A composite board impregnation masking process

Abstract

The present invention discloses a composite plate impregnation and masking process, comprising the following steps: step 1, affixing a protective film to the area of the plate to be impregnated; step 2, vapor-depositing thermal zirconium oxide using an evaporation device, and coating the area on the plate not covered by the protective film; step 3, tearing off the protective film on the surface of the plate after coating, and then starting the impregnation process; step 4, after the impregnation is completed, cooling and solidifying the coated zirconium dioxide, and then stripping after the curing is completed. The protective film in step 1 is provided with a hollow portion identical to the vapor-deposited area, and the vapor-depositing device in step 2 evaporates the zirconium dioxide by laser evaporation or magnetron sputtering, and then adheres to the area on the plate not blocked by the protective film. The present invention effectively improves the masking density, prevents the infiltration of dyeing liquid, does not leave residual offset, ensures the finished product effect, can effectively reduce manpower consumption, and improves work efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of dip dyeing, in particular to a composite board dip dyeing and masking process. Background Art

[0002] In the existing composite panel industry, there are a variety of semi-transparent processes with different techniques. In terms of clarity and transparency, immersion dyeing is the most popular. However, the immersion dyeing process is least adept at hollowing out a part without dyeing. The immersion dyeing process involves immersing the entire large / small piece of product in dyeing liquid, with a reciprocating motion from top to bottom. Any part that enters the dyeing liquid will be colored. It is impossible to hollow out a designed geometric shape at a specific position without dyeing to form the required transparent hole.

[0003] With the innovation and change of technology, some breakthrough technologies have emerged in the industry. For example, a protective film with a designed geometric shape is attached to a specific position to cover the position that does not need to be dyed, so that the dyeing liquid cannot penetrate during the soaking process. In this way, a specific geometric shape can be formed at a specific position without being colored, thus forming the required transparent hole.

[0004] However, there are two existing technical solutions. The first (Figure 2) applies a protective film with a specific geometric shape to a specific location, while the second (Figure 3) prints a protective adhesive with a specific geometric shape to a specific location. The former can cause the silicone on the protective film to fall off in high-temperature dyeing liquid, leaving residue / transfer on the product surface. The latter uses printing, which improves production compared to manual film application. However, screen printing cannot always achieve 100% density. Gaps exist between dots due to line diameter, and dye can penetrate through these gaps. After the protective adhesive is removed, the penetration rate through the holes decreases, failing to meet high transparency specifications. Summary of the Invention

[0005] The object of the present invention is to provide a composite board impregnation and masking process to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solution: comprising the following steps:

[0007] Step 1: Apply protective film to the area of the board to be dyed;

[0008] Step 2: Using a vapor deposition device to vapor-deposit thermal zirconium oxide, the area on the plate not covered by the protective film is covered with a film;

[0009] Step 3: Tear off the protective film on the surface of the board after lamination, and then start the dyeing work;

[0010] Step 4: After the impregnation is completed, the coated zirconium dioxide is cooled and solidified. After the solidification is completed, the coating is stripped.

[0011] Preferably, the protective film in step 1 is provided with a hollow portion identical to the vapor deposition area.

[0012] Preferably, the evaporation device in step 2 uses laser evaporation or magnetron sputtering to evaporate zirconium dioxide, and then adheres it to the area on the plate that is not blocked by the protective film, thereby forming a zirconium dioxide film.

[0013] Preferably, the cooling and solidification in step 4 is assisted by a cooling device to accelerate the solidification of the zirconium dioxide layer, and the stripping is carried out by chemical stripping.

[0014] Preferably, the thickness of the zirconium dioxide evaporated coating is between 10-20 nm.

[0015] Compared with the prior art, the beneficial effects of the invention are:

[0016] The present invention utilizes zirconium dioxide evaporation to coat the plate. This method of using evaporation to mask areas of the plate that do not need to be dyed effectively increases the masking density, avoids the infiltration of dyeing liquid, and prevents masking marks. After the dyeing is completed, the zirconium dioxide is de-plated and no offset residue is left, thereby ensuring the finished product effect. At the same time, all process steps are completed by mechanical equipment, which can effectively reduce manpower consumption and improve work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall process of a composite board dip-dyeing and masking process;

[0018] Figure 2 Schematic diagram of the film processing process;

[0019] Figure 3 is a schematic diagram of the screen printing process;

[0020] Figure 4 Schematic diagram of a composite board dip-dyeing and masking process. DETAILED DESCRIPTION

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] Example 1

[0023] See also Figure 1 and 4 , the present invention provides a technical solution, comprising the following steps:

[0024] Masking the dyeing area: Cover the area of the plate to be dyed with a protective film, and create a hollow area on the protective film corresponding to the area to be evaporated;

[0025] Evaporation: The zirconium dioxide is evaporated by laser evaporation or magnetron sputtering. The evaporated zirconium dioxide in vapor state adheres to the area on the plate that is not covered by the protective film, thereby coating the plate;

[0026] Dyeing: Tear off the protective film on the surface of the board after lamination to reveal the area that needs to be dyed, and then immerse the board into the dyeing tank to start the dyeing work;

[0027] Stripping: After the impregnation is completed, the coated zirconium dioxide is cooled and solidified by a cooling device to accelerate the cooling and solidification of the zirconium dioxide coating layer. After the solidification is completed, the stripping is carried out. The stripping is carried out chemically, using some weak acid or weak alkaline solutions, such as dilute hydrochloric acid or sodium hydroxide solution, to carry out chemical stripping. When selecting the stripping solution, it is necessary to ensure that it has little effect on the dye on the surface of the plate.

[0028] The thickness of the zirconium dioxide evaporated coating is between 10-20nm.

[0029] Example 2

[0030] See also Figure 1-4 The present invention provides a technical solution comprising the following steps:

[0031] Step 1: Apply a polyethylene protective film to the area of the board to be impregnated. The film has a certain degree of flexibility and wear resistance. Before applying the film, the surface of the substrate needs to be thoroughly cleaned to remove oil, dust and other impurities on the surface.

[0032] Step 2: The thermal zirconium oxide is evaporated using an evaporation device. Before evaporation, solvent cleaning, ultrasonic cleaning, plasma cleaning, etc. can be used. Alternatively, the surface of the substrate can be activated by chemical or physical methods to increase its surface activity, which is beneficial to the adhesion of the evaporated film, thereby coating the area on the plate not covered by the protective film;

[0033] Step 3: Tear off the protective film on the surface of the board after lamination, and then start the dyeing work;

[0034] Step 4: After the impregnation is completed, the coated zirconium dioxide is cooled and solidified. After the solidification is completed, the coating is stripped.

[0035] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0036] While the embodiments of the invention have been shown and described, it will be appreciated by those skilled in the art that many changes, modifications, substitutions, and alterations can be made to these embodiments without departing from the principles and spirit of the invention.

Claims

1. A composite board impregnation and masking process, characterized in that , including the following steps: Step 1: Apply protective film to the area of the board to be dyed; Step 2: Using a vapor deposition device to deposit thermal zirconium oxide, the area on the plate not covered by the protective film is coated; Step 3: Tear off the protective film on the surface of the plate after coating, and then start the dip-dyeing work; Step 4: After the impregnation is completed, the coated zirconium dioxide is cooled and solidified. After the solidification is completed, the coating is stripped.

2. The composite board impregnation and masking process according to claim 1, characterized in that: The protective film in step 1 is provided with a hollow portion identical to the vapor deposition area.

3. The composite board impregnation and masking process according to claim 1, characterized in that: The evaporation device in step 2 uses laser evaporation or magnetron sputtering to evaporate zirconium dioxide, and then adheres it to the area on the plate that is not blocked by the protective film, thereby forming a zirconium dioxide film.

4. The composite board impregnation and masking process according to claim 1, characterized in that: The cooling and solidification in step 4 is assisted by a cooling device to accelerate the solidification of the zirconium dioxide layer, and the stripping is carried out by chemical stripping.

5. The composite board impregnation and masking process according to claim 1, characterized in that: The thickness of the zirconium dioxide evaporated coating is between 10-20nm.

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