A plasma degumming monitoring rate sheet, its production and use method

Abstract

The present invention discloses a plasma degumming rate monitoring sheet, its production method, and its use method, belonging to the technical field of printed circuit boards. The sheet is fabricated by forming a metal carrier board into a strip-shaped test sheet, milling a plurality of stepped grooves of varying depths into the strip-shaped test sheet, filling the stepped grooves with PCB plugging resin, baking the test sheet until the resin is completely cured, and then polishing the sheet to produce a plasma degumming rate monitoring sheet. This effectively improves the accuracy of degumming rate testing on PCB products.

Description

Technical Field

[0001] The present invention relates to a plasma degumming monitoring rate sheet, a manufacturing method and a use method thereof, and in particular to a PCB board visualized plasma degumming monitoring rate sheet, a manufacturing method and a use method thereof, and belongs to the technical field of PCB board manufacturing. Background Art

[0002] During PCB processing, after drilling, gases such as CF4, O2, and N2 are used, along with high-voltage RF lines to ionize the gas molecules. This cleans residual adhesive from the hole walls, improving the surface condition of the resin inside the hole and increasing the material's surface hydrophilicity. Improved surface hydrophilicity increases the plating area's contact with the plating solution, helping to eliminate air bubbles within the hole and strengthening the bond between the plating layer and the hole wall. However, this plasma gas degumming method requires high machine degumming rates and daily monitoring of degumming uniformity across different areas within the cavity.

[0003] Conventional technology typically uses a pre-cured resin sheet of a certain thickness, and under a fixed degumming program, routinely monitors the degumming rate by measuring the difference in weight before and after degumming. This fixed degumming test program only monitors the differences in degumming rate capabilities between machines. This method is not only time-sensitive but also fails to address issues such as weight errors caused by moisture absorption by the pre-cured resin sheet between weighings. Using gravimetric methods to assess degumming rate is not time-sensitive, and moisture absorption by the test sheet exposed to air can affect the accuracy of the test sheet weight, ultimately affecting the accuracy of the degumming rate test. Summary of the Invention

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a method for manufacturing a visual plasma degumming monitoring rate sheet for PCB boards, thereby improving the degumming rate test accuracy of PCB products.

[0005] In order to achieve the above object, the technical solution adopted by the present invention is:

[0006] In a first aspect, the present invention provides a method for manufacturing a plasma debonding monitoring rate sheet, comprising:

[0007] The metal carrier is formed into a strip test piece;

[0008] Milling a number of stepped grooves of different depths on the strip test piece;

[0009] Fill the step groove with PCB plugging resin and bake until the PCB plugging resin is completely cured to obtain a test piece;

[0010] The test piece was polished to obtain a plasma debonding monitoring rate piece.

[0011] In combination with the first aspect, further, the number of the stepped grooves is at least 10, and the length and width of the stepped grooves are equal.

[0012] Furthermore, the intervals between the stepped grooves are the same, and the depths of the stepped grooves increase or decrease in sequence.

[0013] Furthermore, the depth of the stepped groove ranges from 1 to 10 μm.

[0014] Furthermore, the length of the stepped groove is 0.7±0.1 cm and the width is 0.7±0.1 cm.

[0015] In a second aspect, the present invention provides a plasma degumming monitoring rate sheet, which is manufactured according to any of the above-mentioned manufacturing methods. The plasma degumming monitoring rate sheet needs to be baked within a set temperature range before use.

[0016] In a third aspect, the present invention provides a method for using a plasma degumming monitoring rate sheet, comprising:

[0017] Select a fixed plasma degumming equipment as the standard machine and set the operating parameters of the standard machine;

[0018] Adjust the setting conditions in the machine program to obtain the main reaction time required to clean the PCB plug resin in the step groove of each area in the plasma degumming monitoring rate sheet under different setting conditions.

[0019] In combination with the third aspect, further, the operating parameters of the standard machine include operating power, gas flow, cavity air pressure, main reaction temperature and placement position of the plasma degumming monitoring rate sheet.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The method for preparing the glue removal rate sheet of the present invention is simple and convenient, and the test results of the method are timely, which can avoid the problem of poor test result accuracy caused by environmental moisture absorption in the traditional weighing method and improve accuracy.

[0022] By using the plasma degumming monitoring rate sheet of the present invention, the degumming rate performance of the machine can be visually identified after the machine reacts, which is convenient and fast, and improves time efficiency.

[0023] The degumming rate sheet of the present invention is easy to use. For the same machine, the differential degumming rate performance of different areas in the cavity can be tested and monitored through the same program main reaction time. For different machines, the ion degumming rate sheet is placed at a fixed position in the cavity, and the same program main reaction time is used. The degumming rate capacity differences of different machines are monitored through the status of the degumming rate sheets of different machines after the reaction. For high-priced products, the degumming rate sheet is attached to the board, and the performance of the degumming rate card is visually monitored to truly monitor the performance of the PCB board product, avoid the amount of scrap caused by physical slicing confirmation, and reduce product processing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a flowchart of the production of a PCB board visualized plasma debonding monitoring rate sheet provided by an embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of the overall structure of a PCB board visualized plasma debonding monitoring rate sheet provided by an embodiment of the present invention;

[0026] Figure 3 1. A top view of a PCB board visualized plasma debonding monitoring rate sheet provided by an embodiment of the present invention;

[0027] Figure 4 This is a schematic diagram of the colloid in the groove of the PCB board visualized plasma degumming monitoring rate sheet provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0028] The present invention will be further described below in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present invention and are not intended to limit the scope of protection of the present invention.

[0029] The use of adhesive removal rate sheets during PCB processing is crucial for monitoring the quality of adhesive removal within holes. During PCB processing, adhesive removal rate sheets monitor the process of removing residual adhesive and debris from holes drilled by PCB processing machinery through aerosol chemistry. The use of adhesive removal rate sheets is an essential step in PCB processing and crucial for ensuring PCB quality and reliability. If residual adhesive within the hole is not completely removed, it can easily lead to poor connection between the hole wall and the internal PAD connector, resulting in poor electrical functionality of the PCB.

[0030] Therefore, daily monitoring of the degumming capacity and stability of each device is very important. This is mainly achieved by using degumming rate sheets for daily monitoring.

[0031] like Figure 1As shown in FIG, a flowchart of manufacturing a PCB board visualized plasma debonding monitoring rate sheet provided by an embodiment of the present invention specifically includes the following steps:

[0032] Step 1: Metal substrate machining: Select a metal substrate, which can be made of copper, iron, aluminum or other metal materials that are easy to CNC machine and wear-resistant.

[0033] 1.1. The metal substrate is machined into a 10cm*1cm*5mm strip test piece with a dimensional accuracy of ±0.1mm.

[0034] 1.2. The above-mentioned strip test pieces are further processed using a CNC machine to mill grooves of equal distance, equal size and different designed depths, with a milling groove depth accuracy of ±0.1μm.

[0035] Step 2: Processing and making the resin in the groove:

[0036] 2.1. Use a vacuum plugging machine, set the machine vacuum degree to 10-30mbar, the printing pressure to 0.8-1.0Mpa, and the plugging scraper speed to 18-25mm / s.

[0037] 2.2. Bake the sample in a box oven at 155°C for 2 hours to completely cure the resin in the step groove.

[0038] 2.3. Use 1200 grit sandpaper to clean the excess resin on the surface of the test piece and bake it at 120℃*1H before actual use.

[0039] like Figure 2 As shown, it is a schematic diagram of the overall structure of the PCB board visualized plasma degumming monitoring rate sheet provided by an embodiment of the present invention, including a base carrier board 1, a groove A with a depth of 1 μm, a groove B with a depth of 2 μm, a groove C with a depth of 3 μm, a groove D with a depth of 4 μm, a groove E with a depth of 5 μm, a groove F with a depth of 6 μm, a groove G with a depth of 7 μm, a groove H with a depth of 8 μm, a groove I with a depth of 9 μm, and a groove J with a depth of 10 μm.

[0040] By fixing the main parameters such as operating power, gas flow, chamber pressure, main reaction temperature, and test piece placement on the selected standard prototype, the main reaction time required to clean the colloid in the stepped grooves of each area of ​​the degumming rate sheet under different main reaction time settings is tested. The program main reaction time corresponding to each area is defined as the standard degumming rate card time, as shown in Table 1 below:

[0041] Table 1:

[0042] area Groove length / cm Groove width / cm Glue thickness / μm Main reaction time T(min) A 0.7 0.7 1 5～10 B 0.7 0.7 2 11～20 C 0.7 0.7 3 21～30 D 0.7 0.7 4 31～40 E 0.7 0.7 5 41～50 F 0.7 0.7 6 51～60 G 0.7 0.7 7 61～70 H 0.7 0.7 8 71～80 I 0.7 0.7 9 81～90 J 0.7 0.7 10 90～100

[0043] The main reaction time capabilities of degumming corresponding to different step troughs are shown in Table 1, which is the PCB board visualized plasma degumming monitoring rate sheet capability card of this application.

[0044] The method for preparing the adhesive removal rate sheet of the present invention is simple and convenient, and the test results of the method are timely, which can avoid the problem of poor test result accuracy caused by environmental moisture absorption in the traditional weighing method, and the accuracy can be improved by about 40%.

[0045] By using the plasma degumming monitoring rate sheet of the present invention, the degumming rate performance of the machine can be visually identified after the machine reacts, which is convenient and fast, and the time efficiency can be improved by about 20%.

[0046] like Figure 3 As shown, it is a top view of the visualized plasma degumming monitoring rate sheet for the PCB board provided by an embodiment of the present invention. From the figure, the outer dimensions of the base carrier board 1 and the outer dimensions of each groove can be seen, and the positions of the grooves on the base carrier board 1 are evenly distributed.

[0047] like Figure 4 As shown, it is a schematic diagram of the colloid in the groove of the PCB board visualized plasma degumming monitoring rate sheet provided by an embodiment of the present invention, wherein Figure a is a schematic diagram of a volume of glue block with a thickness of 1μm, and a groove A with a depth of 1μm is filled with 7mm*7mm*1μm glue; Figure b is a schematic diagram of a glue block with a thickness of 10μm, and a groove J with a depth of 10μm is filled with 7mm*7mm*10μm of colloid.

[0048] The present invention provides a method for using a plasma degumming monitoring rate sheet, comprising:

[0049] Select a fixed plasma degumming equipment as the standard machine and set the operating parameters of the standard machine;

[0050] Adjust the settings in the machine program to obtain the main reaction time required to clean the PCB plug resin in the step groove in each area of ​​the degumming rate sheet under different setting conditions.

[0051] Specifically, among the existing equipment, select the best-performing line equipment as the benchmark for comparing the degumming capabilities of other line equipment. This means its degumming performance under different degumming parameters is used as the standard for degumming capabilities under different degumming parameters. Then, adjust the degumming speed sheet from Area A to Area J using this standard machine, and then clean each area to the desired degumming parameters, setting the reaction time.

[0052] The degumming rate sheet of the present invention is easy to use. For the same machine, the plasma degumming monitoring rate sheet can be placed at different positions of the machine, and any main reaction time can be used to monitor the degumming conditions of each area of ​​the plasma degumming monitoring rate sheet after the reaction, thereby monitoring the degumming rate capabilities of different areas in a single cavity.

[0053] For different machines, the ion degumming rate sheet is placed at a fixed position in the chamber, and any main reaction time is used. The degumming rate performance of the standard machine is compared with the degumming rate status of different machines after the reaction to monitor the difference in degumming rate capabilities of different machines.

[0054] For high-difficulty and high-priced PCB products, a standard debonding rate sheet can be attached to the board to accurately present the actual debonding performance of the PCB product, avoid product scrapping caused by traditional slicing confirmation methods, and reduce product processing costs.

[0055] For ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be considered as the scope of protection of the present invention.

Claims

1. A method for manufacturing a plasma degumming monitoring rate sheet, characterized in that: include: The metal carrier is formed into a strip test piece; Milling a number of stepped grooves of different depths on the strip test piece; Fill the step groove with PCB plugging resin and bake until the PCB plugging resin is completely cured to obtain a test piece; The test piece was polished to obtain a plasma debonding monitoring rate piece.

2. The production method according to claim 1, characterized in that There are at least 10 stepped grooves, and the length and width of the stepped grooves are equal.

3. The production method according to claim 1, characterized in that The intervals between the step grooves are the same, and the depths of the step grooves increase or decrease in sequence.

4. The production method according to claim 1, characterized in that The step groove depth ranges from 1 to 10 μm.

5. The production method according to claim 1, characterized in that: The length of the stepped groove is 0.7±0.1 cm and the width is 0.7±0.1 cm.

6. A plasma degumming monitoring rate sheet, characterized in that: According to the manufacturing method according to any one of claims 1-5, the plasma degumming monitoring rate sheet needs to be baked within a set temperature range before use.

7. The method for using a plasma degumming monitoring rate sheet according to claim 6, characterized in that: include: Select a fixed plasma degumming equipment as the standard machine and set the operating parameters of the standard machine; Adjust the setting conditions in the machine program to obtain the main reaction time required to clean the PCB plug resin in the step groove of each area in the plasma degumming monitoring rate sheet under different setting conditions.

8. The method for using a plasma degumming monitoring rate sheet according to claim 7, characterized in that: The operating parameters of the standard machine include operating power, gas flow, chamber pressure, main reaction temperature and the placement position of the plasma degumming monitoring rate plate.

Images