Pickup device and pickup method for ultra-thin chips

Abstract

The application discloses a pickup device and a pickup method for an ultrathin chip, and is applied to the technical field of ultrathin chip pickup devices.The technical scheme points of the application are as follows: a base is provided;at least two groups of needle assembly are coaxially and slidingly connected to the base along the vertical direction; a lifting assembly for synchronously driving the needle assembly to slide along the vertical direction is rotatably connected to the bottom of the base, so that the chip can be lifted; the lifting speed of the needle assembly gradually decreases from inside to outside; a rotating disc is rotatably connected to one end of the needle assembly away from the lifting assembly based on a driving recovery assembly; and a jet support assembly is arranged on the needle assembly.The application has the technical effect that the pickup efficiency of the ultrathin chip is ensured while the multi-step needle process is used to adapt to the pickup requirements of chips of different sizes, and damage to the ultrathin chip is avoided.

Description

Technical Field

[0001] This invention relates to the field of ultra-thin chip pickup device technology, and particularly to a pickup device and pickup method for ultra-thin chips. Background Technology

[0002] Currently, the increasing market demand for electronic devices has driven the rapid development of electronic device processing technology. Especially since the advent of flexible electronics, research on related production processes and manufacturing devices has increased significantly. Flexible electronics, an emerging electronic technology, involves fabricating organic or inorganic electronic components on flexible, stretchable plastic or thin metal substrates. With its unique flexibility and stretchability, as well as efficient and low-cost manufacturing processes, it has broad application prospects in information, energy, medical, and defense fields, such as flexible electronic displays, organic light-emitting diodes (OLEDs), printed RFID, thin-film solar panels, and surface-mount electronics. Compared to traditional electronic devices, flexible electronics require chips to have a certain degree of curvature adaptability, which has led to increasingly thinner chips; currently, chips used in experiments are approaching 10μm in thickness. However, ultra-thin chips are prone to bending and breakage and cannot withstand extreme impacts, posing a significant challenge to chip peeling technology. How to quickly and effectively peel off large-area, thin-thin chips is one of the urgent problems to be solved in the current electronic packaging field.

[0003] Currently, Chinese invention patent CN110504208B discloses a pick-up system. An external vacuum device extracts gas from the first and second vacuum channels, creating a negative pressure at the vacuum via, thus successfully adsorbing the blue film on the wafer. When the chip needs to be released, an external compressed air source introduces compressed air into the first and second compression channels, lifting the chip from the blue film through the compression via. However, for chips with low strength and thinness, controlling the pressure of the compressed gas during the process of lifting the chip from the film is difficult, potentially damaging the ultra-thin chip. Current technologies for picking up ultra-thin chips generally require a three-step or four-step pick-up design to avoid chip cracking caused by the pick-up. Multi-step pick-up processes cause less damage to surrounding chips during operation, but the process requires multiple steps to lift the chip, resulting in low efficiency and room for improvement. Summary of the Invention

[0004] The primary objective of this invention is to provide a pickup device for ultra-thin chips, which has the advantage of ensuring the efficiency of ultra-thin chip pickup while adapting to the pickup requirements of chips of different sizes using a multi-step ejector pin process, and avoiding damage to the ultra-thin chips.

[0005] The above-mentioned technical objective of the present invention is achieved through the following technical solution: a pickup device for ultra-thin chips, comprising a base; at least two sets of ejector pin assemblies are slidably connected to the base along the vertical direction; a lifting assembly is rotatably connected to the bottom of the base for synchronously driving the ejector pin assemblies to slide along the vertical direction to lift the chip; the lifting speed of the ejector pin assemblies decreases gradually from the inside to the outside; a rotating disk is rotatably connected to the end of the ejector pin assembly away from the lifting assembly based on a drive return assembly; and each ejector pin assembly is provided with a jet support assembly.

[0006] The present invention is further configured such that: the ejector assembly has 3 sets, namely a first ejector, a second ejector, and a third ejector from the inside out; the base is provided with a guide groove for guiding the sliding of the ejector assembly; a plurality of limiting guide blocks are uniformly fixed in the guide groove along the circumferential direction; the ejector assembly is uniformly provided with limiting guide grooves along the circumferential direction that cooperate with the limiting guide blocks, thereby restricting the rotation of the ejector assembly in the guide groove.

[0007] The present invention is further configured such that: the tops of the plurality of ejector pin assemblies are flush, the length of the ejector pin assemblies decreases progressively from the inside to the outside, the bottoms of the plurality of ejector pin assemblies have a stepped structure, the lifting assembly includes a first lifting thread respectively disposed on the outer side wall of the bottom of the ejector pin assembly, a rotating seat is provided on the base, a stepped groove is provided in the rotating seat to cooperate with the bottom of the ejector pin assembly, the groove wall of the stepped groove is provided with a second lifting thread to cooperate with the first lifting thread, and a drive motor for driving the rotating seat to rotate is fixedly provided on the base.

[0008] The present invention is further configured such that: the drive motor is a servo motor, and the transmission ratio between the first lifting thread and the second lifting thread decreases step by step from the inside to the outside, thereby realizing that the lifting speed of the ejector pin assembly decreases step by step from the inside to the outside.

[0009] The present invention is further configured such that: the drive return assembly includes a plurality of return grooves uniformly formed along the circumferential direction on the top of the ejector assembly; a drive groove is formed at the bottom of the return groove; a stepped plate is uniformly formed along the circumferential direction on the bottom of the rotating disk, which cooperates with the return groove and the drive groove; a return spring is fixedly provided in the return groove for abutting the stepped plate; an air blowing hole is formed on the side wall of the drive groove; an air blowing pipe and an air blowing pump are connected to the air blowing hole to blow air onto the stepped plate, pushing the stepped plate to slide in the return groove, thereby driving the rotating disk to rotate on the ejector assembly.

[0010] The present invention is further configured such that: the arc center angle of the recovery groove is not greater than 45°, and the angle at which the driving recovery component drives the rotating disk to rotate in a single operation is not higher than 30° and not lower than 15°.

[0011] The present invention is further configured such that: a plurality of the ejector pin assemblies are stacked on rotating disks to avoid chips located between adjacent ejector pin assemblies being suspended; a first rotating disk, a second rotating disk, and a third rotating disk are rotatably connected to the first ejector pin, the second ejector pin, and the third ejector pin, respectively; the outer shaft wall of the first rotating disk and the outer shaft wall of the second rotating disk extend to the inner shaft wall of the second ejector pin and the third ejector pin, respectively; a first stacking block and a second stacking block are respectively provided coaxially and outwardly on the top of the first rotating disk and the second rotating disk; a first stacking groove and a second stacking groove are respectively provided on the top of the second rotating disk and the third rotating disk for accommodating the first stacking block and the second stacking block; the upper surfaces of the first rotating disk, the second rotating disk, the third rotating disk, the first stacking block, and the second stacking block are flush.

[0012] The present invention is further configured such that: the jet support assembly includes a plurality of first jet holes and second jet holes respectively opened on the ejector assembly and the rotating disk, the first jet holes and the second jet holes are in contact and connected, the ejector assembly is fixedly provided with a jet pipe communicating with the first jet hole, the outer side wall of the ejector assembly is provided with a jet groove for avoiding the jet pipe, and the jet pipe is externally connected to an air pump assembly.

[0013] The present invention is further configured such that: the air pump assembly uses a frequency conversion air pump, the air pump assembly is coupled to the lifting assembly, and the height difference between the outer pin assembly and the central pin assembly is determined based on the running time and running speed of the lifting assembly, thereby changing the air pressure of the air pump assembly to ensure that the supporting force acting on the bottom of the chip remains constant.

[0014] The second objective of this invention is to provide a method for picking up ultra-thin chips, which has the advantage of ensuring the efficiency of picking up ultra-thin chips while adapting to the picking requirements of chips of different sizes using a multi-step ejector pin process, and avoiding damage to ultra-thin chips.

[0015] The above-mentioned technical objective of the present invention is achieved through the following technical solution: a method for picking up ultra-thin chips, employing a picking device for ultra-thin chips as described in any of the above technical solutions, comprising:

[0016] Step 1: The lifting assembly controls several pin assemblies to rise and lift the chip;

[0017] Step 2: During the rising process of the ejector pin assembly, the external ejector pin assembly gradually detaches from the bottom surface of the chip. After the ejector pin assembly detaches from the bottom surface of the chip, the jet support assembly jets air onto the bottom surface of the chip and keeps the supporting force acting on the bottom of the chip constant until the chip rises to the highest point.

[0018] Step 3: When the chip rises to its highest point, the innermost jet support component instantly jets air, causing the film at the bottom of the chip to detach from the rotating disk set on the top surface of the ejector assembly. At the same time, the drive recovery component drives the rotating disk to rotate instantly. After rotating a certain angle, the rotating disk returns to its initial position. During the rotation of the rotating disk, the rotating disk gradually blocks the jet jet process of the jet support component. During the return process of the rotating disk, the rotating disk gradually resumes the jet jet process of the jet support component, thereby reducing the adhesion between the chip and the film during the rotation and return process of the rotating disk, and realizing the rapid separation of the chip and the film.

[0019] In summary, the present invention has the following beneficial effects:

[0020] 1. Several sets of coaxially arranged ejector pin assemblies are set on the base, and a lifting assembly is set at the bottom of the base to drive the ejector pin assemblies to slide vertically. The lifting assembly adjusts the transmission ratio between the first and second lifting threads of the ejector pin assemblies from the inside to the outside, thereby gradually reducing the lifting speed of the ejector pin assemblies from the inside to the outside during the chip lifting process. Through a multi-step ejector pin process, it adapts to the picking requirements of chips of different sizes, reducing damage to the chips. At the same time, as the outer ejector pin assemblies gradually detach from the bottom surface of the chip during the chip lifting process, the jet support assembly set inside the ejector pin assembly provides support to the bottom of the chip by jetting air onto the bottom of the chip, avoiding damage to the ultra-thin chip. Because the air pump assembly of the jet support component uses a variable frequency air pump coupled to the drive motor of the lifting assembly, the distance between the ejector pin assembly and the bottom surface of the chip, as well as the height difference between the ejector pin assemblies, can be determined based on the running time and speed of the lifting assembly. This allows for real-time adjustment of the air pressure of the air pump assembly, thereby changing the support force acting on the bottom of the chip. This ensures that the support force acting on the bottom surface of the chip remains constant, preventing damage to the ultra-thin chip during the lifting process. The synchronous operation of multiple ejector pin assemblies avoids the need for multiple steps in the traditional multi-step ejector pin process to lift the chip, improving the efficiency of chip picking. At the same time, ejector pin assemblies can be added to the base according to the size of the chip, expanding the compatibility range.

[0021] 2. A rotating disk is set on the ejector assembly based on the drive recovery component. When the chip rises to the highest point, the innermost jet support component instantly jets air, causing the film at the bottom of the chip to detach from the rotating disk set on the top surface of the ejector assembly. At the same time, the drive recovery component drives the rotating disk to rotate instantly. After rotating a certain angle, the rotating disk returns to its initial position. During the rotation of the rotating disk, the first jet hole of the rotating disk is gradually blocked, thereby blocking the jetting process of the jet support component. When the rotating disk returns, it gradually resumes the jetting process of the jet support component, thereby reducing the adhesion between the chip and the film during the rotation and return process of the rotating disk, and realizing the rapid separation of the chip and the film. Attached Figure Description

[0022] Figure 1 This is a cross-sectional view of the overall structure of this embodiment;

[0023] Figure 2 yes Figure 1 Enlarged schematic diagram of part A;

[0024] Figure 3 yes Figure 1 Enlarged diagram of part B;

[0025] Figure 4 yes Figure 1 Enlarged schematic diagram of part C;

[0026] Figure 5 This is a schematic diagram of the structure of the driver response component in this embodiment.

[0027] Reference numerals: 1. Base; 11. Guide groove; 12. Limiting guide block; 2. Ejector pin assembly; 21. First ejector pin; 22. Second ejector pin; 23. Third ejector pin; 24. Limiting guide groove; 3. Lifting assembly; 31. First lifting thread; 32. Rotary seat; 33. Step groove; 34. Second lifting thread; 35. Drive motor; 4. Drive return assembly; 41. Return groove; 42. Drive groove; 43. Step plate; 44. Return spring; 45. Air blowing hole; 5. Rotary disk; 51. First rotating disk; 52. Second rotating disk; 53. Third rotating disk; 54. First stacking block; 55. Second stacking block; 56. First stacking groove; 57. Second stacking groove; 6. Air jet support assembly; 61. First air jet hole; 62. Second air jet hole; 63. Air jet pipe; 64. Air jet groove; 65. Air pump assembly. Detailed Implementation

[0028] The present invention will be further described in detail below with reference to the accompanying drawings.

[0029] Example 1:

[0030] refer to Figures 1 to 5A pickup device for ultra-thin chips includes a base 1. At least two sets of ejector pin assemblies 2 are slidably connected to the base 1 along a vertical direction, with a certain distance between the ejector pin assemblies 2. A lifting assembly 3 is rotatably connected to the bottom of the base 1 to synchronously drive the ejector pin assemblies 2 to slide along the vertical direction, thereby lifting the chip. The lifting speed of the ejector pin assemblies 2 decreases gradually from the inside to the outside. A rotating disk 5 is rotatably connected to the end of the ejector pin assembly 2 away from the lifting assembly 3 based on a drive return assembly 4. The rotating disk 5 reduces the adhesion between the chip and the film by causing relative rotation between the chip and the film while the chip is being lifted, thereby achieving rapid separation of the chip and the film. A pickup assembly is also provided for picking up the chip. After the chip is separated from the film, the pickup assembly picks up the chip. An air jet support assembly 6 is provided on each ejector pin assembly 2. The air jet support assembly 6 is used to maintain support for the chip even when the outer ejector pin assembly 2 is detached from the bottom surface of the chip during the lifting process, so as to avoid damage to the ultra-thin chip during the lifting process.

[0031] refer to Figure 1 and Figure 3 Specifically, the tops of several ejector pin assemblies 2 are flush, and the length of the ejector pin assemblies 2 decreases gradually from the inside to the outside. The bottoms of several ejector pin assemblies 2 have a stepped structure. The lifting assembly 3 includes a first lifting thread 31 respectively provided on the outer side wall of the bottom of the ejector pin assembly 2. A rotating seat 32 is rotatably connected to the base 1. The axis of the rotating seat 32 and the ejector pin assembly 2 are on the same vertical line. A stepped groove 33 that mates with the bottom of the ejector pin assembly 2 is provided in the rotating seat 32. A second lifting thread 34 that mates with the first lifting thread 31 is provided on the groove wall of the stepped groove 33. A drive motor 35 for driving the rotating seat 32 to rotate is fixed on the base 1. The drive motor 35 drives the rotating seat 32 to rotate, thereby realizing the synchronous lifting and lowering of the ejector pin assembly 2 through the mate between the second lifting thread 34 and the first lifting thread 31. The transmission ratio between the first lifting thread 31 and the second lifting thread 34 decreases step by step from the inside out, thereby achieving a step-by-step decrease in the lifting speed of the ejector assembly 2 from the inside out. This multi-step ejector process adapts to the picking requirements of chips of different sizes, reducing damage to the chips. In this embodiment, the drive motor 35 is a servo motor. The servo motor facilitates the control of the lifting speed of the ejector assembly 2, and also facilitates the summarization of the lifting speed and lifting distance, which is convenient for the jet support assembly 6 to perform jet control.

[0032] refer to Figure 1 and Figure 2Specifically, the ejector assembly 2 has three sets, namely the first ejector 21, the second ejector 22, and the third ejector 23 from the inside out. A guide groove 11 is provided on the base 1 to guide the sliding of the ejector assembly 2. Several limiting guide blocks 12 are uniformly fixed in the guide groove 11 along the circumferential direction. A limiting guide groove 24 is uniformly provided in the ejector assembly 2 along the circumferential direction to cooperate with the limiting guide blocks 12, thereby limiting the rotation of the ejector assembly 2 in the guide groove 11. The cooperation between the limiting guide blocks 12 and the limiting guide groove 24 ensures the stability of the lifting assembly during the lifting process on the base 1 and avoids shaking that could damage the ultra-thin chip. A plurality of rotating disks 5 of ejector pin assemblies 2 are stacked to avoid chips located between adjacent ejector pin assemblies 2 being suspended. A first rotating disk 51, a second rotating disk 52, and a third rotating disk 53 are rotatably connected to the first ejector pin 21, the second ejector pin 22, and the third ejector pin 23, respectively. The outer shaft wall of the first rotating disk 51 and the outer shaft wall of the second rotating disk 52 extend to the inner shaft wall of the second ejector pin 22 and the third ejector pin 23, respectively. A first stacking block 54 and a second stacking block 55 are respectively coaxially protruding outward from the top of the first rotating disk 51 and the second rotating disk 52. The stacking block 55 has a first stacking slot 56 and a second stacking slot 57 respectively opened on the top of the second rotating disk 52 and the third rotating disk 53 for accommodating the first stacking block 54 and the second stacking block 55. The upper surfaces of the first rotating disk 51, the second rotating disk 52, the third rotating disk 53, the first stacking block 54 and the second stacking block 55 are flush. The stacking block and the stacking slot are extended and set by the internal rotating disk 5, so as not to affect the lifting process of the lifting component, and also to avoid the impact of the cutout between adjacent lifting components on the ultra-thin chip.

[0033] refer to Figure 1 and Figure 5Specifically, the drive return assembly 4 includes several return grooves 41 evenly spaced along the circumferential direction on the top of the ejector assembly 2. A drive groove 42 is formed at the bottom of the return grooves 41. Both the return grooves 41 and the drive grooves 42 are arc-shaped and coaxial with the ejector assembly 2. Stepped plates 43, cooperating with the return grooves 41 and the drive grooves 42, are evenly spaced along the circumferential direction at the bottom of the rotating disk 5. A return spring 44 is fixed inside the return grooves 41 to abut against the stepped plates 43. Air holes 45 are formed on the sidewalls of the drive grooves 42. Air pipes and air pumps are connected to the air holes 45 to blow air onto the stepped plates 43, pushing the stepped plates 43 to slide in the return grooves 41, thereby driving the rotating disk 5 to move on top. The chip rotates on the pin assembly 2. When the chip rises to its highest point, the innermost jet support assembly 6 instantly jets air, causing the film at the bottom of the chip to detach from the rotating disk 5 on the top surface of the pin assembly 2. Simultaneously, the drive return assembly 4 drives the rotating disk 5 to rotate instantaneously. The air pump, by supplying air to the air blowing pipe, discharges gas from the blowing hole and abuts against the abutment plate in the drive groove 42. The abutment plate receives thrust and moves along the return groove 41, compressing the return spring 44. When the stepped plate 43 moves to a certain position, the return spring 44 resets, causing the rotating disk 5 to reset. This creates relative movement between the rotating disk 5 and the film, reducing the adhesion between the chip and the film and facilitating separation. In this embodiment, the arc center angle of the return groove 41 is no greater than 45°, preferably 45°, and the angle at which the drive return assembly 4 drives the rotating disk 5 to rotate in a single rotation is no higher than 30° and no lower than 15°, preferably 30°.

[0034] refer to Figure 1 and Figure 2 Specifically, the jet support assembly 6 includes several first jet holes 61 and second jet holes 62 respectively opened on the ejector assembly 2 and the rotating disk 5. The first jet holes 61 and second jet holes 62 are in contact and connected. An jet pipe 63 connected to the first jet hole 61 is fixedly provided inside the ejector assembly 2. An jet groove 64 is opened on the side wall of the ejector assembly 2 to avoid the jet pipe 63. An air pump assembly 65 is connected to the outside of the jet pipe 63. The air pump assembly 65 passes into the jet pipe 63, so that compressed gas enters from the first jet hole 61 into the second jet hole 62 and acts on the bottom of the chip. When the rotating disk 5 rotates, the first jet hole 61 and the second jet hole 62 block each other, thereby reducing the gas output. The reduced gas output reduces the supporting force acting on the bottom surface of the chip. The chip falls onto the rotating disk 5 and generates relative motion with the rotating disk 5, thereby reducing the adhesion force between the chip and the film. The air pump assembly 65 uses a frequency conversion air pump. The air pump assembly 65 is coupled to the lifting assembly 3. Based on the running time and running speed of the lifting assembly 3, the height difference between the outer pin assembly 2 and the central pin assembly 2 is determined, thereby changing the air pressure of the air pump assembly 65 to ensure that the supporting force acting on the bottom of the chip remains constant.

[0035] Example 2:

[0036] A method for picking up ultra-thin chips, using a picking device for ultra-thin chips as shown in Example 1, includes:

[0037] Step 1: The lifting assembly 3 controls several pin assemblies 2 to rise and lift the chip;

[0038] Step 2: During the rising process of the ejector pin assembly 2, the external ejector pin assembly 2 gradually detaches from the bottom surface of the chip. After the ejector pin assembly 2 detaches from the bottom surface of the chip, the jet support assembly 6 jets air onto the bottom surface of the chip and keeps the supporting force acting on the bottom of the chip constant until the chip rises to the highest point.

[0039] Step 3: When the chip rises to its highest point, the innermost jet support component 6 instantly jets air, causing the film at the bottom of the chip to detach from the rotating disk 5 located on the top surface of the ejector pin component 2. At the same time, the drive recovery component 4 drives the rotating disk 5 to rotate instantly. After rotating a certain angle, the rotating disk 5 returns to its initial position. During the rotation of the rotating disk 5, the rotating disk 5 gradually blocks the jetting process of the jet support component 6. During the return process of the rotating disk 5, the rotating disk 5 gradually resumes the jetting process of the jet support component 6, thereby reducing the adhesion between the chip and the film during the rotation and return process of the rotating disk 5, and realizing the rapid separation of the chip and the film.

[0040] This specific embodiment is merely an explanation of the present invention and is not intended to limit the invention. After reading this specification, those skilled in the art can make inventive modifications to this embodiment as needed, but as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A pick-up device for ultra-thin chips, comprising a base (1); characterized in that, The base (1) is coaxially connected with at least two groups of needle assemblies (2) along the vertical direction, the bottom of the base (1) is rotatably connected with a lifting assembly (3) for synchronously driving the needle assemblies (2) to slide along the vertical direction to realize the lifting of the chip, the lifting speed of the needle assemblies (2) gradually decreases from inside to outside, the end of the needle assemblies (2) away from the lifting assembly (3) is rotatably connected with a rotating disc (5) based on a driving recovery assembly (4), and the needle assemblies (2) are each provided with a jet support assembly (6).

2. The pick-up device for ultra-thin chips according to claim 1, characterized in that The needle assemblies (2) are provided with three groups of first needles (21), second needles (22) and third needles (23) from inside to outside, the base (1) is provided with a guide sliding groove (11) for guiding the sliding of the needle assemblies (2), a plurality of limiting guide blocks (12) are uniformly and fixedly arranged in the guide sliding groove (11) along the circumferential direction, and the needle assemblies (2) are uniformly provided with limiting guide grooves (24) matched with the limiting guide blocks (12) along the circumferential direction, so as to limit the rotation of the needle assemblies (2) in the guide sliding groove (11).

3. The pick-up device for ultra-thin chips according to claim 1, characterized in that, The top of the needle assemblies (2) is flush, and the length of the needle assemblies (2) gradually decreases from inside to outside, the bottom of the needle assemblies (2) is in a stepped structure, the lifting assembly (3) comprises first lifting threads (31) arranged on the outer side walls of the bottoms of the needle assemblies (2), respectively, a rotating seat (32) is rotatably connected to the base (1), a stepped groove (33) matched with the bottoms of the needle assemblies (2) is formed in the rotating seat (32), a second lifting thread (34) matched with the first lifting thread (31) is arranged on the groove wall of the stepped groove (33), and a driving motor (35) for driving the rotating seat (32) to rotate is fixedly arranged on the base (1).

4. The pick-up device for ultra-thin chips according to claim 3, characterized in that The driving motor (35) is a servo motor, the transmission ratio between the first lifting thread (31) and the second lifting thread (34) gradually decreases from inside to outside, so that the lifting speed of the needle assemblies (2) gradually decreases from inside to outside.

5. The pick-up device for ultra-thin chips according to claim 1, characterized in that, The driving recovery assembly (4) comprises a plurality of recovery grooves (41) uniformly formed on the top of the needle assemblies (2) along the circumferential direction, a driving groove (42) is formed in the bottom of the recovery groove (41), a stepped plate (43) matched with the recovery groove (41) and the driving groove (42) is uniformly formed in the bottom of the rotating disc (5) along the circumferential direction, a recovery spring (44) for abutting against the stepped plate (43) is fixedly arranged in the recovery groove (41), a blowing hole (45) is formed in the side wall of the driving groove (42), the blowing hole (45) is connected with a blowing pipeline and a blowing pump, so that air is blown to the stepped plate (43) to push the stepped plate (43) to slide in the recovery groove (41), thereby driving the rotating disc (5) to rotate on the needle assemblies (2).

6. The pick-up device for ultra-thin chips according to claim 5, characterized in that The arc center angle of the return groove (41) is not greater than 45°, and the angle of single driving of the driving return assembly (4) for the rotation of the rotating disc (5) is not higher than 30° and not lower than 15°.

7. The pick-up device for ultra-thin chips according to claim 2, characterized in that, The rotating discs (5) of the plurality of needle assemblies (2) are arranged in a stack to avoid the chip suspended between adjacent needle assemblies (2), the first needle (21), the second needle (22) and the third needle (23) are respectively rotatably connected with a first rotating disc (51), a second rotating disc (52) and a third rotating disc (53), the outer shaft wall of the first rotating disc (51) and the outer shaft wall of the second rotating disc (52) extend to the inner shaft wall of the second needle (22) and the third needle (23) respectively, the top of the first rotating disc (51) and the second rotating disc (52) coaxially protrude outward to be provided with a first stacking block (54) and a second stacking block (55) respectively, the top of the second rotating disc (52) and the third rotating disc (53) are respectively provided with a first stacking groove (56) and a second stacking groove (57) for accommodating the first stacking block (54) and the second stacking block (55), and the upper surfaces of the first rotating disc (51), the second rotating disc (52), the third rotating disc (53), the first stacking block (54) and the second stacking block (55) are flush.

8. The pick-up device for ultra-thin chips according to claim 1, characterized in that, The jet support assembly (6) comprises a plurality of first jet holes (61) and second jet holes (62) respectively provided on the needle assembly (2) and the rotating disc (5), the first jet hole (61) and the second jet hole (62) are in contact and communication, the jet pipe (63) in communication with the first jet hole (61) is fixedly arranged inside the needle assembly (2), the jet groove (64) for avoiding the jet pipe (63) is provided on the side wall of the outer needle assembly (2), and the jet pipe (63) is externally connected with the air pump assembly (65).

9. The pick-up device for ultra-thin chips according to claim 8, characterized in that The air pump assembly (65) uses a variable frequency air pump, the air pump assembly (65) is coupled with the lifting assembly (3), the height difference between the outer needle assembly (2) and the central needle assembly (2) is determined based on the running time and the running speed of the lifting assembly (3), so that the air pressure of the air pump assembly (65) is changed to ensure that the supporting force acting on the bottom of the chip remains unchanged.

10. A pick-up method for ultra-thin chips, using a pick-up device for ultra-thin chips according to any one of claims 1 to 9; characterized in that, Comprising: Step 1, the lifting assembly (3) controls the upward movement of the plurality of needle assemblies (2) to lift the chip; Step 2, during the upward movement of the needle assembly (2), the outer needle assembly (2) gradually separates from the bottom surface of the chip, and after the needle assembly (2) separates from the bottom surface of the chip, the jet support assembly (6) sprays air to the bottom surface of the chip and keeps the supporting force acting on the bottom of the chip unchanged until the chip rises to the highest point. Step 3, when the chip rises to the highest point, the innermost jet support assembly (6) instantaneously sprays to make the film at the bottom of the chip separate from the rotating disc (5) arranged on the top surface of the needle assembly (2), at the same time, the driving recovery assembly (4) drives the rotating disc (5) to instantaneously rotate, and after rotating by a certain angle, the rotating disc (5) returns to the initial position, in the rotating process of the rotating disc (5), the rotating disc (5) gradually blocks the jetting process of the jet support assembly (6), and in the returning process of the rotating disc (5), the rotating disc (5) gradually restores the jetting process of the jet support assembly (6), so that the adhesion between the chip and the film is reduced in the rotating and returning process of the rotating disc (5), and the rapid separation of the chip and the film is realized.

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