintered, the contact area between the electrode 20 and the insulating layer 10 is small, which can reduce the risk of cracking of the insulating layer 10. The length c of the lead portion 23 along the width direction x can be 1 / 3w1, 2 / 5w1, 3 / 7w1, 1 / 2w1, etc., and this embodiment does not make specific limitations on this.

[0046] In some embodiments, the width of the coil 21 is w2, and the length of the lead portion 23 along the width direction x is c, where c>w2. Thus, by having the length c of the lead portion 23 along the width direction x be greater than the width w2 of the coil 21, the area of ​​the lead portion 23 located at one end edge of the insulating layer 10 along the length direction y can be increased, providing sufficient effective contact area for contact and conduction with the external electrode 20, thereby ensuring the performance of the inductor, reducing the inductor's DC resistance, and minimizing power loss.

[0047] For example, c≤10w2. If c>10w2, the area of ​​the lead portion 23 located at one end edge of the insulating layer 10 along the length direction y is too large to ensure reliable electrical connection and have low DC resistance. When the lead layer 100 is sintered, the electrode 20 will shrink before the insulating layer 10 at low temperatures, which can easily cause the insulating layer 10 to crack. Therefore, the length c of the lead portion 23 along the width direction x can be c≤10w2. When the lead layer 100 is sintered, the contact area between the electrode 20 and the insulating layer 10 is small, which can reduce the risk of cracking the insulating layer 10. The length c of the lead portion 23 along the width direction x can be 1.1w2, 2w2, 3w2, 4w2, 5w2, 6w2, 7w2, 8w2, 9w2, 10w2, etc., and this embodiment does not specifically limit this.

[0048] In some embodiments, the coil 21 includes a main portion 211 and an extension portion 212. The main portion 211 is configured in a coiled shape. A connection plate 22 is provided at one end of the main portion 211. The extension portion 212 is provided at the other end of the main portion 211. The extension portion 212 extends from the other end of the main portion 211 toward and connects to the lead portion 23. The extension direction of the extension portion 212 is inclined relative to the longitudinal direction y. Thus, because the extension direction of the extension portion 212 is inclined relative to the longitudinal direction y, the extension portion 212 can extend obliquely from the other end of the main portion 211 to connect to the lead portion 23. The main portion 211 and the lead portion 23 are offset along the width direction x, thereby positioning the lead portion 23 away from the first edge 10a.

[0049] Illustratively, along the projection of the lead layer 100 on the surface of the insulating layer 10 in the thickness direction, the extension portion 212 has a first side 212a and a second side 212b that are spaced apart, the first side 212a extending from the other end of the main body 211 to the lead-out portion 23 and connected to the side of the lead-out portion 23 toward the first edge 10a, and the second side 212b extending from the other end of the main body 211 to the lead-out portion 23 and connected to the side of the lead-out portion 23 toward the main body 211 along the length direction y. In this way, by connecting the first side 212a to the side of the lead-out portion 23 toward the first edge 10a, and connecting the second side 212b to the side of the lead-out portion 23 toward the main body 211, the lead-out portion 23 can extend from the position of the first side 212a along the width direction x in a direction away from the first side 212a to form a certain length, and can make the extension length of the lead-out portion 23 greater than the spacing distance between the first side 212a and the second side 212b, that is, greater than the width of the coil 21.

[0050] Embodiment 1 of the present invention provides a lead layer 100, in which an electrode 20 is set through an insulating layer 10, a connecting pad 22 is set at one end of the electrode 20, and a lead-out portion 23 is set at the other end, and the lead-out portion 23 is located at one end edge of the insulating layer 10 along the length direction y of the lead layer 100. At the same time, along the projection of the lead layer 10 on the insulating layer 10 in the thickness direction of the lead layer 100, the lead-out portion 23 is spaced apart from the edge of the insulating layer 10 along the width direction x of the lead layer 100. Based on this, when the lead layer 100 is applied to the inductor, the lead portion 23 is located at one end edge of the insulating layer 10 along the length direction y of the lead layer 100, and is located in the middle position along the width direction x, away from the corners of the lead layer 100. The lead portion 23 can be electrically connected to the external electrode 20 of the inductor. When the inductor is plated, the position of the external electrode 20 corresponding to the lead portion 23 is away from the corners of the lead layer 100. The thickness of the external electrode 20 is large, which can prevent the plating solution from penetrating from the position of the external electrode 20 corresponding to the lead portion 23 to the lead portion 23, thereby reducing the risk of short circuit of the inductor, and the preparation yield of the inductor is high.

[0051] Furthermore, the distance d between the coil 21 and the edge and the spacing L between the lead portion 23 and the edge satisfy L ≥ 0.5d. This reduces the risk of the plating solution seeping from the external electrode 20 into the lead portion 23, causing the inductor to short-circuit, and improves the yield of the inductor manufacturing.

[0052] In addition, when the lead layer 100 is applied to the inductor, the position of the lead portion 23 on the insulating layer 10 is kept away from the edge of the insulating layer 10 along the width direction x of the lead layer 100, that is, away from the corner position of the lead layer 100. In this way, when the inductor is bumped, the lead portion 23 is kept away from the corner position of the inductor, which can avoid the situation where the thickness and strength of the external electrode 20 at the corner position are smaller, resulting in the impact force applied to the external electrode 20 being transmitted to the lead portion 23 and causing the electrode 20 to crack.

[0053] Example 2

[0054] Please also refer to Figure 2 and Figure 3 , is a structural schematic diagram of a substrate 200 provided in Example 2 of the present invention, the substrate 200 includes an inner electrode layer 201 and the lead layer 100 of Example 1, the inner electrode layer 201 has an inner electrode (not marked), and the lead layer 100 is provided on both sides of the inner electrode layer 201 along the thickness direction, and the two ends of the inner electrode are respectively electrically connected to the connection pads of the lead layer 100 located on both sides of the inner electrode layer 201.

[0055] There may be multiple internal electrode layers 201 , and the multiple internal electrode layers 201 are stacked in sequence along the thickness direction, and the internal electrodes of two adjacent internal electrode layers 201 are electrically connected.

[0056] The second embodiment of the present invention provides a substrate 200 that can prevent the plating solution from penetrating into the electrodes of the lead layer 100 , thereby reducing the risk of short circuit of the inductor and achieving a high production yield of the inductor.

[0057] Example 3

[0058] Please also refer to Figure 4 and Figure 5 , an inductor 300 provided in the third embodiment of the present invention, includes a first external electrode 30, a second external electrode 31 and the base 200 of the second embodiment, wherein the first external electrode 30 is provided at one end of the base and is electrically connected to the lead portion of one of the lead layers, and the second external electrode 31 is provided at an end of the base 200 away from the first external electrode 30 and is electrically connected to the lead portion of the other lead layer.

[0059] The third embodiment of the present invention provides an inductor 300 that can prevent the plating solution from penetrating from the first external electrode 30 and the second external electrode 31 into the electrodes of the lead layer, thereby reducing the risk of short circuit of the inductor 300 and achieving a high manufacturing yield of the inductor 300 .

[0060] The above is a detailed introduction to a lead layer, substrate, and inductor disclosed in the embodiments of the present invention. This article uses individual examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the lead layer, substrate, and inductor of the present invention and their core concepts. At the same time, for those skilled in the art, based on the concepts of the present invention, there may be changes in the specific implementation methods and application scopes. In summary, the contents of this specification should not be understood as limiting the present invention.

Claims

1. A lead layer, characterized in that: include: an insulating layer, the insulating layer having an edge along a width direction of the lead layer; as well as An electrode, wherein the electrode is provided on the insulating layer, and the electrode comprises: Coil; a connecting disk, the connecting disk being provided at one end of the coil; and A lead-out portion, the lead-out portion being provided at the other end of the coil and being located at an edge of one end of the insulating layer along the length direction of the lead layer; The projection of the lead layer on the surface of the insulating layer in the thickness direction thereof is such that the distance between the coil and the edge is d, the lead portion is spaced apart from the edge, and the spacing distance between the lead portion and the edge is L, where L is ≥ 0.5d. The length of the lead portion along the width direction is c, the width of the insulating layer is w1, 1 / 3w1≤c≤1 / 2w1, and the width of the coil is w2, w2<c<6w2 or 6w2<c≤10w2.

2. The lead layer according to claim 1, characterized in that The edge includes a first edge and a second edge opposite to each other along the width direction, and a projection on the surface of the insulating layer along the thickness direction of the lead layer is a distance d from the coil and the first edge, a distance d from the coil and the second edge, a spacing distance L between the lead portion and the first edge, and a spacing distance L between the lead portion and the second edge; The values ​​of the spacing distance L between the lead-out portion and the first edge and the spacing distance L between the lead-out portion and the second edge are the same or different.

3. The lead layer according to claim 1 or 2, characterized in that: The coil includes a main body and an extension part. The main body is constructed in a winding shape. The connecting disk is provided at one end of the main body. The extension part is provided at the other end of the main body. The extension part extends from the other end of the main body to the lead-out part and is connected to the lead-out part. The extension direction of the extension part is inclined to the length direction.

4. The lead layer according to claim 3, characterized in that Along the projection of the lead layer on the surface of the insulating layer in the thickness direction, the extension portion has a first side and a second side that are spaced apart, the first side extending from the other end of the main body portion to the lead-out portion and connected to the side of the lead-out portion facing the edge, and the second side extending from the other end of the main body portion to the lead-out portion and connected to the side of the lead-out portion toward the main body portion along the length direction.

5. A substrate, characterized in that It includes an inner electrode layer and a lead layer as described in any one of claims 1 to 4, wherein the inner electrode layer has an inner electrode, the lead layer is provided on both sides of the inner electrode layer along the thickness direction, and the two ends of the inner electrode are respectively electrically connected to the connection plates of the lead layer located on both sides of the inner electrode layer.

6. An inductor, characterized in that: It includes a first external electrode, a second external electrode and a substrate as described in claim 5, wherein the first external electrode is arranged at one end of the substrate, the first external electrode is electrically connected to the lead-out portion of one of the lead layers, and the second external electrode is arranged at one end of the substrate away from the first external electrode, and the second external electrode is electrically connected to the lead-out portion of the other lead layer.

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