A radiator and an electronic device

Abstract

The present application provides a heat sink and an electronic device, relating to the technical field of electronic devices. It is used to solve the problem that the electromagnetic noise generated by the chip is coupled with the heat sink and radiated to the surroundings through the heat sink, causing interference to the surrounding electronic components. The above-mentioned electronic device includes a housing, a circuit board, a chip, and a heat sink. The circuit board is arranged inside the housing. The chip is arranged on the circuit board. The surface of the chip away from the circuit board is the first surface, and the first surface includes a first region, and the region other than the first region is the second region. The heat sink is arranged on the side of the chip away from the circuit board. A recess is provided on the surface of the heat sink facing the first surface, and the recess is used to space the heat sink from the first region, and the heat sink is attached to the second region.

Description

Technical Field

[0001] This application relates to the technical field of electronic devices, and in particular, to a heat sink and an electronic device. Background Art

[0002] As the integration degree of internal components of electronic devices is getting higher and higher, the electromagnetic environment inside the devices becomes more complex. For example, in the existing system-on-chip (SoC) inside an electronic device, the SoC chip generates electromagnetic noise when working. After being coupled with the heat sink, this electromagnetic noise radiates to the surroundings, which will interfere with the surrounding electronic components, resulting in problems such as slow loading, lagging, or slow file transfer, affecting the user experience. Summary of the Invention

[0003] Embodiments of this application provide a heat sink and an electronic device, which are used to solve the problem that electromagnetic noise is coupled with the heat sink and radiates to the surroundings through the heat sink, interfering with the surrounding components.

[0004] To achieve the above object, the embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, an electronic device is provided. The electronic device includes a housing, a circuit board, a chip, and a heat sink. The circuit board is disposed inside the housing. The chip is disposed on the circuit board. The surface of the chip away from the circuit board is the first surface, and the first surface includes a first region, and the region other than the first region is the second region. The heat sink is disposed on the side of the chip away from the circuit board. A recess is provided on the surface of the heat sink facing the first surface. The recess is used to space the heat sink apart from the first region, and the heat sink is in contact with the second region.

[0006] For the electronic device provided in the first aspect of this application, by providing a recess on the surface of the heat sink facing the chip, the distance between the first region on the chip and the heat sink is increased, that is, the coupling path between the first region on the chip and the heat sink is increased. According to the calculation formulas of capacitance and capacitive reactance, it can be known that the capacitance value is inversely proportional to the distance between the plates, and the capacitance value is also inversely proportional to the capacitive reactance value, that is, the larger the distance between the plates, the smaller the capacitance value; the smaller the capacitance value, the larger the capacitive reactance value. Since the coupling between the chip and the heat sink is capacitive coupling, when the distance between the first region on the chip and the heat sink increases, the capacitive reactance value between the heat sink and the chip can be increased, which is conducive to reducing the coupling degree between the two, so that the electromagnetic noise coupled from the chip to the heat sink is weakened, which is conducive to reducing the noise radiation power, and further reducing the interference to the surrounding electronic components, and is conducive to improving the user experience.

[0007] In some embodiments of the present invention, the electromagnetic noise generated in the first region is greater than that generated in the second region. In this way, the position on the chip where the electromagnetic noise is stronger is the first region, and a recess is provided on the heat sink corresponding to the first region, so that the stronger electromagnetic noise on the chip can be weakened when coupled to the heat sink, further reducing the power of the electromagnetic noise radiated to the surroundings through the heat sink, which is more conducive to reducing the interference to the surrounding electronic components.

[0008] In some embodiments of the present invention, the vertical projection of the recess on the first surface covers the first region. In this way, it is beneficial to optimize the electromagnetic noise that is significantly higher than the average value generated on the chip surface, and is beneficial to further reduce the power of the electromagnetic noise radiated to the surroundings through the heat sink.

[0009] In some embodiments of the present invention, the recess includes a groove, and the bottom surface of the groove faces the first region. That is, by providing a groove on the surface of the heat sink facing the chip, the depth of the groove is the distance between the first region of the chip and the heat sink, which is beneficial to reducing the coupling degree between the electromagnetic noise generated in the first region of the chip and the heat sink.

[0010] In some embodiments of the present invention, the groove is filled with a heat-conducting material, and the heat-conducting material is in contact with the first region of the chip. In this way, while reducing the interference generated by the electromagnetic noise, the heat dissipation effect of the chip can be ensured. That is, the heat generated in the first region of the chip is transferred to the heat sink through the heat-conducting material, thereby realizing heat dissipation and temperature reduction.

[0011] In some embodiments of the present invention, the heat-conducting material includes heat-conducting silica gel. Heat-conducting silica gel has good heat-conducting performance and a wide operating temperature range, so that it can achieve a good heat dissipation effect.

[0012] In some embodiments of the present invention, the recess includes a through hole that penetrates the surface of the heat sink away from the chip. Since the through hole penetrates the heat sink, therefore, the coupling degree between the electromagnetic noise generated by the chip and the heat sink can be further reduced, which is more conducive to reducing the intensity of the electromagnetic noise radiated to the surroundings through the heat sink.

[0013] In some embodiments of the present invention, a heat-conducting member is provided in the through hole, and the heat-conducting member abuts against the first region of the chip. In this way, the heat generated in the first region can be transferred to the heat sink through the heat-conducting member, thereby realizing heat dissipation while reducing the interference generated by the electromagnetic noise.

[0014] In some embodiments of the present invention, the heat-conducting member includes a heat-conducting gasket. The heat-conducting gasket has high compressibility, is soft and elastic. Therefore, by arranging the heat-conducting gasket in the through hole and abutting against the first region of the chip, it is beneficial to make the heat-conducting gasket fully contact with the chip and the inner wall of the through hole, which is beneficial to improving the heat-conducting efficiency.

[0015] In some embodiments of the present invention, the heat sink includes a first part and a second part. The first part faces the first surface of the chip. Along a direction parallel to the first surface, the second parts are arranged on both opposite sides of the first part, the second part is fixedly connected to the first part, and the second part is fixedly connected to the circuit board. By fixedly connecting the second part to the circuit board, the first part can be closely attached to the chip, thereby ensuring the heat dissipation effect of the chip.

[0016] In some embodiments of the present invention, the heat sink further includes a plurality of fins, and the fins are arranged on the surface of the first part away from the chip, and the plurality of fins are spaced apart. In this way, it is beneficial to increase the heat dissipation area of the heat sink to improve the heat dissipation efficiency of the heat sink, thereby being beneficial to improving the heat dissipation effect of the chip.

[0017] In some embodiments of the present invention, the chip includes a SoC chip.

[0018] In a second aspect, a heat sink is provided. The heat sink is used for being attached to and connected with the chip of an electronic device. A recessed portion is provided on the surface of the heat sink facing the chip, and the recessed portion spaces a partial area of the heat sink from the chip.

[0019] For the heat sink provided in the second aspect of the present application, by providing a recessed portion on the surface of the heat sink facing the chip, the distance between the heat sink and a partial area on the chip is increased, thereby increasing the coupling path between the partial area on the chip and the heat sink. In this way, the capacitance value between the heat sink and the chip can be increased, which is beneficial to reducing the coupling degree between the two, so as to reduce the power of the electromagnetic noise generated by the chip radiating to the surroundings through the heat sink, and further beneficial to reducing the interference to the surrounding electronic components and improving the user experience.

[0020] In some embodiments of the present invention, the recessed portion includes a groove, and the bottom surface of the groove faces the chip. That is, by providing a groove on the surface of the heat sink facing the chip, the depth of the groove is the distance between a partial area of the chip and the heat sink, which is beneficial to reducing the coupling degree between the electromagnetic noise generated by a partial area of the chip and the heat sink.

[0021] In some embodiments of the present invention, the groove portion includes a through hole, and the through hole penetrates through the surface of the heat sink away from the chip. Since the through hole penetrates through the heat sink, therefore, the coupling degree between the electromagnetic noise generated by the chip and the heat sink can be further reduced, which is more beneficial to reducing the intensity of the electromagnetic noise radiating to the surroundings through the heat sink.

[0022] In some embodiments of the present invention, the heat sink includes a first part and a second part. The first part faces the chip. The second part is disposed on opposite sides of the first part and is fixedly connected to the first part. In this way, by fixing the second part inside the electronic device, the first part can be closely attached to the chip, thereby ensuring the heat dissipation effect of the chip.

[0023] In some embodiments of the present invention, the heat sink further includes a plurality of fins. The fins are disposed on the surface of the first part away from the chip, and the plurality of fins are spaced apart. In this way, it is beneficial to increase the heat dissipation area of the heat sink to improve the heat dissipation efficiency of the heat sink, thereby being beneficial to improving the heat dissipation effect of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Structural diagram of the electronic device provided by the embodiment of the present application;

[0025] Figure 2 Exploded view of the main body of the electronic device provided by the embodiment of the present application;

[0026] Figure 3 Connection structure diagram of the heat sink and the SoC chip provided by the embodiment of the present application;

[0027] Figure 4 Is Figure 3 Noise electric field distribution diagram around the heat sink provided;

[0028] Figure 5 Another connection structure diagram of the heat sink and the SoC chip provided by the embodiment of the present application;

[0029] Figure 6 Is Figure 5 Top view of the SoC chip provided;

[0030] Figure 7 Is Figure 5 Noise electric field distribution diagram of the heat sink provided;

[0031] Figure 8 Near-field scanning spectrum diagram of the SoC chip provided by the embodiment of the present application;

[0032] Figure 9 Top view of the unoptimized heat sink provided by the embodiment of the present application;

[0033] Figure 10 Is Figure 9 Schematic diagram of the noise electric field distribution when the heat sink is installed inside the electronic device provided;

[0034] Figure 11 Top view of the optimized heat sink (provided with a recess) provided by the embodiment of the present application;

[0035] Figure 12 Schematic diagram of the noise electric field distribution of the radiator provided for Figure 11 installation inside the electronic device;

[0036] Figure 13 Schematic diagram of the isolation simulation effect of the radiator provided for Figure 10 and Figure 12 ;

[0037] Figure 14 Distribution diagram of the positional relationship between the radiator provided in the embodiment of the present application and the installed antennas (points C and D) inside the electronic device 10;

[0038] Figure 15 Schematic diagram of the isolation simulation effect of the electronic device 10 (including using an unoptimized radiator and an optimized radiator) provided for Figure 14 ;

[0039] Figure 16 Noise matching effect diagram of the unoptimized radiator and the optimized radiator provided in the embodiment of the present application;

[0040] Figure 17 Cross-sectional view of a recess provided on the radiator in the embodiment of the present application;

[0041] Figure 18 Cross-sectional view of the recess filled with a heat-conducting material provided for Figure 17 ;

[0042] Figure 19 Cross-sectional view of another recess provided on the radiator in the embodiment of the present application;

[0043] Figure 20 Cross-sectional view of the heat-conducting member provided in the recess 510 provided for Figure 19 ;

[0044] Figure 21 Structural diagram of a distribution manner of through holes and fins provided in the embodiment of the present application;

[0045] Figure 22 Structural diagram of another distribution manner of through holes and fins provided in the embodiment of the present application.

[0046] Reference numerals: 10 - electronic device; 101 - main body; 100 - display module; 110 - backlight module; 120 - display screen; 200 - housing; 210 - rear cover; 220 - bezel; 221 - upper bezel bar; 222 - lower bezel bar; 223 - left bezel bar; 224 - right bezel bar; 230 - back plate; 300 - circuit board; 400 - SoC chip; 410 - first surface; 411 - first region; 412 - second region; 500 - heat sink; 510 - recess; 511 - groove; 512 - through hole; 520 - first part; 530 - second part; 540 - fin; 600 - thermal material; 700 - thermal component; 102 - bracket. Detailed implementation manners

[0047] Next, the technical solutions in the embodiments of the present application will be described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments.

[0048] Hereinafter, terms such as "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features.

[0049] In addition, in the present application, orientation terms such as "upper" and "lower" are defined relative to the orientation in which the components in the accompanying drawings are schematically placed. It should be understood that these directional terms are relative concepts, and they are used for relative description and clarification, and they may change correspondingly according to the change of the orientation in which the components in the accompanying drawings are placed.

[0050] In the present application, unless otherwise clearly defined and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or integrated; it can be directly connected or indirectly connected through an intermediate medium.

[0051] Embodiments of the present application provide an electronic device. Specifically, the electronic device may be a portable electronic device or other types of electronic devices. For example, the electronic device may be a smart screen (TV), mobile phone, tablet personal computer, laptop computer, personal digital assistant (PDA), personal computer, notebook computer, in-vehicle device, wearable device, augmented reality (AR) glasses, AR helmet, virtual reality (VR) glasses, or VR helmet, etc. For the convenience of description below, the electronic device is taken as an example of a smart screen (TV).

[0052] As can be seen from the above, please refer to Figure 1 , Figure 1 which is a structural diagram of the electronic device 10 provided by the embodiments of the present application. In this embodiment, the electronic device 10 is a smart screen. The electronic device 10 may include a main body 101 and a bracket 102 connected to the 101. The main body 101 may be approximately in the shape of a rectangular plate and is used for functions such as displaying images, videos, wireless communication, audio playback, signal input / output, etc. In addition, in some other examples, the above-mentioned main body 101 may also be approximately in the shape of a square flat plate, a circular flat plate, a triangular flat plate, or a polygonal flat plate, etc., or the main body 101 may also be in the shape of a curved plate. Therefore, the present application does not make special limitations on this.

[0053] The above-mentioned bracket 102 is used to support the main body 101 on a desktop, a TV countertop, or the floor. Or it is used to hang the main body 101 on a wall. There are various structural forms of the bracket 102, which are not limited here. The following mainly introduces the main body 101 of the electronic device in detail.

[0054] Please refer to Figure 2 , Figure 2 which is an exploded view of the main body 101 of the electronic device 10 provided by the embodiments of the present application. The above-mentioned main body 101 may include a display module 100, a housing 200, and internal electronic components (not shown in the figure).

[0055] The above-mentioned display module 100 is used to display images, videos, etc. The display module 100 may include a backlight module 110 and a display screen 120. In some embodiments, the display screen 120 is a liquid crystal display (LCD). The display screen 120 includes a display surface, and the images or videos displayed by the display screen 120 are presented to the user by this display surface. The display screen 120 has a back side, and the back side of the display screen 120 is the side of the display screen facing away from the display surface.

[0056] The backlight module 110 is located on the back side of the display screen 120 and is stacked with the display screen 120. The backlight module 110 is used to provide light sources for the display screen 120 so that each sub-pixel in the display screen 120 can emit light to achieve image display. Among them, the sub-pixel is the smallest imaging unit of the display screen 120. Multiple adjacent sub-pixels that emit different lights in sequence can form a pixel. For example, adjacent red (R), green (G), and blue (B) sub-pixels in sequence form a pixel. In this case, the purpose of adjusting the display color of the pixel can be achieved by adjusting the proportion of R, G, and B lights in different pixels. The backlight module 110 can be a side-entry backlight module or a direct-lit backlight module, which is not limited herein.

[0057] In some other embodiments, the display screen 120 can also adopt a self-emitting display screen, such as an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a microorganic light-emitting diode display screen, or a quantum dot light emitting diode (QLED) display screen. The self-emitting display screen can emit light independently without a backlight source. Therefore, in this case, the backlight module 110 may not be provided in the main body 101 either.

[0058] The above-mentioned housing 200 is used to protect the electronic components inside the electronic device 10. The housing 200 may include a rear cover 210, a bezel 220, and a back plate 230. The back plate 230 is located on the side of the backlight module 110 away from the display screen 120 and is stacked with the backlight module 110. The back plate 230 serves as a support frame inside the main body 101, and the backlight module 110, the display screen 120, the bezel 220, the rear cover 210, and the internal electronic components are all fixed and supported on the back plate 230. To meet the structural strength and stability of the whole machine, the back plate 230 is usually made of a metal material. The backlight module 110 can be adhesively fixed to the back plate 230.

[0059] The above-mentioned front frame 220 includes, but is not limited to, a plastic front frame and a metal front frame. The front frame 220 covers the edges of the display screen 120, the backlight module 110, and the back plate 230, thereby playing a role in protection and decoration. Specifically, the front frame 220 includes an upper front frame bar 221, a lower front frame bar 222, a left front frame bar 223, and a right front frame bar 224. The upper front frame bar 221, the lower front frame bar 222, the left front frame bar 223, and the right front frame bar 224 respectively cover the upper edge, the lower edge, the left edge, and the right edge of the display screen 120, the backlight module 110, and the back plate 230. On this basis, the display screen 120 can be fixed to the back plate 230 by means of the front frame 220. In this way, the main body 101 includes fewer components, has a compact structure, and a higher assembly efficiency. In some other embodiments, the main body 101 may further include a middle frame (not shown in the figure), and the display screen 120 is fixed to the back plate 230 by means of the middle frame. On this basis, the front frame 220 can cover the outer surface of the middle frame to play a role in protection and decoration.

[0060] The above-mentioned rear cover 210 is located on the side of the back plate 230 away from the backlight module 110. In some embodiments, the rear cover 210 and the front frame 220 are respectively two independent structural members, and the periphery of the edge of the rear cover 210 and the back plate 230 can be fixed by structures such as screws, buckles, and elastic pieces. In some other embodiments, the rear cover 210 and the front frame 220 can also be integrally formed, that is, the rear cover 210 and the front frame 220 are an integral structural member, and this integral structural member is fixed to the back plate 230 by structural members such as screws and buckles.

[0061] A plurality of interfaces can be provided on the rear cover 210. The plurality of interfaces are input / output interfaces. The plurality of interfaces are electrically connected to internal electronic components, and the openings of the plurality of interfaces face the outside of the rear cover 210 to facilitate connection to external devices. And, the rear cover 210 may further include a plurality of buttons, and the buttons include, but are not limited to, a power button, a volume button, and a display mode switching button, etc. The button can be a mechanical button or a touch button. Therefore, this application does not make a special limitation on this.

[0062] Among them, an internal accommodation space is formed between the above-mentioned rear cover 210 and the back plate 230. The above-mentioned electronic components are all accommodated in this internal accommodation space. Please refer to Figure 3 , Figure 3 which is the connection structure diagram of the radiator 500 and the SoC chip 400 provided by the embodiment of this application. The above-mentioned electronic components include, but are not limited to, a circuit board 300, an SoC chip 400, a radiator 500, and an antenna (not shown in the figure).

[0063] The above circuit board 300 is used to arrange various electronic components of the electronic device 10 and realize the electrical connection between the electronic components. Exemplarily, the electronic components may be the above-mentioned SoC chip 400, graphics processing unit (GPU), universal flash storage (UFS), camera module, flash module, and so on.

[0064] The above circuit board 300 can be fixed to the backplane 230 by means of adhesion, snap connection, welding, or threaded connection, etc. The circuit board 300 can be a rigid circuit board 300, a flexible circuit board 300, or a rigid-flex circuit board 300. Therefore, this application does not make special limitations on this.

[0065] The above heat sink 500 is used to dissipate heat from the SoC chip 400. Specifically, please continue to refer to Figure 3 , the above heat sink 500 is arranged on the side of the SoC chip 400 away from the circuit board 300. The heat sink 500 can be fixedly connected to the backplane 230 through fasteners and is attached to the surface of the SoC chip 400 away from the circuit board 300 (hereinafter referred to as the first surface 410), so as to realize heat dissipation for the SoC chip 400.

[0066] However, please refer to Figure 4 , Figure 4 For Figure 3 the noise electric field distribution diagram around the provided heat sink 500. When the electronic device 10 is working, the SoC chip 400 will generate electromagnetic noise, and this electromagnetic noise can be coupled with the heat sink 500 and radiate to the surroundings, as shown in Figure 4 regions A and B in (in the figure, the strength of the electric field is represented by the depth of the arrow grayscale. The darker the grayscale, the stronger the electric field, and the lighter the grayscale, the weaker the electric field), thus interfering with other surrounding electronic components (such as antennas) and affecting the surrounding working electronic components. Exemplarily, in the communication systems of 2.4G WIFI or 5G WIFI, it will cause a decrease in the throughput rate, resulting in problems such as slow loading, stuttering in video playback, and slow file transfer and download. And it is more obvious in weak signal scenarios. Therefore, it seriously affects the user experience.

[0067] To solve the above problems, an embodiment of this application provides an electronic device 10, including the above circuit board 300, SoC chip 400, and heat sink 500. Please refer to Figure 5 and Figure 6 , Figure 5 is the connection structure diagram of another heat sink 500 and SoC chip 400 provided by an embodiment of this application, Figure 6 For Figure 5Top view of the SoC chip 400 provided in the example. The heat sink 500 may include a first part 520, a second part 530, and a plurality of fins 540. The first part 520 is disposed opposite to the first surface 410 of the SoC chip 400. The second part 530 is disposed on opposite sides of the first part 520 along a direction parallel to the first surface 410 and is fixedly connected to the first part 520. The second part 530 is fixedly connected to the circuit board 300. The plurality of fins 540 are fixed to a side of the first part 520 and the second part 530 away from the SoC chip 400.

[0068] Specifically, the first part 520 and the second parts 530 disposed on both sides may be an integrally formed structure, and the second part 530 and the circuit board 300 may be fixedly connected by fasteners (such as screws, not shown in the figure) so that the heat sink 500 is fixed on the SoC chip 400. Among them, since the above circuit board 300 is fixed on the backplane 230, the fasteners may also penetrate the circuit board 300 and be fixed to the backplane 230. The specific connection structure of the heat sink 500 in this application is not particularly limited.

[0069] Among them, the above plurality of fins 540 may be disposed on the surface of the first part 520 away from the SoC chip 400, may also be disposed on the surface of the second part 530 away from the SoC chip 400, or may also have a plurality of fins 540 on both the first part 520 and the second part 530. And, the above plurality of fins 540 are arranged parallel to each other and perpendicular to the surface of the first part 520 away from the SoC chip 400, so that the heat dissipation area of the heat sink 500 can be increased through the plurality of fins 540, which is beneficial to improving the heat dissipation performance of the heat sink 500.

[0070] On this basis, please continue to refer to Figure 5 and Figure 6 , a first region 411 is provided on the first surface 410 of the above SoC chip 400, and the region outside the first region 411 is the second region 412. A recess 510 is provided on the surface of the heat sink 500 facing the first surface 410. The recess 510 is used to space the heat sink 500 from the first region 411, and the heat sink 500 is attached to the second region 412.

[0071] In this way, the optimized heat sink 500 is spaced from a partial region on the first surface 410 of the SoC chip 400, which can increase the coupling path between the heat sink 500 and a partial region of the SoC chip 400. Since the coupling between the heat sink 500 and the SoC chip 400 is capacitive coupling, according to the capacitance calculation formula where C represents the capacitance value, ε represents the dielectric constant, s represents the area of the capacitor plate, and d represents the distance between the substrates. At the same time, according to the calculation formula of capacitive reactance Where Xc represents the capacitive reactance value, f represents the frequency, and C represents the capacitance value. It can be seen from the above formula that the capacitance value C is inversely proportional to the distance d between the substrates, that is, the greater the distance between the plates, the smaller the capacitance value; and the capacitance value is also inversely proportional to the capacitive reactance value, that is, the smaller the capacitance value, the greater the capacitive reactance value.

[0072] Therefore, please refer to Figure 7 , Figure 7 which is Figure 5 the noise electric field distribution diagram of the provided heat sink 500. When a partial area of the heat sink 500 is spaced from the first surface 410 of the SoC chip 400, the capacitive reactance value between the heat sink 500 and the SoC chip 400 can be increased, which is beneficial to reducing the coupling degree therebetween, so that the electromagnetic noise intensity coupled from the SoC chip 400 to the heat sink 500 is weakened, as Figure 7 shown in areas A1 and B1 (in the figure, the strength of the electric field is represented by the shade of the arrow grayscale, the darker the grayscale, the stronger the electric field, and the lighter the grayscale, the weaker the electric field), compared with Figure 4 areas A and B shown in Figure 7 , the noise electric fields in areas A1 and B1 shown in

[0073] Figure 7 are weaker, which is beneficial to reducing the noise radiation power, so as to reduce the interference to the surrounding electronic components, and further beneficial to improving the user experience.

[0074] Exemplarily, please refer to Figure 8 , which is Figure 8 the near-field scanning spectrum diagram of the SoC chip 400 provided in the embodiment of the present application. The above-mentioned SoC chip 400 can be scanned on the first surface 410 through a spectrum analyzer or a vector network analyzer. When the noise electric field in a certain area on the first surface 410 is concentrated and significantly stronger, such as Figure 8 the noise spectrum shown in area C in Figure 8 is significantly higher than the average value of the other areas. Therefore, Figure 8The area corresponding to the spectral value in the C region on the first surface 410 of the SoC chip 400 is the above-mentioned first region 411, and the area outside the first region 411 is the above-mentioned second region 412.

[0075] Among them, during the scanning process, the position where the intensity of the noise electric field increases or decreases significantly can be used as the boundary between the first region 411 and the second region 412, so as to determine the range of the first region 411.

[0076] Based on this, please refer to Figures 9 - 13 , Figure 9 which is a top view of the unoptimized radiator 500 provided by the embodiment of the present application, Figure 10 and Figure 9 is a schematic diagram of the noise electric field distribution when the radiator 500 is installed inside the electronic device 10 provided by Figure 11 This is a top view of the optimized radiator 500 (with a recess 510) provided by the embodiment of the present application, Figure 12 and Figure 11 is a schematic diagram of the noise electric field distribution when the radiator 500 is installed inside the electronic device 10 provided by Figure 13 and Figure 10 and Figure 12 are the isolation simulation effect diagrams of the radiator 500 provided by Figure 10 and Figure 12 Among them, the white dashed boxes in Figure 13 and Figure 13

[0077] Figure 14 Exemplarily, please refer to Figure 15 and Figure 14 , Figure 15 which is a distribution diagram of the positional relationship between the radiator 500 and the installed antennas (points C and D) inside the electronic device 10 provided by the embodiment of the present application, Figure 15 and Figure 14 is the isolation simulation effect diagram of the electronic device 10 (including using the unoptimized radiator 500 and the optimized radiator 500) provided by Figure 15 It can be seen from Figure 14The simulation results of point C are the C1 curve and the C2 curve respectively, and the simulation results of point D are the D1 curve and the D2 curve respectively. It can be seen from this that the simulated isolation of the optimized radiator 500 drops by about 6 dB compared to the unoptimized radiator 500; that is, the optimized radiator 500 has less interference to the antenna, and the downlink throughput of the antenna can be increased by about 40 Mbps.

[0078] In addition, please refer to Figure 16 , Figure 16 which is the noise matching effect diagram of the unoptimized radiator 500 and the optimized radiator 500 provided by the embodiment of the present application. Specifically, when the above-mentioned SoC chip 400 and the radiator 500 undergo capacitive coupling, since their impedances cannot be perfectly matched, part of the power transmitted from the SoC chip 400 to the radiator 500 will be reflected, and the greater the reflected power, the smaller the power transmitted to the radiator 500, that is, the electric field intensity that the radiator 500 can radiate to the surroundings will weaken. From Figure 16 the shown simulation results, it can be seen that the reflection coefficient (curve c in the figure) of the optimized radiator 500 is significantly greater than the reflection coefficient (curve d in the figure) of the unoptimized radiator 500. Therefore, by providing the recess 510 on the radiator 500, that is, the optimized radiator 500 is beneficial to reducing the electric field intensity radiated to the surroundings, thereby being able to reduce the interference to the surrounding electronic components.

[0079] In summary, by providing the recess 510 at the position corresponding to the first region 411 on the first part 520 of the radiator 500, that is, by providing the recess 510 at the position corresponding to the region on the first part 520 of the radiator 500 where the electromagnetic noise generated on the SoC chip 400 is relatively strong, the coupling degree between the relatively strong electromagnetic noise generated on the SoC chip 400 and the radiator 500 can be reduced, thereby reducing the power radiated to the surroundings through the radiator 500, which is beneficial to reducing the interference to the surrounding electronic components. The relatively weak electromagnetic noise generated in the second region 412, due to its relatively low intensity itself, after coupling with the radiator 500, its radiation power is also relatively small and cannot interfere with the surrounding electronic components. In this way, the coupling degree between the SoC chip 400 and the radiator 500 can be reduced, and the power of the electromagnetic noise radiated to the surroundings through the radiator 500 can be reduced, thereby further reducing the interference to the surrounding electronic components.

[0080] In addition, to ensure that all the electromagnetic noise generated in the first region 411 can be optimized, the vertical projection of the recess 510 provided in the embodiment of the present application on the first surface 410 of the SoC chip 400 can cover the first region 411. In this way, it can be ensured that the coupling degree between the relatively strong electromagnetic noise generated on the SoC chip 400 and the heat sink 500 is reduced, thereby further reducing the interference to the surrounding electronic components.

[0081] It should be noted that the vertical projection of the above-mentioned recess 510 on the first surface 410 of the SoC chip 400 can completely coincide with the first region 411, that is, the area and shape of the vertical projection of the recess 510 on the first surface 410 are the same as those of the first region 411, and the two coincide with each other. The area of the vertical projection of the recess 510 on the first surface 410 can also be larger than the area of the first region 411, and the vertical projection of the recess 510 completely covers the first region 411. Therefore, the present application does not make special limitations on this.

[0082] In some embodiments, please refer to Figure 17 , Figure 17 which is a cross-sectional view of a recess 510 provided on the heat sink 500 according to the embodiment of the present application. The above-mentioned recess 510 can be a groove 511, that is, a groove 511 is opened on the surface of the first part 520 facing the SoC chip 400, and the bottom surface of the groove 511 faces the first region 411. In this way, a distance equal to the depth of the groove 511 can be increased between the heat sink 500 and the first region 411 of the SoC chip 400, which is beneficial to reducing the coupling degree between the electromagnetic noise generated in the first region 411 of the SoC chip 400 and the heat sink 500, so as to reduce the power of the electromagnetic noise radiated to the surrounding through the heat sink 500, and further reduce the interference to the surrounding electronic components.

[0083] It should be noted that the depth of the above-mentioned groove 511 can be determined according to actual requirements. Exemplarily, from the above capacitance and capacitive reactance formulas, it can be known that the distance between the first region 411 of the SoC chip 400 and the bottom surface of the groove 511 can determine the coupling degree therebetween, that is, the deeper the groove 511 is, the more the coupling degree between the electromagnetic noise generated by the SoC chip 400 and the heat sink 500 can be reduced, thereby reducing the interference of electromagnetic radiation on other electronic components around the SoC chip 400. Therefore, during actual production, the minimum radiation value that will not interfere with other electronic components around the SoC chip 400 can be used as a standard, so as to determine the depth of the groove 511 when the radiation value after coupling the electromagnetic noise generated by the SoC chip 400 and the heat sink 500 can be reduced to this standard. In this way, on the one hand, it is beneficial to ensure that there is no interference with the surrounding electronic components; on the other hand, the depth of the groove 511 can be accurately determined to avoid the situation where the depth of the groove 511 is reduced and the radiation value fails to be reduced to the above standard.

[0084] In addition, the cross-sectional shape of the above-mentioned groove 511 along the direction parallel to the first surface 410 is not unique. For example, the cross-sectional shape of the groove 511 can be circular, oval, square, rectangular, triangular, pentagonal, hexagonal, rhombic, trapezoidal, etc., or the cross-section of the groove 511 can also be other irregular shapes. That is, the vertical projection of the groove 511 on the first surface 410 can cover the above-mentioned first region 411, and its specific shape is not specially limited in this application.

[0085] To ensure that while the groove 511 is opened on the heat sink 500, the heat dissipation performance of the heat sink 500 can also be guaranteed. Please refer to Figure 18 , Figure 18 For Figure 17 the sectional view of the recessed portion 510 provided with the heat-conducting material 600 filled therein. The above-mentioned groove 511 can be filled with the heat-conducting material 600, and the heat-conducting material 600 is in contact with the first region 411 of the SoC chip 400. In this way, the heat generated by the first region 411 can be transferred to the heat sink 500 through the heat-conducting material 600, thereby realizing heat dissipation and temperature reduction of the first region 411 of the SoC chip 400. Among them, the heat-conducting material 600 can adopt heat-conducting silica gel. Heat-conducting silica gel is a heat-conducting compound, and its characteristics of not solidifying and not conducting electricity can avoid risks such as short circuits in the circuit. It has high thermal conductivity and a wide operating temperature range, so as to achieve a good heat dissipation effect.

[0086] In some other embodiments, please refer to Figure 19 , Figure 19A cross-sectional view of another recess 510 provided on the heat sink 500 according to an embodiment of the present application. The above-mentioned recess 510 can also be a through-hole 512, and the through-hole 512 penetrates the surface of the first part 520 of the heat sink 500 away from the SoC chip 400. In this way, since the through-hole 512 penetrates the heat sink 500, the coupling degree between the electromagnetic noise generated in the first region 411 of the SoC chip 400 and the heat sink 500 can be further reduced, which is more conducive to reducing the intensity of electromagnetic noise radiating to the surroundings through the heat sink 500, and further more conducive to reducing the interference of the electromagnetic noise generated by the SoC chip 400 to other surrounding electronic components.

[0087] Among them, the cross-sectional shape of the above-mentioned through-hole 512 is not unique. For example, the cross-sectional shape of the through-hole 512 can be circular, oval, square, rectangular, triangular, pentagonal, hexagonal, rhombic, trapezoidal, etc., or the cross-section of the through-hole 512 can also be other irregular shapes. That is, the vertical projection of the through-hole 512 on the first surface 410 can cover the above-mentioned first region 411, and the specific shape thereof is not particularly limited in this application.

[0088] To ensure that while a through-hole 512 is opened on the heat sink 500, the heat dissipation performance of the heat sink 500 can still be guaranteed. Please refer to Figure 20 , Figure 20 For Figure 19 A cross-sectional view of a heat conducting member 700 provided in the recess 510. A heat conducting member 700 can be provided in the through-hole 512. The heat conducting member 700 abuts against the first region 411 of the SoC chip 400 and abuts against the inner wall of the through-hole 512. In this way, the heat generated in the first region 411 can be transferred to the heat sink 500 through the heat conducting member 700, so as to realize heat dissipation and temperature reduction of the first region 411 of the SoC chip 400. Among them, the above-mentioned heat conducting member 700 can adopt a heat conducting gasket, which has high compressibility, is soft and elastic. Therefore, setting the heat conducting gasket in the through-hole 512 and abutting against the first region 411 of the SoC chip 400 is conducive to making the heat conducting gasket fully contact with the SoC chip 400 and the inner wall of the through-hole 512, thus being conducive to improving the heat conduction efficiency. At the same time, the heat conducting gasket has a good heat conduction rate. Therefore, the heat dissipation effect of the SoC chip 400 can be guaranteed.

[0089] Exemplarily, the above through hole 512 may be a round hole, that is, the cross section of the through hole 512 is circular. At this time, the heat conducting member 700 may be a heat conducting gasket with a circular cross section. The diameter of the circular heat conducting gasket matches the inner diameter of the through hole 512, so that the side wall of the heat conducting gasket is fully attached to the inner wall of the through hole 512, and the heat conducting gasket is pressed along the direction perpendicular to the first surface 410 to make it fully attached to the first region 411 of the SoC chip 400. In this way, the heat on the first region 411 of the SoC chip 400 can be transferred to the radiator 500 through the heat conducting gasket, realizing heat dissipation and temperature reduction.

[0090] In addition, please refer to Figure 21 , Figure 21 which is a structural diagram of a distribution manner of the through hole 512 and the fins 540 provided by an embodiment of the present application. The fins 540 provided on the side of the first part 520 of the radiator 500 away from the SoC chip 400 may not be provided in the area corresponding to the through hole 512, that is, in the plane parallel to the first surface 410, the fins 540 and the through hole 512 are arranged in a staggered manner to facilitate the installation of the above heat conducting gasket into the through hole 512. For example, along the length direction of the fins 540 (i.e., the extending direction of the fins 540), the fins 540 can be divided into two parts and are respectively arranged on both sides of the through hole 512.

[0091] Or, please refer to Figure 22 , Figure 22 which is another structural diagram of a distribution manner of the through hole 512 and the fins 540 provided by an embodiment of the present application. Some of the fins 540 of the radiator 500 may also be staggered with the fins 540. That is, in the plane parallel to the first surface 410, some of the fins 540 and the through hole 512 overlap each other. In this way, the surface of the heat conducting gasket provided in the through hole 512 away from the SoC chip 400 can contact with the fins 540, which is beneficial to further improving the heat dissipation effect.

[0092] In the description of this specification, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0093] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present application, and all should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electronic device, characterized in that, Comprising: A housing; A circuit board, disposed within the housing; A chip, disposed on the circuit board. The surface of the chip away from the circuit board is the first surface. The first surface includes a first region, and the region other than the first region is the second region. The electromagnetic noise generated by the first region is greater than the electromagnetic noise generated by the second region; A radiator, disposed on the side of the chip away from the circuit board. A recess is provided on the surface of the radiator facing the first surface. The recess is used to space the radiator from the first region, and the radiator is in contact with the second region.

2. The electronic device according to claim 1, wherein The vertical projection of the recess on the first surface covers the first region.

3. The electronic device according to claim 1 or 2, characterized in that The recess includes a groove, and the bottom surface of the groove faces the first region.

4. The electronic device according to claim 3, wherein The groove is filled with a thermal conductive material, and the thermal conductive material is in contact with the first region of the chip.

5. The electronic device according to claim 4, wherein The thermal conductive material includes thermal conductive silicone.

6. The electronic device according to claim 1 or 2, characterized in that The recess includes a through hole, and the through hole penetrates the surface of the radiator away from the chip.

7. The electronic device according to claim 6, wherein A thermal conductive member is disposed within the through hole, and the thermal conductive member abuts against the first region of the chip.

8. The electronic device according to claim 7, characterized in that, The thermal conductive member includes a thermal conductive gasket.

9. The electronic device according to claim 1 or 2, characterized in that, The radiator includes: A first part, opposite to the first surface of the chip; A second part, on both sides opposite to the first part along a direction parallel to the first surface. The second part is fixedly connected to the first part, and the second part is fixedly connected to the circuit board.

10. The electronic device according to claim 9, wherein, The radiator further includes a plurality of fins, and the fins are disposed on the surface of the first part away from the chip, and the plurality of fins are spaced apart.

11. The electronic device according to claim 1 or 2, characterized in that, The chip includes a SoC chip.

Images