Transparent antenna preparation method, transparent antenna and terminal

Abstract

The present invention relates to the field of antenna technology, and in particular to a method for preparing a transparent antenna, a transparent antenna and a terminal. A first photoresist prepared in advance is applied on a pre-treated substrate, wherein the first photoresist contains at least copper powder; the substrate is exposed and developed to obtain a copper seed layer, wherein the copper seed layer forms a copper seed antenna pattern; a second photoresist prepared in advance is applied on a substrate having a copper seed antenna pattern, wherein the second photoresist does not contain copper powder; the substrate having a copper seed antenna pattern is exposed and developed to obtain a reverse protection layer, wherein the reverse protection layer forms a reverse protection pattern, and the reverse protection pattern is around the copper seed antenna pattern; copper is electroplated on the copper seed layer on the substrate having the reverse protection pattern to obtain a transparent antenna with small square resistance (e.g., 0.2Ω / □) and high transmittance (e.g., 86%), which is applied to a terminal, does not hinder the display of the terminal display screen and meets communication needs.

Description

Technical Field

[0001] The present invention relates to the field of antenna technology, and in particular to a transparent antenna preparation method, a transparent antenna and a terminal. Background Art

[0002] With the development of 5G and 6G communication technologies, the conversion of centimeter waves to millimeter waves and even Hertzian waves, millimeter waves have greater electromagnetic propagation losses and more obvious shielding effects than decimeter waves and centimeter waves that have been used for mobile communications. Considering that transparent antennas are easier to planarize, easier to install on buildings, vehicles, and smart mobile terminal glass, easier to quickly change beams, and more mature technology, they are often used as millimeter wave band antenna solutions, especially for handheld mobile terminals (such as mobile phones), to increase the gain of the antenna to enhance the coverage distance of wireless communications.

[0003] There are several implementation schemes for transparent antenna technology to realize the conductive material of the antenna line. With the development of antenna technology, higher requirements are placed on the resistance, transmittance and size of transparent antennas. In the existing technology, the square resistance of transparent antennas is not low enough, the transmittance is not high enough, and the wire diameter is not small enough to meet actual needs. Summary of the invention

[0004] The main purpose of the present application is to provide a method for preparing a transparent antenna, a transparent antenna and a terminal, so as to solve the problem in the prior art that the square resistance of the transparent antenna is not low enough, the transmittance is not high enough, and it cannot meet the actual needs of communication.

[0005] A first aspect of the present invention provides a method for preparing a transparent antenna, comprising:

[0006] Applying a pre-prepared first photoresist on the pre-treated substrate, wherein the first photoresist contains at least copper powder;

[0007] exposing and developing the substrate to obtain a copper seed layer, wherein the copper seed layer forms a copper seed antenna pattern;

[0008] Applying a pre-prepared second photoresist on the substrate having the copper seed antenna pattern, wherein the second photoresist does not contain copper powder;

[0009] Exposing and developing the substrate having the copper seed antenna pattern to obtain a reverse protection layer, wherein the reverse protection layer forms a reverse protection pattern, and the reverse protection pattern is around the copper seed antenna pattern;

[0010] The transparent antenna is obtained by electroplating copper on the copper seed layer on the substrate with the reverse protection pattern.

[0011] Furthermore, the first photoresist is prepared from the following raw materials in parts by mass:

[0012] 1-30 parts of copper powder, wherein the copper powder at least comprises copper powder composed of copper powder particles with a diameter between 2um and 10nm;

[0013] 10-20 parts of polymer resin;

[0014] Dispersant 0.5-1 part;

[0015] Photoinitiator 0.05-1 part;

[0016] 0.4-20 parts of developing monomer;

[0017] Additives 0.05-1 part;

[0018] 27-88 parts of organic solvent.

[0019] Furthermore, the second photoresist is prepared from the following raw materials in parts by mass:

[0020] 10-30 parts of polymer resin;

[0021] Dispersant 0.5-5 parts;

[0022] Photoinitiator 0.05-5 parts;

[0023] 0.4-30 parts of developing monomer;

[0024] Additives 0.05-1 part;

[0025] 29-88 parts of organic solvent.

[0026] Further, the polymer resin includes at least one of methyl hexanediol diacrylate, trimethylolpropane triacrylate, dipropylene glycol diacrylate, pentaerythritol triacrylate, or a mixture of any multiple thereof;

[0027] The dispersant includes at least one of hydroxyethyl methacrylate, hydroxybutyl acrylate, phenylmaleimide, maleic anhydride, pentaerythritol acrylate, or a mixture of any multiple thereof;

[0028] The photoinitiator includes at least one of 2-methyl-1-[4-methylthiophenyl]-2-morpholinepropane-2-one, 2-hydroxy-2-methyl-1-phenyl-1-propanone, and 4-methylbenzophenone;

[0029] The developing monomer includes at least one of a copolymer of methacrylic acid and methyl methacrylate;

[0030] The auxiliary agent includes at least one of a polyether-modified polydimethylsiloxane solution, a polyacrylate solution, and a fluorocarbon copolymer solution;

[0031] The organic solvent includes at least one of methyl ethyl ketone, butanone, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol dimethyl ether, and ethyl acetate, or a mixture of any multiple thereof.

[0032] Furthermore, the step of coating the pre-prepared first photoresist on the pre-treated substrate includes:

[0033] Applying a first photoresist on the substrate by slit coating;

[0034] The baked product is baked at a preset first temperature range for a preset first time period, wherein the first temperature range at least includes a temperature range of 90-130° C.

[0035] Furthermore, the step of coating the pre-prepared second photoresist on the substrate having the copper seed antenna pattern comprises:

[0036] Applying a second photoresist on the substrate having the copper seed antenna pattern by slit coating;

[0037] The baked product is baked at a preset second temperature range for a preset second time period, wherein the second temperature range at least includes a temperature range of 90-130°C.

[0038] Further, the exposing and developing the substrate to obtain a copper seed layer comprises:

[0039] Exposing the substrate under a preset photomask to obtain a copper seed layer;

[0040] Developing the substrate having the copper seed layer in a pre-prepared alkali solution for a preset third time period, wherein the alkali solution comprises at least an aqueous solution of potassium hydroxide;

[0041] The substrate having the copper seed layer is baked at a preset third temperature range for a preset fourth time period, wherein the third temperature range at least includes a temperature range of 140-150° C.

[0042] Furthermore, the step of electroplating copper on the copper seed layer of the substrate having the reverse protection pattern to obtain the transparent antenna comprises:

[0043] placing the substrate having the reverse protection pattern into an electroplating tank;

[0044] The copper seed layer on the substrate is electroplated with copper in an electroplating tank to obtain a transparent antenna.

[0045] A second aspect of the present invention provides a transparent antenna, which is prepared by using the transparent antenna preparation method as described in any one of the first aspects of the present invention.

[0046] A third aspect of the present invention provides a terminal, the terminal having the transparent antenna as described in the second aspect of the present invention, and the terminal communicates via the transparent antenna.

[0047] In the technical solution of the present invention, specifically, a pre-prepared first photoresist is coated on a pre-treated substrate, wherein the first photoresist contains at least copper powder; the substrate is exposed and developed to obtain a copper seed layer, wherein the copper seed layer forms a copper seed antenna pattern; a pre-prepared second photoresist is coated on the substrate with the copper seed antenna pattern, wherein the second photoresist does not contain copper powder; the substrate with the copper seed antenna pattern is exposed and developed to obtain a reverse protection layer, wherein the reverse protection layer forms a reverse protection pattern, and the reverse protection pattern is around the copper seed antenna pattern; copper is electroplated on the copper seed layer on the substrate with the reverse protection pattern to obtain a transparent antenna; as above, by coating, exposing and developing the first photoresist with copper powder and the second photoresist without copper powder, a copper seed layer and a reverse protection layer are formed successively, and the reverse protection pattern is around the copper seed antenna pattern, and the different thicknesses of the copper seed layer and the reverse protection layer form a groove in the metal grid area. During copper electroplating, copper grows vertically in the groove, thereby preventing copper from growing horizontally. In addition, the protective pattern can prevent water and oxygen corrosion from occurring on the side of the copper layer. Ultrafine copper powder is dispersed in a photoresist, and a copper seed layer in a metal grid area is first formed by exposure and development, and then a reverse protective pattern is formed by exposure and development of the photoresist, thereby thickening the metal grid during electroplating, and finally forming a transparent antenna with a small wire diameter (for example, 5.3um wide and 5.2um thick in the embodiment), a small square resistance (for example, 0.2Ω / □ in the embodiment), and a high transmittance (for example, 86% in the embodiment), thereby solving the problem in the prior art that the square resistance of the transparent antenna is not low enough, the transmittance is not high enough, and the actual needs of communication cannot be met. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 A schematic diagram of an embodiment of a method for preparing a transparent antenna in an embodiment of the present invention;

[0049] Figure 2 A schematic diagram of an embodiment of a transparent antenna in an embodiment of the present invention;

[0050] Figure 3 A schematic diagram of an embodiment of a terminal in an embodiment of the present invention;

[0051] Figure 4 A schematic diagram of a copper seed layer antenna pattern in an embodiment of the present invention;

[0052] Figure 5 A schematic diagram of a groove in a metal mesh region according to an embodiment of the present invention;

[0053] Figure 6A schematic diagram of a portion of a metal mesh area in an embodiment of the present invention;

[0054] Figure 7 FIG. 4 is a schematic diagram of a display screen of a terminal in an embodiment of the present invention. DETAILED DESCRIPTION

[0055] The technical solutions in the embodiments of the present invention will be described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0056] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "including" or "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0057] For ease of understanding, the specific process of the embodiment of the present invention is described below. Figure 1 , an embodiment of a method for preparing a transparent antenna in an embodiment of the present invention, the implementation steps of the method are as follows:

[0058] Step 101, coating a pre-prepared first photoresist on a pre-treated substrate, wherein the first photoresist contains at least copper powder;

[0059] In this step, the first photoresist is prepared from the following raw materials by weight:

[0060] 1-30 parts of copper powder, wherein the copper powder at least comprises copper powder composed of copper powder particles with a diameter between 2um and 10nm;

[0061] 10-20 parts of polymer resin;

[0062] Dispersant 0.5-1 part;

[0063] Photoinitiator 0.05-1 part;

[0064] 0.4-20 parts of developing monomer;

[0065] Additives 0.05-1 part;

[0066] 27-88 parts of organic solvent.

[0067] In practical applications, the polymer resin includes at least one of methyl hexanediol diacrylate, trimethylolpropane triacrylate, dipropylene glycol diacrylate, pentaerythritol triacrylate, or a mixture of any multiple thereof;

[0068] The dispersant includes at least one of hydroxyethyl methacrylate, hydroxybutyl acrylate, phenylmaleimide, maleic anhydride, pentaerythritol acrylate, or a mixture of any multiple thereof;

[0069] The photoinitiator includes at least one of 2-methyl-1-[4-methylthiophenyl]-2-morpholinepropane-2-one, 2-hydroxy-2-methyl-1-phenyl-1-propanone, and 4-methylbenzophenone;

[0070] The developing monomer includes at least one of a copolymer of methacrylic acid and methyl methacrylate;

[0071] The auxiliary agent includes at least one of a polyether-modified polydimethylsiloxane solution, a polyacrylate solution, and a fluorocarbon copolymer solution;

[0072] The organic solvent includes at least one of methyl ethyl ketone, butanone, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol dimethyl ether, and ethyl acetate, or a mixture of any multiple thereof.

[0073] The method of coating the pre-prepared first photoresist on the pre-treated substrate comprises:

[0074] Applying a first photoresist on the substrate by slit coating;

[0075] The baked product is baked at a preset first temperature range for a preset first time period, wherein the first temperature range at least includes a temperature range of 90-130° C.

[0076] Furthermore, the first time period may be set to 3 minutes or 2 minutes.

[0077] In this step, the substrate is a rigid or flexible substrate. The rigid substrate can be set to any one of glass, acrylic board, and polycarbonate board; the flexible substrate can be set to any one of polyester film (PET), polypropylene film (PP), polyvinyl chloride film (PVC), and polycarbonate film (PC).

[0078] Step 102, exposing and developing the substrate to obtain a copper seed layer, wherein the copper seed layer forms a copper seed antenna pattern;

[0079] The step of exposing and developing the substrate to obtain a copper seed layer comprises:

[0080] Exposing the substrate under a preset photomask to obtain a copper seed layer;

[0081] Developing the substrate having the copper seed layer in a pre-prepared alkali solution for a preset third time period, wherein the alkali solution comprises at least an aqueous solution of potassium hydroxide;

[0082] The substrate having the copper seed layer is baked at a preset third temperature range for a preset fourth time period, wherein the third temperature range at least includes a temperature range of 140-150° C.

[0083] Furthermore, the third time period can be set to 1 minute or 2 minutes; the fourth time period can be set to 30 minutes or 10 minutes or 3 minutes.

[0084] Step 103, coating a pre-prepared second photoresist on the substrate having the copper seed antenna pattern, wherein the second photoresist does not contain copper powder;

[0085] In this step, the second photoresist is prepared from the following raw materials in parts by mass:

[0086] 10-30 parts of polymer resin;

[0087] Dispersant 0.5-5 parts;

[0088] Photoinitiator 0.05-5 parts;

[0089] 0.4-30 parts of developing monomer;

[0090] Additives 0.05-1 part;

[0091] 29-88 parts of organic solvent.

[0092] Step 104, exposing and developing the substrate with the copper seed antenna pattern to obtain a reverse protection layer, wherein the reverse protection layer forms a reverse protection pattern, and the reverse protection pattern is around the copper seed antenna pattern;

[0093] In this step, coating the pre-prepared second photoresist on the substrate having the copper seed antenna pattern includes:

[0094] Applying a second photoresist on the substrate having the copper seed antenna pattern by slit coating;

[0095] The baked product is baked at a preset second temperature range for a preset second time period, wherein the second temperature range at least includes a temperature range of 90-130°C.

[0096] Furthermore, the second time period can be set to 3 minutes or 2 minutes.

[0097] In practical applications, the reverse protection pattern is around the copper seed antenna pattern. The different thicknesses of the copper seed layer and the reverse protection layer form a groove in the metal grid area. When electroplating copper, the copper grows vertically in this groove, avoiding the horizontal growth of copper. In addition, this protection pattern can prevent the side of the copper layer from being corroded by water and oxygen. Figure 6 As shown, Figure 6 There are black areas and white areas in the figure, the black area is a copper seed antenna pattern, the white area is a reverse protection pattern, and the copper seed antenna pattern and the reverse protection pattern constitute a metal grid area; Figure 6 The “well” pattern formed by the black part is not a limitation of the pattern, but indicates that it is Figure 4 A portion of a copper seed antenna pattern as exemplified in FIG.

[0098] The black part of the metal grid area is the concave part of the groove, and the white part is the two sides of the groove. Figure 5 As shown, the black square in the groove represents the copper seed layer, and the white square in the groove represents the reverse protection layer.

[0099] Step 105 , electroplating copper on the copper seed layer on the substrate with the reverse protection pattern to obtain a transparent antenna.

[0100] This step includes:

[0101] Placing the substrate with the reverse protection pattern into an electroplating tank, wherein the electroplating tank contains an electroplating solution, and the electroplating solution contains copper ions;

[0102] The copper seed layer on the substrate is electroplated with copper in an electroplating tank to obtain a transparent antenna, wherein the electroplating tank is powered.

[0103] In practical applications, the first photoresist can be prepared in the following manner: copper powder is evenly dispersed in a dispersion using ultrasonic vibration, and on this basis, organic solvents, additives, polymer resins, developer monomers, and photoinitiators are added in proportion in sequence, and ultrasonic vibration is used to mix evenly to obtain the first photoresist; wherein, in the specification of the present invention, "photoresist A", "A photoresist", "photoresist A1", and "photoresist A2" are all specific implementation methods of the first photoresist.

[0104] In practical applications, the first photoresist can be prepared in the following manner: adding an auxiliary agent, a polymer resin, a developing monomer, and a photoinitiator to an organic solvent in proportion in sequence, and mixing them evenly through ultrasonic vibration to obtain a second photoresist; wherein, in the specification of the present invention, "photoresist B", "B photoresist", "photoresist B1", and "photoresist B2" are all specific implementation methods of the second photoresist.

[0105] In practical applications, the corresponding beneficial effects of each component are as follows: copper powder acts on conductivity, polymer resin acts on adhesion, development, and resolution of metal grid lines; photoinitiator acts on polymer resin to react; developing monomer acts on development difficulty and resolution; additives act on leveling and foaming.

[0106] In one implementation, the method for preparing a transparent antenna includes the following steps:

[0107] Step S1, performing plasma treatment on the substrate;

[0108] Step S2, coating the substrate photoresist A (i.e., the first photoresist) on the substrate in a slit-type manner, with a dry film thickness of 0.1-0.5 um;

[0109] Step S3, baking at 90-130° C. for 3 min;

[0110] Step S4, exposing under a photomask, the A photoresist layer forms a copper seed layer with a thickness of 0.1-0.5um, and the copper seed layer forms a copper seed antenna pattern, such as Figure 4 As shown;

[0111] Step S5, developing in 0.1-0.5% KOH alkali solution for 1 min;

[0112] Step S6, baking at 140-150° C. for 30 min;

[0113] Step S7, coating the photoresist B on the substrate in a slit-type manner, with a dry film thickness of 2-15 um;

[0114] Step S8, baking at 90-130°C for 3 minutes;

[0115] Step S9, exposing under a photomask, the B photoresist layer forms a reverse protection layer with a thickness of 0.1-0.5um around the copper seed layer antenna pattern, the reverse protection layer forms a reverse protection pattern, and forms a groove in the metal grid area (because the thickness of the reverse protection layer is thicker than that of the copper seed layer, and the reverse protection layer is formed around the copper seed layer antenna pattern, the reverse protection layer and the copper seed layer form a groove, such as Figure 5 When copper is electroplated, the copper grows vertically in the groove, which prevents the copper from growing horizontally. In addition, the protective pattern can prevent water and oxygen corrosion from occurring on the side of the copper layer.

[0116] Step S10: placing the exposed and developed substrate into an electroplating tank, electroplating copper on the copper seed layer to form a final metal grid copper layer antenna of 2-12 um, that is, a transparent antenna.

[0117] In the specification of the present invention, with respect to the copper seed antenna pattern and the reverse protection pattern, it can be understood that the copper seed antenna pattern is formed by the copper seed layer, the reverse protection pattern is formed by the reverse protection layer, the thickness of the copper seed antenna pattern refers to the thickness of the copper seed layer, and the thickness of the reverse protection pattern refers to the thickness of the reverse protection layer; in the specification of the present invention, 0.3% KOH represents at least one of "an aqueous solution of potassium hydroxide with a mass concentration of 0.3%" or "a 0.3 mol / L potassium hydroxide aqueous solution".

[0118] In another implementation, a 3 mm thick transparent polycarbonate is selected as the substrate;

[0119] Preparation of photoresist A1: 100g of 50nm diameter copper powder was ground and dispersed in 710g of propylene glycol dimethyl ether by ultrasonic oscillation, and then 10g of polyether modified polydimethylsiloxane solution, 10g of pentaerythritol acrylate, 100g of trimethylolpropane triacrylate, 10g of 2-hydroxy-2-methyl-1-phenyl-1-propanone, and 60g of methacrylic acid and methyl methacrylate copolymer were added in an ultrasonic bath while stirring;

[0120] Preparation of photoresist B1: After taking 710g of propylene glycol dimethyl ether, add 10g of polyether-modified polydimethylsiloxane solution, 10g of pentaerythritol acrylate, 200g of trimethylolpropane triacrylate, 10g of 2-hydroxy-2-methyl-1-phenyl-1-propanone, and 60g of methacrylic acid and methyl methacrylate copolymer in an ultrasonic bath while stirring;

[0121] Another method for preparing a transparent antenna: after a transparent polycarbonate plate is plasma treated, the copper powder photoresist A1 on the substrate is coated on the substrate (transparent polycarbonate plate) in a slit manner, baked at 120 degrees for 3 minutes, UV exposed under a mask, and developed in a 0.3% KOH alkaline solution to form a copper seed antenna pattern with a thickness of 0.1um and a width of 5um; the copper powder photoresist B1 on the substrate is coated on the substrate in a slit manner, baked at 120 degrees for 3 minutes, UV exposed under a mask, and developed in a 0.3% KOH alkaline solution to form a reverse protection pattern of the antenna pattern with a dry film thickness of 5um, so that a groove with a depth of 5um and a width of 5um is formed in the metal grid area, and the exposed and developed substrate is placed in an electroplating tank, and copper is electroplated on the copper seed layer to form a 5um final metal grid copper layer antenna, which is recorded as antenna D1.

[0122] In yet another implementation, a 3 mm thick transparent glass is selected as the substrate;

[0123] Preparation of photoresist A2: 100g of 200nm coarse powder was ground and dispersed in 710g of propylene glycol dimethyl ether by ultrasonic oscillation, and then 10g of polyether-modified polydimethylsiloxane solution, 10g of pentaerythritol acrylate, 100g of trimethylolpropane triacrylate, 10g of 2-hydroxy-2-methyl-1-phenyl-1-propanone, and 60g of methacrylic acid and methyl methacrylate copolymer were added in an ultrasonic bath while stirring;

[0124] Preparation of photoresist B2: After taking 630g of propylene glycol dimethyl ether, add 10g of polyether-modified polydimethylsiloxane solution, 20g of pentaerythritol acrylate, 200g of trimethylolpropane triacrylate, 20g of 2-hydroxy-2-methyl-1-phenyl-1-propanone, and 120g of methacrylic acid and methyl methacrylate copolymer in sequence while stirring in an ultrasonic bath;

[0125] Another method for preparing a transparent antenna: after plasma treatment of transparent glass, the copper powder photoresist A2 on the substrate is coated on the substrate (glass) in a slit manner, baked at 120 degrees for 3 minutes, UV exposed under a mask, and developed with 0.3% KOH to form a copper seed antenna line pattern with a line thickness of 0.3um and a width of 10um; the copper powder photoresist B2 on the substrate is coated on the substrate in a slit manner, baked at 120 degrees for 3 minutes, UV exposed under a mask, and developed in 0.3% KOH alkaline solution to form a reverse protection pattern of the antenna pattern with a dry film thickness of 10um, so that a groove with a depth of 10um and a width of 10um is formed in the metal grid area, and the exposed and developed substrate is placed in an electroplating tank, and copper is electroplated on the copper seed layer to form a final metal grid copper layer antenna of 10um, which is recorded as antenna D2.

[0126] The test data of the "antenna D1" and "antenna D2" prepared based on the above implementation method are as follows:

[0127] Test items (average value) Transmittance Line Width Line depth (thickness) Line resistance Antenna D1 86％ 5.3um 5.2um 0.2Ω / □ Antenna D2 84％ 10.4um 10.6um 0.04Ω / □

[0128] By implementing the above method, a pre-prepared first photoresist is coated on a pre-treated substrate, wherein the first photoresist contains at least copper powder; the substrate is exposed and developed to obtain a copper seed layer, wherein the copper seed layer forms a copper seed antenna pattern; a pre-prepared second photoresist is coated on a substrate having a copper seed antenna pattern, wherein the second photoresist does not contain copper powder; the substrate having a copper seed antenna pattern is exposed and developed to obtain a reverse protection layer, wherein the reverse protection layer forms a reverse protection pattern, and the reverse protection pattern is around the copper seed antenna pattern; copper is electroplated on the copper seed layer on the substrate having the reverse protection pattern to obtain a transparent antenna; as above, by coating, exposing and developing the first photoresist containing copper powder and the second photoresist without copper powder, a copper seed layer and a reverse protection layer are formed successively, and the reverse protection pattern is around the copper seed antenna pattern, and the different thicknesses of the copper seed layer and the reverse protection layer form a groove in the metal grid area. During copper electroplating, copper grows vertically in the groove, thereby preventing copper from growing horizontally. In addition, the protective pattern can prevent water and oxygen corrosion from occurring on the side of the copper layer. Ultrafine copper powder is dispersed in a photoresist, and a copper seed layer in a metal grid area is first formed by exposure and development, and then a reverse protective pattern is formed by exposure and development of the photoresist, thereby thickening the metal grid during electroplating, and finally forming a transparent antenna with a small wire diameter (for example, 5.3um wide and 5.2um thick in the embodiment), a small square resistance (for example, 0.2Ω / □ in the embodiment), and a high transmittance (for example, 86% in the embodiment), thereby solving the problem in the prior art that the square resistance of the transparent antenna is not low enough, the transmittance is not high enough, and the actual needs of communication cannot be met.

[0129] Reference Figure 2 , an embodiment of the transparent antenna in the embodiment of the present invention is described in detail:

[0130] Figure 2 There is a blank box, a black box and a box with a shadow in it; wherein the blank box represents the covering layer of the transparent antenna, the black box represents the conductive line, and the box with a shadow represents the bearing layer;

[0131] The covering layer is used to protect the conductive line, wherein the covering layer can be made of transparent plastic that does not hinder signal transmission;

[0132] The conductive circuit is prepared according to any one of the above-mentioned transparent antenna preparation methods;

[0133] The bearing layer is used to establish an electrical connection between the conductive circuit and the terminal, so as to install the conductive circuit on the terminal, wherein the bearing layer can be made of a composite material of metal and UV adhesive layer;

[0134] The circuit layout in the conductive circuit can be set as follows Figure 4 The grid lines shown, Figure 4 That is Figure 2 The front view of the black square in the middle, Figure 2 The black square in the Figure 4 Side view (the front view is the view from above the grid line, and the side view is the view from the side of the grid line, Figure 2 and Figure 4 It is for illustration only and does not limit the size. The sizes of the front view and the side view are not strictly corresponding).

[0135] By implementing the above-mentioned transparent antenna, since the transparent antenna is prepared according to any one of the above-mentioned transparent antenna preparation methods, the method is carried out by coating a pre-prepared first photoresist on a pre-treated substrate, wherein the first photoresist contains at least copper powder; exposing and developing the substrate to obtain a copper seed layer, wherein the copper seed layer forms a copper seed antenna pattern; coating a pre-prepared second photoresist on the substrate with the copper seed antenna pattern, wherein the second photoresist does not contain copper powder; exposing and developing the substrate with the copper seed antenna pattern to obtain a reverse protection layer, wherein the reverse protection layer forms a reverse protection pattern, and the reverse protection pattern is around the copper seed antenna pattern; electroplating copper on the copper seed layer on the substrate with the reverse protection pattern to obtain a transparent antenna; above, by coating, exposing and developing the first photoresist with copper powder and the second photoresist without copper powder, the copper seed layer and the reverse protection layer are formed successively, and the reverse protection pattern is around the copper seed antenna pattern, and the different thicknesses of the copper seed layer and the reverse protection layer form a groove in the metal grid area. During copper electroplating, copper grows vertically in this groove, avoiding copper growth in the horizontal direction. In addition, this protective pattern can prevent water and oxygen corrosion from occurring on the side of the copper layer. Ultrafine copper powder is dispersed in a photoresist, and a copper seed layer in the metal grid area is first formed by exposure and development, and then a reverse protective pattern is formed by exposure and development of the photoresist, thereby thickening the metal grid during electroplating, and finally forming a transparent antenna with a small wire diameter (for example, 5.3um wide and 5.2um thick in the embodiment), a small square resistance (for example, 0.2Ω / □ in the embodiment), and a high transmittance (for example, 86% in the embodiment). The transparent antenna has the performance of sending and receiving wireless signals, which meets the requirements of clearer 5G network communication and real-time transmission of larger data volumes.

[0136] See also Figure 3 , an embodiment of a terminal in an embodiment of the present invention is described in detail:

[0137] The terminal can be configured as at least one of a computer, a mobile phone, a tablet, and a display with a communication function;

[0138] The terminal includes a display screen ( Figure 3Not shown), a transparent antenna 301 and a controller 302, the transparent antenna 301 is installed on the display screen, and the controller 302 is used to control the transparent antenna 301 to receive or send signals and control the display of the display screen;

[0139] Figure 7 There are solid line boxes and dotted line boxes in it, wherein the solid line box represents the display screen of the terminal, and the dotted line box represents the transparent antenna 301; Figure 7 As shown, the transparent antenna 301 is installed on the display screen;

[0140] The transparent antenna 301 is prepared according to any of the above transparent antenna preparation methods and can be set as Figure 2 The transparent antenna shown.

[0141] Through the implementation of the above-mentioned terminal, the terminal has a transparent antenna. Since the transparent antenna is prepared according to any one of the above-mentioned transparent antenna preparation methods, the method is carried out by coating a pre-prepared first photoresist on a pre-treated substrate, wherein the first photoresist contains at least copper powder; exposing and developing the substrate to obtain a copper seed layer, wherein the copper seed layer forms a copper seed antenna pattern; coating a pre-prepared second photoresist on the substrate with the copper seed antenna pattern, wherein the second photoresist does not contain copper powder; exposing and developing the substrate with the copper seed antenna pattern to obtain a reverse protection layer, wherein the reverse protection layer forms a reverse protection pattern, and the reverse protection pattern is around the copper seed antenna pattern; electroplating copper on the copper seed layer on the substrate with the reverse protection pattern to obtain a transparent antenna; in the above, by coating, exposing and developing the first photoresist with copper powder and the second photoresist without copper powder, the copper seed layer and the reverse protection layer are formed successively, and the reverse protection pattern is around the copper seed antenna pattern, and the different thicknesses of the copper seed layer and the reverse protection layer form a groove in the metal grid area. During copper electroplating, copper grows vertically in this groove, avoiding copper growth in the horizontal direction. In addition, this protective pattern can prevent water and oxygen corrosion from occurring on the side of the copper layer. Ultrafine copper powder is dispersed in a photoresist, a copper seed layer in the metal grid area is first formed by exposure and development, and then a reverse protective pattern is formed by exposure and development of the photoresist, thereby thickening the metal grid during electroplating, and finally forming a transparent antenna with a small wire diameter (for example, 5.3um wide and 5.2um thick in the embodiment), a small square resistance (for example, 0.2Ω / □ in the embodiment), and a high transmittance (for example, 86% in the embodiment). The transparent antenna is arranged on the surface of the display screen, which can effectively improve the transceiver performance of the transparent antenna for wireless signals, and meet the requirements of clearer 5G network communication and real-time transmission with larger data volume.

[0142] In practical applications, the method provided above can be implemented based on artificial intelligence technology, wherein artificial intelligence (AI) is a theory, method, technology and application system that uses digital computers or machines controlled by digital computers to simulate, extend and expand human intelligence, perceive the environment, acquire knowledge and use knowledge to obtain the best results. It can be specifically executed based on a server, which can be an independent server or a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, content delivery networks (CDN), and big data and artificial intelligence platforms. Technical personnel in the relevant field can clearly understand that for the convenience and simplicity of description, the specific working process of the above-described device and unit can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0143] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods of each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM), random access memory (RAM), disk or optical disk, etc., various media that can store program codes.

[0144] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive in all respects, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention.

Claims

1. A method for preparing a transparent antenna, characterized in that: include: coating a pre-prepared first photoresist on the pre-treated substrate, wherein the first photoresist contains at least copper powder; exposing and developing the substrate to obtain a copper seed layer, wherein the copper seed layer forms a copper seed antenna pattern; Applying a pre-prepared second photoresist on the substrate having the copper seed antenna pattern, wherein the second photoresist does not contain copper powder; Exposing and developing the substrate having the copper seed antenna pattern to obtain a reverse protection layer, wherein the reverse protection layer forms a reverse protection pattern, and the reverse protection pattern is around the copper seed antenna pattern; electroplating copper on a copper seed layer on a substrate having a reverse protection pattern to obtain a transparent antenna; The different thicknesses of the copper seed layer and the reverse protection layer form a groove in the metal grid area; when copper is electroplated, copper grows vertically in the groove.

2. The method for preparing a transparent antenna according to claim 1, characterized in that: The first photoresist is prepared from the following raw materials in parts by mass: 1-30 parts of copper powder, wherein the copper powder at least comprises copper powder composed of copper powder particles with a diameter between 2um and 10nm; 10-20 parts of polymer resin; Dispersant 0.5-1 part; Photoinitiator 0.05-1 part; 0.4-20 parts of developing monomer; Additives 0.05-1 part; 27-88 parts of organic solvent.

3. The method for preparing a transparent antenna according to claim 1, characterized in that: The second photoresist is prepared from the following raw materials in parts by mass: 10-30 parts of polymer resin; Dispersant 0.5-5 parts; Photoinitiator 0.05-5 parts; 0.4-30 parts of developing monomer; Additives 0.05-1 part; 29-88 parts of organic solvent.

4. The method for preparing a transparent antenna according to claim 2 or 3, characterized in that: The polymer resin includes at least one of methyl hexanediol diacrylate, trimethylolpropane triacrylate, dipropylene glycol diacrylate, pentaerythritol triacrylate, or a mixture of any multiple thereof; The dispersant includes at least one of hydroxyethyl methacrylate, hydroxybutyl acrylate, phenylmaleimide, maleic anhydride, pentaerythritol acrylate, or a mixture of any multiple thereof; The photoinitiator includes at least one of 2-methyl-1-[4-methylthiophenyl]-2-morpholinepropane-2-one, 2-hydroxy-2-methyl-1-phenyl-1-propanone, and 4-methylbenzophenone; The developing monomer includes at least one of a copolymer of methacrylic acid and methyl methacrylate; The auxiliary agent includes at least one of a polyether-modified polydimethylsiloxane solution, a polyacrylate solution, and a fluorocarbon copolymer solution; The organic solvent includes at least one of methyl ethyl ketone, butanone, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol dimethyl ether, and ethyl acetate, or a mixture of any multiple thereof.

5. The method for preparing a transparent antenna according to claim 1, characterized in that: The method of coating the pre-prepared first photoresist on the pre-treated substrate comprises: Applying a first photoresist on the substrate by slit coating; The baked product is baked at a preset first temperature range for a preset first time period, wherein the first temperature range at least includes a temperature range of 90-130° C.

6. The method for preparing a transparent antenna according to claim 1, characterized in that: The method of coating the pre-prepared second photoresist on the substrate having the copper seed antenna pattern comprises: Applying a second photoresist on the substrate having the copper seed antenna pattern by slit coating; The baked product is baked at a preset second temperature range for a preset second time period, wherein the second temperature range at least includes a temperature range of 90-130°C.

7. The method for preparing a transparent antenna according to claim 1, characterized in that: The step of exposing and developing the substrate to obtain a copper seed layer comprises: Exposing the substrate under a preset photomask to obtain a copper seed layer; Developing the substrate having the copper seed layer in a pre-prepared alkali solution for a preset third time period, wherein the alkali solution comprises at least an aqueous solution of potassium hydroxide; The substrate having the copper seed layer is baked at a preset third temperature range for a preset fourth time period, wherein the third temperature range at least includes a temperature range of 140-150° C.

8. The method for preparing a transparent antenna according to claim 1, characterized in that: The method of electroplating copper on a copper seed layer of a substrate having a reverse protection pattern to obtain a transparent antenna comprises: placing the substrate having the reverse protection pattern into an electroplating tank; The copper seed layer on the substrate is electroplated with copper in an electroplating tank to obtain a transparent antenna.

9. A transparent antenna, characterized in that: The transparent antenna is prepared by the transparent antenna preparation method according to any one of claims 1 to 8.

10. A terminal, characterized in that: The terminal has the transparent antenna as claimed in claim 9, and the terminal communicates via the transparent antenna.

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