Computing nodes, computing devices, and computing systems

Abstract

The embodiments of the present application belong to the technical field of computing devices, and provide a computing node, computing device, and computing system. The computing node includes: a shell, a first module, a second module, and a cooling assembly. The shell includes a baffle, which divides the shell into a first accommodating chamber and a second accommodating chamber. The cooling assembly includes a liquid inlet interface, a liquid outlet interface, an air outlet interface, and a cold plate. The first module is located in the first accommodating chamber, the second module is located in the second accommodating chamber, and the cold plate is located in the second accommodating chamber and in contact with the second module. The liquid inlet interface and the air outlet interface are both connected to the first accommodating chamber, and the liquid inlet interface and the liquid outlet interface are both connected to the cold plate. The liquid inlet interface injects coolant into the first accommodating chamber and the cold plate, and the air outlet interface discharges the vaporized coolant. The liquid outlet interface discharges the coolant in the cold plate. The technical method provided by the embodiments of the present application can enable the computing nodes in the server to have a better heat dissipation effect and a lower heat dissipation cost.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of computing devices, and in particular to a computing node, a computing device, and a computing system. Background Art

[0002] As the computing density of computing devices such as servers increases, the requirements for the heat dissipation capacity of servers also increase.

[0003] Computing devices include components such as motherboards and hard disks. The motherboard is equipped with electronic components such as processors and memory, and the hard disk includes disks and heads. As computing density increases, computing devices need to use liquid cooling to dissipate heat. Liquid cooling includes immersion liquid cooling, spray liquid cooling, and cold plate liquid cooling. Among them, immersion liquid cooling and spray liquid cooling have better heat dissipation effects, but immersion liquid cooling and spray liquid cooling consume coolant, making the cost of cooling the computing device high. In addition, hard disks are not suitable for immersion liquid cooling and spray liquid cooling. Cold plate liquid cooling uses less coolant, but cold plates need to be placed on all electronic devices with large heat dissipation in the computing device, which takes up a large space in the computing device and is difficult to layout. In addition, the heat dissipation effect of cold plate cooling is worse than that of immersion liquid cooling and spray liquid cooling. Therefore, cold plate liquid cooling is difficult to meet the heat dissipation requirements of the processor.

[0004] Therefore, it is an urgent problem to be solved that the heat dissipation method in computing equipment can simultaneously meet the requirements of good heat dissipation effect and low heat dissipation cost. Summary of the Invention

[0005] The embodiments of the present application provide a computing node, a computing device, and a computing system. The computing node has good heat dissipation effect and low heat dissipation cost.

[0006] In a first aspect, an embodiment of the present application provides a computing node, comprising: a shell, a first module, a second module and a cooling assembly, the shell comprising a baffle, the baffle being located inside the shell to divide the shell into a first accommodating chamber and a second accommodating chamber; the cooling assembly comprising a liquid inlet interface, a liquid outlet interface, an air outlet interface and a cold plate; the first module being located inside the first accommodating chamber, the second module being located inside the second accommodating chamber, the cold plate being located inside the second accommodating chamber and the cold plate being in contact with the second module; the liquid inlet interface and the air outlet interface being both connected to the first accommodating chamber, and the liquid inlet interface and the liquid outlet interface being both connected to the cold plate; the liquid inlet interface being used to inject cooling liquid into the first accommodating chamber and into the cold plate, the air outlet interface being used to discharge cooling liquid vaporized in the first accommodating chamber; the liquid outlet interface being used to discharge cooling liquid from the cold plate.

[0007] The computing node provided in the embodiment of the present application is provided with a shell, a first module, a second module and a cooling assembly. The shell includes a baffle, which is located in the shell to divide the shell into a first accommodating chamber and a second accommodating chamber. The cooling assembly includes a liquid inlet interface, a liquid outlet interface, an air outlet interface and a cold plate; the first module is located in the first accommodating chamber, and the liquid inlet interface and the air outlet interface are both connected to the first accommodating chamber. The coolant is injected into the first accommodating chamber through the liquid inlet interface. The coolant absorbs heat in the first accommodating chamber and then vaporizes and is discharged from the air outlet interface. The coolant absorbs a large amount of heat in the process of changing from liquid to gas, and has a good heat dissipation effect. In order to make the coolant vaporize in time, the injection amount of coolant injected into the first accommodating chamber is small, so that the amount of coolant used is small, and therefore the heat dissipation cost is low. The second module and the cold plate are both located in the second accommodating cavity, and the cold plate is in contact with the second module. The liquid inlet and liquid outlet interfaces are both connected to the cold plate. The coolant is injected into the cold plate via the liquid inlet interface. The coolant absorbs the heat of the second module in the second accommodating cavity and is discharged from the liquid outlet interface. The heat dissipation of the second module during operation is relatively small, and the heat dissipation requirements of the second module can be met by using the cold plate for heat dissipation. Using the cold plate to cool the second module can save the amount of coolant, making the cooling cost lower and also facilitating the maintenance of the second module. By setting the shell into the first accommodating cavity and the second accommodating cavity, different heat dissipation methods are set according to the different heat dissipation of the first module in the first accommodating cavity and the second module in the second accommodating cavity, so that the heat dissipation cost of the computing node is lower and the heat dissipation effect is better.

[0008] In one possible implementation, the computing node provided in the embodiments of the present application has the liquid inlet, liquid outlet, and gas outlet ports all disposed on a sidewall of the first accommodating chamber, thereby fully utilizing the space on the four sidewalls of the housing. Furthermore, the liquid inlet, liquid outlet, and gas outlet ports are located on the same sidewall, which facilitates connection of the liquid inlet, liquid outlet, and gas outlet ports to the cooling distribution device.

[0009] In one possible embodiment, the computing node provided in the embodiment of the present application, the cooling component includes a first liquid distribution tube and a spray plate, one end of the first liquid distribution tube is connected to the liquid inlet interface, and the other end of the first liquid distribution tube is connected to the spray plate; a processor is provided on the first module, and the spray plate is located above the processor; a spray head is provided on the spray plate, and the spray head is used to spray coolant onto the processor, and the spraying method can save more coolant.

[0010] In one possible embodiment, the computing node provided in the embodiment of the present application, the cooling component also includes a second liquid distribution tube and a liquid outlet tube, one end of the second liquid distribution tube is connected to the liquid inlet interface, and the other end of the second liquid distribution tube passes through the baffle to connect to the cold plate; one end of the liquid outlet tube is connected to the liquid outlet interface, and the other end of the liquid outlet tube passes through the baffle to connect to the cold plate.

[0011] In one possible implementation, the computing node provided in the embodiments of the present application includes a liquid level detection control valve within the first storage chamber, which is connected to the first liquid distribution pipe. When the liquid level detection control valve detects that the liquid level in the first storage chamber is higher than a preset level, the liquid level detection control valve is configured to reduce the flow of coolant in the first liquid distribution pipe. By providing the liquid level detection control valve, the amount of coolant injected into the first storage chamber can be controlled based on actual heat dissipation requirements. This ensures a good cooling effect while avoiding the injection of excess coolant into the first storage chamber, thereby avoiding coolant waste and reducing cooling costs.

[0012] In one possible implementation, in the computing node provided in the embodiment of the present application, the liquid level detection control valve includes a valve body and a float, the valve body includes a piston, and the float is connected to the piston. When coolant needs to be injected into the first accommodating chamber, the piston is in a fully open state; when the coolant level in the first accommodating chamber is higher than a preset level, the float floats to make the piston in a semi-open state or a closed state.

[0013] In one possible embodiment, the computing node provided in the embodiment of the present application is further provided with a liquid baffle in the first accommodating cavity. The liquid baffle is provided near the air outlet interface, and the height of the liquid baffle is greater than the preset liquid level. The baffle can separate the air outlet interface from the coolant in the first accommodating cavity, preventing the coolant from flowing out of the air outlet interface. The distance between the upper end of the liquid baffle and the bottom plate is greater than the height of the preset liquid level. Therefore, when the liquid level fluctuates so that the liquid level in other areas of the first accommodating cavity is higher than the liquid level at the liquid level detection control valve, the liquid baffle can prevent the coolant from flowing out of the air outlet interface, thereby providing double protection for the air outlet interface.

[0014] In one possible implementation, the computing node provided in the embodiments of the present application further includes a memory module disposed on the first module. The end of the memory module facing the first module is immersed in the coolant, and the end of the memory module facing away from the first module is provided with a heat sink, which is partially immersed in the coolant. Thus, the end of the memory module facing the first module is in direct contact with the coolant, while the end of the memory module facing away from the first module directs heat into the coolant via the heat sink to dissipate heat from the memory. Consequently, the coolant level in the first accommodating chamber can be controlled to be relatively low, further reducing the amount of coolant used and thereby further reducing heat dissipation costs.

[0015] In the second aspect, an embodiment of the present application also provides a computing device, including a cabinet, a liquid inlet main pipe, a liquid outlet main pipe, an air outlet main pipe and a plurality of the above-mentioned computing nodes, the computing nodes are arranged along the height direction of the cabinet, and the liquid inlet main pipe, the liquid outlet main pipe, and the air outlet main pipe all extend along the height direction of the cabinet; the liquid inlet interface in each computing node is connected to the liquid inlet main pipe, the liquid outlet interface in each computing node is connected to the liquid outlet main pipe, and the air outlet interface in each computing node is connected to the air outlet main pipe.

[0016] In a third aspect, an embodiment of the present application also provides a computing system, including a cooling distribution device and the above-mentioned computing equipment, the cooling distribution device is used to provide cooling liquid to the computing equipment, the cooling distribution device includes a condenser and a liquid storage tank, the condenser and the liquid storage tank are connected, the condenser is connected to the air outlet main pipe in the computing equipment; the liquid storage tank is connected to the liquid outlet main pipe and the liquid inlet main pipe in the computing equipment.

[0017] In a fourth aspect, an embodiment of the present application also provides a cooling distribution device, which is used to provide cooling liquid to the computing device. The cooling distribution device includes a condenser and a liquid storage tank. The condenser and the liquid storage tank are connected. The condenser is used to connect to the air outlet main pipe in the computing device; the liquid storage tank is used to connect to the liquid outlet main pipe and the liquid inlet main pipe in the computing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the structure of a data center provided in an embodiment of the present application;

[0019] Figure 2 Schematic diagram of the structure of the computing device provided in the embodiment of the present application Figure 1 ;

[0020] Figure 3 Schematic diagram of the structure of the computing node provided in the embodiment of the application Figure 1 ;

[0021] Figure 4 Schematic diagram of the structure of the computing node provided in the embodiment of the application Figure 2 ;

[0022] Figure 5 Schematic diagram of the structure inside the first accommodation cavity of the computing node provided in the embodiment of the present application Figure 1 ;

[0023] Figure 6 A schematic diagram of the structure of a cold plate in a computing node provided in an embodiment of the present application;

[0024] Figure 7 Schematic diagram of the structure of the computing node provided in the embodiment of the application Figure 3 ;

[0025] Figure 8a Schematic diagram of the structure of the liquid level detection control valve in the computing node provided in the embodiment of the present application Figure 1 ;

[0026] Figure 8b Schematic diagram of the structure of the liquid level detection control valve in the computing node provided in the embodiment of the present application Figure 2 ;

[0027] Figure 8cSchematic diagram of the structure of the liquid level detection control valve in the computing node provided in the embodiment of the present application Figure 3 ;

[0028] Figure 9 Schematic diagram of the structure inside the first accommodation cavity of the computing node provided in the embodiment of the present application Figure 2 ;

[0029] Figure 10 Schematic diagram of the structure of the computing device provided in the embodiment of the present application Figure 2 ;

[0030] Figure 11 A schematic diagram of the structure of a liquid inlet manifold in a computing device provided in an embodiment of the present application;

[0031] Figure 12 A schematic diagram of the structure of a liquid outlet main pipe in a computing device provided in an embodiment of the present application;

[0032] Figure 13 A schematic diagram of the structure of a gas outlet main pipe in a computing device provided in an embodiment of the present application;

[0033] Figure 14 A schematic diagram of the structure of a cooling distribution device provided in an embodiment of the present application;

[0034] Figure 15 A schematic diagram of the structure of a computing system provided in an embodiment of the present application.

[0035] Description of reference numerals:

[0036] 10. Computing equipment;

[0037] 100, cabinet;

[0038] 200, computing nodes;

[0039] 210, housing; 211, first accommodating chamber; 212, second accommodating chamber;

[0040] 213, bottom shell; 2131, bottom plate; 2132, side wall; 2132a, first side wall; 2132b, second side wall; 2132c, third side wall; 2132d, fourth side wall;

[0041] 214, baffle; 2141, sealing joint;

[0042] 215, Sealing rubber ring;

[0043] 220, first module; 221, processor; 222, memory; 223, radiator;

[0044] 230, second module;

[0045] 240, cooling assembly; 241, liquid inlet interface; 242, liquid outlet interface; 243, air outlet interface;

[0046] 244, cold plate; 2441, metal plate; 2442, channel; 2442a, channel inlet; 2442b, channel outlet;

[0047] 245. First dispensing tube; 246. Transfer tube;

[0048] 247, spray plate; 2471, spray head; 2472, connecting column; 2473, fastener;

[0049] 248, second dispensing tube;

[0050] 249, liquid outlet pipe;

[0051] 250, liquid level detection control valve; 251, valve body; 2511, pipeline; 2512, piston; 252, float;

[0052] 260, liquid baffle;

[0053] 270, heat sink;

[0054] 300, liquid inlet main pipe; 310, liquid inlet;

[0055] 400, liquid outlet main pipe; 410, liquid outlet;

[0056] 500, main air outlet; 510, air outlet;

[0057] 20. Computer room;

[0058] 30. Cooling distribution device;

[0059] 31. Condenser; 32. Liquid storage tank; 33. Subcooler; 34. Pump body;

[0060] 1000, data center;

[0061] X, length direction;

[0062] Y, width direction;

[0063] Z, height direction. DETAILED DESCRIPTION

[0064] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0065] To facilitate understanding, the technical terms involved in the embodiments of this application are first explained and illustrated.

[0066] Processor: The processor is a general term for various processors such as CPU (Central Processing Unit), GPU (Graphics Processing Unit) or TPU (Tensor Processing Unit), abbreviated as XPU.

[0067] Memory: Memory is used to temporarily store data for processor operations and data exchanged with external storage devices such as hard drives. The processor transfers the data to memory for calculation and then transmits the results after the calculation is completed.

[0068] Cold Plate: A sealed heat sink that can hold flowing liquid and is typically bonded to a heating element via a thermally conductive interface material to remove heat from the element.

[0069] Immersion cooling: Heat-generating electronic components are immersed in a refrigerant (coolant), allowing the liquid to circulate and remove heat. Immersion cooling allows for direct, all-around contact between the heating element and the refrigerant, resulting in higher heat dissipation efficiency.

[0070] Spray liquid cooling: A spray head is set above the heat-generating electronic components, which sprays coolant onto the electronic components to remove the heat from the electronic components. Compared with immersion liquid cooling, spray liquid cooling can save more coolant and can spray locally on the components that need cooling.

[0071] Figure 1 A schematic diagram of the structure of a data center provided in an embodiment of the present application.

[0072] See also Figure 1 As shown, data center 1000 is a globally coordinated network of specialized devices used to transmit, accelerate, display, compute, and store data information on the Internet infrastructure. Data center 1000 may include a computer room 20 and at least one computing device 10 located therein. It is understood that computer room 20 may be a closed room or a room with one or more open sides. Computer room 20 may be a temporary room, such as a tent or prefabricated house, or a permanent room.

[0073] The computer room 20 may contain only one computing device 10 or multiple computing devices 10. When multiple computing devices 10 are installed in the computer room 20, each computing device 10 may be identical, partially identical, or completely different. The computing device 10 may be a desktop server, blade server, rack server, high-density server, or entire cabinet server.

[0074] Among them, whole-cabinet servers are widely used in cloud computing, high-performance computing (HPC), big data, and artificial intelligence (AI) due to their high space utilization.

[0075] Below, the structure of the computing device 10 is described by taking the computing device 10 as a whole cabinet server as an example.

[0076] Figure 2 Schematic diagram of the structure of the computing device provided in the embodiment of the present application Figure 1 .

[0077] See also Figure 2 As shown, the computing device 10 includes a cabinet 100 and a plurality of computing nodes 200 .

[0078] Specifically, the cabinet 100 is generally a rectangular parallelepiped structure, and includes a length direction X, a width direction Y, and a height direction Z. A plurality of computing nodes 200 are arranged along the height direction Z in the cabinet 100 .

[0079] Computing nodes include components such as a motherboard and a hard disk. The motherboard is equipped with electronic components such as a processor and memory, and the hard disk includes a disk and a magnetic head. As computing density increases, the heat dissipation of the processor increases, so the computing node needs to use liquid cooling to dissipate heat. Liquid cooling includes immersion liquid cooling, spray liquid cooling, and cold plate liquid cooling. Among them, immersion liquid cooling and spray liquid cooling have better heat dissipation effects, but immersion liquid cooling and spray liquid cooling consume coolant, making the cost of cooling the computing node high. In addition, the hard disk includes a magnetic head and a magnetic disk. The magnetic head needs to move on the disk to read data. Immersion liquid cooling and spray liquid cooling will affect the contact between the magnetic head and the magnetic disk, so the hard disk is not suitable for immersion liquid cooling and spray liquid cooling. In addition, the hard disk needs to be frequently plugged and unplugged, and immersion liquid cooling and spray liquid cooling are not convenient for plugging and unplugging the disk.

[0080] Cold plate liquid cooling uses less coolant, but requires placing cold plates on all electronic components in the computing device that dissipate a large amount of heat. For example, cold plates need to be installed on components such as memory, processors, and hard drives. This takes up a large amount of space in the computing device and needs to be adjusted according to different computing nodes, making the layout of the cold plates difficult. In addition, the heat dissipation effect of cold plate cooling is worse than that of immersion liquid cooling and spray liquid cooling. Therefore, cold plate liquid cooling is difficult to meet the heat dissipation requirements of the processor.

[0081] Therefore, it is difficult for the heat dissipation method in the computing node to simultaneously meet the requirements of good heat dissipation effect and low heat dissipation cost.

[0082] Based on this, an embodiment of the present application provides a computing node, which has good heat dissipation effect and low heat dissipation cost.

[0083] Figure 3 Schematic diagram of the structure of the computing node provided in the embodiment of the application Figure 1 ; Figure 4 Schematic diagram of the structure of the computing node provided in the embodiment of the application Figure 2 .

[0084] See also Figure 3 and Figure 4 As shown, the computing node 200 provided in the embodiment of the present application includes a housing 210, a first module 220, a second module 230 and a cooling assembly 240. The housing 210 includes a baffle 214. The baffle 214 is located in the housing 210 to divide the housing 210 into a first accommodating cavity 211 and a second accommodating cavity 212. The cooling assembly 240 includes a liquid inlet interface 241, a liquid outlet interface 242, an air outlet interface 243 and a cold plate 244. The first module 220 is located in the first accommodating cavity 211, and the second module 230 and the cold plate 244 are connected to the cooling assembly 240. Both are located in the second accommodating cavity 212, and the cold plate 244 is in contact with the second module 230; the liquid inlet interface 241 and the air outlet interface 243 are both connected to the first accommodating cavity 211, and the liquid inlet interface 241 and the liquid outlet interface 242 are both connected to the cold plate 244; the liquid inlet interface 241 is used to inject coolant into the first accommodating cavity 211 and to inject coolant into the cold plate 244, and the air outlet interface 243 is used to discharge the coolant vaporized in the first accommodating cavity 211; the liquid outlet interface 242 is used to discharge the coolant in the cold plate 244.

[0085] The housing 210 is used to support and accommodate other components of the computing node 200. The housing 210 is a rectangular parallelepiped structure, and the length, width, and height of the housing 210 correspond to the length X, width Y, and height Z of the computing device 10.

[0086] The housing 210 includes a bottom shell 213 and an upper cover. Figure 3 The upper cover is omitted in the figure to clearly illustrate the internal structure of the housing 210. The bottom shell 213 includes a bottom plate 2131 and four side walls 2132. The four side walls 2132 are arranged around the circumference of the bottom plate 2131. The four side walls 2132 are respectively a first side wall 2132a, a second side wall 2132b, a third side wall 2132c, and a fourth side wall 2132d. The first side wall 2132a and the third side wall 2132c are arranged opposite each other along the width direction Y, and the second side wall 2132b and the fourth side wall 2132d are arranged opposite each other along the length direction X.

[0087] A baffle 214 is provided in the bottom shell 213, and the baffle 214 can extend along the first direction X. One end of the baffle 214 is connected to the second side wall 2132b, and the other end of the baffle 214 is connected to the fourth side wall 2132d. The baffle 214 forms a first accommodating cavity 211 with the first side wall 2132a, part of the bottom plate 2131, part of the second side wall 2132b and part of the fourth side wall 2132d, and the baffle 214 forms a second accommodating cavity 212 with the third side wall 2132c, another part of the bottom plate 2131, another part of the second side wall 2132b and another part of the fourth side wall 21322132d.

[0088] The first module 220 is located in the first accommodating cavity 211. The first module 220 can be the mainboard of the computing node 200. The first module 220 is equipped with a processor 221, memory 222, and other electronic components. The processor 221 is the core working component of the computing node 200 for performing calculations. The processor 221 works in conjunction with the memory 222 and other electronic components of the first module 220. As the computing power of the processor 221 increases, the amount of heat dissipated during operation by the processor 221 also increases. Therefore, liquid cooling is required for the processor 221.

[0089] The coolant enters the first accommodating chamber 211 through the liquid inlet port 241 and vaporizes in the first accommodating chamber 211. The vaporization process absorbs heat generated by the processor 221 and the memory 222. The vaporized coolant can be promptly discharged from the first accommodating chamber 211 through the gas outlet port 243. The operating temperature of the processor 221 is generally greater than 50°C. A coolant with a boiling point of approximately 50°C can be selected. For example, the coolant can be mineral oil, silicone oil, or fluorinated liquid.

[0090] The process of liquid coolant entering the first accommodating chamber 211, absorbing heat, and then vaporizing is called two-phase heat dissipation. The coolant absorbs a large amount of heat during the process of changing from liquid to gas, which has a better heat dissipation effect than single-phase heat dissipation without phase change. In addition, in order to ensure that the coolant vaporizes in a timely manner, the amount of coolant injected into the first accommodating chamber 211 is small, resulting in a smaller amount of coolant used, and thus a lower heat dissipation cost. It should be noted that the coolant inlet temperature can be maintained at 35°-40°, which is also conducive to the timely vaporization of the coolant after absorbing heat.

[0091] Part of the unvaporized coolant is located in the first accommodating cavity 211 , so that the first module 220 and other components on the first module 220 can be immersed in the coolant, thereby facilitating heat dissipation for the first module 220 and other electronic components on the first module 220 .

[0092] The second module 230 can be a hard disk or a network card, etc. The hard disk includes a magnetic head and a disk, so the hard disk cannot be in direct contact with the coolant. In addition, the hard disk and the network card also need to be frequently plugged in and out. If there is coolant in the second accommodating cavity 212, when maintaining the hard disk or the network card, the coolant in the second accommodating cavity 212 needs to be drained first, and the second accommodating cavity 212 needs to be dried before the hard disk and the network card can be plugged in and out, which makes the maintenance process of the hard disk and the network card more complicated.

[0093] Therefore, a cold plate 244 can be used to dissipate heat from the second module 230. The cold plate 244 is mounted on and in close contact with the second module 230. The liquid inlet port 241 can be connected to one end of the cold plate 244 via a pipeline, and the liquid outlet port 242 can be connected to the cold plate 244 via another pipeline. Coolant enters the cold plate 244 through the liquid inlet port 241, absorbs heat from the second module 230, and is discharged through the liquid outlet port 242. The operating temperature of the second module 230 does not reach the boiling point of the coolant. Therefore, the coolant flowing out of the liquid outlet port 242 remains in liquid form.

[0094] Using the cold plate 244 to cool the second module 230 can save the amount of coolant, thereby reducing the cooling cost and facilitating the maintenance of the second module 230 .

[0095] It should be noted that a sealing rubber ring 215 is provided on the baffle 214 and the side wall 2132 forming the first accommodating cavity 211. When the upper cover is set on the bottom shell 213, the sealing of the sealing rubber ring 215 can make the first accommodating cavity 211 a sealed accommodating cavity, thereby preventing the coolant in the first accommodating cavity 211 from entering the second accommodating cavity 212.

[0096] The computing node 200 provided in the embodiment of the present application is provided with a housing 210, a first module 220, a second module 230 and a cooling assembly 240. The housing 210 includes a baffle 214, which is located in the housing 210 to divide the housing 210 into a first accommodating cavity 211 and a second accommodating cavity 212. The cooling assembly 240 includes a liquid inlet interface 241, a liquid outlet interface 242, an air outlet interface 243 and a cold plate 244. The first module 220 is located in the first accommodating cavity 211, and the liquid inlet interface 241 is located in the first accommodating cavity 211. 241 and the gas outlet interface 243 are both connected to the first accommodating chamber 211. The coolant is injected into the first accommodating chamber 211 through the liquid inlet interface 241. The coolant absorbs heat in the first accommodating chamber 211 and vaporizes and is discharged from the gas outlet interface 243. The coolant absorbs a large amount of heat in the process of changing from liquid to gas, and has a good heat dissipation effect. In order to make the coolant vaporize in time, the injection amount of coolant injected into the first accommodating chamber 211 is small, so that the amount of coolant used is small, and therefore the heat dissipation cost is low. The second module 230 and the cold plate 244 are both located in the second accommodating chamber 212, and the cold plate 244 is in contact with the second module 230. The liquid inlet interface 241 and the liquid outlet interface 242 are both connected to the cold plate 244. The coolant is injected into the cold plate 244 through the liquid inlet interface 241. The coolant absorbs the heat of the second module 230 in the second accommodating chamber 212 and is discharged from the liquid outlet interface 242. The heat dissipation of the second module 230 during operation is relatively small. The heat dissipation requirement of the second module 230 can be met by using the cold plate 244. Using the cold plate 244 to cool the second module 230 can save the amount of coolant, reduce the cooling cost, and facilitate maintenance of the second module 230. By setting the shell 210 into a first accommodating cavity 211 and a second accommodating cavity 212, different heat dissipation methods are set according to the different heat dissipation of the first module 220 in the first accommodating cavity 211 and the second module 230 in the second accommodating cavity 212, the heat dissipation cost of the computing node 200 is low and the heat dissipation effect is better.

[0097] Please continue to see Figure 3 and Figure 4 As shown, the liquid inlet port 241, the liquid outlet port 242, and the gas outlet port 243 are all disposed on the first side wall 2132a. In other embodiments, the liquid inlet port 241, the liquid outlet port 242, and the gas outlet port 243 may also be disposed on the second side wall 2132b or the fourth side wall 2132d forming the first accommodating chamber 211.

[0098] This is because the hard disk in the second accommodating cavity 212 needs to be frequently plugged in and out, and an interface for plugging in and out the hard disk needs to be opened on the third side wall 2132c, so that the remaining space on the third side wall 2132c is limited. Therefore, the liquid inlet interface 241, the liquid outlet interface 242 and the air outlet interface 243 are usually arranged on the side wall 2132 forming the first accommodating cavity 211 to make full use of the space on the four side walls 2132 of the shell 210.

[0099] In addition, the liquid inlet interface 241, the liquid outlet interface 242 and the gas outlet interface 243 are located on the same side wall 2132. This arrangement can facilitate the connection of the liquid inlet interface 241, the liquid outlet interface 242 and the gas outlet interface 243 with the cooling distribution device.

[0100] Next, the specific heat dissipation process in the first accommodating cavity 211 is described.

[0101] Please continue to see Figure 3 As shown, the cooling assembly 240 includes a first liquid distributing tube 245 , one end of which is connected to the liquid inlet interface 241 , and the other end of the first liquid distributing tube 245 extends into the first accommodating cavity 211 to inject cooling liquid into the first accommodating cavity 211 .

[0102] Since the liquid inlet interface 241 needs to inject coolant into the first accommodating chamber 211 and also needs to inject coolant into the cold plate 244, it is necessary to connect a two-way pipe at the liquid inlet interface 241. For example, the cooling assembly 240 also includes a transfer pipe 246, which is connected to the liquid inlet interface 241, and a first liquid distribution pipe 245 is connected to the transfer pipe 246. The liquid outlet of the first liquid distribution pipe 245 is set in the first accommodating chamber 211 near the processor 221. The coolant with a lower temperature flowing out of the first liquid distribution pipe 245 flows directly to the side of the processor 221 to dissipate heat for the processor 221. Figure 3 Two processors 221 are provided on the first module 220 , so the number of the first liquid distributing pipes 245 can be two, and the two first liquid distributing pipes 245 extend to the vicinity of different processors 221 , respectively.

[0103] Figure 5 Schematic diagram of the structure inside the first accommodation cavity of the computing node provided in the embodiment of the present application Figure 1 .

[0104] See also Figure 4 and Figure 5 As shown, the cooling assembly 240 also includes a spray plate 247, which is connected to the first liquid distribution pipe 245; the spray plate 247 is located above the processor 221; a spray head 2471 is provided on the spray plate 247, and the spray head 2471 is used to spray cooling liquid onto the processor 221.

[0105] Please continue to see Figure 5 As shown, a heat sink 223 is provided above the processor 221. The heat sink 223 is attached to the processor 221 to promptly transfer the heat generated by the processor 221 to the first accommodating cavity 211. The spray plate 247 includes a connecting post 2472, which can be fixed to the first module 220. The spray plate 247 is connected to the connecting post 2472 via a fastener 2473, and a certain distance is provided between the spray plate 247 and the heat sink 223. A plurality of spray heads 2471 are mounted on the spray plate 247. The coolant in the first liquid distribution pipe 245 is sprayed from the spray heads 2471. The coolant absorbs heat and vaporizes after contacting the radiator 223, thereby absorbing the heat generated by the processor 221. The spraying method can further save coolant.

[0106] Next, a specific cooling method in the second accommodating cavity 212 is described.

[0107] Please continue to see Figure 3 and Figure 4 As shown, the cooling assembly 240 further includes a second liquid distribution pipe 248, one end of which is in communication with the liquid inlet port 241, and the other end of which passes through the baffle 214 to communicate with the cold plate 244. The cooling assembly 240 further includes a liquid outlet pipe 249, one end of which is in communication with the liquid outlet port 242, and the other end of which passes through the baffle 214 to communicate with the cold plate 244.

[0108] Figure 6 This is a schematic diagram of the structure of the cold plate in the computing node provided in an embodiment of the present application.

[0109] See also Figure 6 As shown, the cold plate 244 includes a metal plate 2441 and a channel 2442. The channel 2442 has an inlet 2442a and an outlet 2442b for coolant. The metal plate 2441 is attached to the second module 230 to absorb heat from the second module 230. Coolant flows in the channel 2442, and the heat of the metal plate 2441 is removed by the flowing coolant.

[0110] One end of the second liquid distributing tube 248 is connected to the liquid inlet port 241 via the transfer tube 246 , and the other end of the second liquid distributing tube 248 passes through the baffle 214 and is connected to the channel inlet 2442 a of the cold plate 244 .

[0111] One end of the liquid outlet pipe 249 is directly connected to the liquid outlet port 242. The other end of the liquid outlet pipe 249 extends through the baffle 214 into the second accommodating chamber 212 and is connected to the channel outlet 2442b of the cold plate 244. It should be noted that the connection between the first liquid distribution pipe 245 and the baffle 214 requires a sealing joint 2141. The connection between the second liquid distribution pipe 248 and the baffle 214 also requires a sealing joint 2141.

[0112] The coolant flows through the liquid inlet interface 241, the transfer tube 246, and the second liquid distribution tube 248 in sequence, enters the cold plate 244 from the channel inlet 2442a, flows in the channel 2442 of the cold plate 244, absorbs the heat of the second module 230, and then flows out from the channel outlet 2442b, and is discharged in sequence through the liquid outlet pipe 249 and the liquid outlet interface 242.

[0113] Please continue to see Figure 3 and Figure 4 As shown, in some possible implementations, the plurality of second modules 230 may share a cold plate 244 , and the cold plate 244 is attached above the second modules 230 .

[0114] Figure 7 Schematic diagram of the structure of the computing node provided in the embodiment of the application Figure 3 .

[0115] See also Figure 7 As shown, in some possible embodiments, a cold plate 244 is provided on each second module 230, and multiple cold plates 244 are connected in sequence. The second liquid distribution pipe 248 is connected to the channel inlet 2442a of the cold plate 244 located most upstream in the direction of coolant flow, and the liquid outlet pipe 249 is connected to the channel outlet 2442b of the cold plate 244 located most downstream in the direction of coolant flow. The coolant is injected from the second liquid distribution pipe 248 into the cold plate 244 located most upstream in the direction of coolant flow, flows through multiple cold plates 244 in sequence, and then flows out from the liquid outlet pipe 249 to cool the multiple second modules 230.

[0116] Please continue to see Figure 3 、 Figure 4 and Figure 7 As shown, the first accommodating chamber 211 is provided with a liquid level detection control valve 250, which is connected to the first liquid distribution pipe 245; when the liquid level detection control valve 250 detects that the liquid level in the first accommodating chamber 211 is higher than the preset liquid level, the liquid level detection control valve 250 is used to reduce the flow rate of the coolant in the first liquid distribution pipe 245.

[0117] Figure 8a Schematic diagram of the structure of the liquid level detection control valve in the computing node provided in the embodiment of the present application Figure 1 ; Figure 8bSchematic diagram of the structure of the liquid level detection control valve in the computing node provided in the embodiment of the present application Figure 2 ; Figure 8c Schematic diagram of the structure of the liquid level detection control valve in the computing node provided in the embodiment of the present application Figure 3 Among them, Figure 8a and Figure 8b The flow path of the coolant is shown in dashed lines.

[0118] See also Figures 8a to 8c As shown, the liquid level detection control valve 250 includes a valve body 251 and a float 252. The valve body 251 can be a solenoid valve. The valve body includes a pipe 2511 and a piston 2512. The pipe 2511 is connected to the first liquid distribution pipe 245, and the float 252 is connected to the electromagnetic control switch of the piston 2512.

[0119] Please continue to see Figure 8a As shown, when cooling liquid needs to be injected into the first accommodating chamber 211 , the piston 2512 is in a fully open state, and the cooling liquid flows through the pipe 2511 and the first liquid distribution pipe 245 and is injected into the first accommodating chamber 211 .

[0120] Please continue to see Figure 8b As shown, when the liquid level of the coolant in the first accommodating chamber 211 is higher than the preset liquid level, the coolant causes the float 252 to float, and the float 252 triggers the electromagnetic switch of the piston 2512, causing the piston 2512 to move downward a certain distance, thereby reducing the cross-sectional area of the channel in the pipe 2511 through which the coolant can flow, and reducing the flow rate of the coolant that can flow through the pipe 2511. This state is a semi-open state. When the piston 2512 is in the semi-open state, the flow rate of the coolant in the first liquid distribution pipe 245 is reduced.

[0121] Please continue to see Figure 8c As shown, the liquid level in the first accommodating chamber 211 continues to rise, and the piston 2512 continues to move downward until the piston 2512 is in a closed state, and no coolant flows through the pipe 2511. The coolant in the first accommodating chamber 211 absorbs heat, vaporizes, and is discharged from the gas outlet 243, causing the coolant to gradually decrease. When the coolant level drops below the preset level, the float 252 moves downward, and the piston 2512 opens again to inject coolant into the first accommodating chamber 211.

[0122] It should be noted that the preset liquid level can be set according to specific usage requirements. For example, the preset liquid level can be set so that the coolant in the first accommodating chamber 211 at least submerges the processor 221 and a portion of the memory 222 in the first module 220. It should be noted that the preset liquid level needs to be smaller than the distance between the air outlet port 243 and the bottom plate 2131 to prevent the coolant from being discharged from the air outlet port 243.

[0123] By setting the liquid level detection control valve 250, the amount of coolant injected into the first container 211 can be controlled according to the actual heat dissipation requirements, thereby ensuring a better cooling effect while avoiding the injection of excess coolant into the first container 211, avoiding the waste of coolant, and thus reducing the cooling cost.

[0124] Please continue to see Figure 3 、 Figure 4 and Figure 7 As shown, a liquid baffle 260 is further provided in the first accommodating chamber 211 . The liquid baffle 260 is provided close to the air outlet interface 243 , and the height of the liquid baffle 260 is greater than the preset liquid level.

[0125] The liquid baffle 260 extends upward from the bottom plate 2131 of the shell 210. The liquid baffle 260 is a curved plate-like member. One end of the liquid baffle 260 is connected to the first side wall 2132a, and the other end of the liquid baffle 260 is connected to the second side wall 2132b to separate the air outlet interface 243 from the coolant in the first accommodating chamber 211, thereby preventing the coolant from flowing out of the air outlet interface 243.

[0126] Among them, the distance between the upper end of the liquid baffle 260 and the bottom plate 2131 is greater than the height of the preset liquid level. Therefore, when the liquid level fluctuates so that the liquid level in other areas of the first accommodating chamber 211 is higher than the liquid level at the liquid level detection control valve 250, the liquid baffle 260 can prevent the coolant from flowing out of the air outlet interface 243, thereby providing double protection for the air outlet interface 243.

[0127] The height of the memory 222 is usually higher than the height of the coolant in the first accommodating cavity 211 . Therefore, the end of the memory 222 facing away from the first module 220 cannot be cooled by the coolant.

[0128] In some possible implementations, a heat sink may be provided on the memory 222 to dissipate heat from the memory 222 .

[0129] Figure 9 Schematic diagram of the structure inside the first accommodation cavity of the computing node provided in the embodiment of the present application Figure 2 .

[0130] See also Figure 9 As shown, one end of the memory 222 facing the first module 220 is immersed in the coolant, and a heat sink 270 is provided on the end of the memory 222 away from the first module 220. The heat sink 270 is partially immersed in the coolant.

[0131] Multiple memories 222 are arranged side by side on both sides of each processor 221, with spacing between the memories 222. A heat sink 270 can be clamped on the end of each memory 222 away from the first module 220. The heat sink 270 is partially immersed in the coolant (in Figure 9The liquid level of the coolant is shown by a dotted line in the figure), thereby, the end of the memory 222 facing the first module 220 is directly in contact with the coolant, and the end of the memory 222 facing away from the first module 220 introduces heat into the coolant through the heat sink 270 to dissipate heat from the memory 222. Therefore, the liquid level of the coolant in the first accommodating cavity 211 can be controlled to be lower, which can further reduce the amount of coolant used, thereby further reducing the heat dissipation cost.

[0132] Next, the manner in which the liquid inlet interface 241 , the liquid outlet interface 242 , and the gas outlet interface 243 are connected to the circuit in the computing device 10 will be described.

[0133] Figure 10 Schematic diagram of the structure of the computing device provided in the embodiment of the present application Figure 2 .in, Figure 10 It is from Figure 2 A view of the back side of the device.

[0134] See also Figure 10 As shown, the computing device 10 also includes a liquid inlet main pipe 300, a liquid outlet main pipe 400, and an air outlet main pipe 500. The liquid inlet main pipe 300, the liquid outlet main pipe 400, and the air outlet main pipe 500 all extend along the height direction Z of the cabinet 100; the liquid inlet interface 241 in each computing node 200 is connected to the liquid inlet main pipe 300, the liquid outlet interface 242 in each computing node 200 is connected to the liquid outlet main pipe 400, and the air outlet interface 243 in each computing node 200 is connected to the air outlet main pipe 500.

[0135] The liquid inlet main pipe 300 , the liquid outlet main pipe 400 , and the gas outlet main pipe 500 are arranged side by side at the rear side of the cabinet 100 , thereby facilitating connection with the cooling distribution device and saving space at the rear side of the cabinet 100 .

[0136] Specifically, Figure 11 This is a schematic diagram of the structure of the liquid inlet main pipe in the computing device provided in an embodiment of the present application.

[0137] See also Figure 10 and Figure 11 As shown, the liquid inlet manifold 300 can be mounted on the cabinet 100 using fasteners. The liquid inlet manifold 300 is provided with multiple liquid inlets 310. The liquid inlets 310 are arranged along the height direction Z on the liquid inlet manifold 300. These liquid inlets 310 are connected to the liquid inlet interfaces 241 in a one-to-one correspondence. Cooling liquid enters the computing device 10 from the liquid inlet manifold 300 and is delivered to different computing nodes 200 through different liquid inlets 310.

[0138] Figure 12 This is a schematic diagram of the structure of the liquid outlet main pipe in the computing device provided in an embodiment of the present application.

[0139] See also Figure 10 and Figure 12 As shown, the liquid outlet manifold 400 can also be mounted on the cabinet 100 using fasteners. Liquid outlet ports 410 are provided on the liquid outlet manifold 400. The liquid outlet ports 410 are arranged along the height direction Z on the liquid outlet manifold 400. These liquid outlet ports 410 are in one-to-one communication with the liquid outlet interfaces 242. Cooling liquid from the cold plates 244 of different computing nodes 200 enters the liquid outlet manifold 400 through the liquid outlet interfaces 242 and the liquid outlet ports 410 and is discharged from the liquid outlet manifold 400.

[0140] Figure 13 This is a schematic diagram of the structure of the gas outlet main pipe in the computing device provided in an embodiment of the present application.

[0141] See also Figure 10 and Figure 13 As shown, the gas outlet manifold 500 can also be mounted on the cabinet 100 using fasteners. The gas outlet manifold 500 is provided with gas outlets 510. The gas outlets 510 are arranged along the height direction Z on the gas outlet manifold 500. These gas outlets 510 are in one-to-one communication with the gas outlet interfaces 243. The vaporized coolant in the first accommodating cavities 211 of different computing nodes 200 enters the gas outlet manifold 500 through the gas outlet interfaces 243 and the gas outlets 510, and is discharged from the gas outlet manifold 500.

[0142] Figure 14 A schematic diagram of the structure of a cooling distribution device provided in an embodiment of the present application; Figure 15 A schematic diagram of the structure of a computing system provided in an embodiment of the present application.

[0143] See also Figure 14 and Figure 15 As shown, an embodiment of the present application also provides a computing system, which includes a cooling distribution device 30 and the above-mentioned computing device 10. The cooling distribution device 30 is used to provide cooling liquid to the computing device 10. The cooling distribution device 30 includes a condenser 31 and a liquid storage tank 32. The condenser 31 and the liquid storage tank 32 are connected. The condenser 31 is used to communicate with the air outlet main pipe 500 in the computing device 10; the liquid storage tank 32 is used to communicate with the liquid outlet main pipe 400 and the liquid inlet main pipe 300 in the computing device 10.

[0144] The specific structure of the computing device 10 has been described in detail in the above embodiments and will not be repeated here.

[0145] A liquid storage tank 32 is provided in the cooling distribution device 30, and the liquid inlet main pipe 300 and the liquid outlet main pipe 400 are connected to the liquid storage tank 32. The cooling liquid flowing out of the liquid outlet main pipe 400 enters the liquid storage tank 32 and then enters the liquid inlet main pipe 300 of the computing device 10, and circulates in this way to dissipate heat for the computing device 10.

[0146] In the embodiment of the present application, since gaseous coolant is also discharged from the gas outlet main pipe 500 of the computing device 10, the cooling capacity distribution device 30 also includes a condenser 31. One end of the condenser 31 is connected to the gas outlet main pipe 500, and the other end of the condenser 31 is connected to the liquid storage tank 32. The gaseous coolant in the gas outlet main pipe 500 is condensed into liquid in the condenser 31 and then enters the liquid storage tank 32, and then enters the computing device 10 from the liquid inlet main pipe 300.

[0147] Please continue to see Figure 14 and Figure 15 As shown, the cooling capacity distribution device 30 also includes a subcooler 33, which is arranged between the condenser 31 and the liquid storage tank 32. The coolant flowing out of the condenser 31 and the coolant flowing out of the liquid outlet main pipe 400 both enter the subcooler 33, and the coolant is cooled by the subcooler 33, so that the temperature of the coolant entering the liquid storage tank 32 is lower.

[0148] Please continue to see Figure 14 and Figure 15 As shown, the cooling distribution device 30 further includes a pump body 34 , which is disposed between the liquid storage tank 32 and the liquid inlet main pipe 300 . The pump body 34 pumps the coolant with a lower temperature in the liquid storage tank 32 into the liquid inlet main pipe 300 .

[0149] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0150] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A computing node, characterized in that: The invention comprises a housing, a first module, a second module, and a cooling assembly, wherein the housing comprises a baffle, which is located inside the housing to divide the internal space of the housing into a first accommodating chamber and a second accommodating chamber; the cooling assembly comprises a liquid inlet interface, a liquid outlet interface, an air outlet interface, and a cold plate; the first module is located in the first accommodating chamber, the second module and the cold plate are both located in the second accommodating chamber, and the cold plate is in contact with the second module; The liquid inlet interface and the gas outlet interface are both in communication with the first accommodating cavity, and the liquid inlet interface and the liquid outlet interface are both in communication with the cold plate; the liquid inlet interface is used to inject coolant into the first accommodating cavity and to inject coolant into the cold plate, the gas outlet interface is used to discharge coolant vaporized in the first accommodating cavity; the liquid outlet interface is used to discharge coolant in the cold plate; The liquid inlet interface, the liquid outlet interface, and the gas outlet interface are all provided on a side wall of one side of the first accommodating chamber; The cooling assembly further includes a first liquid distributing pipe and a transfer pipe, wherein the transfer pipe is in communication with the liquid inlet interface, and one end of the first liquid distributing pipe is in communication with the liquid inlet interface through the transfer pipe, and the first liquid distributing pipe is used to dissipate heat for the first module; The cooling assembly further includes a second liquid distributing pipe and a liquid outlet pipe, one end of the second liquid distributing pipe is connected to the liquid inlet port through the transfer pipe, and the other end of the second liquid distributing pipe passes through the baffle to be connected to the cold plate; One end of the liquid outlet pipe is connected to the liquid outlet interface, and the other end of the liquid outlet pipe passes through the baffle to be connected to the cold plate; The coolant is used to flow through the liquid inlet interface, the transfer tube, and the second liquid distribution pipe in sequence, from the first accommodating chamber through the baffle into the cold plate of the second accommodating chamber, absorb the heat of the second module, flow out from the cold plate, pass through the baffle and be discharged through the liquid outlet pipe and the liquid outlet interface in sequence.

2. The computing node according to claim 1, wherein: The cooling assembly further includes a spray plate, and the other end of the first liquid distribution pipe is connected to the spray plate; the first module is provided with a processor, and the spray plate is located above the processor; The spray plate is provided with a spray head, and the spray head is used to spray cooling liquid onto the processor.

3. The computing node according to claim 2, wherein: A liquid level detection control valve is provided in the first accommodating chamber, and the liquid level detection control valve is connected to the first liquid distributing pipe; When the liquid level detection control valve detects that the liquid level in the first accommodating chamber is higher than a preset liquid level, the liquid level detection control valve is used to reduce the flow rate of the coolant in the first liquid distribution pipe.

4. The computing node according to claim 3, characterized in that The liquid level detection control valve includes a valve body and a float. The valve body includes a piston. The float is connected to the piston. When coolant needs to be injected into the first accommodating chamber, the piston is in a fully open state; when the coolant level in the first accommodating chamber is higher than the preset liquid level, the float floats to make the piston in a semi-open state or a closed state.

5. The computing node according to claim 4, characterized in that A liquid baffle is further provided in the first accommodating chamber. The liquid baffle is provided close to the air outlet interface, and the height of the liquid baffle is greater than the preset liquid level.

6. The computing node according to any one of claims 1 to 5, characterized in that: The first module is further provided with a memory, and one end of the memory facing the first module is immersed in the coolant. The end of the memory facing away from the first module is provided with a heat sink, and the heat sink is partially immersed in the coolant.

7. A computing device, characterized in that The device comprises a cabinet, a liquid inlet manifold, a liquid outlet manifold, a gas outlet manifold, and a plurality of computing nodes according to any one of claims 1 to 6, wherein the computing nodes are arranged along the height direction of the cabinet, and the liquid inlet manifold, the liquid outlet manifold, and the gas outlet manifold all extend along the height direction of the cabinet; The liquid inlet interface in each computing node is connected to the liquid inlet main pipe, the liquid outlet interface in each computing node is connected to the liquid outlet main pipe, and the gas outlet interface in each computing node is connected to the gas outlet main pipe.

8. A computing system, characterized in that: The device comprises a cooling distribution device and the computing device according to claim 7, wherein the cooling distribution device is used to provide cooling liquid to the computing device, the cooling distribution device comprises a condenser and a liquid storage tank, the condenser is in communication with the liquid storage tank, and the condenser is in communication with an air outlet main pipe in the computing device; The liquid storage tank is communicated with a liquid outlet main pipe and a liquid inlet main pipe in the computing device.

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