A circuit board assembly and an electronic device

Abstract

The present application provides a circuit board assembly and an electronic device, relating to the technical field of electronic products, enabling the circuit board assembly to be more firmly installed in the electronic device and more conveniently disassembled from the electronic device. Among them, a circuit board assembly is provided. The circuit board assembly includes a circuit board, a first group of electronic components, and a bracket. The circuit board includes a first surface, and the first group of electronic components is disposed on the first surface. The bracket is connected to the circuit board. The bracket includes a first bracket portion, and the first bracket portion is located on the side facing the first surface. The direction perpendicular to the first surface is the first direction, and at least a part of the first bracket portion in the first direction is an elastic soft structure.

Description

Technical Field

[0001] This application relates to the technical field of electronic products, and particularly to a circuit board assembly and an electronic device. Background Art

[0002] With the development of the information age, users have more diverse demands for the functions of electronic devices and higher requirements for performance. Therefore, in order to meet the above demands, more circuit board assemblies are provided in electronic devices to implement various functions of the electronic devices. However, in order to improve the user experience, the thinning and lightening of the whole machine is also the direction that electronic devices continuously pursue. In an extreme space, how to better arrange components, optimize the structural layout, improve performance while ensuring the reliability of the whole machine, and the convenience of disassembling the circuit board assembly during later maintenance and disassembly poses an important challenge to the structural design of the whole machine. Summary of the Invention

[0003] This application provides a circuit board assembly and an electronic device, enabling the circuit board assembly to be more firmly installed and more conveniently disassembled.

[0004] To achieve the above object, the embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, a circuit board assembly is provided. The circuit board assembly includes a circuit board, a first group of electronic components, and a bracket. The circuit board includes a first surface, and the first group of electronic components is disposed on the first surface. The bracket is connected to the circuit board. The bracket includes a first bracket portion, and the first bracket portion is located on the side facing the first surface. The direction perpendicular to the first surface is the first direction, and at least a part of the first bracket portion in the first direction is an elastic soft structure.

[0006] Different from being bonded to other structural members only through the side or surface of the circuit board, a bracket is provided on the circuit board, and the circuit board assembly is connected to other structural members by means of the bracket. On the one hand, compared with connecting to other structural members through the side of the circuit board, the bracket can provide a larger connection area for the connection of the circuit board assembly, and thus connect the circuit board assembly to other structural members more firmly and reliably. On the other hand, when disassembling the circuit board assembly, the external force for disassembly can be directly applied to the bracket to disassemble the circuit board from other structural members, avoiding directly applying force to the circuit board assembly and causing damage to the circuit board assembly, and improving the stability of the use of the circuit board assembly. Further, after the circuit board is installed, the bracket also squeezes the circuit board between two opposite structural members by providing an elastic soft structure. Further, an interference fit is formed between the circuit board and other structural members through the elastic soft structure, making the connection of the circuit board assembly more stable and further improving the stability and reliability of the circuit board assembly after installation.

[0007] In a possible implementation of the first aspect, the first bracket portion includes a substrate portion and an elastic rubber material. The substrate portion includes a second surface and a fourth surface facing each other, and the second surface faces the first surface. The elastic rubber material is disposed on the fourth surface, and the elastic rubber material forms an elastic soft structure. The elastic soft structure made of the elastic rubber material can play multiple roles. First, the circuit board assembly can be bonded to other structural members through the elastic rubber material. Second, the elastic rubber material is located between the substrate portion and other structural members, so that the cooperation between the circuit board assembly and other structural members forms an interference fit, thereby improving the stability and reliability of the installation of the circuit board assembly. Third, when the circuit board assembly collides, the elastic rubber material has a certain buffering effect, thereby protecting the circuit board assembly and preventing the circuit board assembly from being damaged during the collision, further improving the user's satisfaction.

[0008] In a possible implementation of the first aspect, the height by which the elastic rubber material protrudes from the fourth surface is greater than or equal to 0.05 mm. In this way, the second bracket portion plays a limiting role on the side of the circuit board facing the first side.

[0009] In a possible implementation of the first aspect, the circuit board further includes a first side surface connected to the first surface, and the bracket further includes a second bracket portion. The second bracket portion is located on the side facing the first side surface, and the second bracket portion is disposed on the second surface.

[0010] In this way, the second bracket portion plays a limiting role on the side of the circuit board facing the first side surface. Specifically, the first bracket portion plays a limiting role in the thickness direction of the circuit board, and the second bracket portion plays a limiting role in the width direction of the circuit board. Further, in the width direction of the circuit board, the assembly error between the bracket and the circuit board is reduced, and the assembly accuracy of the bracket and the circuit board is improved. Further, the stability and reliability of the installation of the circuit board assembly in the electronic device are also improved.

[0011] In a possible implementation of the first aspect, the circuit board further includes a third side surface opposite to the first side surface, as well as a fourth side surface and a fifth side surface, and the distance from the first side surface to the third side surface is less than the distance from the fourth side surface to the third side surface.

[0012] In this way, the side surface of the bottom wall of the first avoidance notch facing the second bracket portion and the bottom surface of the side wall of the first avoidance notch facing the second bracket portion. When the bracket is installed on the circuit board, the positioning of the bracket can be achieved through the cooperation between the second bracket portion and the first avoidance notch. After the bracket is installed on the circuit board, the circuit board can be limited by the bracket and the bottom wall and side wall of the first avoidance notch, thereby ensuring the stability and reliability of the circuit board assembly. Moreover, the second bracket portion is accommodated in the first avoidance notch, further ensuring the flatness of the overall appearance of the circuit board assembly after the bracket is fixed to the circuit board, and thus facilitating the convenience and accuracy of installing the circuit board assembly in the electronic device.

[0013] In a possible implementation manner of the first aspect, the circuit board further includes a second side surface connected to the first surface, and the second side surface is also connected to the first side surface. The bracket further includes a third bracket portion located on the side facing the second side surface, and the third bracket portion is disposed on the second surface.

[0014] In this way, the first bracket portion plays a limiting role in the thickness direction of the circuit board; the second bracket portion plays a limiting role in the width direction of the circuit board; the third bracket portion plays a limiting role in the length direction of the circuit board. Therefore, the bracket limits the circuit board in three directions, thereby reducing the assembly error between the bracket and the circuit board and improving the accuracy of the assembly of the bracket and the circuit board. Further, the stability and reliability of the circuit board assembly installed in the electronic device are also improved.

[0015] In a possible implementation manner of the first aspect, the circuit board is provided with a first positioning portion, and the second surface is provided with a second positioning portion that cooperates with the first positioning portion. By the cooperation between the first positioning portion and the second positioning portion, the accuracy of bonding the bracket and the circuit board is improved, thereby reducing the assembly error between the bracket and the circuit board, further improving the stability and reliability of the connection between the bracket and the circuit board, and improving the assembly accuracy of the circuit board assembly and the electronic device.

[0016] In a possible implementation manner of the first aspect, the first positioning portion is a notch that penetrates the third side surface; the second positioning portion is a convex block that cooperates with the notch. In this way, when the bracket and the circuit board are assembled, in the width direction of the circuit board assembly, the convex block is aligned with the groove, and after alignment, the convex block is pushed into the groove to accommodate the convex block in the groove, thereby achieving the positioning of the bracket and the circuit board, improving the accuracy of bonding the bracket and the circuit board, thereby reducing the assembly error between the bracket and the circuit board, further improving the stability and reliability of the connection between the bracket and the circuit board, and improving the assembly accuracy of the circuit board assembly and the electronic device.

[0017] In a possible implementation of the first aspect, the arrangement directions of the first side surface and the third side surface are the second direction. In the second direction, the bracket includes a seventh side surface and an eighth side surface that face each other. The seventh side surface is located on the side of the fourth side surface away from the third side surface, and the eighth side surface is located on the side of the fourth side surface away from the seventh side surface. In this way, after the circuit board assembly is installed in the accommodation groove and the back cover of the electronic device is installed on the frame, the circuit board assembly is located between the bottom wall of the accommodation groove and the back cover. Moreover, the circuit board assembly is in direct contact with the back cover through the bracket, realizing the fixation of the circuit board assembly in the second direction. Further, the back cover can form an interference fit relationship with the circuit board assembly to squeeze the circuit board assembly into the accommodation groove, further improving the stability and reliability of the circuit board assembly installed in the accommodation groove.

[0018] In a possible implementation of the first aspect, the eighth side surface is located between the third side surface and the fourth side surface. In this way, after the circuit board assembly is installed in the accommodation groove, the circuit board assembly is in direct contact with other structural components through the third side surface. The circuit board assembly relies on the circuit board itself for installation and positioning, reducing the error during the assembly of the circuit board assembly and improving the accuracy of the circuit board assembly installed in the electronic device.

[0019] In a possible implementation of the first aspect, in the second direction, the distance from the eighth side surface to the third side surface is less than or equal to 0.15 millimeters. The circuit board assembly relies on the circuit board itself for installation and positioning, reducing the error during the assembly of the circuit board assembly and improving the accuracy of the circuit board assembly installed in the electronic device.

[0020] In a possible implementation of the first aspect, the substrate portion is provided with an avoidance groove, and the opening of the avoidance groove faces the first surface. At least part of the first group of electronic components is accommodated in the avoidance groove. In this way, by connecting the circuit board assembly to the accommodation groove through the bracket, the stability and reliability of the circuit board assembly fixed in the electronic device are improved. The bracket also provides a accommodation space for the installation of the electronic components, facilitating the arrangement of more electronic components on the surface of the circuit board and improving the compactness of the circuit board layout.

[0021] In a possible implementation of the first aspect, the circuit board further includes a third surface opposite to the first surface, and the second bracket portion further includes a fifth surface opposite to the second surface. The distance from the third surface to the fourth surface is greater than or equal to the distance from the fifth surface to the fourth surface. In this way, in the width direction of the electronic device, the circuit board assembly is fixed in the receiving groove. And one side surface of the circuit board assembly is connected to the second inner wall surface of the receiving groove through the circuit board itself, further reducing the assembly error between the circuit board assembly and the frame, and thus improving the installation accuracy of the circuit board assembly. Further, by directly contacting the third surface with the second inner wall surface, the stability and reliability of the circuit board assembly during use are further improved, and the problem of easy fracture caused by the third surface of the circuit board not being fixed to form a cantilever structure is avoided.

[0022] In a possible implementation of the first aspect, the circuit board assembly further includes a protrusion provided on the fifth surface. The protrusion extends in a direction away from the second surface along the fifth surface, and the protrusion protrudes from the third surface. In this way, after the circuit board assembly is installed in the receiving groove, the circuit board assembly can be connected to the second inner wall surface through the protrusion of the bracket. In the width direction of the electronic device, the circuit board assembly is fixed in the receiving groove through the bracket, improving the stability and reliability of the fixing of the circuit board assembly.

[0023] In a possible implementation of the first aspect, the circuit board assembly further includes a second group of electronic components provided on the third surface. In this way, the performance of the electronic device and the diversity of the functions of the electronic device are further improved.

[0024] In a possible implementation of the first aspect, the edge of the bracket is provided with a second avoidance notch. The second avoidance notch is located on the side of the second bracket portion facing away from the fifth side surface and on the side of the third bracket portion facing away from the third side surface. By providing the second avoidance notch, the convenience of disassembling the circuit board assembly is further improved. When disassembling the circuit board assembly, a force can be applied to the bracket through the second avoidance notch to take out the circuit board assembly from the receiving groove. Specifically, a pry bar can be used to apply a force to the bracket through the second avoidance notch to pry out the circuit board assembly from the receiving groove. When the bracket and the frame are connected by an adhesive method, when disassembling the circuit board assembly, the adhesive material between the bracket and the frame can be melted first, and after the adhesive material melts, the circuit board assembly can be taken out through the second avoidance notch. Therefore, by providing the second avoidance notch, the convenience of disassembling the circuit board assembly is improved, and damage to the circuit board assembly during disassembly is avoided, improving the reliability and stability of the use of the circuit board assembly.

[0025] In a possible implementation of the first aspect, the circuit board is connected to at least one of the first support portion, the second support portion, and the third support portion. In this way, the connection between the circuit board and the support is not limited to a single area on the support, and the area for connecting the circuit board can be flexibly selected according to the specific structure of the support, further improving the flexibility of the connection between the support and the circuit board.

[0026] In a possible implementation of the first aspect, the circuit board includes opposite first and second ends, and the number of supports is two. The two supports are symmetrically arranged at the first and second ends. The circuit board is fixed in the receiving groove through the two supports, and the circuit board assembly can be more firmly and reliably connected to the receiving groove.

[0027] In the second aspect, an electronic device is further provided. The electronic device includes a housing and the above-mentioned circuit board assembly. The housing includes a receiving groove, and the receiving groove includes opposite first and second inner wall surfaces. The circuit board assembly is located in the receiving groove, and the arrangement directions of the support of the circuit board assembly and the circuit board of the circuit board assembly are consistent with the arrangement directions of the first and second inner wall surfaces. The support of the circuit board assembly is connected to the first inner wall surface, and the circuit board of the circuit board assembly is connected to the second inner wall surface. In this way, in the width direction of the electronic device, the circuit board assembly is fixed in the receiving groove. Moreover, one side surface of the circuit board assembly is connected to the second inner wall surface of the receiving groove through the circuit board itself, further reducing the assembly error between the circuit board assembly and the frame, and thus improving the installation accuracy of the circuit board assembly. Further, by directly contacting the third surface with the second inner wall surface, the stability and reliability of the circuit board assembly during use are further improved, avoiding the problem of easy fracture caused by the lack of fixation of the third surface of the circuit board to form a cantilever structure.

[0028] In a possible implementation of the second aspect, the receiving groove further includes a third inner wall surface connected between the first inner wall surface and the second inner wall surface, and the distance between the support and the third inner wall surface is less than or equal to 0.15 millimeters.

[0029] In a possible implementation of the second aspect, the housing further includes a frame, the frame includes a sixth surface, and the receiving groove is provided on the sixth surface. The thickness direction of the circuit board is perpendicular to the thickness direction of the electronic device.

[0030] In a possible implementation of the second aspect, the sixth surface is further provided with an avoidance groove, and the avoidance groove communicates with the accommodation groove. In this way, when disassembling the circuit board assembly, the bracket can be forced through the avoidance groove to take out the circuit board assembly from the accommodation groove. Specifically, a pry bar can be used to apply force to the bracket through the avoidance groove to pry out the circuit board assembly from the accommodation groove. When the bracket and the frame are connected by bonding, when disassembling the circuit board assembly, the adhesive material between the bracket and the frame can be melted first, and after the adhesive material melts, the circuit board assembly can be taken out through the avoidance groove. Therefore, by providing the avoidance groove, the convenience of disassembling the circuit board assembly is improved, and damage to the circuit board assembly during disassembly is avoided, thereby improving the reliability and stability of the use of the circuit board assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 Stereogram of an electronic device provided by some embodiments of the present application;

[0032] Figure 2 is Figure 1 exploded structural schematic diagram of the shown electronic device;

[0033] Figure 3 is Figure 2 an enlarged view of part A in;

[0034] Figure 4 structural schematic diagram of a circuit board provided by some embodiments of the present application;

[0035] Figure 5 is Figure 4 the circuit board in is installed in Figure 3 structural schematic diagram of the accommodation groove in;

[0036] Figure 6 structural schematic diagram of a circuit board assembly provided by some embodiments of the present application;

[0037] Figure 7 is Figure 6 structural schematic diagram of the circuit board assembly installed in the accommodation groove in;

[0038] Figure 8 structural schematic diagram of a bracket provided by some embodiments of the present application;

[0039] Figure 9 is Figure 7 structural schematic diagram of the bracket observed from the F1 angle in;

[0040] Figure 10 is Figure 8 structural schematic diagram of a circuit board provided by some embodiments of the present application;

[0041] Figure 11 isFigure 9 The bracket in Figure 10 is installed on the circuit board in the structural schematic diagram;

[0042] Figure 12 is the structural schematic diagram of the bracket provided by some other embodiments of the present application;

[0043] Figure 13 is Figure 12 the front view of the bracket in

[0044] Figure 14 is Figure 13 the structural schematic diagram of observing the bracket from the F2 angle in

[0045] Figure 15 is the structural schematic diagram of the circuit board provided by some other embodiments of the present application;

[0046] Figure 16 is Figure 14 the bracket in Figure 15 is installed on the circuit board in the structural schematic diagram;

[0047] Figure 17 is Figure 16 the structural schematic diagram of the circuit board assembly installed in the accommodation groove;

[0048] Figure 18 is Figure 17 the top view of the circuit board assembly installed in the accommodation groove;

[0049] Figure 19 is the structural schematic diagram of the circuit board assembly provided by some other embodiments of the present application;

[0050] Figure 20 is the structural schematic diagram of the bracket provided by some other embodiments of the present application;

[0051] Figure 21 is Figure 20 the structural schematic diagram of observing the bracket from the F3 angle in

[0052] Figure 22 is Figure 21 the structural schematic diagram of the bracket and the circuit board installed in the accommodation groove after connection;

[0053] Figure 23 is Figure 22 the top view of the circuit board installed in the accommodation groove;

[0054] Figure 24 is the structural schematic diagram of the circuit board assembly omitting the bracket provided by some other embodiments of the present application;

[0055] Figure 25Schematic structural diagram of the circuit board assembly provided in some embodiments of the present application;

[0056] Figure 26 Schematic structural diagram of the bracket installed in the accommodation groove provided in some embodiments of the present application.

[0057] Reference numerals

[0058] 100, electronic device; 10, screen; 11, light-transmitting cover plate; 12, display screen;

[0059] 20, back shell; 21, back cover; 22, frame; S15, sixth surface; 221, accommodation groove; 222, inner frame; 223, outer frame; 224, first inner wall surface; 225, second inner wall surface; 226, third inner wall surface; 227, fourth inner wall surface; 228, bottom wall surface; 22a, third avoidance notch; 23, middle plate;

[0060] 30, circuit board assembly; 31, circuit board; 31a, first end; 31b, second end;

[0061] 32, electronic components; S1, first surface; S3, third surface; S4, first side surface; S5, second side surface; S6, third side surface; 33, first positioning portion; S9, sixth side surface; 34, fourth avoidance notch; S11, fourth side surface; S12, fifth side surface;

[0062] 30a, main board circuit board assembly; 311, main board circuit board 311; 312, electronic components of the main board;

[0063] 30b, other circuit board assemblies; 321, other circuit boards; 322, other electronic components; 322a, first group of electronic components; 322b, second group of electronic components;

[0064] 40, bracket; S2, second surface; S7, seventh side surface; S8, eighth side surface; 40a, second avoidance notch; S13, fourth surface;

[0065] 41, first bracket portion; 411, second positioning portion; 412, substrate portion; 412a, avoidance groove; 413, elastic adhesive; 414, first adhesive;

[0066] 42, second bracket portion; S14, fifth surface; 421, protrusion; 43, third bracket portion; 44, accommodation groove of the bracket;

[0067] 50, flexible circuit board; 51, first portion; 52, second portion; 53, bending portion; 60, elastic connecting member. Detailed implementation manners

[0068] In the embodiments of the present application, the terms "first", "second", "third", "fourth", and "fifth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", "third", "fourth", and "fifth" may explicitly or implicitly include one or more of such features.

[0069] In the embodiments of the present application, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "comprising a..." does not exclude the presence of additional identical elements in the process, method, article or device comprising such element.

[0070] In the embodiments of the present application, unless otherwise specified, the description of "parallel" means generally parallel within a certain error range, and the error range may be a range where the deviation angle relative to absolute parallelism is less than or equal to 5°. The description of "perpendicular" means generally perpendicular within a certain error range, and the error range may be a range where the deviation angle relative to absolute perpendicularity is less than or equal to 5°.

[0071] In the embodiments of the present application, unless otherwise specified, the description of two objects "overlapping" includes four possible implementation manners: in two objects, a part of one object overlaps with the whole of the other object, a part of the other object overlaps with the whole of the one object, the whole of the one object overlaps with the whole of the other object, and a part of the one object overlaps with a part of the other object. The description of two objects "overlapping" means that the middle parts and the edges of the two objects completely coincide.

[0072] With the development of the information age, users' demands for the functions of electronic devices are more diverse and their requirements for performance are also higher. Therefore, to meet the above demands, more circuit board components are provided in the electronic device to realize various functions of the electronic device. However, to improve the user experience, the thin and light design of the whole machine is also the continuous pursuit direction of electronic devices. In the extreme space, how to better arrange devices, optimize the structural layout, improve the performance while ensuring the reliability of the whole machine, and the convenience of disassembling the circuit board components during later maintenance and disassembly poses an important challenge to the structural design of the whole machine.

[0073] Based on this, to solve the above problems, the present application provides a circuit board assembly from the perspectives of improving the stability of the circuit board assembly when installed in an electronic device and facilitating disassembly. The circuit board assembly is fixed inside the electronic device with the aid of a bracket. The circuit board assembly is fixed under the clamping of the bracket and the inner wall of the electronic device, thereby achieving the stability of the circuit board assembly fixed inside the electronic device.

[0074] The following describes the specific structure of the bracket in combination with the specific application scenarios of the above circuit board assembly.

[0075] The present application provides an electronic device, which can be a user equipment (UE) or a terminal device, etc. For example, the electronic device can be a portable android device (PAD), a personal digital assistant (PDA), a handheld device with wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in remote medical, a wireless terminal in smart grid, a wireless terminal in transportation safety, a wireless terminal in smart city, a wireless terminal in smart home, etc., including mobile terminals or fixed terminals. In the embodiments of the present application, the form of the electronic device is not specifically limited.

[0076] Please refer to Figure 1 , Figure 1 which is a perspective view of the electronic device 100 provided in some embodiments of the present application. In this embodiment and the following embodiments, the electronic device 100 is taken as a handheld device with wireless communication function for exemplary illustration, and the handheld device with wireless communication function can be, for example, a mobile phone. The electronic device 100 is generally in the shape of a rectangular flat plate. Based on this, to facilitate the description of the following embodiments, an XYZ coordinate system is established, specifically defining the width direction of the electronic device 100 as the X-axis direction, the length direction of the electronic device 100 as the Y-axis direction, and the thickness direction of the electronic device 100 as the Z-axis direction. It can be understood that the coordinate system of the electronic device 100 can be flexibly set according to actual needs and is not specifically limited here. When the electronic device 100 is other products, the electronic device 100 can also be generally in the shape of a square flat plate, a circular flat plate, etc., which is not specifically limited here.

[0077] Please refer to Figure 1 and Figure 2 , Figure 2 which is Figure 1 a schematic exploded view of the electronic device 100 shown. The electronic device 100 includes a screen 10, a back cover 20, a circuit board assembly 30, electronic components, and a bracket 50.

[0078] It can be understood that Figure 1 and Figure 2 schematically show some components included in the electronic device 100, and the actual shape, actual size, actual position, and actual structure of these components are not limited by Figure 1 and Figure 2 . In some other examples, the electronic device 100 may also not include the screen 10.

[0079] The screen 10 is used to display images, videos, etc. The screen 10 includes a light-transmitting cover plate 11 and a display screen 12. The light-transmitting cover plate 11 and the display screen 12 are stacked. The light-transmitting cover plate 11 is mainly used to protect the display screen 12 and prevent dust. The material of the light-transmitting cover plate 11 includes but is not limited to glass. The display screen 12 can be a flexible display screen or a rigid display screen. For example, the display screen 12 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini light-emitting diode display screen, a micro light-emitting diode display screen, a micro organic light-emitting diode display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD).

[0080] The back cover 20 is connected to the screen 10, and the back cover 20 is used to protect the internal electronic components of the electronic device 100. In some embodiments, please refer to Figure 1 and Figure 2, the back shell 20 may include a back cover 21 and a frame 22. The back cover 21 is located on the side of the display screen 12 away from the light-transmitting cover plate 11 and is spaced apart from the display screen 12. The frame 22 is located between the back cover 21 and the screen 10 and is provided along the edges of the back cover 21 and the screen 10. The frame 22 is fixed to the back cover 21. Exemplarily, the frame 22 may be fixedly connected to the back cover 21 by adhesive. The frame 22 may also be an integrally formed structure with the back cover 21, that is, the frame 22 and the back cover 21 are a whole structure. The light-transmitting cover plate 11 is fixedly adhered to the frame 22. There is a receiving cavity inside the back shell 20. In some embodiments, the receiving cavity is located between the screen 10 and the back cover 21.

[0081] In some embodiments, please refer to Figure 2 , the electronic device 100 further includes a middle plate 23. The middle plate 23 is fixed to the inner surface of the frame 22. Exemplarily, the middle plate 23 may be fixed to the frame 22 by welding. The middle plate 23 may also be an integrally formed structure with the frame 22. The middle plate 23 serves as the structural "skeleton" of the electronic device 100 and is used to support and fix the electronic components inside the electronic device 100.

[0082] Among them, the structural member composed of the middle plate 23 and the frame 22 may also be referred to as a middle frame. On this basis, the receiving cavity may be located between the middle frame and the back cover 21.

[0083] The circuit board assembly 30 is accommodated in the receiving cavity. In some embodiments, the circuit board assembly 30 may be fixed to the middle plate 23. In other embodiments, when the electronic device 100 does not include the middle plate 23, the circuit board assembly 30 may also be fixed to the back cover 21 or the frame 22.

[0084] The circuit board assembly 30 is used to realize the electrical connection between various electronic components, and the circuit board assembly 30 is used to perform operations such as signal control, data signal processing, and data signal storage on the electronic components. Specifically, the circuit board assembly 30 may include a circuit board 31 and electronic components 32 disposed on the surface of the circuit board.

[0085] The circuit board 31 includes a first surface S1 and a third surface S3 facing each other. The first surface S1 and the third surface S3 may be the two largest surfaces of the circuit board 31. The circuit board 31 may include a multi-layer stacked structure formed by alternately stacking an insulating dielectric layer and a metal layer in sequence and a solder mask layer disposed on at least one end surface of the multi-layer stacked structure along its stacking direction. Among them, the metal layer has a pattern for forming the internal traces or reference ground of the circuit board 31. Based on this, the first surface S1 and the third surface S3 may be perpendicular to the stacking direction of the insulating dielectric layer and the metal layer in the multi-layer stacked structure.

[0086] The circuit board 31 can be a double-sided board or a single-sided board with the first surface S1 for arranging electronic components. When the circuit board 31 is a double-sided board, electronic components are provided on both the first surface S1 and the third surface S3. In other embodiments, the circuit board 31 can also be a single-sided board with the third surface S3 for arranging electronic components.

[0087] The circuit board 31 can be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board. In this embodiment, the circuit board 31 is taken as an example of a rigid circuit board for illustrative purposes. Specifically, the circuit board 31 can be a rigid printed circuit board (PCB).

[0088] The electronic components 32 include but are not limited to chips, resistors, capacitors, inductors, potentiometers, electron tubes, radiators, electromechanical components, connectors, semiconductor discrete devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, etc. It should be noted that the number and arrangement of the electronic components 32 in the embodiments of the present application can be set according to actual needs, and the embodiments of the present application do not limit the number and arrangement of the electronic components 32.

[0089] In order to achieve the diversity of functions of the electronic device 100, the circuit board assembly 30 can include multiple circuit board assemblies 30 for implementing different functions. Specifically, the circuit board assembly 30 can include a main board circuit board assembly 30a and at least one other circuit board assembly 30b. Figure 2 Only one other circuit board assembly 30b is shown herein, which does not represent a special limitation on the present application. The number of other circuit board assemblies 30b can be two, three, four, etc. Among them, the main board circuit board assembly 30a includes a main board circuit board 311 and main board electronic components 312, and the other circuit board assembly 30b includes another circuit board 321 and other electronic components 322. The main board circuit board assembly 30a is used as the main board of the electronic device 100, and the other circuit board assembly 30b can be other circuit boards of the electronic device 100, such as a circuit board for carrying a speaker, a USB interface, side keys for switches, and side keys for volume in a mobile phone, which is not specifically limited herein.

[0090] In order to improve the user experience, the thin and light design of the whole machine is also a continuous pursuit direction of the electronic device 100. In the extreme space of the electronic device 100, components should be reasonably arranged and the structural layout should be optimized. In order to more efficiently utilize the space of the electronic device 100, the circuit board assembly 30 can be arranged using a variety of layout schemes. Such as Figure 2As shown, the main board circuit board assembly 30a is used as the main board circuit board 311 of the electronic device 100. The main board circuit board 311 is a circuit board 31 with a relatively large surface area in the electronic device 100, and can be arranged in a planar layout. The surface area of other circuit board assemblies 30b is smaller than that of the main board circuit board 311, and at least part of the other circuit board assemblies 30b can be arranged in an upright layout.

[0091] "Planar layout" means that the thickness direction of the circuit board 31 is parallel to the thickness direction of the electronic device 100, that is, Figure 2 the Z-axis direction in. Here, the parallel means parallel including a certain error, not parallel in the absolute sense. The parallel mentioned in the following embodiments all includes a certain error, and will not be elaborated later. Specifically, the main board circuit board 311 includes a first surface S1 and a third surface S3 facing each other. The first surface S1 faces the back cover 21, and the third surface S3 faces the middle plate 23. When the main board circuit board assembly 30a is a single-sided board, the electronic components 312 of the main board can be arranged on the first surface S1, and the main board circuit board assembly 30a is bonded to the middle plate 23 by means of the third surface S3. Alternatively, the electronic components 312 of the main board are arranged on the third surface S3, and the main board circuit board assembly 30a is bonded to the back cover 21 by means of the first surface S1. When the main board circuit board assembly 30a is a double-sided board, the electronic components 312 of the main board are distributed on the first surface S1 and the third surface S3, and the main board circuit board assembly 30a is fixed to the middle plate 23 or the back cover 21 by means of the bracket 40.

[0092] Other circuit board assemblies 30b are fixed in the electronic device 100 in an upright layout. "Upright layout" means that the thickness direction of other circuit boards 31 is perpendicular to the thickness direction of the electronic device 100, that is, perpendicular to the Z-axis direction. Here, the perpendicular means perpendicular including a certain error, not perpendicular in the absolute sense. The perpendicular mentioned in the following embodiments all includes a certain error, and will not be elaborated later. The upright layout can be achieved by setting a receiving groove 221 on the middle frame and arranging other circuit board assemblies 30b in the receiving groove 221. Therefore, compared with only using the planar layout method, the combination of the upright layout and the planar layout can make more efficient use of the space inside the electronic device 100.

[0093] Hereinafter, taking the circuit board assembly 30 as another circuit board assembly 30b as an example, a scenario where the other circuit board assembly 30b is fixed in the electronic device 100 in a vertical layout manner will be described in detail. For the sake of smooth reading, in the following text, the other circuit board assembly 30b will be described by using its upper concept circuit board assembly 30 as the name, the other circuit board 31 will be described by using its upper concept circuit board 31 as the name, and the other electronic components 30b will be described by using its upper concept electronic components 32 as the name. That is to say, a scenario where the circuit board assembly 30 is in a vertical layout manner will be described in detail.

[0094] Please refer to Figure 3 , Figure 3 as Figure 2 an enlarged view of part A in . The frame 22 includes an inner frame 222 and an outer frame 223 that face each other, and a sixth surface S15 connecting the inner frame 222 and the outer frame 223. The inner frame 222 is the frame of the frame 22 facing the inside of the housing, and the outer frame 223 is the frame of the frame 22 facing the outside of the housing. The accommodating groove 221 is provided on the sixth surface S15 between the inner frame 222 and the outer frame 223. The extending direction of the length of the accommodating groove 221 can be the same as the extending direction of the length of the frame 22, that is, extending along the Y-axis direction. When the circuit board assembly 30 is accommodated in the accommodating groove 221, the extending direction of the length of the circuit board assembly 30 is the same as the extending direction of the length of the frame 22. In this way, the length of the accommodating groove 221 can extend to the inner walls at both ends of the frame 22 in the length direction to meet the requirement of being able to install a circuit board 31 with a larger length.

[0095] Of course, in some other embodiments, the extending direction of the length of the circuit board 31 can also be inclined at a certain angle relative to the Y-axis direction. In this way, the circuit board 31 can avoid interfering with the installation of other components by being inclined to create a certain space.

[0096] Figure 3 The above description is given by taking the accommodating groove 221 being provided on the frame 22 as an example. However, this does not represent a special limitation on the present application. That is to say, in some other embodiments, the accommodating groove 221 can also be provided on the middle plate 23 or the back cover 21. The extending direction of the length of the accommodating groove 221 can extend along the X-axis direction, the Y-axis direction, the Z-axis direction, or can also extend at a certain angle relative to the X-axis direction, the Y-axis direction, or the Z-axis direction. It can be understood that the extending direction of the length of the accommodating groove 221 extending in each direction is within the protection scope of the present application.

[0097] The following description will be made by taking an example where the receiving groove 221 is disposed on the frame 22 and the extension direction of the length of the receiving groove 221 is consistent with the extension direction of the length of the frame 22 .

[0098] Please continue reading Figure 3 , the opening of the receiving groove 221 faces the back cover 21. When the circuit board assembly 30 is assembled, the circuit board assembly 30 can be installed in the receiving groove 221 before the back cover 21 is assembled. When the electronic device 100 fails, the circuit board assembly 30 can be directly observed after the back cover 21 is disassembled, and the circuit board assembly 30 can be easily disassembled through the opening. In this way, the assembly and disassembly of the circuit board assembly 30 are facilitated.

[0099] Specifically, the accommodating groove 221 includes a first inner wall surface 224 and a second inner wall surface 225 relative to each other, a third inner wall surface 226 and a fourth inner wall surface 227 relative to each other connected between the first inner wall surface 224 and the second inner wall surface 225, and a bottom wall surface 228 opening toward the accommodating groove 221, and the bottom wall surface 228 is located on the side of the first inner wall surface 224 and the second inner wall surface 225 away from the opening of the accommodating groove 221.

[0100] The extending direction of the first inner wall surface 224 and the extending direction of the second inner wall surface 225 are parallel to the length direction of the electronic device 100, that is, Figure 3 The extension direction of the third inner wall surface 226 and the extension direction of the fourth inner wall surface 227 are parallel to the width direction of the electronic device 100, that is, Figure 3 The bottom wall surface 228 may be connected between the first inner wall surface 224 and the second inner wall surface 225, the bottom wall surface 228 may be connected between the third inner wall surface 226 and the fourth inner wall surface 227, and the bottom wall surface 228 may be connected to the first inner wall surface 224, the second inner wall surface 225, the third inner wall surface 226 and the fourth inner wall surface 227 at the same time.

[0101] In this embodiment and the following embodiments, the case where the bottom wall surface 228 is connected to the first inner wall surface 224 and the second inner wall surface 225 is taken as an example for illustration. The connection line of the midpoint D1 of the first inner wall surface 224 and the midpoint D2 of the second inner wall surface 225 is defined as the center line L1 of the bottom wall surface 228. One end of the bottom wall surface 228 extends a certain distance from the center line L1 towards the third inner wall surface 226, and the other end of the bottom wall surface 228 extends a certain distance from the center line L1 towards the fourth inner wall surface 227. Among them, the "midpoint D1 of the first inner wall surface 224" refers to the area on the first inner wall surface 224 where the distances from the third inner wall surface 226 and the fourth inner wall surface 227 are equal. Similarly, the "midpoint D2 of the second inner wall surface 225" is also defined as above. The length of the bottom wall surface 228 can be between one-fifteenth and one-tenth of the length of the circuit board 31, and this length constitutes a special limitation on this application. In this way, the bottom wall surface 228 can not only play a role in supporting the circuit board 31, but also the hollow areas on both sides of the bottom wall surface 228 can save the weight of the electronic device 100, thereby improving the user experience.

[0102] Please refer to Figure 4 , Figure 4 which is a schematic structural diagram of the circuit board 31 provided by some embodiments of this application. Based on the above content, the circuit board 31 is further introduced. The circuit board 31 further includes opposite first side surface S4 and third side surface S6 connected between the first surface S1 and the third surface S3, and opposite second side surface S5 and sixth side surface S9 connected between the first surface S1 and the third surface S3.

[0103] Please refer to Figure 5 , Figure 5 which is Figure 4 a schematic structural diagram of the circuit board 31 in Figure 3 installed in the accommodation groove 221 in

[0104] However, the circuit board assembly 30 fixed in the above manner has problems of unstable fixation. The reasons are as follows. The side area of the circuit board 31 is small. When connecting through the side with a small area to the back cover 21 or the bottom wall surface 228, there will be problems of unstable adhesion. After the circuit board assembly 30 is placed in the accommodation groove 221, there will also be problems of difficult disassembly. Since the circuit board 31 is connected to the inner wall of the accommodation groove 221 by adhesion, when disassembling the circuit board assembly 30, due to the small space of the accommodation groove 221, it is difficult to take out the circuit board assembly 30 inside. It is necessary to use other disassembly tools to take out the circuit board assembly 30. For example, pry out the circuit board 31 from the accommodation groove 221 with a pry bar. However, the circuit board 31 is easily damaged during the disassembly process.

[0105] To solve the above problems, the present application also provides a circuit board assembly 30. Please refer to Figure 6 , Figure 6 which is a schematic structural diagram of the circuit board assembly 30 provided by some embodiments of the present application. The main difference between this circuit board assembly 30 and the above-mentioned circuit board assembly 30 is that the circuit board assembly 30 further includes a bracket 40. The bracket 40 will be introduced in detail below. The bracket 40 is connected to the circuit board 31. "The bracket 40 is connected to the circuit board 31" means that at least part of the bracket 40 is connected to the circuit board 31 to fix the bracket 40 on the circuit board 31. The bracket 40 includes a first bracket portion 41. In some embodiments, the bracket 40 can be connected to the circuit board 31 through the first bracket portion 41. The first bracket portion 41 is located on the side facing the first surface S1. That is to say, the first bracket portion 41 and the first group of electronic components 32 are on the same side of the circuit board 31. The direction perpendicular to the first surface S1 is the first direction, that is, the direction of the X-axis in the figure. At least part of the first bracket portion 41 in the first direction is an elastic soft structure. When the bracket 40 is subjected to a force in the first direction, the elastic soft structure can be compressed and rebound in the first direction.

[0106] In some embodiments, the material of the bracket 40 includes but is not limited to metals such as stainless steel, aluminum alloy, and titanium alloy. Such materials have good heat dissipation performance at the same time, which helps to dissipate heat from the electronic device 100, and such materials have high structural strength, which can ensure the stability of the bracket 40 during use. In some other embodiments, the material of the bracket 40 can also be non-metals such as polycarbonate (PC), PC + glass fiber, and acrylonitrile butadiene styrene plastic (ABS plastic). The bracket 40 made of such materials is lighter in weight, which is beneficial to reducing the weight of the electronic device 100, and thus improving the user experience.

[0107] The first support part 41 can be plate-shaped, block-shaped, strip-shaped, etc. In this embodiment and the following embodiments, the first support part 41 is taken as an example of being plate-shaped for illustration, but this does not represent a special limitation on the present application. Further, the first support part 41 can be square plate-shaped, circular plate-shaped, oval plate-shaped, irregular plate-shaped, etc. In this embodiment and the following embodiments, the first support part 41 is taken as an example of being square plate-shaped for illustration. In this way, the first support part 41 includes a second surface S2 facing the first surface S1, and the first support part 41 can be connected to the circuit board 31 through the second surface S2.

[0108] The first support part 41 can be connected to the circuit board 31 by means of adhesion, snap connection, screw connection, etc. In this embodiment and the following embodiments, the first support part 41 being adhered to the circuit board 31 is taken as an example for illustration. Specifically, an adhesive material is provided between the first support part 41 and the first surface S1 to adhere the first support part 41 to the first surface S1. The adhesive material can be made of heat-conductive adhesive, heat-conductive gel and other materials with adhesiveness. In this way, it helps the heat dissipation of the electronic device 100 during use, and further improves the performance of the electronic device 100. However, the above does not constitute a special limitation on the present application, that is, using other adhesive materials also belongs to the protection scope of the present application.

[0109] The material of the elastic soft structure can be rubber, silica gel, foam, sponge, etc. Based on the premise that the first support part 41 is square plate-shaped as described above, the elastic soft material can be at least part of the square plate body in the first direction, and the rest of the square plate body is made of hard material. The elastic soft material can also be the part protruding from the surface of the square plate body, and the elastic soft material protrudes from the square plate body in the first direction.

[0110] Based on the above embodiment, different from being only adhered to other structural members through the side or surface of the circuit board 31, a support 40 is provided on the circuit board 31, and the circuit board assembly 30 is connected to other structural members by means of the support 40. On the one hand, the support 40 can provide a larger connection area for the connection of the circuit board assembly 30, and then connect the circuit board assembly 30 to other structural members more firmly and reliably. On the other hand, when disassembling the circuit board assembly 30, the force can be directly applied to the support 40 to disassemble the circuit board 31 from other structural members, avoiding directly applying the force to the circuit board assembly 30 and causing damage to the circuit board assembly 30, and improving the stability of the circuit board assembly 30 during use. Further, after the circuit board 31 is installed, the support 40 also squeezes the circuit board 31 between two opposite structural members by providing an elastic soft structure, and then an interference fit is formed between the circuit board 31 and other structural members, making the connection of the circuit board assembly 30 more stable, and further improving the stability and reliability of the circuit board assembly 30 after installation.

[0111] Please refer to Figure 7 , Figure 7 which is Figure 6 a schematic structural view of the circuit board assembly 30 installed in the accommodation groove 221. The surface of the bracket 40 facing away from the circuit board 31 faces the first inner wall surface 224, and the surface of the circuit board 31 facing away from the bracket 40 (i.e., the third surface S3 of the circuit board 31) faces the second inner wall surface 225. The circuit board assembly 30 is installed between the first inner wall surface 224 and the second inner wall surface 225. The circuit board assembly 30 can be bonded to the first inner wall surface 224 of the accommodation groove 221 through the bracket 40. Further, the elastic soft structure on the bracket 40 enables an interference fit between the circuit board assembly 30 and the first inner wall surface 224 and the second inner wall surface 225, so as to make the circuit board assembly 30 more stably and reliably connected within the accommodation groove 221.

[0112] Please continue to refer to Figure 6 and Figure 7 , the number of brackets 40 can be set to at least one. That is to say, only one bracket 40 can be set, or two, three, four, etc. can be set. The number of brackets 40 can be determined according to the length of the circuit board 31. For example, when the length of the circuit board 31 is relatively large, the number of brackets 40 can be set to two. The circuit board 31 includes opposite first end 31a and second end 31b, and the first end 31a and the second end 31b are the two ends in the length direction of the circuit board 31. The two brackets 40 are symmetrically arranged at the first end 31a and the second end 31b. In this way, the circuit board 31 is fixed in the accommodation groove 221 through the two brackets 40, and the circuit board assembly 30 can be more firmly and reliably connected to the accommodation groove 221.

[0113] In some other embodiments, when the length of the circuit board 31 is larger, more brackets 40 can be set to fix the circuit board assembly 30. When the length of the circuit board 31 is relatively small, setting one bracket 40 can achieve the stability and reliability of the installation of the circuit board assembly 30. Therefore, this application does not make special limitations on the number of brackets 40, and the number of brackets 40 can be selected according to the length of the circuit board 31 and the requirements for the installation stability of the circuit board 31. The above embodiments and the following partial embodiments are described by taking the number of brackets 40 as two as an example.

[0114] Next, the specific structure of the first bracket part 41 will be introduced. Please refer to Figure 8 , Figure 8Schematic diagram of the structure of the bracket 40 provided by some embodiments of the present application. Based on the above introduction of the bracket 40, the first bracket part 41 is in the shape of a square plate, and the first bracket part 41 includes a substrate part 412 and an elastic rubber material 413. The substrate part 412 is connected to the first surface S1. The elastic rubber material 413 is disposed on the surface of the substrate part 412 facing away from the first surface S1, and the elastic rubber material 413 forms an elastic soft structure. The elastic rubber material 413 covers at least a part of the surface of the substrate part 412 facing away from the first surface S1. For example, the elastic rubber material 413 may cover one-third to one-half of the surface of the substrate part 412 facing away from the first surface S1, and the elastic rubber material 413 may also cover the entire surface of the substrate part 412 facing away from the first surface S1. The present application does not make any special limitation on the coverage area of the elastic rubber material 413. It can be understood that the elastic rubber material 413 can be selected according to the size of the volume of the circuit board 31, and the area size of the elastic rubber material 413 is within the protection scope of the present application.

[0115] The elastic rubber material 413 may include a part protruding from the surface of the substrate part 412 and a part extending into the substrate part 412, that is, Figure 8 the part indicated by the dashed line in. The height of the elastic rubber material 413 protruding from the surface of the substrate part 412 is greater than or equal to 0.05 mm. For example, the height of the elastic rubber material 413 protruding from the surface of the substrate part 412 may be 0.05 mm, 0.07 mm, 0.08 mm, 0.1 mm, 0.12 mm, etc. In this way, the extension length of the elastic rubber material 413 is greater, providing greater elasticity for the fixation of the circuit board assembly 30, enabling the circuit board assembly 30 to have an interference fit with the accommodation groove 221, and further making the installation of the circuit board assembly 30 more stable and reliable.

[0116] The elastic rubber material 413 may be integrally formed with the substrate part 412, or the elastic rubber material 413 may be connected to the substrate part 412 by an assembly method.

[0117] The elastic rubber material 413 may be made of a thermally conductive adhesive, a thermally conductive gel, etc. having adhesiveness. In this way, it helps the heat dissipation of the electronic device 100 during use, and further improves the performance of the electronic device 100. However, the above does not constitute a special limitation on the present application. That is to say, using other elastic rubber materials 413 also belongs to the protection scope of the present application.

[0118] The elastic soft structure using the elastic adhesive 413 can play multiple roles. First, the circuit board assembly 30 can be bonded to the first inner wall surface 224 through the elastic adhesive 413. Second, the elastic adhesive 413 is located between the substrate portion 412 and the first inner wall surface 224, making the fit between the circuit board assembly 30 and the receiving groove 221 an interference fit, thereby improving the stability and reliability of the installation of the circuit board assembly 30. Third, when the circuit board assembly 30 collides, the elastic adhesive 413 has a certain buffering effect, thereby protecting the circuit board assembly 30 and preventing the circuit board assembly 30 from being damaged during the collision, further improving the user's satisfaction.

[0119] Please refer to Figure 9 and Figure 10 , Figure 9 which is Figure 7 a schematic structural view of the bracket 40 observed from the F1 angle in Figure 10 and is a schematic structural view of the circuit board 31 provided by some embodiments of the present application. A first adhesive 414 is provided between the first surface S1 of the circuit board 31 and the second surface S2 of the bracket 40, and the bracket 40 is bonded to the circuit board 31 through the first adhesive 414. In order to improve the accuracy of the fit between the bracket 40 and the circuit board 31, a first positioning portion 33 is provided on the first surface S1, and a second positioning portion 411 that cooperates with the first positioning portion 33 is provided on the second surface S2. By the cooperation of the first positioning portion 33 and the second positioning portion 411, the accuracy of bonding between the bracket 40 and the circuit board 31 is improved, thereby reducing the assembly error between the bracket 40 and the circuit board 31, further improving the stability and reliability of the connection between the bracket 40 and the circuit board 31, and improving the assembly accuracy of the circuit board assembly 30 and the electronic device 100.

[0120] Please continue to refer to Figure 9 and Figure 10 , further, the first positioning portion 33 is a notch that penetrates the third side surface S6; the second positioning portion 411 is a convex block that cooperates with the notch. In one embodiment, the convex block is provided on the bracket 40, and the notch is provided on the circuit board 31. In some other embodiments, the convex block is provided on the circuit board 31, and the notch is provided on the bracket 40. This embodiment and the following embodiments are described by taking the convex block being provided on the bracket 40 and the notch being provided on the circuit board 31 as an example.

[0121] Specifically, the convex block can be a square block, a circular block, an oval block, a special-shaped block, etc. that protrudes from the second surface S2. The shape of the notch is the same as the shape of the convex block to accommodate the convex block. And, the notch penetrates to the third side surface S6, correspondingly, the convex block is provided in the area of the second surface S2 close to the third side surface S6, that is, the area of the second surface S2 that is lower in the Z-axis direction. Please refer to Figure 11 , Figure 11 which isFigure 9 The bracket 40 in Figure 10 is a schematic structural view of the circuit board 31. In this way, when the bracket 40 and the circuit board 31 are assembled, in the thickness direction of the electronic device 100 (that is, the Z-axis direction), the first positioning portion 33 of the circuit board 31 is aligned with the second positioning portion 411 of the bracket 40. After alignment, the second positioning portion 411 is pushed into the first positioning portion 33 to accommodate the second positioning portion 411 in the first positioning portion 33, thereby realizing the positioning of the bracket 40 and the circuit board 31, improving the bonding accuracy between the bracket 40 and the circuit board 31, further reducing the assembly error between the bracket 40 and the circuit board 31, and further improving the stability and reliability of the connection between the bracket 40 and the circuit board 31, as well as improving the assembly accuracy of the circuit board assembly 30 and the electronic device 100.

[0122] The above embodiment realizes the fixation of the circuit board assembly 30 in the width direction of the electronic device 100 through the first bracket portion 41. Based on this, in order to further improve the stability of the installation of the circuit board assembly 30, please refer to Figure 12 and Figure 13 , Figure 12 which is a schematic structural view of the bracket 40 provided by some other embodiments of the present application; Figure 13 is Figure 12 the front view of the bracket 40 in

[0123] The second bracket portion 42 can be in the shape of a block, a plate, a strip, etc. In this embodiment and the following embodiments, the second bracket portion 42 is taken as an example of a block for illustration. The second bracket portion 42 can be in the shape of a square block, a circular block, an oval block, etc. In this embodiment and the following embodiments, the second bracket portion 42 is taken as an example of a square block for illustration. The second bracket portion 42 includes a seventh surface facing the second surface S2 ( Figure 12(not shown in the figure), and a fifth surface S14 opposite to the seventh surface. The second bracket portion 42 is connected to the second surface S2 through the seventh surface, and the fifth surface S14 is a square block extending in the direction facing the first surface S1. Moreover, the second bracket portion 42 extends to at least a part of the first side surface S4. "The second bracket portion 42 extends to at least a part of the first side surface S4" means that the orthographic projection of the first side surface S4 on the second bracket portion 42 overlaps with the second bracket portion 42. "Overlap" means that the orthographic projection of the first side surface S4 on the second bracket portion 42 may completely overlap with the second bracket portion 42, or the orthographic projection of the first side surface S4 on the second bracket portion 42 may at least partially overlap with the second bracket portion 42.

[0124] The second bracket portion 42 may be in direct contact with the first side surface S4 of the circuit board 31, the second bracket portion 42 may also have a certain gap from the first side surface S4 of the circuit board 31, and the second bracket portion 42 may also be in contact with the first side surface S4 of the circuit board 31.

[0125] In this way, the second bracket portion 42 plays a limiting role on the side of the circuit board 31 facing the first side surface S4. Specifically, the first bracket portion 41 plays a limiting role in the thickness direction of the circuit board 31, that is, in Figure 13 the X-axis direction in the figure, and the second bracket portion 42 plays a limiting role in the width direction of the circuit board 31, that is Figure 13 the Z-axis direction in the figure. Further, in the width direction of the circuit board 31, the circuit board 31 is more precisely installed on the circuit board 31 through the cooperation of the second positioning portion 411 and the second bracket portion 42, thereby reducing the assembly error between the bracket 40 and the circuit board 31 and improving the assembly accuracy of the bracket 40 and the circuit board 31. Further, the stability and reliability of the circuit board assembly 30 installed in the electronic device 100 are also improved.

[0126] Please refer to Figure 13 and Figure 14 , Figure 14 For Figure 13Schematic diagram of the bracket 40 observed from the F2 angle. In the width direction of the circuit board 31, that is, in the Z-axis direction, the bracket 40 includes a seventh side surface S7 and an eighth side surface S8 facing each other, wherein the seventh side surface S7 is the side surface of the bracket 40 close to the first side surface S4. Specifically, the seventh side surface S7 includes a side surface S71 of the first bracket portion 41 and a side surface S72 of the second bracket portion 42, and the side surface S71 of the first bracket portion 41 and the side surface S72 of the second bracket portion 42 are located in the same plane a. In this way, the flatness of the seventh side surface S7 is ensured, and the problem of difficult installation caused by the unevenness of the first bracket portion 41 and the second bracket portion 42 is avoided, because the assembly error is larger when the uneven plane cooperates with other surfaces, and it is difficult to fit and fix with other surfaces.

[0127] In some other embodiments, the side surface S71 of the first bracket portion 41 and the side surface S72 of the second bracket portion 42 may not be in the same plane. For example, the side surface S72 of the second bracket portion 42 may protrude from the side surface S71 of the first bracket portion 41, and a notch is provided in the area of the electronic device 100 opposite to the second bracket portion 42, and the part of the second bracket portion 42 protruding from the first bracket portion 41 cooperates with the notch to facilitate the positioning of the bracket 40 when installed on the electronic device 100.

[0128] In some embodiments, please refer to Figure 15 and Figure 16 , Figure 15 Schematic diagram of the structure of the circuit board 31 provided by some other embodiments of the present application; Figure 16 is Figure 14 in the bracket 40 is installed on Figure 15 Schematic diagram of the structure of the circuit board 31 in. The circuit board 31 further includes a third side surface S6 opposite to the first side surface S4, as well as a fourth side surface S11 and a fifth side surface S12. The distance from the first side surface S4 to the third side surface S6 is less than the distance from the fourth side surface S11 to the third side surface S6. When the bracket 40 is installed on the circuit board 31, the positioning of the bracket 40 can be achieved through the cooperation of the second bracket portion 42 and the first side surface S4, thereby ensuring the stability and reliability of the circuit board assembly 30. Moreover, the second bracket portion 42 is accommodated in the notch formed by the fourth side surface S11 and the fifth side surface S12, further ensuring the flatness of the overall appearance of the circuit board assembly 30 after the bracket 40 is fixed to the circuit board 31, and thus facilitating the convenience and accuracy of installing the circuit board assembly 30 on the electronic device 100.

[0129] In the above embodiment, the circuit board assembly 30 is fixed in the width direction of the electronic device 100 by the first bracket part 41, and the circuit board assembly 30 is fixed in the thickness direction of the electronic device 100 by the second bracket part 42. Based on this, in order to further improve the stability of the installation of the circuit board assembly 30, please continue to refer to Figure 12 , Figure 13 and Figure 14 The bracket 40 also includes a third bracket portion 43, which is located on the side facing the third side surface S6 of the circuit board 31. The third bracket portion 43 can be connected to the first bracket portion 41, and the third bracket portion 43 can also be connected to the second bracket portion 42. The third bracket portion 43 can also be connected to both the first bracket portion 41 and the second bracket portion 42. This embodiment and the following embodiments are described by taking the example that the third bracket portion 43 is connected to both the first bracket portion 41 and the second bracket portion 42.

[0130] Please continue reading Figure 12 , Figure 13 and Figure 14 The third bracket part 43 can be in a block shape, a plate shape, a strip shape, etc., and in this embodiment and the following embodiments, the third bracket part 43 is in a block shape as an example for description. The third bracket part 43 can be in a square block shape, a circular block shape, an elliptical block shape, etc., and in this embodiment and the following embodiments, the third bracket part 43 is in a square block shape as an example for description.

[0131] Specifically, the top surface of the third bracket portion 43 faces the second bracket portion 42 and is connected to the second bracket portion 42, and the side surface of the third bracket portion 43 faces the first bracket portion 41 and is connected to the first bracket portion 41. In this way, the first bracket portion 41, the second bracket portion 42 and the third bracket portion 43 form a bracket receiving groove 44. Figure 16 , at least part of the circuit board 31 is accommodated in the accommodating groove 44 of the bracket, specifically, the first surface S1 of the circuit board 31 is connected to the first bracket part 41, the first side surface S4 of the circuit board 31 faces the second bracket part 42, and the second side surface S5 of the circuit board 31 faces the third bracket part 43. The circuit board 31 can directly contact the second bracket part 42 and the third bracket part 43, or the circuit board 31 can have a certain gap with the second bracket part 42 and the third bracket part 43.

[0132] The bracket 40 limits the circuit board 31 in three directions, thereby reducing the assembly error between the bracket 40 and the circuit board 31 and improving the assembly accuracy of the bracket 40 and the circuit board 31. Further, the stability and reliability of the circuit board assembly 30 installed in the electronic device 100 are improved.

[0133] The above embodiments are described by taking the connection between the first surface S1 of the circuit board 31 and the first support portion 41 as an example. In some other embodiments, the first surface S1 of the circuit board 31 may also be connected to the second support portion 42, and the first surface S1 of the circuit board 31 may also be connected to the third support portion 43. In still other embodiments, the first surface S1 of the circuit board 31 may also be connected to two or three of the first support portion 41, the second support portion 42, and the third support portion 43 simultaneously to improve the connection strength between the circuit board 31 and the support 40. Therefore, the connection between the circuit board 31 and the support 40 is not limited to only one area on the support 40, and the area connected to the circuit board 31 can be flexibly selected according to the specific structure of the support 40, further improving the flexibility of the connection between the support 40 and the circuit board 31.

[0134] Please continue to refer to Figure 16 , define the arrangement direction of the first side surface S4 and the third side surface S6 as the second direction, that is Figure 16 the Z-axis direction in Figure 16 . In the second direction, the support 40 includes a seventh side surface S7 and an eighth side surface S8 facing away from each other. The seventh side surface S7 is located on the side of the first side surface S4 away from the third side surface S6, and the eighth side surface S8 is located on the side of the first side surface S4 away from the seventh side surface S7. That is to say, the seventh side surface S7 is the surface of the support 40 facing the opening of the accommodating groove 221, and the eighth side surface S8 is arranged opposite to the seventh side surface S7. In the width direction of the circuit board assembly 30, that is Figure 16 the Z-axis direction in Figure 16 , the seventh side surface S7 of the support 40 protrudes from the first side surface S4 of the circuit board 31.

[0135] In this way, after the circuit board assembly 30 is installed in the accommodating groove 221 and the back cover 21 of the electronic device 100 is installed on the frame 22, the circuit board assembly 30 is located between the bottom wall of the accommodating groove 221 and the back cover 21. The support 40 can be in direct contact with the back cover 21 to realize the fixation of the circuit board assembly 30 in the second direction. Further, the back cover 21 and the circuit board assembly 30 can form an interference fit relationship to squeeze the circuit board assembly 30 into the accommodating groove 221, further improving the stability and reliability of the circuit board assembly 30 installed in the accommodating groove 221.

[0136] In some other embodiments, the support 40 and the back cover 21 may not be in contact, and there may be a certain gap between the support 40 and the back cover 21. The support 40 and the back cover 21 may also be in contact by means of other structural members. For example, a filler may be provided between the support 40 and the back cover 21, and the filler is squeezed between the support 40 and the back cover 21 to further improve the stability and reliability of the circuit board assembly 30 installed in the accommodating groove 221.

[0137] In some other embodiments, the seventh side surface S7 may be flush with the first side surface S4, thus ensuring the flatness of the appearance of the circuit board assembly 30.

[0138] Please continue to refer to Figure 16 , the eighth side surface S8 is located between the first side surface S4 and the third side surface S6. That is to say, in the width direction of the circuit board assembly 30, that is, the Z-axis direction in the figure, the third side surface S6 of the circuit board 31 protrudes from the eighth side surface S8 of the bracket 40. The height by which the third side surface S6 can protrude from the eighth side surface S8 is greater than or equal to 0.1 mm. The height by which the third side surface S6 can protrude from the eighth side surface S8 can be 0.1 mm, 0.11 mm, 0.13 mm, 0.15 mm, etc. In this way, after the circuit board assembly 30 is installed in the receiving groove 221, the circuit board assembly 30 directly contacts the bottom wall surface 228 of the receiving groove 221 through the third side surface S6. The circuit board assembly 30 relies on the circuit board 31 itself for installation and positioning, reducing the error during the assembly of the circuit board assembly 30 and improving the accuracy of installing the circuit board assembly 30 in the electronic device 100.

[0139] Please refer to Figure 17 and Figure 18 , Figure 17 is Figure 16 a schematic structural diagram of the circuit board assembly 30 in Figure 18 installed in the receiving groove 221; Figure 17 is Figure 17 a top view of the circuit board assembly 30 installed in the receiving groove 221 in

[0140] After the bracket 40 is installed on the circuit board 31, the circuit board assembly 30 with the bracket 40 is installed in the receiving groove 221 of the frame 22. In the width direction of the electronic device 100, that is,

[0141] in the X-axis direction in Figure 17In the Y-axis direction, the circuit board assembly 30 is fixed in the accommodation groove 221 through the brackets 40 at both ends. Specifically, the bracket 40 at the first end 31a of the circuit board 31 is connected to the third inner wall surface 226 of the accommodation groove 221, and the bracket 40 at the second end 31b of the circuit board 31 is connected to the fourth inner wall surface 227 of the accommodation groove 221. The distance between the bracket 40 at the first end 31a and the third inner wall surface 226, and the distance between the bracket 40 at the second end 31b and the fourth inner wall surface 227 are less than or equal to 0.15 mm. For example, the distance between the bracket 40 at the first end 31a and the third inner wall surface 226, and the distance between the bracket 40 at the second end 31b and the fourth inner wall surface 227 can be 0.05 mm, 0.1 mm, or 0.15 mm. In this way, the circuit board assembly 30 is fixed in the accommodation groove 221 through the brackets 40 in the length direction of the electronic device 100. On the one hand, the brackets 40 increase the connection area between the circuit board assembly 30 and the accommodation groove 221 in the length direction, thereby improving the connection strength of the circuit board assembly 30 fixed in the accommodation groove 221, and further improving the stability and reliability of the electronic device 100 during use. On the other hand, when the circuit board assembly 30 needs to be disassembled, the connection between the bracket 40 and the accommodation groove 221 can be removed. Specifically, a pry bar can be used to pry up the circuit board assembly 30 by applying force to the bracket 40, without applying external force to the circuit board 31, thereby avoiding damage to the circuit board assembly 30 during the disassembly process of the circuit board assembly 30, further extending the service life of the electronic device 100, and enhancing the user experience.

[0142] To further facilitate the disassembly of the circuit board 31, please continue to refer to Figure 17 , in some embodiments, the first inner wall surface 224 is provided with an avoidance groove 22a, and the orientation of the avoidance groove 22a is the same as the orientation of the opening of the accommodation groove 221. Specifically, the avoidance groove 22a extends in the direction away from the bracket 40 from the first inner wall surface 224, and the avoidance groove 22a penetrates through to the opening of the accommodation groove 221. In this way, when the circuit board assembly 30 is disassembled, the bracket 40 can be forced through the avoidance groove 22a to take out the circuit board assembly 30 from the accommodation groove 221. Specifically, a pry bar can be used to apply force to the bracket 40 through the avoidance groove 22a to pry out the circuit board assembly 30 from the accommodation groove 221. When the bracket 40 and the frame 22 are connected by bonding, when the circuit board assembly 30 is disassembled, the adhesive material between the bracket 40 and the frame 22 can be melted first, and after the adhesive material is melted, the circuit board assembly 30 can be taken out through the avoidance groove 22a. Therefore, by providing the avoidance groove 22a, the convenience of disassembling the circuit board assembly 30 is improved, and damage to the circuit board assembly 30 during the disassembly of the circuit board assembly 30 is avoided, and the reliability and stability of the use of the circuit board assembly 30 are improved.

[0143] Please continue to refer to Figure 17 and Figure 18 , in some other embodiments, for the convenience of disassembling the circuit board assembly 30, a second avoidance notch 40a may further be provided on the bracket 40. The second avoidance notch 40a is provided on the seventh side surface S7, and the opening of the second avoidance notch 40a faces the direction in which the seventh side surface S7 deviates from the eighth side surface S8. Further, the second avoidance notch 40a may be provided on the surface of the first bracket portion 41 facing the opening of the accommodation groove 221, may also be provided on the surface of the second bracket portion 42 facing the opening of the accommodation groove 221, and may also be provided on the surface of the third bracket portion 43 facing the opening of the accommodation groove 221. In this embodiment, the second avoidance notch 40a may be provided based on the above-mentioned embodiment, or the avoidance groove 22a may not be provided, and only the second avoidance notch 40a is provided.

[0144] By providing the second avoidance notch 40a, the convenience of disassembling the circuit board assembly 30 is further improved. When disassembling the circuit board assembly 30, a force can be applied to the bracket 40 through the second avoidance notch 40a to take out the circuit board assembly 30 from the accommodation groove 221. Specifically, a pry bar can be used to apply a force to the bracket 40 through the second avoidance notch 40a to pry out the circuit board assembly 30 from the accommodation groove 221. When the bracket 40 and the frame 22 are connected by an adhesive method, when disassembling the circuit board assembly 30, the adhesive material between the bracket 40 and the frame 22 can be melted first, and after the adhesive material melts, the circuit board assembly 30 can be taken out through the second avoidance notch 40a. Therefore, by providing the second avoidance notch 40a, the convenience of disassembling the circuit board assembly 30 is improved, and damage to the circuit board assembly 30 during disassembly is avoided, thereby improving the reliability and stability of the use of the circuit board assembly 30.

[0145] Please continue to refer to Figure 17 and Figure 18 , in some embodiments, the circuit board assembly 30 further includes a flexible electrical connection structure connected to the circuit board 31. The circuit board assembly 30 can be electrically connected to the main board circuit board 311 by means of the flexible electrical connection structure. The flexible electrical connection structure includes, but is not limited to, a flexible circuit board 50 (flexible printed circuit board, FPC) and a structural member formed by braiding wires and soft materials. In this embodiment, the flexible electrical connection structure 43 is exemplified by the flexible circuit board 50.

[0146] Please refer to Figure 19 , Figure 19A schematic diagram of the structure of a circuit board assembly 30 provided for some further embodiments of the present application. Specifically, the flexible circuit board 50 includes a first portion 51, a second portion 52, and a bending portion 53 connected between the first portion 51 and the second portion 52, and the bending portion 53 is located on the side of the first side S4 of the circuit board 31 away from the third side S6, and the first portion 51 is connected to the circuit board 31. The first side S4 is also provided with a fourth avoidance gap 34 opposite to the bending portion 53, and at least part of the bending portion 53 is accommodated in the fourth avoidance gap 34. "Opposite to the bending portion 53" means that the orthographic projection of the bending portion 53 on the first side S4 overlaps with the first side S4. The first portion 51 is connected to the first surface S1 of the circuit board 31, and extends to the first side S4 along the width direction of the first surface S1. The second portion 52 extends from the surface of the main board circuit board 311 to one side of the first side surface S4. The bending portion 53 connects the first portion 51 and the second portion 52 above the first side surface S4. Since the first portion 51 and the second portion 52 extend in different directions, the bending portion 53 serves to connect the first portion 51 and the second portion 52. In order to ensure the flatness of the overall structure of the circuit board assembly 30, the fourth avoidance notch 34 is provided to accommodate the bending portion 53, so as to prevent the bending portion 53 from protruding from the circuit board assembly 30. Furthermore, the assembly of the circuit board assembly 30 and the frame 22 is more convenient, which is beneficial to the stability and reliability of the installation of the circuit board assembly 30.

[0147] The first part 51 can be a board-to-board (BTB) connector at both ends of the FPC. The FPC is a flexible connector that can be deformed and can flexibly adapt to the spatial layout, so that it is easy to connect the external connection end and the main board circuit board 311. It can be seen that the flexible electrical connection structure is not limited to establishing a connection with the electronic component through the BTB. For example, the components of the electronic device 100 can be provided with springs as the connection ends, and the first part of the flexible electrical connection structure can directly expose copper to connect with the springs, or establish a connection through conductive glue, etc. This embodiment does not make specific restrictions. In some embodiments, the first part 51 can be bonded to the circuit board 31, and the first part 51 can also be welded to the circuit board 31.

[0148] The material of the flexible electrical connection structure can be liquid crystal polymer (LPC), polyimide (PI), modified polyimide (MPI), etc., as long as it can realize the circuit layout function and has a certain bending ability.

[0149] Please continue reading Figure 19, the circuit board assembly 30 further includes an elastic connecting member 60. When the circuit board assembly 30 serves as the side key circuit board 31 of the electronic device 100, for example, the volume circuit board 31 or the switch circuit board 31 of the electronic device 100. The elastic connecting member 60 is correspondingly arranged opposite to the side key on the outer surface of the housing to realize various functions of the electronic device 100. Based on the fact that the third surface S3 of the circuit board 31 is directly connected to the second inner wall surface 225, when the side key is pressed, the side key transmits the external force to the elastic connecting member 60 on the circuit board 31, and the elastic connecting member 60 transmits the force to the circuit board 31 after being stressed. Since the third surface S3 of the circuit board 31 is directly connected to the second inner wall surface 225, the second inner wall surface 225 can provide reliable support for the circuit board 31, thereby avoiding structural damage to the circuit board 31 when it is subjected to external force. Moreover, due to the support of the second inner wall surface 225, elastic deformation of the circuit board 31 is also avoided, further avoiding the problem of poor contact between the side key and the elastic connecting member 60 caused by elastic deformation of the circuit board 31, and thus ensuring the performance of the circuit board assembly 30.

[0150] In some other embodiments, when the circuit board assembly 30 is not used as the side key circuit board 31 of the electronic device 100, the circuit board assembly 30 may also include an elastic connecting member 60. One side of the elastic connecting member 60 can be connected to the circuit board 31 by fixing methods such as welding, bonding, and clamping, and the other side of the elastic connecting member 60 can abut against the first inner wall surface 224.

[0151] Please refer to Figure 20 and Figure 21 , Figure 20 , which is a schematic structural diagram of the bracket 40 provided in some other embodiments of the present application; Figure 21 is Figure 20 a schematic structural diagram of the bracket 40 in Figure 20 viewed from the F3 angle. The bracket 40 further includes a protruding portion 421. The protruding portion 421 can be arranged on the second bracket portion 42, can also be arranged on the third bracket portion 43, or can be arranged on both the second bracket portion 42 and the third bracket portion 43 at the same time. Defining the arrangement direction of the circuit board 31 and the bracket 40 as the first direction, that is, Figure 22 the X-axis direction in Figure 23 , the protruding portion 421 extends along the first direction and protrudes from the third surface S3 in the first direction. That is to say, the protruding portion 421 extends from the bracket 40 towards the circuit board 31 and protrudes from the third surface S3 of the circuit board 31. Please refer to Figure 22 and Figure 23 , Figure 22 is Figure 21 a schematic structural diagram of the bracket 40 and the circuit board 31 after being connected and installed in the accommodation groove 221 in Figure 23 is Figure 22A top view of the circuit board 31 installed in the accommodation groove 221. In this way, after the circuit board assembly 30 is installed in the accommodation groove 221, the circuit board assembly 30 can be connected to the second inner wall surface 225 through the protruding portion 421 of the bracket 40. In the width direction of the electronic device 100, the circuit board assembly 30 is fixed in the accommodation groove 221 through the bracket 40, improving the stability and reliability of the fixation of the circuit board assembly 30.

[0152] As the functions of the electronic device 100 gradually increase and its performance gradually improves, more and more electronic components 32 are integrated on the circuit board 31, and these electronic components 32 can be dispersedly arranged on opposite sides of the circuit board 31. That is to say, the circuit board 31 can be a double-sided board with electronic components 32 integrated on opposite sides. Specifically, based on the above-mentioned bracket 40 including the protruding portion 421, please refer to Figure 24 , Figure 24 which is a schematic structural diagram of the circuit board assembly 30 omitting the bracket 40 provided in some other embodiments of the present application. The circuit board assembly 30 includes a first group of electronic components 32 and a second group of electronic components 32. The first group of electronic components 32 is arranged on the first surface S1, and the second group of electronic components 32 is arranged on the third surface S3. In this way, the performance of the electronic device 100 and the diversity of the functions of the electronic device 100 are further improved.

[0153] The above embodiments are described by taking the number of brackets 40 as two as an example. Next, an example with one bracket 40 is described. Please refer to Figure 25 , Figure 25 which is a schematic structural diagram of the circuit board assembly 30 provided in some other embodiments of the present application. When the length of the circuit board 31 is small, setting one bracket 40 can fix the circuit board 31 in the accommodation groove 221. Different from the above embodiments, the bracket 40 in this embodiment does not need to be arranged at both ends of the circuit board 31, and the bracket 40 can be arranged in the central area of the circuit board 31 to more firmly fix the circuit board assembly 30 in the accommodation groove 221. Here, the "central area" means an area with approximately equal distances from the edges of the circuit board 31. In order to prevent the connection between the bracket 40 and the circuit board 31 from reducing the surface of the circuit board 31 and causing a reduction in the area of the circuit board 31 for bonding the electronic components 32, an avoidance groove 412a is provided on the bracket 40, and the opening of the avoidance groove 412a faces the first surface S1, and at least part of the electronic component 32 is accommodated in the avoidance groove 412a. In this way, the circuit board assembly 30 is connected to the accommodation groove 221 through the bracket 40, improving the stability and reliability of the circuit board assembly 30 fixed in the electronic device 100. The bracket 40 also provides an accommodation space for the installation of the electronic components 32, so as to facilitate the arrangement of more electronic components 32 on the surface of the circuit board 31 and improve the compactness of the layout of the circuit board 31.

[0154] The above embodiments are described by taking the case where the circuit board 31 adopts a vertical layout as an example. In some other embodiments, the bracket 40 can also be applied to the scenario where the circuit board 31 adopts a planar layout. Please refer to Figure 26 , Figure 26 which is a schematic structural diagram of the bracket 40 installed in the accommodation groove 221 provided in some embodiments of the present application. For example, the bracket 40 can also be connected to the main board circuit board 311. Specifically, the main board circuit board 311 includes a first surface S1 facing the bracket 40 and a third surface S3 facing the back cover 21. The main board circuit board 311 is fixed in the accommodation groove 221 through the bracket 40. When disassembling the circuit board assembly 30, a force can be directly applied to the bracket 40 to avoid damaging the circuit board assembly 30, thereby ensuring the quality of the circuit board assembly 30 during use and the process of maintenance and disassembly, and further ensuring the performance of the circuit board assembly 30.

[0155] In the description of this specification, specific features, structures, materials, or characteristics can be combined in a suitable manner in any one or more embodiments or examples.

[0156] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, characterized in that, Comprising: A housing, the housing includes a receiving groove, and the receiving groove includes opposite first inner wall surface and second inner wall surface; A circuit board assembly, the circuit board assembly is located in the receiving groove, and the circuit board assembly includes, A circuit board, the circuit board includes a first surface facing the first inner wall surface and opposite first end and second end; A first bracket, the first bracket is disposed at the first end of the circuit board and connected to the circuit board, the first bracket includes a first bracket portion, the first bracket portion is located on the side facing the first surface, wherein, the direction perpendicular to the first surface is the first direction, and at least a part of the first bracket portion in the first direction is an elastic soft structure; wherein, a first notch is provided on the surface of the first bracket facing the opening of the receiving groove; A second bracket, the second bracket is disposed at the second end of the circuit board; A first group of electronic components, the first group of electronic components is disposed on the first surface and between the first bracket and the second bracket; and An elastic connecting member, one side of the elastic connecting member is fixedly connected to the circuit board, and the other side of the elastic connecting member abuts against the first inner wall surface.

2. The electronic device according to claim 1, wherein The first bracket and the second bracket are two separate brackets, and the first bracket and the second bracket are respectively disposed at the first end and the second end of the circuit board.

3. The electronic device according to claim 1, wherein The first bracket portion includes: A substrate portion, the substrate portion includes opposite second surface and fourth surface, and the second surface faces the first surface; An elastic adhesive material, the elastic adhesive material is disposed on the fourth surface, and the elastic adhesive material forms the elastic soft structure.

4. The electronic device according to claim 3, characterized in that, The elastic adhesive material is integrally formed with the substrate portion.

5. The electronic device according to claim 3 or 4, characterized in that The height by which the elastic adhesive material protrudes from the fourth surface is greater than or equal to 0.05 millimeters.

6. The electronic device according to claim 3 or 4, characterized in that, A first adhesive material is provided between the first surface and the second surface.

7. The electronic device according to claim 3, wherein The circuit board further includes a first side surface connected to the first surface, the first bracket further includes a second bracket portion, the second bracket portion is located on the side facing the first side surface, and the second bracket portion is disposed on the second surface.

8. The electronic device according to claim 7, wherein The second bracket portion is in direct contact with the first side surface of the circuit board.

9. The electronic device according to claim 7, wherein The circuit board further includes a second side surface connected to the first surface, and the second side surface is also connected to the first side surface; The first bracket further includes a third bracket portion, the third bracket portion is located on the side facing the second side surface, and the third bracket portion is disposed on the second surface.

10. The electronic device according to claim 9, wherein, The third bracket portion is in direct contact with the second side surface of the circuit board.

11. The electronic device according to claim 9 or 10, characterized in that, The third bracket portion is connected to the second bracket portion.

12. The electronic device according to any one of claims 1-4, characterized in that, The first notch is configured to apply a force to the first bracket through the first notch when disassembling the circuit board assembly, so as to take out the circuit board assembly from the receiving groove.

13. The electronic device according to claim 12, characterized in that, The first notch is provided on the surface of the first bracket portion facing the opening of the receiving groove.

14. The electronic device according to claim 7, characterized in that, The circuit board further includes a third side opposite to the first side, a fourth side and a fifth side, and the distance from the first side to the third side is less than the distance from the fourth side to the third side.

15. The electronic device according to any one of claims 8-10, characterized in that, The circuit board further includes a third side opposite to the first side, a fourth side and a fifth side, and the distance from the first side to the third side is less than the distance from the fourth side to the third side.

16. The electronic device according to claim 3 or 4, characterized in that, The circuit board further includes a first side connected to the first surface and a third side opposite to the first side, and a first positioning portion is provided on the circuit board, and a second positioning portion cooperating with the first positioning portion is provided on the second surface.

17. The electronic device according to claim 16, wherein The first positioning portion is a notch recessed into and penetrating through the third side; the second positioning portion is a bump protruding from the second surface and cooperating with the notch.

18. The electronic device according to claim 17, wherein The bump is a square block protruding from the second surface.

19. The electronic device according to any one of claims 7-10, characterized in that, The circuit board further includes a third side opposite to the first side, a first positioning portion is provided on the circuit board, and a second positioning portion cooperating with the first positioning portion is provided on the second surface.

20. The electronic device according to claim 19, wherein The first positioning portion is a notch recessed into and penetrating through the third side; the second positioning portion is a bump protruding from the second surface and cooperating with the notch.

21. The electronic device according to claim 20, wherein The bump is a square block protruding from the second surface.

22. The electronic device according to any one of claims 1-4, 7-10, 14, 17-18, and 20-21, characterized in that, The elastic connecting member is welded to the circuit board.

23. The electronic device according to claim 22, characterized in that, The number of the elastic connecting members is two, and the two elastic connecting members are respectively located on both sides of the first group of electronic components.

24. The electronic device according to claim 14, wherein The arrangement direction of the first side and the third side is the second direction. In the second direction, the bracket includes a seventh side and an eighth side opposite to each other. The seventh side is located on the side of the fourth side away from the third side, and the eighth side is located on the side of the fourth side away from the seventh side.

25. The electronic device according to claim 24, wherein The seventh side includes the side of the first bracket portion and the side of the second bracket portion. Among them, the side of the first bracket portion and the side of the second bracket portion are in the same plane.

26. The electronic device according to claim 24 or 25, characterized in that, The eighth side is located between the third side and the fourth side.

27. The electronic device according to claim 9 or 10, characterized in that, The circuit board is connected to at least one of the first bracket portion, the second bracket portion and the third bracket portion.

28. The electronic device according to any one of claims 1-4, characterized in that, The accommodating groove further includes a third inner wall surface connected between the first inner wall surface and the second inner wall surface, and the distance between the first bracket and the third inner wall surface is less than or equal to 0.15 millimeters.

29. The electronic device according to any one of claims 1-4, characterized in that The accommodating groove further includes a third inner wall surface connected between the first inner wall surface and the second inner wall surface, and the first notch is on the side of the bracket close to the third inner wall surface.

30. The electronic device according to any one of claims 1-4, characterized in that, The housing further includes a frame, the frame includes a sixth surface, and the accommodating groove is provided on the sixth surface.

31. The electronic device according to claim 30, wherein The sixth surface is further provided with an avoidance groove, and the avoidance groove communicates with the accommodating groove.

32. The electronic device according to claim 24 or 25, characterized in that, In the second direction, the distance from the eighth side to the third side is less than or equal to 0.15 millimeters.

33. The electronic device according to claim 3 or 4, characterized in that, The substrate portion is provided with an avoidance groove, an opening of the avoidance groove faces the first surface, and at least a part of the first group of electronic components is received in the avoidance groove.

34. The electronic device according to claim 7 or 8, characterized in that, The circuit board further includes a third surface opposite to the first surface, the second bracket portion further includes a fifth surface opposite to the second surface, and a distance from the third surface to the fourth surface is greater than or equal to a distance from the fifth surface to the fourth surface.

35. The electronic device according to claim 34, wherein The circuit board assembly further includes a protruding portion, the protruding portion is disposed on the fifth surface, the protruding portion extends along a direction in which the fifth surface is away from the second surface, and the protruding portion protrudes from the third surface.

36. The electronic device according to claim 35, wherein The circuit board assembly further includes a second group of electronic components, and the second group of electronic components is disposed on the third surface.

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