Mask production equipment and production process thereof

Abstract

The present application belongs to the technical field of abrasive plate production equipment, and particularly relates to a mask production equipment, which comprises a working box, driving motors, a silk tap rod, a thickness gauge, a polishing mechanism and a chemical etching device. The driving motors are respectively arranged on the two sides of an end wall of the working box and have output ends penetrating into the working box. The silk tap rod has one end connected with the output end of the driving motor and the other end rotatably connected with the inner wall of the working box away from the driving motor. The adsorption device has a moving end connected with the two silk tap rods and a pressing end arranged on the inner wall of the working box. The adsorption end faces the top opening of the working box. The thickness gauge has a fixed end arranged on the two sides of the top end of the working box and an output end located above the top opening of the working box. The polishing mechanism has a fixed end arranged on the two sides of the top end of the working box and an output end extending into the working box. The chemical etching device is arranged on the top end of the working box. The present application has the advantages that different thicknesses can be polished on different positions of the mask, different chemical etching can be performed on the abrasive plates with different thicknesses, and the evaporation and plating effect of the abrasive plate is excellent.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of mask production equipment, in particular to a mask production equipment and a production process thereof. BACKGROUND

[0002] The mask production equipment is used for producing masks, and a traditional mask production equipment produces a grinding plate with a uniform thickness. In an OLED panel evaporation process, due to the distribution of a magnetic field, different magnetic forces are formed in different regions, and the mask causes different length deformations of the evaporation mask in different regions. The position of an internal through hole is offset, so that material passing through the through hole cannot be correctly evaporated on a corresponding anode position of a TFT substrate, thereby causing product defects such as color mixing. SUMMARY

[0003] In view of the deficiencies in the prior art, the purpose of the present application is to provide a mask production equipment and a production process thereof to solve the above problems.

[0004] Therefore, the present application provides a mask production equipment, which comprises:

[0005] A working box, which is a cuboid and is placed on the ground at the bottom end;

[0006] Two driving motors, the fixed ends of which are respectively spaced apart from the two sides of an end wall of the working box, and the output ends of which penetrate into the working box;

[0007] Two tap rods, one end of each of which is fixedly connected with the output end of the driving motor, and the other end of each of which is rotatably connected with the inner wall of the working box away from the driving motor;

[0008] A suction device, the moving end of which is connected with the two tap rods, the pressing end of which is arranged on the inner wall of the working box, and the suction end of which faces the top opening of the working box;

[0009] A thickness gauge, the fixed end of which is arranged on the two sides of the top end of the working box, and the output end of which is located above the top opening of the working box;

[0010] A polishing mechanism, the fixed end of which is arranged on the two sides of the top end of the working box, and the output end of which extends into the working box;

[0011] A chemical etching device, which is arranged at the top opening of the working box;

[0012] The suction device is used for adsorbing an unprocessed mask, the thickness gauge is used for measuring the thickness of the grinding plate, the polishing mechanism is used for polishing the mask to different thicknesses, and the chemical etching device is used for performing chemical etching of different intensities on the grinding plates with different thicknesses.

[0013] By adopting the above technical scheme, firstly, the unprocessed grinding plate is placed on the adsorption device, the adsorption device adsorbs the bottom end of the grinding plate, then the driving motor is started, the driving motor rotates the tap rod, the tap rod drives the adsorption device to move to the below of the thickness gauge, when the adsorption device moves through the thickness gauge, the thickness of the mask plate from front to back is measured in turn, the first thickness detection of the grinding plate is completed, the operator adjusts the grinding mechanism according to the requirement, and the mask plate is ground, after the grinding is completed, the driving motor moves the mask plate to the thickness gauge for the second thickness detection, when the mask plate is unqualified, the grinding mechanism grinds the mask plate again until the mask plate is qualified, when the mask plate is qualified, the adsorption device moves to the chemical etching device, different chemical etching strength is carried out on the mask plate with different thickness, so that the through hole steps of different thickness areas of the mask plate are consistent, thereby realizing the uniformity of the mask plate deformation of different places and different strengths of the magnetic field, and the best evaporation effect is achieved. After the above mask plate grinding is completed, photoresist coating, double-sided exposure and development are carried out, and then the mask plate is reinstalled on the adsorption device for chemical etching, when one side of the mask plate is chemically etched, the operator turns over the mask plate for the second side chemical etching.

[0014] In the above technical scheme, further, the adsorption device comprises:

[0015] Two connecting blocks are arranged on the two tap rods respectively;

[0016] The adsorption mechanism is connected to the opposite sides of the two connecting blocks respectively, and the adsorption end is arranged towards the opening of the working box;

[0017] Two first sliding holes are arranged on the two sides of the working box respectively, and the other end openings are communicated in the working box;

[0018] Two first driving blocks are arranged on the two sides of the working box respectively, and the other ends are penetrated through the first sliding holes and communicated in the working box;

[0019] The pressing plate is arranged on the opposite side of the two first driving blocks and in the working box;

[0020] Two first hydraulic cylinders are arranged on the two sides of the working box respectively, and the output ends are connected to the two first driving blocks;

[0021] When the output end of the first hydraulic cylinder is retracted, the two first driving blocks are lowered, so that the pressing plate is lowered, and the mask plate on the adsorption end of the adsorption mechanism is pressed.

[0022] The two connecting blocks are arranged, so that the adsorption mechanism can move on the tap rod through the connecting blocks; the first hydraulic cylinder is arranged, so that the first driving block can ascend and descend in the first sliding hole, thereby driving the pressing plate to ascend and descend; the pressing plate can be lowered to press the mask plate on the adsorption mechanism; and the adsorption mechanism is arranged, so that the mask plate can be adsorbed and fixed.

[0023] In the technical scheme, the adsorption mechanism further comprises:

[0024] The mounting block is arranged on the side opposite to the two connecting blocks, and the mounting block is provided with a movable cavity;

[0025] The air suction member is arranged on the side wall of the mounting block;

[0026] The plurality of suction pipe groups are arranged above the mounting block and extend into the movable cavity through the mounting block, and the plurality of suction pipe groups are arranged along the width direction of the mounting block at intervals, respectively; the suction pipe group comprises a plurality of suction pipes arranged along the length direction of the mounting block at intervals;

[0027] The plurality of suction discs are arranged at the openings of the suction pipes away from the mounting block;

[0028] The plurality of air pipes are connected to the openings of the suction pipes in the movable cavity at one end and connected to the air suction member through the mounting block at the other end;

[0029] The lifting structure is arranged at the bottom of the movable cavity, and the movable end is connected to the suction pipes in the movable cavity;

[0030] The mounting block is provided with an embedding groove for the suction disc, and the lifting structure is used for ascending and descending the plurality of suction pipes.

[0031] In the technical scheme, the mask plate is first placed on the plurality of suction discs, and then the pressing plate is lowered to press the mask plate on the suction disc; at this time, the air suction member is used for suction, and the air pipe and the suction pipe are used for transmission, so that the suction disc adsorbs the mask plate; after the suction disc adsorbs the mask plate, the lifting structure is lowered, so that the suction disc is embedded in the embedding groove, so that the mask plate is just attached to the top end of the mounting block, and the bottom end of the mask plate is resisted when the polishing mechanism polishes.

[0032] In the technical scheme, the lifting structure further comprises:

[0033] The first moving plate is attached to and slides on the inner wall of the movable cavity, the outermost circle of the suction pipes penetrates and is connected to the moving plate, and the moving plate is provided with through holes for the other suction pipes to pass through;

[0034] The second moving plate is sleeved on the outer side wall of the other air pipe.

[0035] a second hydraulic cylinder, the fixed end of which is connected to the bottom of the movable cavity, and the output end of which is connected to the first moving plate;

[0036] and a third hydraulic cylinder, the fixed end of which is connected to the bottom of the movable cavity, and the output end of which is connected to the second moving plate;

[0037] When the second hydraulic cylinder is extended or retracted, the first moving plate is raised or lowered, so that the outermost circle of the suction pipes is raised or lowered; when the third hydraulic cylinder is extended or retracted, the second moving plate is raised or lowered, so that the inner circle of the suction pipes is raised or lowered.

[0038] In the technical solution, when the mask plate is polished, the second hydraulic cylinder and the third hydraulic cylinder are simultaneously extended and retracted, so that the first moving plate and the second moving plate are simultaneously raised and lowered, so that all the suction cups are raised and lowered, achieving comprehensive fixation of the mask plate; when the mask plate is chemically etched, the second hydraulic cylinder and the third hydraulic cylinder are simultaneously extended, so that the mask plate is located above the mounting block; at this time, the suction cups on the second moving plate cancel the suction, and then the third hydraulic cylinder is lowered, so that only the outer suction cups are adsorbed to the mask plate, so as to better chemically etch.

[0039] In the above technical solution, the polishing mechanism further comprises:

[0040] two support plates, oppositely arranged on both sides of the top end of the working box and located between the thickness gauge and the adsorption device, and the side of each of the two support plates away from each other is provided with a second sliding hole;

[0041] two second driving blocks, one end of each of which is located on the two sides of the working box, and the other end of each of which penetrates through the corresponding second sliding hole;

[0042] a bearing plate, arranged on the side opposite to the two second driving blocks;

[0043] two mounting plates, one end of each of which is arranged at intervals at the bottom end of the bearing plate, and the other end of each of which extends towards the bottom of the working box;

[0044] a polishing roller, rotationally connected between the two mounting plates;

[0045] and two fourth hydraulic cylinders, the fixed end of each of which is arranged on the two sides of the working box, and the output end of each of which is connected to the second driving block;

[0046] The mounting plate is provided with a rotation motor for driving the polishing roller.

[0047] In the technical solution, the second driving block is stably moved in the second sliding hole through the cooperation of the supporting plate and the second sliding hole, the bearing plate is stably moved through the arrangement of the second driving block, the polishing roller is installed through the arrangement of the two mounting plates, the polishing roller is indirectly driven by the second driving block to ascend and descend through the arrangement of the fourth hydraulic cylinder, thereby achieving polishing of the mask plate with different thicknesses, and the polishing roller is rotated for polishing through the arrangement of the rotating motor, the middle part of the mask plate is polished by the polishing roller, and the two sides of the mask plate are not polished, so that when the back surface of the mask plate is adsorbed, the outer circle of the suction disc can stably adsorb the mask plate.

[0048] In the above technical solution, the chemical etching device further comprises:

[0049] The mounting cover is arranged on the top of the working box and located on the side away from the polishing device of the thickness gauge;

[0050] The partition plate is arranged in the mounting cover, so that the mounting cover is divided into an etching area and a cleaning area;

[0051] The etching mechanism is arranged at the top end of the mounting cover and penetrates the mounting cover to be located in the etching area;

[0052] The cleaning mechanism is arranged at the top end of the mounting cover and penetrates the mounting cover to be located in the cleaning area;

[0053] And two baffles are arranged at the bottom end of the inner wall of the working box, so that two collection areas are formed at the bottom end of the mounting cover;

[0054] The side wall of the working box is provided with a liquid outlet pipe communicated with the collection area.

[0055] In the technical solution, the etching mechanism and the cleaning mechanism are installed through the arrangement of the mounting cover, the etching mechanism performs chemical etching in the etching area through the arrangement of the partition plate, the cleaning mechanism performs cleaning in the cleaning area, two collection areas are formed through the arrangement of the two baffles, so that the etching liquid of the etching mechanism and the cleaning liquid of the cleaning mechanism are collected, and finally discharged through the liquid outlet pipe.

[0056] In the above technical solution, the etching mechanism further comprises:

[0057] Two first liquid storage tanks are arranged at the top end of the mounting cover, and one of the first liquid storage tanks is provided with a heating element;

[0058] The mixing tank is arranged at the top end of the mounting cover, and the mixing tank is provided with a temperature measuring element;

[0059] Two first liquid pumps, fixed ends are arranged at the top of the two first liquid storage tanks respectively, and the input ends of the first liquid pumps are connected to the corresponding first liquid storage tanks, and the output ends are connected to the mixing tank respectively;

[0060] Two second liquid pumps, fixed ends are arranged in the mixing tank, input ends are penetrated into the mixing tank, and the output ends are penetrated into the mounting cover in the etching area;

[0061] Two first connecting rods, arranged at the top of the etching area;

[0062] The first output pipe is connected to one end of the two first connecting rods away from the top of the etching area;

[0063] And a plurality of nozzles, input ends are arranged at the bottom of the first output pipe and are communicated in the first output pipe, and the output ends extend away from the first output pipe;

[0064] Among them, the output end of the second liquid pump penetrates the first output pipe and is communicated in the first output pipe, the first output pipe is perpendicular to the length direction of the two taps, and the first liquid storage tank is placed with etching liquid.

[0065] In the technical solution, through the arrangement of the two first liquid storage tanks, etching liquid can be placed, through the arrangement of the heating element, the temperature of the etching liquid in one of the first liquid storage tanks can be raised, through the arrangement of the first liquid pump, the etching liquid in the two first liquid storage tanks can be transported to the mixing tank respectively, through the arrangement of the mixing tank, the etching liquid in the two first liquid storage tanks can be mixed, so that etching liquid of different temperatures can be mixed, through the arrangement of the temperature measuring element, the temperature of the mixed etching liquid can be measured, through the arrangement of the two first connecting rods, the first output pipe can be installed, through the arrangement of the second liquid pump, the etching liquid in the mixing tank can be input into the first output pipe, through the arrangement of the plurality of nozzles, the etching liquid can be output in rows, and the width direction of the mask plate can be chemically etched in rows.

[0066] In the above technical solution, further, the cleaning mechanism comprises:

[0067] The second liquid storage tank is arranged at the top of the mounting cover;

[0068] Two second connecting rods, arranged at the top of the cleaning area;

[0069] The second output pipe is connected to one end of the two second connecting rods away from the top of the cleaning area;

[0070] A plurality of spray heads, input ends are arranged at the bottom of the second output pipe and are communicated in the second output pipe, and the output ends extend away from the second output pipe;

[0071] And the third liquid pump, the fixed end is arranged in the second liquid tank, the input end is communicated with the second liquid tank through the second liquid tank, and the output end is communicated with the second output pipe through the mounting cover.

[0072] Wherein, the second liquid tank is provided with cleaning liquid, and the second output pipe is arranged vertically with the tap rod.

[0073] In the technical solution, the second liquid tank is arranged to place the cleaning liquid, the two second connecting rods are arranged to install the second output pipe, the third liquid pump is arranged to make the cleaning liquid in the second liquid tank enter the second output pipe, and the plurality of spray heads are arranged to clean the mask plate.

[0074] In the above technical solution, further comprising the following steps:

[0075] S1: first place the unprocessed mask plate on the adsorption device, and the adsorption device adsorbs the unprocessed grinding plate;

[0076] S2: start the grinding mechanism and make the driving motor continue to move the adsorption device, when the adsorption device moves through the grinding mechanism, the grinding mechanism grinds the thickness of the grinding plate, and grinds different thicknesses in different places, and completes the grinding;

[0077] S3: when the mask plate is ground, the driving motor drives the adsorption device to move to the lower side of the thickness gauge for detecting the thickness;

[0078] S4: when the mask plate does not reach the thickness requirement, the same as S2, the second grinding is carried out to realize the thickness requirement;

[0079] S5: when the thickness of the mask plate reaches the requirement, the driving motor moves the adsorption device to the lower side of the chemical etching device, the chemical etching device carries out chemical etching and cleaning on the grinding plate, and at this time, the first mask plate is completed. Chemical etching of the mask plate;

[0080] S6: at this time, the operator turns over the mask plate, the adsorption device adsorbs the mask plate in reverse, and then the second face chemical etching of the mask plate is carried out;

[0081] S7: the driving motor moves out of the chemical etching device, and the operator takes the processed mask plate.

[0082] The mask plate can be installed and fixed through the setting of S1, the mask plate can be polished to different thicknesses at different positions through the setting of S2, the thickness of the mask plate can be measured through the setting of S3, the thickness requirement of the mask plate can be accurately met through the setting of S4, the first surface of the mask plate can be chemically etched and cleaned through the setting of S5, the second surface of the mask plate can be chemically etched and cleaned through the setting of S6, and the processed mask plate can be taken out through the setting of S7. BRIEF DESCRIPTION OF DRAWINGS

[0083] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative labor.

[0084] Figure 1 The present application is a specific embodiment of the whole structure schematic diagram.

[0085] Figure 2 The present application is a specific embodiment of the adsorption mechanism sectional view.

[0086] Figure 3 The present application is a specific embodiment of the chemical etching device sectional view.

[0087] The drawings are as follows: 1, working box; 2, driving motor; 3, tap rod; 4, connecting block; 5, first sliding hole; 6, first driving block; 7, pressing plate; 8, first hydraulic cylinder; 9, mounting block; 10, suction pipe; 11, suction disc; 12, air pipe; 13, first moving plate; 14, second moving plate; 15, through hole; 16, second hydraulic cylinder; 17, third hydraulic cylinder; 18, embedded groove; 19, supporting plate; 20, second sliding hole; 21, second driving block; 22, fourth hydraulic cylinder; 23, bearing plate; 24, mounting plate; 25, polishing roller; 26, mounting cover; 27, partition plate; 28, etching area; 29, cleaning area; 30, baffle; 31, thickness gauge; 32, liquid outlet pipe; 33, first liquid storage tank; 34, mixing tank; 35, first liquid pump; 36, second liquid pump; 37, temperature measuring element; 38, first connecting rod; 39, first output pipe; 40, nozzle; 41, second liquid storage tank; 42, second connecting rod; 43, second output pipe; 44, spray head; 45, third liquid pump. DETAILED DESCRIPTION

[0088] Clearly, the described embodiments are only some, but not all of embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by a person of ordinary skill in the art are within the scope of protection of the application.

[0089] In the description of the application, it should be noted that the terms used herein are only intended to describe specific embodiments and are not intended to limit the exemplary embodiments according to the application. For ease of description, the sizes of the various parts shown in the drawings are not drawn in proportion. The techniques, methods and devices known to those of ordinary skill in the relevant art can not be discussed in detail, but should be considered as part of the authorized description. In all examples shown and discussed herein, any specific value should be interpreted as merely exemplary and not as a limitation. Therefore, other examples of exemplary embodiments can have different values. It should be noted that similar reference numbers and letters represent similar items in the following drawings, so further discussion is not needed in subsequent drawings once an item is defined in one drawing.

[0090] It should be noted that the terms "first", "second" and the like in the specification and claims of the application are used to distinguish similar objects, and are not intended to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the application can be implemented in an order other than that illustrated or described herein, and the objects distinguished by "first", "second" and the like are generally a class, not limited to the number of objects, for example, the first object can be one or more. In addition, the specification and claims "and / or" indicate at least one of the connected objects, and the character " / ", generally indicates that the front and rear associated objects are a kind of mask production equipment and its production process "or" relationship.

[0091] It should be noted that in the description of the application, the orientation terms such as "front, rear, upper, lower, left, right", "horizontal, vertical, perpendicular, horizontal" and "top, bottom" and the like indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, only for the convenience of describing the application and simplifying the description, without the opposite indication, these orientation terms do not indicate and imply that the indicated device or element must have a specific orientation or be constructed and operated in a specific orientation, therefore, it cannot be understood as a limitation on the scope of protection of the application; the orientation terms "inner, outer" refer to the inner and outer of the contour of each part itself.

[0092] It should be noted that in this application, the terms "comprising", "including", or any other variant thereof are intended to cover a non-exclusive inclusion, so that a process, method, article, or apparatus that includes a list of elements not only includes those elements, but also includes other elements not expressly listed or inherent to such process, method, article, or apparatus. Without more limitations, the element defined by the statement "comprising a" does not exclude the presence of additional identical elements in the process, method, article, or apparatus including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, but can also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method can be performed in an order different from that described, and various steps can also be added, omitted, or combined. In addition, the features described with reference to certain examples can be combined in other examples.

[0093] Embodiment 1:

[0094] The embodiment provides a mask production equipment, comprising:

[0095] A working box 1, which is cuboid and placed on the ground at the bottom end;

[0096] Two drive motors 2, the fixed ends are respectively spaced on both sides of one end wall of the working box 1, and the output ends all penetrate into the working box 1;

[0097] Two tap rods 3, one end of each of which is fixedly connected with the output end of the drive motor 2, and the other end is rotatably connected with the inner wall of the side of the working box 1 away from the drive motor 2;

[0098] An adsorption device, the moving end of which is connected to the two tap rods 3, the pressing end of which is arranged on the inner wall of the working box 1, and the adsorption end of which faces the top opening of the working box 1;

[0099] A thickness gauge 31, the fixed end of which is arranged on both sides of the top end of the working box 1, and the output end of which is located above the top opening of the working box 1;

[0100] A polishing mechanism, the fixed end of which is arranged on both sides of the top end of the working box 1, and the output end of which extends into the working box 1;

[0101] And a chemical etching device, which is arranged at the top opening of the working box 1;

[0102] Among them, the adsorption device is used for adsorbing the unprocessed mask, the thickness gauge 31 is used for measuring the thickness of the grinding plate, the polishing mechanism is used for polishing the mask to different thicknesses, and the chemical etching device is used for chemical etching of different intensities on the grinding plate with different thicknesses;

[0103] First, the unprocessed grinding plate is placed on the adsorption device, which adsorbs the bottom end of the grinding plate, and then the driving motor 2 is started, the driving motor 2 rotates the tap rod 3, the tap rod 3 drives the adsorption device to move to the below of the thickness gauge 31, when the adsorption device moves through the thickness gauge 31, the thickness of the mask plate from front to back is measured in turn, the first thickness detection of the grinding plate is completed, the operator adjusts the grinding mechanism according to the requirement, and the mask plate is ground, after grinding, the driving motor 2 moves the mask plate to the thickness gauge 31 for the second thickness detection, when the mask plate is unqualified, the grinding mechanism grinds the mask plate again until the mask plate is qualified, when the mask plate is qualified, the adsorption device moves to the chemical etching device, different chemical etching intensity is carried out on different thickness mask plates, so that the through hole step of different thickness areas of the mask plate remains consistent, thereby realizing the uniformity of the mask plate deformation in the magnetic field with different strength in different places, and the best evaporation effect is achieved through the uniformity of the mask plate deformation and the through hole step. After the above mask plate grinding is completed, photoresist coating, double-sided exposure and development are carried out, and then the mask plate is reinstalled on the adsorption device for chemical etching, when one side of the mask plate is chemically etched, the operator turns over the mask plate for the second side chemical etching.

[0104] Embodiment 2:

[0105] In this embodiment, in addition to the structural features of the foregoing embodiments, the adsorption device further comprises:

[0106] Two connecting blocks 4 are respectively arranged on the two tap rods 3;

[0107] The adsorption mechanism is connected to the opposite side of the two connecting blocks 4 on both sides, and the adsorption end is arranged towards the opening of the working box 1;

[0108] Two first sliding holes 5 are respectively arranged at the two sides of the working box 1, and the other end openings are respectively connected to the working box 1;

[0109] Two first driving blocks 6 are respectively located at the two sides of the working box 1, and the other ends are respectively connected to the working box 1 through the first sliding hole 5;

[0110] The pressing plate 7 is arranged on the opposite side of the two first driving blocks 6 and located in the working box 1;

[0111] And two first hydraulic cylinders 8 are arranged on the two sides of the working box 1, and the output ends are connected to the two first driving blocks 6;

[0112] When the output end of the first hydraulic cylinder 8 is retracted, the two first driving blocks 6 are lowered, so that the pressing plate 7 is lowered, and the mask plate on the adsorption end of the adsorption mechanism is pressed;

[0113] Through the setting of the two connecting blocks 4, the suction mechanism can move on the tap rod 3 through the connecting blocks 4. Through the setting of the first hydraulic cylinder 8, the first driving block 6 can ascend and descend in the first sliding hole 5, thereby driving the pressing plate 7 to ascend and descend. Through the descent of the pressing plate 7, the mask plate can be pressed on the suction mechanism. Through the setting of the suction mechanism, the mask plate can be sucked, thereby being fixed.

[0114] Embodiment 3:

[0115] In this embodiment, in addition to the structural features of the foregoing embodiments, the suction mechanism further comprises:

[0116] The mounting block 9 is arranged on the side opposite to the two connecting blocks 4, and the mounting block 9 is provided with a movable cavity;

[0117] The air suction member is arranged on the side wall of the mounting block 9;

[0118] A plurality of groups of suction pipes 10 are arranged above the mounting block 9 and extend into the movable cavity through the mounting block 9, and the plurality of groups of suction pipes 10 are arranged along the width direction of the mounting block 9 at intervals, respectively. Each group of suction pipes 10 comprises a plurality of suction pipes 10 arranged along the length direction of the mounting block 9 at intervals;

[0119] A plurality of suction discs 11 are arranged at the openings of the suction pipes 10 away from the mounting block 9;

[0120] A plurality of air pipes 12 are connected to the openings of the suction pipes 10 in the movable cavity at one end and connected to the air suction member at the other end through the mounting block 9;

[0121] And a lifting structure is arranged, with a fixed end arranged at the bottom of the movable cavity and an active end connected to the suction pipes 10 in the movable cavity;

[0122] The mounting block 9 is provided with an embedding groove 18 for the suction disc 11, and the lifting structure is used to lift and lower the plurality of suction pipes 10;

[0123] First, the mask plate is placed on the plurality of suction discs 11, and then the pressing plate 7 is lowered to press the mask plate on the suction disc 11. At this time, the air suction member is used to suck air, and the air pipe 12 and the suction pipe 10 are used to transfer air, so that the suction disc 11 can suck the mask plate. When the suction disc 11 sucks the mask plate, the lifting structure is lowered to embed the suction disc 11 in the embedding groove 18, so that the mask plate is just attached to the top end of the mounting block 9, and the mask plate bottom end is resisted when the polishing mechanism polishes.

[0124] Embodiment 4:

[0125] In this embodiment, in addition to the structural features of the foregoing embodiments, the lifting structure further comprises:

[0126] The first moving plate 13 is fitted and slides on the inner wall of the movable cavity, the outermost circle of the suction pipes 10 penetrates and is connected to the moving plate, and the middle part of the moving plate is provided with a through hole 15 for other suction pipes 10 to pass through;

[0127] The second moving plate 14 is sleeved on the outer side wall of the other air pipe 12;

[0128] The second hydraulic cylinder 16 is connected at the fixed end to the cavity bottom of the movable cavity, and at the output end to the first moving plate 13;

[0129] And the third hydraulic cylinder 17 is connected at the fixed end to the cavity bottom of the movable cavity, and at the output end to the second moving plate 14;

[0130] When the second hydraulic cylinder 16 is extended and retracted, the first moving plate 13 rises and falls, so that the outermost circle of the suction pipes 10 rises and falls, and when the third hydraulic cylinder 17 is extended and retracted, the second moving plate 14 rises and falls, so that the inner circle of the suction pipes 10 rises and falls;

[0131] When polishing the mask, the second hydraulic cylinder 16 and the third hydraulic cylinder 17 are simultaneously extended and retracted, so that the first moving plate 13 and the second moving plate 14 are simultaneously raised and lowered, so that all the suction cups 11 are raised and lowered, achieving overall fixation of the mask, when chemical etching the mask, the second hydraulic cylinder 16 and the third hydraulic cylinder 17 are simultaneously extended, so that the mask is located above the mounting block 9, at this time the suction cups 11 on the second moving plate 14 cancel the suction, and then the third hydraulic cylinder 17 is lowered, so that only the outer suction cups 11 are adsorbed to the mask, so as to better chemical etching.

[0132] Embodiment 5:

[0133] In this embodiment, in addition to the structural features of the preceding embodiments, the polishing mechanism further comprises:

[0134] Two support plates 19 are oppositely arranged on both sides of the top end of the working box 1 and located between the thickness gauge 31 and the adsorption device, and the side of each of the two support plates 19 away from each other is provided with a second sliding hole 20;

[0135] Two second driving blocks 21 are respectively located at one end of both sides of the working box 1 and respectively penetrate the corresponding second sliding holes 20 at the other end;

[0136] A bearing plate 23 is arranged on the side opposite to the two second driving blocks 21;

[0137] Two mounting plates 24 are arranged at intervals at one end of the bottom end of the bearing plate 23 and extend towards the bottom of the working box 1 at the other end;

[0138] The polishing roller 25 is rotatably connected between the two mounting plates 24;

[0139] The fourth hydraulic cylinders 22 are fixedly arranged on the two sides of the working box 1, and the output ends of the fourth hydraulic cylinders 22 are connected to the second driving blocks 21.

[0140] The mounting plate 24 is provided with a rotating motor for driving the polishing roller 25.

[0141] The second driving blocks 21 can stably move in the second sliding holes 20 through the cooperation of the supporting plates 19 and the second sliding holes 20. The bearing plates 23 can stably move through the arrangement of the second driving blocks 21. The polishing rollers 25 can be installed through the arrangement of the two mounting plates 24. The second driving blocks 21 can indirectly drive the polishing rollers 25 to rise and fall through the arrangement of the fourth hydraulic cylinders 22, so as to polish the mask plate with different thicknesses. The polishing rollers 25 can rotate and polish through the arrangement of the rotating motor. The above-mentioned polishing rollers 25 polish the middle part of the mask plate, and the two sides of the mask plate are not polished, so that the outer ring of the suction cups 11 can stably adsorb the mask plate when the back surface of the mask plate is adsorbed.

[0142] Embodiment 6:

[0143] In addition to the structural features of the foregoing embodiments, the chemical etching device further comprises:

[0144] The mounting cover 26 is arranged on the top of the working box 1 and located on the side of the thickness gauge 31 away from the polishing device.

[0145] The partition plate 27 is arranged in the mounting cover 26, so that the mounting cover 26 is divided into the etching area 28 and the cleaning area 29.

[0146] The etching mechanism is arranged at the top end of the mounting cover 26 and penetrates the mounting cover 26 to be located in the etching area 28.

[0147] The cleaning mechanism is arranged at the top end of the mounting cover 26 and penetrates the mounting cover 26 to be located in the cleaning area 29.

[0148] The baffles 30 are arranged at the bottom end of the inner wall of the working box 1, so that two collection areas are formed at the bottom end of the mounting cover 26.

[0149] The sidewalls of the working box 1 are provided with the liquid outlet pipes 32 communicating with the collection areas.

[0150] Through the installation of the cover 26, the etching mechanism and the cleaning mechanism can be installed. Through the installation of the partition 27, the etching mechanism can perform chemical etching in the etching area 28, and the cleaning mechanism can perform cleaning in the cleaning area 29. Through the installation of the two baffles 30, two collection areas are formed to collect the etching liquid of the etching mechanism and the cleaning liquid of the cleaning mechanism, and finally the liquids are discharged through the liquid outlet pipe 32.

[0151] Embodiment 7:

[0152] In this embodiment, in addition to the structural features of the foregoing embodiments, the etching mechanism further comprises:

[0153] Two first liquid storage tanks 33 are arranged at the top end of the installation cover 26, and one of the first liquid storage tanks 33 is provided with a heating element;

[0154] A mixing tank 34 is arranged at the top end of the installation cover 26, and the mixing tank 34 is provided with a temperature measuring element 37;

[0155] Two first liquid pumps 35 are fixedly arranged at the top end of the two first liquid storage tanks 33, and the input ends of the first liquid pumps 35 are connected to the corresponding first liquid storage tanks 33, and the output ends are connected to the mixing tank 34;

[0156] Two second liquid pumps 36 are fixedly arranged in the mixing tank 34, the input ends of the second liquid pumps 36 penetrate into the mixing tank 34, and the output ends of the second liquid pumps 36 penetrate into the etching area 28 of the installation cover 26;

[0157] Two first connecting rods 38 are arranged at the top end of the etching area 28;

[0158] A first output pipe 39 is connected to one end of the two first connecting rods 38 away from the top end of the etching area 28;

[0159] And a plurality of nozzles 40 are arranged at the bottom end of the first output pipe 39 and are connected to the first output pipe 39, and the output ends of the nozzles 40 extend away from the first output pipe 39;

[0160] The output ends of the second liquid pumps 36 penetrate into the first output pipe 39 and are connected to the first output pipe 39, the first output pipe 39 is arranged perpendicular to the length direction of the two taps, and the first liquid storage tanks 33 are filled with etching liquid;

[0161] Through the setting of the two first liquid storage tanks 33, etching liquid can be placed, through the setting of the heating element, the temperature of the etching liquid in one of the first liquid storage tanks 33 can be raised, through the setting of the first liquid pump 35, the etching liquid in the two first liquid storage tanks 33 can be respectively transported into the mixing tank 34, through the setting of the mixing tank 34, the etching liquid in the two first liquid storage tanks 33 can be mixed, so that etching liquids of different temperatures are mixed, through the setting of the temperature measuring element 37, the temperature of the mixed etching liquid can be measured, through the setting of the two first connecting rods 38, the first output pipe 39 can be installed, through the setting of the second liquid pump 36, the etching liquid in the mixing tank 34 can be input into the first output pipe 39, through the setting of the plurality of nozzles 40, the etching liquid can be output in rows to perform row-by-row chemical etching on the width direction of the mask plate.

[0162] Embodiment 8:

[0163] In this embodiment, in addition to including the structural features of the preceding embodiments, the cleaning mechanism further includes:

[0164] A second liquid storage tank 41 is arranged at the top end of the mounting cover 26;

[0165] Two second connecting rods 42 are arranged at the top end of the cleaning area 29 in a spaced manner;

[0166] A second output pipe 43 is connected to one end of the two second connecting rods 42 away from the top end of the cleaning area 29;

[0167] A plurality of spray heads 44 are arranged at the bottom end of the second output pipe 43 in a spaced manner and are in communication with the second output pipe 43, and the output end of the spray head 44 extends away from the second output pipe 43;

[0168] A third liquid pump 45 is arranged with a fixed end in the second liquid storage tank 41, an input end penetrating the second liquid storage tank 41 and being in communication with the second liquid storage tank 41, and an output end penetrating the mounting cover 26 and being in communication with the second output pipe 43;

[0169] The second liquid storage tank 41 is provided with cleaning liquid, and the second output pipe 43 is arranged perpendicularly to the tap rod 3;

[0170] Through the setting of the second liquid storage tank 41, cleaning liquid can be placed, through the setting of the two second connecting rods 42, the second output pipe 43 can be installed, through the setting of the third liquid pump 45, the cleaning liquid in the second liquid storage tank 41 can be input into the second output pipe 43, and through the setting of the plurality of spray heads 44, the mask plate can be cleaned.

[0171] Embodiment 9:

[0172] In this embodiment, in addition to including the structural features of the preceding embodiments, the following steps are further included:

[0173] S1: first need to place the unprocessed mask on the adsorption device, the adsorption device is carried out to the unprocessed grinding plate adsorption;

[0174] S2: start polishing mechanism and make the drive motor 2 continue to move the adsorption device, when the adsorption device moves through the polishing mechanism, the polishing mechanism polishes the grinding plate thickness, and the different places are polished to different thicknesses, and the polishing is completed;

[0175] S3: when the mask is polished, the drive motor 2 drives the adsorption device to move to the thickness gauge 31 below to detect the thickness;

[0176] S4: when the mask does not reach the thickness requirement, the same as S2, the second polishing is carried out to realize the thickness requirement;

[0177] S5: when the mask thickness reaches the requirement, the drive motor 2 moves the adsorption device to the chemical etching device below, the chemical etching device carries out chemical etching and cleaning to the grinding plate, at this time, the first face mask is completed chemical etching;

[0178] S6: at this time, the operator turns over the mask, the adsorption device carries out reverse adsorption to the mask, and then the second face chemical etching of the mask is carried out;

[0179] S7: the drive motor 2 moves out of the chemical etching device, and the operator takes the processed mask;

[0180] Through the setting of S1, the mask can be installed and fixed, through the setting of S2, the mask can be polished to different thicknesses at different positions, through the setting of S3, the thickness of the mask can be determined, through the setting of S4, the thickness requirement of the mask can be accurately reached, through the setting of S5, the first face of the mask can be chemically etched and cleaned, through the setting of S6, the second face of the mask can be chemically etched and cleaned, and through the setting of S7, the processed mask is taken out.

[0181] The above only describes the preferred embodiments of the present application, and does not limit the present application, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A production process of a mask production apparatus, characterized by, The mask production equipment comprises: A working box (1) is cuboid and is placed on the ground at the bottom end; Two drive motors (2) are fixed at both sides of one end wall of the working box (1) respectively, and the output ends penetrate into the working box (1); Two tap rods (3) are fixedly connected with the output ends of the drive motors (2) at one end respectively, and are rotatably connected with the inner walls of the working box (1) on the side away from the drive motors (2) at the other end respectively; An adsorption device is movably connected on the two tap rods (3), and a pressing end is arranged on the inner wall of the working box (1), and an adsorption end faces the top opening of the working box (1); A thickness gauge (31) is fixedly arranged at both sides of the top end of the working box (1), and the output end is located above the top opening of the working box (1); A polishing mechanism is fixedly arranged at both sides of the top end of the working box (1), and the output end extends into the working box (1); And a chemical etching device is arranged at the top opening of the working box (1); The adsorption device is used for adsorbing the unprocessed mask, the thickness gauge (31) is used for measuring the thickness of the mask, the polishing mechanism is used for polishing the mask to different thicknesses, and the chemical etching device is used for chemical etching of different intensities on the masks with different thicknesses; The production process comprises the following steps: S1: First, place the unprocessed mask to be processed on the adsorption device, and the adsorption device adsorbs the unprocessed mask; S2: Start the polishing mechanism and continue to move the adsorption device by the drive motor (2), when the adsorption device moves through the polishing mechanism, the polishing mechanism polishes the mask to different thicknesses at different positions, and the polishing is completed; S3: After the mask is polished, the drive motor (2) drives the adsorption device to move to the position below the thickness gauge (31) to detect the thickness; S4: When the thickness of the mask does not meet the requirement, the second polishing is performed according to S2 to meet the thickness requirement; S5: When the thickness of the mask meets the requirement, the mask is coated with photoresist, exposed on both sides, developed, and then reinstalled on the adsorption device for chemical etching, the drive motor (2) moves the adsorption device to the position below the chemical etching device, the chemical etching device performs chemical etching on the mask and cleans it, and the first face of the mask is etched chemically at this time; S6: At this time, the operator turns over the mask, the adsorption device adsorbs the mask reversely, and the second face of the mask is etched chemically; S7: The drive motor (2) moves the adsorption device out of the chemical etching device, and the operator takes the processed mask.

2. The production process of a mask production apparatus according to claim 1, wherein The adsorption device comprises: Two connecting blocks (4) are arranged on the two tap rods (3) respectively; An adsorption mechanism is connected to the opposite side of the two connecting blocks (4) respectively, and an adsorption end faces the opening of the working box (1); Two first sliding holes (5) are arranged at both sides of the working box (1) respectively, and the other end openings are communicated with the working box (1) respectively; Two first driving blocks (6) are located at both sides of the working box (1) respectively, and the other ends penetrate the first sliding holes (5) and are communicated with the working box (1) respectively; A pressing plate (7) is arranged on the opposite side of the two first driving blocks (6) and located in the working box (1); Two first hydraulic cylinders (8) are arranged on the two sides of the two working boxes (1), and the fixed ends of the two first hydraulic cylinders (8) are connected to the two first driving blocks (6); When the output end of the first hydraulic cylinder (8) is retracted, the two first driving blocks (6) are lowered, so that the pressing plate (7) is lowered, and the mask plate on the adsorption end of the adsorption mechanism is pressed.

3. The production process of a mask production apparatus according to claim 2, wherein The adsorption mechanism comprises: A mounting block (9) is arranged on the opposite side of the two connecting blocks (4), and the mounting block (9) is provided with a movable cavity; An air suction member is arranged on the side wall of the mounting block (9); A plurality of suction pipe groups (10) are arranged above the mounting block (9) and extend into the movable cavity through the mounting block (9), and the plurality of suction pipe groups (10) are arranged along the width direction of the mounting block (9) at intervals, and each suction pipe group (10) comprises a plurality of suction pipes (10) arranged along the length direction of the mounting block (9) at intervals; A plurality of suction discs (11) are arranged at the openings of the suction pipes (10) away from the mounting block (9); A plurality of air pipes (12) are connected to the openings of the suction pipes (10) in the movable cavity at one end and connected to the air suction member at the other end; And a lifting structure is arranged on the bottom of the movable cavity and connected to the suction pipes (10) in the movable cavity; The top end of the mounting block (9) is provided with an embedding groove (18) for embedding the suction disc (11), and the lifting structure is used for lifting and lowering the plurality of suction pipes (10).

4. The production process of a mask production apparatus according to claim 3, wherein The lifting structure comprises: A first moving plate (13) is arranged on the inner wall of the movable cavity, and the outermost circle of the suction pipes (10) penetrates and is connected to the first moving plate (13), and the middle part of the first moving plate (13) is provided with a through hole (15) for the inner circle of the suction pipes (10); A second moving plate (14) is arranged on the outer side wall of the inner circle of the suction pipes (10); A second hydraulic cylinder (16) is connected to the bottom of the movable cavity at the fixed end and connected to the first moving plate (13) at the output end; And a third hydraulic cylinder (17) is connected to the bottom of the movable cavity at the fixed end and connected to the second moving plate (14) at the output end; When the second hydraulic cylinder (16) is extended and retracted, the first moving plate (13) is lifted and lowered, so that the outermost circle of the suction pipes (10) is lifted and lowered, and when the third hydraulic cylinder (17) is extended and retracted, the second moving plate (14) is lifted and lowered, so that the inner circle of the suction pipes (10) is lifted and lowered.

5. The production process of a mask production apparatus according to claim 1, wherein The polishing mechanism comprises: Two support plates (19) are arranged on the two sides of the top end of the working box (1) and located between the thickness gauge (31) and the adsorption device, and the side of each support plate (19) away from each other is provided with a second sliding hole (20); Two second driving blocks (21) are arranged on the two sides of the working box (1) at one end and penetrate the corresponding second sliding holes (20) at the other end; A bearing plate (23) is arranged on the opposite side of the two second driving blocks (21); Two mounting plates (24) are arranged at the bottom end of the bearing plate (23) and extend towards the bottom of the working box (1); A polishing roller (25) is rotatably connected between the two mounting plates (24); And two fourth hydraulic cylinders (22) are fixedly arranged on the two sides of the working box (1) and have output ends connected to the second driving blocks (21); The mounting plate (24) is provided with a rotating motor for driving the polishing roller (25).

6. The production process of a mask production apparatus according to claim 1, wherein The chemical etching device comprises: A mounting cover (26) is arranged on the top of the working box (1) and located on the side of the thickness gauge (31) away from the polishing device; A partition plate (27) is arranged in the mounting cover (26), so that the mounting cover (26) is divided into an etching area (28) and a cleaning area (29); An etching mechanism is arranged at the top end of the mounting cover (26) and has an output end penetrating through the mounting cover (26) and located in the etching area (28); A cleaning mechanism is arranged at the top end of the mounting cover (26) and has an output end penetrating through the mounting cover (26) and located in the cleaning area (29); And two baffles (30) are arranged at the bottom end of the inner wall of the working box (1), so that two collection areas are formed at the bottom end of the mounting cover (26); The side wall of the working box (1) is provided with a liquid outlet pipe (32) communicating with the collection area.

7. The production process of a mask production apparatus according to claim 6, wherein The etching mechanism comprises: Two first liquid storage tanks (33) are arranged at the top end of the mounting cover (26), and one of the first liquid storage tanks (33) is provided with a heating element; A mixing tank (34) is arranged at the top end of the mounting cover (26), and the mixing tank (34) is provided with a temperature measuring element (37); Two first liquid pumps (35) are fixedly arranged at the top end of the two first liquid storage tanks (33), and the input ends of the first liquid pumps (35) are connected to the corresponding first liquid storage tanks (33), and the output ends are connected to the mixing tank (34); A second liquid pump (36) is fixedly arranged in the mixing tank (34), and the input end penetrates into the mixing tank (34), and the output end penetrates through the mounting cover (26) and is located in the etching area (28); Two first connecting rods (38) are arranged at the top end of the etching area (28); A first output pipe (39) is connected to one end of the two first connecting rods (38) away from the top end of the etching area (28); And a plurality of nozzles (40) are arranged at the bottom end of the first output pipe (39) and communicate with the first output pipe (39), and the output ends extend away from the first output pipe (39); The output end of the second liquid pump (36) penetrates through the mounting cover (26) and communicates with the first output pipe (39), the first output pipe (39) is perpendicular to the length direction of the two taps, and the first liquid storage tank (33) contains etching liquid.

8. The production process of a mask production apparatus according to claim 6, wherein The cleaning mechanism comprises: A second liquid storage tank (41) is arranged at the top end of the mounting cover (26); Two second connecting rods (42) are arranged at the top end of the cleaning area (29); A second output pipe (43) is connected to one end of the two second connecting rods (42) away from the top end of the cleaning area (29); A plurality of spray heads (44) are arranged at intervals at the bottom end of the second output pipe (43) and are in communication with the second output pipe (43), and the output end extends away from the second output pipe (43); A third liquid pumping device (45) is arranged at the fixed end of the second liquid storage tank (41), the input end penetrates the second liquid storage tank (41) and is in communication with the second liquid storage tank (41), and the output end penetrates the mounting cover (26) and is in communication with the second output pipe (43); The second liquid storage tank (41) is provided with cleaning liquid, and the second output pipe (43) is arranged perpendicularly to the tap rod (3).

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