Silicon wafer conveying device and silicon wafer conveying method

Abstract

This invention discloses a silicon wafer conveying device, comprising: multiple loading stations for placing unprocessed or processed silicon wafers, wherein when any one loading station is vacant, the remaining loading stations are in a placement state; a first unloading station for placing processed or unprocessed silicon wafers; a first transport mechanism for transferring unprocessed or processed silicon wafers between the loading stations and the first unloading station; a second transport mechanism for transferring unprocessed or processed silicon wafers between the loading stations and the first unloading station; and a controller configured to: control the first transport mechanism to transfer processed silicon wafers from the first unloading station to the vacant loading station; and control the second transport mechanism to transfer unprocessed silicon wafers from the placement loading stations to the first unloading station. The silicon wafer conveying device of this invention can improve the silicon wafer conveying efficiency.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer processing technology, and in particular to a silicon wafer conveying device and a silicon wafer conveying method. Background Technology

[0002] In related technologies, the processing of solar silicon wafers includes texturing, etching, and diffusion. A conveying device is used to transport the silicon wafers, allowing them to be processed by different equipment. Specifically, wafer baskets and quartz boats are used to transport the wafers. Existing conveying devices first place the processed wafers from the quartz boat into an empty wafer basket, then transport the basket to transfer the processed wafers. Next, unprocessed wafers are placed into the wafer basket, and the basket is transported again, transferring the unprocessed wafers from the basket to the quartz boat. Finally, the quartz boat transports the unprocessed wafers to the processing equipment. This method of transferring wafers results in low wafer transfer efficiency, further reducing the overall production efficiency of silicon wafers. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention proposes a silicon wafer conveying device that can improve the conveying efficiency of silicon wafers.

[0004] The present invention also proposes a silicon wafer transport method.

[0005] A silicon wafer transport apparatus according to a first aspect embodiment of the present invention includes:

[0006] Multiple wafer loading stations are used to place unprocessed silicon wafers or processed silicon wafers. Each wafer loading station has a placement state in which the unprocessed silicon wafer or the processed silicon wafer is placed, and an empty state in which the unprocessed silicon wafer or the processed silicon wafer is not placed. When any one of the wafer loading stations is in the empty state, the other wafer loading stations are in the placement state.

[0007] The first wafer unloading station is used to place processed silicon wafers or unprocessed silicon wafers.

[0008] A first conveying mechanism is used to transfer the unprocessed silicon wafer or the processed silicon wafer between the wafer loading station and the first wafer unloading station;

[0009] The second conveying mechanism is used to transfer the unprocessed silicon wafer or the processed silicon wafer between the wafer loading station and the first wafer unloading station;

[0010] A controller, communicatively connected to the first transport mechanism and the second transport mechanism, is configured to: control the first transport mechanism to transfer the processed silicon wafer at the first unloading station to the vacant loading station, so that the vacant loading station is switched to the placement state; and control the second transport mechanism to transfer the unprocessed silicon wafer at the placement loading station to the first unloading station, so that the placement loading station is switched to the vacant state.

[0011] The silicon wafer conveying device according to embodiments of the present invention has at least the following beneficial effects: the controller controls the first conveying mechanism to transfer the processed silicon wafers at the first unloading station to the vacant loading station; simultaneously, the controller also controls the second conveying mechanism to transfer the unprocessed silicon wafers at the loading station to the first unloading station. In the prior art, when transferring processed and unprocessed silicon wafers, the processed silicon wafers must be transferred first, followed by the unprocessed silicon wafers, resulting in low wafer conveying efficiency. However, the silicon wafer conveying device of this application can transfer processed and unprocessed silicon wafers simultaneously. Therefore, the silicon wafer conveying device has higher conveying efficiency.

[0012] According to some embodiments of the silicon wafer conveying apparatus of the present invention, the silicon wafer conveying apparatus further includes a first processing conveyor line extending to a first unloading station and an external processing device, respectively. The controller is further configured to: control the first processing conveyor line to transfer the unprocessed silicon wafer from the first unloading station to the processing device, and / or control the first processing conveyor line to transfer the processed silicon wafer from the processing device to the first unloading station; and / or, the silicon wafer conveying apparatus further includes a material conveyor line extending to the loading station, the controller being further configured to: control the material conveyor line to transfer the unprocessed silicon wafer to the loading station, and / or control the material conveyor line to transfer the processed silicon wafer out of the loading station.

[0013] According to some embodiments of the silicon wafer conveying apparatus of the present invention, the controller is further configured to: when the processed silicon wafer is placed on the wafer loading station in the placement state, the controller further controls the material conveying line to transfer the processed silicon wafer out of the wafer loading station, so that the wafer loading station in the placement state is switched to the vacant state; and the controller further controls the material conveying line to transfer the unprocessed silicon wafer to the wafer loading station in the vacant state.

[0014] According to some embodiments of the silicon wafer conveying apparatus of the present invention, the controller is further configured to: when the unprocessed silicon wafer is placed at the first unloading station, the controller controls the first processing conveyor line to transfer the unprocessed silicon wafer to the processing equipment; and / or, when the processed silicon wafer is present at the processing equipment, the controller controls the first processing conveyor line to transfer the processed silicon wafer from the processing equipment to the first unloading station.

[0015] According to some embodiments of the silicon wafer conveying apparatus of the present invention, the silicon wafer conveying apparatus further includes a second unloading station, the second unloading station being used to place the processed silicon wafer or the unprocessed silicon wafer; the silicon wafer conveying apparatus further includes a first processing conveyor line, the first processing conveyor line extending to the first unloading station and external processing equipment respectively; the controller is further configured to: control the first processing conveyor line to transfer the unprocessed silicon wafer from the first unloading station to the processing equipment, and / or, control the first processing conveyor line to transfer the processed silicon wafer from the processing equipment to the first unloading station; the controller is further configured to: control the first processing conveyor line to transfer the unprocessed silicon wafer from the processing equipment to the first unloading station. During the transfer of the unprocessed silicon wafer from the first unloading station to the processing equipment, and during the period when the controller controls the first processing conveyor line to transfer the processed silicon wafer from the processing equipment to the first unloading station, the controller also controls the second transport mechanism to transfer the processed silicon wafer at the second unloading station to the vacant wafer loading station, so that the vacant wafer loading station is switched to the placement state; and the controller also controls the first transport mechanism to transfer the unprocessed silicon wafer at the placement wafer loading station to the second unloading station, so that the placement wafer loading station is switched to the vacant state.

[0016] According to some embodiments of the silicon wafer conveying device of the present invention, the controller is further configured to: when the controller controls the first processing conveyor line to transfer the unprocessed silicon wafer from the first unloading station to the processing equipment, the controller also simultaneously controls the second conveying mechanism to transfer the processed silicon wafer at the second unloading station to the loading station in the vacant state, and the controller also simultaneously controls the first conveying mechanism to transfer the unprocessed silicon wafer at the loading station in the placed state to the second unloading station.

[0017] According to some embodiments of the present invention, the silicon wafer conveying apparatus further includes a material conveying line extending to the wafer loading station. The controller is further configured to: control the material conveying line to transfer the unprocessed silicon wafer to the wafer loading station, and / or control the material conveying line to transfer the processed silicon wafer out of the wafer loading station; the controller is further configured to: during the controller controlling the first processing conveying line to transfer the unprocessed silicon wafer from the first unloading station to the processing equipment, and during the controller controlling the first processing conveying line to transfer the processed silicon wafer from the processing equipment to the first unloading station, the controller further controls the material conveying line to transfer the processed silicon wafer in the placed state at the wafer loading station out of the wafer loading station, so that the wafer loading station in the placed state is switched to the vacant state, and the controller further controls the material conveying line to transfer the unprocessed silicon wafer to the wafer loading station in the vacant state, so that the wafer loading station in the vacant state is switched to the placed state.

[0018] According to some embodiments of the silicon wafer conveying apparatus of the present invention, the controller is further configured to: when the controller controls the first processing conveyor line to transfer the unprocessed silicon wafer from the first unloading station to the processing equipment, the controller also simultaneously controls the material conveyor line to transfer the processed silicon wafer in the placement state at the wafer loading station out of the wafer loading station, and the controller also simultaneously controls the material conveyor line to transfer the unprocessed silicon wafer to the wafer loading station.

[0019] According to some embodiments of the silicon wafer conveying device of the present invention, along a first direction, a plurality of wafer loading stations and a second wafer unloading station are respectively arranged on both sides of the first wafer unloading station, and a plurality of wafer loading stations and a first wafer unloading station are respectively arranged on both sides of the second wafer unloading station, wherein the first direction is a direction perpendicular to the conveying direction of the first processing conveying line.

[0020] According to some embodiments of the silicon wafer conveying apparatus of the present invention, the controller is further configured to: control the first conveying mechanism to transfer the unprocessed silicon wafer or the processed silicon wafer between the first unloading station and the loading station located next to the first unloading station; and control the second conveying mechanism to transfer the unprocessed silicon wafer or the processed silicon wafer between the second unloading station and the loading station located next to the second unloading station.

[0021] According to some embodiments of the silicon wafer conveying apparatus of the present invention, the controller is further configured to: control the first conveying mechanism to transfer the processed silicon wafer at the first unloading station to the wafer loading station in the vacant state, so that the wafer loading station in the vacant state is switched to the placement state; and the controller synchronously controls the second conveying mechanism to transfer the unprocessed silicon wafer at the wafer loading station in the placement state to the first unloading station, so that the wafer loading station in the placement state is switched to the vacant state.

[0022] According to some embodiments of the silicon wafer conveying device of the present invention, the silicon wafer conveying device further includes a top tooth assembly disposed below the first unloading station and the loading station. The first unloading station and the loading station are each provided with a placement groove for placing the silicon wafer. The top tooth assembly is used to abut against the silicon wafer so that at least a portion of the silicon wafer protrudes beyond the placement groove.

[0023] According to some embodiments of the silicon wafer conveying device of the present invention, the silicon wafer conveying device further includes a wafer-leveling assembly disposed above the first unloading station and the loading station, the wafer-leveling assembly being used to level the silicon wafer.

[0024] A silicon wafer transport method according to a second aspect embodiment of the present invention includes the following steps:

[0025] Prepare a first unloading station and multiple loading stations. The first unloading station has a placement state with processed or unprocessed silicon wafers and an empty state without the processed or unprocessed silicon wafers. When any one of the loading stations is in the empty state, the other loading stations are in the placement state.

[0026] The processed silicon wafers at the first unloading station are transferred to the vacant loading station, so that the vacant loading station is switched to the placement state; and the unprocessed silicon wafers at the placement loading station are transferred to the first unloading station, so that the placement loading station is switched to the vacant state.

[0027] The silicon wafer transport method according to embodiments of the present invention has at least the following beneficial effects: after preparing multiple loading stations and a first unloading station, the processed silicon wafers at the first unloading station are transferred to the vacant loading station, while the unprocessed silicon wafers at the loading station in a placement state are transferred to the first unloading station. In the prior art, when transferring silicon wafers, the processed silicon wafers must be transferred first, and then the unprocessed silicon wafers can be transferred, which leads to low silicon wafer transport efficiency. However, the silicon wafer transport method of this application can transfer processed silicon wafers and unprocessed silicon wafers simultaneously. Therefore, the silicon wafer transport method has high transport efficiency.

[0028] According to some embodiments of the silicon wafer transport method of the present invention, when the processed silicon wafer at the first unloading station is transferred to the loading station which is in the vacant state, the unprocessed silicon wafer at the loading station which is in the placement state is simultaneously transferred to the first unloading station.

[0029] According to some embodiments of the present invention, the silicon wafer conveying method further includes the step of transferring the unprocessed silicon wafer at the first unloading station to the processing equipment.

[0030] According to some embodiments of the present invention, the silicon wafer transport method further includes the following steps: preparing a second unloading station, the second unloading station having the processed silicon wafer; during the process of transferring the unprocessed silicon wafer at the first unloading station to the processing equipment and transferring the processed silicon wafer at the processing equipment to the first unloading station, transferring the processed silicon wafer at the second unloading station to the loading station in the vacant state, so that the loading station in the vacant state is switched to the placement state; and transferring the unprocessed silicon wafer at the loading station in the placement state to the second unloading station, so that the loading station in the placement state is switched to the vacant state.

[0031] According to some embodiments of the present invention, in a silicon wafer transport method, when transferring the unprocessed silicon wafer at the first unloading station to the processing equipment, the processed silicon wafer at the second unloading station is simultaneously transferred to the vacant loading station, so that the vacant loading station is switched to the placement state; and the unprocessed silicon wafer at the placement loading station is transferred to the second unloading station, so that the placement loading station is switched to the vacant state.

[0032] According to some embodiments of the present invention, the silicon wafer transport method further includes the following steps: during the process of transferring the processed silicon wafer at the second unloading station to the loading station in the vacant state, so that the loading station in the vacant state is switched to the placement state, and transferring the unprocessed silicon wafer at the loading station in the placement state to the second unloading station, so that the loading station in the placement state is switched to the vacant state, the processed silicon wafer at the loading station in the placement state is transferred out of the loading station, so that the loading station in the placement state is switched to the vacant state, and the unprocessed silicon wafer is transferred to the loading station in the vacant state, so that the loading station in the vacant state is switched to the placement state.

[0033] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0034] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0035] Figure 1 This is a schematic diagram of a silicon wafer conveying device according to some embodiments of the present invention;

[0036] Figure 2 This is a schematic diagram of the first conveying mechanism in a silicon wafer conveying device according to some embodiments of the present invention;

[0037] Figure 3 This is a schematic diagram of the top tooth assembly in a silicon wafer conveying device according to some embodiments of the present invention;

[0038] Figure 4 This is a schematic diagram of a silicon wafer conveying device according to a first embodiment of the present invention;

[0039] Figure 5 This is a schematic diagram of a silicon wafer conveying device according to a second embodiment of the present invention;

[0040] Figure 6 This is a schematic diagram of a silicon wafer conveying device according to a third embodiment of the present invention;

[0041] Figure 7 This is a schematic diagram of a silicon wafer conveying device according to a fourth embodiment of the present invention;

[0042] Figure 8 This is a schematic flowchart of a silicon wafer transport method according to some embodiments of the present invention.

[0043] Figure label:

[0044] Silicon wafer conveying device 100, wafer loading station 200, first wafer loading station 210, second wafer loading station 220, third wafer loading station 230, fourth wafer loading station 240, first wafer unloading station 300, second wafer unloading station 400, first conveying mechanism 500, first driving component 510, suction component 520, second conveying mechanism 600, first processing conveying line 700, second processing conveying line 800, material conveying line 900, top tooth assembly 1000, holding component 1100, third driving component 1200, and whole wafer assembly 2000. Detailed Implementation

[0045] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0046] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0047] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0048] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0049] In the description of this invention, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0050] In the prior art, silicon wafers can be divided into two categories: silicon wafers that have been processed by the processing equipment (referred to as processed silicon wafers in this application), and silicon wafers that have not yet been processed by the processing equipment (referred to as unprocessed silicon wafers in this application). The silicon wafer processing process requires a silicon wafer conveying device 100 to transport the processed silicon wafers from the processing equipment and then transport the unprocessed silicon wafers to the processing equipment. Furthermore, existing conveying devices, when transporting silicon wafers, first place the processed silicon wafers from the quartz boat into an empty wafer basket, then transport the wafer basket to transfer the processed silicon wafers, then place the unprocessed silicon wafers into the wafer basket, transport the wafer basket, thereby transferring the unprocessed silicon wafers from the wafer basket to the quartz boat, and finally transport the unprocessed silicon wafers to the processing equipment via the quartz boat. The above-mentioned method of transferring silicon wafers results in low silicon wafer transfer efficiency, further reducing silicon wafer production efficiency. Therefore, this application proposes a silicon wafer conveying device 100.

[0051] Please refer to Figure 1 and Figure 7 ,in, Figures 4 to 7 A schematic diagram of a silicon wafer conveying device 100 conveying silicon wafers is shown. Figures 4 to 7In the diagram, arrows represent the trajectories of the first transport mechanism 500 and the second transport mechanism 600 transferring silicon wafers. In some embodiments, the silicon wafer transport device 100 includes: a plurality of wafer loading stations 200, a first wafer unloading station 300, a first transport mechanism 500, a second transport mechanism 600, and a controller (not shown). The plurality of wafer loading stations 200 are used to place unprocessed or processed silicon wafers. Each wafer loading station 200 has a loading state with unprocessed or processed silicon wafers placed on it, and an empty state without unprocessed or processed silicon wafers placed on it. When any one wafer loading station 200 is in an empty state, the remaining wafer loading stations 200 are in a loading state. It is conceivable that multiple unprocessed silicon wafers can be placed on the wafer loading stations 200, awaiting transport to the processing equipment. The first wafer unloading station 300 is used to place processed or unprocessed silicon wafers. Processed silicon wafers can be placed on the first wafer unloading station 300, awaiting transport to other processes. The first transport mechanism 500 is used to transfer unprocessed or processed silicon wafers between the wafer loading station 200 and the first unloading station 300. Specifically, the first transport mechanism 500 can be a robotic arm, which can pick up unprocessed or processed silicon wafers and transfer them. The second transport mechanism 600 is used to transfer unprocessed or processed silicon wafers between the wafer loading station 200 and the first unloading station 300. Specifically, the second transport mechanism 600 can be a robotic arm, which can pick up unprocessed or processed silicon wafers and transfer them. The robotic arm can be mounted on a gantry crane. A controller is communicatively connected to the first transport mechanism 500 and the second transport mechanism 600. The controller can control the movement of the first transport mechanism 500 and the second transport mechanism 600, so that the first transport mechanism 500 picks up processed silicon wafers for transfer, or the second transport mechanism 600 picks up unprocessed silicon wafers for transfer. A controller is a feedback loop component widely used in industrial control applications. For example, a programmable memory stores instructions for performing logical operations, sequential control, timing, counting, and arithmetic operations, controlling various types of mechanical equipment or production processes through digital or analog inputs and outputs. The specific structure of the controller is existing technology and will not be described in detail here. In this configuration, multiple wafer loading stations 200 are arranged such that one station is empty, while the remaining stations have unprocessed silicon wafers in a placed state. That is, when unprocessed silicon wafers are placed on the multiple wafer loading stations 200, one station is empty, while the remaining stations have unprocessed silicon wafers.The controller is configured to: control the first transport mechanism 500 to transfer the processed silicon wafers at the first unloading station 300 to the vacant loading station 200, so that the vacant loading station 200 is switched to a placement state; and control the second transport mechanism 600 to transfer the unprocessed silicon wafers at the placement loading station 200 to the first unloading station 300, so that the placement loading station 200 is switched to a vacant state.

[0052] Specifically, the controller controls the first transport mechanism 500 to transfer the processed silicon wafers at the first unloading station 300 to the vacant loading station 200. Simultaneously, the controller also controls the second transport mechanism 600 to transfer the unprocessed silicon wafers from the vacant loading station 200 to the first unloading station 300. In the prior art, when transferring processed and unprocessed silicon wafers, the processed wafers must be transferred first, followed by the unprocessed wafers. This results in low wafer transport efficiency. However, the silicon wafer transport device 100 of this application can transfer processed and unprocessed silicon wafers simultaneously. Therefore, the silicon wafer transport device 100 has higher transport efficiency.

[0053] Furthermore, it should be added that since one of the multiple wafer loading stations 200 is in an vacant state, when transferring processed and unprocessed silicon wafers, the processed silicon wafers are transferred to the vacant wafer loading station 200. This causes the first unloading station 300, which is in a placement state, to switch to an vacant state. This allows unprocessed silicon wafers to be placed on the vacant first unloading station 300. Furthermore, after the unprocessed silicon wafers in the placement state of the wafer loading station 200 are transferred to the first unloading station 300, one of the multiple wafer loading stations 200 will be in an vacant state. This cycle repeats continuously, allowing the silicon wafer conveying device 100 of this application to continuously transfer processed and unprocessed silicon wafers, thereby achieving high conveying efficiency.

[0054] Furthermore, to improve conveying efficiency, the first conveying mechanism 500 and the second conveying mechanism 600 can operate synchronously. Specifically, in some embodiments, the controller is further configured to: control the first conveying mechanism 500 to transfer the processed silicon wafers at the first unloading station 300 to the vacant loading station 200, so that the vacant loading station 200 is switched to a placement state; and synchronously control the second conveying mechanism 600 to transfer the unprocessed silicon wafers at the placement loading station 200 to the first unloading station 300, so that the placement loading station 200 is switched to an vacant state. Specifically, the synchronous control refers to the second conveying mechanism 600 starting to move unprocessed silicon wafers when the first conveying mechanism 500 begins moving processed silicon wafers. That is, the first conveying mechanism 500 and the second conveying mechanism 600 can start simultaneously under the control of the controller, thus improving conveying efficiency.

[0055] Further, please refer to Figure 4 In some embodiments, the silicon wafer conveying device 100 further includes a first processing conveyor line 700 and a material conveyor line 900. The material conveyor line 900 extends to the wafer loading station 200. The controller is further configured to: control the material conveyor line 900 to transfer unprocessed silicon wafers to the wafer loading station 200, and / or control the material conveyor line 900 to transfer processed silicon wafers out of the wafer loading station 200. The first processing conveyor line 700 extends to both the first unloading station 300 and external processing equipment. The controller is further configured to: control the first processing conveyor line 700 to transfer unprocessed silicon wafers from the first unloading station 300 to the processing equipment, and / or control the first processing conveyor line 700 to transfer processed silicon wafers from the processing equipment to the first unloading station 300. Specifically, the material conveyor line 900 and the first processing conveyor line 700 can be belt conveyors or rail conveyors. The material conveyor line 900 can transport unprocessed silicon wafers, thereby enabling the unprocessed silicon wafers to be processed. Furthermore, the processed silicon wafers are transported out of the processing equipment via the first processing conveyor line 700, which improves the wafer transfer efficiency. More specifically, high conveying efficiency can be achieved through the material conveyor line 900 and the first processing conveyor line 700.

[0056] Furthermore, in some embodiments, the controller is also configured to: when a processed silicon wafer is placed on the wafer loading station 200 in the placement state, the controller also controls the material conveyor line 900 to transfer the processed silicon wafer out of the wafer loading station 200, so that the wafer loading station 200 in the placement state is switched to an empty state; and the controller also controls the material conveyor line 900 to transfer unprocessed silicon wafers to the wafer loading station 200 in the empty state. Specifically, the wafer loading station 200 is initially in an empty state. After the processed silicon wafers are transferred to the empty wafer loading station 200, when there are processed silicon wafers on the placed wafer loading station 200, the processed silicon wafers on the placed wafer loading station 200 can be transferred to other processes through the material conveyor line 900. Then, the unprocessed silicon wafers are transferred to the empty wafer loading station 200. In this way, the processed silicon wafers can be transferred from the processing equipment to other processes, and the unprocessed silicon wafers can be transferred to the empty wafer loading station 200 through the material conveyor line 900, so that they can wait to be transferred to the processing equipment for processing.

[0057] Furthermore, in some embodiments, the controller is also configured to: when an unprocessed silicon wafer is placed at the first unloading station 300, the controller controls the first processing conveyor line 700 to transfer the unprocessed silicon wafer to the processing equipment; and / or, when a processed silicon wafer is present at the processing equipment, the controller controls the first processing conveyor line 700 to transfer the processed silicon wafer from the processing equipment to the first unloading station 300. Specifically, by controlling the first processing conveyor line 700 to transport the processed silicon wafer from the processing equipment to the first unloading station 300, the automated transfer of the processed silicon wafer at the processing equipment can be achieved. In addition, the controller can also control the first processing conveyor line 700 to transport the unprocessed silicon wafer at the first unloading station 300 to the processing equipment for processing.

[0058] It is conceivable that, in some embodiments, the silicon wafer conveying device 100 further includes a second processing conveyor line 800 and a second unloading station 400. The controller is also configured to: when an unprocessed silicon wafer is placed at the second unloading station 400, the controller controls the second processing conveyor line 800 to transfer the unprocessed silicon wafer to the processing equipment; and / or, when a processed silicon wafer is present at the processing equipment, the controller controls the second processing conveyor line 800 to transfer the processed silicon wafer from the processing equipment to the second unloading station 400. Specifically, by controlling the second processing conveyor line 800 to convey the processed silicon wafer from the processing equipment to the second unloading station 400, automated transfer of the processed silicon wafer at the processing equipment can be achieved. Furthermore, the controller can also control the second processing conveyor line 800 to convey the unprocessed silicon wafer at the second unloading station 400 to the processing equipment for processing.

[0059] Further, please refer to Figure 4 and Figure 5 In some embodiments, the silicon wafer conveying device 100 further includes a second unloading station 400 for placing processed silicon wafers or unprocessed silicon wafers; the silicon wafer conveying device 100 also includes a first processing conveyor line 700, which extends to the first unloading station 300 and external processing equipment respectively; the controller is further configured to: control the first processing conveyor line 700 to transfer unprocessed silicon wafers from the first unloading station 300 to the processing equipment, and / or control the first processing conveyor line 700 to transfer processed silicon wafers from the processing equipment to the first unloading station 300. The controller is also configured to: while the controller controls the first processing conveyor 700 to transfer unprocessed silicon wafers from the first unloading station 300 to the processing equipment, and while the controller controls the first processing conveyor 700 to transfer processed silicon wafers from the processing equipment to the first unloading station 300, the controller also controls the second transport mechanism 600 to transfer processed silicon wafers at the second unloading station 400 to the vacant loading station 200, so that the vacant loading station 200 is switched to a placement state; and the controller also controls the first transport mechanism 500 to transfer unprocessed silicon wafers at the placement loading station 200 to the second unloading station 400, so that the placement loading station 200 is switched to an vacant state. It is conceivable that the coordination of the first wafer unloading station 300, the second wafer unloading station 400, and the first processing conveyor line 700 can achieve the following: after unprocessed silicon wafers are placed on the first wafer unloading station 300 in an empty state, the first processing conveyor line 700 transports the unprocessed silicon wafers on the first wafer unloading station 300 to the processing equipment for processing, and the first processing conveyor line 700 transfers processed silicon wafers from the processing equipment to the first wafer unloading station 300. The controller also controls the second transport mechanism 600 to transfer the processed silicon wafers at the second wafer unloading station 400 to the empty wafer loading station 200, and the controller also controls the first transport mechanism 500 to transfer the unprocessed silicon wafers at the placed wafer loading station 200 to the second wafer unloading station 400. Thus, during the transport of unprocessed and processed silicon wafers on the first processing conveyor line 700, processed silicon wafers on the second unloading station 400 are transferred, and unprocessed silicon wafers on the loading station 200 are transferred. Specifically, the various mechanisms in the silicon wafer conveying device 100 can operate continuously, which can further enable the silicon wafer conveying device 100 to have a high conveying efficiency.

[0060] Furthermore, in some embodiments, the controller is also configured to: when the controller controls the first processing conveyor 700 to transfer unprocessed silicon wafers from the first unloading station 300 to the processing equipment, the controller also simultaneously controls the second transport mechanism 600 to transfer processed silicon wafers from the second unloading station 400 to the vacant loading station 200; and the controller also simultaneously controls the first transport mechanism 500 to transfer unprocessed silicon wafers from the placed loading station 200 to the second unloading station 400. Specifically, when the first processing conveyor 700 starts working, the second transport mechanism 600 and the first transport mechanism 500 also start working; the simultaneous operation of these three mechanisms can improve work efficiency.

[0061] As mentioned above, while the first processing conveyor line 700 is conveying unprocessed silicon wafers, the processed silicon wafers on the second unloading station 400 are simultaneously transferred to unprocessed silicon wafers. Furthermore, the unprocessed silicon wafers on the second unloading station 400 can be conveyed to processing equipment for processing. For details, please refer to... Figure 4 and Figure 5In some embodiments, the silicon wafer conveying device 100 further includes a second processing conveyor line 800, which extends to the second unloading station 400 and external processing equipment, respectively. The controller is also configured to: control the second processing conveyor line 800 to transfer unprocessed silicon wafers from the second unloading station 400 to the processing equipment, and / or control the second processing conveyor line 800 to transfer processed silicon wafers from the processing equipment to the second unloading station 400. The controller is also configured to: while the controller controls the second processing conveyor line 800 to transfer unprocessed silicon wafers from the second unloading station 400 to the processing equipment, and while the controller controls the second processing conveyor line 800 to transfer processed silicon wafers from the processing equipment to the second unloading station 400, the controller also controls the first transport mechanism 500 to transfer processed silicon wafers at the first unloading station 300 to the vacant loading station 200, so that the vacant loading station 200 is switched to a placement state; and the controller also controls the second transport mechanism 600 to transfer unprocessed silicon wafers at the placement loading station 200 to the first unloading station 300, so that the placement loading station 200 is switched to an vacant state. It is conceivable that the coordination of the first wafer unloading station 300, the second wafer unloading station 400, and the second processing conveyor line 800 can achieve the following: after unprocessed silicon wafers are placed on the vacant second wafer unloading station 400, the second processing conveyor line 800 transports the unprocessed silicon wafers from the second wafer unloading station 400 to the processing equipment for processing, and the second processing conveyor line 800 transfers processed silicon wafers from the processing equipment to the second wafer unloading station 400. The controller also controls the first transport mechanism 500 to transfer the processed silicon wafers from the first wafer unloading station 300 to the vacant wafer loading station 200, and the controller also controls the second transport mechanism 600 to transfer the unprocessed silicon wafers from the placed wafer loading station 200 to the first wafer unloading station 300. Thus, during the transport of unprocessed and processed silicon wafers on the second processing conveyor line 800, processed silicon wafers on the first unloading station 300 are transferred, and unprocessed silicon wafers on the loading station 200 are transferred. Specifically, the various mechanisms in the silicon wafer conveying device 100 can operate continuously, which can further enable the silicon wafer conveying device 100 to have a high conveying efficiency.

[0062] Furthermore, in some embodiments, the controller is also configured to: when the controller controls the second processing conveyor line 800 to transfer unprocessed silicon wafers from the second unloading station 400 to the processing equipment, the controller also simultaneously controls the first transport mechanism 500 to transfer processed silicon wafers from the first unloading station 300 to the vacant loading station 200; and the controller also simultaneously controls the second transport mechanism 600 to transfer unprocessed silicon wafers from the placed loading station 200 to the first unloading station 300. Specifically, when the second processing conveyor line 800 starts working, the second transport mechanism 600 and the first transport mechanism 500 also start working; the simultaneous operation of these three mechanisms can improve work efficiency.

[0063] Furthermore, during the transport of unprocessed silicon wafers by the first processing conveyor line 700, the material conveyor line 900 can also transport either unprocessed or processed silicon wafers. Specifically, the silicon wafer transport device 100 further includes a material conveyor line 900 extending to the wafer loading station 200, and the controller is further configured to: control the material conveyor line 900 to transfer unprocessed silicon wafers to the wafer loading station 200, and / or control the material conveyor line 900 to transfer processed silicon wafers out of the wafer loading station 200. The controller is also configured to: during the period when the controller controls the first processing conveyor line 700 to transfer unprocessed silicon wafers from the first unloading station 300 to the processing equipment, and during the period when the controller controls the first processing conveyor line 700 to transfer processed silicon wafers from the processing equipment to the first unloading station 300, the controller also controls the material conveyor line 900 to transfer processed silicon wafers from the loading station 200 which is in a placement state, so that the loading station 200 in a placement state is switched to an vacant state; and the controller also controls the material conveyor line 900 to transfer unprocessed silicon wafers to the vacant loading station 200, so that the vacant loading station 200 is switched to a placement state. Specifically, during the period when the first processing conveyor line 700 is conveying unprocessed silicon wafers and processed silicon wafers, the operation of the material conveyor line 900 during this period can make full use of the time, so that the silicon wafer conveying device 100 can operate continuously and has high conveying efficiency.

[0064] Furthermore, to improve conveying efficiency, several mechanisms can operate simultaneously. Specifically, in some embodiments, the controller is also configured to: when the controller controls the first processing conveyor line 700 to transfer unprocessed silicon wafers from the first unloading station 300 to the processing equipment, the controller also simultaneously controls the material conveyor line 900 to transfer processed silicon wafers from the loading station 200, and the controller also simultaneously controls the material conveyor line 900 to transfer unprocessed silicon wafers to the loading station 200. The simultaneous operation of the first processing conveyor line 700 and the material conveyor line 900 can improve the efficiency of the silicon wafer conveying device 100.

[0065] Further, please refer to Figure 4 In some embodiments, along a first direction, multiple wafer loading stations 200 and second wafer unloading stations 400 are respectively arranged on both sides of the first wafer unloading station 300, and multiple wafer loading stations 200 and first wafer unloading stations 300 are respectively arranged on both sides of the second wafer unloading station 400. The first direction is a direction perpendicular to the conveying direction of the first processing conveyor line 700. Specifically, the first direction can be the length direction of the gantry bridge, with the wafer loading stations 200, the first wafer unloading stations 300, and the second wafer unloading stations 400 located below the gantry bridge. A robotic arm can be installed on the gantry bridge to handle unprocessed or processed silicon wafers.

[0066] Furthermore, along the first direction, multiple wafer loading stations 200, a first wafer unloading station 300, a second wafer unloading station 400, and multiple wafer loading stations 200 are arranged sequentially. This arrangement facilitates the layout of the first transport mechanism 500 and the second transport mechanism 600. Specifically, in some embodiments, the controller is further configured to: control the first transport mechanism 500 to transfer unprocessed or processed silicon wafers between the first wafer unloading station 300 and the wafer loading station 200 located next to the first wafer unloading station 300; and control the second transport mechanism 600 to transfer unprocessed or processed silicon wafers between the second wafer unloading station 400 and the wafer loading station 200 located next to the second wafer unloading station 400. In this design, the midline between the first unloading station 300 and the second unloading station 400 serves as the dividing line. The first transport mechanism 500 can operate to the left of the dividing line, and the second transport mechanism 600 can operate to the right of the dividing line. This arrangement avoids mutual interference between the first transport mechanism 500 and the second transport mechanism 600 in their travel distances and also allows for synchronous operation of the two mechanisms. For example, the first transport mechanism 500 and the second transport mechanism 600 can synchronously lift, lower, and pick up silicon wafers.

[0067] The following example illustrates how the silicon wafer conveying device 100 conveys processed and unprocessed silicon wafers. Please refer to... Figures 4 to 7 Before the silicon wafer conveying device 100 is started, there are four wafer loading stations 200. Three wafer loading stations 200 are in the placement state, and one wafer loading station 200 is in the vacant state. For easy identification, they can be named as follows: First wafer loading station 210 (vacant state), Second wafer loading station 220 (placed state, with unprocessed silicon wafers), Third wafer loading station 230 (placed state, with unprocessed silicon wafers), and Fourth wafer loading station 240 (placed state, with unprocessed silicon wafers). Processed silicon wafers are placed on both the First wafer unloading station 300 and the Second wafer unloading station 400.

[0068] Please refer to Figure 4In the first stage, the first transport mechanism 500 transfers the processed silicon wafers from the first unloading station 300 to the first loading station 210, and the second transport mechanism 600 transfers the unprocessed silicon wafers from the third loading station 230 to the first unloading station 300. It should be noted that this process can be carried out simultaneously.

[0069] Then, in the second step, please refer to... Figure 5 The second transport mechanism 600 transfers the processed silicon wafers from the second unloading station 400 to the third loading station 230. Then, the first transport mechanism 500 transfers the unprocessed silicon wafers from the second loading station 220 to the second unloading station 400. During this process, the material conveyor line 900 transports the processed silicon wafers from the first loading station 210 to other processes and transfers the unprocessed silicon wafers to the first loading station 210, ensuring that the first loading station 210 has unprocessed silicon wafers. Simultaneously, the first processing conveyor line 700 transports the unprocessed silicon wafers from the first unloading station 300 to the processing equipment and transfers the processed silicon wafers from the processing equipment to the first unloading station 300. It should be noted that this process can be performed simultaneously.

[0070] Then, in the third step, please refer to... Figure 6 The first transport mechanism 500 transfers the processed silicon wafers from the first unloading station 300 to the second loading station 220, while the second transport mechanism 600 transfers the unprocessed silicon wafers from the fourth loading station 240 to the first unloading station 300. During this process, the second processing conveyor line 800 transports the unprocessed silicon wafers from the second unloading station 400 to the processing equipment and transfers the processed silicon wafers from the processing equipment to the second unloading station 400. The material conveyor line 900 removes the processed silicon wafers from the third loading station 230 and transfers the unprocessed silicon wafers to the third loading station 230, resulting in unprocessed silicon wafers at the third loading station 230. It should be noted that this process can be performed simultaneously.

[0071] Then, in the fourth step, please refer to... Figure 7 The second transport mechanism 600 transfers the processed silicon wafers from the second unloading station 400 to the fourth loading station 240, while the first transport mechanism 500 transfers the unprocessed silicon wafers from the first loading station 210 to the second unloading station 400. During this process, the first processing conveyor line 700 transports the unprocessed silicon wafers from the first unloading station 300 to the processing equipment and transfers the processed silicon wafers from the processing equipment to the first unloading station 300. The material conveyor line 900 removes the processed silicon wafers from the second loading station 220 and transfers the unprocessed silicon wafers to the second loading station 220, resulting in the second loading station 220 containing unprocessed silicon wafers. It should be noted that this process can be performed simultaneously.

[0072] In the fourth stage, the silicon wafers at the first wafer loading station 210, the second wafer loading station 220, the third wafer loading station 230, the fourth wafer loading station 240, the first wafer unloading station 300, and the second wafer unloading station 400 are as follows: the first wafer loading station 210 is empty, the second wafer loading station 220 is in a placement state with unprocessed silicon wafers, the third wafer loading station 230 is in a placement state with unprocessed silicon wafers, the fourth wafer loading station 240 is in a placement state with unprocessed silicon wafers, and the first wafer unloading station 300 and the second wafer unloading station 400 both have processed silicon wafers. Therefore, it can be concluded that after the fourth stage, the silicon wafer transport device 100 remains in the same state as initially. Thus, in subsequent silicon wafer transport, only the first to fourth stages need to be repeated.

[0073] Further, please refer to Figure 1 and Figure 2 In some embodiments, the first conveying mechanism 500 includes a first driving member 510, a second driving member (not shown in the figure), and two suction members 520. Both suction members 520 are connected to the first driving member 510, which can drive the two suction members 520 to move up and down. The suction members 520 can clamp a silicon wafer and then suck it up by suction. The second driving member is connected to the first driving member 510, allowing the two suction members 520 to move closer or further apart. That is, through the first driving member 510 and the second driving member, the suction members 520 can suck up the silicon wafer and move it horizontally and vertically. It should be noted that the specific structure of the second conveying mechanism 600 can be consistent with the structure of the first conveying mechanism 500.

[0074] Further, please refer to Figure 1 and Figure 3 In some embodiments, the silicon wafer conveying device 100 further includes a top tooth assembly 1000, which is disposed below the first unloading station 300 and the loading station 200. The first unloading station 300, the second unloading station 400, and the loading station 200 are all provided with placement grooves for placing silicon wafers. The top tooth assembly 1000 is used to abut against the silicon wafer, causing at least a portion of the silicon wafer to protrude beyond the placement groove. Specifically, the top tooth assembly 1000 can hold the silicon wafer, thereby pushing the silicon wafer out of the placement groove. This facilitates the first conveying mechanism 500 or the second conveying mechanism 600 to pick up the silicon wafer and then transfer it. The abutment assembly includes an abutment member 1100 and a third driving member 1200. The third driving member 1200 is connected to the abutment member 1100, thereby driving the abutment member 1100 to move up and down.

[0075] Further, please refer to Figure 1In some embodiments, the silicon wafer conveying device 100 further includes a wafer-leveling assembly 2000, which is disposed above the first unloading station 300 and the loading station 200. The wafer-leveling assembly 2000 is used to level the silicon wafer. Specifically, after the top tooth assembly 1000 pushes a portion of the silicon wafer out of the placement slot, the silicon wafer may be tilted. In this case, the wafer-leveling assembly 2000 can level the silicon wafer. Further, the wafer-leveling assembly 2000 includes a wafer-leveling plate and a fourth driving member. The fourth driving member can drive the wafer-leveling plate to rise and fall, so that the wafer-leveling plate abuts against the top of the silicon wafer, thereby leveling the silicon wafer.

[0076] In addition to the silicon wafer transport device 100 described above, this application also proposes a silicon wafer transport method. Please refer to... Figure 8 In some embodiments, the silicon wafer delivery method includes the following steps:

[0077] S100. Prepare a first wafer unloading station 300 and multiple wafer loading stations 200. The first wafer unloading station 300 has a placement state with processed or unprocessed silicon wafers placed, and an empty state with no processed or unprocessed silicon wafers placed. When any one of the wafer loading stations 200 is in an empty state, the other wafer loading stations 200 are in a placement state.

[0078] S200: Transfer the processed silicon wafers at the first unloading station 300 to the vacant loading station 200, so that the vacant loading station 200 is switched to a placement state; and transfer the unprocessed silicon wafers at the placement loading station 200 to the first unloading station 300, so that the placement loading station 200 is switched to a vacant state.

[0079] Specifically, after preparing multiple wafer loading stations 200 and a first wafer unloading station 300, the processed silicon wafers at the first wafer unloading station 300 are transferred to the vacant wafer loading station 200, while the unprocessed silicon wafers are simultaneously transferred to the first wafer unloading station 300. In existing technologies, when transferring silicon wafers, processed silicon wafers must be transferred first, followed by unprocessed silicon wafers, resulting in low wafer transport efficiency. The silicon wafer transport method of this application, however, can simultaneously transfer processed and unprocessed silicon wafers. Therefore, the silicon wafer transport method has higher transport efficiency.

[0080] Furthermore, to improve conveying efficiency, when transferring the processed silicon wafers from the first unloading station 300 to the vacant loading station 200, the unprocessed silicon wafers in the placement state at the loading station 200 can be simultaneously transferred to the first unloading station 300. Therefore, in some embodiments, when transferring the processed silicon wafers from the first unloading station 300 to the vacant loading station 200, the unprocessed silicon wafers in the placement state at the loading station 200 can be simultaneously transferred to the first unloading station 300.

[0081] Furthermore, after the first conveying mechanism 500 transfers the processed silicon wafer from the first unloading station 300 where it is in a placed state, the unprocessed silicon wafer, which is still at the first unloading station 300, can be transferred to the processing station, thereby allowing the unprocessed silicon wafer to be processed. Therefore, in some embodiments, the silicon wafer conveying method further includes the step of transferring the unprocessed silicon wafer at the first unloading station 300 to the processing equipment.

[0082] Furthermore, the cooperation between the first unloading station 300 and the loading station 200 allows for the transfer of unprocessed and processed silicon wafers. To further improve transport efficiency, a second unloading station 400 can be set up, and during the transfer of unprocessed silicon wafers from the first unloading station 300 to the processing equipment, processed silicon wafers on the second unloading station 400 can be transported. Specifically, in some embodiments, the silicon wafer transport method further includes the following steps: preparing a second unloading station 400, where processed silicon wafers are located. During the process of transferring unprocessed silicon wafers from the first unloading station 300 to the processing equipment, and transferring processed silicon wafers from the processing equipment to the first unloading station 300, processed silicon wafers from the second unloading station 400 are transferred to the vacant loading station 200, thus switching the vacant loading station 200 to a placement state. Conversely, unprocessed silicon wafers from the placement loading station 200 are transferred to the second unloading station 400, thus switching the placement loading station 200 to an vacant state. In this way, the silicon wafer transport method can transport silicon wafers uninterruptedly, which can greatly improve production efficiency.

[0083] In the above embodiments, the conveying efficiency can be further improved. Specifically, when transferring the unprocessed silicon wafers at the first unloading station 300 to the processing equipment, the processed silicon wafers at the second unloading station 400 are simultaneously transferred to the vacant loading station 200, so that the vacant loading station 200 is switched to a placement state, and the unprocessed silicon wafers at the placement loading station 200 are transferred to the second unloading station 400, so that the placement loading station 200 is switched to an vacant state. The unprocessed silicon wafers at the first unloading station 300 can be transferred to the processing equipment via the first processing conveyor line 700, and the processed silicon wafers can be transferred to the vacant loading station 200 and the unprocessed silicon wafers at the placement loading station 200 can be transferred to the second unloading station 400 via the first transport mechanism 500 and the second transport mechanism 600. Therefore, in this embodiment, the first processing conveyor line 700, the first handling mechanism 500, and the second handling mechanism 600 can be operated simultaneously, which can make full use of the machine's functions and thereby improve production efficiency.

[0084] Furthermore, in some embodiments, the silicon wafer transport method further includes the following steps: transferring processed silicon wafers at the second unloading station 400 to an vacant loading station 200 to switch the vacant loading station 200 to a placement state, and transferring unprocessed silicon wafers at the placement loading station 200 to the second unloading station 400 to switch the placement loading station 200 to an vacant state, while transferring processed silicon wafers at the placement loading station 200 out of the loading station 200 to switch the placement loading station 200 to an vacant state, and transferring unprocessed silicon wafers to an vacant loading station 200 to switch the vacant loading station 200 to a placement state. Specifically, by utilizing the time frame during the process of transferring processed silicon wafers from the second unloading station 400 to the vacant loading station 200 to switch the vacant loading station 200 to a placement state, and transferring unprocessed silicon wafers from the placement loading station 200 to the second unloading station 400 to switch the placement loading station 200 to an vacant state, unprocessed silicon wafers can be continuously placed at the loading station 200. This ensures that unprocessed silicon wafers can be transferred to the first unloading station 300 or the second unloading station 400 at any time, awaiting transfer for processing. Thus, the silicon wafer transport method enables the cyclical flow of unprocessed and processed silicon wafers, allowing the processing equipment to operate continuously and achieving high production efficiency.

[0085] The following example illustrates the method of conveying processed and unprocessed silicon wafers. Please refer to... Figures 4 to 7For ease of understanding, the silicon wafer transport method can utilize a first transport mechanism 500, a second transport mechanism 600, a first processing conveyor line 700, a second processing conveyor line 800, and a material conveyor line 900 to transfer silicon wafers. Before the silicon wafer transport method begins, there are four wafer loading stations 200: three are in a placement state, and one is in an idle state. For easy identification, these can be named as follows: First wafer loading station 210 (idle state), Second wafer loading station 220 (placed state, with unprocessed silicon wafers), Third wafer loading station 230 (placed state, with unprocessed silicon wafers), and Fourth wafer loading station 240 (placed state, with unprocessed silicon wafers). Processed silicon wafers are placed on both the first unloading station 300 and the second unloading station 400.

[0086] Please refer to Figure 4 In the first stage, the first transport mechanism 500 transfers the processed silicon wafers from the first unloading station 300 to the first loading station 210, and the second transport mechanism 600 transfers the unprocessed silicon wafers from the third loading station 230 to the first unloading station 300. It should be noted that this process can be carried out simultaneously.

[0087] Then, in the second step, please refer to... Figure 5 The second transport mechanism 600 transfers the processed silicon wafers from the second unloading station 400 to the third loading station 230. Then, the first transport mechanism 500 transfers the unprocessed silicon wafers from the second loading station 220 to the second unloading station 400. During this process, the material conveyor line 900 transports the processed silicon wafers from the first loading station 210 to other processes and transfers the unprocessed silicon wafers to the first loading station 210, ensuring that the first loading station 210 has unprocessed silicon wafers. Simultaneously, the first processing conveyor line 700 transports the unprocessed silicon wafers from the first unloading station 300 to the processing equipment and transfers the processed silicon wafers from the processing equipment to the first unloading station 300. It should be noted that this process can be performed simultaneously.

[0088] Then, in the third step, please refer to... Figure 6The first transport mechanism 500 transfers the processed silicon wafers from the first unloading station 300 to the second loading station 220, while the second transport mechanism 600 transfers the unprocessed silicon wafers from the fourth loading station 240 to the first unloading station 300. During this process, the second processing conveyor line 800 transports the unprocessed silicon wafers from the second unloading station 400 to the processing equipment and transfers the processed silicon wafers from the processing equipment to the second unloading station 400. The material conveyor line 900 removes the processed silicon wafers from the third loading station 230 and transfers the unprocessed silicon wafers to the third loading station 230, resulting in unprocessed silicon wafers at the third loading station 230. It should be noted that this process can be performed simultaneously.

[0089] Then, in the fourth step, please refer to... Figure 7 The second transport mechanism 600 transfers the processed silicon wafers from the second unloading station 400 to the fourth loading station 240, while the first transport mechanism 500 transfers the unprocessed silicon wafers from the first loading station 210 to the second unloading station 400. During this process, the first processing conveyor line 700 transports the unprocessed silicon wafers from the first unloading station 300 to the processing equipment and transfers the processed silicon wafers from the processing equipment to the first unloading station 300. The material conveyor line 900 removes the processed silicon wafers from the second loading station 220 and transfers the unprocessed silicon wafers to the second loading station 220, resulting in the second loading station 220 containing unprocessed silicon wafers. It should be noted that this process can be performed simultaneously.

[0090] In the fourth stage, the silicon wafers at the first wafer loading station 210, the second wafer loading station 220, the third wafer loading station 230, the fourth wafer loading station 240, the first wafer unloading station 300, and the second wafer unloading station 400 are as follows: the first wafer loading station 210 is empty, the second wafer loading station 220 is in a placement state with unprocessed silicon wafers, the third wafer loading station 230 is in a placement state with unprocessed silicon wafers, the fourth wafer loading station 240 is in a placement state with unprocessed silicon wafers, and the first wafer unloading station 300 and the second wafer unloading station 400 both have processed silicon wafers. Therefore, it can be concluded that after the fourth stage, the silicon wafer transport device 100 remains in the same state as initially. Thus, in subsequent silicon wafer transport, only the first to fourth stages need to be repeated.

[0091] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A silicon wafer conveying device, characterized in that, include: Multiple wafer loading stations are used to place unprocessed silicon wafers or processed silicon wafers. Each wafer loading station has a placement state in which the unprocessed silicon wafer or the processed silicon wafer is placed, and an empty state in which the unprocessed silicon wafer or the processed silicon wafer is not placed. When any one of the wafer loading stations is in the empty state, the other wafer loading stations are in the placement state. The first wafer unloading station is used to place processed silicon wafers or unprocessed silicon wafers. A first conveying mechanism is used to transfer the unprocessed silicon wafer or the processed silicon wafer between the wafer loading station and the first wafer unloading station; The second conveying mechanism is used to transfer the unprocessed silicon wafer or the processed silicon wafer between the wafer loading station and the first wafer unloading station; A controller, communicatively connected to the first transport mechanism and the second transport mechanism, is configured to: control the first transport mechanism to transfer the processed silicon wafer at the first unloading station to the vacant loading station, so that the vacant loading station is switched to the placement state; and control the second transport mechanism to transfer the unprocessed silicon wafer at the placement loading station to the first unloading station, so that the placement loading station is switched to the vacant state. The silicon wafer conveying device further includes a first processing conveyor line, which extends to the first unloading station and external processing equipment respectively. The controller is further configured to: control the first processing conveyor line to transfer the unprocessed silicon wafer from the first unloading station to the processing equipment, and / or control the first processing conveyor line to transfer the processed silicon wafer from the processing equipment to the first unloading station. The silicon wafer conveying device further includes a material conveying line extending to the wafer loading station, and the controller is further configured to: control the material conveying line to transfer the unprocessed silicon wafer to the wafer loading station, and / or control the material conveying line to transfer the processed silicon wafer out of the wafer loading station; The controller is further configured to: when the processed silicon wafer is placed on the wafer loading station in the placement state, the controller further controls the material conveyor line to transfer the processed silicon wafer out of the wafer loading station, so that the wafer loading station in the placement state is switched to the vacant state; and the controller further controls the material conveyor line to transfer the unprocessed silicon wafer to the wafer loading station in the vacant state.

2. The silicon wafer conveying device according to claim 1, characterized in that, The controller is further configured to: when the unprocessed silicon wafer is placed at the first unloading station, the controller controls the first processing conveyor line to transfer the unprocessed silicon wafer to the processing equipment; and / or, when the processed silicon wafer is present at the processing equipment, the controller controls the first processing conveyor line to transfer the processed silicon wafer from the processing equipment to the first unloading station.

3. The silicon wafer conveying device according to claim 1, characterized in that, The silicon wafer conveying device further includes a second unloading station, which is used to place the processed silicon wafer or the unprocessed silicon wafer; the silicon wafer conveying device further includes a first processing conveyor line, which extends to the first unloading station and external processing equipment respectively; the controller is further configured to: control the first processing conveyor line to transfer the unprocessed silicon wafer from the first unloading station to the processing equipment, and / or control the first processing conveyor line to transfer the processed silicon wafer from the processing equipment to the first unloading station; The controller is further configured to: during the period when the controller controls the first processing conveyor line to transfer the unprocessed silicon wafer from the first unloading station to the processing equipment, and the controller controls the first processing conveyor line to transfer the processed silicon wafer from the processing equipment to the first unloading station, the controller further controls the second transport mechanism to transfer the processed silicon wafer at the second unloading station to the vacant wafer loading station, so that the vacant wafer loading station is switched to the placement state; and the controller further controls the first transport mechanism to transfer the unprocessed silicon wafer at the placement wafer loading station to the second unloading station, so that the placement wafer loading station is switched to the vacant state.

4. The silicon wafer conveying device according to claim 3, characterized in that, The controller is further configured to: when the controller controls the first processing conveyor line to transfer the unprocessed silicon wafer from the first unloading station to the processing equipment, the controller also simultaneously controls the second transport mechanism to transfer the processed silicon wafer at the second unloading station to the vacant wafer loading station; and the controller also simultaneously controls the first transport mechanism to transfer the unprocessed silicon wafer at the placed wafer loading station to the second unloading station.

5. The silicon wafer conveying device according to claim 3, characterized in that, The silicon wafer conveying device further includes a material conveying line extending to the wafer loading station, and the controller is further configured to: control the material conveying line to transfer the unprocessed silicon wafer to the wafer loading station, and / or control the material conveying line to transfer the processed silicon wafer out of the wafer loading station; The controller is further configured to: during the period when the controller controls the first processing conveyor line to transfer the unprocessed silicon wafer from the first unloading station to the processing equipment, and the controller controls the first processing conveyor line to transfer the processed silicon wafer from the processing equipment to the first unloading station, the controller further controls the material conveyor line to transfer the processed silicon wafer in the placement state from the wafer loading station to the loading station, so that the loading station in the placement state is switched to the vacant state; and the controller further controls the material conveyor line to transfer the unprocessed silicon wafer to the loading station in the vacant state, so that the loading station in the vacant state is switched to the placement state.

6. The silicon wafer conveying device according to claim 5, characterized in that, The controller is further configured to: when the controller controls the first processing conveyor line to transfer the unprocessed silicon wafer from the first unloading station to the processing equipment, the controller also simultaneously controls the material conveyor line to transfer the processed silicon wafer in the placement state at the wafer loading station out of the wafer loading station, and the controller also simultaneously controls the material conveyor line to transfer the unprocessed silicon wafer to the wafer loading station.

7. The silicon wafer conveying device according to claim 3, characterized in that, Along the first direction, multiple loading stations and the second unloading station are respectively arranged on both sides of the first unloading station, and multiple loading stations and the first unloading station are respectively arranged on both sides of the second unloading station. The first direction is a direction perpendicular to the conveying direction of the first processing conveyor line.

8. The silicon wafer conveying device according to claim 7, characterized in that, The controller is further configured to: control the first transport mechanism to transfer the unprocessed silicon wafer or the processed silicon wafer between the first unloading station and the loading station located next to the first unloading station; and control the second transport mechanism to transfer the unprocessed silicon wafer or the processed silicon wafer between the second unloading station and the loading station located next to the second unloading station.

9. The silicon wafer conveying device according to claim 1, characterized in that, The controller is further configured to: control the first transport mechanism to transfer the processed silicon wafer at the first unloading station to the vacant wafer loading station, so that the vacant wafer loading station is switched to the placement state; and simultaneously control the second transport mechanism to transfer the unprocessed silicon wafer at the placement wafer loading station to the first unloading station, so that the placement wafer loading station is switched to the vacant state.

10. The silicon wafer conveying device according to claim 1, characterized in that, The silicon wafer conveying device further includes a top tooth assembly, which is disposed below the first unloading station and the loading station. Both the first unloading station and the loading station are provided with a placement groove for placing the silicon wafer. The top tooth assembly is used to abut against the silicon wafer so that at least a portion of the silicon wafer protrudes beyond the placement groove.

11. The silicon wafer conveying device according to claim 1, characterized in that, The silicon wafer conveying device further includes a wafer assembly, which is disposed above the first unloading station and the loading station, and is used to level the silicon wafer.

12. A silicon wafer transport method, characterized in that, In the silicon wafer transport apparatus of any one of claims 1 to 11, the silicon wafer transport method comprises the following steps: Prepare a first unloading station and multiple loading stations. The first unloading station has a placement state with processed or unprocessed silicon wafers and an empty state without the processed or unprocessed silicon wafers. When any one of the loading stations is in the empty state, the other loading stations are in the placement state. The processed silicon wafers at the first unloading station are transferred to the vacant loading station, so that the vacant loading station is switched to the placement state; and the unprocessed silicon wafers at the placement loading station are transferred to the first unloading station, so that the placement loading station is switched to the vacant state.

13. The silicon wafer transport method according to claim 12, characterized in that, When the processed silicon wafer at the first unloading station is transferred to the vacant loading station, the unprocessed silicon wafer at the loading station in the placement state is simultaneously transferred to the first unloading station.

14. The silicon wafer transport method according to claim 12, characterized in that, The silicon wafer conveying method further includes the following step: transferring the unprocessed silicon wafer at the first unloading station to the processing equipment.

15. The silicon wafer transport method according to claim 12, characterized in that, The silicon wafer conveying method further includes the following steps: preparing a second unloading station, wherein the processed silicon wafer is located at the second unloading station; During the process of transferring the unprocessed silicon wafer at the first unloading station to the processing equipment and transferring the processed silicon wafer at the processing equipment to the first unloading station, the processed silicon wafer at the second unloading station is transferred to the vacant loading station to switch the vacant loading station to the placement state, and the unprocessed silicon wafer at the placement loading station is transferred to the second unloading station to switch the placement loading station to the vacant state.

16. The silicon wafer transport method according to claim 15, characterized in that, When the unprocessed silicon wafer at the first unloading station is transferred to the processing equipment, the processed silicon wafer at the second unloading station is simultaneously transferred to the vacant loading station, so that the vacant loading station is switched to the placement state, and the unprocessed silicon wafer at the placement loading station is transferred to the second unloading station, so that the placement loading station is switched to the vacant state.

17. The silicon wafer transport method according to claim 15, characterized in that, The silicon wafer transport method further includes the following steps: during the process of transferring the processed silicon wafer at the second unloading station to the vacant wafer loading station to switch the vacant wafer loading station to the placement state, and transferring the unprocessed silicon wafer at the placement wafer loading station to the second unloading station to switch the placement wafer loading station to the vacant state, the processed silicon wafer at the placement wafer loading station is transferred out of the wafer loading station to switch the placement wafer loading station to the vacant state, and the unprocessed silicon wafer is transferred to the vacant wafer loading station to switch the vacant wafer loading station to the placement state.

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