Anode target disk welding structure and anode target disk preparation method

Abstract

The application relates to an anode target disc welding structure and an anode target disc preparation method. The anode target disc welding structure comprises a ring-shaped base, a ring-shaped base body and solder. Two stop portions are recessed on one side of the ring-shaped surface of the ring-shaped base. A raised ring is formed between the two stop portions, and the surface of the raised ring is provided with a plurality of spaced grooves. The ring-shaped base body is located on one side of the ring-shaped base close to the stop portions. Two stop rings are protruded on the ring-shaped surface of the ring-shaped base body close to the ring-shaped base, and a containing groove is formed between the two stop rings. The containing groove corresponds to the raised ring and can accommodate the raised ring. The ring-shaped base body and the ring-shaped base have a preset containing space. The solder is located on the raised ring. The volume of the solder is not less than the volume of the preset containing space. The application can improve the connection strength and stability between the ring-shaped base and the ring-shaped base body, thereby improving the stability and reliability of the anode target disc work.

Description

Technical Field

[0001] This application relates to the field of medical device component manufacturing technology, and in particular to an anode target disk welding structure and an anode target disk manufacturing method. Background Technology

[0002] X-ray tubes are used to generate X-rays and play an important role in various fields such as medical diagnosis, security inspection, and non-destructive testing.

[0003] An X-ray tube consists of a vacuum tube and a cathode filament and an anode target disk housed within it. The cathode filament generates an electron beam directed at the anode target disk, and the surface of the anode target disk converts the kinetic energy of the electron beam into high-frequency electromagnetic waves, i.e., X-rays. The anode target disk typically includes a substrate and a base. The substrate generates X-rays when bombarded by electrons from the cathode filament, and the base serves for heat dissipation. Generally, the substrate is made of metal, and the base is made of graphite, with the substrate and base connected by brazing. However, the low connection strength between the substrate and base results in poor connection stability. Summary of the Invention

[0004] Therefore, it is necessary to provide an anode target welding structure and an anode target preparation method to address the above problems.

[0005] In a first aspect, this application provides an anode target welding structure, which includes an annular base, an annular substrate, and solder.

[0006] Two stop portions are recessed on one side of the annular surface of the annular base, one stop portion being located at the inner edge of the annular surface and the other stop portion being located at the outer edge of the annular surface. A raised ring is formed between the two stop portions, and the surface of the raised ring is provided with a plurality of grooves arranged at intervals.

[0007] The annular base is located on the side of the annular base near the stop portion. Two stop rings are protruding from the annular surface of the annular base near the annular base. One stop ring is located at the inner edge of the annular surface, and the other stop ring is located at the outer edge of the annular surface, with a receiving groove formed between the two stop rings. The receiving groove corresponds to the protruding ring and is capable of accommodating it. A predetermined receiving space exists between the annular base and the annular base.

[0008] The solder is located on the raised ring. The volume of the solder is not less than the volume of the preset accommodating space.

[0009] In one embodiment, after the anode target welding structure is welded, there is a first gap between the surface of the protruding ring and the bottom wall of the receiving groove, and a second gap between the surface of the stop portion and the end of the stop ring.

[0010] The first spacing is greater than the second spacing.

[0011] In one embodiment, the difference between the first spacing and the second spacing is between 0.1 and 0.5 mm.

[0012] In one embodiment, after the anode target disk welding structure is welded, there is a third distance between the side of the protruding ring and the side wall of the receiving groove, the third distance being between 0.05-0.5mm.

[0013] The aforementioned anode target welding structure, by setting grooves on the raised ring, increases the welding interface between the annular base and the annular substrate, thereby improving their connection strength. It also prevents the propagation of welding cracks, thus improving the connection stability between the annular base and the annular substrate. By setting stop portions and stop rings, the boundaries of the welded structure are protected, suppressing the propagation of microcracks at the weld boundary, thereby improving the connection stability between the annular base and the annular substrate. Furthermore, during operation, the annular substrate provides a certain supporting force to the annular base, further improving the connection reliability between the annular base and the annular substrate. By ensuring that the volume of the solder is not less than the volume of the preset accommodating space between the annular substrate and the annular base, it is guaranteed that the solder fully fills this preset accommodating space after melting, avoiding voids in the welded structure between the annular base and the annular substrate, thereby improving the connection strength and stability between the annular base and the annular substrate, and ultimately improving the stability and reliability of the anode target operation.

[0014] Secondly, this application provides a method for preparing an anode target disk, wherein the anode target disk is prepared using the anode target disk welding structure described in the first aspect.

[0015] The method for preparing the anode target disk includes:

[0016] The volume of the solder is determined based on the preset accommodating space between the annular base and the annular substrate. The volume of the solder is not less than the volume of the preset accommodating space.

[0017] Solder is placed on the raised ring, and the annular substrate is then placed on the annular base. Both the solder and the raised ring are located within the receiving groove.

[0018] The solder is heated to a first preset temperature so that it melts and fills the preset accommodating space.

[0019] In one embodiment, after the steps of placing solder on the raised ring and covering the annular base with the annular substrate, and before the steps of heating the solder to a first preset temperature to melt the solder and fill the preset accommodating space, the method further includes:

[0020] A preset pressure is applied to the solder to cause a portion of the solder to embed into the trench.

[0021] In one embodiment, the step of applying a preset pressure to the solder to embed a portion of the solder into the trench includes:

[0022] A preset pressure is applied to the solder, and the solder is heated to a second preset temperature and then held at that temperature for a preset time. The first preset temperature is greater than the second preset temperature.

[0023] In one embodiment, the first preset temperature is higher than the melting point of the solder.

[0024] And / or, the second preset temperature is lower than the melting point of the solder.

[0025] In one embodiment, the preset pressure value is between 2 and 5 MPa.

[0026] In one embodiment, before the step of applying a preset pressure to the solder to embed a portion of the solder into the trench, and after the step of placing the solder on the raised ring and covering the annular base with the annular substrate, the method further includes:

[0027] Multiple anode target disk welding structures are sequentially stacked on the annular substrate to form a stacked structure.

[0028] The above-mentioned method for preparing an anode target disk ensures that the volume of the solder is not less than the volume of the preset accommodating space between the annular substrate and the annular base. This guarantees that the solder fully fills the preset accommodating space after melting, avoids the presence of pores in the welded structure between the annular base and the annular substrate, thereby improving the connection strength and connection stability between the annular base and the annular substrate, and thus improving the stability and reliability of the anode target disk operation. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a top view of an anode target welding structure provided in an embodiment of this application;

[0031] Figure 2 for Figure 1 Schematic diagram of AA section;

[0032] Figure 3 for Figure 2 A schematic diagram of a partial cross-sectional structure of the anode target disk welding structure after welding;

[0033] Figure 4 for Figure 2 A schematic diagram of the anode target disk welding structure in a preset position;

[0034] Figure 5 This is a schematic flowchart illustrating a method for preparing an anode target disk according to an embodiment of this application.

[0035] Explanation of reference numerals in the attached figures:

[0036] 1-Anode target welding structure; 11-Annular base; 111-Stop part; 112-Protruding ring; 113-Groove; 12-Annular base; 121-Stop ring; 122-Receiving groove; 13-Solder. Detailed Implementation

[0037] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0038] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0039] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0040] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0041] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0042] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0043] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, in this specification, the term “and / or” includes any and all combinations of the associated listed items.

[0044] As described in the background section, the anode target disk in current X-ray tubes is generally composed of a substrate made of metal and a base made of graphite, connected by brazing. However, graphite brazing easily forms brittle and hard carbides at the weld joint, reducing the connection strength of the metal and graphite welded structure.

[0045] To address this issue, surface micromachining is typically performed on the graphite welding surface to increase the welding area and improve the connection strength of the metal-graphite welded structure. However, micromachining of the graphite welding surface creates numerous micro-grooves. During brazing, the solder often cannot fill these micro-grooves completely. This reduces the connection strength of the metal-graphite welded structure, resulting in poor stability of the substrate-base connection; it also reduces the thermal conductivity of the substrate and base.

[0046] In view of the above problems, this application provides an anode target plate welding structure and an anode target plate preparation method, which can fill the gap (including groove) between the annular base and the annular substrate with solder, avoid the presence of pores in the welding structure between the annular base and the annular substrate, thereby improving the connection strength and connection stability between the annular base and the annular substrate, and thus improving the stability and reliability of the anode target plate operation.

[0047] Firstly, referring to Figures 1-4 As shown, this application provides an anode target welding structure 1, which includes an annular base 11, an annular substrate 12, and solder 13.

[0048] The annular base 11 can be made of conventional materials in the field, such as carbon-based materials: CC, CFC, SiC, Si3N4, SiC-C, etc. The preferred material for the annular base 11 is lightweight, has high heat capacity, and high thermal conductivity, such as graphite. Furthermore, the graphite can be high-strength, high-density, and high-purity graphite, which has excellent and uniform thermal conductivity, resulting in good heat dissipation. The annular matrix 12 can be made of refractory metals, which generally refer to rare metal monomers or alloys with high melting points (e.g., above 1650℃). Refractory metals can include tungsten, molybdenum, niobium, tantalum, vanadium, zirconium, rhenium, hafnium, tantalum-tungsten alloys, molybdenum-titanium-zirconium alloys, etc. The solder 13 can be manganese-based or nickel-based solders, etc.

[0049] It is understood that "ring-shaped" can include circular rings, triangular rings, rectangular rings, hexagonal rings, and irregular rings. In this application, the ring shape can include an inner edge and an outer edge surrounding the inner edge. The inner and outer edges of the ring can have the same shape. For example, both the inner and outer edges of the ring can be circular, in which case the ring is circular; or, for example, both the inner and outer edges of the ring can be hexagonal, in which case the ring is hexagonal. The inner and outer edges of the ring can have different shapes. For example, the inner edge of the ring can be circular, and the outer edge can be rectangular. This application does not limit the specific shapes of the ring-shaped base 11 and the ring-shaped substrate 12.

[0050] Specifically, two stop portions 111 are recessed on one side of the annular surface of the annular base 11. One stop portion 111 is located at the inner edge of the annular surface, and the other stop portion 111 is located at the outer edge of the annular surface. A raised ring 112 is formed between the two stop portions 111, and the surface of the raised ring 112 is provided with a plurality of grooves 113 arranged at intervals. It should be noted here that "one side of the annular surface of the annular base 11" refers to the surface on one side along the axial direction of the annular base 11.

[0051] By providing grooves 113 on the raised ring 112, the welding interface between the annular base 11 and the annular substrate 12 can be increased, thereby improving the connection strength between the two. On the other hand, it can prevent the propagation of welding cracks, thereby improving the connection stability between the annular base 11 and the annular substrate 12.

[0052] Specifically, the annular base 12 is located on the side of the annular base 11 near the stop portion 111. Two stop rings 121 are protruding on the annular surface of the annular base 12 near the annular base 11. One stop ring 121 is located at the inner edge of the annular surface, and the other stop ring 121 is located at the outer edge of the annular surface.

[0053] Understandably, after the annular base 12 and the annular base 11 are welded, the solder 13 forms a welding mechanism between them. By providing the stop portion 111 and the stop ring 121, on the one hand, the boundary of the welded structure can be protected, and the propagation of microcracks at the welded structure boundary can be suppressed, thereby improving the connection stability of the annular base 11 and the annular base 12. On the other hand, during operation, the annular base 12 can provide a certain supporting force to the annular base 11, further improving the connection reliability of the annular base 11 and the annular base 12.

[0054] Specifically, a receiving groove 122 is formed between the two stop rings 121. The receiving groove 122 corresponds to the raised ring 112 and is capable of accommodating the raised ring 112. A predetermined receiving space is provided between the annular base 12 and the annular base 11. Solder 13 is located on the raised ring 112, and the volume of solder 13 is not less than the volume of the predetermined receiving space.

[0055] It should be noted that the structure of the annular base 12 and the annular base 11 before welding is as follows: Figure 2 As shown, the structure after welding is as follows Figure 3 As shown, after welding, the relative positions of the annular base 12 and the annular base 11 are fixed. (Refer to...) Figure 4 The diagram shows the annular base 12 and the annular base 11 in a preset position. The "preset position" can be considered as the relative position of the annular base 12 and the annular base 11 after welding. When the annular base 12 and the annular base 11 are in the preset position, there is a preset accommodating space between them. This preset accommodating space is the gap between the annular base 12 and the annular base 11. It can be understood that this "preset accommodating space" includes all gaps between the annular base 12 and the annular base 11.

[0056] The anode target welding structure 1 provided in this application ensures that the volume of the solder 13 is not less than the volume of the preset accommodating space between the annular base 12 and the annular base 11. This ensures that the solder 13 fully fills the preset accommodating space after melting, avoiding the presence of pores in the welding structure between the annular base 11 and the annular base 12. This improves the connection strength and connection stability between the annular base 11 and the annular base 12, thereby improving the stability and reliability of the anode target working.

[0057] It should be noted that, in Figures 1-4 In the diagram, the dashed line c represents the central axis of the annular base 11 and the annular base 12.

[0058] In one embodiment, reference Figure 4 As shown, after the anode target welding structure 1 is welded, there is a first distance L1 between the surface of the protruding ring 112 and the bottom wall of the receiving groove 122, and a second distance L2 between the surface of the stop portion 111 and the end of the stop ring 121. The first distance L1 is greater than the second distance L2.

[0059] By making the first gap L1 greater than the second gap L2, excessive flow of solder 13 from the gap between the stop portion 111 and the stop ring 121 after melting can be avoided, thereby ensuring that the solder 13 can fill all the gaps between the annular base 12 and the annular base 11 after melting.

[0060] In one embodiment, the difference between the first spacing L1 and the second spacing L2 is between 0.1 and 0.5 mm. In one example, the difference between the first spacing L1 and the second spacing L2 may be between 0.1 and 0.45 mm; in another example, the difference may be between 0.15 and 0.45 mm; in yet another example, the difference may be between 0.2 and 0.4 mm; and in yet another example, the difference may be between 0.25 and 0.35 mm.

[0061] By ensuring that the difference between the first spacing L1 and the second spacing L2 is within the aforementioned range, on the one hand, there is sufficient gap between the protruding ring 112 and the receiving groove 122 to ensure capillary action; on the other hand, the stop portion 111 and the stop ring 121 can block the solder 13, preventing excessive loss of the solder 13.

[0062] Understandably, the second spacing L2 can be 0mm. In this way, after the anode target welding structure 1 is welded, the stop part 111 and the stop ring 121 can be completely closed to prevent the solder 13 from being lost.

[0063] In one embodiment, reference Figure 4 As shown, after the anode target welding structure 1 is welded, there is a third distance L3 between the side of the raised ring 112 and the side wall of the receiving groove 122, and the third distance L3 is between 0.05-0.5mm. In one example, the third distance L3 can be between 0.05-0.45mm; in another example, the third distance L3 can be between 0.1-0.4mm; in yet another example, the third distance L3 can be between 0.15-0.45mm; and in yet another example, the third distance L3 can be between 0.15-0.35mm.

[0064] It is understandable that the first spacing L1 can be equal to the third spacing L3. By keeping the first spacing L1 and the third spacing L3 within the above range, capillary action can be ensured, allowing the solder 13 to flow sufficiently after melting to fill all the gaps between the annular substrate 12 and the annular base 11.

[0065] Reference Figure 5 and combined Figures 1-4 Secondly, this application provides a method for preparing an anode target disk, which uses the anode target disk welding structure 1 in the first aspect to prepare the anode target disk.

[0066] Methods for preparing anode target disks include:

[0067] S100: The volume of the solder is determined based on the preset accommodating space between the annular base and the annular substrate. The volume of solder 13 is not less than the volume of the preset accommodating space. (Refer to...) Figure 4 The diagram shows the annular base 12 and the annular base 11 in a preset position. The "preset position" can be considered as the relative position of the annular base 12 and the annular base 11 after welding. When the annular base 12 and the annular base 11 are in the preset position, there is a preset accommodating space between them. This preset accommodating space is the gap between the annular base 12 and the annular base 11. It can be understood that this "preset accommodating space" includes all gaps between the annular base 12 and the annular base 11.

[0068] S200: Place solder on the raised ring and cover the annular base with the annular substrate. Both the solder 13 and the raised ring 112 are located in the receiving groove 122. The structure after placing the annular substrate 12 and the solder 13 is as follows: Figure 2 As shown.

[0069] S300: The solder is heated to a first preset temperature to melt and fill a preset containment space. In one example, the first preset temperature may be greater than the melting temperature of the solder 13. After the solder 13 melts, under the influence of gravity of the annular substrate 12 and the capillary action of the liquid solder 13, the solder 13 flows between the annular substrate 12 and the annular base 11, gradually filling the gap between the annular substrate 12 and the annular base 11. It is understood that the melting temperature of the solder 13 is not necessarily the melting point of the solder 13; the solder 13 may undergo a low-melting-point eutectic reaction with the annular substrate 12.

[0070] In this embodiment, the annular base 11 and the annular substrate 12 are brazed. Brazing is a commonly used welding method in modern industry. Brazing involves simultaneously heating a solid solder (brazing filler metal) with a melting point lower than that of the components to be welded to the melting temperature of the solid solder, causing it to melt into a liquid solder. This liquid solder fills the gaps between the components, thus achieving a connection. Vacuum brazing is a brazing technique where the solder is placed between the components to be welded (e.g., two components), and then both are placed in a vacuum heating chamber for heating. Heating in a vacuum chamber prevents the solder and components from oxidizing or burning after heating.

[0071] The anode target disk preparation method provided in this application embodiment ensures that the volume of the solder 13 is not less than the volume of the preset accommodating space between the annular substrate 12 and the annular base 11. This ensures that the solder 13 fully fills the preset accommodating space after melting, avoiding the presence of pores in the welded structure between the annular base 11 and the annular substrate 12. This improves the connection strength and connection stability between the annular base 11 and the annular substrate 12, thereby improving the stability and reliability of the anode target disk operation.

[0072] In one embodiment, after step S200: placing solder on the raised ring and covering the annular base with the annular substrate, and before step S100: heating the solder to a first preset temperature to melt the solder and fill the preset accommodating space, the method further includes:

[0073] S150: Apply a preset pressure to the solder to embed part of the solder into the groove. In this way, the solder 13 can be embedded into the groove 113 by external force, which further ensures that the solder 13 can fully fill the groove 113, and improves the connection strength and connection stability of the welded structure of the annular substrate 12 and the annular base 11.

[0074] It is understood that the preset pressure can be applied by a pressure-applying device, for example: applying a vertically downward pressure to the annular substrate 12 by the pressure-applying device, and the annular substrate 12 transmitting the pressure to the solder 13.

[0075] In one embodiment, before the step of S150: applying a preset pressure to the solder to embed a portion of the solder into the trench, and after the step of S200: placing the solder on the raised ring and covering the annular base with the annular substrate, the method further includes:

[0076] S250: Multiple anode target welding structures are sequentially stacked on an annular substrate to form a stacked structure. This allows for simultaneous welding of multiple anode target welding structures 1, improving the fabrication efficiency of the anode target; furthermore, a portion of the preset pressure can come from the gravity of the stacked structure. It is understood that after this step, to ensure the welding effect of the top anode target welding structure 1, a certain pressure needs to be applied to the top anode target welding structure 1 using a pressure-applying device to ensure that the solder 13 can fully fill the trench 113.

[0077] In one embodiment, S150: The step of applying a preset pressure to the solder to embed a portion of the solder into the trench includes:

[0078] S151: Apply a preset pressure to the solder, and simultaneously heat the solder to a second preset temperature and then hold the solder at that temperature for a preset time. Wherein, the first preset temperature is greater than the second preset temperature.

[0079] In this way, the yield strength of the solder 13 can be reduced by heating it to the second preset temperature, which makes it easier to press the solder 13 into the groove 113. At the same time, the solder 13 is kept at the preset pressure and the second preset temperature for a preset time, which helps the solder 13 to be fully pressed into the groove 113.

[0080] In some embodiments, the solder 13, the annular substrate 12, and the annular base 11 can be heated together. In other embodiments, the solder 13 can be heated directly to melt it. In some embodiments, the annular substrate 12 and / or the annular base 11 can be heated, and the heated annular substrate 12 and / or the annular base 11 can transfer heat to the solder 13 to melt it. In some embodiments, the solder 13, the annular substrate 12, and the annular base 11 can be heated together to melt the solder 13.

[0081] In one embodiment, the first preset temperature is higher than the melting point of the solder 13. Specifically, the first preset temperature can be 10-100°C higher than the melting point of the solder 13. In one example, the first preset temperature can be 10-30°C higher than the melting point of the solder 13; in another example, the first preset temperature can be 15-45°C higher than the melting point of the solder 13; in yet another example, the first preset temperature can be 30-80°C higher than the melting point of the solder 13; and in yet another example, the first preset temperature can be 40-100°C higher than the melting point of the solder 13. The first preset temperature being within the above temperature range ensures that the solder 13 melts sufficiently while avoiding wasting excessive energy.

[0082] In one embodiment, the second preset temperature is lower than the melting point of the solder 13. Specifically, the second preset temperature can be 10-50°C lower than the melting point of the solder 13. In one example, the second preset temperature can be 10-20°C lower than the melting point of the solder 13; in another example, the second preset temperature can be 15-25°C lower than the melting point of the solder 13; in yet another example, the second preset temperature can be 20-35°C lower than the melting point of the solder 13; and in yet another example, the second preset temperature can be 30-50°C lower than the melting point of the solder 13. The second preset temperature being within the above temperature range ensures that the solder 13 does not melt and has a sufficiently low yield strength, facilitating the full pressing of the solder 13 into the groove 113.

[0083] In one embodiment, the preset pressure value is between 2 and 5 MPa. In one example, the preset pressure value may be between 2 and 3 MPa; in another example, it may be between 2.5 and 3.5 MPa; in yet another example, it may be between 3 and 4.5 MPa; and in yet another example, it may be between 3.5 and 5 MPa. It is understood that the preset pressure value should be greater than the yield strength of the solder 13 at the second preset temperature, thus ensuring that the solder 13 is fully pressed into the trench 113.

[0084] In one embodiment, the preset duration is between 30 and 60 minutes. In one example, the preset duration can be between 30 and 40 minutes; in another example, it can be between 35 and 45 minutes; in yet another example, it can be between 40 and 55 minutes; and in yet another example, it can be between 40 and 60 minutes. A preset duration within the above range ensures that the solder 13 is fully pressed into the trench 113 while reducing the time and energy consumed in the anode target fabrication process, thereby improving the fabrication efficiency of the anode target and reducing energy consumption.

[0085] In one embodiment, after step S300: heating the solder to a first preset temperature to melt the solder and fill the preset accommodating space, the method may further include:

[0086] S400: Cools the annular base, annular substrate, and molten solder.

[0087] During the heating process in S300, elemental diffusion occurs between the molten solder 13 and the annular substrate 12, and between the molten solder 13 and the annular base 11. During the cooling process in S400, the molten solder 13 gradually solidifies to ensure a stable connection between the annular substrate 12 and the annular base 11. For example, air cooling can be used to cool the annular base 11, the annular substrate 12, and the molten solder 13.

[0088] It should be understood that, although Figure 5 The steps in the flowchart are shown sequentially as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order in which these steps are executed, and they can be performed in other orders. Figure 5At least some of the steps in the process may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but may be executed at different times. The execution order of these steps or stages is not necessarily sequential, but may be executed in turn or alternately with other steps or at least some of the steps or stages in other steps.

[0089] In the description of this specification, the references to terms such as "some embodiments," "other embodiments," "ideal embodiments," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example that are included in at least one embodiment or example of this application. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0090] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0091] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A welding structure for an anode target disk, characterized in that, include: An annular base (11) has two recessed stops (111) on one side of its annular surface. One stop (111) is located at the inner edge of the annular surface, and the other stop (111) is located at the outer edge of the annular surface. A raised ring (112) is formed between the two stops (111), and the surface of the raised ring (112) is provided with a plurality of grooves (113) arranged at intervals. An annular base (12) is located on the side of the annular base (11) near the stop portion (111); two stop rings (121) are protruding on the annular surface of the annular base (12) near the annular base (11); one stop ring (121) is located at the inner edge of the annular surface, and the other stop ring (121) is located at the outer edge of the annular surface, and a receiving groove (122) is formed between the two stop rings (121); the receiving groove (122) corresponds to the protruding ring (112) and can accommodate the protruding ring (112); there is a preset receiving space between the annular base (12) and the annular base (11); Solder (13) is located on the raised ring (112); and the volume of solder (13) is not less than the volume of the preset accommodating space; After the anode target disk welding structure (1) is welded, there is a first gap between the surface of the protruding ring (112) and the bottom wall of the receiving groove (122), and a second gap between the surface of the stop part (111) and the end of the stop ring (121); the first gap is greater than the second gap. After the anode target disk welding structure (1) is welded, there is a third distance between the side of the protruding ring (112) and the side wall of the receiving groove (122).

2. The anode target disk welding structure according to claim 1, characterized in that, The difference between the first spacing and the second spacing is between 0.1 and 0.5 mm.

3. The anode target disk welding structure according to claim 1 or 2, characterized in that, The third spacing is between 0.05 and 0.5 mm.

4. A method for preparing an anode target disk, characterized in that, The anode target disk is prepared using the anode target disk welding structure as described in any one of claims 1-3; The method for preparing the anode target disk includes: The volume of the solder is determined according to the preset accommodating space between the annular base and the annular substrate; wherein the volume of the solder is not less than the volume of the preset accommodating space; Solder is placed on the raised ring, and the annular base is placed on the annular base; wherein the solder and the raised ring are both located in the receiving groove; The solder is heated to a first preset temperature so that it melts and fills the preset accommodating space.

5. The method for preparing the anode target disk according to claim 4, characterized in that, After the steps of placing solder on the raised ring and covering the annular base with the annular substrate, and before the steps of heating the solder to a first preset temperature to melt the solder and fill the preset accommodating space, the method further includes: A preset pressure is applied to the solder to cause a portion of the solder to embed into the trench.

6. The method for preparing the anode target disk according to claim 5, characterized in that, The step of applying a preset pressure to the solder to embed a portion of the solder into the trench includes: A preset pressure is applied to the solder, and the solder is heated to a second preset temperature and then kept at that temperature for a preset time; wherein the first preset temperature is greater than the second preset temperature.

7. The method for preparing the anode target disk according to claim 6, characterized in that, The first preset temperature is higher than the melting point of the solder; And / or, the second preset temperature is lower than the melting point of the solder.

8. The method for preparing the anode target disk according to any one of claims 5-7, characterized in that, The preset pressure value is between 2 and 5 MPa.

9. The method for preparing the anode target disk according to any one of claims 5-7, characterized in that, Before the step of applying a preset pressure to the solder to embed a portion of the solder into the trench, and after the step of placing the solder on the raised ring and covering the annular base with the annular substrate, the method further includes: Multiple anode target disk welding structures are sequentially stacked on the annular substrate to form a stacked structure.

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