A stepped structure gold finger and a manufacturing method thereof

Abstract

The application discloses a stepped structure golden finger and a manufacturing method thereof, and the manufacturing method comprises the following steps: S01, forming a first circuit layer and a second circuit layer on a first core layer, and forming an upper layer hole in a vertical direction; S02, performing electroplating on the first circuit layer to form an upper layer golden finger; S03, performing lamination and pre-pressing on the lower surface of the second circuit layer of the first circuit substrate and the upper surface of a prepreg; S04, filling the upper layer hole and the prepreg opening with conductive silver paste; S05, forming a third circuit layer and a fourth circuit layer on a second core layer, and forming a lower layer hole in a vertical direction; S06, performing electroplating on the third circuit layer to form a lower layer golden finger, and then performing conductive silver paste processing; and S07, performing press bonding on the lower surface of the first circuit substrate and the upper surface of a second circuit substrate. The stepped structure golden finger and the manufacturing method thereof provided by the application do not need to perform PP slotting, PI tape and depth control fishing operations, do not need to protect the golden finger area, are not easy to damage the base material, and save the process and production cost.

Description

TECHNICAL FIELD

[0001] The present application relates to a kind of ladder structure gold finger and its manufacturing method, belong to PCB board processing technical field. BACKGROUND

[0002] With the development of electronic product technology, the production and processing technology of printed circuit board is more and more high, in the design end is continuously developed to high layer, high density direction today, in order to meet the needs of different structure and space design, ladder structure gold finger is invented, but its processing method is still more traditional in gold finger area selection PP (prepreg) slot + place PI (polyimide) tape design, then using the depth of control dredging to PI tape position again tear off PI tape to expose gold finger. Because gasket is too thick, PP window blind dredging is easy to damage substrate, and need to tear off PI tape manually, increase process and production cost, can not meet the manufacture of this new design of ladder structure gold finger. SUMMARY

[0003] The technical problem to be solved by the present application is to overcome the defects of the prior art, provide a kind of ladder structure gold finger and its manufacturing method, without PP slotting, PI tape and control dredging operation, without protecting gold finger area, not easy to damage substrate, and save process and production cost.

[0004] To solve the above technical problems, the technical scheme adopted by the present application is:

[0005] A kind of ladder structure gold finger manufacturing method, comprising the following steps:

[0006] S01, first circuit substrate is sent out, drilled and electroplated, to form first circuit layer and second circuit layer on the upper surface and lower surface of first core layer respectively, and to form upper layer hole in vertical direction;

[0007] S02, the first circuit layer and the second circuit layer of the first circuit substrate are etched to form a pattern, and then the first circuit layer is electroplated to form an upper layer gold finger;

[0008] S03, after cutting processing of prepreg, the second circuit layer below the first circuit substrate is laminated and pre-pressed with the upper surface of the prepreg;

[0009] S04, laser is carried out on the upper layer hole of the first circuit substrate, the prepreg covering the upper layer hole is burned off, and then conductive plug silver paste processing is carried out, the upper layer hole and the opening of the prepreg directly below it are filled with conductive silver paste;

[0010] S05, the second circuit substrate is sent out, drilled and electroplated, to form third circuit layer and fourth circuit layer on the upper surface and lower surface of second core layer respectively, and to form lower layer hole in vertical direction.

[0011] S06, etching the third and fourth circuit layers of the second circuit substrate to form a pattern, then electroplating the third circuit layer to form a lower layer gold finger, and then processing a conductive plug silver paste to fill the lower layer hole with the conductive silver paste;

[0012] S07, pressing the lower surface of the first circuit substrate and the upper surface of the second circuit substrate, allowing the third circuit layer blank to be filled with the semi-cured sheet during the pressing process, then sintering the upper and lower layer holes with conductive silver paste to form a through hole, and finally performing a solder mask and molding operation.

[0013] In S01, the first circuit substrate is a two-layer substrate or a multi-layer substrate formed by pressing multiple substrates.

[0014] In S03, the semi-cured sheet is cut to a size of 100um smaller than the area corresponding to the upper layer gold finger on the first circuit substrate.

[0015] In S03, the pre-pressing temperature is 100-130℃, and the pressure is 0.5-1MPa.

[0016] In S05, the second circuit substrate is a two-layer substrate or a multi-layer substrate formed by pressing multiple substrates.

[0017] A stepped structure gold finger is obtained by the above method.

[0018] The present application provides a stepped structure gold finger and its manufacturing method, which realizes the communication between layers by sintering the upper layer hole on the first circuit substrate and the lower layer hole on the second circuit substrate to form a through hole through the upper and lower layers when pressing the lower surface of the first circuit substrate and the upper surface of the second circuit substrate, thereby eliminating the need for drilling, electroplating, patterning and other processes after pressing, thus eliminating the need for protecting the gold finger area, reducing the risk of damaging the substrate, and saving process and production costs. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 The structure diagram obtained by step one of the stepped structure gold finger manufacturing method of the present application;

[0020] Figure 2 The structure diagram obtained by step two of the stepped structure gold finger manufacturing method of the present application;

[0021] Figure 3 The structure diagram obtained by step three of the stepped structure gold finger manufacturing method of the present application;

[0022] Figure 4 The structure diagram obtained by step four of the stepped structure gold finger manufacturing method of the present application;

[0023] Figure 5 the structure diagram obtained in step five of the method for manufacturing the gold finger with ladder structure of the present application;

[0024] Figure 6 the structure diagram obtained in step six of the method for manufacturing the gold finger with ladder structure of the present application.

[0025] Figure 7 the structure diagram obtained in step seven of the method for manufacturing the gold finger with ladder structure of the present application.

[0026] In the drawing, the reference signs are as follows: 100 - first circuit substrate; 101 - first core layer; 102 - first circuit layer; 103 - second circuit layer; 104 - upper layer hole; 105 - prepreg; 106 - upper layer gold finger; 200 - second circuit substrate; 201 - second core layer; 202 - third circuit layer; 203 - fourth circuit layer; 204 - lower layer hole; 206 - lower layer gold finger. DETAILED DESCRIPTION

[0027] The present application will be further described in conjunction with the drawings. The following examples are only used to more clearly illustrate the technical solutions of the present application, and cannot be used to limit the protection scope of the present application.

[0028] The present application discloses a method for manufacturing a gold finger with ladder structure, comprising the following steps:

[0029] Step one, providing a first circuit substrate 100, which is a two-layer substrate or a multi-layer substrate formed by pressing a plurality of substrates. The first circuit substrate 100 is subjected to feeding, drilling and electroplating to form a first circuit layer 102 and a second circuit layer 103 on the upper surface and the lower surface of the first core layer 101 respectively, and to form an upper layer hole 104 in the vertical direction, and the obtained structure is as shown in Figure 1 .

[0030] Step two, etching the first circuit layer 102 and the second circuit layer 103 of the first circuit substrate 100 to form a pattern, and then electroplating the first circuit layer 102 to form an upper layer gold finger 106, and the obtained structure is as shown in Figure 2 .

[0031] Step three, cutting and processing the prepreg 105, and cutting the area corresponding to the upper layer gold finger 106 on the first circuit substrate 100 to a size of 100 um inward. In addition, the prepreg 105 in the present embodiment is a common prepreg, and there is no need to select a low-flow prepreg, thereby reducing the requirement for material selection in the process. Then, the second circuit layer 103 below the first circuit substrate 100 and the upper surface of the prepreg 105 are laminated and pre-pressed, and the obtained structure is as shown in Figure 3 . The pre-pressing temperature is 100-130℃, and the pressure is 0.5-1MPa.

[0032] Step four, laser on the first circuit substrate 100 on the upper layer hole 104, the semi-cured sheet 105 covering the upper layer hole 104 is burned, and then the conductive plug silver paste processing is carried out, the upper layer hole 104 and the semi-cured sheet 105 directly below it are opened to be filled with conductive silver paste, and the structure obtained is as shown in Figure 4 , that is, the complete first circuit substrate 100.

[0033] Step five, provide the second circuit substrate 200, the second circuit substrate 200 is two-layer substrate or multi-layer substrate pressed from multiple substrates. The second circuit substrate 200 is subjected to material feeding, drilling and electroplating to form a third circuit layer 202 and a fourth circuit layer 203 on the upper surface and the lower surface of the second core layer 201 respectively, and a lower layer hole 204 is formed in the vertical direction, and the structure obtained is as shown in Figure 5 .

[0034] Step six, etching the third circuit layer 202 and the fourth circuit layer 203 of the second circuit substrate 200 to form a pattern, then electroplating the third circuit layer 202 to form a lower layer gold finger 206, and then performing conductive plug silver paste processing to fill the lower layer hole 204 with conductive silver paste, and the structure obtained is as shown in Figure 6 .

[0035] Step seven, press the lower surface of the first circuit substrate 100 and the upper surface of the second circuit substrate 200, so that the blank of the third circuit layer 202 is filled with the semi-cured sheet 105 during the pressing process, and then the upper layer hole 104 and the lower layer hole 204 are sintered to form a through hole by conductive silver paste, and finally the anti-soldering and shaping operations are carried out, the first circuit layer 102 and the fourth circuit layer 203 are the final outer layer pattern, and the product with the stepped structure gold finger structure is obtained, and the specific structure is as shown in Figure 7 .

[0036] The application also discloses a stepped structure gold finger made of the stepped structure gold finger.

[0037] The stepped structure gold finger and the manufacturing method thereof provided by the application realize the communication between layers by sintering the upper layer hole on the first circuit substrate and the lower layer hole on the second circuit substrate to form a through hole through the upper and lower layers when the lower surface of the first circuit substrate and the upper surface of the second circuit substrate are pressed, so that the board after pressing does not need to be drilled, electroplated, patterned and the like, and therefore the gold finger area does not need to be protected, the substrate is not easy to be damaged, and the process and production cost are saved.

[0038] The above merely is the preferred embodiment of the present application, it should be pointed out that: for ordinary skilled in the art, without departing from the principles of the present application, can also make a number of improvements and refinements, these improvements and refinements should also be considered the scope of protection of the present application.

Claims

1. A method for making a ladder structure gold finger, the method comprising: Includes the following steps: ​ S01, the first circuit board (100) is processed by feeding, drilling and electroplating to form a first circuit layer (102) and a second circuit layer (103) on the upper and lower surfaces of the first core layer (101) respectively, and an upper layer hole (104) is formed in the vertical direction. S02, the first circuit layer (102) and the second circuit layer (103) of the first circuit substrate (100) are etched to form a pattern, and then the first circuit layer (102) is electroplated to form an upper gold finger (106). S03, after cutting the prepreg (105), the second circuit layer (103) of the first circuit board (100) is stacked and pre-pressed on the top of the prepreg (105); S04, the upper hole (104) on the first circuit board (100) is laser-etched to burn off the prepreg (105) covering the upper hole (104), and then conductive silver paste is processed to fill the opening of the upper hole (104) and the prepreg (105) directly below it with conductive silver paste. S05, the second circuit board (200) is processed by feeding, drilling and electroplating to form a third circuit layer (202) and a fourth circuit layer (203) on the upper and lower surfaces of the second core layer (201) respectively, and a lower layer hole (204) is formed in the vertical direction. S06, the third circuit layer (202) and the fourth circuit layer (203) of the second circuit substrate (200) are etched to form a pattern, and then the third circuit layer (202) is electroplated to form the lower gold finger (206), and then conductive silver paste is processed to fill the lower hole (204) with conductive silver paste. S07, the first circuit board (100) is pressed together on the bottom and the second circuit board (200), and the blank space of the third circuit layer (202) is filled by the prepreg (105) during the pressing process. Then, the upper hole (104) and the lower hole (204) are sintered with conductive silver paste to form through holes. Finally, solder resist and molding operations are performed.

2. The method of claim 1, wherein: In S01, the first circuit board (100) is a multilayer board formed by laminating two or more substrates.

3. The method of claim 1, wherein: In S03, the area corresponding to the upper gold finger (106) on the prepreg (105) and the first circuit board (100) is cut to an inward size of 100um.

4. The method of claim 1, wherein: In SO3, the pre-compression temperature is 100~130℃ and the pressure is 0.5~1MPa.

5. The method of claim 1, wherein: In S05, the second circuit board (200) is a multilayer board formed by laminating two or more substrates.

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