Maintenance method and manufacturing method of electronic component

Abstract

The maintenance method is a maintenance method of a cutting apparatus. The cutting apparatus is configured to manufacture an electronic component by cutting a packaging substrate, and perform appearance inspection of the electronic component based on first image data. The first image data is generated by capturing the electronic component arranged on a worktable with a camera. The maintenance method includes a step of capturing a standard test piece arranged on the worktable with the camera to generate second image data, a step of calculating a length of the standard test piece based on the second image data, and a step of comparing the calculated length of the standard test piece with a reference value related to the length of the standard test piece stored in the cutting apparatus, and determining whether adjustment for the appearance inspection is required based on the comparison result.

Description

Technical Field

[0001] This invention relates to maintenance methods and methods for manufacturing electronic components. Background Technology

[0002] Japanese Patent Publication No. 2019-201143 (Patent Document 1) discloses an inspection method for measuring the pixel size of an imaging unit included in a processing apparatus. In this inspection method, an inspection fixture is used to measure the pixel size. A pattern and a two-dimensional barcode recording the width of the pattern are formed on the surface of the inspection fixture. In this inspection method, the pattern formed on the surface of the inspection fixture is photographed, and the number of pixels corresponding to the width of the pattern is measured. Then, the pixel size is calculated by dividing the width of the pattern read from the two-dimensional barcode by the number of pixels corresponding to the width of the pattern (see Patent Document 1).

[0003] Patent Document 1: Japanese Patent Publication No. 2019-201143

[0004] In cutting apparatuses that manufacture electronic components by cutting packaged substrates, visual inspection of the electronic components is sometimes required. Visual inspection of electronic components is performed, for example, by photographing the electronic components positioned on an inspection table. If a long period of time has passed since the cutting apparatus was first used, the quality of the visual inspection may deteriorate. However, Patent Document 1 mentioned above does not disclose a technique for consistently maintaining the quality of the visual inspection. Summary of the Invention

[0005] This invention was made to solve such problems, and its purpose is to provide a maintenance method for continuously maintaining the appearance inspection quality of electronic components in a cutting device and a method for manufacturing electronic components.

[0006] According to one aspect of the present invention, a maintenance method for a cutting device is provided. The cutting device is configured to manufacture electronic components by cutting a packaged substrate and to perform visual inspection of the electronic components based on first image data. The first image data is generated by photographing the electronic components disposed on a worktable using a camera. The maintenance method includes the steps of: photographing a standard test piece disposed on the worktable using a camera to generate second image data; calculating the length of the standard test piece based on the second image data; and comparing the calculated length of the standard test piece with a reference value related to the length of the standard test piece stored in the cutting device, and determining whether adjustments for visual inspection are necessary based on the comparison result.

[0007] According to another aspect of the present invention, a method for manufacturing an electronic component is a method for manufacturing an electronic component using the above-described maintenance method. This method includes the step of manufacturing the electronic component by cutting a packaging substrate after using the above-described maintenance method.

[0008] Invention Effects

[0009] According to the present invention, a maintenance method for continuously maintaining the appearance inspection quality of electronic components in a cutting device and a method for manufacturing electronic components can be provided. Attached Figure Description

[0010] Figure 1 This is a schematic top view of the cutting device.

[0011] Figure 2 This is a schematic side view of the spindle section.

[0012] Figure 3 This diagram schematically illustrates the use of a second optical inspection camera for inspection.

[0013] Figure 4 It is a diagram that schematically illustrates the hardware structure of a computer.

[0014] Figure 5 This is a schematic diagram illustrating the second optical inspection camera used when photographing the calibration plate.

[0015] Figure 6 This is a perspective view schematically showing an example of a calibration fixture.

[0016] Figure 7 It is a schematic diagram showing the plane of the calibration plate.

[0017] Figure 8 This is a schematic diagram illustrating the second optical inspection camera used when photographing standard test pieces.

[0018] Figure 9 This is a perspective view schematically illustrating an example of a maintenance fixture.

[0019] Figure 10 This is a diagram that schematically illustrates an example of a patterned section.

[0020] Figure 11 This is an example diagram schematically showing the pin layout of a QFN package.

[0021] Figure 12 This is an example diagram schematically showing a substrate surface of a BGA package.

[0022] Figure 13This is an example diagram that schematically illustrates the pattern of the molded surface of the package.

[0023] Figure 14 This is a flowchart illustrating the operating procedures performed after assembling the cutting device.

[0024] Figure 15 This is a flowchart illustrating the operating procedures performed according to the maintenance sequence of the disconnection device.

[0025] Explanation of reference numerals in the attached figures

[0026] 1. Cutting device; 3. Substrate supply unit; 4. Positioning unit; 4a. Track unit; 5. Cutting table; 5a. Holding component; 5b. Rotating mechanism; 5c. Moving mechanism; 5d. First position confirmation camera; 5e. First cleaner; 6. Spindle unit; 6a. Blade; 6b. Second position confirmation camera; 6c. Rotating shaft; 6d. First flange; 6e. Second flange; 6f. Fastening component; 7. Conveying unit; 7a. Second cleaner; 11. Inspection table; 12. First optical inspection camera; 12a, 13a. Illumination device; 13. Second optical inspection camera; 14. Placement unit; 15. Extraction unit; 15a. Good product tray; 15b. Defective product tray; 20. Monitor; 50. Computer; 70. Computation unit; 72. CPU; 74. RAM; 76. ROM; 80. Storage unit. 81 Control program, 90 Input / output (I / F), 100, 200 Fixtures, 110 Base, 120 Holding plate, 124 Recess, 130 Calibration plate, 112 Threaded hole, 114 Pressing component, 114A First face, 114B Bending part, 114c Second face, 116, 122, 212 Screws, 210 Standard test piece, 220 Pattern part, 221, 222, 223, 224, 225 QFN pattern, 231, 232, 233, 234, 235 BGA pattern, 241, 242, 243, 244 Marking pattern, 229, 239, 249 Drawing, A1 Cutting module, B1 Inspection and storage module, D1 Point, M1 Material box, P1 Packaging substrate, S1 Electronic components. Detailed Implementation

[0027] Hereinafter, an embodiment of one aspect of the present invention (hereinafter also referred to as "this embodiment") will be described in detail with reference to the accompanying drawings. Furthermore, the same or equivalent parts in the drawings are labeled with the same reference numerals, and their descriptions are not repeated. Additionally, for ease of understanding, the objects in the drawings are appropriately omitted or exaggerated schematically depicted.

[0028] [1. Composition]

[0029] <1-1. Overall Structure of the Cutting Device>

[0030] Figure 1This is a schematic top view of the cutting device 1 used in the maintenance method of this embodiment. The cutting device 1 is configured to cut the packaging substrate (the object to be cut) to monolithically divide the packaging substrate into multiple electronic components (packaging components). In the packaging substrate, the substrate or lead frame on which the semiconductor chip is mounted is sealed with resin.

[0031] Examples of packaging substrates include BGA (Ball Grid Array) packaging substrates, LGA (Land Grid Array) packaging substrates, CSP (Chip Size Package) packaging substrates, LED (Light Emitting Diode) packaging substrates, and QFN (Quad Flat No-leaded) packaging substrates.

[0032] Furthermore, the cutting device 1 is configured to inspect each of the multiple monolithically processed electronic components individually. In the cutting device 1, images of each electronic component are captured, and inspections are performed based on these images. Inspection data is generated from this inspection, and each electronic component is classified as either "good" or "defective."

[0033] In this example, the packaging substrate P1 is used as the object to be cut, and the cutting device 1 is used to monolithize the packaging substrate P1 into multiple electronic components S1. Hereinafter, the surface of the packaging substrate P1 that is sealed with resin is called the molding surface, and the surface opposite to the molding surface is called the ball / lead surface.

[0034] like Figure 1 As shown, the cutting device 1 comprises a cutting module A1 and an inspection and storage module B1. The cutting module A1 is configured to manufacture multiple electronic components S1 by cutting the packaging substrate P1. The inspection and storage module B1 is configured to inspect each of the manufactured electronic components S1 and then store the electronic components S1 in a tray. In the cutting device 1, each component can be disassembled and replaced relative to the other components.

[0035] The cutting module A1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting table 5, a spindle unit 6, and a conveying unit 7.

[0036] The substrate supply unit 3 supplies the packaging substrates P1 one by one to the positioning unit 4 by pushing them out of the cassette M1 containing multiple packaging substrates P1. At this time, the packaging substrates P1 are configured such that the ball / lead surface faces upward.

[0037] The positioning unit 4 positions the packaging substrate P1 by placing it on the track unit 4a after it is pushed out from the substrate supply unit 3. Then, the positioning unit 4 transports the positioned packaging substrate P1 to the cutting table 5.

[0038] The cutting stage 5 holds the packaged substrate P to be cut. In this example, a cutting device 1 with a double cutting stage structure having two cutting stages 5 is illustrated. The cutting stage 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5a holds the packaged substrate P1 by adsorbing it from below, which is conveyed by the positioning part 4. The rotating mechanism 5b enables the holding member 5a to rotate about the θ1 direction in the figure. The moving mechanism 5c enables the holding member 5a to move along the Y-axis in the figure.

[0039] The spindle portion 6 cuts the package substrate P1 to monolithize the package substrate P1 into multiple electronic components S1. In this example, a cutting device 1 with a dual-spindle structure having two spindle portions 6 is shown. The spindle portions 6 are movable along the X-axis and Z-axis shown in the figure. Alternatively, the cutting device 1 can also be a single-spindle structure having one spindle portion 6.

[0040] Figure 2 This is a schematic side view of the spindle section 6. (Example) Figure 2 As shown, the spindle part 6 includes a blade 6a, a rotating shaft 6c, a first flange 6d, a second flange 6e, and a fastening member 6f.

[0041] The blade 6a cuts the packaging substrate P1 by high-speed rotation, thereby monolithically dividing the packaging substrate P1 into multiple electronic components S1. The blade 6a is mounted on the rotating shaft 6c while being held by one flange (first flange) 6d and another flange (second flange) 6e. The first flange 6d and the second flange 6e are fixed to the rotating shaft 6c by fastening components 6f such as nuts. The first flange 6d is also called the inner flange, and the second flange 6e is also called the outer flange.

[0042] The spindle section 6 is equipped with a cutting water nozzle for spraying cutting water onto the high-speed rotating blade 6a, a cooling water nozzle for spraying cooling water, and a cleaning water nozzle for spraying cleaning water to clean chips, etc. (none of which are shown).

[0043] Refer again Figure 1 After the cutting stage 5 picks up the packaging substrate P1, the first position confirmation camera 5d photographs the packaging substrate P1 to confirm its position. The confirmation performed using the first position confirmation camera 5d is, for example, confirming the position of a mark provided on the packaging substrate P1. This mark, for example, indicates the cutting position of the packaging substrate P1.

[0044] Then, the cutting stage 5 moves along the Y-axis towards the spindle portion 6 in the figure. After the cutting stage 5 moves below the spindle portion 6, the packaging substrate P1 is cut by moving the cutting stage 5 relative to the spindle portion 6. Then, the packaging substrate P1 is photographed using the second position confirmation camera 6b as needed to confirm the position of the packaging substrate P1, etc. The confirmation performed using the second position confirmation camera 6b is, for example, the confirmation of the cutting position and cutting width of the packaging substrate P1.

[0045] After the packaging substrate P1 is cut, the cutting stage 5 moves away from the mandrel 6 along the Y-axis in the figure, while adsorbing multiple monolithized electronic components S1. During this movement, the upper surface (ball / lead surface) of the electronic components S1 is cleaned and dried using the first cleaner 5e.

[0046] The conveying unit 7 picks up and holds the electronic component S1 on the cutting table 5 from above, and conveys the electronic component S1 to the inspection table 11 of the inspection and storage module B1. During this conveying process, the lower surface (molded surface) of the electronic component S1 is cleaned and dried using the second cleaner 7a.

[0047] The inspection and storage module B1 mainly includes an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, a placement unit 14, and an extraction unit 15. Alternatively, the first optical inspection camera 12 can also be mounted on the cutting module A1.

[0048] The inspection table 11 holds the electronic component S1 for optical inspection. The inspection table 11 can move along the X-axis shown in the figure. In addition, the inspection table 11 can be flipped up and down. A holding member is provided on the inspection table 11 to hold the electronic component S1 by adsorbing it.

[0049] The first optical inspection camera 12 and the second optical inspection camera 13 photograph both sides (ball / pin side and molded side) of the electronic component S1. Various inspections of the electronic component S1 are performed based on the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13. The first optical inspection camera 12 and the second optical inspection camera 13 are each arranged near the inspection table 11 in a manner that they photograph upwards.

[0050] An illumination device 12a is provided on the first optical inspection camera 12, and an illumination device 13a is provided on the second optical inspection camera 13. The illumination device 12a is configured to illuminate the inspection table 11 when inspection is performed using the first optical inspection camera 12. The illumination device 13a is configured to illuminate the inspection table 11 when inspection is performed using the second optical inspection camera 13.

[0051] The first optical inspection camera 12 captures the molded surface of the electronic component S1, which is conveyed from the transport unit 7 to the inspection table 11. Then, the transport unit 7 places the electronic component S1 onto the holding member of the inspection table 11. After the holding member holds the electronic component S1, the inspection table 11 is reversed vertically. The inspection table 11 moves upwards towards the second optical inspection camera 13, and the ball / pin surface of the electronic component S1 is captured by the second optical inspection camera 13. As an example, the inspection performed using the second optical inspection camera 13 is described below.

[0052] Figure 3 This diagram schematically illustrates the inspection process using the second optical inspection camera 13. (See diagram for example.) Figure 3 As shown, the inspection using the second optical inspection camera 13 is performed with the inspection table 11, which holds the electronic component S1 below, positioned above the second optical inspection camera 13. Specifically, image data is generated by photographing the electronic component S1 held on the inspection table 11 using the second optical inspection camera 13, and the appearance inspection of the ball / pin surfaces of the electronic component S1 is performed based on the generated image data. As described above, the appearance inspection of the molded surfaces of the electronic component S1 is performed by the first optical inspection camera 12.

[0053] Refer again Figure 1 The inspected electronic component S1 is placed in the placement unit 14. The placement unit 14 is movable along the Y-axis shown in the figure. The inspection table 11 places the inspected electronic component S1 in the placement unit 14.

[0054] The extraction unit 15 transfers the electronic components S1 arranged in the arrangement unit 14 to a tray. Based on the results of inspection using the first optical inspection camera 12 and the second optical inspection camera 13, the electronic components S1 are classified as "good" or "defective". Based on the classification results, the extraction unit 15 transfers each electronic component S1 to a good product tray 15a or a defective product tray 15b. That is, good products are stored in the good product tray 15a, and defective products are stored in the defective product tray 15b. When both the good product tray 15a and the defective product tray 15b are filled with electronic components S1, they are replaced with new trays.

[0055] The cutting device 1 also includes a computer 50 and a monitor 20. The monitor 20 is configured to display images. The monitor 20 is, for example, a liquid crystal monitor or an organic EL (Electro Luminescence) monitor.

[0056] Computer 50 controls the operation of various components of cutting module A1 and inspection and storage module B1, for example. Computer 50 controls the operation of components such as substrate supply unit 3, positioning unit 4, cutting table 5, spindle unit 6, conveying unit 7, inspection table 11, first optical inspection camera 12, second optical inspection camera 13, placement unit 14, extraction unit 15 and monitor 20.

[0057] Furthermore, the computer 50 performs various inspections of the electronic component S1, for example, based on image data generated by the first optical inspection camera 12 and the second optical inspection camera 13. The computer 50 will now be described in detail.

[0058] <1-2. Computer Hardware Structure>

[0059] Figure 4 This is a schematic diagram illustrating the hardware structure of computer 50. (For example...) Figure 4 As shown, the computer 50 includes an arithmetic unit 70, an input / output (I / F) (interface) 90, and a storage unit 80, each of which is electrically connected via a bus.

[0060] The arithmetic unit 70 includes a CPU (Central Processing Unit) 72, RAM (Random Access Memory) 74, and ROM (Read Only Memory) 76. The arithmetic unit 70 is configured to process information and control the various components within the computer 50 and the various components within the cutting device 1.

[0061] The input / output I / F90 is configured to communicate with each component included in the cutting device 1 via signal lines. The input / output I / F90 is used to send data from the computer 50 to each component in the cutting device 1 and to receive data sent from each component in the cutting device 1 to the computer 50.

[0062] The storage unit 80 is, for example, an auxiliary storage device such as a hard disk drive or a solid-state drive. The storage unit 80 is configured, for example, as a storage control program 81. The storage unit 80 can also store inspection data generated by inspection using the first optical inspection camera 12 and the second optical inspection camera 13.

[0063] [2. Quality assurance through visual inspection]

[0064] As described above, in the cutting device 1, an appearance inspection of the molded surface of the electronic component S1 (hereinafter also referred to as "first appearance inspection") is performed based on the image captured by the first optical inspection camera 12, and an appearance inspection of the ball / pin surface of the electronic component S1 (hereinafter also referred to as "second appearance inspection") is performed based on the image captured by the second optical inspection camera 13. In each appearance inspection, for example, information about the pixel size of each camera (hereinafter also referred to as "pixel size information") is used. Pixel size (image resolution) refers to the actual length of the object being photographed corresponding to one side of each pixel of the camera. For example, if the length of one side of the object photographed by one pixel of the camera is 1 mm, the pixel size is 1 mm.

[0065] The pixel size of each camera is calculated during calibration. Camera calibration is performed, for example, after the cutting device 1 is installed. The first optical inspection camera 12 is calibrated by taking a picture of the calibration plate 130 (described later) held on the transport unit 7. Similarly, the second optical inspection camera 13 is calibrated by taking a picture of the calibration plate 130 held on the inspection table 11. Camera calibration will be explained in detail later.

[0066] The quality of the first visual inspection is affected by the accuracy of the pixel size information of the first optical inspection camera 12. The higher the accuracy of the pixel size information of the first optical inspection camera 12, the higher the quality of the first visual inspection. Similarly, the quality of the second visual inspection is affected by the accuracy of the pixel size information of the second optical inspection camera 13. The higher the accuracy of the pixel size information of the second optical inspection camera 13, the higher the quality of the second visual inspection.

[0067] The accuracy of the pixel size information of the first optical inspection camera 12 is affected by the relative tilt between the first optical inspection camera 12 and the calibration plate 130 (transportation unit 7) during calibration. When calibrating the first optical inspection camera 12, the closer the optical axis of the first optical inspection camera 12 is to being perpendicular to the calibration plate 130, the higher the accuracy of the pixel size information of the first optical inspection camera 12.

[0068] Furthermore, the accuracy of the pixel size information of the second optical inspection camera 13 is affected by the relative tilt between the second optical inspection camera 13 and the calibration plate 130 (inspection stage 11) during the calibration of the second optical inspection camera 13. When calibrating the second optical inspection camera 13, the closer the optical axis of the second optical inspection camera 13 is to being perpendicular to the calibration plate 130, the higher the accuracy of the pixel size information of the second optical inspection camera 13.

[0069] Furthermore, the quality of the first visual inspection is affected, for example, by the relative tilt between the first optical inspection camera 12 and the electronic component S1 (transport unit 7) during the first visual inspection of the electronic component S1. During the first visual inspection, the closer the optical axis of the first optical inspection camera 12 is to being perpendicular to the electronic component S1, the higher the quality of the first visual inspection. Similarly, the quality of the second visual inspection is affected, for example, by the relative tilt between the second optical inspection camera 13 and the electronic component S1 (inspection table 11) during the second visual inspection of the electronic component S1. During the second visual inspection, the closer the optical axis of the second optical inspection camera 13 is to being perpendicular to the electronic component S1, the higher the quality of the second visual inspection.

[0070] Therefore, in order to ensure the quality of the first visual inspection, it is necessary to manage the relative tilt between the first optical inspection camera 12 and the transport unit 7. In addition, in order to ensure the quality of the second visual inspection, it is necessary to manage the relative tilt between the second optical inspection camera 13 and the inspection table 11.

[0071] In the cutting device 1, before calibrating the first optical inspection camera 12, the relative tilt between the first optical inspection camera 12 and the calibration plate 130 (conveyor 7) is calculated. Similarly, before calibrating the second optical inspection camera 13, the relative tilt between the second optical inspection camera 13 and the calibration plate 130 (inspection table 11) is calculated. The calculation of the relative tilt between the first optical inspection camera 12 and the calibration plate 130, and the calculation of the relative tilt between the second optical inspection camera 13 and the calibration plate 130, are performed essentially in the same way. Here, the method for calculating the relative tilt between the second optical inspection camera 13 and the calibration plate 130 will be described representatively.

[0072] Figure 5 This is a schematic diagram illustrating the second optical inspection camera 13 when photographing the calibration plate 130. (See diagram below.) Figure 5 As shown, when the calibration plate 130 is photographed using the second optical inspection camera 13, the inspection table 11 is positioned above the second optical inspection camera 13. A clamp 100 is disposed on the lower surface of the inspection table 11. The clamp 100 is fixed to a predetermined position on the lower surface of the inspection table 11 by fixing components such as screws. Since the clamp 100 is fixed to the inspection table 11 by fixing components, the position of the clamp 100 on the inspection table 11 becomes a predetermined predetermined position. For example, at the predetermined position, the center position of the clamp 100 coincides with the center position of the inspection table 11.

[0073] Figure 6 This is a perspective view schematically showing an example of a calibration fixture 100. (See diagram below.) Figure 6As shown, the fixture 100 includes a base 110, a retaining plate 120, and a calibration plate 130. Each of the base 110, retaining plate 120, and calibration plate 130 is a rectangular plate-shaped component when viewed from above. The calibration plate 130 is disposed within a recess 124 formed in the retaining plate 120 and is fixed to the retaining plate 120 by pressing the head of a screw 122 against the vicinity of each of the four corners of the calibration plate 130.

[0074] Figure 7 This is a schematic diagram showing the plane of the calibration plate 130. (See diagram for example.) Figure 7 As shown, a predetermined pattern is formed on the calibration plate 130. The predetermined pattern is formed on the calibration plate 130, for example, by printing or cutting. In this example, a plurality of dots D1 are printed on the calibration plate 130. Information related to the predetermined pattern is, for example, pre-stored in the storage unit 80. Figure 4 As an example of information related to a specified pattern, the diameter of point D1 and the length between points D1 can be given.

[0075] Refer again Figure 6 The retaining plate 120 is secured to the base 110 by pressing the vicinity of each of its four corners with pressing members 114. Each pressing member 114 includes a first face 114a, a curved portion 114b, and a second face 114c. The curved portion 114b is curved relative to each of the first face 114a and the second face 114c. In plan view, the first face 114a and the second face 114c extend from the curved portion 114b in opposite directions to each other. The second face 114c is secured to the base 110 by screws 116, and the first face 114a presses the retaining plate 120 toward the base 110. Thus, the retaining plate 120 is secured to the base 110. A plurality of threaded holes 112 are formed in the base 110. By passing screws through the threaded holes 112, the clamp 100 is secured in a predetermined position on the inspection table 11. With the fixture 100 fixed in the designated position on the inspection table 11, the center position of the calibration plate 130 coincides, for example, with the center position of the electronic component S1 during the second visual inspection.

[0076] Refer again Figure 5 The second optical inspection camera 13 captures images of the calibration plate 130 included in the fixture 100 and generates image data. In the cutting device 1, the relative tilt between the second optical inspection camera 13 and the calibration plate 130 is calculated based on the generated image data. In the cutting device 1, for example, the relative tilt in each of the θ1, θ2, and θ3 directions shown in the figure is calculated. The relative tilt between the second optical inspection camera 13 and the calibration plate 130 is calculated, for example, based on the degree of skewness of the pattern (e.g., multiple points D1) of the calibration plate 130 in the captured image.

[0077] Thus, in the cutting device 1, before calibrating the first optical inspection camera 12, the relative tilt between the first optical inspection camera 12 and the calibration plate 130 (transport section 7) is calculated. Similarly, before calibrating the second optical inspection camera 13, the relative tilt between the second optical inspection camera 13 and the calibration plate 130 (inspection table 11) is calculated. According to the cutting device 1, each camera is calibrated only after confirming that there are no issues with the relative tilt between each camera and the calibration plate 130, thereby ensuring the calibration accuracy of each camera. As a result, the quality of each appearance inspection can be guaranteed according to the cutting device 1.

[0078] When the cutting device 1 has been in use for an extended period of time, for example, the relative tilt between the cameras and the transport section 7 or the inspection table 11 may change. In this case, the quality of the appearance inspection will be reduced. In addition, the quality of the appearance inspection may be reduced for various other reasons. Maintenance is performed on the cutting device 1 to suppress the decline in the quality of the appearance inspection. If it is determined that various adjustments for appearance inspection are required through maintenance, the necessary adjustments are made. Maintenance is performed by taking pictures of standard test pieces 210 (described later) with each camera. Since the maintenance methods using each of the first optical inspection cameras 12 and the second optical inspection camera 13 are basically the same, only the maintenance method using the second optical inspection camera 13 will be described here as representative.

[0079] Figure 8 This is a schematic diagram illustrating the second optical inspection camera 13 when photographing the standard test piece 210. (See diagram below.) Figure 8 As shown, when photographing the standard test piece 210 using the second optical inspection camera 13, the inspection table 11 is positioned above the second optical inspection camera 13. A clamp 200 is disposed on the lower surface of the inspection table 11. The clamp 200 is fixed to a predetermined position on the lower surface of the inspection table 11 by screws or other fixing components. Because the clamp 200 is fixed to the inspection table 11 by the fixing components, the position of the clamp 200 on the inspection table 11 becomes a predetermined position. For example, at the predetermined position, the center position of the clamp 200 coincides with the center position of the inspection table 11.

[0080] Figure 9 This is a perspective view schematically illustrating an example of a maintenance clamp 200. (See diagram below.) Figure 9 As shown, the fixture 200 includes a base 110 and a standard test piece 210. The standard test piece 210 is a rectangular plate-shaped member when viewed from above. A patterned portion 220 is formed on the standard test piece 210. The patterned portion 220 is formed on the standard test piece 210, for example, by printing or cutting.

[0081] The standard test piece 210 is fixed to the base 110 by being pressed by the pressing member 114 at every two locations near each long side (a total of four locations) and by being threaded by screws 212 at every three locations near each long side (a total of six locations). As described above, a plurality of threaded holes 112 are formed in the base 110. By passing screws through the threaded holes 112, the clamp 200 is fixed in a predetermined position on the inspection table 11.

[0082] Figure 10 This is a schematic diagram illustrating an example of the pattern section 220. (As shown...) Figure 10 As shown, the pattern section 220 includes QFN patterns 221-225, BGA patterns 231-235, and marking patterns 241-244. Each of the QFN patterns 221-225, BGA patterns 231-235, and marking patterns 241-244 contains patterns of multiple packages of the same type. For example, each package pattern represents a package without surface defects. Furthermore, the size of each of the QFN patterns 221-225, BGA patterns 231-235, and marking patterns 241-244 is larger than or equal to the imaging range of each of the first optical inspection cameras 12 and the second optical inspection cameras 13.

[0083] QFN patterns 221-225 each contain patterns of multiple QFN packages. The QFN package patterns contained in each of QFN patterns 221-225 represent the pin faces of the QFN packages.

[0084] Figure 11 This is an example diagram schematically showing the pin layout of a QFN package. (See diagram below.) Figure 11 As shown, Figure 229 represents the pin layout of a QFN package.

[0085] Refer again Figure 10 QFN patterns 221-225 each contain patterns of multiple QFN packages of the same size. QFN patterns 221, 222, 223, 224, and 225 each include patterns of QFN packages, for example, 2mm square, 3mm square, 5mm square, 7mm square, and 9mm square. Information related to the side lengths of each pattern is pre-stored in storage unit 80. Figure 4 )middle.

[0086] BGA patterns 231-235 each contain patterns of multiple BGA packages. The patterns of the BGA packages contained in each of BGA patterns 231-235 represent the spherical surface of the BGA package.

[0087] Figure 12 This is a schematic diagram illustrating an example of the spherical pattern of a BGA package. (See diagram below.) Figure 12 As shown, Figure 239 represents the spherical surface of a BGA package.

[0088] Refer again Figure 10 BGA patterns 231-235 each contain patterns of multiple BGA packages of the same size. BGA patterns 231, 232, 233, 234, and 235 each include patterns of BGA packages, for example, 2mm square, 4mm square, 8mm square, 10mm square, and 12mm square. Information related to the length of each side of each pattern is, for example, pre-stored in the storage unit 80.

[0089] Marking patterns 241-244 each contain patterns of multiple packages. The package patterns contained in each of marking patterns 241-244 represent the molded surface of the package. Each package pattern contains markings containing text, etc.

[0090] Figure 13 This is an example diagram schematically illustrating the pattern of the molded surface of the package. (See diagram for example.) Figure 13 As shown, Figure 249 represents the molded surface of the package. Markings, for example, containing the letters "ABC," are formed on the molded surface.

[0091] Refer again Figure 10 Each of the marking patterns 241-244 contains a pattern of multiple packages of the same size. Marking patterns 241, 242, 243, and 244 respectively contain patterns of packages with dimensions of, for example, 3mm square, 4mm square, 7mm square, and 12mm square. Information related to the length of each side of each pattern is stored in the storage unit 80 in advance.

[0092] Refer again Figure 8 The second optical inspection camera 13 is positioned below the subject pattern among the multiple patterns included in the standard test piece 210. For example, if the electronic component manufactured by the cutting device 1 is a 2mm square QFN package, the second optical inspection camera 13 is positioned below the QFN pattern 221 in the standard test piece 210. In this state, the second optical inspection camera 13 photographs the standard test piece 210 and generates image data.

[0093] In the cutting device 1, the length of one side of the captured QFN package pattern is calculated based on the generated image data, for example. Specifically, the length of one side of the QFN package pattern is calculated by accumulating the number of pixels corresponding to one side of the QFN package pattern in the captured image and the pixel size calculated during the calibration of the second optical inspection camera 13. Based on the difference between the calculated side length and the side length (reference value) stored in the storage unit 80, it is determined whether various adjustments for appearance inspection are required.

[0094] In this way, the accuracy of pixel size information is confirmed during maintenance in the cutting device 1. Based on the cutting device 1, the appearance inspection of electronic component S1 is performed after confirming that the accuracy of the pixel size information is not problematic during maintenance, thus continuously ensuring the appearance inspection quality of electronic component S1. The operation of the cutting device 1 will be described in detail below.

[0095] [3. Manufacturing operations of electronic components]

[0096] <3-1. Operation after assembling the cutting device>

[0097] Figure 14 This is a flowchart illustrating the operating procedures performed after assembling the cutting device 1. (Refer to...) Figure 14 The operator assembles the calibration plate 130 (clamp 100) into the designated position on the inspection table 11 (step S100). The computer 50 controls the second optical inspection camera 13 to take pictures of the calibration plate 130 fixed on the inspection table 11 (step S105). The computer 50 calculates the relative tilt between the second optical inspection camera 13 and the calibration plate 130 based on the image data generated by the second optical inspection camera 13 (step S110).

[0098] The computer 50 controls the monitor 20 to display the calculated tilt information (step S115). Then, it is determined whether the relative tilt between the second optical inspection camera 13 and the calibration plate 130 is within a specified range. This determination is, for example, performed by an operator.

[0099] If it is determined that the relative tilt is not within the specified range (No in step S120), the tilt of at least one of the second optical inspection camera 13 and the calibration plate 130 (inspection table 11) is adjusted (step S125). This tilt adjustment is performed manually by the operator, for example.

[0100] On the other hand, if it is determined that the relative tilt is within the specified range ("Yes" in step S120), the computer 50 controls the second optical inspection camera 13 to capture images of the calibration plate 130 fixed on the inspection table 11 (step S130). The computer 50 performs calibration processing on the second optical inspection camera 13 based on the image data generated by the second optical inspection camera 13 (step S135). For example, the computer 50 calculates the pixel size of the second optical inspection camera 13 based on the image data generated by the second optical inspection camera 13 and information related to the specified pattern of the calibration plate 130 stored in the storage unit 80. Thus, the second optical inspection camera 13 is calibrated.

[0101] Computer 50 controls monitor 20 to display calibration results (e.g., pixel size of the second optical inspection camera 13) (step S140). Then, it determines whether recalibrating the second optical inspection camera 13 is necessary (step S145). For example, if the calculated pixel size does not meet the standard, it is determined that recalibration is necessary, while if the calculated pixel size meets the standard, it is determined that recalibration is not necessary. This determination is made, for example, by an operator.

[0102] If it is determined that recalibration of the second optical inspection camera 13 is required ("Yes" in step S145), there may be a reason in the assembly of the cutting device 1, so the cutting device 1 is reassembled (step S150). The reassembly of the cutting device 1 is performed, for example, by an operator.

[0103] If it is determined that recalibration of the second optical inspection camera 13 is not required ("No" in step S145), and the calibration of the first optical inspection camera 12 is also completed, the manufacturing of the electronic component S1 in the cutting device 1 begins (step S155). Furthermore, the same operations corresponding to steps S100-S150 are performed in the first optical inspection camera 12 as in the second optical inspection camera 13.

[0104] Thus, in the cutting device 1, before calibrating the first optical inspection camera 12, the relative tilt between the first optical inspection camera 12 and the calibration plate 130 (transport section 7) is calculated. Similarly, before calibrating the second optical inspection camera 13, the relative tilt between the second optical inspection camera 13 and the calibration plate 130 (inspection table 11) is calculated. According to the cutting device 1, each camera is calibrated only after confirming that there are no issues with the relative tilt between each camera and the calibration plate 130, thereby ensuring the calibration accuracy of each camera. As a result, the quality of each appearance inspection can be guaranteed according to the cutting device 1.

[0105] <3-2. Operations in the Maintenance Sequence>

[0106] Figure 15 This is a flowchart illustrating the operating procedure performed according to the maintenance sequence of the disconnection device 1. (Refer to...) Figure 15 The operator assembles the standard test piece 210 (clamp 200) at the designated position on the inspection table 11 (step S200). The computer 50 controls the second optical inspection camera 13 to take pictures of the standard test piece 210 fixed on the inspection table 11 (step S205).

[0107] Based on the image data generated by the second optical inspection camera 13, the computer 50 calculates the length of the object area of ​​the standard test piece 210 (step S210). For example, the computer 50 calculates the length of one side of the pattern (encapsulated pattern) that is the object to be photographed. The computer 50 compares the calculated length of one side with the length of one side of the pattern of the object to be photographed (reference value) pre-stored in the storage unit 80 (step S215).

[0108] Computer 50 determines whether adjustments for appearance inspection are needed based on the comparison results (step S220). For example, if the difference between the calculated side length and the reference value is greater than or equal to a first predetermined value, it is determined that adjustments for appearance inspection are needed; if the difference between the calculated side length and the reference value is less than the first predetermined value, it is determined that adjustments for appearance inspection are not needed.

[0109] If it is determined that no adjustments for visual inspection are required ("No" in step S220), and the adjustments related to the first optical inspection camera 12 are also completed, the manufacturing of the electronic component S1 in the cutting device 1 begins (step S250). Furthermore, the first optical inspection camera 12 also performs the operations corresponding to steps S200-S240, just like the second optical inspection camera 13.

[0110] On the other hand, if it is determined that adjustments for appearance inspection are required ("Yes" in step S220), the computer 50 determines whether calibration of the second optical inspection camera 13 is required (step S225). For example, if the difference between the calculated side length and the reference value is a second predetermined value (the second predetermined value > the first predetermined value) or higher, it is determined that calibration of the second optical inspection camera 13 is required; if the difference between the calculated side length and the reference value is less than the second predetermined value, it is determined that calibration of the second optical inspection camera 13 is not required.

[0111] If it is determined that calibration of the second optical inspection camera 13 is required ("Yes" in step S225), then for example, the calibration is performed. Figure 14 The operation (calibration process) is shown in the flowchart (step S230). On the other hand, if it is determined that calibration of the second optical inspection camera 13 is not required ("No" in step S225), various parameters affecting the appearance inspection are adjusted. As an example of various parameters, parameters related to the illuminance of the illumination device 13a can be listed. The adjustment of various parameters is performed, for example, by the operator.

[0112] Then, it is determined whether further adjustments for visual inspection are needed (step S240). This determination is made, for example, by a worker. If it is determined that further adjustments are needed ("Yes" in step S240), the operation of step S200 is performed again. On the other hand, if it is determined that further adjustments are not needed ("No" in step S240), and the adjustments related to the first optical inspection camera 12 are also completed, the manufacturing of the electronic component S1 in the cutting device 1 begins (step S250).

[0113] Thus, in the cutting device 1, the accuracy of pixel size information is confirmed during maintenance, and the necessity of recalibrating each camera is determined. Based on the cutting device 1, the visual inspection of electronic component S1 is performed after confirming that the accuracy of pixel size information is not an issue during maintenance, thereby continuously ensuring the quality of the visual inspection of electronic component S1.

[0114] [4. Characteristics]

[0115] As described above, in the cutting device 1, the accuracy of the pixel size information is confirmed during maintenance. Based on the cutting device 1, the appearance inspection of the electronic component S1 is performed after confirming that the accuracy of the pixel size information is not problematic during maintenance, thus ensuring the continuous quality of the appearance inspection of the electronic component S1.

[0116] Furthermore, the cutting device 1 is an example of a "cutting device" in this invention. The respective first optical inspection cameras 12 and second optical inspection cameras 13 are examples of "cameras" in this invention. The packaging substrate P1 is an example of a "packaging substrate" in this invention. The electronic component S1 is an example of an "electronic component" in this invention. The respective transport units 7 and inspection tables 11 are examples of "worktables" in this invention. The standard test piece 210 is an example of a "standard test piece" in this invention.

[0117] [5. Other Implementation Methods]

[0118] The ideas behind the above-described embodiments are not limited to those described above. Below, examples of other embodiments that can apply the ideas described above will be given.

[0119] <5-1>

[0120] In the above embodiment, the relative tilt between the first optical inspection camera 12 and the calibration plate 130 (transport section 7) is calculated before calibrating the first optical inspection camera 12, and the relative tilt between the second optical inspection camera 13 and the calibration plate 130 (inspection table 11) is calculated before calibrating the second optical inspection camera 13. However, it is not necessarily necessary to perform these relative tilt calculations. At least it is sufficient to determine whether adjustments for visual inspection are required during maintenance of the cutting device 1.

[0121] <5-2>

[0122] Furthermore, in the above embodiment, the relative tilt between the calibration plate 130 and the first optical inspection camera 12 is calculated before the calibration of the first optical inspection camera 12, and the relative tilt between the calibration plate 130 and the second optical inspection camera 13 is calculated before the calibration of the second optical inspection camera 13. However, it is not necessary to calculate the relative tilt between the camera and the calibration plate 130 before calibrating each camera. At least for one camera, it is sufficient to calculate the relative tilt between the camera and the calibration plate 130 before calibrating the camera.

[0123] <5-3>

[0124] Furthermore, in the above embodiment, during maintenance of the cutting device 1, the accuracy of the pixel size information of each of the first optical inspection camera 12 and the second optical inspection camera 13 was verified. However, it is not necessary to verify the accuracy of the pixel size information of both the first optical inspection camera 12 and the second optical inspection camera 13. For example, it is also possible to configure the device to verify the accuracy of the pixel size information of either the first optical inspection camera 12 or the second optical inspection camera 13.

[0125] <5-4>

[0126] In addition, the calibration of each camera may also include calculating the size of the shooting range (field of view) of each camera.

[0127] <5-5>

[0128] Additionally, during the visual inspection of electronic component S1, the corners of electronic component S1 can also be detected. In this case, the corners of electronic component S1 can be detected based on the amount of brightness change in the captured image. Figure 15 The parameters adjusted in step S235 may also include a threshold for detecting the amount of brightness change at the corner of the electronic component S1.

[0129] <5-6>

[0130] in addition, Figure 14 and Figure 15Some operations in the flowchart are performed by operators (humans). However, each operation can also be performed automatically by the cutting device 1. For example, each decision can also be made by the computer 50 instead of by operators.

[0131] <5-7>

[0132] Additionally, a rectangular package pattern is formed on the standard test piece 210. However, the shape of the pattern formed on the standard test piece 210 is not limited to rectangle. For example, a special shape such as a micro SD (registered trademark) can also be formed on the standard test piece 210. Furthermore, patterns for packages other than QFN packages and BGA packages (LGA packages, CSP packages, etc.) can also be formed on the standard test piece 210.

[0133] The embodiments of the present invention have been described above by way of example. That is, the detailed description and drawings have been disclosed for illustrative purposes. Therefore, the constituent elements described in the detailed description and drawings may include those that are not essential for solving the problem. Therefore, these non-essential constituent elements should not be assumed to be essential simply because they are described in the detailed description and drawings.

[0134] Furthermore, the above-described embodiments are merely examples of the present invention in all respects. Various modifications and alterations can be made to the above-described embodiments within the scope of the present invention. That is, when implementing the present invention, specific structures can be appropriately adopted according to the embodiments.

Claims

1. A maintenance method for a cutting device. The cutting device is configured to manufacture electronic components by cutting a packaging substrate, and to perform an appearance inspection of the electronic components based on first image data. The first image data is generated by photographing the electronic components configured on the worktable using a camera. The maintenance method includes: The step of using the camera to photograph a standard test piece arranged on the workbench and generating second image data; The step of calculating the length of the standard test piece based on the second image data; The step of comparing the calculated length of the standard test piece with a reference value related to the length of the standard test piece stored in the cutting device, and determining whether adjustments for the appearance inspection are needed based on the comparison results; as well as If it is determined that adjustments are needed for the visual inspection, then the adjustment steps for the visual inspection are performed. The step of making adjustments for the visual inspection includes: adjusting the relative tilt between the worktable and the camera within a specified range.

2. The maintenance method according to claim 1, wherein, The adjustments used for the visual inspection are either camera calibration or parameter resetting related to the visual inspection.

3. The maintenance method according to claim 2, wherein, The calibration includes calculating the pixel size of the camera.

4. The maintenance method according to claim 2 or 3, wherein, The parameters include those related to illumination of the worktable.

5. A method for manufacturing an electronic component, wherein the method for manufacturing the electronic component uses the maintenance method according to any one of claims 1-4. The method for manufacturing the electronic component includes: The step of manufacturing the electronic component by cutting the packaging substrate after using the maintenance method described above.

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