Differential quadrature signal coupler and on-chip radio frequency transceiver system

By designing a differential quadrature signal coupler as a two-segment symmetrical coaxial line structure, and combining capacitive coupling effect and dielectric structure, the problems of large area occupation and high loss of existing quadrature couplers are solved, realizing the miniaturization and low power consumption of RF transceiver systems.

CN117954820BActive Publication Date: 2026-07-28CHONGQING GIGACHIP TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
CHONGQING GIGACHIP TECH CO LTD
Filing Date
2023-12-15
Publication Date
2026-07-28

AI Technical Summary

Technical Problem

Existing quadrature couplers occupy a large area and have high losses in on-chip RF transceiver systems, making it difficult to achieve miniaturization and low power consumption.

Method used

A differential orthogonal signal coupler is designed, which adopts a two-segment symmetrical coaxial line structure. It utilizes the capacitive coupling effect between the second and first metal wire structures set coaxially, combined with the dielectric structure, to form a three-dimensional stacked structure, which reduces the planar area occupied and reduces the loss. At the same time, the characteristic impedance of the coupler can be adjusted by adjusting the size parameters of the metal wire structure to expand the operating bandwidth.

Benefits of technology

This technology enables the miniaturization of couplers, reduces the area and power consumption of RF transceiver chips, and improves the flexibility of operating bandwidth.

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Abstract

The application provides a differential quadrature signal coupler and a radio frequency transceiver system on chip, which combines two first metal wire structures, two second metal wire structures and two dielectric structures to design the differential quadrature signal coupler, one first metal wire structure, one second metal wire structure and one dielectric structure form one coaxial line structure, the differential quadrature signal coupler is designed as two symmetrical coaxial line structures, based on the capacitive coupling effect between the coaxially arranged second metal wire structure and the first metal wire structure, the coupling transmission of the radio frequency signal is realized, on the basis of ensuring signal coupling, the planar area of the differential quadrature signal coupler can be reduced, the size of the corresponding coupling line is reduced, and the loss on the coupler is reduced; when designing and manufacturing, the size parameters of the second metal wire structure and the first metal wire structure can be adjusted according to actual needs, and then the characteristic impedance of the coupler can be adjusted, and the working bandwidth of the coupler is increased.
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Description

Technical Field

[0001] This invention relates to the field of radio frequency technology, and in particular to a differential quadrature signal coupler and an on-chip radio frequency transceiver system. Background Technology

[0002] In on-chip RF transceiver systems, quadrature signal transmitters play a crucial role. Quadrature signal couplers convert high-frequency local oscillator signals into two signals with amplitude and phase difference of 90°. Commonly used couplers include traditional quadrature couplers implemented using quarter-wavelength transmission lines, hybrid differential quadrature couplers, Lange couplers, and transformer-based couplers, etc. However, these structures typically occupy a large area and have significant losses. In integrated circuit design, larger area means higher cost and larger size; higher losses mean higher power consumption. Therefore, miniaturized, low-loss quadrature couplers can effectively reduce the area and power consumption of RF transceiver chips.

[0003] However, existing orthogonal couplers still have many drawbacks: For branch-line hybrid network structures, power distribution and 90° phase shift are achieved by reflection and transmission at different nodes, and the length of each arm is about a quarter wavelength; coupled-line directional couplers achieve power distribution and 90° phase shift through coupling between two lines, and the length is also about a quarter wavelength; if a signal with a frequency of 60 GHz propagates in a medium with a relative permittivity of 4, its quarter wavelength is 625 μm, which will occupy a large area for the chip, limiting the miniaturization design of the structure.

[0004] Therefore, there is an urgent need for an on-chip orthogonal coupling technology solution with a smaller area. Summary of the Invention

[0005] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide an on-chip differential orthogonal signal coupler technical solution. The differential orthogonal signal coupler is designed as two symmetrical coaxial lines. Based on the capacitive coupling effect between the second metal line structure and the first metal line structure set coaxially, the coupling and transmission of radio frequency signals are realized. The whole is a three-dimensional stacked structure. Compared with the structure design of two metal lines directly connected in a two-dimensional plane, its planar area is smaller, which can effectively reduce the size of the corresponding coupling line and reduce the loss on the coupler.

[0006] To achieve the above and other related objectives, the technical solution provided by this invention is as follows.

[0007] An on-chip differential quadrature signal coupler includes: Two segments of first metal wire structure symmetrically arranged along a first direction; Two second metal wire structures are symmetrically arranged along the first direction. The first second metal wire structure is coaxially arranged with the first first metal wire structure and the first second metal wire structure is arranged around the first first metal wire structure. The second second metal wire structure is coaxially arranged with the second first metal wire structure and the second second metal wire structure is arranged around the second first metal wire structure. Two dielectric structures are symmetrically arranged along a first direction. The first dielectric structure fills the space between the first metal wire structure and the second metal wire structure and covers the second metal wire structure. The second dielectric structure fills the space between the first metal wire structure and the second metal wire structure and covers the second metal wire structure.

[0008] Optionally, the first metal wire structure, the second metal wire structure, and the dielectric structure are respectively symmetrically arranged along the second direction.

[0009] Optionally, the first end of the first metal wire structure in the first segment and the first end of the second metal wire structure in the second segment constitute the differential input port of the differential quadrature signal coupler; the second end of the first metal wire structure in the first segment and the second end of the second metal wire structure in the second segment constitute the Q-channel differential output port of the differential quadrature signal coupler; the first end of the second metal wire structure in the first segment and the first end of the second metal wire structure in the second segment constitute the I-channel differential output port of the differential quadrature signal coupler; and the second end of the second metal wire structure in the first segment and the second end of the second metal wire structure in the second segment constitute the differential isolation port of the differential quadrature signal coupler.

[0010] Optionally, a matching resistor is connected in series between the second end of the first segment of the second metal wire structure and the second end of the second segment of the second metal wire structure. The resistance value of the matching resistor is equal to the average value of the characteristic impedance of the differential quadrature signal coupler.

[0011] Optionally, the characteristic impedance of the differential quadrature signal coupler gradually increases along the differential input port to the Q-channel differential output port.

[0012] Optionally, the first metal wire structure is a single-layer metal structure, and the second metal wire structure is a three-layer metal structure plus two layers of vias.

[0013] Optionally, the first metal wire structure includes a first metal wire, and the second metal wire structure includes a second metal wire, a third metal wire, a fourth metal wire, a fifth metal wire, a sixth metal wire, and a seventh metal wire. The second metal wire and the third metal wire are disposed independently in the same layer on the first layer. The fourth metal wire, the first metal wire, and the fifth metal wire are disposed independently in the same layer on the second layer. The sixth metal wire and the seventh metal wire are disposed independently in the same layer on the third layer. The first layer, the second layer, and the third layer are arranged at intervals along a third direction. The fourth metal wire is connected to the second metal wire through a first via. The fourth metal wire is connected to the sixth metal wire through a second via. The fifth metal wire is connected to the third metal wire through a third via. The fifth metal wire is connected to the seventh metal wire through a fourth via.

[0014] Optionally, at both ends of the second metal wire structure, the second metal wire is connected to the third metal wire, or the sixth metal wire is connected to the seventh metal wire.

[0015] Optionally, the characteristic impedance of the differential quadrature signal coupler can be adjusted by adjusting the size of the first metal line along the second direction, by adjusting the spacing between the first metal line and the fourth and fifth metal lines along the second direction, by adjusting the overlap area between the first metal line and the second, third, sixth, and seventh metal lines along the third direction, and by adjusting the spacing between the first metal line and the second, third, sixth, and seventh metal lines along the third direction.

[0016] An on-chip radio frequency transceiver system includes a differential orthogonal signal coupler as described above, wherein the differential orthogonal signal coupler is integrated on-chip based on semiconductor technology and performs orthogonal coupling processing on radio frequency signals.

[0017] As described above, the differential orthogonal signal coupler and on-chip RF transceiver system provided by the present invention have at least the following beneficial effects: A differential orthogonal signal coupler is designed by combining two segments of first metal line structure, two segments of second metal line structure, and two segments of dielectric structure. The first, second, and dielectric segments form a coaxial-like structure, making the differential orthogonal signal coupler a two-segment symmetrical coaxial-like structure. The coupling and transmission of radio frequency signals are achieved based on the capacitive coupling effect between the coaxially positioned second and first metal line structures. The overall structure is a three-dimensional stacked structure. Compared to a two-dimensional design where two metal lines are directly connected, this design occupies a smaller area, effectively reducing the size of the corresponding coupling lines and decreasing coupler losses. Furthermore, by adjusting the dimensional parameters of the second and first metal line structures, the characteristic impedance of the coupler can be adjusted, effectively increasing the coupler's operating bandwidth. Applying this miniaturized, low-loss differential orthogonal coupler to an on-chip RF transceiver system can effectively reduce the area and power consumption of the RF transceiver chip. Attached Figure Description

[0018] Figure 1 The diagram shows a top view of the differential orthogonal signal coupler in this invention.

[0019] Figure 2 The diagram shows a side view of the differential orthogonal signal coupler in this invention along axis b.

[0020] Figures 3-5 The diagram shows a structural side view of the differential orthogonal signal coupler at its port along axis a in different alternative embodiments of the present invention. Detailed Implementation

[0021] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0022] Please see Figures 1-5It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show components relevant to the present invention and are not drawn according to the actual number, shape, and size of the components in implementation. In actual implementation, the form, quantity, and proportion of each component can be arbitrarily changed, and the component layout may be more complex. The structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and are not intended to limit the implementation conditions of the present invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effects and objectives of the present invention, should still fall within the scope of the technical content disclosed in the present invention.

[0023] As mentioned in the background section, the inventors discovered that the size of the orthogonal coupler in the prior art is still not small enough. When applied to an on-chip RF transceiver system, it will occupy a large part of the area of ​​the RF transceiver chip, which is not conducive to reducing the area and power consumption of the RF transceiver chip.

[0024] Based on this, the present invention proposes a simple and efficient on-chip differential orthogonal signal coupling technology: a differential orthogonal signal coupler is designed by combining two first metal line structures, two second metal line structures, and two dielectric structures. One first metal line structure, one second metal line structure, and one dielectric structure form a coaxial-like structure. The differential orthogonal signal coupler is designed as two symmetrical coaxial-like structures. Based on the capacitive coupling effect between the coaxially arranged second metal line structure and the first metal line structure, the coupled transmission of radio frequency signals is realized, thereby reducing its planar area, reducing the size of the corresponding coupling line, and reducing the loss on the coupler. At the same time, by adjusting the size parameters of the second metal line structure and the first metal line structure, the characteristic impedance of the coupler can be adjusted to increase the operating bandwidth of the coupler.

[0025] First, such as Figure 1 As shown, this invention proposes an on-chip differential quadrature signal coupler, which includes: Two segments of a first metal wire structure 1 are symmetrically arranged along a first direction (i.e., the Y-axis direction or the direction of axis a); Two second metal wire structures 2 are symmetrically arranged along a first direction. The first second metal wire structure 2 (i.e., the second metal wire structure 2 on the left) is coaxially arranged with the first first metal wire structure 1 (i.e., the first metal wire structure 1 on the left) and the first second metal wire structure 2 is arranged around the first first metal wire structure 1. The second second metal wire structure 2 (i.e., the second metal wire structure 2 on the right) is coaxially arranged with the second first metal wire structure 1 (i.e., the first metal wire structure 1 on the right) and the second second metal wire structure 2 is arranged around the second first metal wire structure 1. Two dielectric structures 3 are symmetrically arranged along a first direction. The first dielectric structure 3 (i.e., the dielectric structure 3 on the left) is filled between the first metal wire structure 1 and the first metal wire structure 2, and the first dielectric structure 3 covers the first metal wire structure 2. The second dielectric structure 3 (i.e., the dielectric structure 3 on the right) is filled between the second metal wire structure 1 and the second metal wire structure 2, and the second dielectric structure 3 covers the second metal wire structure 2.

[0026] In detail, such as Figure 1 As shown, in the XY plane, the first segment of the first metal wire structure 1, the first segment of the second metal wire structure 2, and the first segment of the dielectric structure 3 constitute the first segment of the coaxial line structure, and the second segment of the first metal wire structure 1, the second segment of the second metal wire structure 2, and the second segment of the dielectric structure 3 constitute the second segment of the coaxial line structure. The first segment of the coaxial line structure and the second segment of the coaxial line structure are symmetrically arranged along the first direction.

[0027] In detail, such as Figure 1 As shown, the first metal wire structure 1, the second metal wire structure 2 and the dielectric structure 3 are also symmetrically arranged along the second direction (i.e., the X-axis direction or the direction of axis b), that is, the first segment of the quasi-axis structure and the second segment of the quasi-axis structure are symmetrically arranged along the second direction.

[0028] In detail, such as Figure 1 As shown, the first end of the first metal wire structure 1 and the first end of the second metal wire structure 1 form the differential input port P1 of the differential orthogonal signal coupler; the second end of the first metal wire structure 1 and the second end of the second metal wire structure 1 form the Q-channel differential output port P2 of the differential orthogonal signal coupler; the first end of the first metal wire structure 2 and the first end of the second metal wire structure 2 form the I-channel differential output port P3 of the differential orthogonal signal coupler; and the second end of the first metal wire structure 2 and the second end of the second metal wire structure 2 form the differential isolation port P4 of the differential orthogonal signal coupler.

[0029] More in detail, such as Figure 1As shown, a matching resistor R is connected in series between the second end of the first segment of the second metal wire structure 2 and the second end of the second segment of the second metal wire structure 2. In order to ensure that each port is in a matched state, the resistance value of the matching resistor R is equal to the average value of the characteristic impedance of the differential quadrature signal coupler, or it can fluctuate around the average value, thereby adjusting the operating frequency of the differential quadrature signal coupler.

[0030] It should be noted that the differential quadrature signal coupler is symmetrical about axis a, and the isoaxial structure on both sides consists of multiple isoaxial metal traces. To improve the operating bandwidth of the differential quadrature signal coupler, the characteristic impedance of the metal traces can be inconsistent, for example, in... Figure 1 In the process, the impedance of the metal traces gradually increases from the differential input port P1 to the Q-channel differential output port P2. This causes the characteristic impedance of the differential quadrature signal coupler to gradually increase. Of course, for the convenience of drawing the layout, the characteristic impedance of all metal traces can be the same. The specific impedance arrangement depends on the desired operating bandwidth.

[0031] In detail, such as Figure 2 As shown, the first metal wire structure 1 is a single-layer metal structure, and the second metal wire structure 2 is a three-layer metal structure plus two layers of vias.

[0032] More in detail, such as Figure 2 As shown, the first metal wire structure 1 includes a first metal wire M1, and the second metal wire structure 2 includes a second metal wire M2, a third metal wire M3, a fourth metal wire M4, a fifth metal wire M5, a sixth metal wire M6, and a seventh metal wire M7. The second metal wire M2 and the third metal wire M3 are independently arranged in the first layer, the fourth metal wire M4, the first metal wire M1, and the fifth metal wire M5 are independently arranged in the second layer, and the sixth metal wire M6 and the seventh metal wire M7 are independently arranged in the third layer. The first, second, and third layers are arranged alternately along the third direction (i.e., the Z-axis direction). The fourth metal wire M4 is connected to the second metal wire M2 through the first via V1, the fourth metal wire M4 is connected to the sixth metal wire M6 through the second via V2, the fifth metal wire M5 is connected to the third metal wire M3 through the third via V3, and the fifth metal wire M5 is connected to the seventh metal wire M7 through the fourth via V4.

[0033] In detail, such as Figures 3-5 As shown, in order to enhance coupling, at both ends of the second metal wire structure 2, the left and right sides of each segment of the second metal wire structure 2 are connected together by independent semi-enclosed metal wire structures, such as the second metal wire M2 being connected to the third metal wire M3, or the sixth metal wire M6 being connected to the seventh metal wire M7.

[0034] More in detail, such as Figure 3As shown, in an optional embodiment of the present invention, at both ends of the second metal wire structure 2, the sixth metal wire M6 is connected to the seventh metal wire M7.

[0035] More in detail, such as Figure 4 As shown, in another optional embodiment of the present invention, the second metal wire M2 is connected to the third metal wire M3 at both ends of the second metal wire structure 2.

[0036] More in detail, such as Figure 5 As shown, in another optional embodiment of the present invention, at both ends of the second metal wire structure 2, the second metal wire M2 is connected to the third metal wire M3, and the sixth metal wire M6 is connected to the seventh metal wire M7.

[0037] In detail, such as Figure 2 As shown, the second metal line M2 and the third metal line M3 can be obtained by etching the first metal layer; the fourth metal line M4, the first metal line M1, and the fifth metal line M5 can be obtained by etching the second metal layer; and the sixth metal line M6 and the seventh metal line M7 can be obtained by etching the third metal layer. Generally, to reduce line loss, the thickness of the first metal layer depends on the required characteristic impedance value, while the second and third metal layers are the thickest top layers in integrated circuit manufacturing processes.

[0038] Meanwhile, the characteristic impedance of the differential quadrature signal coupler can be adjusted by adjusting the lateral (i.e., second direction) dimension of each metal line, the lateral distance between each metal line, or the longitudinal (i.e., third direction) distance. This allows the characteristic impedance of the differential quadrature signal coupler to have various different trends along the direction from the differential input port P1 to the Q-channel differential output port P2, such as gradually increasing or remaining constant. This makes the characteristic impedance of the differential quadrature signal coupler flexible and adjustable, and suitable for various different operating bandwidths.

[0039] In detail, such as Figure 2 As shown, the characteristic impedance of the differential quadrature signal coupler is adjusted by adjusting the size of the first metal line M1 along the second direction, adjusting the spacing between the first metal line M1 and the fourth metal line M4 and the fifth metal line M5 along the second direction, adjusting the overlap area between the first metal line M1 and the second metal line M2, the third metal line M3, the sixth metal line M6 and the seventh metal line M7 along the third direction, and adjusting the spacing between the first metal line M1 and the second metal line M2, the third metal line M3, the sixth metal line M6 and the seventh metal line M7 along the third direction.

[0040] More in detail, such as Figure 2 As shown, the characteristic impedance of the differential quadrature signal coupler can be increased by the following adjustment steps: 1) Decrease the size of the first metal wire M1 along the second direction, or increase the spacing between the first metal wire M1 and the fourth metal wire M4 and the fifth metal wire M5 along the second direction; 2) Reduce the overlap area between the first metal wire M1 and the second metal wire M2, the third metal wire M3, the sixth metal wire M6 and the seventh metal wire M7 along the third direction; 3) Increase the spacing between the first metal wire M1 and the second metal wire M2, the third metal wire M3, the sixth metal wire M6 and the seventh metal wire M7 along the third direction.

[0041] More in detail, such as Figure 2 As shown, the characteristic impedance of the differential quadrature signal coupler can be reduced by the following adjustment steps: 1) Increase the dimension of the first metal wire M1 along the second direction, or decrease the spacing between the first metal wire M1 and the fourth metal wire M4 and the fifth metal wire M5 along the second direction; 2) Increase the overlap area between the first metal wire M1 and the second metal wire M2, the third metal wire M3, the sixth metal wire M6 and the seventh metal wire M7 along the third direction; 3) Reduce the spacing between the first metal wire M1 and the second metal wire M2, the third metal wire M3, the sixth metal wire M6 and the seventh metal wire M7 along the third direction.

[0042] It should be noted that the characteristic impedance can also be adjusted by adjusting the distance between the second metal line M2 and the third metal line M3 along the second direction, or by adjusting the distance between the sixth metal line M6 and the seventh metal line M7 along the second direction. However, the distance between the second metal line M2 and the third metal line M3 along the second direction, or the distance between the sixth metal line M6 and the seventh metal line M7 along the second direction, and the spacing between the first metal line M1 and the fourth metal line M4 and the fifth metal line M5 along the second direction, cannot be smaller than the minimum dimension allowed by the process.

[0043] The distance between the second metal line M2 and the third metal line M3 along the second direction, or the distance between the sixth metal line M6 and the seventh metal line M7 along the second direction, can be zero; the distance between the first metal line M1 and the fourth metal line M4 and the fifth metal line M5 along the second direction cannot be zero.

[0044] Therefore, in this invention, a differential orthogonal signal coupler with a coaxial-like structure formed by multiple metal traces is used. The characteristic impedance of the differential orthogonal signal coupler can be flexibly adjusted according to parameters such as the size and distance of the metal traces, thereby improving the operating bandwidth of the differential orthogonal signal coupler.

[0045] Secondly, this invention also provides an on-chip radio frequency transceiver system, including the aforementioned differential orthogonal signal coupler. The differential orthogonal signal coupler is integrated on-chip based on semiconductor processes (such as alternating multilayer deposition and etching). The differential orthogonal signal coupler performs orthogonal coupling processing on the on-chip transmitted and received radio frequency signals. Based on a coaxial cable-like structure, while ensuring the coupled transmission of radio frequency signals, it reduces the occupied area and overall size of the differential orthogonal signal coupler, facilitating high-density miniaturized integration of the on-chip system. Simultaneously, the parameters of each metal trace in the coaxial cable-like structure are flexibly adjustable, allowing for various characteristic impedance distributions to be formed according to actual needs. This improves the operating bandwidth of the differential orthogonal signal coupler, making it suitable for coupling various radio frequency signals of different frequencies.

[0046] In summary, the differential orthogonal signal coupler and on-chip RF transceiver system provided by this invention combine two first metal line structures, two second metal line structures, and two dielectric structures to design the differential orthogonal signal coupler. The first metal line structure, the second metal line structure, and the dielectric structure form a coaxial-like structure. The differential orthogonal signal coupler is designed as two symmetrical coaxial-like structures. Based on the capacitive coupling effect between the coaxially arranged second and first metal line structures, RF signal coupling and transmission are achieved. While ensuring signal coupling, the planar area occupied by the differential orthogonal signal coupler can be reduced, the size of the corresponding coupling line can be decreased, and the loss on the coupler can be reduced. Simultaneously, the dimensional parameters of the second and first metal line structures in the coaxial-like structure are flexibly adjustable. During design and fabrication, the dimensional parameters of the second and first metal line structures can be adjusted according to actual needs, thereby adjusting the characteristic impedance of the coupler and increasing its operating bandwidth, making it suitable for coupling various RF signals of different frequencies. When applied to an on-chip RF transceiver system, it can effectively reduce the area and power consumption of the RF transceiver chip.

[0047] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. An on-chip differential quadrature signal coupler, characterized in that, include: Two segments of first metal wire structure symmetrically arranged along a first direction; Two second metal wire structures are symmetrically arranged along the first direction. The first second metal wire structure is coaxially arranged with the first first metal wire structure and surrounds the first first metal wire structure. The second second metal wire structure is coaxially arranged with the second first metal wire structure and surrounds the second first metal wire structure. The second metal wire structure is a multilayer metal structure with vias. Two dielectric structures are symmetrically arranged along the first direction. The first dielectric structure fills the space between the first metal wire structure and the second metal wire structure and covers the second metal wire structure. The second dielectric structure fills the space between the first metal wire structure and the second metal wire structure and covers the second metal wire structure. The first end of the first metal wire structure in the first segment and the first end of the first metal wire structure in the second segment constitute the differential input port of the differential quadrature signal coupler. The second end of the first metal wire structure in the first segment and the second end of the first metal wire structure in the second segment constitute the Q-channel differential output port of the differential quadrature signal coupler. The first end of the second metal wire structure in the first segment and the first end of the second metal wire structure in the second segment constitute the I-channel differential output port of the differential quadrature signal coupler. The second end of the second metal wire structure in the first segment and the second end of the second metal wire structure in the second segment constitute the differential isolation port of the differential quadrature signal coupler.

2. The differential quadrature signal coupler according to claim 1, characterized in that, The first metal wire structure, the second metal wire structure, and the dielectric structure are also symmetrically arranged along the second direction.

3. The differential orthogonal signal coupler according to claim 1, characterized in that, A matching resistor is connected in series between the second end of the first segment of the second metal wire structure and the second end of the second segment of the second metal wire structure. The resistance value of the matching resistor is equal to the average value of the characteristic impedance of the differential quadrature signal coupler.

4. The differential quadrature signal coupler according to claim 1, characterized in that, Along the differential input port to the Q-channel differential output port, the characteristic impedance of the differential quadrature signal coupler gradually increases.

5. The differential quadrature signal coupler according to claim 1, characterized in that, The first metal wire structure is a single-layer metal structure, and the second metal wire structure is a three-layer metal structure plus two layers of vias.

6. The differential quadrature signal coupler according to claim 5, characterized in that, The first metal wire structure includes a first metal wire, and the second metal wire structure includes a second metal wire, a third metal wire, a fourth metal wire, a fifth metal wire, a sixth metal wire, and a seventh metal wire. The second metal wire and the third metal wire are independently disposed in the same layer on the first layer. The fourth metal wire, the first metal wire, and the fifth metal wire are independently disposed in the same layer on the second layer. The sixth metal wire and the seventh metal wire are independently disposed in the same layer on the third layer. The first layer, the second layer, and the third layer are arranged at intervals along a third direction. The fourth metal wire is connected to the second metal wire through a first via. The fourth metal wire is connected to the sixth metal wire through a second via. The fifth metal wire is connected to the third metal wire through a third via. The fifth metal wire is connected to the seventh metal wire through a fourth via.

7. The differential quadrature signal coupler according to claim 6, characterized in that, At both ends of the second metal wire structure, the second metal wire is connected to the third metal wire, or the sixth metal wire is connected to the seventh metal wire.

8. The differential quadrature signal coupler according to claim 6, characterized in that, The characteristic impedance of the differential quadrature signal coupler can be adjusted by adjusting the size of the first metal line along the second direction, by adjusting the spacing between the first metal line and the fourth and fifth metal lines along the second direction, by adjusting the overlap area between the first metal line and the second, third, sixth, and seventh metal lines along the third direction, and by adjusting the spacing between the first metal line and the second, third, sixth, and seventh metal lines along the third direction.

9. An on-chip radio frequency transceiver system, characterized in that, The differential orthogonal signal coupler as described in any one of claims 1-8 is integrated on-chip based on semiconductor technology to perform orthogonal coupling processing on radio frequency signals.