Circuit board components and electronic devices

Abstract

An embodiment of the present application provides a circuit board assembly and an electronic device, wherein the circuit board assembly includes a circuit board, a connecting plate, and a second electronic device. The circuit board has a circuit board body and a first electronic device, and the first electronic device is located on the circuit board body. The circuit board body has a first signal hole. The connecting plate is located on the side of the circuit board body opposite to the first electronic device, and is connected to the first electronic device through the first signal hole. The second electronic device is connected to the connecting plate. The circuit board assembly of the present application can fully utilize the first signal hole while realizing signal transmission between the first electronic device and the second electronic device, so as to avoid the signal between the first electronic device and the second electronic device from generating residual stubs in the first signal hole, thereby improving the quality of the signal between the first electronic device and the second electronic device.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a circuit board assembly and an electronic device. Background Art

[0002] At present, electronic devices such as laptops and tablets play an important role in people's daily life and work. The existence of these electronic devices has greatly facilitated people's life and work. With the continuous development of electronic technology, people's requirements for the performance of electronic devices are also constantly increasing.

[0003] Electronic devices have circuit boards inside them. As the core component of electronic devices, circuit boards play an important role in electronic devices. The performance of circuit boards directly affects the performance of electronic devices. Circuit boards include a circuit board body and a large number of electronic devices, and a large number of electronic devices are carried on the circuit board body. At present, the circuit board body in the circuit board is mostly provided with signal holes so that signal transmission between electronic devices carried on the circuit board can be achieved through the signal holes. For example, signal transmission between a central processing unit on the circuit board body and a double-rate synchronous dynamic random access memory (hereinafter referred to as random access memory) can be achieved through the signal holes on the circuit board.

[0004] When the CPU and RAM are transmitting signals through the signal hole, a stub will form in the circuit board body. The stub will deteriorate the signal quality, causing the RAM rate to be unable to increase to the maximum rate supported by the electronic device, limiting the performance improvement of the circuit board. Summary of the invention

[0005] The present application provides a circuit board assembly and an electronic device, so that during the transmission process of a signal between a first electronic device and a second electronic device, a first signal hole can be fully utilized to avoid the generation of residual stubs during transmission in the first signal hole, thereby improving the quality of the signal between the first electronic device and the second electronic device.

[0006] A first aspect of an embodiment of the present application provides a circuit board assembly, the circuit board assembly comprising:

[0007] The circuit board comprises a circuit board body and a first electronic device, wherein the first electronic device is located on the circuit board body; the circuit board body comprises a signal hole, wherein the signal hole comprises a first signal hole;

[0008] The connecting plate is located on a side of the circuit board body opposite to the first electronic device and is connected to the first electronic device through the first signal hole;

[0009] The second electronic device is electrically connected to the connecting board.

[0010] In the circuit board assembly of the embodiment of the present application, the connection plate is provided so that the first electronic device can use the first signal hole on the circuit board body and achieve conduction with the second electronic device through the connection plate, so that the signal between the first electronic device and the second electronic device (referred to as the second electronic device signal) can fully utilize the first signal hole during transmission to avoid the generation of residual piles in the first signal hole. The present application does not require a back drilling process, so that the second electronic device can be close to the first electronic device, improve the quality of the second electronic device signal, and ensure that the performance of the second electronic device is better exerted.

[0011] In some possible implementations, the connection board is a high-density interconnection board, and a first signal path is provided in the connection board, a first end of the first signal path is connected to the first electronic device through a first signal hole, and a second end of the first signal path is connected to the second electronic device;

[0012] When the signal between the second electronic device and the first electronic device is transmitted in the first signal path, the connection board does not generate a stub at the first signal path.

[0013] In this way, the connecting board realizes conduction between the first electronic device and the second electronic device through the first signal path, so as to ensure that the first electronic device is electrically connected to the second electronic device, while the signal of the second electronic device can fully utilize the first signal hole and the first signal path during transmission, and no residual stumps will be generated in the first signal hole and the first signal path.

[0014] Compared to the method of using a high-density interconnection board in the circuit board body to solve the problem of the second electronic device signal generating residual stubs in the first signal hole, the present application can avoid the second electronic device signal generating residual stubs in the first signal hole by only setting a connecting board, thereby reducing the manufacturing cost of the circuit board assembly.

[0015] In some possible embodiments, a first conductive portion is provided between the first electronic device and the circuit board body, and the first electronic device is connected to the first end of the first signal hole through the first conductive portion; a second conductive portion is provided between the connecting board and the circuit board body, and the second end of the first signal hole is connected to the first end of the first signal path through the second conductive portion.

[0016] The first conductive portion and the second conductive portion can realize the conduction between the first electronic device and the first end of the first signal path. In addition, due to the introduction of the connecting plate, the signal fan-out area of ​​the first electronic device can be reduced, so that the second electronic device is closer to the first electronic device, so as to further reduce the insertion loss of the second electronic device signal and improve the quality of the second electronic device signal.

[0017] In some possible implementations, the first signal hole is located on the side of the first conductive portion, which can simplify the formation process of the first signal hole and reduce the manufacturing cost of the circuit board assembly.

[0018] In some possible implementations, there are multiple first conductive portions, and each first conductive portion is correspondingly provided with a first signal hole and a second conductive portion;

[0019] The connecting board is provided with a first signal path corresponding to each second conductive portion so as to form multiple transmission paths between the first electronic device and the second electronic device. Multiple second electronic device signals are transmitted through their respective transmission paths, which can improve the transmission rate of the second electronic device signals and avoid mutual interference between the second electronic device signals.

[0020] In some possible implementations, a third conductive portion is provided between the second electronic device and the connecting board, and the third conductive portion is connected between the second end of the first signal path and the second electronic device to achieve conduction between the second electronic device and the connecting board through the third conductive portion.

[0021] In some possible embodiments, the second electronic device is located on a side of the connecting board facing the first electronic device; the first end of the first signal path and the second end of the first signal path are both formed on a side of the connecting board facing the circuit board body to ensure that the first signal path is connected to the first electronic device and the second electronic device.

[0022] In some possible implementations, the second electronic device is connected to a side of the circuit board body on which the first electronic device is provided to ensure electrical conduction between the first electronic device and the second electronic device, thereby avoiding residual stubs generated when the signal of the second electronic device is transmitted in the first signal hole, thereby improving the quality of the signal of the second electronic device and enabling the first electronic device and the second electronic device to be arranged on the same surface of the circuit board body.

[0023] In some possible implementations, the signal hole further includes a second signal hole, and the circuit board body has the second signal hole at a position corresponding to the third conductive portion;

[0024] A first end of the second signal hole is connected to the second electronic device, and a second end of the second signal hole is connected to the third conductive portion.

[0025] By connecting the second signal hole with the second electronic device and the third conductive portion, the second electronic device can be connected to the connecting board and the second electronic device signal can fully utilize the second signal hole during transmission to avoid residual stubs in the second signal hole.

[0026] In some possible implementations, a fourth conductive portion is provided between the second electronic device and the circuit board body, and the second electronic device is connected to the first end of the second signal hole via the fourth conductive portion to achieve conduction between the second electronic device and the connecting board.

[0027] In some possible embodiments, the circuit board assembly also includes an adapter board, and the second electronic device is connected to the first end of the second signal hole through the adapter board, so as to achieve conduction between the second electronic device and the circuit board body through the adapter board while ensuring that the second signal hole is opened on the circuit board body.

[0028] In some possible implementations, the second electronic device has a second projection area on the circuit board body;

[0029] The projection of the connecting board on the circuit board body and the second projection area have a second overlapping area; the second signal hole is located in the second overlapping area, so that the second electronic device can be connected to the connecting board through the second signal hole while being closer to the first electronic device, thereby improving the quality of the second electronic device signal.

[0030] In some possible implementations, the second electronic device is located in the circuit board body, and while the second electronic device is connected to the second electronic device, the second electronic device can be hidden in the circuit board body to avoid the circuit board assembly being too thick and affecting the thickness of the electronic device.

[0031] In some possible implementations, the second electronic device is located on a side of the connection board away from the first electronic device, so that the second electronic device and the first electronic device are arranged on different surfaces of the circuit board body;

[0032] The first end of the first signal path is formed on the side of the connecting plate facing the circuit board body, and the second end of the first signal path is formed on the side of the connecting plate facing the second electronic device, so as to achieve conduction between the second electronic device and the first electronic device through the first signal path.

[0033] In some possible embodiments, the number of third conductive portions is equal to the number of first signal paths and corresponds one to one, so that each first signal path of the connecting board can be connected to the second electronic device through a third conductive portion to achieve transmission of the second electronic device signal in each transmission path.

[0034] In some possible implementations, the connection board includes a conductive portion and a plurality of conductive circuit layers stacked together, and adjacent conductive circuit layers are insulated from each other; at least two conductive circuit layers located in the middle layer of the connection board form a core board unit of the connection board, and adjacent conductive circuit layers located on the side of the core board unit are interconnected through the conductive portion;

[0035] The first signal path is formed at least at the conductive portion of the core board unit facing the circuit board body, so that the first signal path is formed by utilizing the conductive portions interconnected between adjacent conductive circuit layers, so that the second electronic device signal can be transmitted within the first signal path while avoiding the second electronic device signal from passing through useless conductive circuit layers when passing through the first signal path, thereby avoiding the generation of residual piles.

[0036] In some possible implementations, adjacent conductive circuit layers within the core board unit are interconnected via conductive parts.

[0037] In some possible implementations, the signal hole is a signal via hole or a signal buried hole on the circuit board body to solve the problem of residual stubs generated when the second electronic device signal is transmitted in the signal via hole or the signal buried hole of the circuit board body.

[0038] In some possible implementations, the first electronic device has a first projection area on the circuit board body;

[0039] The projection of the connecting plate on the circuit board body has a first overlapping area with the first projection area; the first signal hole is located in the first overlapping area, so that the signal fan-out area of ​​the first electronic device can be zero, further improving the quality of the signal of the second electronic device.

[0040] In some possible implementations, the circuit board body has a first surface and a second surface in the thickness direction of the board, and the second surface faces the keyboard of the electronic device;

[0041] The first electronic device is arranged on the first surface, and the connecting plate is arranged on the second surface, so that the connecting plate is located on the side of the circuit board body opposite to the first electronic device, so as to ensure that the connecting plate can be connected to the first electronic device through the first signal hole, and can facilitate the heat dissipation of the first electronic device, thereby improving the user experience of the electronic device.

[0042] In some possible implementations, the circuit board assembly further includes an isolating member, which blocks at least one side of the second electronic device, so as to shield the second electronic device through the isolating member to prevent the second electronic device from affecting other signals of the electronic device.

[0043] In some possible implementations, the isolation member includes an isolation cover or an isolation plate, which can achieve shielding for the second electronic device while making the structure of the isolation member more diversified to adapt to the design requirements of the circuit board assembly for the isolation member in different scenarios.

[0044] In some possible implementations, the first electronic device includes a processor, and the second electronic device includes a memory, so as to improve the performance of the memory so that the rate of the memory can be increased to the maximum rate that the electronic device can support.

[0045] A second aspect of an embodiment of the present application provides an electronic device, which includes a housing and a circuit board assembly as described above, wherein the circuit board assembly is located inside the housing to ensure that the performance of the second electronic device in the circuit board assembly is better utilized to improve the performance of the circuit board assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0047] Figure 2 A schematic diagram of the internal structure of a body of an electronic device provided in an embodiment of the present application;

[0048] Figure 3 A partial schematic diagram of the core area of ​​the first circuit board provided in the related art;

[0049] Figure 4 for Figure 3 A local detail view of the circuit board body at the first signal hole and the second signal hole;

[0050] Figure 5 A partial schematic diagram of the core area of ​​the second circuit board provided in the related art;

[0051] Figure 6 A partial schematic diagram of a circuit board assembly provided in the related art;

[0052] Figure 7 A partial schematic diagram of another circuit board assembly provided in the related art;

[0053] Figure 8 A schematic diagram of a structure for removing stumps on a circuit board body by back drilling provided in the related art;

[0054] Fig. 9 A schematic diagram of the structure of a first circuit board assembly provided in an embodiment of the present application;

[0055] Fig.10 A schematic diagram of the structure of a connecting plate provided in an embodiment of the present application;

[0056] Fig.11 A schematic diagram of the structure of another connecting plate provided in an embodiment of the present application;

[0057] Fig.12 A structural schematic diagram of another connecting plate provided in an embodiment of the present application;

[0058] Fig.13 A schematic diagram of the structure of another connecting plate provided in an embodiment of the present application;

[0059] Fig.14 A schematic diagram of signal routing in a low-order high-density interconnect board provided in an embodiment of the present application;

[0060] Fig.15 A schematic diagram of the structure of a second circuit board assembly provided in an embodiment of the present application;

[0061] Fig.16A schematic diagram of the structure of a third circuit board assembly provided in an embodiment of the present application;

[0062] Fig.17 A schematic structural diagram of a fourth circuit board assembly provided in an embodiment of the present application;

[0063] Fig.18 A schematic diagram of a first routing pattern of a signal of the second electronic device in a connecting board when the first electronic device and the second electronic device provided in an embodiment of the present application are arranged on the same surface of the connecting board;

[0064] Fig.19 A schematic diagram of a second routing of a signal of the second electronic device in a connecting board when the first electronic device and the second electronic device provided in an embodiment of the present application are arranged on the same surface of the connecting board;

[0065] Fig. 20 A schematic diagram of a third routing of a signal of the second electronic device in a connecting board when the first electronic device and the second electronic device provided in an embodiment of the present application are arranged on the same surface of the connecting board;

[0066] Fig.21 A schematic structural diagram of a fifth circuit board assembly provided in an embodiment of the present application;

[0067] Fig. 22 A schematic structural diagram of a sixth circuit board assembly provided in an embodiment of the present application;

[0068] Fig.23 A schematic diagram of a first routing of a signal of the second electronic device in a connecting board when the first electronic device and the second electronic device provided in an embodiment of the present application are arranged on different surfaces of the connecting board;

[0069] Fig.24 A schematic diagram of a second routing of a signal of the second electronic device in a connecting board when the first electronic device and the second electronic device provided in an embodiment of the present application are arranged on different surfaces of the connecting board;

[0070] Fig.25 A schematic diagram of a third routing of a signal of the second electronic device within a connecting board when the first electronic device and the second electronic device are arranged on different surfaces of the connecting board provided in an embodiment of the present application.

[0071] Reference numerals:

[0072] 100- electronic equipment;

[0073] 1-screen component; 11-screen housing; 12-display screen;

[0074] 2-body; 21-base; 22-keyboard; 23-touchpad;

[0075] 3- Rotating shaft mechanism;

[0076] 4-circuit board; 41-circuit board body; 411-first signal hole; 412-second signal hole; 413-working layer; 414-first conductive part; 415-second conductive part; 416-third conductive part; 417-fourth conductive part; 418-fifth conductive part; 42-central processing unit; 421-substrate; 422-chip; 423-packaging layer; 43-random access memory; 44-core area; 45-first connecting part; 46-second connecting part; 47-third connecting part; 48-first electronic device; 49-second electronic device;

[0077] 5- Fan;

[0078] 6-connecting board; 61-first signal path; 62-conductive circuit layer; 63-insulating layer; 64-core board unit; 641-first side; 642-second side; 65-conductive part; 651-first conductive part; 652-second conductive part; 653-third conductive part; 654-fourth conductive part; 655-fifth conductive part; 66-signal buried hole; 67-conductive group;

[0079] 7-adapter board; 71-second signal path;

[0080] 8-Drill bit;

[0081] 9- Isolation piece;

[0082] S0-signal fan-out area; S1-first overlapping area; S2-second overlapping area. DETAILED DESCRIPTION

[0083] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application.

[0084] The embodiment of the present application provides an electronic device, which may include but is not limited to a computer, a mobile phone, a drone, a netbook, a personal digital assistant (PDA), an ultra-mobile personal computer (UMPC), a handheld computer, a smart wearable device, a virtual reality (VR) device, a server, a point of sales (POS), and other mobile or fixed terminals. The computer may include a laptop, a tablet computer (i.e., a pad), and the like.

[0085] Figure 1The structure of an electronic device 100 is schematically shown, and the electronic device 100 is a laptop computer. The structure of the electronic device 100 is further described below by taking the laptop computer as an example.

[0086] See also Figure 1 As shown, the electronic device 100 may include a screen component 1 and a body 2. The screen component 1 may be used to display information and provide an interactive interface for the user. The body 2 has an input device, and the user may operate on the body 2 to facilitate the user's input when using the electronic device 100.

[0087] See also Figure 1 As shown, the electronic device 100 may further include a hinge mechanism 3. The hinge mechanism 3 is located at the connection between the screen member 1 and the base 21, and the screen member 1 is rotatably connected to the base 21 through the hinge mechanism 3. By rotating the screen member 1, the configuration of the electronic device 100 can be changed. For example, by rotating the screen member 1, the electronic device 100 can be switched from a closed state to an open state (such as Figure 1 As shown). For another example, by rotating the screen member 1, the electronic device 100 can be switched from an open state to a closed state. When the electronic device 100 is in a closed state, the screen member 1 is stacked on the base 21. When the electronic device 100 is in an open state, the screen member 1 is arranged at an angle relative to the body 2.

[0088] In some embodiments, the screen member 1 can be arranged on the body 2 and can be separated from the body 2. For example, the screen member 1 can be arranged on the body 2 by magnetic attraction so that the screen member 1 can be separated from the body 2. After the screen member 1 is separated from the body 2, the screen member 1 and the body 2 can be two independent devices. The screen member 1 can be used alone. By changing the position of the screen member 1 relative to the body 2, the user's usage needs in more application scenarios can be met.

[0089] Below Figure 1 Taking the laptop computer in which the screen member 1 is rotatably connected to the base 21 as an example, the structure of the electronic device 100 is further described.

[0090] Continue to see Figure 1 As shown, the screen component 1 may include a screen housing 11 and a display screen 12. The display screen 12 is mounted on the screen housing 11 and together with the screen housing 11 constitutes the screen component 1. When the display screen 12 is mounted on the screen housing 11, the display screen 12 is exposed on a side of the screen housing 11 facing the body 2, so that the display screen 12 can be used to display information and provide an interactive interface for the user.

[0091] Continue to see Figure 1 The screen component 1 further includes a camera module (not shown) etc. The camera module is located in the screen housing 11 to realize the assembly of the camera module on the screen component 1.

[0092] Continue to see Figure 1 The body 2 includes a base 21. The electronic device 100 includes a housing, which includes the base 21 and a screen housing 11. The hinge mechanism 3 is located between the screen housing 11 and the base 21, and the screen housing 11 is rotatably connected to the base 21 through the hinge mechanism 3 to realize the rotatable connection between the screen member 1 and the body 2. In this way, by rotating the screen housing 11, the electronic device 100 can be switched between the open state and the closed state.

[0093] The side of the screen housing 11 facing away from the display screen 12 forms the A side of the electronic device 100. The side of the screen member 1 provided with the display screen 12 forms the B side of the electronic device 100.

[0094] Continue to see Figure 1 The input device on the body 2 may include a keyboard 22. The keyboard 22 includes a language input module, a number input module, and a symbol input keyboard 22. The keyboard 22 is installed on the side of the base 21 facing the display screen 12 to achieve the assembly of the keyboard 22 on the base 21. The user can operate on the keyboard 22 to facilitate the user's input when using the electronic device 100.

[0095] In addition to the keyboard 22, the input device on the body 2 may also include a touch pad 23. As another input module in the electronic device 100, the touch pad 23 may also be installed on the side of the base 21 facing the display screen 12 to issue commands or input data to the electronic device 100. The touch pad 23 may be arranged on the base 21 at a side of the touch pad 23 away from the hinge mechanism 3, so that when the user uses the electronic device 100, the touch pad 23 can be close to the user, so that the user can use the touch pad 23 easily.

[0096] The side of the base 21 on which the keyboard 22 and the touchpad 23 are provided constitutes the C side of the electronic device 100 , and the side of the base 21 opposite to the keyboard 22 or the touchpad 23 forms the D side of the electronic device 100 .

[0097] Figure 2 1 shows a schematic diagram of the internal structure of a body 2 of an electronic device 100. Figure 2As shown, the electronic device 100 also has a circuit board 4. The circuit board 4 can be arranged in the base 21 to realize the installation of the circuit board 4 in the body 2. The circuit board 4 includes a circuit board body 41 (not shown) and a large number of electronic devices. For the convenience of the following description, the length direction of the circuit board body 41 is defined as the X direction, the width direction of the circuit board body 41 is defined as the Y direction, and the thickness direction of the circuit board body 41 is defined as the Z direction. A large number of electronic devices (not shown in the figure) are usually arranged on the circuit board body 41 to realize the control function of the circuit board 4 on the electronic device 100. For example, the circuit board 4 can be connected to the display screen 12 to realize the display control function of the display screen 12.

[0098] A large number of electronic devices include processors, memories, and electrical connectors. For example, the processor may include a central processing unit (CPU), an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, a display processing unit (DPU), etc.

[0099] The processor (such as the central processing unit 42) can be electrically connected to the display screen 12 through the electrical connector on the circuit board body 41, so that the signal between the processor and the display screen 12 can be transmitted between the processor and the display screen 12, thereby realizing the display control function of the processor on the display screen 12. Among them, the electrical connector can be an electrical connection socket, etc.

[0100] The memory can be used to store computer executable program codes, data (such as audio data, phone book) created during the use of the electronic device 100, etc. The executable program code includes instructions. The memory may include a high-speed random access memory or a non-volatile memory, etc. For example, the high-speed random access memory may include a double data rate synchronous dynamic random access memory (abbreviated as DDR, referred to as random access memory 43). For example, the non-volatile memory may include a flash memory, etc.

[0101] The processor is electrically connected to the memory, and the signal transmission between the processor and the memory can be realized. For example, when the processor (such as the central processing unit 42) is electrically connected to the memory, not only the memory can save the instructions or data just used or cyclically used by the processor, but also the processor can execute various functional applications and data processing of the electronic device 100 by running the instructions stored in the memory.

[0102] In addition to the processor, memory, and electrical connector, the circuit board 4 also carries electronic components such as a power management module and a charging management module. The electronic components carried by the circuit board 4 will not be further described here.

[0103] Since at least most of the processors are heat generating devices, a large amount of heat will be generated when they are working. For example, the CPU 42, the graphics processor, the application processor and other processors are heat generating devices, and a large amount of heat will be generated when they are working. Therefore, when the electronic devices are laid out on the circuit board 4, the processors and other heat generating devices are centrally arranged so that the heat dissipation system in the body 2 can be used to dissipate the heat of the processors and other heat generating devices to ensure the normal use of the electronic device 100.

[0104] The area on the circuit board body 41 where the processor is centrally arranged is called the core area 44 of the circuit board 4. The heat dissipation system may include active heat sinks and passive heat sinks. Passive heat sinks may include heat pipes, heat spreaders, etc. Passive heat sinks are mainly used to be arranged on heat-generating devices and passively absorb heat from the heat-generating devices to achieve heat dissipation of the heat-generating devices. Active heat sinks may include fans 5. The fan 5 can carry away the heat from the passive heat sink, thereby achieving continuous heat dissipation of the heat-generating devices by the passive heat sink. The fan 5 is usually arranged on the side of the circuit board body 41. The number of fans 5 may be two. The core area 44 of the circuit board 4 may be located in the area of ​​the circuit board body 41 between the two fans 5.

[0105] As a core component of the electronic device 100, the circuit board 4 plays an important role in the electronic device 100. The performance of the circuit board 4 directly affects the performance of the electronic device 100.

[0106] Figure 3 The schematic diagram shows the local structure of the first circuit board in the core area 44 in the related art. Figure 3As shown, the circuit board body 41a is a circuit board on which the circuit board 4a carries electronic devices. Under the premise of ensuring signal transmission between electronic devices carried on the circuit board 4a, the circuit board body 41a in the circuit board 4a is mostly provided with signal holes due to the manufacturing cost of the electronic device 100. The signal holes in the circuit board body 41a are signal vias. Signals between electronic devices carried on the circuit board 4a can be transmitted through the signal holes. The signal vias can be metal vias on the circuit board body 41a. The metal vias can be understood as through holes on the circuit board body 41a that are plated with conductive metal. For example, the conductive metal can be copper or the like.

[0107] For example, see Figure 3 In order to facilitate the electrical connection between the random access memory 43 and the central processing unit 42, the random access memory 43 is also arranged in the core area 44 (not marked), and the signal transmission between the central processing unit 42 and the random access memory 43 can be realized through the signal hole on the circuit board 4.

[0108] Continue to see Figure 3 , the central processing unit 42 may include a substrate 421, a chip 422 and a packaging layer 423. The chip 422 is soldered on the substrate 421. The packaging layer 423 is packaged on the outside of the chip 422 and the substrate 421. The substrate 421 is soldered to the circuit board body 41a through a plurality of first connecting parts 45. The first connecting part 45 is a soldering part. For example, the soldering part may include a solder pad and a solder ball on the solder pad. The random access memory 43 may be arranged on the same surface of the circuit board body 41a as the central processing unit 42. The random access memory 43 is soldered to the circuit board body 41a through a plurality of second connecting parts 46. The second connecting part 46 is the soldering part mentioned above.

[0109] The circuit board body 41a is provided with a first signal hole 411a at a position corresponding to the first connection portion 45, and a second signal hole 412a at a position corresponding to the second connection portion 46. The CPU 42 is connected to the RAM 43 via the first connection portion 45, the first signal hole 411a, the second signal hole 412a, and the second connection portion 46, thereby realizing electrical connection between the CPU 42 and the RAM 43, so as to facilitate the transmission of signals (hereinafter referred to as RAM signals) between the CPU 42 and the RAM 43.

[0110] The first connection portion 45 , the first signal hole 411 a , the second signal hole 412 a and the second connection portion 46 may constitute a transmission path between the central processing unit 42 and the random access memory 43 , and the transmission path is used for transmitting the random access memory signal between the central processing unit 42 and the random access memory 43 .

[0111] Figure 3Only one transmission path between the central processing unit 42 and the random access memory 43 is shown, and it does not constitute a limitation on the number of transmission paths between the central processing unit 42 and the random access memory 43. The number of random access memory signals is multiple. There are multiple transmission paths between the central processing unit 42 and the random access memory 43, so that each random access memory signal can be transmitted through one transmission path. At this time, the central processing unit 42 can be electrically connected to the random access memory 43 through multiple first connecting parts 45. Multiple first connecting parts 45 are evenly arranged on the circuit board body 41 along the peripheral side of the central processing unit 42. A first signal hole 411, a second signal hole 412 and a second connecting part 46 are correspondingly arranged at each first connecting part 45 to form multiple transmission paths between the central processing unit 42 and the random access memory 43. A first connecting part 45, a first signal hole 411, a second signal hole 412 and a second connecting part 46 are correspondingly arranged in each signal transmission path. In the application, the number of transmission paths between the central processing unit 42 and the random access memory 43 is not particularly limited. The following further describes the transmission of random access memory signals by taking one of the transmission paths as an example.

[0112] Due to the manufacturing cost of the circuit board 4a, the first signal hole 411a is usually set in the blank area on the side of the first connection part 45 of the circuit board body 41a, and the second signal hole 412a is usually set in the blank area on the side of the second connection part 46 of the circuit board body 41a. The first signal hole 411a is set corresponding to the first connection part 45 and connected to the corresponding first connection part 45, and the second signal hole 412a is connected through the working layer 413 (not marked) inside the circuit board body 41a. The second signal hole 412a is also set corresponding to the second connection part 46 and connected to the corresponding second connection part 46, so that the central processing unit 42 is connected to the random access memory 43 through the first connection part 45, the first signal hole 411a, the second signal hole 412a and the second connection part 46.

[0113] Figure 4 Schematically shows Figure 3 Detailed view of the circuit board body 41a at the first signal hole 411a and the second signal hole 412a. Figure 4 As shown, the existing circuit board body 41a includes a multi-layer stacked working layer 413. The working layer 413 includes a copper layer located at the top layer and the bottom layer of the circuit board body 41a. The working layer 413 also includes an intermediate layer located at the circuit board body 41a. For example, the intermediate layer can be a circuit layer, etc. Adjacent working layers 413 are insulated from each other. Signal holes penetrate each working layer 413. Each first signal hole 411a can be connected to the second signal hole 412a through the intermediate layer in the circuit board body 41a.

[0114] When the random access memory signal is transmitted in the first signal hole 411 a , it only passes through a portion of the working layer 413 of the circuit board body 41 a in the first signal hole 411 , and there may be a situation where the first signal hole 411 a is too long.

[0115] The working layer 413 through which the random access memory signal does not pass will form a stub in the first signal hole 411a. The stub will reflect the high-speed signal in the first signal hole 411a, causing the quality of the high-speed signal to deteriorate. For example, in some examples, the high-speed signal can be understood as a signal with a rate greater than 2G. In some examples, the rate of the high-speed signal can also adopt other defining conditions (such as a rate greater than 5G). In this application, a signal with a rate greater than 2G is taken as an example of a high-speed signal to further illustrate the electronic device 100.

[0116] The random access memory signal is a high-speed signal. Therefore, the residual pile seriously deteriorates the quality of the random access memory signal, which will cause the rate of the random access memory 43 to be unable to be increased to the maximum rate supported by the electronic device 100, limiting the performance improvement of the circuit board 4a.

[0117] Similarly, when the random access memory signal is transmitted in the second signal hole 412a, since the random access memory signal only passes through a portion of the working layer 413 of the circuit board body 41a in the second signal hole 412a, the working layer 413 that the random access memory signal has not passed through will form a stump in the second signal hole 412a, which will cause the quality of the random access memory signal to deteriorate.

[0118] Figure 5 FIG. 4 is a partial schematic diagram of a second circuit board provided in the related art in a core area 44 (not shown). Figure 3 The first circuit board (circuit board 4a) in FIG. 1 is different in that, see Figure 5 As shown, the random access memory 43 in the second circuit board (circuit board 4b) is soldered to the side of the circuit board body 41a opposite to the central processing unit 42 through the second connecting portion 46. In other words, the random access memory 43 and the central processing unit 42 are arranged on different surfaces on the circuit board body 41a. Similarly, when the random access memory 43 and the central processing unit 42 are arranged on different surfaces on the circuit board body 41a, the two technical problems existing in the first circuit board 4 (circuit board 4a) will also exist, resulting in the deterioration of the quality of the random access memory signal.

[0119] Figure 3 and Figure 5 Both illustrate conventional arrangements of existing random access memories 43 on a circuit board body 41. In the conventional arrangement, the spacing between adjacent second connection portions 46 of the circuit board body 41a is relatively large, which can meet the requirements for the arrangement of the second signal holes 412a on the circuit board body 41a.

[0120] Figure 6 A partial schematic diagram of a circuit board assembly in the related art is shown. Figure 6 This is an unconventional arrangement of the existing random access memory 43 on the circuit board body 41a. Figure 6 As shown, compared with the first circuit board (circuit board 4a) and the second circuit board (circuit board 4b) mentioned above, the number of second connecting parts 46 between the random access memory 43 and the circuit board body 41a is increased, and the spacing between adjacent second connecting parts 46 is smaller.

[0121] As described above, the second signal hole 412a is usually disposed in the blank area of ​​the circuit board body 41a beside the second connection portion 46. When the spacing between adjacent second connection portions 46 is smaller, there will be insufficient space between adjacent second connection portions 46 in the circuit board body 41a to dispose the second signal hole 412a.

[0122] Therefore, continue to see Figure 6 In an unconventional setting, the random access memory 43 is connected to the circuit board body 41a through the adapter board 7a. The second connection portion 46 can be located between the adapter board 7a and the random access memory 43. The circuit board body 41a is connected to the adapter board 7a through the third connection portion 47. The third connection portion 47 is the welding portion mentioned above. For example, the circuit board body 41a is provided with a third connection portion 47 corresponding to each second signal hole 412a. The second signal hole 412a is connected to the corresponding third connection portion 47. The adapter board 7a has a signal path (not marked) at each third connection portion 47. The second signal hole 412a is electrically connected to the random access memory 43 through the corresponding third connection portion 47, the signal path in the adapter board 7a and the second connection portion 46, so as to realize the transmission of the random access memory signal between the second connection portion 46 and the second signal hole 412a.

[0123] See also Figure 6 As shown, when the random access memory 43 is connected to the circuit board body 41a through the adapter plate 7a, the random access memory 43 can be connected to the side of the circuit board body 41a provided with the central processing unit 42 through the adapter plate 7a. In other words, the random access memory 43 and the central processing unit 42 can be arranged on the same side of the circuit board body 41a.

[0124] Considering the heat dissipation of the CPU 42 and the user experience of the electronic device 100 , when the circuit board body 41 a is disposed in the body 2 , the CPU 42 is usually disposed on the side of the circuit board body 41 a facing the D surface of the electronic device 100 .

[0125] Figure 7 FIG. 1 is a partial schematic diagram of another circuit board assembly provided in the related art. Figure 7 As shown, if the random access memory 43 is connected to the side of the circuit board body 41a opposite to the central processing unit 42 through the adapter plate 7a, that is, the random access memory 43 and the central processing unit 42 are arranged on different surfaces on the circuit board body 41a, the random access memory 43 will be oriented toward the C surface of the electronic device 100, so that the random access memory 43 is too close to the keyboard 22.

[0126] When the thickness of the body 2 remains unchanged, if the distance between the random access memory 43 and the keyboard 22 is too close, the distance between the random access memory 43 and the keyboard 22 will not meet the design requirements of the electronic device 100. Therefore, when the random access memory 43 is connected to the circuit board body 41a through the adapter plate 7a, the random access memory 43 and the central processing unit 42 are usually arranged on the same surface of the circuit board body 41a, so that the random access memory 43 faces the D surface of the electronic device 100.

[0127] Similarly, when the random access memory 43 is connected to the circuit board body 41 through the adapter board 7a, the two technical problems existing in the first circuit board (circuit board 4a) will also exist, resulting in the deterioration of the quality of the random access memory signal.

[0128] In the related art, a back drilling process is usually used to remove the residual piles in the circuit board body 41a.

[0129] by Figure 6 Take the circuit board assembly in as an example, Figure 8 The schematic diagram of the structure of back drilling to eliminate the residual pile on the circuit board body 41a is shown. Figure 8 As shown, taking the first signal hole 411a as an example, the process of back drilling to eliminate the residual pile in the signal hole is briefly described. Figure 8 In the back drilling process, the size of the drill bit 8 is larger than the aperture of the first signal hole 411a, and the drill bit 8 can be located at the end (useless end) of the circuit board body 41a where the stub is generated in the first signal hole 411a. The stub generated in the first signal hole 411a can be eliminated by drilling the circuit board body 41a with the drill bit 8. Similarly, the stub generated in the second signal hole 412a can also be eliminated through the back drilling process.

[0130] However, the back drilling process cannot be widely used in electronic devices 100 such as notebook computers. The specific reasons include three points.

[0131] The first point is that due to the limitation of the alignment accuracy of the signal hole of the existing drill bit 8 on the circuit board body 41a, the size of the drill hole formed by the drill bit 8 on the circuit board body 41a will be larger than the preset drill hole size. In order to prevent the drill bit 8 from damaging the working layer 413 of the circuit board body 41a on the peripheral side of the drill hole during the drilling process, it is necessary to increase the distance between the signal hole and the surrounding working layer 413 in the initial setting of the circuit board body 41a, which will cause the drill bit 8 to require a larger space on the circuit board body 41a during the back drilling process. When a larger space is required on the circuit board body 41 during the back drilling process, the area of ​​the circuit board 4 in the core area 44 will be too large. Since the size of the core area 44 of the circuit board needs to be coupled with the size of the passive heat sink, and the electronic device 100 requires the size of the circuit board in the core area 44 to be as small as possible, this will cause the use of the back drilling process to be contrary to the demands of the electronic device 100.

[0132] Continue to see Figure 8 Combined with Figure 6 As shown, the second point is that when the back drilling needs to increase the distance between the signal hole and the peripheral working layer 413, the distance between two adjacent signal holes in the circuit board body 41a will increase. For example, when the distance between two adjacent first signal holes 411a increases, part of the plurality of first signal holes 411a will move toward one side of the random access memory 43 along the width direction (Y direction) of the circuit board body 41a, and then the random access memory 43 will move toward the side away from the central processing unit 42 along the Y direction, and the design area required for the random access memory 43 on the circuit board body 41 will increase, so that the random access memory 43 is far away from the central processing unit 42.

[0133] When the random access memory 43 is far away from the central processing unit 42, the insertion loss of the random access memory signal will increase and the quality of the random access memory signal will deteriorate.

[0134] The third point is that an additional process is required to perform a back drilling process during the manufacturing process of the circuit board body 41 a , which will increase the manufacturing cost of the circuit board.

[0135] In summary, the back drilling process cannot be widely used in electronic devices 100 such as laptop computers. The problem of deterioration of the signal quality of the random access memory caused by the stubs and the random access memory 43 and the central processing unit 42 has not been effectively solved.

[0136] To this end, an embodiment of the present application provides a circuit board assembly. Fig. 9 The schematic diagram of the structure of the first circuit board assembly of the present application is shown. Fig. 9As shown, by adding a connecting plate 6 to the circuit board assembly, the first electronic device 48 can utilize the first signal hole 411 on the circuit board body 41, and achieve conduction with the second electronic device 49 through the connecting plate 6, so as to realize the transmission of the signal (referred to as the second electronic device signal) between the first electronic device 48 and the second electronic device 49, while the second electronic device signal can fully utilize (100% utilize) the first signal hole 411 during the transmission process, thereby avoiding the generation of residual piles in the first signal hole 411. Therefore, the circuit board assembly of the present application does not require a back drilling process, so that the second electronic device 49 is close to the first electronic device 48, and the quality of the signal between the first electronic device 48 and the second electronic device 49 is improved, and the performance of the second electronic device 49 is better utilized, while effectively solving the technical problems caused by the back drilling process.

[0137] The first electronic device 48 may include a processor. For example, the first electronic device 48 may include a central processing unit 42, etc. The second electronic device 49 may include a memory. For example, the second electronic device 49 may include a random access memory 43 (DDR) or other memory with high-speed signals. By introducing the connecting plate 6 in the circuit board assembly, no stumps will be generated in the first signal hole 411, and the second electronic device 49 can be arranged close to the first electronic device 48, which can improve the quality of the random access memory signal and the performance of the random access memory 43, so that the rate of the random access memory 43 can be increased to the maximum rate that the electronic device 100 can support, ensuring that the performance of the random access memory 43 is better utilized to improve the performance of the circuit board assembly.

[0138] Therefore, when the first electronic device 48 is a central processing unit 42 and the second electronic device 49 is a random access memory 43, the present application can effectively solve technical problems caused by the back drilling process, such as the core area 44 of the circuit board 4 is too large and the random access memory 43 is far away from the central processing unit 42.

[0139] It should be noted that, in addition to the memory, the second electronic device 49 may also include other electronic devices in the electronic device 100. For example, the second electronic device 49 may also include a connector, etc. The connector is configured to be connected to the display screen 12. In this way, when the display screen 12 is connected to the first electronic device 48 through the connector, the display screen 12 can be electrically connected to the first electronic device 48, and the quality of the second electronic device signal can be improved, so as to improve the connection performance between the circuit board assembly and the display screen 12.

[0140] The structure of the circuit board assembly of the present application is further described below by taking the first electronic device 48 as the central processing unit 42 and the second electronic device 49 as the random access memory 43 as an example.

[0141] The circuit board assembly of the present application is arranged in the housing of the electronic device to realize the assembly of the circuit board assembly in the electronic device while improving the performance of the circuit board assembly and reducing the production cost of the circuit board assembly. Specifically, the circuit board assembly can be arranged in the base 21 of the body 2.

[0142] Continue to see Fig. 9 The circuit board assembly includes a circuit board 4. The circuit board 4 has a circuit board body 41 and a first electronic device 48. The first electronic device 48 is located on the circuit board body 41. The circuit board body 41 has a signal hole. Among them, the signal hole includes a first signal hole 411. The circuit board assembly also includes a connecting board 6. The connecting board 6 is located on the side of the circuit board body 41 opposite to the first electronic device 48, and is connected to the first electronic device 48 through the first signal hole 411, so that the second electronic device signal is transmitted between the first electronic device 48 and the connecting board 6 through the first signal hole 411.

[0143] The circuit board assembly further includes a second electronic device 49. The second electronic device 49 is in conduction with the connecting board 6. Since the connecting board 6 is in conduction with the first electronic device 48, when the second electronic device 49 is in conduction with the connecting board 6, the first electronic device 48 and the second electronic device 49 can be electrically connected through the connecting board 6 and the first signal hole 411, thereby realizing the transmission of the second electronic device signal between the first electronic device 48 and the second electronic device 49.

[0144] Since the connecting plate 6 is located on the side of the circuit board body 41 opposite to the first electronic device 48, when the signal of the second electronic device 49 is transmitted in the circuit board body 41 and passes through the first signal hole 411, it can completely pass through the first signal hole 411, thereby fully utilizing the first signal (100% utilization) and no residual stumps are generated in the first signal hole 411, thereby avoiding the quality of the second electronic device signal from being deteriorated due to the residual stumps, thereby improving the quality of the second electronic device signal.

[0145] Due to the introduction of the connecting plate 6, the first signal hole 411 will not produce residual piles. The circuit board assembly of the present application does not require a back drilling process, nor does it need to increase the distance between the first signal hole 411 and the peripheral working layer 413 in the circuit board body 41. Therefore, the circuit board assembly of the circuit board 4 of the present application does not have the problem of the circuit board 4 being too large in the core area 44 and the increase in the design area required for the second electronic device 49.

[0146] Compared with the first circuit board 4, the second circuit board 4, the first circuit board assembly and the second circuit board assembly mentioned above, the circuit board assembly of the present application makes the second electronic device 49 closer to the first electronic device 48, which can reduce the insertion loss of the second electronic device signal and improve the quality of the random access memory signal.

[0147] Therefore, the circuit board assembly of the present application can ensure that the performance of the second electronic device 49 is better utilized, so as to improve the performance of the second electronic device 49 and the circuit board assembly.

[0148] Continue to see Fig. 9 , the circuit board body 41 has a first surface and a second surface in the board thickness direction. That is to say, the first surface and the second surface are two opposite surfaces of the circuit board body 41 in the board thickness direction. The board thickness direction of the circuit board body 41 can refer to the Z direction, and the Z direction is perpendicular to the Y direction mentioned above. Among them, the second surface faces the keyboard 22 of the electronic device 100. Since the first surface and the second surface are two opposite surfaces on the circuit board body 41, the second surface is away from the keyboard 22. At this time, the second surface faces the D surface of the electronic device 100.

[0149] The first electronic device 48 is disposed on the first surface, and the connecting plate 6 is disposed on the second surface, so that the connecting plate 6 is located on the side of the circuit board body 41 opposite to the first electronic device 48, so as to ensure that the connecting plate 6 can be connected to the first electronic device 48 through the first signal hole 411. In addition, since the first electronic device 48 is disposed on the first surface, the circuit board assembly of the present application does not change the setting position of the first electronic device 48 on the circuit board body 41, so that the heat dissipation of the first electronic device 48 can be facilitated while ensuring the user experience of the electronic device 100.

[0150] Continue to see Fig. 9 , the connecting board 6 is a high density interconnector (abbreviated as HDI) board. A first signal path 61 is provided in the connecting board 6. The first end of the first signal path 61 is connected to the first electronic device 48 through the first signal hole 411, and the second end of the first signal path 61 is connected to the second electronic device 49. When the second electronic device signal is transmitted in the first signal path 61, the connecting board 6 does not generate a stub at the first signal path 61. In this way, the connecting board 6 realizes the conduction between the first electronic device 48 and the second electronic device 49 through the first signal path 61, so as to ensure that the first electronic device 48 and the second electronic device 49 are electrically connected, and the first signal hole 411 and the first signal path 61 can be fully utilized to transmit the second electronic device signal, and no stub will be generated in the first signal hole 411 and the first signal path 61, so as to further improve the quality of the second electronic device signal.

[0151] In order to solve the problem of the second electronic device signal generating a stub in the first signal hole 411, the circuit board body 41 may also use a high-density interconnection board, but this will cause the manufacturing cost of the circuit board assembly to be too high. Compared with the method of using a high-density interconnection board for the circuit board body 41, since the size of the connecting board 6 is small and it is only a small board arranged on the circuit board body 41, the present application, through the arrangement of the connecting board 6, can avoid the second electronic device signal generating a stub in the first signal hole 411, while not requiring the circuit board body 41 to use a high-density interconnection board as a whole, which can reduce the manufacturing cost of the circuit board assembly.

[0152] Continue to see Fig. 9 , a first conductive portion 414 is provided between the first electronic device 48 and the circuit board body 41. The first electronic device 48 is connected to the first end of the first signal hole 411 through the first conductive portion 414. A second conductive portion 415 is provided between the connecting plate 6 and the circuit board body 41. The second end of the first signal hole 411 is connected to the first end of the first signal path 61 through the second conductive portion 415. Through the first conductive portion 414 and the second conductive portion 415, the first electronic device 48 can be connected to the first end of the first signal path 61, so that when the second end of the first signal path 61 is connected to the second electronic device 49, the first electronic device 48 can be connected to the second electronic device 49, thereby realizing the transmission of the second electronic device signal between the first electronic device 48 and the second electronic device 49.

[0153] If the connection board 6 is not introduced, the first signal hole 411 corresponding to the outer first conductive part 414 needs to be moved to the outer side of the first electronic device 48 along the Y direction to reserve enough wiring channels between the inner first conductive part 414 and the corresponding first signal hole 411. This will cause the signal fan-out area S0 of the first electronic device 48 to be larger, causing the second electronic device 49 to move away from the second electronic device 49 along the Y direction, resulting in the second electronic device 49 being far away from the first electronic device 48, and the second electronic device signal insertion loss is larger.

[0154] The first electronic device 48 has a first projection area on the circuit board body 41. The signal fan-out area S0 of the first electronic device 48 can be understood as the area of ​​the first signal hole 411 on the circuit board body 41 that exceeds the first projection area.

[0155] Due to the introduction of the connecting plate 6, the first conductive portion 414 can be directly connected to the first end of the first signal hole 411, and the connecting plate 6 can be directly connected to the second end of the first signal hole 411 on the back of the circuit board body 41, and the circuit board 4 is used to realize the routing of the second electronic device signal between the first electronic device 48 and the second electronic device 49, without moving part of the first signal hole 411 to the outside of the first electronic device 48. In this way, the signal fan-out area S0 of the first electronic device 48 can be reduced, and the distance between the first electronic device 48 and the second electronic device 49 can be further compressed, so that the second electronic device 49 is closer to the first electronic device 48, so as to further reduce the insertion loss of the signal between the first electronic device 48 and the second electronic device 49, and improve the quality of the second electronic device signal.

[0156] It should be noted that the first electronic device 48 is connected to the first signal hole 411 through the first conductive portion 414. The structure of the first conductive portion 414 will be described below and will not be repeated here.

[0157] There are multiple welding parts between the first electronic device 48 and the circuit board body 41. The welding part may include a solder ball or a solder pad. For ease of description, the welding part between the first electronic device 48 and the circuit board body 41 is referred to as a second welding part. Multiple first welding parts can be evenly arranged between the first electronic device 48 and the circuit board body 41. The first welding part may include a solder ball or a solder pad. Some of the multiple first welding parts are connected to the connecting plate 6, and the other part can be connected to other electronic devices on the circuit board 4. The first welding part connected to the connecting plate 6 forms a first conductive part 414, so that the first electronic device 48 is connected to the first end of the first signal hole 411 using the first welding part.

[0158] There are multiple welding parts between the connecting plate 6 and the circuit board body 41. For the convenience of description, the welding parts between the connecting plate 6 and the circuit board body 41 are called second welding parts. Multiple second welding parts can be evenly arranged between the connecting plate 6 and the circuit board body 41. Similarly, the second welding part connected to the connecting plate 6 forms a second conductive part 415, so that the second end of the first signal hole 411 is connected to the first end of the first signal path 61 by using the second welding part.

[0159] Continue to see Fig. 9 , the first electronic device 48 has a first projection area on the circuit board body 41. The projection of the connecting board 6 on the circuit board body 41 has a first overlapping area S1 with the first projection area. The first signal hole 411 can be located in the first overlapping area S1, so that the signal fan-out area S0 of the first electronic device 48 can be zero, thereby reducing the insertion loss of the second electronic device signal as much as possible and improving the quality of the second electronic device signal.

[0160] It should be noted that, while reducing the signal insertion loss of the second electronic device, the first signal hole 411 may also be partially located outside the first projection area.

[0161] Since the first signal hole 411 is located in the first conductive portion 414, the formation process of the first signal hole 411 is relatively complicated. Therefore, the first signal hole 411 of the present application can be located on the side of the first conductive portion 414 and directly connected to the first signal hole 411, so that the first conductive portion 414 is connected to the first signal, and the formation process of the first signal hole 411 can be simplified, thereby reducing the production cost of the circuit board assembly.

[0162] There are multiple first conductive parts 414. Each first conductive part 414 is correspondingly provided with a first signal hole 411 and a second conductive part 415. The connecting board 6 is correspondingly provided with a first signal path 61 at each second conductive part 415. At this time, multiple transmission paths are formed between the first electronic device 48 and the second electronic device 49. Each transmission path includes a first conductive part 414, a first signal hole 411, a second conductive part 415 and a first signal path 61. Each transmission path transmits a second electronic device signal, which can improve the signal transmission rate while avoiding mutual interference between the second electronic device signals.

[0163] The structure of the circuit board assembly is further explained below using a transmission path as an example.

[0164] Fig.10 Schematic diagram of the structure of a connecting plate 6 is shown. Fig.10 As shown, the connection board 6 includes a conductive circuit layer 62 that is stacked in multiple layers. The conductive circuit layer 62 may be a conductive metal layer. For example, the conductive circuit layer 62 may be a copper layer. The multiple conductive circuit layers 62 are stacked, and adjacent conductive circuit layers 62 are insulated from each other. The number of layers of the conductive circuit layer 62 in the high-density interconnect board is at least four. Specifically, the connection board 6 also includes an insulating layer 63. An insulating layer 63 may be provided between adjacent conductive circuit layers 62 to insulate adjacent conductive circuit layers 62 from each other.

[0165] Continue to see Fig.10 , at least two layers of conductive circuit layers 62 located in the middle layer of the connecting board 6 form a core board unit 64 of the connecting board 6. The connecting board 6 also includes a conductive portion 65. The conductive portion 65 may be formed of a conductive metal. For example, the conductive portion 65 may be formed of copper or the like. Adjacent conductive circuit layers 62 located on the side of the chip 422 unit are interconnected through the conductive portion 65, so that the adjacent conductive circuit layers 62 are interconnected through the conductive portion 65.

[0166] When making the connection board 6, the conductive circuit layer 62 in the core board unit 64 can be pre-pressed, and then conductive vias are set in the pressed core board unit 64, so that the signal can be interconnected with adjacent conductive circuit layers 62 in the core board unit 64 through the conductive vias, and the signal can also be transmitted in each conductive circuit layer 62 in the core board unit 64 through the conductive vias. The conductive vias in the core board unit 64 form signal buried holes 66 in the connection board 6.

[0167] Fig.11 A schematic diagram of the structure of another connecting plate 6 is illustrated. When any side of the core plate unit 64 has at least two layers of conductive circuit layers 62, the multiple conductive circuit layers 62 on any side of the core plate unit 64 can be pressed layer by layer on the side of the core plate unit 64. Specifically, the core plate unit 64 has a first side 641 and a second side 642 in the thickness direction. The core plate unit 64 can be parallel to the Z direction in the thickness direction. The first side 641 of the core plate unit 64 is set toward the top of the connecting plate 6, and the second side 642 of the core plate unit 64 is set toward the bottom of the connecting plate 6. The conductive circuit layer 62 located on the first side 641 of the core plate unit 64 can form the top area of ​​the connecting plate 6. The conductive circuit layer 62 located on the second side 642 of the core plate unit 64 can form the bottom area of ​​the connecting plate 6.

[0168] Laser holes (not shown) are provided in adjacent conductive circuit layers 62 connected by the conductive part 65 . The material forming the conductive part 65 can be filled in the laser holes of the adjacent conductive circuit layers 62 by electroplating or other processes to form the conductive part 65 .

[0169] The connection board 6 has a plurality of conductive parts 65. According to the positions of the conductive parts 65, for the convenience of description, the conductive parts 65 are defined as a first conductive part 651, a second conductive part 652, a third conductive part 653, a fourth conductive layer and a fifth conductive part 655.

[0170] A first conductive portion 651 is provided between adjacent conductive circuit layers 62 in the top region, so as to realize interconnection between adjacent conductive circuit layers 62 in the top region through the first conductive portion 651. A conductive circuit layer 62 adjacent to the core plate unit 64 in the top region is interconnected with the conductive circuit layer 62 on the surface of the core plate unit 64 through the second conductive portion 652, thereby realizing interconnection between the conductive circuit layer 62 in the top region and the first side 641 of the core plate unit 64.

[0171] A third conductive portion 653 is provided between adjacent conductive circuit layers 62 in the bottom region to interconnect adjacent conductive circuit layers 62 in the bottom region through the third conductive portion 653. A conductive circuit layer 62 adjacent to the core plate unit 64 in the bottom region is interconnected with the conductive circuit layer 62 located on the surface of the core plate unit 64 through the fourth conductive portion 654, thereby realizing the interconnection between the conductive circuit layer 62 in the bottom region and the second side 642 of the core plate unit 64.

[0172] The manufacturing process of the high-density interconnection board can refer to the relevant description in the prior art, and will not be further described here.

[0173] The number of conductive circuit layers 62 in the core unit 64 is N. N is an even number, and N is greater than or equal to 2. The number of conductive circuit layers 62 in the top region and the bottom region is a. a is greater than or equal to 1. The number of conductive circuit layers 62 in the bottom region is the same as the number of conductive circuit layers 62 in the top region.

[0174] The model of the connecting board 6 can usually be represented by a+N+a. a can also represent the side pressing of the core board unit 64, which can also be understood as the order of the connecting board 6. The total number of layers of the conductive circuit layer 62 in the connecting board 6 is the sum of N and 2a. In the electronic device 100, the connecting board 6 usually adopts a high-density interconnection board with a total number of conductive circuit layers 62 of eight or ten layers.

[0175] The structure of the connection board 6 is further described below by taking a ten-layer high-density interconnect board as an example.

[0176] When the model of the connection board 6 is 1+8+1, it means that the connection board 6 is a 10-layer 1st-order high-density interconnection board. When the model of the connection board 6 is 2+6+2, it means that the connection board 6 is a 10-layer 2nd-order high-density interconnection board. When the model of the connection board 6 is 3+4+3, it means that the connection board 6 is a 10-layer 3rd-order high-density interconnection board. When the model of the connection board 6 is 4+3+4, it means that the connection board 6 is a 10-layer 4th-order high-density interconnection board.

[0177] When the connection board 6 is a 10-layer 1-stage high-density interconnect board (such as Fig.10 As shown in FIG. 1 , the number of conductive circuit layers 62 in the core board unit 64 is large, and the length of the signal buried via 66 in the connecting board 6 is long.

[0178] Fig.11 The connection board 6 in the figure is a 10-layer 2-stage high-density interconnect board. Fig.11 As shown, compared with a 10-layer 1-level high-density interconnection board, when the connection board 6 is a 10-layer 2-level high-density interconnection board, the length of the signal buried via 66 is reduced.

[0179] Fig.12 A schematic structural diagram of another connecting plate 6 is shown. Fig.12 The connection board 6 in the figure is a 10-layer 4-order high-density interconnect board. Fig.12 As shown, in a 10-layer 4-level high-density interconnect board, the signal buried via 66 of the core board unit 64 extends to the conductive circuit layer 62 adjacent to the core board unit 64 in the top area and the bottom area. At this time, a conductive circuit layer 62 adjacent to the core board unit 64 in the top area and the bottom area can also be regarded as a part of the core board unit 64. Fig.12 As shown, compared with a 10-layer 2-level high-density interconnection board, when the connection board 6 is a 10-layer 4-level high-density interconnection board, the length of the signal buried via 66 is reduced.

[0180] Fig.13 FIG. 2 is a schematic diagram showing the structure of another connecting plate 6 . Fig.13 The connection board 6 in the figure is a 10-layer high-density interconnect board of any order. Fig.13 As shown, when the connection board 6 is an arbitrary-order high-density interconnection board, adjacent conductive circuit layers 62 in the core board unit 64 are interconnected through the conductive portion 65. For example, adjacent conductive circuit layers 62 in the core board unit 64 are interconnected through the fifth conductive portion 655. In an arbitrary-order high-density interconnection board, interconnection of conductive circuit layers 62 of any layer can be achieved.

[0181] It can be seen that, under a certain adjustment of the total number of conductive circuit layers 62 , when the order of the connection board 6 is smaller, it is easier to generate residual piles when the second electronic device signal is transmitted in the connection board 6 .

[0182] Fig.14 The figure shows a signal routing diagram in a low-order high-density interconnect board. Fig.14 The high-density interconnect board in is a 10-layer 2-stage high-density interconnect board. Fig.14 As shown, along the Z direction, the 10 conductive circuit layers 62 in the high-density interconnect board can be represented by L1, L2, L3, L4, L5, L6, L7, L8, L9 and L10 in sequence. When the routing layer of the second electronic device signal in the high-density interconnect board is the L4 conductive circuit layer 62, due to the low order of the high-density interconnect board, the second electronic device signal passes through the conductive portion 65 between the L1 conductive circuit layer 62 and the L2 conductive circuit layer 62, and between the L2 conductive circuit layer 62 and the L3 conductive circuit layer 62, and then needs to pass through the signal buried via 66 to reach the L4 conductive circuit layer 62, which will produce a stub at the signal buried via 66.

[0183] Therefore, the circuit board body 41 of the present application may include a through-hole circuit board that is pressed once. Alternatively, the circuit board body 41 of the present application may also include a low-order high-density interconnection board in which the signal generates a stub in the signal buried hole 66. For example, the circuit board body 41 may be a 1st-order or 2nd-order high-density interconnection board. In other words, the circuit board assembly of the present application can not only solve the stub problem of the stub in the through-hole circuit board, but also solve the stub problem of the stub in the low-order high-density interconnection board.

[0184] When the circuit board body 41 is a through-hole circuit board that is pressed once, the signal hole can be a signal via hole in the circuit board body 41. When the circuit board body 41 is a low-order high-density interconnection board, the signal hole can be a signal buried hole 66 in the circuit board body 41. Therefore, the present application can solve the problem of residual piles generated by the signal via hole in the circuit board body 41 and the problem of residual piles generated in the signal buried hole 66 in the circuit board body 41 by setting the connecting plate 6.

[0185] It should be noted that since the signal hole is a buried signal hole 66, the signal hole is not exposed on the surface of the circuit board body 41. At this time, when the connecting board 6 is connected to the first electronic device 48 and the second electronic device 49 through the signal hole, it also needs to rely on the conductive part 65 in the circuit board body 41.

[0186] The connection between the connecting plate 6 and the first electronic device 48 is used as an example for explanation. When the connecting plate 6 and the first electronic device 48 are connected, the first end of the first signal hole 411 of the first conductive portion 414 needs to be connected to the first welding portion by using the conductive portion 65 in the circuit board body 41, and the second end of the second signal hole 412 also needs to be connected to the second conductive portion 415 by using the conductive portion 65 in the circuit board body 41.

[0187] The structure of the circuit board assembly of the present application is further described below by taking the circuit board body 41 as a through-hole circuit board (the signal hole is a signal via) as an example.

[0188] Fig.15 The structure diagram of the second circuit board assembly of the present application is shown. Fig.15 As shown, the first signal path 61 of the connecting board 6 of the present application is formed at least in the conductive part 65 of the core board unit 64 of the connecting board 6 on the side facing the circuit board body 41, so as to form the first signal path 61 by utilizing the conductive part 65 interconnected between adjacent conductive circuit layers 62, so as to realize the transmission of the second electronic device signal in the first signal path 61 while avoiding the second electronic device signal from passing through the useless conductive circuit layer 62 when passing through the first signal path 61, thereby avoiding the generation of residual piles.

[0189] The number of conductive parts 65 in the first signal path 61 depends not only on the position of the second electronic device 49 relative to the connection board 6, but also on the number of conductive circuit layers 62 occupied by the second electronic device signal when it is routed in the connection board 6. This will be further described below in conjunction with specific embodiments.

[0190] Continue to see Fig.15 , there is a third conductive portion 416 between the second electronic device 49 and the connecting board 6. For example, the third conductive portion 416 can be a welding portion, etc. The third conductive portion 416 is connected between the second end of the first signal path 61 and the second electronic device 49, so that the second electronic device 49 and the connecting board 6 are connected through the third conductive portion 416, so that the second electronic device signal can be transmitted between the first electronic device 48 and the second electronic device 49.

[0191] The number of the third conductive portions 416 is equal to the number of the first signal paths 61, and they correspond one to one, so that each first signal path 61 of the connecting board 6 can be connected to the second electronic device 49 through a third conductive portion 416, so as to realize the transmission of the second electronic device signal in each transmission path. At this time, following the first signal path 61, the transmission path of the second electronic device signal also includes the third conductive portion 416.

[0192] Continue to see Fig.15 , the second electronic device 49 can be located on the side of the connecting board 6 facing the first electronic device 48. The first end of the first signal path 61 and the second end of the first signal path 61 can both be formed on the side of the connecting board 6 facing the circuit board body 41 to ensure that the first signal path 61 is connected to the first electronic device 48 and the second electronic device 49.

[0193] When the second electronic device 49 is located on the side of the connecting plate 6 facing the first electronic device 48, the second electronic device 49 can be connected to the side of the circuit board body 41 where the first electronic device 48 is provided to ensure that the first electronic device 48 and the second electronic device 49 are conductively connected to each other, thereby preventing the second electronic device signal from generating residual stumps when being transmitted in the first signal hole 411. This improves the quality of the second electronic device signal and enables the first electronic device 48 and the second electronic device 49 to be arranged on the same surface of the circuit board body 41.

[0194] Furthermore, when the first electronic device 48 and the second electronic device 49 are on the same surface of the circuit board body 41, the device height of the first electronic device 48 on the circuit board body 41 can be utilized to achieve the setting of the second electronic device 49 on the circuit board 4 while avoiding the influence of the setting of the second electronic device 49 on the thickness of the circuit board assembly, thereby ensuring that the electronic device 100 has a smaller thickness.

[0195] Since the first electronic device 48 and the second electronic device 49 are on the same surface of the circuit board body 41, in order to facilitate the conduction between the connecting board 6 and the second electronic device 49, the signal hole can also include a second signal hole 412. The second signal hole 412 has the same structure as the first signal hole 411, and the details can refer to the relevant description of the first signal hole 411 above. The circuit board body 41 has a second signal hole 412 at the corresponding third conductive part 416. In other words, the number of the second signal holes 412 and the third conductive part 416 is equal, and they correspond one to one. The second signal hole 412 is located on the side of the third conductive part 416 and is directly connected to the third conductive part 416.

[0196] The first end of the second signal hole 412 is connected to the second electronic device 49, and the second end of the second signal hole 412 is connected to the third conductive portion 416. Through the connection between the second signal hole 412, the second electronic device 49 and the third conductive portion 416, the second electronic device 49 and the connecting board 6 are connected, and the second signal hole 412 can be fully utilized (100% utilization) to avoid the generation of residual stubs when the second electronic device signal is transmitted in the second signal hole 412, and the quality of the second electronic device signal is further improved.

[0197] Continue to see Fig.15 , there is a fourth conductive portion 417 between the second electronic device 49 and the circuit board body 41. For example, the fourth conductive portion 417 may be a welding portion, etc. The second electronic device 49 may be connected to the first end of the second signal hole 412 through the fourth conductive portion 417 to achieve connection between the second electronic device 49 and the first end of the second signal hole 412, so as to achieve conduction between the second electronic device 49 and the connecting board 6. At this time, following the third conductive portion 416, the transmission path of the second electronic device signal also includes the second signal hole 412 and the fourth conductive portion 417.

[0198] The number of the fourth conductive portions 417 is equal to that of the second signal holes 412, and they correspond one to one, so that each second signal hole 412 is connected to a corresponding fourth conductive portion 417. The second signal hole 412 is located on the side of the fourth conductive portion 417 and is directly connected to the fourth conductive portion 417.

[0199] The second electronic device 49 has a second projection area on the circuit board body 41. The projection of the connecting board 6 on the circuit board body 41 and the second projection area have a second overlapping area S2. The second signal hole 412 is located in the second overlapping area S2, so that the second electronic device 49 can be close to the first electronic device 48 while being connected to the connecting board 6 through the second signal hole 412, thereby improving the quality of the second electronic device signal.

[0200] See again Fig. 9As shown, when the interval between the fourth conductive portions 417 is larger, the second electronic device 49 can be directly connected to the first end of the second signal hole 412 through the fourth conductive portion 417 .

[0201] Fig.16 The schematic diagram of the structure of the third circuit board assembly of the present application is shown. Fig.16 As shown, when the spacing between the fourth conductive portions 417 is small, so that the circuit board body 41 cannot be provided with the second signal hole 412 between the adjacent fourth conductive portions 417, the circuit board assembly may further include an adapter plate 7. The second electronic device 49 may be connected to the first end of the second signal hole 412 through the adapter plate 7, so that the second electronic device 49 and the circuit board body 41 are connected through the adapter plate 7, and the second signal hole 412 can be ensured to be opened on the circuit board body 41.

[0202] In order to avoid the generation of stubs when the second electronic device signal is transmitted in the adapter board 7, the adapter board 7 can be an arbitrary-order high-density interconnection board. For example, the adapter board 7 can be a 4-layer arbitrary-order high-density interconnection board, a 6-layer arbitrary-order high-density interconnection board, an 8-layer arbitrary-order high-density interconnection board, a 10-layer arbitrary-order high-density interconnection board, etc. Since the adjacent conductive circuit layers 62 in the arbitrary-order high-density interconnection board are interconnected through the conductive portion 65, the conductive circuit layers 62 of any layer can be interconnected through the conductive portion 65. In this way, when the second electronic device signal is transmitted to the adapter board 7, the conductive circuit layers 62 of the required number of layers can be selected in the adapter board 7 for routing according to its own routing requirements, and no stubs will be generated.

[0203] The second electronic device 49 can be connected to the first end of the second signal path 71 in the adapter board 7 through the fourth conductive portion 417, and the second end of the second signal path 71 can be conductively connected to the first end of the second signal hole 412 through the fifth conductive portion 418. At this time, following the fourth conductive portion 417, the transmission path of the second electronic device signal also includes the second signal path 71 and the fifth conductive portion 418.

[0204] It should be noted that the conductive portion 65 through which the second electronic device signal passes in the adapter board 7 forms a second signal path 71 .

[0205] Fig.17 FIG. 4 shows a schematic diagram of the structure of a fourth circuit board assembly. Fig.17As shown, when the first electronic device 48 and the second electronic device 49 are on the same surface of the circuit board body 41, the second electronic device 49 can be located inside the circuit board body 41. At this time, the second electronic device 49 can still be directly connected to the second end of the first signal path 61 through the third conductive portion 416, so that the second electronic device 49 can be hidden inside the circuit board body 41 while the second electronic device 49 is connected to the second electronic device 49, so as to avoid the circuit board assembly being too thick and affecting the thickness of the body 2 of the electronic device 100. The direction of the thickness of the body 2 is the same as the thickness direction of the circuit board body 41, which can be referred to as the Z direction.

[0206] The circuit board body 41 has a mounting hole in it, and the second electronic device 49 can be located in the mounting hole to achieve the arrangement of the second electronic device 49 in the circuit board body 41. In this case, the circuit board body 41 does not need to have a second signal hole 412.

[0207] Since the adapter board 7 is an arbitrary-order high-density interconnection board, when the second electronic device 49 can be connected to the first end of the second signal hole 412 through the adapter board 7, the adapter board 7 can be used as the connecting board 6, and the stub in the first signal hole 411 can also be eliminated without the need to set up an additional connecting board 6.

[0208] Continue to see Fig.17 As shown, the circuit board assembly may further include an isolator 9. The isolator 9 blocks at least one side of the second electronic device 49, so as to shield the second electronic device 49 through the isolator 9, so as to prevent the second electronic device 49 from affecting other signals of the electronic device 100. For example, when the second electronic device 49 is a random access memory 43 (DDR), the isolator 9 can shield the influence of the noise generated by the second electronic device 49 when it is working on the wireless network communication (WiFi) signal of the electronic device 100.

[0209] The isolating member 9 may include an isolating cover or an isolating plate. For example, the isolating cover may be a metal isolating cover, and the isolating plate may be a copper foil, an aluminum foil, or a small-sized high-density interconnection board. When the isolating plate is a high-density interconnection board, the wiring space of the circuit board assembly can also be increased. The isolating cover can shield multiple sides of the second electronic device 49. The isolating plate can shield the side of the second electronic device 49 away from the connecting plate 6. When the isolating cover or the isolating plate are made of the same material and the same plate thickness, the isolating cover has a better isolation effect on the second electronic device 49 than the isolating plate.

[0210] By setting the isolation cover or isolation plate of the isolation member 9, the second electronic device 49 can be shielded and the structure of the isolation member 9 can be made more diversified to meet the design requirements of the circuit board assembly for the isolation member 9 in different scenarios.

[0211] For example, when the second electronic device 49 protrudes from the side of the circuit board body 41 facing the first electronic device 48, an isolation cover can be used to cover the outer side of the second electronic device 49. The isolation cover can be connected to the connecting plate 6 or the circuit board body 41 by welding or other means to realize the assembly and fixation of the isolation cover in the circuit board assembly.

[0212] For example, when the second electronic device 49 does not protrude from the side of the circuit board body 41 facing the first electronic device 48, an isolation plate can be used to block the side of the second electronic device 49 away from the connecting plate 6. The isolation plate can be connected to the circuit board body 41 by welding or other means to achieve assembly and fixation of the isolation plate in the circuit board assembly.

[0213] When the first electronic device 48 and the second electronic device 49 are arranged on the same surface of the circuit board body 41, in order to realize that the first electronic device 48 is connected to the second electronic device 49 through the connecting board 6, and the second electronic device signal is transmitted in the first signal path 61 in the connecting board 6 without generating residual piles, the adjacent conductive circuit layers 62 in the core board unit 64 of the connecting board 6 are interconnected through the conductive part 65. In other words, the connecting board 6 can adopt any order of high-density interconnection board. Therefore, the second electronic device signal can select the required number of conductive circuit layers 62 in the adapter board 7 for routing according to its own routing requirements in the connecting board 6, so that the connecting board 6 can transmit the second electronic device signal without generating residual piles. The conductive part 65 through which the second electronic device signal passes in the connecting board 6 forms the first signal path 61.

[0214] The following takes the example that the second electronic device 49 needs to occupy three conductive circuit layers 62 in the connection board 6 of any order of 10 layers when routing in the connection board 6 to further explain a transmission path of the second electronic device signal.

[0215] Fig.18 The diagram shows a first routing diagram of the second electronic device signal in the connecting board 6 when the first electronic device 48 and the second electronic device 49 are arranged on the same surface of the connecting board 6 . Fig.18 2 shows two conductive groups 67. Each conductive group 67 includes a plurality of conductive portions 65 connecting each conductive line layer 62 in the same area of ​​the connection board 6. For a connection board 6 of any order with 10 layers, each conductive group 67 includes 9 conductive portions 65 arranged in sequence along the Z direction.

[0216] See also Fig.18As shown, similarly, along the Z direction, the 10 conductive circuit layers 62 in the connection board 6 are sequentially represented by L1, L2, L3, L4, L5, L6, L7, L8, L9 and L10. It is assumed that the second electronic device signal needs to occupy three conductive circuit layers 62 in the connection board 6 for routing, and the occupied three conductive circuit layers 62 are located in the connection board 6 at the layers L3, L5 and L7 respectively.

[0217] Continue to see Fig.18 When the second electronic device signal is routed on the L3 conductive circuit layer 62, the second electronic device signal can pass through the conductive group 67 on the left side in sequence through the conductive portion 65 between the L1 conductive circuit layer 62 and the L2 conductive circuit layer 62, and between the L2 conductive circuit layer 62 and the L3 conductive circuit layer 62, and then routed on the L3 conductive circuit layer 62, and then pass through the conductive group 67 on the right side in sequence through the conductive portion 65 between the L2 conductive circuit layer 62 and the L3 conductive circuit layer 62, and between the L2 conductive circuit layer 62 and the L1 conductive circuit layer 62, and then be transmitted to the second electronic device 49.

[0218] The first signal path 61 is formed at the conductive portion 65 through which the second electronic device signal passes in the connecting board 6. In addition to the conductive portion 65, the first signal path 61 also includes the routing of the second electronic device signal on the L3 layer conductive circuit layer 62. The second electronic device signal can also be transmitted to the first electronic device 48 along the first signal path 61.

[0219] Fig.19 The second schematic diagram of the second electronic device signal routing in the connecting board 6 is shown when the first electronic device 48 and the second electronic device 49 are arranged on the same surface of the connecting board 6. Fig.19 As shown, when the second electronic device signal is routed in the L5 conductive circuit layer 62, the difference from the second electronic device signal being routed in the L3 conductive circuit layer 62 is that after the second electronic device signal passes through the conductive portion 65 between the L2 conductive circuit layer 62 and the L3 conductive circuit layer 62, it continues to pass through the conductive group 67 on the left in sequence, through the conductive portion 65 between the L3 conductive circuit layer 62 and the L4 conductive circuit layer 62, and between the L4 conductive circuit layer 62 and the L5 conductive circuit layer 62, and then after being routed in the L5 conductive circuit layer 62, it continues along the conductive circuit layer 62. Fig.19 The transmission direction shown in FIG. 1 passes through the four conductive parts 65 in the conductive group 67 on the right side in sequence and is then transmitted to the second electronic device 49. At this time, in addition to the conductive parts 65, the first signal path 61 also includes the routing of the second electronic device signal on the conductive circuit layer 62 of the L5 layer.

[0220] Fig. 20The third wiring diagram of the second electronic device signal in the connecting board 6 is shown when the first electronic device 48 and the second electronic device 49 are arranged on the same surface of the connecting board 6. Fig. 20 As shown, when the second electronic device signal is routed in the L7 conductive circuit layer 62, the difference from the second electronic device signal being routed in the L5 conductive circuit layer 62 is that after passing through the conductive portion 65 between the L4 conductive circuit layer 62 and the L5 conductive circuit layer 62, the second electronic device signal continues to pass through the conductive group 67 on the left in sequence, passing through the conductive portion 65 between the L5 conductive circuit layer 62 and the L6 conductive circuit layer 62, and between the L6 conductive circuit layer 62 and the L7 conductive circuit layer 62, and then, after being routed in the L7 conductive circuit layer 62, it continues along the conductive circuit layer 62. Fig. 20 The transmission direction shown in FIG. 1 passes through the six conductive parts 65 in the conductive group 67 on the right side in sequence and is then transmitted to the second electronic device 49. At this time, in addition to the conductive parts 65, the first signal path 61 also includes the routing of the second electronic device signal on the conductive circuit layer 62 of the L7 layer.

[0221] From the above, it can be seen that when the second electronic device signal passes through the first signal path 61 of the connecting board 6, no stubs will be generated.

[0222] It should be noted that when the routing of the second electronic device signal in the adapter board 7 is relatively simple, the connection board 6 can also use a low-order high-density interconnection board, and similarly no residual piles will be generated. For example, when the routing of the second electronic device signal in the adapter board 7 only exists in the surface conductive circuit layer 62, the connection board 6 can use a 1-order high-density interconnection board.

[0223] Fig.21 The structure diagram of the fifth circuit board assembly of the present application is shown. Fig.21 As shown, in some embodiments, the second electronic device 49 can also be located on the side of the connecting board 6 away from the first electronic device 48, so that the second electronic device 49 and the first electronic device 48 are arranged on different surfaces of the circuit board body 41. At this time, the first end of the first signal path 61 is formed on the side of the connecting board 6 facing the circuit board body 41, and the second end of the first signal path 61 is formed on the side of the connecting board 6 facing the second electronic device 49, so that the second electronic device 49 and the first electronic device 48 are connected through the first signal path 61, so that the second electronic device signal can be transmitted between the first electronic device 48 and the second electronic device 49.

[0224] Continue to see Fig.21 The second electronic device 49 can be connected to the second end of the signal path of the connecting board 6 through the third conductive portion 416 to achieve conductive connection between the second electronic device 49 and the first electronic device 48 .

[0225] Fig. 22The sixth circuit board assembly of the present application is shown in FIG. Fig. 22 As shown, if the height of the circuit board assembly toward the C-surface of the electronic device 100 allows, when the second electronic device 49 is connected to the circuit board body 41 through the adapter board 7, and when the adapter board 7 is a high-density interconnect board of any order, the adapter board 7 can also be used as a connecting board 6, and can also eliminate the stub in the first signal hole 411. There is no need to set up an additional connecting board 6, which can simplify the structure of the circuit board assembly.

[0226] When the second electronic device 49 can also be located on the side of the connecting plate 6 away from the first electronic device 48, the isolation member 9 can be an isolation cover. When the isolation cover is arranged on the outside of the second electronic device 49, it can be connected to the connecting plate 6 or the circuit board body 41 by welding or the like to realize the assembly and fixation of the isolation member 9 in the circuit board assembly.

[0227] When the second electronic device 49 can also be located on the side of the connecting board 6 away from the first electronic device 48, the connecting board 6 can be a high-density interconnection board of any order. In this way, the signal of the second electronic device can be routed in the conductive circuit layer 62 of the required number of layers in the adapter board 7 according to its own routing requirements in the connecting board 6, so that the connecting board 6 can transmit the signal of the second electronic device without generating residual piles.

[0228] The following also takes the connection board 6 as a 10-layer arbitrary-order high-density interconnection board as an example to further explain a transmission path of the second electronic device signal.

[0229] Fig.23 The figure shows a first routing schematic diagram of the second electronic device signal in the connection board 6 when the first electronic device 48 and the second electronic device 49 are arranged on different surfaces of the connection board 6. It is also assumed that the second electronic device signal needs to occupy three layers of conductive circuit layers 62 in the connection board 6 for routing, and the occupied three layers of conductive circuit layers 62 are located in the connection board 6 at layers L3, L5 and L7 respectively.

[0230] Continue to see Fig.23 When the second electronic device signal is routed in the L3 conductive circuit layer 62, the second electronic device signal can pass through the conductive group 67 on the left in sequence through the conductive parts 65 between the L1 conductive circuit layer 62 and the L2 conductive circuit layer 62, and between the L2 conductive circuit layer 62 and the L3 conductive circuit layer 62, and then after routing in the L3 conductive circuit layer 62, it can pass through the 7 conductive parts 65 in the conductive group 67 on the right in sequence to reach the L10 conductive circuit layer 62, and be transmitted to the second electronic device 49.

[0231] The first signal path 61 is formed at the conductive portion 65 through which the second electronic device signal passes in the connecting board 6. In addition to the conductive portion 65, the first signal path 61 also includes the routing of the second electronic device signal on the L3 layer conductive circuit layer 62. The second electronic device signal can also be transmitted to the first electronic device 48 along the first signal path 61.

[0232] Fig.24 The second schematic diagram of the second electronic device signal routing in the connecting board 6 is shown when the first electronic device 48 and the second electronic device 49 are arranged on different surfaces of the connecting board 6. Fig.24 As shown, when the second electronic device signal is routed on the L5 conductive circuit layer 62, the difference from the second electronic device signal being routed on the L3 conductive circuit layer 62 is that after passing through the conductive portion 65 between the L2 conductive circuit layer 62 and the L3 conductive circuit layer 62, the second electronic device signal continues to pass through the conductive portion 65 between the L3 conductive circuit layer 62 and the L4 conductive circuit layer 62, and between the L4 conductive circuit layer 62 and the L5 conductive circuit layer 62 on the left conductive group 67, and then routes on the L5 conductive circuit layer 62, and then sequentially passes through the five conductive portions 65 in the right conductive group 67 to reach the L10 conductive circuit layer 62, and is transmitted to the second electronic device 49. In addition to the conductive portion 65, the first signal path 61 also includes the routing of the second electronic device signal on the L5 conductive circuit layer 62.

[0233] Fig.25 FIG. 4 shows a third routing diagram of the second electronic device signal in the connecting board 6 when the first electronic device 48 and the second electronic device 49 are arranged on different surfaces of the connecting board 6. Fig.25 As shown, when the second electronic device signal is routed on the L7 conductive circuit layer 62, the difference from the second electronic device signal being routed on the L5 conductive circuit layer 62 is that after passing through the conductive portion 65 between the L4 conductive circuit layer 62 and the L5 conductive circuit layer 62, the second electronic device signal continues to pass through the conductive portion 65 between the L5 conductive circuit layer 62 and the L6 conductive circuit layer 62, and between the L6 conductive circuit layer 62 and the L7 conductive circuit layer 62 on the left conductive group 67, and then after being routed on the L7 conductive circuit layer 62, it passes through the three conductive portions 65 in the right conductive group 67 in sequence and reaches the L10 conductive circuit layer 62, and is transmitted to the second electronic device 49. In addition to the conductive portion 65, the first signal path 61 also includes the routing of the second electronic device signal on the L7 conductive circuit layer 62.

[0234] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0235] In the description of the present application, it should be understood that the terms "include" and "have" and any variations thereof used herein are intended to cover non-exclusive inclusions. For example, a process, method, display structure, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0236] The term "and / or" used in this application is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0237] Unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of this application can be understood according to specific circumstances.

[0238] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

Claims

1. A circuit board assembly, characterized in that: include: A circuit board, comprising a circuit board body and a processor, wherein the processor is located on the circuit board body; the circuit board body has a signal hole, wherein the signal hole includes a first signal hole; a first conductive portion is provided between the processor and the circuit board body, wherein the processor is connected to a first end of the first signal hole through the first conductive portion; and the first signal hole is located on the side of the first conductive portion; A connecting board, located on a side of the circuit board body opposite to the processor, wherein the connecting board has a first signal path, and a first end of the first signal path is connected to the processor through the first signal hole; The connecting board is a high-density interconnection board, and the connecting board includes a conductive portion and a plurality of stacked conductive circuit layers, and adjacent conductive circuit layers are insulated from each other; At least two layers of the conductive circuit layers located in the middle layer of the connecting plate form a core plate unit of the connecting plate, and the adjacent conductive circuit layers located on the side of the core plate unit are interconnected through the conductive part; The first signal path is formed at least at the conductive portion of the core board unit on a side facing the circuit board body; A memory is located on a side of the connection board facing the processor, and the second end of the first signal path is connected to the memory to be electrically connected to the processor through the connection board and the first signal hole, so that no stub is generated in the first signal hole; When the signal between the memory and the processor is transmitted in the first signal path, the connection board does not generate a stub at the first signal path.

2. The circuit board assembly according to claim 1, characterized in that: A second conductive portion is provided between the connecting plate and the circuit board body, and the second end of the first signal hole is connected to the first end of the first signal path through the second conductive portion.

3. The circuit board assembly according to claim 2, characterized in that: There are a plurality of first conductive portions, and each of the first conductive portions is correspondingly provided with the first signal hole and the second conductive portion; The connecting board is provided with the first signal path correspondingly at each of the second conducting portions.

4. The circuit board assembly according to claim 1, characterized in that: A third conductive portion is provided between the memory and the connection board, and the third conductive portion is connected between the second end of the first signal path and the memory.

5. The circuit board assembly according to claim 4, characterized in that: The first end of the first signal path and the second end of the first signal path are both formed on a side of the connecting board facing the circuit board body.

6. The circuit board assembly according to claim 5, characterized in that: The memory is connected to a side of the circuit board body where the processor is arranged.

7. The circuit board assembly according to claim 6, characterized in that: The signal hole further comprises a second signal hole, and the circuit board body has the second signal hole at a position corresponding to the third conductive portion; A first end of the second signal hole is connected to the memory, and a second end of the second signal hole is connected to the third conductive portion.

8. The circuit board assembly according to claim 7, characterized in that: A fourth conductive portion is provided between the memory and the circuit board body, and the memory is connected to the first end of the second signal hole through the fourth conductive portion.

9. The circuit board assembly according to claim 7, characterized in that: It also includes an adapter plate, and the memory is connected to the first end of the second signal hole through the adapter plate.

10. The circuit board assembly according to claim 7, characterized in that: The memory has a second projection area on the circuit board body; The projection of the connecting plate on the circuit board body and the second projection area have a second overlapping area; the second signal hole is located in the second overlapping area.

11. The circuit board assembly according to claim 5, characterized in that: The memory is located in the circuit board body.

12. The circuit board assembly according to claim 4, characterized in that: The number of the third conducting portions is equal to the number of the first signal paths and corresponds one to one.

13. The circuit board assembly according to claim 1, wherein: Adjacent conductive circuit layers in the core board unit are interconnected through the conductive portion.

14. The circuit board assembly according to any one of claims 1 to 12, characterized in that: The signal hole includes a signal via hole or a signal buried hole on the circuit board body.

15. The circuit board assembly according to any one of claims 1 to 12, characterized in that: The processor has a first projection area on the circuit board body; The projection of the connecting plate on the circuit board body and the first projection area have a first overlapping area; the first signal hole is located in the first overlapping area.

16. The circuit board assembly according to any one of claims 1 to 12, characterized in that: The circuit board body has a first surface and a second surface in the thickness direction, and the second surface faces the keyboard of the electronic device; The processor is disposed on the first surface, and the connecting board is disposed on the second surface.

17. The circuit board assembly according to any one of claims 1 to 12, characterized in that: It also includes an isolating member, which blocks at least one side of the memory.

18. The circuit board assembly according to claim 17, wherein: The isolation member includes an isolation cover or an isolation plate.

19. An electronic device, characterized in that: It comprises a housing and a circuit board assembly as claimed in any one of claims 1 to 18, wherein the circuit board assembly is located in the housing.

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