Glue dispensing device and process for printed circuit board processing

By designing a dispensing device for printed circuit boards, the blowing mechanism and clamping mechanism are used to achieve uniform coating and rapid drying of glue, which solves the problem of uneven filling of glue during the dispensing process of printed circuit boards and improves improve production efficiency and product quality.

CN117861955BActive Publication Date: 2025-01-21KUNSHANQIANDENGHUAXINGXIANLU BOARD FACTORY
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Patent Information

Application Number
CN202310364087.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-04-07
Publication Date
2025-01-21
Estimated Expiration
2043-04-07

AI Technical Summary

Technical Problem

During the dispensing process of printed circuit boards, the glue is not evenly filled, resulting in too thick glue layer, prolonged solidification time and not fully covered in part, affecting the use of printed circuit boards.

Method used

A dispensing device is designed, including a workbench, an air blowing mechanism and a clamping mechanism. The air blowing mechanism drives the printed circuit board to shake through the electro-hydraulic rod, uses air pressure and hot air to accelerate the drying of the glue, and generates heat through the friction ball and friction plate, which is stored in the phase change thermal storage fluid and delayed use to save energy.

Benefits of technology

It effectively solves the problem of uneven glue filling, improves the glue application efficiency and drying speed, and ensures uniform coverage and high-quality production of printed circuit boards.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application discloses a glue dispensing device and a process for printed circuit board processing, which are applied in the field of printed circuit board processing. By setting an air blowing mechanism, a glue gun is used to dispense glue on the printed circuit board after it is installed, and then the heating tube and the electric hydraulic rod are turned on successively. During the operation, the electric hydraulic rod can not only repeatedly drive the printed circuit board to shake to disperse the glue, but also use the air pressure to suck the external gas into the heat storage box, and at the same time, it can repeatedly compress the gas storage sleeve to send the gas to the heat storage box to help the hot air to the surface of the printed circuit board, and heat the glue to help it dry faster, effectively improving its gluing efficiency; not only that, the electric hydraulic rod can also drive the friction ball and the friction plate through the ring to repeatedly rub and generate heat, and the phase change heat storage liquid will store the generated heat. After a period of time, the heating tube can be turned off to save energy, and finally the purpose of drying the glue can also be achieved.
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Description

Technical Field

[0001] The present application relates to the field of printed circuit board processing, and in particular to a glue dispensing device and a process thereof for printed circuit board processing. Background Art

[0002] Printed circuit boards, also known as printed circuit boards, are important electronic components, the support of electronic components, and the carrier of electrical connections of electronic components. Because it is made using electronic printing technology, it is called a "printed" circuit board. In the actual production process, printed circuit boards need to be glued, which can not only bond the circuits, but also serve the purpose of moisture-proof insulation.

[0003] In the current printed circuit board dispensing process, the dispensing rate is too fast and it is easy to cause deviations, resulting in uneven glue filling. This not only causes the glue to accumulate too much without dispersion, making the glue layer too thick and the solidification time prolonged, but also makes some positions unable to be completely covered by glue, ultimately rendering the printed circuit board unusable.

[0004] Therefore, there is an urgent need for a dispensing device and process for printed circuit board processing. Summary of the invention

[0005] The purpose of the present application is to solve the problem of uneven glue at the glue dispensing position of the current printed circuit board. Compared with the prior art, a glue dispensing device for printed circuit board processing is provided, including a workbench, a printed circuit board is arranged on the top of the workbench, a support column is slidably connected to one side of the workbench, an electric guide rail is arranged inside the support column, a fixed column is slidably connected to the outer side of the support column through the electric guide rail, a movable guide rail is arranged inside the fixed column, the fixed column is slidably connected to a telescopic rod through the movable guide rail, a clamping ring is fixedly connected to the outer side of the telescopic rod, a glue gun is clamped on the inner wall of the clamping ring, a glue pump is arranged on the outer side of the workbench, a hose is fixedly connected between the top of the glue pump and the glue gun, and an air blowing mechanism is fixedly connected to the top of the workbench;

[0006] The blowing mechanism includes a heat storage box, one end of the heat storage box close to the printed circuit board is slidably connected to a push plate, a plurality of electric hydraulic rods are arranged inside the heat storage box, one end of the electric hydraulic rod is fixedly connected to the side end of the push plate, a sealing plate slidably connected to the inner wall of the heat storage box is fixedly connected to the outer wall of the electric hydraulic rod, a heat storage box is arranged on the outer wall of the electric hydraulic rod, and a plurality of air supply pipes are fixedly connected to the end of the heat storage box away from the push plate;

[0007] The heat storage box comprises a heat preservation box body, the interior of the heat preservation box body is filled with sensible heat storage liquid, a heating pipe is arranged inside the sensible heat storage liquid, the outside of the heat preservation box body is fixedly connected with a gas storage jacket communicating with the inside thereof, and the outside of the heat preservation box body is respectively fixedly connected with an air inlet pipe and a pair of hot air pipes;

[0008] One end of the push plate is fixedly connected to a sliding plate, one side of the sliding plate is provided with a clamping mechanism, the printed circuit board is located in the clamping mechanism, a corrugated tube is fixedly penetrated inside the heat storage box, a pair of adjacent hot air pipes are fixedly connected and communicated with the corrugated tube, one end of the corrugated tube is slidably connected to a sleeve, one end of the sleeve is fixedly connected to an air outlet plate with a hollow interior, by setting an air blowing mechanism, when the printed circuit board is installed, glue is applied to it with a glue gun, and then the heating tube and the electric hydraulic rod are opened successively. During the working process, the electric hydraulic rod can not only repeatedly drive the printing The circuit board is shaken to disperse the glue, and the air pressure is used to suck the outside gas into the heat storage box. At the same time, the air storage sleeve can be repeatedly compressed to send the gas into the heat storage box, helping the hot air to be sent to the surface of the printed circuit board, and heating the glue to help it dry faster, effectively improving its gluing efficiency; not only that, the electric hydraulic rod can also use the ring to carry the friction ball and the friction plate to repeatedly rub to generate heat, and the phase change heat storage fluid will store the generated heat. After a period of time, the heating tube can be turned off to save energy, and ultimately the purpose of drying the glue can also be achieved.

[0009] Furthermore, one-way valves are arranged inside the bellows, the air inlet pipe and the air supply pipe, and a hot air hood is detachably connected to the bottom of the air outlet plate, and a pair of hot air hoods are located above the printed circuit board.

[0010] Furthermore, the clamping mechanism includes a first clamping plate and a second clamping plate, the interior of the second clamping plate is fixedly connected with a limit screw, and the outer thread of the limit screw is sleeved with a limit valve located above the first clamping plate.

[0011] Furthermore, a pair of limiting holes is opened at the bottom of the sliding plate, and two pairs of guide limiting strips are fixedly connected to the top of the workbench, and the sliding plate slides above the workbench through the guide limiting strips.

[0012] Furthermore, the corrugated tube is made of a bendable hard material, and the heat-insulating box body is made of a heat-insulating material.

[0013] Furthermore, the heat storage box also includes a heat conduction box, a connecting rod is fixedly connected between the heat conduction box and the insulation box body, the interior of the heat conduction box is filled with phase change heat storage liquid, the interior of the heat conduction box is fixedly connected to a friction plate, the outer wall of the electric hydraulic rod is fixedly connected to a ring, and the inner side of the ring is rotatably connected to a plurality of friction balls through a fixed axis.

[0014] Furthermore, the friction plate is annular in structure and is made of heat-conducting material, and the friction plate is compatible with the friction ball.

[0015] Furthermore, the sensible heat storage fluid uses liquid water, and the phase change thermal storage fluid uses paraffin oil.

[0016] Furthermore, a hollow arc-shaped blowing plate is detachably connected to the bottom of the air outlet plate, and a sealing plug is clamped on the inner wall of the air outlet plate.

[0017] The steps of dispensing process for printed circuit board processing are as follows:

[0018] S1, fixing: placing the printed circuit board between the first clamping plate and the second clamping plate, and fixing it with a limit valve;

[0019] S2, gluing: the glue gun is moved to a specific position through the electric guide rail and the moving guide rail, and the glue is applied;

[0020] S3, air blowing heating: adjust the bellows to align the hot air hood with the printed circuit board, then turn on the electric hydraulic rod and the heating tube, and use the gas pressure to blow the hot air onto the surface of the printed circuit board;

[0021] S4, reciprocating shaking: the electric hydraulic rod moves the printed circuit board left and right to thin the glue and spread it evenly, speeding up the glue drying and spreading efficiency;

[0022] S5, remove the printed circuit board, turn it over and repeat the above operation.

[0023] Compared with the prior art, the advantages of this application are:

[0024] (1) By setting up an air blowing mechanism, after the printed circuit board is installed, glue is applied to it using a glue gun, and then the heating tube and the electric hydraulic rod are turned on in turn. During the operation, the electric hydraulic rod can not only repeatedly drive the printed circuit board to shake to disperse the glue, but also use air pressure to absorb external gas into the heat storage box. At the same time, it can repeatedly compress the air storage sleeve to send the gas into the heat storage box to help the hot air to the surface of the printed circuit board. By heating the glue, it helps it to dry faster, effectively improving its gluing efficiency; not only that, the electric hydraulic rod can also use the ring to drive the friction ball and the friction plate to repeatedly rub to generate heat, and the phase change heat storage fluid will store the generated heat. After a period of time, the heating tube can be turned off to save energy, and the purpose of drying the glue can also be achieved in the end.

[0025] (2) The printed circuit board is fixed by a clamping mechanism, and then the position of the glue gun is adjusted by CNC to apply glue to a specific position of the printed circuit board. By setting up an air blowing mechanism and turning on the electric hydraulic rod, the printed circuit board is repeatedly shaken left and right through the sliding plate to "shake" the glue on it, making the glue thinner and increasing the coating area.

[0026] (3) During the operation of the electric hydraulic rod, the one-way valve repeatedly absorbs external gas into the heat storage box, and repeatedly squeezes the gas storage sleeve to allow gas to enter the insulation box. The hot air emitted by the heated sensible heat storage liquid in the insulation box is then blown onto the printed circuit board to heat and dry the blown glue, accelerate the solidification of the glue, and prevent the glue from flowing around when turning over, which affects the gluing effect.

[0027] (4) During the operation of the electric hydraulic rod, its driving end repeatedly rubs against the friction plate with multiple friction balls through the sleeve, so that mechanical energy is converted into heat energy and stored in the phase-change thermal storage fluid. When the paraffin oil is melted to a certain extent, the heating tube is turned off, and only the friction balls perform friction heating on the paraffin oil. The sensible heat storage fluid directly absorbs the heat of the phase-change thermal storage fluid through the heat transfer box, and transmits the hot air through the hot air pipe and the bellows, which can ultimately achieve the effect of drying the glue on the surface of the printed circuit board. The friction between the friction balls and the friction plates can generate heat, which can save energy.

[0028] (5) By removing the hot air hood and installing the blowing plate, since the blowing plate only blows air in one direction, the wind force is used to increase the rate of glue dispersion, further achieving a more uniform glue distribution effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is the overall structure diagram of this application;

[0030] Figure 2 For this application Figure 1 A magnified structural diagram;

[0031] Figure 3 The blowing mechanism and bellows structure diagram of this application;

[0032] Figure 4 This is the internal structure diagram of the heat storage box of this application;

[0033] Figure 5 For this application Figure 4 The enlarged structure diagram at B;

[0034] Figure 6 This is a diagram of the internal structure of the heat preservation box of this application;

[0035] Figure 7 This is a three-dimensional structural diagram of the interior and exterior of the heat preservation box of the present application;

[0036] Figure 8 This is a diagram of the internal structure of the heat preservation box body of Example 2 of the present application;

[0037] Fig. 9 This is a structural diagram of the blowing plate of this application;

[0038] Fig.10 This is a process flow chart of this application.

[0039] Description of the numbers in the figure:

[0040] 1. Workbench; 2. Support column; 3. Fixed column; 4. Telescopic rod; 5. Snap ring; 6. Glue gun; 7. Glue pump; 8. Hose; 9. Blowing mechanism; 91. Heat storage box; 92. Push plate; 93. Sealing plate; 94. Electric hydraulic rod; 95. Heat storage box; 951. Insulation box body; 952. Connecting rod; 953. Heat conduction box; 954. Phase change heat storage liquid; 955. Hot air pipe; 956. Friction plate ; 957, friction ball; 958, sensible heat storage liquid; 959, air storage sleeve; 96, air supply pipe; 10, sliding plate; 11, bellows; 12, sleeve; 13, air outlet plate; 14, hot air hood; 15, second clamping plate; 16, limit screw; 17, first clamping plate; 18, limit valve; 19, guide limit strip; 20, heating tube; 21, air inlet pipe; 22, air blowing plate; 23, sealing plug. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0042] Embodiment 1:

[0043] This application discloses a glue dispensing device for printed circuit board processing, please refer to Figure 1 , including a workbench 1, a support column 2 is slidably connected to one side of the workbench 1, an electric guide rail is arranged inside the support column 2, a fixed column 3 is slidably connected to the outer side of the support column 2 through the electric guide rail, a movable guide rail is arranged inside the fixed column 3, a telescopic rod 4 is slidably connected to the fixed column 3 through the movable guide rail, a printed circuit board is arranged on the top of the workbench 1, a clamping ring 5 is fixedly connected to the outer side of the telescopic rod 4, a glue gun 6 is clamped on the inner wall of the clamping ring 5, a glue pump 7 is arranged on the outer side of the workbench 1, a hose 8 is fixedly connected between the top of the glue pump 7 and the glue gun 6, and a blowing mechanism 9 is fixedly connected to the top of the workbench 1.

[0044] Specifically, the workbench 1 and the support column 2 are also connected by an electric guide rail, and the movement of the glue gun 6 can be achieved by computer electronic control.

[0045] See also Figure 4The blowing mechanism 9 includes a heat storage box 91, and one end of the heat storage box 91 close to the printed circuit board is slidably connected to a push plate 92. A plurality of electric hydraulic rods 94 are arranged inside the heat storage box 91, and one end of the electric hydraulic rod 94 is fixedly connected to the side end of the push plate 92. A sealing plate 93 slidably connected to the inner wall of the heat storage box 91 is fixedly connected to the outer wall of the electric hydraulic rod 94. A heat storage box 95 is arranged on the outer wall of the electric hydraulic rod 94. A plurality of air supply pipes 96 are fixedly connected to one end of the heat storage box 91 away from the push plate 92.

[0046] See also Figure 6-7 The heat storage box 95 includes a heat preservation box body 951, the interior of the heat preservation box body 951 is filled with a sensible heat storage liquid 958, a heating tube 20 is arranged inside the sensible heat storage liquid 958, the outside of the heat preservation box body 951 is fixedly connected to a gas storage jacket 959 communicating with the inside thereof (a through hole is opened on one side of the heat preservation box body 951, and the gas storage jacket 959 is communicated with the inner cavity of the heat preservation box body 951 through the through hole), and the outside of the heat preservation box body 951 is respectively fixedly connected to an air inlet pipe 21 and a pair of hot air pipes 955.

[0047] See also Figure 3 One end of the push plate 92 is fixedly connected to the sliding plate 10, one side of the sliding plate 10 is provided with a clamping mechanism, the printed circuit board is located in the clamping mechanism, the interior of the heat storage box 91 is fixedly penetrated by a bellows 11, an adjacent pair of hot air pipes 955 are fixedly connected to and communicate with the bellows 11, one end of the bellows 11 is slidably connected to a sleeve 12, one end of the sleeve 12 is fixedly connected to an air outlet plate 13 with a hollow interior, and the bellows 11, the air inlet pipe 21 and the air supply pipe 96 are all provided with a one-way valve.

[0048] The bottom of the air outlet plate 13 is detachably connected with a hot air cover 14, a pair of hot air covers 14 are located above the printed circuit board, and one end of the sleeve 12 close to the air outlet plate 13 is detachably connected with a porous drying plate made of activated carbon.

[0049] In the initial state, the hot air hood 14 is vertically positioned above the heat storage tank 91 so as not to affect the normal operation of the glue gun 6 .

[0050] See also Figure 2 The clamping mechanism includes a first clamping plate 17 and a second clamping plate 15 . The second clamping plate 15 is internally fixedly connected with a limit screw 16 . The external thread of the limit screw 16 is sleeved with a limit valve 18 located above the first clamping plate 17 .

[0051] A pair of limiting holes are formed at the bottom of the sliding plate 10 , and two pairs of guide limiting strips 19 are fixedly connected to the top of the workbench 1 . The sliding plate 10 slides above the workbench 1 through the guide limiting strips 19 .

[0052] The corrugated tube 11 is made of a bendable hard material, and the heat-insulating box body 951 is made of a heat-insulating material.

[0053] During operation, the printed circuit board is placed between the first clamping plate 17 and the second clamping plate 15, and the plurality of limit valves 18 are rotated successively to fix the printed circuit board. Then, the position of the glue gun 6 is adjusted by a computer to apply glue to a specific position of the printed circuit board. Then, the position and state of the hot air cover 14 can be adjusted through the plurality of bellows 11, and the heating tube 20 and the electric hydraulic rod 94 are opened successively. On the one hand, the electric hydraulic rod 94 repeatedly shakes the printed circuit board left and right through the sliding plate 10 to "shake up" the glue above it to make the glue thinner and the coating area larger; on the other hand, during the operation of the electric hydraulic rod 94, external gas is repeatedly attracted to enter the heat storage box 91 through the air supply pipe 96, and the air storage sleeve 959 is repeatedly squeezed, so that the hot air emitted by the internally heated sensible heat storage liquid 958 is blown onto the printed circuit board through the bellows 11 and the air outlet plate 13, and the blown glue is heated and dried, accelerating the solidification of the glue, and avoiding the glue from flowing around when turning over, which affects the gluing effect.

[0054] See also Fig.10 , the dispensing process for printed circuit board processing, the steps are as follows:

[0055] S1, fixing: placing the printed circuit board between the first clamping plate 17 and the second clamping plate 15, and fixing it with a limit valve 18;

[0056] S2, gluing: moving the glue gun 6 to a specific position through the electric guide rail and the movable guide rail, and gluing is performed;

[0057] S3, air blowing heating: adjust the bellows 11 so that the hot air cover 14 is aligned with the printed circuit board, then open the electric hydraulic rod 94 and the heating tube 20, and use the gas pressure to blow the hot air onto the surface of the printed circuit board;

[0058] S4, reciprocating shaking: the electric hydraulic rod 94 moves the printed circuit board left and right to thin the glue and spread it evenly, thereby accelerating the glue drying and spreading efficiency;

[0059] S5, remove the printed circuit board, turn it over and repeat the above operation.

[0060] Embodiment 2:

[0061] This application discloses a glue dispensing device for printed circuit board processing, please refer to Figure 8The difference between this embodiment and embodiment 1 is that the following technical features are added: the heat storage box 95 also includes a heat conduction box 953, a connecting rod 952 is fixedly connected between the heat conduction box 953 and the insulation box body 951, the interior of the heat conduction box 953 is filled with a phase change heat storage liquid 954, the interior of the heat conduction box 953 is fixedly connected to a friction plate 956, the outer wall of the electric hydraulic rod 94 is fixedly connected to a ring, and the inner side of the ring is rotatably connected to a plurality of friction balls 957 through a fixed axis.

[0062] The friction plate 956 is annular in structure and is made of heat-conducting material. The friction plate 956 and the friction ball 957 are adapted for use.

[0063] The sensible heat storage fluid 958 is liquid water, and the phase change heat storage fluid 954 is paraffin oil.

[0064] A temperature sensor is also provided inside the heat preservation box body 951, and the heating tube 20 can be turned off when the set temperature is reached.

[0065] During the operation of the electric hydraulic rod 94, its driving end moves with the collar. Since a plurality of friction balls 957 are arranged on the outside of the collar, repeated friction between the friction balls 957 and the friction plates 956 converts mechanical energy into heat energy, which is stored by the phase-change heat storage liquid 954 (preferably paraffin oil). When the paraffin oil is thermally dissolved to a certain extent, the heating tube 20 is turned off, and only the friction balls 957 perform friction heating on the paraffin oil, while the sensible heat storage liquid 958 (preferably water) directly absorbs heat through the heat conduction box 953, and transmits the hot air through the hot air pipe 955 and the bellows 11. Finally, the glue on the surface of the printed circuit board can be dried. By utilizing the repeated friction between the friction balls 957 and the friction plates 956, energy can be saved.

[0066] Example 3

[0067] See also Fig. 9 The difference between this embodiment and embodiment 2 is that: the bottom of the air outlet plate 13 is detachably connected with a blow plate 22 in an arc-shaped hollow state, and the inner wall of the air outlet plate 13 is clamped with a sealing plug 23. At the beginning, the hot air cover 14 is disassembled.

[0068] By providing a blowing plate 22 that blows air in only one direction, the glue can be dispensed in a left or right direction. When the blowing plate 22 blows hot air, the efficiency of glue dispersion can be improved by utilizing wind force.

[0069] The above is only a preferred specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can make equivalent substitutions or changes within the technical scope disclosed in the present application according to the technical solution and its improved conception, which should be covered by the protection scope of the present application.

Claims

1. A glue dispensing device for processing printed circuit boards, comprising a workbench (1), a printed circuit board being arranged on the top of the workbench (1), a support column (2) being slidably connected to one side of the workbench (1), an electric guide rail being arranged inside the support column (2), a fixed column (3) being slidably connected to the outer side of the support column (2) via the electric guide rail, a movable guide rail being arranged inside the fixed column (3), and a telescopic rod (4) being slidably connected to the fixed column (3) via the movable guide rail, characterized in that: The outer side of the telescopic rod (4) is fixedly connected to a clamping ring (5), the inner wall of the clamping ring (5) is clamped to a glue gun (6), a glue pump (7) is arranged on the outer side of the workbench (1), a hose (8) is fixedly connected between the top of the glue pump (7) and the glue gun (6), and a blowing mechanism (9) is fixedly connected to the top of the workbench (1); The blowing mechanism (9) comprises a heat storage box (91), one end of the heat storage box (91) close to the printed circuit board is slidably connected to a push plate (92), a plurality of electric hydraulic rods (94) are arranged inside the heat storage box (91), one end of the electric hydraulic rod (94) is fixedly connected to the side end of the push plate (92), the outer wall of the electric hydraulic rod (94) is fixedly connected to a sealing plate (93) slidably connected to the inner wall of the heat storage box (91), the outer wall of the electric hydraulic rod (94) is provided with a heat storage box (95), and one end of the heat storage box (91) away from the push plate (92) is fixedly connected to a plurality of air supply pipes (96); The heat storage box (95) comprises a heat-insulating box body (951), the interior of the heat-insulating box body (951) is filled with a sensible heat storage liquid (958), a heating pipe (20) is arranged inside the sensible heat storage liquid (958), the exterior of the heat-insulating box body (951) is fixedly connected to an air storage jacket (959) communicating with the interior thereof, and the exterior of the heat-insulating box body (951) is respectively fixedly connected to an air inlet pipe (21) and a pair of hot air pipes (955); One end of the push plate (92) is fixedly connected to a sliding plate (10), one side of the sliding plate (10) is provided with a clamping mechanism, the printed circuit board is located in the clamping mechanism, a corrugated tube (11) is fixedly passed through the interior of the heat storage box (91), a pair of adjacent hot air pipes (955) are fixedly connected to the corrugated tube (11) and communicate with each other, one end of the corrugated tube (11) is slidably connected to a sleeve (12), and one end of the sleeve (12) is fixedly connected to an air outlet plate (13) with a hollow interior; The bellows (11), the air inlet pipe (21) and the air supply pipe (96) are all provided with check valves. During operation, the electric hydraulic rod (94) repeatedly draws external air into the heat storage box (91) through the air supply pipe (96) and repeatedly squeezes the air storage jacket (959), so that hot air emitted from the sensible heat storage liquid (958) heated inside the heat-insulating box body (951) is blown onto the printed circuit board through the bellows (11) and the air outlet plate (13).

2. The glue dispensing device for printed circuit board processing according to claim 1, characterized in that: A hot air cover (14) is detachably connected to the bottom of the air outlet plate (13), and a pair of the hot air covers (14) are located above the printed circuit board.

3. The glue dispensing device for printed circuit board processing according to claim 2, characterized in that: The clamping mechanism comprises a first clamping plate (17) and a second clamping plate (15); the interior of the second clamping plate (15) is fixedly connected to a limit screw (16); the exterior of the limit screw (16) is threadedly sleeved with a limit valve (18) located above the first clamping plate (17).

4. The glue dispensing device for printed circuit board processing according to claim 3, characterized in that: A pair of limiting holes are provided at the bottom of the sliding plate (10), and two pairs of guide limiting strips (19) are fixedly connected to the top of the workbench (1), and the sliding plate (10) is slidably connected to the workbench (1) via the guide limiting strips (19).

5. The glue dispensing device for printed circuit board processing according to claim 4, characterized in that: The corrugated tube (11) is made of a bendable hard material, and the heat-insulating box body (951) is made of a heat-insulating material.

6. The glue dispensing device for printed circuit board processing according to claim 1, characterized in that: The heat storage box (95) further comprises a heat conduction box (953), a connecting rod (952) being fixedly connected between the heat conduction box (953) and the heat insulation box body (951), the interior of the heat conduction box (953) being filled with a phase change heat storage liquid (954), a friction plate (956) being fixedly connected to the interior of the heat conduction box (953), a collar being fixedly connected to the outer wall of the electric hydraulic rod (94), and a plurality of friction balls (957) being rotatably connected to the inner side of the collar via a fixed shaft.

7. The glue dispensing device for printed circuit board processing according to claim 6, characterized in that: The friction plate (956) is annular in structure and is made of heat-conducting material. The friction plate (956) is adapted for use with the friction ball (957).

8. The glue dispensing device for printed circuit board processing according to claim 7, characterized in that: The sensible heat storage fluid (958) is liquid water, and the phase change heat storage fluid (954) is paraffin oil.

9. The glue dispensing device for printed circuit board processing according to claim 1, characterized in that: The bottom of the air outlet plate (13) is detachably connected to a blow plate (22) in an arc-shaped hollow state, and the inner wall of the air outlet plate (13) is clamped with a sealing plug (23).

10. A glue dispensing process for printed circuit board processing, characterized in that: The glue dispensing device for printed circuit board processing according to claim 3 is used, and the steps are as follows: S1, fixing: placing the printed circuit board between the first clamping plate (17) and the second clamping plate (15), and fixing it with a limit valve (18); S2, gluing: moving the glue gun (6) to a specific position through the electric guide rail and the moving guide rail, and gluing is performed; S3, air blowing heating: adjusting the bellows (11) so that the hot air cover (14) is aligned with the printed circuit board, then the electric hydraulic rod (94) and the heating tube (20) are turned on, and the hot air is blown onto the surface of the printed circuit board by using the gas pressure; S4, reciprocating shaking: the electric hydraulic rod (94) moves the printed circuit board left and right to thin the glue and spread it evenly, thereby accelerating the drying and spreading efficiency of the glue; S5, remove the printed circuit board, turn it over and repeat the above operation.

Citation Information

Patent Citations

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    CN112533396A

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