Test fixture and test method for three-dimensional package ceramic housing

Abstract

The application is suitable for the technical field of testing, and provides a test fixture and a test method for a three-dimensional packaging ceramic shell. The test fixture comprises a bottom plate, an upper mold assembly, four side push mold assemblies and a PCB. The bottom plate is provided with a quadrilateral through hole for placing an array pad surface of a product to be tested. Array pads on the PCB are located below the quadrilateral through hole on the bottom plate. First surfaces of the four side push mold assemblies are perpendicular to the bottom plate and are respectively placed opposite to four side surfaces of the product to be tested. The upper mold assembly is used for connecting with upper pads of the product to be tested. The first surfaces of the side push mold assemblies and the upper mold assembly are provided with probes, one end of the probes is used for corresponding connection with pads on other five surfaces of the product to be tested. The other end of the probes is connected with one end of a flying wire, the other end of the flying wire is connected with grid pads on the PCB. The PCB further comprises secondary wiring. The test fixture provided by the application can realize automatic testing of the electrical performance of the three-dimensional packaging ceramic shell in combination with a test device.

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