Driving circuit components and backlight modules

Abstract

This application provides a driving circuit assembly and a backlight module. The driving circuit assembly includes a flip-chip film, a chip, and a heat dissipation structure. The heat dissipation structure includes a heat dissipation layer, a heat dissipation cavity, and a conduit. An elastic membrane is disposed within the heat dissipation cavity, dividing it into a first air chamber and a second air chamber. A first end of the conduit communicates with the second air chamber through a through-hole. The second air chamber communicates with the outside air through the conduit. In response to a pressure in the first air chamber being greater than that in the second air chamber, the elastic membrane deforms and compresses the second air chamber, allowing some air inside the second air chamber to be discharged to the outside through the conduit. In response to a pressure in the first air chamber being less than that in the second air chamber, the elastic membrane recovers its deformation and compresses the first air chamber, allowing outside air to enter the conduit through its second end. This driving circuit assembly can improve the heat dissipation rate of the chip surface, thus preventing excessively high chip surface temperatures and potential display abnormalities.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a driving circuit assembly and a backlight module. Background Technology

[0002] A liquid crystal display (LCD) is a non-self-emissive electronic device. It does not emit light itself and relies on a backlight module to emit light to achieve its display performance. Therefore, the brightness of an LCD is determined by its backlight module. It is evident that the performance of the backlight module directly affects the display quality of the LCD panel. A backlight module typically includes a light source, reflector, light guide plate, diffuser, optical film, driving circuitry, and frame.

[0003] In existing backlight module driving circuits, the flip-chip film and the chip are typically bonded together using a direct bonding method. This method results in high chip surface temperatures, leading to image abnormalities and deteriorated optical quality in the backlight module. Summary of the Invention

[0004] The driving circuit assembly and backlight module provided in this application aim to solve the problem of high chip surface temperature in existing backlight modules, which leads to abnormal display images.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a driving circuit assembly, comprising:

[0006] Chip-on-chip film;

[0007] A chip is disposed on the flip-chip film and electrically connected to the flip-chip film;

[0008] A heat dissipation structure is disposed on the chip; the heat dissipation structure includes:

[0009] A heat dissipation layer is disposed on the surface of the chip to conduct heat from the surface of the chip outward;

[0010] A heat dissipation cavity is disposed on the side of the heat dissipation layer opposite to the chip; and a through hole is formed in the side wall of the heat dissipation cavity; an elastic membrane is disposed inside the heat dissipation cavity; the elastic membrane is spaced apart from the heat dissipation layer; and the elastic membrane divides the heat dissipation cavity into a first air chamber and a second air chamber; the first air chamber is located between the second air chamber and the heat dissipation layer;

[0011] The conduit; the first end of the conduit communicates with the second air chamber through the through hole;

[0012] The second end of the conduit is close to the flip-chip film and spaced apart from the flip-chip film;

[0013] The second air chamber is connected to the outside air through the duct;

[0014] Wherein, in response to the air pressure in the first air chamber being greater than the air pressure in the second air chamber, the elastic membrane deforms and compresses the second air chamber, causing a portion of the air inside the second air chamber to be discharged to the outside through the conduit; and / or,

[0015] The elastic membrane also responds to the fact that the air pressure in the first air chamber is less than the air pressure in the second air chamber, the elastic membrane restores its deformation and squeezes the first air chamber so that outside air enters the conduit through the second end of the conduit.

[0016] In one specific embodiment, the first chamber is filled with a first gas; and the coefficient of thermal expansion of the first gas is greater than that of air.

[0017] In one specific embodiment, the first gas is carbon dioxide gas.

[0018] In one specific embodiment, the heat dissipation structure further includes:

[0019] A water-absorbing layer is disposed on the side of the second air chamber away from the elastic membrane, and is used to absorb water vapor in the heat dissipation cavity.

[0020] In one specific embodiment, the heat dissipation structure further includes:

[0021] A waterproof layer is disposed on the side surface of the absorbent layer facing the heat dissipation cavity; the waterproof layer is used to prevent water molecules from entering the heat dissipation cavity from the absorbent layer; and the waterproof layer has a first surface facing the heat dissipation cavity and a second surface facing the absorbent layer;

[0022] The waterproof layer is configured to allow water molecules to pass from the first surface through the waterproof layer to the second surface, and to prevent water molecules from passing from the second surface through the waterproof layer to the first surface.

[0023] In one specific embodiment, the catheter further includes:

[0024] A water storage tank is provided on the inner wall of the conduit to prevent liquid from flowing back into the conduit;

[0025] The inner wall of the conduit forms the outer wall of the water storage tank, and the inner wall of the water storage tank extends at least partially toward the first end.

[0026] In one specific embodiment, the heat dissipation structure further includes:

[0027] A heating element is disposed on the conduit;

[0028] Control unit; the control unit is electrically connected to the chip and is used to acquire the operating status of the chip; the control unit is also electrically connected to the heating element and is used to control whether the heating element is working according to the operating status of the chip;

[0029] The control unit controls the heating element to heat the conduit after the chip stops working; the control unit also controls the heating element to stop heating immediately after the chip stops working.

[0030] In one specific embodiment, the heat dissipation layer completely covers the surface of the chip;

[0031] The heat dissipation layer is copper foil.

[0032] In one specific embodiment, it further includes:

[0033] The printed circuit board is electrically connected to the flip-chip film; and the chip is electrically connected to the printed circuit board through the flip-chip film.

[0034] To solve the above-mentioned technical problems, another technical solution adopted in this application is: to provide a backlight module, comprising:

[0035] Back panel;

[0036] The driving circuit assembly is as described in any of the above claims; the printed circuit board of the driving circuit assembly is disposed on one side of the back plate.

[0037] An optical film is disposed on the side of the backplate away from the printed circuit board and overlaps with the end of the flip-chip film away from the printed circuit board.

[0038] The beneficial effects of the embodiments of this application are as follows: Unlike the prior art, this application provides a driving circuit assembly and a backlight module; the driving circuit assembly includes a flip-chip film, a chip, and a heat dissipation structure. The chip is disposed on the flip-chip film and electrically connected to it; the heat dissipation structure is disposed on the chip. The heat dissipation structure includes a heat dissipation layer, a heat dissipation cavity, and a conduit. The heat dissipation layer is disposed on the surface of the chip to conduct heat from the chip surface outwards. The heat dissipation cavity is disposed on the side of the heat dissipation layer away from the chip, and a through-hole is formed in the sidewall of the heat dissipation cavity. An elastic membrane is disposed within the heat dissipation cavity, spaced apart from the heat dissipation layer, and the elastic membrane divides the heat dissipation cavity into a first air chamber and a second air chamber. The first air chamber is located between the second air chamber and the heat dissipation layer. The first end of the conduit communicates with the second air chamber through the through-hole. The second end of the conduit is close to and spaced apart from the flip-chip film. The second air chamber communicates with the outside air through the conduit. In response to the air pressure in the first air chamber being greater than that in the second air chamber, the elastic membrane deforms and compresses the second air chamber, allowing some air inside the second air chamber to be discharged to the outside through the conduit. And / or, in response to the air pressure in the first air chamber being less than that in the second air chamber, the elastic membrane recovers its deformation and compresses the first air chamber, allowing outside air to enter the conduit through the second end of the conduit. By setting a heat dissipation layer on the chip surface, the heat dissipation rate of the chip surface is improved, and the heat on the chip surface is conducted to the gas in the heat dissipation cavity. By setting an elastic membrane in the heat dissipation cavity, the heat dissipation cavity is divided into a closed first air chamber and a second air chamber that is open to the outside air. By utilizing the thermal expansion and contraction effect of the gas in the first air chamber, when the chip surface temperature rises, the elastic membrane deforms and squeezes the second air chamber, expelling the hotter air from the heat dissipation cavity. When the chip surface temperature drops, the elastic membrane returns to its original deformation and squeezes the first air chamber, drawing the cooler outside air into the heat dissipation cavity, thereby accelerating the heat dissipation rate and further reducing the chip surface temperature. In this way, the chip surface temperature is prevented from becoming too high, which could cause abnormal display. Attached Figure Description

[0039] Figure 1 This is a schematic diagram of the structure of a drive circuit assembly provided in an embodiment of this application;

[0040] Figure 2 A schematic diagram of a drive circuit assembly provided in an embodiment of this application;

[0041] Figure 3 This is a schematic diagram of the structure of a backlight module provided in an embodiment of this application.

[0042] Explanation of icon numbers:

[0043] 100-Drive circuit assembly; 200-Backplate; 300-Optical film; 400-Diffuser plate; 500-Light emission diode; 600-Reflective sheet; 1-Crystal-coated film; 2-Chip; 3-Heat dissipation structure; 4-Printed circuit board; 31-Heat dissipation layer; 32-Heat dissipation cavity; 33-Conduit; 34-Water-absorbing layer; 35-Waterproof layer; 36-Heating element; 37-Control unit; 321-Elastic membrane; 322-First gas chamber; 323-Second gas chamber; 331-Water storage tank; 3221-First gas. Detailed Implementation

[0044] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0045] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0046] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0047] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0048] See Figures 1-3 , Figure 1 This is a schematic diagram of the structure of a drive circuit assembly provided in an embodiment of this application; Figure 2 A schematic diagram of a drive circuit assembly provided in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of a backlight module provided in an embodiment of this application. This application provides a driving circuit assembly 100 for controlling the backlight module to emit light and controlling its brightness; the driving circuit assembly 100 may include a flip-chip film 1, a chip 2, and a heat dissipation structure 3.

[0049] In this design, chip 2 is disposed on and electrically connected to the flip-chip film 1; the flip-chip film 1 is used to encapsulate chip 2 and connect the pixel array and chip 2 to achieve precise control of each pixel, thereby displaying an image. Specifically, the flip-chip film 1 can be a flexible substrate, and chip 2 can be directly mounted onto the flip-chip film 1 and electrically connected through gold bumps, solder balls, or other micro-connection technologies.

[0050] The heat dissipation structure 3 is disposed on the chip 2 to improve the heat dissipation rate of the chip 2 surface, so as to avoid the chip 2 surface temperature from becoming too high and causing abnormal display. Specifically, the heat dissipation structure 3 may also include a heat dissipation layer 31, a heat dissipation cavity 32, and a heat pipe 33.

[0051] The heat dissipation layer 31 is disposed on the surface of the chip 2 and is used to conduct heat from the surface of the chip 2 outward. Specifically, the heat dissipation layer 31 can be made of materials with good thermal conductivity, such as thermally conductive silicone, thermally conductive ceramic or metal foil.

[0052] A heat dissipation cavity 32 is disposed on the side of the heat dissipation layer 31 away from the chip 2, and a through hole is provided on the side wall of the heat dissipation cavity 32, through which the heat dissipation cavity 32 communicates with the outside air; specifically, the heat dissipation layer 31 can also serve as the bottom wall of the heat dissipation cavity 32. An elastic membrane 321 is disposed inside the heat dissipation cavity 32, and the elastic membrane 321 is disposed at a distance from the heat dissipation layer 31, dividing the heat dissipation cavity 32 into a first air chamber 322 and a second air chamber 323. Specifically, the elastic membrane 321 can be disposed parallel to the heat dissipation layer 31, and together with the heat dissipation layer 31 and the part of the side wall of the heat dissipation cavity 32 near the heat dissipation layer 31, it forms the first air chamber 322; the first air chamber 322 is located between the second air chamber 323 and the heat dissipation layer 31, and the first air chamber 322 is a closed space. The heat dissipation layer 31 can conduct heat from the surface of the chip 2 to the first air chamber 322, thereby increasing the temperature of the gas in the first air chamber 322. The second air chamber 323 is located on the side of the elastic layer away from the heat dissipation layer 31, and the elastic layer, the top wall of the heat dissipation cavity 32, and the part of the side wall of the heat dissipation cavity 32 away from the heat dissipation layer 31 form the second air chamber 323; the through hole can be opened on the part of the side wall of the heat dissipation cavity 32 away from the heat dissipation layer 31, and the second air chamber 323 can be connected to the outside air through the through hole.

[0053] It is understandable that, since the elastic membrane 321 can deform under the action of external force, the volume of the first air chamber 322 and the volume of the second air chamber 323 will change with the deformation of the elastic membrane 321. Specifically, if the volume of the first air chamber 322 increases, the volume of the second air chamber 323 decreases; if the volume of the second air chamber 323 increases, the volume of the first air chamber 322 decreases.

[0054] The conduit 33 has a first end and a second end disposed opposite to each other; wherein, the first end is connected to the second air chamber 323 through a through hole, and the second end of the conduit 33 is close to and spaced apart from the flip-chip film 1; the second air chamber 323 is connected to the outside air through the conduit 33. Specifically, when the volume of the second air chamber 323 decreases, the air in the second air chamber 323 is discharged to the outside through the through hole, the first end and the second end; when the volume of the second air chamber 323 increases, the outside air enters the second air chamber 323 through the second end, the first end and the through hole under the action of atmospheric pressure.

[0055] In this process, the elastic membrane 321 deforms and compresses the second air chamber 323 in response to the air pressure in the first air chamber 322 being greater than the air pressure in the second air chamber 323, so that some of the air in the second air chamber 323 is discharged to the outside through the conduit 33; and / or, the elastic membrane 321 also recovers its deformation and compresses the first air chamber 322 in response to the air pressure in the first air chamber 322 being less than the air pressure in the second air chamber 323, so that outside air enters the conduit 33 through the second end of the conduit 33.

[0056] Specifically, when the drive circuit assembly 100 is operating, if the surface temperature of the chip 2 rises, the heat dissipation layer 31 conducts heat to the first air chamber 322. The temperature and pressure of the gas in the first air chamber 322 increase, thereby compressing the elastic membrane 321 to deform and compress the second air chamber 323, thus reducing the volume of the second air chamber 323. If the surface temperature of the chip 2 decreases, the heat conducted by the heat dissipation layer 31 decreases, the temperature and pressure of the gas in the first air chamber 322 decrease, and the elastic membrane 321 recovers its deformation under the compression of the second air chamber 323, compressing the first air chamber 322 and increasing the volume of the second air chamber 323.

[0057] By setting a heat dissipation layer 31 on the surface of chip 2, the heat dissipation rate of chip 2 is improved, and the heat on the surface of chip 2 is conducted to the gas in the heat dissipation cavity 32. By setting an elastic membrane 321 in the heat dissipation cavity 32, the heat dissipation cavity 32 is divided into a closed first air chamber 322 and a second air chamber 323 that is open to the outside air. By utilizing the thermal expansion and contraction effect of the gas in the first air chamber 322, when the surface temperature of chip 2 rises, the elastic membrane 321 deforms and squeezes the second air chamber 323, expelling the hotter air from the heat dissipation cavity 32. When the surface temperature of chip 2 decreases, the elastic membrane 321 returns to its original deformation and squeezes the first air chamber 322, drawing the cooler outside air into the heat dissipation cavity 32, thereby accelerating the heat dissipation rate and further reducing the surface temperature of chip 2. In this way, the surface temperature of chip 2 is prevented from becoming too high, which could cause abnormal display.

[0058] In a specific embodiment, the gas in the first air chamber 322 can be a first gas 3221, filling the first air chamber 322 completely; wherein, the coefficient of thermal expansion of the first gas 3221 is greater than that of air. It can be understood that if the coefficient of thermal expansion of the first gas 3221 is larger, the thermal expansion and contraction effect of the first gas 3221 will be more pronounced; given a fixed amount of heat conducted from the heat dissipation layer 31 to the first air chamber 322, a greater change in the pressure of the first gas 3221, that is, a greater change in the volume of the first gas 3221, will result in a greater degree of deformation of the elastic membrane 321, thereby causing a greater change in the volume of the second air chamber 323; this increases the amount of air exchanged between the second air chamber 323 and the outside, thereby further improving the heat dissipation rate of the heat dissipation structure 3. Specifically, the first gas 3221 can be carbon dioxide gas.

[0059] Of course, in some embodiments, the gas in the first gas chamber 322 can also be air, thereby reducing production costs.

[0060] like Figure 1 As shown, in a specific embodiment, the heat dissipation layer 31 can be copper foil to enhance the heat dissipation efficiency of the heat dissipation layer 31, thereby increasing the heat dissipation rate of the heat dissipation structure 3.

[0061] Furthermore, the heat dissipation layer 31 can completely cover the surface of the chip 2 to further reduce the surface temperature of the chip 2. At the same time, the heat dissipation layer 31 covering the surface of the chip 2 can also play a sealing role, preventing the chip 2 from coming into contact with the outside air and causing damage to the chip 2.

[0062] Continue reading Figure 1In a specific embodiment, the heat dissipation structure 3 may further include a water-absorbing layer 34; the water-absorbing layer 34 is disposed on the side of the second air chamber 323 away from the elastic membrane 321, and is used to absorb water vapor in the heat dissipation cavity 32. Specifically, the water-absorbing layer 34 can serve as the top wall of the heat dissipation cavity 32, and together with the elastic membrane 321 and the portion of the sidewall of the heat dissipation cavity 32 away from the heat dissipation layer 31, it forms the second air chamber 323. Specifically, the water-absorbing layer 34 may include one or more common desiccants such as silica gel desiccant, activated alumina, and calcium chloride desiccant.

[0063] It is understandable that the outside air contains a certain amount of water vapor, which may enter the connection between chip 2 and the flip-chip film 1, causing circuit corrosion. When the temperature of the chip 2 surface decreases, the gas temperature in the first gas chamber 322 decreases, and the gas pressure in the first gas chamber 322 decreases until the gas pressure in the first gas chamber 322 is less than the gas pressure in the second gas chamber 323. At this point, the elastic membrane 321 restores its deformation and compresses the first gas chamber 322, thereby increasing the volume of the second gas chamber 323. This allows outside air to enter the conduit 33 and the second gas chamber 323 through the second end of the conduit 33, so that the water vapor in the air can be absorbed by the water-absorbing layer 34, thereby reducing the water vapor content in the outside air and thus reducing the risk of circuit corrosion.

[0064] When the temperature of the surface of chip 2 rises, the temperature of the gas in the first air chamber 322 rises, and the air pressure in the first air chamber 322 increases until the air pressure in the first air chamber 322 is greater than the air pressure in the second air chamber 323. This causes the elastic membrane 321 to deform, reducing the volume of the second air chamber 323, thereby discharging the dry air in the second air chamber 323 to the outside through the conduit 33.

[0065] In this way, by repeatedly raising and lowering the temperature on the surface of chip 2, the air in the second air chamber 323 is repeatedly exchanged with the outside air, thereby improving the absorption efficiency of water vapor in the outside air by the water-absorbing layer 34, further reducing the water vapor content, and thus further reducing the risk of circuit corrosion.

[0066] like Figure 1 As shown, in a specific embodiment, the heat dissipation structure 3 may further include a waterproof layer 35. The waterproof layer 35 may be disposed on the surface of the absorbent layer 34 facing the heat dissipation cavity 32, to prevent water molecules from entering the heat dissipation cavity 32 from the absorbent layer 34. The waterproof layer 35 has a first surface facing the heat dissipation cavity 32 and a second surface facing the absorbent layer 34; the waterproof layer 35 is configured to allow water molecules to pass from the first surface through the waterproof layer 35 to the second surface, and to prevent water molecules from passing from the second surface through the waterproof layer 35 to the first surface. In other words, the waterproof layer 35 allows water molecules to enter the absorbent layer 34 only from the second air chamber 323, and prevents them from entering the second air chamber 323 from the absorbent layer 34. Specifically, the waterproof layer 35 may be DuPont paper.

[0067] Specifically, the diameter of the second end of the conduit 33 can be smaller than the diameter of the first end of the conduit 33. It is understood that water vapor in the outside air may condense on the flip-chip film 1 to form liquid, and the liquid may enter the connection between the chip 2 and the flip-chip film 1 and corrode the circuit; by setting the diameter of the second end near the flip-chip film 1 as small as possible, it is easier for the liquid to enter the conduit 33 from the second end.

[0068] Furthermore, in a specific embodiment, the conduit 33 may also include a water storage tank 331. For example... Figure 1 As shown, a water storage tank 331 is disposed on the inner wall of the conduit 33 to prevent liquid from flowing back into the conduit 33. It can be understood that, in addition to the liquid entering the conduit 33 from the second end, water vapor may also condense into liquid on the inner wall of the conduit 33; the liquid flows down the inner wall of the conduit 33 into the water storage tank 331, preventing the liquid from flowing out of the second end.

[0069] Specifically, there are multiple water storage tanks 331, which are staggered sequentially on the inner wall of the conduit 33. Specifically, the inner wall of the conduit 33 forms the outer wall of the water storage tank 331, and the inner wall of the water storage tank 331 extends at least partially toward the first end. In this embodiment, the cross-sectional shape of the water storage tank 331 can be "V" shaped. The inner wall of the water storage tank 331 extends from the inner wall surface of the conduit 33 toward the axis of the conduit 33 while also extending toward the first end. Furthermore, the length of the inner wall of the water storage tank 331 gradually decreases from the first end to the second end to adapt to the diameter of the conduit 33.

[0070] Furthermore, the conduit 33 can be configured as an arc-shaped bend to enhance the interception effect of the water storage tank 331 on the liquid.

[0071] See Figure 2 In a specific embodiment, the heat dissipation structure 3 may further include a heating element 36 and a control unit 37; wherein, the heating element 36 is disposed on the conduit 33 and is used to heat the conduit 33 to evaporate the liquid intercepted in the water storage tank 331 into water vapor, so that it can enter the second air chamber 323 and be absorbed by the water absorption layer 34. In this embodiment, the heating element 36 can be directly integrated on the conduit 33, that is, part or all of the sidewall of the conduit 33 can serve as the heating element 36.

[0072] The control unit 37 is electrically connected to the chip 2 and is used to acquire the operating status of the chip 2; specifically, the control unit 37 is used to determine whether the chip 2 has stopped working and the duration after the chip 2 stops working. The control unit 37 is also electrically connected to the heating element 36 and is used to control whether the heating element 36 works according to the operating status of the chip 2; specifically, the heating element 36 is connected to a power source through the control unit 37, and the control unit 37 controls whether to supply power to the heating element 36 according to the operating status of the chip 2.

[0073] In this system, control unit 37, in response to chip 2 ceasing operation, controls heating element 36 to heat conduit 33; control unit 37 also, in response to the first time chip 2 ceasing operation, controls heating element 36 to stop heating. It can be understood that during chip 2 operation, the surface temperature of chip 2 does not continuously increase, but rather increases when power is high and decreases when power is low; therefore, the heat dissipation structure 3 repeatedly exchanges internal and external air during chip 2 operation, causing a significant amount of liquid to accumulate in the liquid reservoir of conduit 33. After chip 2 stops operating, heating element 36 begins to heat the liquid in the liquid reservoir, causing the liquid to evaporate and form water vapor, which enters the second air chamber 323 and is absorbed by the water-absorbing layer 34. The liquid in the liquid reservoir is completely evaporated until after the first heating time; specifically, the first heating time can be 5-10 minutes.

[0074] In a specific embodiment, the drive circuit assembly 100 may further include a printed circuit board 4 (see...). Figure 3 The printed circuit board 4 is electrically connected to the flip-chip film 1, and the chip 2 is electrically connected to the printed circuit board 4 through the flip-chip film 1 to achieve precise control of the pixel array. The printed circuit board 4 may include a substrate, driving circuits, and other structures. The specific structure and function of these structures are the same as or similar to those in the prior art. For details, please refer to the prior art, which will not be repeated here.

[0075] This application provides a driving circuit assembly 100, which includes a flip-chip thin film 1, a chip 2, and a heat dissipation structure 3. The chip 2 is disposed on and electrically connected to the flip-chip thin film 1; the heat dissipation structure 3 is disposed on the chip 2. The heat dissipation structure 3 includes a heat dissipation layer 31, a heat dissipation cavity 32, and a conduit 33. The heat dissipation layer 31 is disposed on the surface of the chip 2 for conducting heat from the surface of the chip 2 outwards. The heat dissipation cavity 32 is disposed on the side of the heat dissipation layer 31 away from the chip 2, and a through hole is formed in the sidewall of the heat dissipation cavity 32. An elastic membrane 321 is disposed inside the heat dissipation cavity 32. The elastic membrane 321 is spaced apart from the heat dissipation layer 31 and divides the heat dissipation cavity 32 into a first air chamber 322 and a second air chamber 323. The first air chamber 322 is located between the second air chamber 323 and the heat dissipation layer 31. The first end of the conduit 33 communicates with the second air chamber 323 through the through hole. The second end of 33 is close to and spaced apart from the flip-chip film 1; the second air chamber 323 is connected to the outside air through the conduit 33; wherein, in response to the air pressure of the first air chamber 322 being greater than the air pressure of the second air chamber 323, the elastic membrane 321 deforms and squeezes the second air chamber 323, so that part of the air in the second air chamber 323 is discharged to the outside through the conduit 33; and / or, in response to the air pressure of the first air chamber 322 being less than the air pressure of the second air chamber 323, the elastic membrane 321 also recovers its deformation and squeezes the first air chamber 322, so that outside air enters the conduit 33 through the second end of the conduit 33. By setting a heat dissipation layer 31 on the surface of chip 2, the heat dissipation rate of chip 2 is improved, and the heat on the surface of chip 2 is conducted to the gas in the heat dissipation cavity 32. By setting an elastic membrane 321 in the heat dissipation cavity 32, the heat dissipation cavity 32 is divided into a closed first air chamber 322 and a second air chamber 323 that is open to the outside air. By utilizing the thermal expansion and contraction effect of the gas in the first air chamber 322, when the surface temperature of chip 2 rises, the elastic membrane 321 deforms and squeezes the second air chamber 323, expelling the hotter air from the heat dissipation cavity 32. When the surface temperature of chip 2 decreases, the elastic membrane 321 returns to its original deformation and squeezes the first air chamber 322, drawing the cooler outside air into the heat dissipation cavity 32, thereby accelerating the heat dissipation rate and further reducing the surface temperature of chip 2. In this way, the surface temperature of chip 2 is prevented from becoming too high, which could cause abnormal display.

[0076] like Figure 3As shown, this application also provides a backlight module for providing backlight and ensuring uniform transmission of the backlight through the liquid crystal module. The backlight module may include a backplate 200, a driving circuit assembly 100, and an optical film 300; wherein the backplate 200 provides support for the backlight module; the driving circuit assembly 100 is the driving circuit assembly 100 involved in any of the above embodiments, used to control the backlight module's light emission and control its brightness; specifically, the printed circuit board 4 of the driving circuit assembly 100 is disposed on one side of the backplate 200. The optical film 300 is disposed on the side of the backplate 200 away from the printed circuit board 4 and overlaps with the end of the flip-chip film 1 away from the printed circuit board 4. The optical film 300 is used to adjust the color and brightness of the controllable backlight. The backlight module may also include structural components such as a diffuser plate 400, a light-emitting diode 500, and a reflector 600. The specific structure and function of these structural components are the same as or similar to the structure and function of related structural components in the prior art, and can be referred to the prior art for details, which will not be repeated here.

[0077] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A driving circuit assembly, characterized in that, include: Chip-on-chip film; A chip is disposed on the flip-chip film and electrically connected to the flip-chip film; A heat dissipation structure is disposed on the chip; the heat dissipation structure includes: A heat dissipation layer is disposed on the surface of the chip to conduct heat from the surface of the chip outward; A heat dissipation cavity is disposed on the side of the heat dissipation layer opposite to the chip; and a through hole is formed in the side wall of the heat dissipation cavity; an elastic membrane is disposed inside the heat dissipation cavity; the elastic membrane is spaced apart from the heat dissipation layer; and the elastic membrane divides the heat dissipation cavity into a first air chamber and a second air chamber; the first air chamber is located between the second air chamber and the heat dissipation layer; The conduit; the first end of the conduit communicates with the second air chamber through the through hole; The second end of the conduit is close to the flip-chip film and spaced apart from the flip-chip film; The second air chamber is connected to the outside air through the duct; Wherein, in response to the air pressure in the first air chamber being greater than the air pressure in the second air chamber, the elastic membrane deforms and compresses the second air chamber, causing a portion of the air inside the second air chamber to be discharged to the outside through the conduit; and / or, The elastic membrane also responds to the fact that the air pressure in the first air chamber is less than the air pressure in the second air chamber, the elastic membrane restores its deformation and squeezes the first air chamber so that outside air enters the conduit through the second end of the conduit.

2. The driving circuit assembly according to claim 1, characterized in that, The first chamber is filled with a first gas; and the thermal expansion coefficient of the first gas is greater than that of air.

3. The driving circuit assembly according to claim 2, characterized in that, The first gas is carbon dioxide.

4. The driving circuit assembly according to claim 1, characterized in that, The heat dissipation structure also includes: A water-absorbing layer is disposed on the side of the second air chamber away from the elastic membrane, and is used to absorb water vapor in the heat dissipation cavity.

5. The driving circuit assembly according to claim 4, characterized in that, The heat dissipation structure also includes: A waterproof layer is disposed on the side surface of the absorbent layer facing the heat dissipation cavity; the waterproof layer is used to prevent water molecules from entering the heat dissipation cavity from the absorbent layer; and the waterproof layer has a first surface facing the heat dissipation cavity and a second surface facing the absorbent layer; The waterproof layer is configured to allow water molecules to pass from the first surface through the waterproof layer to the second surface, and to prevent water molecules from passing from the second surface through the waterproof layer to the first surface.

6. The driving circuit assembly according to claim 1, characterized in that, The catheter also includes: A water storage tank is provided on the inner wall of the conduit to prevent liquid from flowing back into the conduit; The inner wall of the conduit forms the outer wall of the water storage tank, and the inner wall of the water storage tank extends at least partially toward the first end.

7. The drive circuit assembly according to claim 4 or 6, characterized in that, The heat dissipation structure also includes: A heating element is disposed on the conduit; Control unit; the control unit is electrically connected to the chip and is used to acquire the operating status of the chip; the control unit is also electrically connected to the heating element and is used to control whether the heating element is working according to the operating status of the chip; The control unit controls the heating element to heat the conduit after the chip stops working; the control unit also controls the heating element to stop heating immediately after the chip stops working.

8. The drive circuit assembly according to claim 1, characterized in that, The heat dissipation layer completely covers the surface of the chip; The heat dissipation layer is copper foil.

9. The driving circuit assembly according to claim 1, characterized in that, Also includes: The printed circuit board is electrically connected to the flip-chip film; and the chip is electrically connected to the printed circuit board through the flip-chip film.

10. A backlight module, characterized in that, include: Back panel; The driving circuit assembly is the driving circuit assembly as described in any one of claims 1-9; The printed circuit board of the drive circuit assembly is disposed on one side of the back plate; An optical film is disposed on the side of the backplate away from the printed circuit board and overlaps with the end of the flip-chip film away from the printed circuit board.

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