A film attaching device with self-cutting function for wafer production

Abstract

The present invention discloses a film laminating device with a self-cutting function for wafer production, which relates to the field of wafer production technology. A film laminating device with a self-cutting function for wafer production comprises a support frame, wherein the support frame is rotatably connected with a feed roller, a mirror-distributed rotating shaft, a mirror-distributed first threaded rod and a rotating rod, wherein one end of the first threaded rod close to the feed roller is threadedly connected with a sliding block, wherein the mirror-distributed sliding blocks are slidably connected with a transition plate, wherein the side wall of the transition plate is slidably connected with a mirror-distributed first limiting frame, wherein the side wall of the mirror-distributed first limiting frame is slidably connected with a mirror-distributed clamping plate. The present invention clamps the edge of the film by the mirror-distributed clamping plate, and at the same time, the part clamped by the mirror-distributed clamping plate is always a complete film, so that the edge of the film is evenly stressed, and it is avoided that only the two ends of the film are stressed.

Description

Technical Field

[0001] The invention discloses a film sticking device with a self-cutting function used in wafer production, which relates to the technical field of wafer production. Background Art

[0002] Wafer is the basic material of a semiconductor chip. Since it is relatively fragile and easily damaged, it needs to be protected during wafer production or transportation to prevent its surface from being damaged. The existing way to protect wafers is to cover their surface with a thin film.

[0003] The existing steps for laminating a wafer are as follows: first, the wafer is fixed on a containing shell, then the film is dragged to the upper surface of the wafer, and then the film is squeezed. After the lamination is completed, the film is cut along the edge of the wafer. When laminating the next wafer, the cut part of the film is usually dragged. Since a part of the film at the dragging part is cut off, during the dragging process, the film may be deformed or even broken due to uneven force, which affects the efficiency of laminating and also causes waste of film materials.

[0004] Therefore, there is an urgent need to develop a film-sticking device with a self-cutting function for wafer production. Summary of the invention

[0005] The present invention provides a film attaching device with a self-cutting function for wafer production, aiming to solve the problems raised in the above background technology.

[0006] The technical solution is as follows: A film laminating device with a self-cutting function for wafer production includes a support frame, the support frame is rotatably connected with a feed roller, a mirror-distributed rotating shaft, a mirror-distributed first threaded rod and a rotating rod, the support frame is installed with a mirror-distributed servo motor, the rotating shaft and the output shaft of the adjacent servo motor are driven by a power component, the rotating shaft cooperates with the adjacent first threaded rod, one end of the first threaded rod close to the feed roller is threadedly connected with a sliding block, the mirror-distributed sliding blocks are slidably connected with a transition plate together, and the mirror-distributed sliding blocks and the transition plate are connected. The gears are fixed with springs, the side walls of the transition plate are slidably connected with a first limit frame with a mirror-distributed distribution, the side walls of the first limit frame with a mirror-distributed distribution are slidably connected with a clamping plate with a mirror-distributed distribution, the rotating rod is provided with an inclined slide groove, the sliding block close to the rotating rod is provided with a limit ball that cooperates with the inclined slide groove of the rotating rod, a one-way bevel gear is installed on the feeding roller, the rotating rod is fixed with a bevel gear that meshes with the one-way bevel gear on the feeding roller, the support frame is slidably connected with a containing shell through a bracket, the first limit frame is provided with a clamping assembly, and the support frame is provided with a transmission assembly and a winding assembly.

[0007] Preferably, the clamping assembly includes a mirror-distributed limit plate, the mirror-distributed limit plates are all fixed to the side of the transition plate away from the mirror-distributed sliding block, a first elastic member is fixed between the mirror-distributed clamping plates, the back sides of the mirror-distributed clamping plates are all provided with inclined grooves, and the limit plates cooperate with the inclined grooves of the adjacent clamping plates.

[0008] Preferably, the transmission assembly includes a first sleeve with a mirror-image distribution, the first sleeve is fixed to a side of the support frame close to the servo motor, the first sleeve is slidably connected to a first piston rod, the first piston rod is fixed to the adjacent first limiting frame on a side away from the feed roller, the support frame is fixed to a second sleeve with a mirror-image distribution on a side close to the servo motor, the second sleeve is connected to the adjacent first sleeve through a conduit, the second sleeve is slidably connected to a second piston rod, and the second piston rods with a mirror-image distribution are fixed to the containing shell on a side away from the feed roller.

[0009] Preferably, compressible gas is filled between the first sleeve and the adjacent first piston rod and between the second sleeve and the adjacent second piston rod. The first sleeve forms a connected cavity with the adjacent second sleeve through a conduit. The portion of the cavity formed by the first sleeve and the adjacent second sleeve through the conduit and located between the adjacent first piston rod and the adjacent second piston rod is in a negative pressure state.

[0010] Preferably, the material receiving assembly includes mirror-distributed guide rollers, the mirror-distributed guide rollers are all arranged on the side of the support frame away from the feeding roller, one of the guide rollers is rotatably connected to the support frame, the guide roller rotatably connected to the support frame is rotatably connected to a mirror-distributed first fixed plate, the mirror-distributed first fixed plates are all fixed to the support frame, the mirror-distributed first fixed plates are all provided with a second fixed plate, the second fixed plate is rotatably connected to another guide roller, the support frame is rotatably connected to a winding roller, and a fan is installed on the side of the support frame close to the mirror-distributed second fixed plate.

[0011] Preferably, a flattening mechanism is further included, which is arranged on the support frame and is used for extruding a film. The flattening mechanism includes a second threaded rod with a mirror-image distribution, the second threaded rod is rotatably connected to the support frame, the second threaded rods with a mirror-image distribution are commonly threadedly connected to an extrusion plate, a rectangular groove is arranged on the lower side of the extrusion plate, the extrusion plate is rotatably connected to an extrusion roller, a driven wheel is fixedly connected to the side of the second threaded rod close to the feed roller, and the rotating shaft is provided with a switching component for driving the adjacent driven wheel to rotate.

[0012] Preferably, the first fixing plate is slidably connected to the adjacent second fixing plate for adjusting the distance between the guide rollers distributed in mirror image, and a spring is fixedly connected between the first fixing plate and the adjacent second fixing plate.

[0013] Preferably, the switching assembly includes a driving wheel with a mirror-image distribution, the driving wheel is fixedly connected to the middle part of the adjacent rotating shaft, the driving wheel cooperates with the adjacent driven wheel, the rotating shaft is rotatably connected to a second limit frame, the support frame is fixedly connected to a first push rod with a mirror-image distribution, the telescopic end of the first push rod cooperates with the extrusion plate, the support frame is fixedly connected to a second push rod, the telescopic end of the second push rod cooperates with the adjacent second limit frame, the second push rod is connected to the adjacent first push rod, and compressible gas is filled inside the two, a second elastic member is fixedly connected between the second limit frame and the bracket of the support frame, the second limit frame cooperates with the containing shell, the second limit frame slidably cooperates with the bracket of the support frame, and the rotating shaft cooperates with the adjacent first threaded rod.

[0014] Preferably, a cutting mechanism is further included, which is arranged on a side of the support frame away from the servo motor, and is used to cut the film. The cutting mechanism includes a three-phase motor, which is installed on a side of the support frame away from the servo motor, and the output shaft of the three-phase motor is fixedly connected to a telescopic rod, and a third sleeve is fixedly connected to a side of the support frame close to the three-phase motor, and the third sleeve is slidably connected to a third piston rod, and the third piston rod is fixed to the telescopic rod, a spring is arranged between the third sleeve and the third piston rod, and the third piston rod is fixedly connected to a cutting knife, and the third sleeve is connected to a fourth sleeve, and the fourth sleeve is slidably connected to a fourth piston rod, and a sliding plate is fixedly connected to a side of the fourth piston rod away from the third sleeve, and the sliding plate cooperates with the extrusion plate.

[0015] Preferably, a fixing component is further included, which is arranged on the containing shell, and is used to fix the wafer. The fixing component includes an air storage shell, which is fixedly connected to the containing shell, and a cavity is arranged inside the air storage shell. The air storage shell is provided with circumferentially distributed through holes connected with the cavity inside the air storage shell. The air storage shell is slidably connected with an adsorption plate, and a third elastic member is fixedly connected between the adsorption plate and the air storage shell. The air storage shell is fixedly connected with an air duct, and the air duct is connected with the cavity of the air storage shell. A negative pressure pump is installed on the side of the support frame close to the servo motor, and the negative pressure pump is connected with the air duct.

[0016] Compared with the prior art, the present invention has the following advantages: the present invention clamps the edge of the film by means of the mirror-distributed clamping plates, and at the same time, the part clamped by the mirror-distributed clamping plates is always a complete film, so that the edge of the film is evenly stressed, and it is avoided that only the two ends of the film are stressed, causing deformation or damage to the film; by moving the extrusion plate and the extrusion roller and squeezing the film, the film is perfectly fitted on the upper surface of the wafer, and by controlling the distance between the mirror-distributed guide rollers, the distance between the mirror-distributed guide rollers is reduced, thereby offsetting the pulling force of the film movement, and preventing the two ends of the film from being fixed, causing excessive pulling and deformation of the film; by adjusting the air storage shell to a negative pressure state through a negative pressure pump, the wafer is fixed, and it is avoided that the wafer moves during the cutting process, causing its position with the film to change; by pumping gas into the air storage shell through a negative pressure pump, the processed wafer is taken out, which is convenient for the staff to take out. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a sectional view of the three-dimensional structure of the present invention; Figure 3 It is a three-dimensional structural schematic diagram of the servo motor and the components at the rotating shaft of the present invention; Figure 4 It is a three-dimensional structural schematic diagram of the components of the sliding block and the transition plate of the present invention; Figure 5 It is a three-dimensional structural exploded view of the components at the transition plate and the first limiting frame of the present invention; Figure 6 It is a schematic diagram of the three-dimensional structure of the cooperation between the containing shell and the second piston rod of the present invention; Figure 7 It is a three-dimensional structural schematic diagram of the clamping assembly of the present invention; Figure 8 It is a three-dimensional structural schematic diagram of the transmission assembly of the present invention; Fig. 9 It is a schematic diagram of the three-dimensional structure of the material receiving assembly of the present invention; Fig.10 It is a three-dimensional structural schematic diagram of the flattening mechanism of the present invention; Fig.11 It is a schematic diagram of the three-dimensional structure of the switching component of the present invention; Fig.12 It is a schematic diagram of the three-dimensional structure of the second limiting frame and the containing shell switching assembly of the present invention; Fig.13 It is a three-dimensional structural schematic diagram of the cutting mechanism of the present invention; Fig.14 It is a schematic diagram of the three-dimensional structure of the fixing assembly of the present invention.

[0018] Description of the accompanying drawings: 1-support frame, 101-clamping assembly, 102-transmission assembly, 103-material receiving assembly, 104-flattening mechanism, 105-switching assembly, 106-cutting mechanism, 107-fixing assembly, 2-feeding roller, 3-servo motor, 4-rotating shaft, 5-first threaded rod, 6-sliding block, 7-transition plate, 8-first limiting frame, 9-clamping plate, 10-rotating rod, 11-containing shell, 201-limiting plate, 202-first elastic member, 301-first sleeve, 302-first piston rod, 303-second sleeve, 304-second piston rod, 401-guide roller, 402-first fixed plate, 4 03-second fixed plate, 404-winding roller, 405-fan, 501-second threaded rod, 502-extrusion plate, 503-extrusion roller, 504-driven wheel, 601-driving wheel, 602-second limiting frame, 603-first push rod, 604-second push rod, 605-second elastic member, 701-three-phase motor, 702-telescopic rod, 703-third sleeve, 704-third piston rod, 705-cutting knife, 706-fourth sleeve, 707-fourth piston rod, 708-sliding plate, 801-air storage shell, 802-adsorption plate, 803-third elastic member, 804-air guide tube, 805-negative pressure pump. DETAILED DESCRIPTION

[0019] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments.

[0020] Example 1: A film attaching device with self-cutting function for wafer production, see Figure 1-Figure 6, including a support frame 1, a feed roller 2 is rotatably connected to the left side of the support frame 1, an uncut film is wound on the feed roller 2, two servo motors 3 distributed in mirror image are installed on the upper side of the support frame 1, two rotating shafts 4 distributed in mirror image are rotatably connected to the upper side of the support frame 1, a pulley is fixedly connected to the rotating shaft 4, a pulley is fixedly connected to the output shaft of the servo motor 3, a belt is wound around the pulley of the rotating shaft 4 and the pulley on the output shaft of the adjacent servo motor 3, the rotating shaft 4 is provided with a first threaded rod 5, the first threaded rod 5 is rotatably connected to the support frame 1, and the first threaded rod 5 is rotatably connected to the support frame 1. The left side of a threaded rod 5 is threadedly connected with a sliding block 6, and the left sides of the two sliding blocks 6 distributed in a mirror image are slidably connected with a transition plate 7, which is composed of a square plate and two round rods. The two sliding blocks 6 distributed in a mirror image are respectively fixed with springs between the adjacent round rods on the transition plate 7. The left side of the transition plate 7 is slidably connected with two first limiting frames 8 distributed in a mirror image. The first limiting frame 8 is composed of a square plate, a round rod and a disc, wherein the disc on the first limiting frame 8 limits the transition plate 7. Two limiting frames 8 are arranged on the left side of the first limiting frame 8. The slide groove, the mirror-distributed first limit frame 8 has the same height in the slide groove and is slidably connected with a clamping plate 9, which is used to clamp the film. The front side of the support frame 1 is rotatably connected with a rotating rod 10, and the rotating rod 10 is provided with an inclined slide groove. The front sliding block 6 is provided with a limiting ball. The inclined slide groove of the rotating rod 10 cooperates with the limiting ball of the adjacent sliding block 6. The sliding block 6 drives the limiting ball on it to move to the right. The limiting ball of the sliding block 6 squeezes the inclined slide groove of the rotating rod 10 to rotate the rotating rod 10. The left side of the rotating rod 10 is fixed with a bevel gear to feed the material. A one-way bevel gear is installed on the front side of the roller 2. When the sliding block 6 moves to the right, the rotating rod 10 drives the feeding roller 2 to rotate through the bevel gear set. When the sliding block 6 moves to the left, the support frame 1 is slidably connected to the containing shell 11 through the bracket. The containing shell 11 is initially located on the right side of the support frame 1. The containing shell 11 is used to place the wafer. The first limit frame 8 is provided with a clamping assembly 101 for clamping the film. The support frame 1 is provided with a transmission assembly 102 for driving the containing shell 11 to move. The support frame 1 is provided with a winding assembly 103 for winding the film.

[0021] See also Figure 7 The clamping assembly 101 includes two limit plates 201 with mirror distribution, and the limit plates 201 are L-shaped. The two limit plates 201 are fixed to the left side of the transition plate 7. The distance between the two limit plates 201 is greater than the distance between the two clamps 9. A first elastic member 202 is fixed between the two clamps 9. The first elastic member 202 is a spring, which is used to drive the two clamps 9 to return to their original positions. The back sides of the two clamps 9 are provided with inclined grooves. The limit plates 201 cooperate with the inclined grooves of the adjacent clamps 9. The limit plates 201 move to the left and squeeze the inclined grooves of the adjacent clamps 9, and the adjacent clamps 9 move under pressure.

[0022] See also Figure 4 and Figure 8The transmission assembly 102 includes two first sleeves 301 with mirror image distribution, the first sleeve 301 is a multi-stage telescopic sleeve, and a through hole is arranged on the left side of the first sleeve 301 to ensure that the adjacent first piston rod 302 moves left and right, the first sleeve 301 is fixedly connected to the upper side of the support frame 1, and the first piston rod 302 is sealed and slidably connected inside the first sleeve 301, and the right side of the first piston rod 302 is fixedly connected to the adjacent first limiting frame 8, and two second sleeves 303 with mirror image distribution are fixedly connected to the upper side of the support frame 1, the second sleeve 303 is a multi-stage telescopic sleeve, and a through hole is arranged on the right side of the second sleeve 303 to ensure that the adjacent second piston rod 304 moves left and right, the first sleeve 301 is located above the adjacent second sleeve 303, and the second sleeve 303 and the adjacent first sleeve 301 The second sleeve 303 is connected through a conduit and is sealed and slidably connected to the second piston rod 304. The left sides of the two mirror-distributed second piston rods 304 are fixedly connected to the right side of the containing shell 11. Compressible gas is filled between the first sleeve 301 and the adjacent first piston rod 302 and between the second sleeve 303 and the adjacent second piston rod 304. The first sleeve 301 forms a connected cavity with the adjacent second sleeve 303 through the conduit. The part of the cavity formed by the first sleeve 301 and the adjacent second sleeve 303 through the conduit and located between the adjacent first piston rod 302 and the adjacent second piston rod 304 is in a negative pressure state. The negative pressure state is always maintained in the first sleeve 301 and the second sleeve 303, so as to fix the adjacent first limiting frame 8 and the containing shell 11.

[0023] See also Figure 6 and Fig. 9 The material receiving assembly 103 includes two guide rollers 401 with mirror-image distribution, and the guide rollers 401 are used to guide the film. The two guide rollers 401 are both arranged on the right side of the support frame 1. The lower guide roller 401 is rotatably connected to the right side of the support frame 1. The lower guide roller 401 is rotatably connected to two first fixed plates 402 with mirror-image distribution. The two first fixed plates 402 are fixed to the support frame 1. A second fixed plate 403 is arranged on the upper side of the two first fixed plates 402. The two second fixed plates 403 with mirror-image distribution are rotatably connected to the upper guide roller 401. The support frame 1 is rotatably connected to a winding roller 404. A fan 405 is installed on the right side of the support frame 1. The fan 405 is used to blow on the surface of the wafer to ensure that there are no impurities on the surface of the wafer. The upper guide roller 401 is supported by the two first fixed plates 402 and the two second fixed plates 403.

[0024] When it is necessary to perform film lamination operation on the wafer, the staff first places the wafer on the containing shell 11, and then pulls the outer end of the film to the right to make the film pass between the two clamping plates 9, and passes the film around the two guide rollers 401. After the film passes around the upper guide roller 401, the film is pulled to the left and fixed on the winding roller 404. At this time, the preparation work is completed, and then the staff turns on the two servo motors 3. The output shafts of the two servo motors 3 respectively drive the adjacent rotating shafts 4 to rotate through the power components, and the rotating shafts 4 drive the adjacent first threaded rods 5 to rotate. The two sliding blocks 6 respectively move to the right along the threads of the adjacent first threaded rods 5, and the two sliding blocks 6 drive the transition plate 7 to move forward through their adjacent springs. When the first limit frame 8 is moved to the right, the transition plate 7 drives the two limit plates 201 to move to the right. During the movement of the limit plate 201 to the right, since the first piston rod 302 and the adjacent second piston rod 304 are in a negative pressure state, the transition plate 7 cannot drive the two first limit frames 8 to move to the right. As the transition plate 7 moves to the right, the transition plate 7 moves to the right along the first limit frame 8. At the same time, the two limit plates 201 drive the two clamping plates 9 to move toward each other under the action of the inclined grooves of the adjacent clamping plates 9. The first elastic member 202 is compressed, and the two clamping plates 9 move toward each other to clamp the film. When the transition plate 7 contacts the disk on the first limit frame 8, the transition plate 7 drives the two first limit frames 8 to move. At this time, the spring on the transition plate 7 is initially compressed.

[0025] During the movement of the sliding block 6 to the right, the front sliding block 6 drives the rotating rod 10 to rotate through the limiting ball thereon, and the rotating rod 10 drives the feeding roller 2 to rotate through the bevel gear set. During the rotation of the feeding roller 2, the feeding roller 2 releases the film thereon. At the same time, the two clamping plates 9 drive the film to move to the right, and the edges of the film are clamped by the two clamping plates 9, so that the edges of the film are subjected to uniform force, thereby preventing only the two ends of the film from being subjected to force, causing deformation or damage to the film.

[0026] After the spring on the transition plate 7 is initially compressed, when the spring force value on the transition plate 7 is greater than the negative pressure value between the first piston rod 302 and the adjacent second piston rod 304, the transition plate 7 drives the two first limit frames 8 to move to the right, and the two first limit frames 8 drive the adjacent first piston rods 302 to move to the right. The first piston rod 302 moves to the right, and under the action of pressure, the adjacent second piston rods 304 move to the left, and the two second piston rods 304 drive the containing shell 11 to move to the left and drive the wafer thereon to move to the left. In the process of the containing shell 11 moving to the left, when the containing shell 11 contacts the bracket on the support frame 1, the containing shell 11 cannot move to the left. At this time, the wafer moves to the specified cutting position, and then the staff uses the existing cutting device to cut the film.

[0027] When the staff turns on the servo motor 3, the winding roller 404 and the fan 405 are turned on synchronously, and the winding roller 404 rotates and winds up the film moving to the right. During the movement of the film, the film is released by the feeding roller 2, and then the two clamps 9 clamp the film and drive the film to move to the right. While the feeding roller 2 rotates, the winding roller 404 winds up the cut film. During the movement of the film to the right, the film bypasses the two guide rollers 401 and drives the two guide rollers 401 to rotate. During the process of the containing shell 11 driving the wafer thereon to move to the left, when the wafer is located at the lower side of the fan 405, the wind blown by the fan 405 cleans the passing wafer to prevent other impurities from adhering to it and affecting the subsequent film laminating operation.

[0028] After the film is cut, the film laminating operation for a single wafer is completed, and then the staff controls the servo motor 3 to rotate in the opposite direction, and the two sliding blocks 6 move to the left. During the movement of the sliding blocks 6 to the left, the corresponding springs on the transition plate 7 are reset. At the same time, under the action of the two first sleeves 301, the two first limit frames 8 cannot move. Then, the transition plate 7 drives the limit plate 201 to move to the left and squeezes the adjacent clamping plates 9. The two clamping plates 9 move backwards under the action of the first elastic member 202 and lose the clamping of the film. Then, the two first limit frames 8 squeeze the adjacent first piston rods 302. The first piston rod 302 moves to the left and drives the adjacent second piston rod 304 to move to the right. The two second piston rods 304 drive the containing shell 11 to move right. The containing shell 11 The wafer with the film pasted on it is driven to move to the right synchronously. After the sliding block 6 returns to its initial position, the staff turns off the servo motor 3 and the winding roller 404, takes out the processed wafer and puts in a wafer without film pasted, and then repeats the above operation to apply film to the subsequent wafer. After the film pasting is completed, the fan 405 is turned off. In the process of the two sliding blocks 6 moving to the left, the front sliding block 6 drives the rotating rod 10 to rotate in the opposite direction. Since the bevel gear on the feed roller 2 is a one-way bevel gear, the bevel gear on the feed roller 2 cannot drive the feed roller 2 to rotate. After the two sliding blocks 6 return to their original positions, the two clamps 9 are located at the uncut part of the film to avoid uneven force on the film when the two clamps 9 clamp and move the cut waste part, thereby causing damage and deformation of the film.

[0029] Example 2: Based on Example 1, please refer to Figure 10-12, also includes a flattening mechanism 104, the flattening mechanism 104 is arranged on the support frame 1, the flattening mechanism 104 is used to extrude the film, the flattening mechanism 104 includes two second threaded rods 501 with mirror distribution, the two second threaded rods 501 are rotatably connected to the upper side of the support frame 1, the two second threaded rods 501 are commonly threadedly connected with an extrusion plate 502, the extrusion plate 502 is used to extrude the film, the lower surface of the extrusion plate 502 is flush with the upper surface of the containing shell 11, both of them are in contact with the film to ensure that the film is attached to the wafer, the lower side of the extrusion plate 502 is provided with a rectangular groove, the film passes through the rectangular groove on the lower side of the extrusion plate 502, the extrusion plate The left side of 502 is rotatably connected to an extrusion roller 503, which is used to extrude the film. The lower side of the extrusion plate 502 and the surface of the extrusion roller 503 are both set to soft foam material to avoid scratching the film. The left side of the second threaded rod 501 is fixedly connected to a driven wheel 504, and the surface of the driven wheel 504 is made of rubber. The first fixed plate 402 is slidably connected to the adjacent second fixed plate 403 to adjust the distance between the mirror-distributed guide rollers 401. A spring is fixed between the first fixed plate 402 and the adjacent second fixed plate 403, and the rotating shaft 4 is provided with a switching component 105 for driving the adjacent driven wheel 504 to rotate.

[0030] See also Fig.11 and Fig.12The switching assembly 105 includes two driving wheels 601 with mirror distribution. The surface of the driving wheel 601 is made of rubber. The driving wheel 601 is fixed to the middle of the adjacent rotating shaft 4. The driving wheel 601 cooperates with the adjacent driven wheel 504. The driving wheel 601 moves to the left and fits with the surface of the adjacent driven wheel 504, so that the driving wheel 601 transmits power to the adjacent driven wheel 504. The rubber material on the surfaces of the two is used to increase the friction between the two. The middle part of the rotating shaft 4 is rotatably connected to the limiting frame 602, and the second limiting frame The support frame 602 is located on the left side of the adjacent driving wheel 601. The support frame 1 is fixedly connected to a first push rod 603 with a mirror distribution. The telescopic end of the first push rod 603 cooperates with the extrusion plate 502. The extrusion plate 502 moves to the left and squeezes the telescopic end of the first push rod 603. The telescopic end of the first push rod 603 retracts, and the gas inside it is compressed. The support frame 1 is fixedly connected to a second push rod 604. The telescopic end of the second push rod 604 cooperates with the adjacent second limiting frame 602. The second limiting frame 602 moves to the left and squeezes the telescopic end of the second push rod 604. The second push rod 604 is connected to the adjacent first push rod 603, and the two push rods are filled with compressible gas. A second elastic member 605 is fixedly connected between the second limiting frame 602 and the bracket of the support frame 1. The second elastic member 605 is a tension spring, which is used to drive the adjacent second limiting frame 602 to reset. The second limiting frame 602 cooperates with the containing shell 11, and the containing shell 11 moves to the left and squeezes the adjacent second limiting frame 602. The second limiting frame 602 moves to the right and brings The adjacent rotating shaft 4 is moved, the second limit frame 602 is slidably matched with the bracket of the support frame 1, the rotating shaft 4 is matched with the adjacent first threaded rod 5, in the initial state, the rotating shaft 4 is matched with the adjacent first threaded rod 5, when the rotating shaft 4 moves to the left, the rotating shaft 4 is rotationally connected with the adjacent first threaded rod 5, and the rotating shaft 4 cannot transmit power to the adjacent first threaded rod 5, when the rotating shaft 4 moves to the right, the rotating shaft 4 is spline-matched with the adjacent first threaded rod 5, and the rotating shaft 4 transmits power to the adjacent first threaded rod 5.

[0031] When laminating the wafer, the staff first passes the film through the rectangular groove on the lower side of the extrusion plate 502 and places the film on the lower side of the extrusion roller 503. In the process of the containing shell 11 driving the wafer to move to the left, when the containing shell 11 contacts the two second limiting frames 602, as the containing shell 11 moves to the left and squeezes the two second limiting frames 602, the two second limiting frames 602 move to the left, the two second elastic members 605 are stretched, and the two second limiting frames 602 respectively drive the adjacent rotating shafts 4 to move to the left, and the rotating shafts 4 rotate with the adjacent first threaded rods 5. The two second limiting frames 602 are dynamically connected, and the telescopic ends of the adjacent first push rods 603 are squeezed respectively. The telescopic ends of the first push rods 603 move to the left, and the gas in the first push rod 603 and the adjacent second push rod 604 is compressed. Due to the limiting effect of the squeezing plate 502 (the squeezing plate 502 is located in the thread groove of the second threaded rod 501 and cannot move), the telescopic end of the second push rod 604 cannot be extended. In the process of the rotating shaft 4 moving to the left, the rotating shaft 4 drives the adjacent driving wheel 601 to move to the left, and the driving wheel 601 contacts the adjacent driven wheel 504.

[0032] After the driven wheel 504 contacts the adjacent driving wheel 601, the staff controls the servo motor 3 to rotate, and the output shaft of the servo motor 3 drives the adjacent rotating shaft 4 to rotate through the power assembly, and the rotating shaft 4 drives the adjacent driven wheel 504 to rotate through the driving wheel 601 thereon, and the driven wheel 504 drives the adjacent second threaded rod 501 to rotate, and the two second threaded rods 501 drive the extrusion plate 502 to move right and squeeze the film downward, and when the extrusion plate 502 moves to the right and loses contact with the telescopic end of the adjacent second push rod 604, under the pressure inside the second push rod 604 and the adjacent first push rod 603, the telescopic end of the second push rod 604 extends outward, and the extrusion plate 502 drives the extrusion roller 503 to move right and squeeze the film, and as the extrusion plate 502 and the extrusion roller 503 move to the right, the extrusion plate 502 and the extrusion roller 503 squeeze the film to the upper surface of the wafer, so that the film fits the upper surface of the wafer.

[0033] Before the extrusion plate 502 and the extrusion roller 503 move to the right, since the film has not yet adhered to the surface of the wafer, and the extrusion plate 502 and the extrusion roller 503 will squeeze the film downward, the film will tend to move to the left. Since both ends of the film are restricted by the feeding roller 2 and the winding roller 404, in order to avoid the film moving to the left and causing excessive stretching and damage to the film, the specific operation is as follows: in the process of the extrusion plate 502 and the extrusion roller 503 moving to the left, the film moves to the left and drives the two clamps 9 to move to the left. The two clamps 9 drive the transition plate 7 to move to the left through the adjacent limiting plates 201 and further compress the spring on the transition plate 7. In the process of the film moving to the left, the film forms an extrusion force on the two guide rollers 401, causing the two guide rollers 401 to move toward each other, thereby causing the first fixed plate 402 to enter the interior of the adjacent second fixed plate 403. By controlling the distance between the two guide rollers 401, the distance between the two guide rollers 401 is reduced, thereby offsetting the pulling force of the film moving to the left, preventing the two ends of the film from being fixed, resulting in extrusion and deformation of the film.

[0034] After flattening the film, the staff uses the existing cutting device to cut the film on the surface of the wafer. After cutting, the staff controls the servo motor 3 to rotate in the opposite direction, so that the extrusion plate 502 and the extrusion roller 503 move in the opposite direction and reset. When the extrusion plate 502 moves to the left and squeezes the telescopic end of the second push rod 604, the telescopic end of the second push rod 604 is retracted, and its internal pressure increases, so that the telescopic end of the adjacent first push rod 603 extends out, and the telescopic end of the first push rod 603 squeezes the adjacent second limit frame 602. The second limit frame 602 moves to the right and drives the rotating shaft 4 to move to the right, so that the driving wheel 601 loses the coordination with the adjacent driven wheel 504. At the same time, the rotating shaft 4 continues to cooperate with the adjacent first threaded rod 5, and the second elastic member 605 contracts and resets.

[0035] Example 3: Based on Example 2, please refer to Figure 1 and Fig.13, also includes a cutting mechanism 106, the cutting mechanism 106 is arranged on the upper side of the support frame 1, the cutting mechanism 106 is used to cut the film, the cutting mechanism 106 includes a three-phase motor 701, the three-phase motor 701 is installed on the upper side of the support frame 1, the output shaft of the three-phase motor 701 is fixedly connected with a telescopic rod 702, the telescopic portion of the telescopic rod 702 is splined with its fixed portion, and its specific parts are not shown in the figure, the upper side of the support frame 1 is fixedly connected with a third sleeve 703, the third sleeve 703 is sealed and slidably connected with a third piston rod 704, the upper end of the third piston rod 704 is fixedly connected to the telescopic end of the telescopic rod 702, the output shaft of the three-phase motor 701 drives the third piston rod 704 to rotate through the telescopic rod 702, a spring is arranged between the third sleeve 703 and the third piston rod 704, the spring is used to drive the third piston rod 704 to reset, and the spring The spring will not affect the rotation of the third piston rod 704. The lower end of the third piston rod 704 is fixedly connected to a cutting knife 705, which is used to cut the film. The rotation radius of the cutting knife 705 is equal to the radius of the wafer. The cutting knife 705 is initially located on the upper side of the support frame 1 in order not to affect the movement of other parts. When the film is cut, the cutting knife 705 will move downward. The right side of the third sleeve 703 is connected to the fourth sleeve 706, and the fourth sleeve 706 is sealed and slidably connected to the fourth piston rod 707. The right side of the fourth piston rod 707 is fixedly connected to a sliding plate 708, which cooperates with the extrusion plate 502. When the extrusion plate 502 moves to the right, the extrusion plate 502 pushes the sliding plate 708, and the sliding plate 708 moves to the right, so that the inside of the third sleeve 703 and the fourth sleeve 706 becomes a negative pressure state.

[0036] See also Fig.14 , and also includes a fixing component 107, the fixing component 107 is arranged on the containing shell 11, the fixing component 107 is used to fix the wafer, the fixing component 107 includes an air storage shell 801, the air storage shell 801 is fixedly connected to the inside of the containing shell 11, the inside of the air storage shell 801 is provided with a cavity, the upper part of the air storage shell 801 is provided with circumferentially distributed through holes connected to the inner cavity, the middle part of the air storage shell 801 is slidably connected with an adsorption plate 802, the adsorption plate 802 is used to support the wafer, the adsorption plate 802 A third elastic member 803 is fixedly connected to the air storage shell 801. In the initial state, the adsorption plate 802 is higher than the air storage shell 801. An air duct 804 is fixedly connected to the air storage shell 801. The air duct 804 is connected to the cavity of the air storage shell 801. A negative pressure pump 805 is installed on the side of the support frame 1 close to the servo motor 3. The negative pressure pump 805 is connected to the air duct 804. When the negative pressure pump 805 extracts the gas in the cavity of the air storage shell 801 under negative pressure, the air storage shell 801 fixes the wafer through negative pressure adsorption.

[0037] When the extrusion plate 502 moves to the right to flatten the film, the staff turns on the three-phase motor 701, the output shaft of the three-phase motor 701 rotates and drives the telescopic rod 702 to rotate, the telescopic rod 702 drives the third piston rod 704 to rotate, and the third piston rod 704 drives the cutting knife 705 to rotate. When the extrusion plate 502 moving to the right contacts the sliding plate 708, as the extrusion plate 502 continues to move to the right and pushes the sliding plate 708 to move to the right, the sliding plate 708 drives the fourth piston rod 707 to move to the right, the pressure in the fourth sleeve 706 decreases, and since the third sleeve 703 and the fourth sleeve 706 are in a connected state, the pressure inside the fourth sleeve 706 decreases synchronously, the third piston rod 704 moves downward and compresses the adjacent spring, and the third piston rod 704 drives the cutting knife 705 to move downward. When the cutting knife 705 moving downward contacts the film, the cutting knife 705 cuts the film.

[0038] After the film is cut, when the extrusion plate 502 moves to the right to the end of the thread of the second threaded rod 501, the staff controls the servo motor 3 to rotate in the opposite direction and drives the extrusion plate 502 to move to the left, and at the same time makes the extrusion plate 502 lose the extrusion on the sliding plate 708. After the sliding plate 708 loses the extrusion force, under the action of the adjacent spring of the third piston rod 704, the third piston rod 704 moves upward, and the third piston rod 704 drives the cutting knife 705 to move upward. The third piston rod 704 moves upward and drives the fourth piston rod 707 to move to the left. The fourth piston rod 707 drives the sliding plate 708 to move to the left. After the extrusion plate 502 is reset, the staff turns off the servo motor 3.

[0039] After the staff places the wafer on the adsorption plate 802, the spring of the adsorption plate 802 is initially compressed, and then the staff turns on the negative pressure pump 805. The negative pressure pump 805 works and extracts the gas in the cavity of the air storage shell 801 through the air duct 804. As the negative pressure pump 805 extracts the air in the air storage shell 801, the adsorption plate 802 gradually moves downward, the third elastic member 803 is compressed, and the adsorption plate 802 drives the wafer thereon to move downward synchronously. When the wafer contacts the air storage shell 801, the wafer blocks the annular through holes on the air storage shell 801, so that the cavity in the air storage shell 801 is in a negative pressure state, and the wafer is fixed by the negative pressure adsorption force of the air storage shell 801 to ensure that the film will not be misaligned with the wafer during the flattening process.

[0040] After the film on the surface of the wafer is cut, when the containing shell 11 moves to the right and returns to its original position, the staff controls the negative pressure pump 805 to fill air into the air storage shell 801. At the same time, the wafer is pushed upward by the air and loses contact with the air storage shell 801, which makes it easier for the staff to take out the wafer. The third elastic member 803 is reset. After the wafer is taken out, the above steps are repeated to perform the film sticking operation on the subsequent wafers. After completing the film sticking work, the staff turns off all electronic components of the device.

[0041] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes may be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A film laminating device with self-cutting function for wafer production, characterized in that: The invention comprises a support frame (1), wherein the support frame (1) is rotatably connected to a feed roller (2), a mirror-distributed rotating shaft (4), a mirror-distributed first threaded rod (5) and a rotating rod (10), wherein the support frame (1) is installed with a mirror-distributed servo motor (3), wherein the rotating shaft (4) and an output shaft of an adjacent servo motor (3) are driven by a power assembly, wherein the rotating shaft (4) cooperates with an adjacent first threaded rod (5), wherein one end of the first threaded rod (5) close to the feed roller (2) is threadedly connected to a sliding block (6), wherein the mirror-distributed sliding blocks (6) are slidably connected to a transition plate (7), wherein springs are fixedly connected between the mirror-distributed sliding blocks (6) and the transition plate (7), and the side of the transition plate (7) is The wall is slidably connected to a first limit frame (8) distributed in a mirror image, and the side walls of the first limit frame (8) distributed in a mirror image are slidably connected to a clamping plate (9) distributed in a mirror image. The rotating rod (10) is provided with an inclined sliding groove, and the sliding block (6) close to the rotating rod (10) is provided with a limit ball that cooperates with the inclined sliding groove of the rotating rod (10). A one-way bevel gear is installed on the feeding roller (2), and the rotating rod (10) is fixedly connected to a bevel gear that meshes with the one-way bevel gear on the feeding roller (2). The support frame (1) is slidably connected to a containing shell (11) through a bracket, the first limit frame (8) is provided with a clamping assembly (101), and the support frame (1) is provided with a transmission assembly (102) and a winding assembly (103).

2. The film attaching device with self-cutting function for wafer production according to claim 1, characterized in that: The clamping assembly (101) comprises a mirror-distributed limiting plate (201), the mirror-distributed limiting plates (201) are all fixedly connected to a side of the transition plate (7) away from the mirror-distributed sliding block (6), a first elastic member (202) is fixedly connected between the mirror-distributed clamping plates (9), and the back sides of the mirror-distributed clamping plates (9) are all provided with inclined grooves, and the limiting plates (201) cooperate with the inclined grooves of the adjacent clamping plates (9).

3. The film attaching device with self-cutting function for wafer production according to claim 1, characterized in that: The transmission assembly (102) comprises a first sleeve (301) with a mirror image distribution, the first sleeve (301) being fixedly connected to a side of the support frame (1) close to the servo motor (3), the first sleeve (301) being slidably connected to a first piston rod (302), the side of the first piston rod (302) away from the feeding roller (2) being fixedly connected to the adjacent first limiting frame (8), the side of the support frame (1) close to the servo motor (3) being fixedly connected to a second sleeve (303) with a mirror image distribution, the second sleeve (303) being connected to the adjacent first sleeve (301) via a conduit, the second sleeve (303) being slidably connected to a second piston rod (304), the side of the second piston rod (304) with a mirror image distribution away from the feeding roller (2) being fixedly connected to the containing shell (11).

4. The film attaching device with self-cutting function for wafer production according to claim 3, characterized in that: The space between the first sleeve (301) and the adjacent first piston rod (302) and the space between the second sleeve (303) and the adjacent second piston rod (304) are filled with compressible gas. The first sleeve (301) forms a connected cavity with the adjacent second sleeve (303) through a conduit. The portion of the cavity formed by the first sleeve (301) and the adjacent second sleeve (303) through the conduit, which is located between the adjacent first piston rod (302) and the adjacent second piston rod (304), is in a negative pressure state.

5. The film attaching device with self-cutting function for wafer production according to claim 3, characterized in that: The material receiving assembly (103) comprises guide rollers (401) which are arranged in a mirror image. The guide rollers (401) which are arranged in a mirror image are all arranged on a side of the support frame (1) away from the feeding roller (2). One of the guide rollers (401) is rotatably connected to the support frame (1). The guide roller (401) which is rotatably connected to the support frame (1) is rotatably connected to a first fixed plate (402) which is rotatably connected to the support frame (1). The first fixed plates (402) which are rotatably connected to the support frame (1) are all fixedly connected to the support frame (1). The first fixed plates (402) which are rotatably distributed are all provided with a second fixed plate (403). The second fixed plate (403) is rotatably connected to another guide roller (401). The support frame (1) is rotatably connected to a winding roller (404). A fan (405) is installed on a side of the support frame (1) close to the second fixed plate (403) which is rotatably distributed.

6. The film attaching device with self-cutting function for wafer production according to claim 5, characterized in that: The invention also comprises a flattening mechanism (104), wherein the flattening mechanism (104) is arranged on the support frame (1), and the flattening mechanism (104) is used for extruding a film, and the flattening mechanism (104) comprises a second threaded rod (501) distributed in a mirror image, wherein the second threaded rod (501) is rotatably connected to the support frame (1), and the second threaded rod (501) distributed in a mirror image is commonly threadedly connected to an extrusion plate (502), and a rectangular groove is arranged on the lower side of the extrusion plate (502), and the extrusion plate (502) is rotatably connected to an extrusion roller (503), and a driven wheel (504) is fixedly connected to the side of the second threaded rod (501) close to the feeding roller (2), and the rotating shaft (4) is provided with a switching component (105) for driving the adjacent driven wheel (504) to rotate.

7. The film attaching device with self-cutting function for wafer production according to claim 5, characterized in that: The first fixing plate (402) is slidably connected to the adjacent second fixing plate (403) for adjusting the distance between the guide rollers (401) distributed in a mirror image, and a spring is fixed between the first fixing plate (402) and the adjacent second fixing plate (403).

8. The film attaching device with self-cutting function for wafer production according to claim 6, characterized in that: The switching assembly (105) comprises a driving wheel (601) with mirror-image distribution, the driving wheel (601) is fixedly connected to the middle part of the adjacent rotating shaft (4), the driving wheel (601) cooperates with the adjacent driven wheel (504), the rotating shaft (4) is rotatably connected to a second limit frame (602), the support frame (1) is fixedly connected to a first push rod (603) with mirror-image distribution, the telescopic end of the first push rod (603) cooperates with the extrusion plate (502), the support frame (1) is fixedly connected to a second push rod (604), and the second push rod The telescopic end of (604) cooperates with the adjacent second limit frame (602), the second push rod (604) is connected with the adjacent first push rod (603), and both are filled with compressible gas, a second elastic member (605) is fixed between the second limit frame (602) and the bracket of the support frame (1), the second limit frame (602) cooperates with the containing shell (11), the second limit frame (602) and the bracket of the support frame (1) are slidably matched, and the rotating shaft (4) cooperates with the adjacent first threaded rod (5).

9. The film attaching device with self-cutting function for wafer production according to claim 8, characterized in that: The cutting mechanism (106) is also included. The cutting mechanism (106) is arranged on a side of the support frame (1) away from the servo motor (3). The cutting mechanism (106) is used to cut the film. The cutting mechanism (106) includes a three-phase motor (701). The three-phase motor (701) is installed on a side of the support frame (1) away from the servo motor (3). The output shaft of the three-phase motor (701) is fixedly connected to a telescopic rod (702). The side of the support frame (1) close to the three-phase motor (701) is fixedly connected to a third sleeve (703). The third sleeve (703) slides A third piston rod (704) is connected, the third piston rod (704) is fixedly connected to the telescopic rod (702), a spring is arranged between the third sleeve (703) and the third piston rod (704), the third piston rod (704) is fixedly connected to a cutting knife (705), the third sleeve (703) is connected to a fourth sleeve (706), the fourth sleeve (706) is slidably connected to a fourth piston rod (707), the fourth piston rod (707) is fixedly connected to a sliding plate (708) on a side away from the third sleeve (703), and the sliding plate (708) cooperates with the extrusion plate (502).

10. The film attaching device with self-cutting function for wafer production according to claim 9, characterized in that: The invention also comprises a fixing component (107), the fixing component (107) being arranged on the containing shell (11), the fixing component (107) being used to fix the wafer, the fixing component (107) comprising an air storage shell (801), the air storage shell (801) being fixedly connected to the containing shell (11), the air storage shell (801) being provided with a cavity inside, the air storage shell (801) being provided with through holes distributed in the circumferential direction and communicating with the cavity inside the air storage shell (801), and the air storage shell (801) being provided with a plurality of through holes connected to the cavity inside the air storage shell (801). ) is slidably connected with an adsorption disk (802), a third elastic member (803) is fixedly connected between the adsorption disk (802) and the air storage shell (801), an air guide tube (804) is fixedly connected to the air storage shell (801), and the air guide tube (804) is connected to the cavity of the air storage shell (801), and a negative pressure pump (805) is installed on the side of the support frame (1) close to the servo motor (3), and the negative pressure pump (805) is connected to the air guide tube (804).

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