Multi-station fully automatic semiconductor wafer edge polishing apparatus and method of using the same

Abstract

The application discloses a multi-station full-automatic semiconductor wafer edge polishing device and a use method thereof. The polishing device comprises a rack, a feeding mechanism, a clamping conveying mechanism, a self-centering edge polishing mechanism, a turnover mechanism and a discharging mechanism arranged on the rack. The clamping conveying mechanism is used for clamping and conveying the semiconductor wafer. The self-centering edge polishing mechanism is used for positioning the semiconductor wafer and performing edge polishing. The turnover mechanism is used for turning over the semiconductor wafer. The polishing device can realize automatic polishing, automatic feeding and discharging of the semiconductor wafer, has high automation degree, effectively reduces the labor intensity of workers, improves polishing efficiency and polishing precision, can turn over the semiconductor wafer, realizes front edge polishing and back edge polishing, prevents uneven polishing, and effectively improves the polishing quality of the semiconductor wafer edge.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor wafer polishing processing, in particular to a multi-station full-automatic semiconductor wafer edge polishing device and a use method thereof. BACKGROUND

[0002] As a new type of material, semiconductor material has good thermal conductivity and thermal stability, can realize smaller chip volume, and can improve the heat dissipation performance of the chip, and is widely used in new energy vehicles, photovoltaic inverters and other fields. Semiconductor wafer edge polishing is one of the key steps in the semiconductor manufacturing process, aiming to improve the flatness and surface quality of the wafer edge. With the continuous progress of semiconductor technology, the size and structure requirements of integrated circuits are also becoming higher and higher. The flatness of the semiconductor wafer edge directly affects the layout and connection of electronic components, and the edge defects may have adverse effects on the performance and reliability of the device. The traditional polishing process mainly uses manual grinding of the edge of the semiconductor wafer, which has low polishing efficiency and low precision, and high labor cost. With the increasing demand for semiconductor wafers year by year, labor cost has become one of the main factors restricting the development of semiconductor wafers. Therefore, it is urgent to study an automatic polishing process for the edge of the semiconductor wafer, which has important significance. SUMMARY

[0003] In order to overcome the above problems existing in the prior art, the present application provides a multi-station full-automatic semiconductor wafer edge polishing device. The polishing device of the present application can realize automatic polishing and automatic feeding and discharging of the semiconductor wafer by setting the feeding mechanism, clamping and conveying mechanism, self-centering edge polishing mechanism and discharging mechanism, has high automation degree, effectively reduces the labor intensity of the workers, and improves the polishing efficiency and polishing precision; in addition, the polishing device is also provided with a turnover mechanism for turning over the semiconductor wafer, so as to realize front edge polishing and back edge polishing of the semiconductor wafer, prevent uneven polishing, and effectively improve the edge polishing quality of the semiconductor wafer. Correspondingly, the present application also provides a use method of the multi-station full-automatic semiconductor wafer edge polishing device.

[0004] For the polishing device, the technical scheme of the present application is:

[0005] Multi-station full-automatic semiconductor wafer edge polishing device, including frame, and loading mechanism, clamping conveying mechanism, self-centering edge polishing mechanism, turnover mechanism and unloading mechanism arranged on the frame; the loading mechanism includes a storage bin and a group of interval distributed storage barrels; the bottom of the storage bin is inclinedly arranged, and the outlet thereof is communicated with the inlet of the storage barrel through a first slide; a sweep roller rotatable by a motor is arranged at the outlet of the storage bin, for poking the semiconductor wafer to make it slide out of the storage bin and into the storage barrel through the first slide; a sliding push plate driven by a motor is arranged at the outlet of the storage barrel, for pushing the semiconductor wafer out of the storage barrel to make it slide into the clamping conveying mechanism through a second slide; the bottom of the second slide is provided with a loading port; the clamping conveying mechanism includes a sliding seat slidingly arranged on the frame; the sliding seat is connected with an adjusting mechanism and can be driven by the adjusting mechanism to move back and forth; a group of interval distributed clamping ports are formed in the sliding seat; a clamping block is arranged in the clamping port; the clamping block is in transmission connection with a first air cylinder, for clamping the semiconductor wafer sliding out of the second slide; the polishing mechanism includes a group of interval distributed polishing bowls for containing polishing liquid; the polishing bowls are arranged on a rotating shaft, and the rotating shaft is in transmission connection with a motor; the rotating shaft is in hollow structure, and a self-centering tappet is arranged in the rotating shaft; the top of the self-centering tappet is arranged to pass through a relief hole in the bottom of the polishing bowl, for bearing the semiconductor wafer during polishing; a workpiece clamp is arranged above the self-centering tappet; the workpiece clamp includes a vacuum chuck for adsorbing the semiconductor wafer during polishing, and a second air cylinder for driving the vacuum chuck to move up and down; the turnover mechanism is used for realizing turnover of the semiconductor wafer, and includes a group of interval distributed turnover tables; the turnover tables are in transmission connection with a motor through a crank linkage structure, and can be switched to horizontal state or inclined state under the drive of the motor; the unloading mechanism includes an inclined slide, one end of which is fixed to the frame, and the other end is located above the conveying mechanism.

[0006] Compared with the prior art, the multi-station full-automatic semiconductor wafer edge device can realize automatic polishing and automatic feeding and discharging of the semiconductor wafer, has high automation degree, and effectively reduces the labor intensity of workers; the device comprises a feeding mechanism, a clamping conveying mechanism, a self-centering edge polishing mechanism, a turnover mechanism and a discharging mechanism; the feeding mechanism realizes sorting of the semiconductor wafers in the storage bin by arranging the sweeping roller, and pushes the semiconductor wafers out of the storage barrel by arranging the sliding push plate, thereby realizing automatic feeding of the semiconductor wafers; the clamping conveying mechanism can realize clamping and conveying of the semiconductor wafers by arranging the clamping block, the sliding seat and the adjusting mechanism; the self-centering edge polishing mechanism realizes polishing of the edge of the semiconductor wafer by arranging the polishing bowl, and the bottom of the polishing bowl penetrates the self-centering tappet, which cooperates with the upper clamp to realize positioning of the semiconductor wafer during polishing, thereby improving the polishing precision of the edge of the semiconductor wafer; the turnover mechanism can turn over the semiconductor wafer by arranging the turnover table and the crank link structure, thereby realizing front edge polishing and back edge polishing of the semiconductor wafer, preventing uneven polishing, and further improving the polishing quality of the edge of the semiconductor wafer; in addition, the polishing device is provided with multiple stations, and multiple semiconductor wafers can be simultaneously fed, discharged and polished, thereby improving the working efficiency.

[0007] As an optimization, in the aforementioned multi-station full-automatic semiconductor wafer edge polishing device, the clamping block is connected with the sliding block through an arc-shaped connecting rod; the sliding block is connected with the first cylinder and can move relative to the sliding seat under the driving of the first cylinder, thereby driving the clamping block to move in the clamping opening and realizing clamping of the semiconductor wafer. At this time, the assembly is more convenient, and one cylinder can drive multiple clamping blocks to move synchronously, which is economical and practical.

[0008] As an optimization, in the aforementioned multi-station full-automatic semiconductor wafer edge polishing device, a herringbone gear is sleeved on the lower end of each rotating shaft, and the adjacent two herringbone gears are meshed with each other; one of the herringbone gears is drivingly connected with the motor; the herringbone gear is arranged in the case; and the rotating shaft is rotatably connected with the case through the deep groove ball bearing. At this time, only one motor is needed, which is low in cost and good in economy, and also ensures the synchronism of the rotation of multiple polishing bowls. Further, the bottom of the polishing bowl is provided with a liquid outlet, and a sealing block is fixed inside; the sealing block is sleeved outside the self-centering tappet; the rotating shaft is sleeved with an oil throwing ring and an oil blocking ring; the oil throwing ring is located above the case; and the oil blocking ring is embedded in the case and located above the deep groove ball bearing. Thus, when it is necessary to discharge the polishing liquid, the sealing block can be removed, and the polishing liquid can flow out from the liquid outlet at the bottom of the polishing bowl, which is very convenient to operate; the arrangement of the oil throwing ring and the oil blocking ring can prevent the polishing liquid from entering the deep groove ball bearing through the gap of the case, thereby preventing the deep groove ball bearing from being worn.

[0009] As optimization, the multi-station full-automatic semiconductor wafer edge polishing device, the lower part of the self-centering plunger is provided with a fixed sleeve; the fixed sleeve and the self-centering plunger are connected with a spring; the spring is sleeved on the moving column at the bottom of the self-centering plunger. The spring and the fixed sleeve are arranged to realize the up-and-down floating of the self-centering plunger relative to the rack, which is simple in structure and easy to implement. Moreover, the arrangement of the bottom moving column can avoid the spring from being separated from the fixed sleeve or the self-centering plunger and then being opened in use.

[0010] Further, the top of the self-centering plunger is provided with a balance block; the balance block includes an X-direction balance block and a Y-direction balance block; the X-direction balance block and the Y-direction balance block are both provided with a balance groove, and a balance column and a balance spring are arranged in the balance groove; the two balance grooves are vertically distributed and can be used for balancing the movement in the X direction and the Y direction.

[0011] As optimization, the multi-station full-automatic semiconductor wafer edge polishing device, the sliding push plate is connected with the motor through a connecting rod assembly; the connecting rod assembly includes a first connecting rod and a second connecting rod which are hinged; the first connecting rod is fixed on the output shaft of the motor; and the second connecting rod is hinged with the sliding push plate. At this time, the structure is simple and easy to assemble. Further, a group of notches corresponding to the outlet of the storage barrel are arranged at the end of the sliding push plate. At this time, the lowest semiconductor wafer in the storage barrel is located in the notch, so that the semiconductor wafer is more convenient to push out.

[0012] As optimization, the multi-station full-automatic semiconductor wafer edge polishing device, the crank connecting rod structure includes a third connecting rod and a fourth connecting rod which are hinged; the third connecting rod is hinged with the turnover table; the turnover table is rotatably connected with the rack through a first transmission shaft; the fourth connecting rod is rotatably arranged on a second transmission shaft; and the second transmission shaft is connected with the motor through a belt transmission mechanism.

[0013] For the use method, the technical scheme of the present application is:

[0014] The application discloses a method for using a multi-station full-automatic semiconductor wafer edge polishing device, and comprises the following steps: step 1, adjusting a mechanism to drive a sliding base to move so that a clamping opening is aligned with a feeding opening; then a sweeping roller is rotated under the drive of a motor to push semiconductor wafers in a storage bin out of an outlet and into a storage barrel through a first sliding channel; then a sliding push plate is moved under the drive of a motor to push the semiconductor wafers in the storage barrel out of the outlet and into the clamping opening through a second sliding channel; step 2, a first cylinder drives a clamping block to move to clamp the semiconductor wafers in the clamping opening; then the adjusting mechanism drives the sliding base to move to a self-centering edge polishing mechanism so that the semiconductor wafers are aligned with a vacuum chuck; step 3, the vacuum chuck is moved down to adhere to the semiconductor wafers, and the clamping block is loosened; the vacuum chuck presses the semiconductor wafers on the top of a self-centering tappet, and controls the height so that the workpiece is immersed in polishing liquid in a polishing bowl; then a rotating shaft is rotated under the drive of a motor to rotate the polishing bowl to polish the edge of the semiconductor wafer; step 4, after a set polishing time is reached, the vacuum chuck is moved up, and the clamping block clamps the semiconductor wafers again; then the adjusting mechanism drives the sliding base to move to a turnover mechanism; step 5, the clamping block is loosened to turn over the semiconductor wafers; after the turning over is completed, the clamping block clamps the semiconductor wafers again, and the adjusting mechanism drives the sliding base to move to the self-centering edge polishing mechanism so that the semiconductor wafers are aligned with the vacuum chuck; step 3 is repeated; step 6, after a set polishing time is reached, the vacuum chuck is moved up, and the clamping block clamps the semiconductor wafers again; then the adjusting mechanism drives the sliding base to move to a discharging mechanism, the clamping block is loosened, and the semiconductor wafers are slid from an inclined sliding table into a conveying mechanism below. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 FIG. 1 is a structural schematic diagram of a multi-station full-automatic semiconductor wafer edge polishing device of the application;

[0016] Figure 2 FIG. 2 is a structural schematic diagram of a feeding mechanism in the application;

[0017] Figure 3 FIG. 3 is an assembly schematic diagram of a sliding push plate and a motor in the application;

[0018] Figure 4 FIG. 4 is a structural schematic diagram of a sweeping roller in the application;

[0019] Figure 5 FIG. 5 is a structural schematic diagram of a clamping conveying mechanism in the application;

[0020] Figure 6 FIG. 6 is a structural schematic diagram of a polishing bowl in the application;

[0021] Figure 7 FIG. 7 is a structural schematic diagram of a self-centering edge polishing mechanism in the application;

[0022] Figure 8 is a sectional view of the self-centering edge polishing mechanism in the present application;

[0023] Figure 9 is a distribution schematic view of the self-centering edge polishing mechanism and the workpiece clamp in the present application;

[0024] Figure 10 is Figure 9 is an enlarged schematic view of part A in

[0025] Figure 11 is a structural schematic view of the balance block in the present application;

[0026] Figure 12 is a structural schematic view of the turnover mechanism in the present application;

[0027] Figure 13 is a structural schematic view of the unloading mechanism in the present application;

[0028] Figure 14 is a schematic view of different states in the process of turning over a semiconductor wafer;

[0029] Figure 15 is a schematic view of the state of the clamping and conveying mechanism in the process of turning over a semiconductor wafer.

[0030] The marks in the drawings are: 1-frame; 2-feeding mechanism, 21-storage bin, 22-storage barrel, 23-stripping roller, 24-first slide, 25-sliding push plate, 251-gap, 26-second slide, 261-feeding port, 27-first connecting rod, 28-second connecting rod; 3-clamping and conveying mechanism, 31-sliding seat, 311-clamping port, 32-adjusting mechanism, 33-clamping block, 34-first cylinder, 35-arc-shaped connecting rod, 36-sliding block; 4-self-centering edge polishing mechanism, 41-polishing bowl, 411-liquid outlet, 42-rotating shaft, 43-self-centering tappet, 431-fixed sleeve, 432-spring, 433-moving column, 434-X-direction balance block, 435-Y-direction balance block, 44-herringbone gear, 45-cabinet, 46-deep groove ball bearing, 47-sealing block, 48-oil flinger, 49-oil baffle; 5-workpiece clamp, 51-vacuum chuck, 52-second cylinder; 6-turnover mechanism, 61-turnover table, 62-third connecting rod, 63-fourth connecting rod, 64-first transmission shaft, 65-second transmission shaft, 66-driving wheel, 67-driven wheel, 68-belt; 7-unloading mechanism, 71-inclined sliding table, 72-conveying mechanism; 8-semiconductor wafer. DETAILED DESCRIPTION

[0031] The present application is further described below in conjunction with the drawings and examples, but is not limited to the basis of the application.

[0032] Example:

[0033] Referring to Figures 1 to 13 , the multi-station full-automatic semiconductor wafer edge polishing device comprises a rack 1, and an upper feeding mechanism 2, a clamping conveying mechanism 3, a self-centering edge polishing mechanism 4, a turnover mechanism 6 and a lower discharging mechanism 7 arranged on the rack 1;

[0034] The upper feeding mechanism 2 comprises a storage bin 21 and five interval distributed storage barrels 22; the bottom of the storage bin 21 is arranged in an inclined manner, and the outlet thereof is communicated with the inlet of the storage barrel 22 through a first slide 24; a sweep roller 23 driven to rotate by a motor is arranged at the outlet of the storage bin 21 correspondingly, for pushing the semiconductor wafer to slide out of the storage bin 21 and into the storage barrel 22 through the first slide 24; a sliding push plate 25 driven by a motor is arranged at the outlet of the storage barrel 22 correspondingly, for pushing the semiconductor wafer out of the storage barrel 22 and into the clamping conveying mechanism 3 through a second slide 26; the bottom of the second slide 26 is provided with an upper feeding port 261; the number of the first slide 24 and the second slide 26 is both five, corresponding to the five storage barrels 22;

[0035] The clamping conveying mechanism 3 comprises a sliding seat 31 (a triangular guide rail is arranged on the rack 1, and correspondingly, a triangular sliding groove is arranged at the bottom of the sliding seat 31) slidingly arranged on the rack 1; the sliding seat 31 is connected with an adjusting mechanism 32 and driven to move back and forth by the adjusting mechanism 32; five interval distributed clamping ports 311 are formed in the sliding seat 31 (one end of the clamping port 311 is in an arc shape, and one end is in a V shape, so as to adapt to semiconductor wafers of different sizes); a clamping block 33 is slidingly arranged in each clamping port 311 (sliding rails are arranged on the inner walls of the clamping port 311, and sliding grooves are arranged on the two sides of the clamping block 33); the clamping block 33 is in transmission connection with a first cylinder 34, for clamping the semiconductor wafer sliding out of the second slide 26; the adjusting mechanism 32 is a ball screw;

[0036] The self-centering edge polishing mechanism 4 comprises five interval distributed polishing bowls 41, and the polishing bowl 41 is filled with non-Newtonian fluid polishing liquid; the polishing bowl 41 is arranged on a rotating shaft 42, and the rotating shaft 42 is in transmission connection with a motor; the polishing bowl 41 and the rotating shaft 42 are detachably connected (thereby, different sizes of polishing bowls 41 can be disassembled and assembled to adapt to semiconductor wafers of different sizes); the rotating shaft 42 is in a hollow structure with two open ends, and a self-centering tappet 43 is arranged in the rotating shaft 42 (two sealing rings are arranged between the self-centering tappet 43 and the rotating shaft 42, and are located at the upper and lower ends of the rotating shaft 42, respectively); the top of the self-centering tappet 43 passes through a relief hole in the bottom of the polishing bowl 41, for bearing the semiconductor wafer during polishing; a workpiece clamp 5 is arranged above the self-centering tappet 43; the workpiece clamp 5 comprises a vacuum chuck 51 for adsorbing the semiconductor wafer during polishing, and a second cylinder 52 for driving the vacuum chuck 51 to move up and down;

[0037] The turnover mechanism 6 is used for realizing turnover of the semiconductor wafer, which comprises five interval distributed turnover tables 61; the turnover tables 61 are connected with the motor through the crank connecting rod structure and can be switched into the horizontal state or the inclined state under the driving of the motor;

[0038] The blanking mechanism 7 comprises an inclined sliding table 71; one end of the inclined sliding table 71 is fixed on the rack 1 and the other end is located above the conveying mechanism 72 (belt conveyor).

[0039] In the embodiment, the clamping block 33 is connected with the sliding block 36 through the arc-shaped connecting rod 35 (both ends of the arc-shaped connecting rod 35 are rotationally connected with the clamping block 33 and the sliding block 36 respectively); the sliding block 36 is connected with the first air cylinder 34 and can move relative to the sliding base 31 under the driving of the first air cylinder 34 (the sliding base 31 is provided with a sliding rail and the bottom of the sliding block 36 is provided with a sliding groove), so as to drive the clamping block 33 to move in the clamping opening 311 and realize clamping of the semiconductor wafer. At this time, the assembly is more convenient, a plurality of clamping blocks 33 can be driven to move synchronously through one air cylinder, and the economy and practicality are good.

[0040] Referring to Figures 6 to 9 In the embodiment, the lower end of each rotating shaft 42 is sleeved with a herringbone gear 44, and the adjacent two herringbone gears 44 are meshed with each other; one of the herringbone gears 44 is connected with the motor; the herringbone gear 44 is arranged in the machine box 45 (to avoid pollution of the herringbone gear 44 by external dust); and the rotating shaft 42 is rotationally connected with the machine box 45 through the deep groove ball bearing 46. At this time, the self-centering edge polishing mechanism 4 only needs to be provided with one motor, which is low in cost, good in economy, and ensures the synchronism of rotation of the plurality of polishing bowls 41.

[0041] Further, the bottom of the polishing bowl 41 is provided with a liquid outlet 411, and a sealing block 47 is fixed inside the polishing bowl 41 (the sealing block 47 is fixed with the bottom of the polishing bowl 41 by screws); the sealing block 47 is sleeved on the self-centering tappet 43; the outer sleeve of the rotating shaft 42 is provided with an oil throwing ring 48 and an oil blocking ring 49; the oil throwing ring 48 is located above the machine box 45; the oil blocking ring 49 is embedded in the machine box 45 and located above the deep groove ball bearing 46. Thus, when it is necessary to drain the polishing liquid, the sealing block 47 can be removed, and the polishing liquid can flow out from the liquid outlet 411 at the bottom of the polishing bowl 41, which is very convenient to operate; the oil throwing ring 48 and the oil blocking ring 49 can prevent the polishing liquid from entering the deep groove ball bearing 46 through the gap of the machine box 45, so as to avoid the wear of the deep groove ball bearing 46. The upper end of the rotating shaft 42 is located above the oil throwing ring 48, and a liquid outlet hole is formed in the upper end of the rotating shaft 42. During the process of draining the polishing liquid, the polishing liquid may leak from the rod hole in the middle of the polishing bowl 41 into the rotating shaft 42, and the polishing liquid can flow out from the liquid outlet hole. The top of the machine box 45 is provided with a liquid discharge groove. The polishing liquid flowing out from the liquid outlet 411 and the liquid outlet hole falls to the top of the machine box 45 and is finally discharged from the liquid discharge groove.

[0042] In the embodiment, the lower end of the self-centering tappet 43 is provided with a fixed sleeve 431; the spring 432 is connected between the self-centering tappet 43 and the fixed sleeve 431; and the spring 432 is sleeved on the moving column 433 at the bottom of the self-centering tappet 43. At this time, the self-centering tappet 43 can float up and down relative to the rack 1; and then the vacuum chuck 51 can move up and down in cooperation with the self-centering tappet 43 during polishing, so as to adjust the position of the semiconductor wafer, so that the semiconductor wafer is located at a suitable polishing position, and the polishing quality is improved. In addition, the spring 432 and the fixed sleeve 431 are arranged to realize the up-and-down movement of the self-centering tappet 43 relative to the rack 1, which has the advantages of simple structure and easy implementation; and the arrangement of the moving column 433 at the bottom can avoid the spring 432 from being separated from the connection with the fixed sleeve 431 or the self-centering tappet 43 and then being opened.

[0043] Further, the top of the self-centering tappet 43 is provided with a balance block; the balance block includes an X-direction balance block 434 and a Y-direction balance block 435 (the two balance blocks are fixed by screws; the Y-direction balance block 435 is inserted into the self-centering tappet 43, and the upper end of the X-direction balance block 434 is fixed with a cover plate; the semiconductor wafer is located on the cover plate during polishing); and the X-direction balance block 434 and the Y-direction balance block 435 are both provided with balance grooves, and the balance grooves are provided with balance columns and balance springs; the two balance grooves are vertically distributed and can be used for balancing the movement in the X direction and the Y direction.

[0044] Referring to Figure 3In this embodiment, the sliding push plate 25 is connected to the motor via a connecting rod assembly. The connecting rod assembly includes a first connecting rod 27 and a second connecting rod 28 that are hinged together. The first connecting rod 27 is fixed to the output shaft of the motor, and the second connecting rod 28 is hingedly connected to the sliding push plate 25. This provides a simple structure and is easy to assemble.

[0045] Furthermore, the end of the sliding push plate 25 is provided with five notches 251 spaced apart, corresponding to the outlets of the storage barrel 22. The notches 251 are V-shaped (to accommodate semiconductor wafers of different sizes). At this point, the bottom semiconductor wafer in the oil storage barrel 22 will be located within the notches 251, making it easier to push the semiconductor wafer out.

[0046] See also Figure 12 In this embodiment, in the initial state, the flip table 61 is tilted. The crank-connecting rod structure includes a hinged third link 62 and a fourth link 63. The third link 62 is hinged to the flip table 61. The flip table 61 is rotatably connected to the frame 1 via a first transmission shaft 64. The fourth link 63 is rotatably mounted on a second transmission shaft 65. The second transmission shaft 65 is connected to a motor (which can be a stepper motor) via a belt drive mechanism. The belt drive mechanism includes a driving pulley 66 mounted on the motor output shaft, a driven pulley 67 mounted on the second transmission shaft 65, and a belt 68 tensioned around the driving pulley 66 and the driven pulley 67.

[0047] Flipping principle (see Figure 14 and Figure 15 Only one semiconductor wafer 8 is drawn in the figure. In actual operation, each clamping port 311 corresponds to a semiconductor wafer 8): After the clamping and transporting mechanism 3 transports the semiconductor wafer 8 to the top of the flip table 61 (see Figure 14 a), the clamping block 33 is released, and since the turning table 61 is tilted, the semiconductor wafer 8 will also tilt when it falls (see Figure 14 b); then, the slide 31 is driven by the adjustment mechanism 32 to move so that the upper end of the semiconductor wafer 8 contacts the inner wall of the clamping opening 311 (see Figure 15 b), when the slide 31 continues to move, the clamping opening 311 will exert force on the end of the semiconductor wafer 8 to turn it over, and the turned semiconductor wafer 8 will be placed on the turning table 61 ( Figure 14 c); Then, start the motor to drive the flip table 61 to move upward (the motor drives the second transmission shaft 65 to rotate through the belt transmission mechanism, and the second transmission shaft 65 rotates, which drives the fourth connecting rod 63 thereon to rotate synchronously, thereby driving the third connecting rod 63 to move, and the lower end of the flip table 61 is lifted upward), so that the flip table 61 moves from the inclined state to the horizontal state (see Figure 14 d); Finally, the clamping and conveying mechanism 3 clamps the semiconductor wafer 8 again for subsequent operations, while the motor reverses to drive the flip table 61 to reset.

[0048] The method for using the multi-station full-automatic semiconductor wafer edge polishing device comprises the following steps: step 1, the adjusting mechanism 32 drives the sliding seat 31 to move so that the clamping opening 311 is aligned with the feeding opening 261; then the scanning roller 23 is rotated under the drive of the motor to push the semiconductor wafer in the storage bin 21 so that the semiconductor wafer slides out of the outlet and falls into the storage barrel 22 through the first slide 24; then the sliding push plate 25 is moved under the drive of the motor to push the semiconductor wafer in the storage barrel 22 so that the semiconductor wafer slides out of the outlet and falls into the clamping opening 311 through the second slide 26;

[0049] Step 2, the first cylinder 34 drives the sliding block 36 to move to drive the clamping block 33 to move in the clamping opening 311 to clamp the semiconductor wafer; then the adjusting mechanism 32 drives the sliding seat 31 to move to the self-centering edge polishing mechanism 4 so that the semiconductor wafer is aligned with the vacuum chuck 51;

[0050] Step 3, the second cylinder 52 drives the vacuum chuck 51 to move downward to contact the surface of the semiconductor wafer; the vacuum chuck 51 adsorbs the semiconductor wafer, and the clamping block 33 is loosened; the second cylinder 52 drives the vacuum chuck 51 to continue to move downward to press the semiconductor wafer on the top of the self-centering tappet 43; then the rotating shaft 42 is rotated under the drive of the motor to drive the polishing bowl 41 to rotate to polish the edge of the semiconductor wafer;

[0051] Step 4, after the set polishing time is reached, the second cylinder 52 drives the vacuum chuck 51 to move upward so that the semiconductor wafer is located in the clamping opening 311, and the clamping block 33 clamps the semiconductor wafer again; then the adjusting mechanism 32 drives the sliding seat 31 to move to the turnover mechanism 6;

[0052] Step 5, the clamping block 33 is loosened to turn over the semiconductor wafer; after the turning over is completed, the clamping block 33 clamps the semiconductor wafer again, the adjusting mechanism 32 drives the sliding seat 31 to move to the self-centering edge polishing mechanism 4 again, and the semiconductor wafer is aligned with the vacuum chuck 51; then step 3 is repeated;

[0053] Step 6, after the set polishing time is reached, the vacuum chuck 51 moves upward, the clamping block 33 clamps the semiconductor wafer again, the adjusting mechanism 32 drives the sliding seat 31 to move to the discharging mechanism 7, the clamping block 33 is loosened, and the semiconductor wafer slides into the conveying mechanism 72 below from the inclined slide 71.

[0054] The general description and the specific embodiments of the application involved in the present application should not be understood as a limitation on the technical solutions of the application. Based on the disclosure of the present application, those skilled in the art can add, reduce or combine the disclosed technical features in the general description or / and the specific embodiments (including the examples) without violating the elements of the application involved, to form other technical solutions within the protection scope of the present application.

Claims

1. Multi-station fully automatic semiconductor wafer edge polishing device, characterized by: It comprises a frame (1), and a loading mechanism (2), a clamping and conveying mechanism (3), a self-centering edge polishing mechanism (4), a turning mechanism (6), and a unloading mechanism (7) arranged on the frame (1); The loading mechanism (2) includes a storage bin (21) and a group of storage barrels (22) distributed at intervals; the bottom of the storage bin (21) is tilted, and its outlet is connected to the inlet of the storage barrel (22) through a first slide (24); a sweeping roller (23) that can be driven to rotate by a motor is provided at the outlet of the storage bin (21) for moving the semiconductor wafer out of the storage bin (21) and sliding it into the storage barrel (22) through the first slide (24); a sliding push plate (25) that can be driven by a motor is provided at the outlet of the storage barrel (22) for pushing the semiconductor wafer out of the storage barrel (22) and sliding it into the clamping and conveying mechanism (3) through a second slide (26); a loading port (261) is provided at the bottom of the second slide (26); The clamping and transporting mechanism (3) includes a slide (31) slidably arranged on the frame (1); the slide (31) is connected to the adjustment mechanism (32) and can be driven to move back and forth by the adjustment mechanism (32); a group of spaced clamping openings (311) are provided on the slide (31); a clamping block (33) is provided in the clamping opening (311); the clamping block (33) is connected to the first cylinder (34) in a transmission manner and is used to clamp the semiconductor wafer that slides out from the second slide (26); the clamping block (33) is connected to the slider (36) through an arc-shaped connecting rod (35); the slider (36) is connected to the first cylinder (34) and can move relative to the slide (31) under the drive of the first cylinder (34), thereby driving the clamping block (33) to move in the clamping opening (311) to achieve clamping of the semiconductor wafer; The self-centering edge polishing mechanism (4) comprises a group of polishing bowls (41) distributed at intervals for containing polishing liquid; the polishing bowls (41) are arranged on a rotating shaft (42), and the rotating shaft (42) is connected to the motor; the rotating shaft (42) is a hollow structure, and a self-centering tappet (43) is arranged inside the rotating shaft; the top of the self-centering tappet (43) passes through the clearance hole at the bottom of the polishing bowl (41) and is used to carry the semiconductor wafer during polishing; the top of the self-centering tappet (43) is provided with A workpiece fixture (5); the workpiece fixture (5) includes a vacuum suction cup (51) for adsorbing a semiconductor wafer during polishing, and a second cylinder (52) for driving the vacuum suction cup (51) to move up and down; a fixing sleeve (431) is provided below the self-centering tappet (43); a spring (432) is connected between the fixing sleeve (431) and the self-centering tappet (43); the spring (432) is sleeved outside the movable column (433) at the bottom of the self-centering tappet (43); The flip mechanism (6) is used to flip the semiconductor wafer, and comprises a set of flip tables (61) distributed at intervals; the flip tables (61) are connected to the motor through a crank-connecting rod structure and can be switched to a horizontal state or an inclined state under the drive of the motor; The unloading mechanism (7) comprises an inclined slide (71); one end of the inclined slide (71) is fixed on the frame (1), and the other end is located above the conveying mechanism (72).

2. The multi-station fully automatic semiconductor wafer edge polishing device according to claim 1, characterized in that: A herringbone gear (44) is sleeved on the lower end of each rotating shaft (42), and two adjacent herringbone gears (44) are meshed with each other; one of the herringbone gears (44) is connected to the motor in a transmission manner; the herringbone gear (44) is arranged in a chassis (45); and the rotating shaft (42) is rotatably connected to the chassis (45) via a deep groove ball bearing (46).

3. The multi-station fully automatic semiconductor wafer edge polishing device according to claim 2, characterized in that: The polishing bowl (41) is provided with a liquid outlet (411) at the bottom thereof, and a sealing block (47) is fixed therein; the sealing block (47) is sleeved on the outside of the self-centering tappet (43); the rotating shaft (42) is provided with an oil slinger (48) and an oil retaining ring (49) on its outer sleeve; the oil slinger (48) is located above the chassis (45); the oil retaining ring (49) is embedded in the chassis (45) and is located above the deep groove ball bearing.

4. The multi-station fully automatic semiconductor wafer edge polishing device according to claim 1, characterized in that: A balancing block is provided on the top of the self-centering tappet (43); the balancing block comprises an X-direction balancing block (434) and a Y-direction balancing block (435); both the X-direction balancing block (434) and the Y-direction balancing block (435) are provided with a balancing groove, in which a balancing column and a balancing spring are provided; the two balancing grooves are vertically distributed.

5. The multi-station fully automatic semiconductor wafer edge polishing device according to claim 1, characterized in that: The sliding push plate (25) is connected to the motor through a connecting rod assembly; the connecting rod assembly includes a hinged first connecting rod (27) and a second connecting rod (28); the first connecting rod (27) is fixed to the output shaft of the motor; the second connecting rod (28) is hinged to the sliding push plate (25).

6. The multi-station fully automatic semiconductor wafer edge polishing device according to claim 5, characterized in that: A group of notches (251) corresponding to the outlet of the material storage barrel (22) are provided at intervals at the end of the sliding push plate (25).

7. The multi-station fully automatic semiconductor wafer edge polishing device according to claim 1, characterized in that: The crank-connecting rod structure comprises a hinged third connecting rod (62) and a fourth connecting rod (63); the third connecting rod (62) is hinged to the turning platform (61); the turning platform (61) is rotationally connected to the frame (1) via a first transmission shaft (64); the fourth connecting rod (63) is rotationally arranged on a second transmission shaft (65); and the second transmission shaft (65) is transmission-connected to the motor via a belt transmission mechanism.

8. The method for using the multi-station fully automatic semiconductor wafer edge polishing device according to any one of claims 1 to 7, wherein: The following steps are involved: Step 1: The adjusting mechanism (32) drives the slide (31) to move so that the clamping opening (311) is aligned with the loading opening (261); then the sweeping roller (23) rotates under the drive of the motor, and moves the semiconductor wafer in the storage bin (21), so that it slides out from the outlet and slides into the storage barrel (22) through the first slide (24); then the sliding push plate (25) moves under the drive of the motor, pushing the semiconductor wafer in the storage barrel (22), so that it slides out from the outlet and falls into the clamping opening (311) through the second slide (26); Step 2: The first cylinder (34) drives the clamping block (33) to move and clamp the semiconductor wafer in the clamping port (311); then the adjustment mechanism (32) drives the slide (31) to move to the self-centering edge polishing mechanism (4) to align the semiconductor wafer with the vacuum chuck (51); Step 3: The vacuum suction cup (51) moves downward to absorb the semiconductor wafer, and the clamping block (33) is released; the vacuum suction cup (51) presses the semiconductor wafer on the top of the self-centering push rod (43), and controls the height so that the workpiece is immersed in the polishing liquid in the polishing bowl (41); then the shaft (42) rotates under the drive of the motor, and drives the polishing bowl (41) to rotate, thereby polishing the edge of the semiconductor wafer; Step 4: After the set polishing time is reached, the vacuum chuck (51) moves upward, and the clamping block (33) re-clamps the semiconductor wafer; then the adjustment mechanism (32) drives the slide (31) to move to the flip mechanism (6); Step 5: The clamping block (33) is released to turn over the semiconductor wafer; after the turning over is completed, the clamping block (33) re-clamps the semiconductor wafer, and the adjustment mechanism (32) drives the slide (31) to move to the self-centering edge polishing mechanism (4) to align the semiconductor wafer with the vacuum suction cup (51); then repeat step 3; Step 6: After the set polishing time is reached, the vacuum suction cup (51) moves upward, and the clamping block (33) re-clamps the semiconductor wafer; the adjustment mechanism (32) drives the slide (31) to move to the unloading mechanism (7), the clamping block (33) is released, and the semiconductor wafer slides from the inclined slide (71) into the conveying mechanism (72) below.

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