Display module and display device

Abstract

Embodiments of the present disclosure provide a display module and a display device, and relate to the technical field of display, which are used for improving the interference between components and other components, and improving the assembly yield of the display module. The display module comprises a display panel; a flexible circuit board connected with the display panel and located at a non-light-emitting side of the display panel; a groove is arranged on a side of the flexible circuit board close to the display panel; a plurality of components are arranged on the flexible circuit board; at least part of the components are located on the side of the flexible circuit board close to the display panel and in the groove. The display module is used for displaying images.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] With the advancement of technology, display devices are becoming increasingly thinner and lighter, leading to more compact assembly spaces. This often results in internal interference during assembly, causing internal components to break due to collisions. For example, internal interference between components and other parts can cause component breakage, thus affecting the display performance. Summary of the Invention

[0003] The purpose of the embodiments disclosed herein is to provide a display module and display device to improve the problem of interference between components and other parts, and to improve the overall assembly yield of the display module.

[0004] To achieve the above objectives, the embodiments of this disclosure provide the following technical solutions:

[0005] On one hand, a display module is provided. The display module includes a display panel, a flexible circuit board, and multiple components. The flexible circuit board is connected to the display panel and is located on the non-light-emitting side of the display panel; a groove is provided on the side of the flexible circuit board near the display panel; multiple components are disposed on the flexible circuit board; at least some of the components are located on the side of the flexible circuit board near the display panel and are located within the groove.

[0006] In the aforementioned display module, by providing a recess on the side of the flexible circuit board near the display panel to accommodate at least some components, thus providing space for these components, the probability of interference between components and other parts during the assembly process is reduced, improving the overall assembly yield. Furthermore, since at least some components are located within the recess, the excessive thickness of these components avoids increasing the overall thickness of the display module, contributing to a thinner and lighter display module.

[0007] In some embodiments, the display module further includes: a heat dissipation layer located between the flexible circuit board and the display panel; the heat dissipation layer has an opening, the opening being oriented toward the flexible circuit board; along the thickness direction of the display module, the opening is disposed opposite to the groove, the opening and the groove forming a receiving cavity for accommodating at least a portion of the components.

[0008] In some embodiments, the plurality of components includes: at least one first type of component and at least one second type of component, wherein the thickness of the second type of component is greater than the thickness of the first type of component; at least one first type of component is located within the receiving cavity, and the thickness of the first type of component is less than or equal to the height of the receiving cavity along the thickness direction of the display module.

[0009] In some embodiments, the display module further includes a buffer layer located between the flexible circuit board and the heat dissipation layer, the buffer layer having a through hole, the through hole being disposed opposite to the groove and opposite to the opening along the thickness direction of the display module, the groove, the through hole and the opening forming the receiving cavity.

[0010] In some embodiments, the plurality of components include: at least one first type of component and at least one second type of component, wherein the thickness of the second type of component is greater than the thickness of the first type of component; at least one second type of component is located within the receiving cavity, and the thickness of the second type of component is less than or equal to the height of the receiving cavity along the thickness direction of the display module.

[0011] In some embodiments, the display module further includes a support portion located within the groove, the support portion dividing the groove into multiple sub-regions, each sub-region having at least one of the components disposed therein.

[0012] In some embodiments, the side of the support portion near the flexible circuit board abuts against the bottom of the groove; the opening penetrates the heat dissipation layer, and the side of the support portion away from the flexible circuit board passes through the opening and abuts against the display panel.

[0013] In some embodiments, the support portion includes a first support bar and a second support bar, wherein the first support bar and the second support bar are arranged intersectingly to divide the groove into the plurality of sub-regions.

[0014] In some embodiments, the plurality of sub-regions include a first sub-region and a second sub-region, and the plurality of components include a first type of component and a second type of component, wherein the first type of component is disposed in the first sub-region and the second type of component is disposed in the second sub-region.

[0015] In some embodiments, there are multiple first sub-regions, and the number of the first type of components disposed in each first sub-region is the same.

[0016] In some embodiments, the support portion is electrically connected to the display panel and also electrically connected to the flexible circuit board.

[0017] In some embodiments, the support portion includes: a first conductive portion electrically connected to the flexible circuit board; a second conductive portion located on the side of the first conductive portion away from the flexible circuit board, the second conductive portion being electrically connected to the first conductive portion; the display module includes a heat dissipation layer, the second conductive portion being electrically connected to and integrally disposed with the heat dissipation layer, and the heat dissipation layer being electrically connected to the display panel.

[0018] In some embodiments, the material of the first conductive portion includes conductive foam.

[0019] In some embodiments, the flexible circuit board includes multiple conductive layers stacked together, and a first protective layer and a second protective layer located on both sides of the multiple conductive layers in the stacking direction, wherein the second protective layer is closer to the display panel than the first protective layer; the bottom of the groove is the conductive layer in the multiple conductive layers that is closest to the first protective layer.

[0020] On the other hand, a display device is provided. The display device includes: a display module as described in any of the above embodiments;

[0021] The above-described display device has the same structure and beneficial technical effects as the display module provided in some of the above embodiments, and will not be described again here. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not a limitation on the actual size of the products involved in the embodiments of this disclosure.

[0023] Figure 1 This is a structural diagram of a display device according to some embodiments;

[0024] Figure 2 This is a structural diagram of a display module according to some embodiments;

[0025] Figure 3 This is a top view of a display module according to some embodiments;

[0026] Figure 4 This is a top view of a heat dissipation layer according to some embodiments;

[0027] Figure 5 This is a top view of another heat dissipation layer according to some embodiments;

[0028] Figure 6This is a structural diagram of another display module according to some embodiments;

[0029] Figure 7 This is a top view of yet another display module according to some embodiments;

[0030] Figure 8 This is a partial top view of a display module according to some embodiments;

[0031] Figure 9 This is a partial top view of yet another display module according to some embodiments;

[0032] Figure 10 This is a structural diagram of a first conductive part according to some embodiments;

[0033] Figure 11 This is a partial view of a display module according to some embodiments;

[0034] Figure 12 This is a structural diagram of another display module according to some embodiments;

[0035] Figure 13 This is a structural diagram of another display module according to some embodiments. Detailed Implementation

[0036] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0037] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0038] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0039] In describing some embodiments, the terms "coupled" and "connected," and their derivative expressions, may be used. The term "connected" should be interpreted broadly; for example, a "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection via an intermediate medium. The term "coupled," for example, indicates that two or more components have direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0040] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0041] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0042] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0043] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0044] Some embodiments of this disclosure provide a display device that can be any display device that displays images, whether moving (e.g., video) or stationary (e.g., still images), and whether text or images. More specifically, the display device of the embodiments is contemplated to be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controllers and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0045] Figure 1 This is a structural diagram of a display device according to some embodiments. For example... Figure 1 As shown, the display device 1000 includes a frame 100, a cover plate 200, a display module 300, and other electronic accessories including a camera.

[0046] The frame 100 has a U-shaped longitudinal section. The display module 300 and other electronic components, including a camera, are housed within the frame 100. The cover plate 200 is located on the light-emitting side of the display module 300. The side of the display module 300 used for displaying images is the light-emitting side, and the side facing away from the light-emitting side is the non-light-emitting side.

[0047] This disclosure provides a display module 300 in some embodiments, which can be applied to the display device 1000 described above. Of course, it can also be applied to other display devices, and this disclosure does not limit it.

[0048] like Figure 2 As shown, the display module 300 includes a display panel 10, a flexible circuit board 20, and multiple components 30.

[0049] The display panel 10 can be an OLED (Organic Light Emitting Diode) display panel, a QLED (Quantum Dot Light Emitting Diodes) display panel, or the like. This disclosure does not specifically limit the embodiments in this regard. This disclosure uses an OLED display panel as an example for illustration.

[0050] The flexible circuit board 20 is electrically connected to the display panel 10 and is located on the non-light-emitting side of the display panel 10. The flexible circuit board 20 is used to provide driving signals to the display panel 10, thereby ensuring the normal display of the display panel 10. The side of the display panel 10 used to display the image is the light-emitting side, and the non-light-emitting side of the display panel 10 is the side of the display panel 10 opposite to the light-emitting side.

[0051] In some examples, the flexible circuit board 20 is configured as the main flexible printed circuit (MFPC) of the display module 300.

[0052] Multiple components 30 are disposed on the flexible circuit board 20. The multiple components 30 are electrically connected to the flexible circuit board 20.

[0053] For example, the multiple components 30 can be capacitors, resistors, inductors, chips, potentiometers, vacuum tubes, or switches, etc. For instance, when the display module 300 is a display module with touch functionality, the component 30 can be a touch integrated circuit (TIC). Of course, the component 30 can also include other components, and the embodiments of this disclosure do not limit this.

[0054] Furthermore, multiple components 30 can be fixedly connected to the flexible circuit board 20 by means of welding, mounting, or fasteners. Without external force, the relative positions of the two fixedly connected structures remain fixed and will not change.

[0055] In some implementations, multiple components 30 are disposed on the side of the flexible circuit board 20 away from the display panel 10. In this case, the total thickness of the display module 300 is equal to the sum of the thickness of the display panel 10, the thickness of the flexible circuit board 20, and the thickness of the components 30. The overall thickness of the display module 300 is relatively large.

[0056] It is understandable that when multiple components 30 are disposed on the side of the flexible circuit board 20 away from the display panel 10, the area of ​​the flexible circuit board 20 used to dispose of the components 30 has a relatively large overall thickness.

[0057] When the display device 1000 is relatively thin and the overall assembly space is small, the greater the overall thickness of the display module 300, the greater the probability of interference between the component 30 and other parts during the assembly process.

[0058] Furthermore, when the display device 1000 is a mobile terminal (e.g., a mobile phone), the display device 1000 also includes a battery disposed on one side of the display module 300. With a fixed overall assembly space, the greater the thickness of the display module 300, the smaller the space in the display device 1000 that can accommodate the battery, which will affect the battery life of the mobile phone.

[0059] Based on this, in the embodiments of this disclosure, such as Figure 2 As shown, the flexible circuit board 20 has a groove 21 on the side near the display panel 10, and at least some of the components 30 are located in the groove 21.

[0060] The number of grooves 21 can be one or more, and the embodiments disclosed herein do not limit this.

[0061] It is understood that the flexible circuit board 20 includes multiple conductive layers, and the bottom of the groove 21 can be any one of the multiple conductive layers. The embodiments disclosed herein do not limit this.

[0062] In some examples, such as Figure 2 and Figure 3 As shown, some components 30 are located within the recess 21, while others are located on the side of the flexible circuit board 20 away from the display panel 10. In other examples, multiple components 30 may all be located within the recess 21. The embodiments disclosed herein are not limited in this respect.

[0063] In the embodiments of this disclosure, by providing a groove 21 for accommodating at least some components 30 on the side of the flexible circuit board 20 near the display panel 10, i.e., providing accommodating space for these components 30, the probability of interference between components 30 and other parts during the assembly process is reduced, thereby improving the overall assembly yield. Furthermore, since at least some components 30 are located within the groove 21, the problem of increased display module thickness due to excessive thickness of these components 30 is avoided, which is beneficial for the thinning of the display module 300.

[0064] Furthermore, given a fixed overall assembly space for the display device 1000, reducing the thickness of the display module 300 increases the space available for accommodating the battery within the display device 1000, allowing for the storage of a larger number of battery cells and thus improving the battery life of the display device 1000.

[0065] In some embodiments, such as Figure 2As shown, the display module 300 also includes a heat dissipation layer 40 located between the flexible circuit board 20 and the display panel 10; the heat dissipation layer 40 is provided with an opening 41, the opening 41 being oriented toward the flexible circuit board 20; along the thickness direction of the display module 300, the opening 41 and the groove 21 are arranged opposite to each other, and the opening 41 and the groove 21 form a receiving cavity R for accommodating at least some of the components 30.

[0066] The heat dissipation layer 40 is attached to the back of the display panel 10 and is configured to dissipate the heat generated when the display panel 10 is working, so as to prevent heat from accumulating on the display panel 10 and reduce the risk of the display panel 10 being burned.

[0067] For example, the heat dissipation layer 40 includes a thermally conductive material (hereinafter referred to as thermally conductive material), which is meant to represent a material generally referred to as a good thermal conductor or known to have heat transfer properties. For example, the heat dissipation layer 40 may include a thermally conductive metallic material; for example, it may include metals such as copper (Cu), gold (Au), silver (Ag), aluminum (Al), magnesium (Mg), or nickel (Ni), or an alloy containing at least one of the above metals. In another example, the heat dissipation layer 40 may include a thermally conductive carbon-based material; for example, it may include graphite, diamond, carbon fiber, etc. In addition, the heat dissipation layer 40 may include a thermally conductive polymer material, such as thermal grease. Of course, the heat dissipation layer 40 is not limited to the above materials, and may include combinations of the above materials or other materials not mentioned above.

[0068] For example, the heat dissipation layer 40 can be configured as one or more layers. For instance, the heat dissipation layer 40 includes a connecting layer, a buffer layer, and a conductive layer stacked sequentially. The connecting layer may be made of, for example, EMBO. The buffer layer is closer to the display panel 10 than the conductive layer and can buffer the stress acting on the display panel 10. For example, the buffer layer may be made of foam. The conductive layer may be made of copper (Cu).

[0069] For example, the thickness of the heat dissipation layer 40 can range from 0.11 mm to 0.21 mm. For instance, the thickness of the heat dissipation layer 40 can be 0.11 mm, 0.13 mm, 0.16 mm, 0.19 mm, 0.21 mm, etc. The embodiments disclosed herein do not limit this.

[0070] Furthermore, the opening 41 on the heat dissipation layer 40 can be a through opening or a groove. The embodiments of this disclosure do not limit this. For example, the opening 41 on the heat dissipation layer 40 can be a through opening, such as... Figure 2 , Figure 4 and Figure 5 As shown.

[0071] It is understandable that when the opening 41 on the heat dissipation layer 40 is a through opening, the height of the opening 41 in the thickness direction of the display module 300 is equal to the thickness of the heat dissipation layer 40.

[0072] When an opening 41 opposite to the groove 21 is provided on the heat dissipation layer 40, the height of the receiving cavity R in the thickness direction of the display module 300 is equal to the sum of the height of the groove 21 and the height of the opening 41. For example, in the thickness direction of the display module 300, the height of the groove 21 is 0.239 mm, the height of the opening on the heat dissipation layer 40 is 0.16 mm, and the height of the receiving cavity R formed by the opening 41 and the groove 21 is 0.399 mm. In this case, components with a thickness less than or equal to 0.399 mm can be placed in the receiving cavity R.

[0073] For example, the orthographic projection of the opening 41 on the heat dissipation layer 40 onto the display panel 10 coincides with the orthographic projection of the recess 21 onto the display panel 10. Also for example, the orthographic projection of the opening 41 on the heat dissipation layer 40 onto the display panel 10 lies within the orthographic projection of the recess 21 onto the display panel 10. Still for example, the orthographic projection of the recess 21 onto the display panel 10 lies within the orthographic projection of the opening 41 on the heat dissipation layer 40 onto the display panel 10. The embodiments disclosed herein are not limited in this respect.

[0074] It is understandable that there are differences in thickness between different components 30. In this embodiment, by providing an opening 41 on the heat dissipation layer 40 that is opposite to the groove 21, and the opening 41 and the groove 21 forming a receiving cavity R for accommodating at least some of the components 30, the thickness of the space that can accommodate the components 30 is increased. This allows the components 30 with larger thickness (e.g., components with a thickness greater than the height of the groove 21 and a thickness less than or equal to the height of the receiving cavity R) to be placed in the receiving cavity R, thereby avoiding interference between these components 30 and other parts during the assembly process and improving the overall assembly yield.

[0075] In some embodiments, such as Figure 2 As shown, the component 30 includes at least one first type component 31 and at least one second type component 32. The thickness of the second type component 32 is greater than the thickness of the first type component 31. At least one first type component 31 is located in the receiving cavity R, and the thickness of the first type component 31 is less than or equal to the height of the receiving cavity R along the thickness direction of the display module 300.

[0076] For example, the first type of component 31 can be a capacitor or a resistor. It is understood that, compared to other components, capacitors and resistors are relatively thin. Commonly used capacitors and resistors are approximately 0.3 mm thick.

[0077] For example, the second type of component 32 can be a TIC. It is understood that the thickness of a TIC is relatively large compared to other components. The thickness of a commonly used TIC is approximately 0.5 mm.

[0078] When the opening 41 and the groove 21 form a receiving cavity R with a height of approximately 0.399 mm, the thicker second type of component 32 (e.g., TIC) can be disposed on the side of the flexible circuit board 20 away from the display panel 10, such as... Figure 2 and Figure 3 As shown.

[0079] By setting the first type of component 31 with a smaller thickness in the cavity R formed by the opening 41 and the groove 21, interference between the first type of component 31 and other components can be avoided during the assembly of the whole machine, thereby improving the overall assembly yield.

[0080] In some embodiments, such as Figure 6 As shown, the display module 300 also includes a buffer layer 50 located between the flexible circuit board 20 and the heat dissipation layer 40. The buffer layer 50 is provided with a through hole 51. Along the thickness direction of the display module 300, the through hole 51 is disposed opposite to the groove 21 and opposite to the opening 41. The groove 21, the through hole 51 and the opening 41 form a receiving cavity R.

[0081] In some examples, the buffer layer 50 can be made of foam, i.e., the buffer layer 50 is a foam layer. The buffer layer 50 can be used to buffer the stress acting on the display panel 10 to protect the display panel 10. In other examples, the buffer layer 50 is an adhesive layer, in which case the buffer layer 50 can be directly bonded to the flexible circuit board 20 and the heat dissipation layer 40. That is, the buffer layer 50 can both buffer and release impact force and allow the flexible circuit board 20 and the heat dissipation layer 40 to be directly bonded, resulting in a simple structure and low cost. Of course, the buffer layer 50 can also be made of other materials, and the embodiments of this disclosure are not limited in this regard.

[0082] For example, the thickness of the buffer layer 50 can range from 0.15 mm to 0.25 mm. For instance, the thickness of the buffer layer 50 can be 0.15 mm, 0.17 mm, 0.20 mm, 0.23 mm, 0.25 mm, etc. The embodiments disclosed herein do not limit this.

[0083] It is understandable that, in the thickness direction of the display module 300, the height of the through hole 51 is equal to the thickness of the buffer layer 50.

[0084] When the display module 300 includes both a heat dissipation layer 40 with an opening 41 and a buffer layer 50 with a through hole 51, the height of the receiving cavity R in the thickness direction of the display module 300 is equal to the sum of the height of the groove 21, the height of the opening 41, and the height of the through hole 51. For example, in the thickness direction of the display module 300, the height of the groove 21 is 0.239 mm, the height of the opening on the heat dissipation layer 40 is 0.16 mm, the height of the through hole 51 is 0.20 mm, and the height of the receiving cavity R formed by the groove 21, the through hole 51, and the opening 41 is 0.599 mm. In this case, components with a thickness less than or equal to 0.599 mm can be placed in the receiving cavity R.

[0085] For example, the orthographic projection of the through hole 51 on the display panel 10 coincides with the orthographic projection of the recess 21 on the display panel 10. Also for example, the orthographic projection of the through hole 51 on the display panel 10 lies within the orthographic projection of the recess 21 on the display panel 10. Again for example, the orthographic projection of the recess 21 on the display panel 10 lies within the orthographic projection of the through hole 51 on the display panel 10. The embodiments disclosed herein are not limited in this respect.

[0086] For example, the orthographic projection of the through hole 51 on the display panel 10 coincides with the orthographic projection of the opening 41 on the display panel 10. Also for example, the orthographic projection of the through hole 51 on the display panel 10 lies within the orthographic projection of the opening 41 on the display panel 10. Again for example, the orthographic projection of the opening 41 on the display panel 10 lies within the orthographic projection of the through hole 51 on the display panel 10. The embodiments disclosed herein are not limited in this respect.

[0087] In this embodiment, by providing a buffer layer 50 with a through hole 51 between the flexible circuit board 20 and the heat dissipation layer 40, the groove 21 of the flexible circuit board 20, the through hole 51, and the opening 41 of the heat dissipation layer 40 together form a receiving cavity R, which increases the height of the receiving cavity R and the height of the space that can accommodate the components 30. This allows the components 30 with larger thickness (for example, components 30 with a thickness greater than the sum of the height of the groove 21 and the height of the opening 41) to be placed in the receiving cavity R, which can further reduce the thickness of the display module 300. This reduces the probability of interference between the components 30 and other components during the assembly process, improves the overall assembly yield, and improves the display effect of the display module 300.

[0088] In some embodiments, such as Figure 6 As shown, when the groove 21, the through hole 51 and the opening 41 form a receiving cavity R, at least one second type of component 32 is located in the receiving cavity R, and the thickness of the second type of component 32 is less than or equal to the height of the receiving cavity R along the thickness direction of the display module 300.

[0089] For example, the second type of component 32 can be a TIC. It is understood that the thickness of a TIC is relatively large compared to other components. The thickness of a commonly used TIC is approximately 0.5 mm.

[0090] As can be seen from the above, the thickness of the second type of component 32 is greater than the thickness of the first type of component 31. Given that the height of the receiving cavity R is large enough to accommodate the second type of component 32, the receiving cavity R must also be able to accommodate the thinner first type of component 31. For example, combined with... Figure 6 and Figure 7 As shown, the first type of component 31 and the second type of component 32 are located within the receiving cavity R. In some other embodiments, when at least one second type of component 32 is located within the receiving cavity R, the first type of component 31 may be located on the side of the flexible circuit board 20 away from the display panel 10. The embodiments of this disclosure are not limited in this respect.

[0091] By setting the above, the thicker second type of component 32 is placed in the receiving cavity R formed by the through hole 51, the opening 41, and the groove 21, which further reduces the thickness of the display module 300. This improves the problem that the second type of component 32 is prone to interference with other components during the assembly process, and improves the overall assembly yield.

[0092] In some embodiments, such as Figure 3 , Figure 6 as well as Figure 7 As shown, the display module 300 also includes a support portion 60 located in the groove 21, the support portion 60 dividing the groove 21 into a plurality of sub-regions 21A, and each sub-region 21A is provided with at least one component 30.

[0093] For example, the number of sub-regions 21A can be two, three, four, five, or more. The embodiments of this disclosure do not limit this. For example, as... Figure 3 As shown, the number of sub-regions 21A is four. For example, as... Figure 7 As shown, there are five sub-regions 21A.

[0094] The number of components 30 disposed within each sub-region 21A can be one, two, or more. The embodiments of this disclosure do not impose this limitation. For example, as... Figure 3 As shown, the number of components 30 disposed within sub-region 21A is four. For example, as... Figure 7 As shown, the number of components 30 set in a certain sub-region 21A is one.

[0095] Furthermore, the number of components 30 disposed in the multiple sub-regions 21A can be the same or different. The embodiments of this disclosure do not limit this. For example, the number of components 30 disposed in the multiple sub-regions 21A may be the same, such as... Figure 3 As shown. For example, such as... Figure 7 As shown, the number of components 30 set in 21A is the same in some sub-regions, while the number of components 30 set in 21A is different in some sub-regions.

[0096] It is understandable that the grooves 21 on the flexible circuit board 20 for accommodating the components 30 may result in insufficient rigidity of the flexible circuit board 20, which may cause it to sag. In addition, since the components 30 have their own weight, the flexible circuit board 20 may also sag under the combined effect of its own weight and the weight of the components 30.

[0097] By adopting the above configuration, the support part 60 supports the flexible circuit board 20, which can improve the problem that the flexible circuit board 20 may sag due to insufficient rigidity or under the action of gravity, and reduce the probability of deformation of the flexible circuit board 20.

[0098] In some embodiments, such as Figure 6 As shown, the side of the support portion 60 closest to the flexible circuit board 20 abuts against the bottom of the groove 21; the opening 41 penetrates the heat dissipation layer 40, and the side of the support portion 60 furthest from the flexible circuit board 20 passes through the opening 41 and abuts against the display panel 10.

[0099] For example, the support portion 60 can be fixed to the bottom of the groove 21 by fitting together.

[0100] For example, the height of the support portion 60 can be equal to the height of the receiving cavity R. For instance, in the case where the receiving cavity R is surrounded by the opening 41 and the groove 21, the height of the support portion 60 can be equal to the sum of the height of the groove 21 and the height of the opening 41. As another example, when the display module 300 includes both a heat dissipation layer 40 with an opening 41 and a buffer layer 50 with a through hole 51, the height of the support portion 60 can be equal to the sum of the height of the groove 21, the height of the opening 41, and the height of the through hole 51.

[0101] In this embodiment, the support portion 60 is located between the flexible circuit board 20 and the display panel 10, and abuts against both the flexible circuit board 20 and the display panel 10, thereby better supporting the flexible circuit board 20 and further reducing the probability of deformation of the flexible circuit board 20.

[0102] In some embodiments, such as Figure 8 and Figure 9As shown, the support portion 60 includes a first support bar 61 and a second support bar 62, which are arranged intersectingly to divide the groove 21 into multiple sub-regions 21A.

[0103] For example, the first support bar 61 extends along a first direction X, and the second support bar 62 extends along a second direction Y. The second direction Y intersects the first direction X. The angle between the first direction X and the second direction Y can be selected according to actual needs. For example, the angle between the first direction X and the second direction Y can be 85°, 88°, or 90°, etc.

[0104] The number of first support bars 61 can be one or more, and the number of second support bars 62 can be one or more; the embodiments disclosed herein do not impose any limitations on this. For example, as... Figure 8 As shown, there is one first support bar 61 and one second support bar 62. The first support bar 61 and the second support bar 62 are intersected in a "+" shape, dividing the groove 21 into four sub-regions 21A. For example, as... Figure 9 As shown, there is one first support bar 61 and two second support bars 62. The first support bars 61 and the second support bars 62 are arranged in an intersecting manner, dividing the groove 21 into five sub-regions 21A.

[0105] In some examples, the two ends of the first support bar 61 abut against the sidewall of the groove 21. The two ends of the second support bar 62 abut against the sidewall of the groove 21.

[0106] Furthermore, the side of the first support bar 61 closest to the flexible circuit board 20 can abut against the bottom of the groove 21; the side of the first support bar 61 furthest from the flexible circuit board 20 can abut against the display panel 10. At this time, the contact area between the first support bar 61 and the flexible circuit board 20 is equal to the area of ​​the side of the first support bar 61 closest to the flexible circuit board 20.

[0107] The side of the second support bar 62 closest to the flexible circuit board 20 can abut against the bottom of the groove 21; the side of the second support bar 62 furthest from the flexible circuit board 20 can abut against the display panel 10. At this time, the contact area between the second support bar 62 and the flexible circuit board 20 is equal to the area of ​​the side of the second support bar 62 closest to the flexible circuit board 20.

[0108] In some implementations, the support 60 is a columnar structure, and the contact area between the support 60 and the flexible circuit board 20 is the area of ​​the end face of the columnar support near the flexible circuit board 20.

[0109] In the embodiments disclosed herein, the support portion 60 includes a first support bar 61 and a second support bar 62. Compared to the columnar support portion, the support portion 60 has a larger contact area with the flexible circuit board 20, which can improve the support effect of the support portion 60 on the flexible circuit board 20.

[0110] In some embodiments, such as Figure 9 As shown, the multiple sub-regions 21A include a first sub-region 21AA and a second sub-region 21AB. A first type of component 31 is disposed in the first sub-region 21AA, and a second type of component 32 is disposed in the second sub-region 21AB.

[0111] The number of first sub-regions 21AA and the number of second sub-regions 21AB can be one or more. The number of first sub-regions 21AA and the number of second sub-regions 21AB can be equal or unequal. The embodiments of this disclosure do not limit this. For example, the number of first sub-regions 21AA and the number of second sub-regions 21AB are unequal. Figure 9 As shown, the multiple sub-regions 21A include four first sub-regions 21AA and one second sub-region 21AB.

[0112] In this embodiment, the support portion 60 is used to divide the groove 21 into sections, and the same type of components 30 are placed in the sub-regions 21A, which standardizes the arrangement of multiple components 30. Any two adjacent sub-regions 21A are separated by the support portion 60, thereby further improving the support effect of the support portion 60 on the flexible circuit board 20.

[0113] In some embodiments, such as Figure 9 As shown, there are multiple first sub-regions 21AA, and the number of first type components 31 set in each first sub-region 21AA is the same.

[0114] It should be noted that when the number of first-type components 31 set in each first sub-region 21AA is the same, the shapes and sizes of the multiple first sub-regions 21AA are roughly the same.

[0115] For example, such as Figure 9 As shown, there are four first sub-regions 21AA, and four first-type components 31 are set in each first sub-region 21AA.

[0116] For example, such as Figure 9As shown, there is one first support bar 61 and two second support bars 62. When the multiple first sub-regions 21AA have approximately the same shape and size, the distances between the first support bar 61 and the two opposing sidewalls (two sidewalls arranged opposite each other along the second direction Y) of the groove 21 are basically equal; the distances between adjacent second support bars 62, or the distance between the second support bar 62 closest to the sidewall of the groove 21 (two sidewalls arranged opposite each other along the second direction X) and that sidewall, are also basically equal.

[0117] Therefore, when the weight of the flexible circuit board 20 and the multiple components 30 is applied to the support 60, the weight of the flexible circuit board 20 and the multiple components 30 can be evenly distributed on the first support bar 61, thereby better supporting the flexible circuit board 20.

[0118] In some embodiments, the support portion 60 is electrically connected to the display panel 10 and to the flexible circuit board 20.

[0119] With the above configuration, on the one hand, the support part 60 can support the flexible circuit board 20, reducing the probability of deformation of the flexible circuit board 20; on the other hand, the support part 60 is electrically connected to the flexible circuit board 20 and the display panel 10, which can transfer the static charge on the flexible circuit board 20 and the display panel 10 to the support part 60, and conduct it away through the ground of the support part 60, avoiding the accumulation of static charge on the flexible circuit board 20 and the display panel 10, preventing the generation of electric field in the flexible circuit board 20 and the display panel 10, reducing the risk of electrostatic discharge of the display module 300, and improving the stability of the display module 300.

[0120] It should be noted that the support part 60 can be connected to the housing of the display device 1000 to ground the support part 60.

[0121] In some embodiments, such as Figure 6 As shown, the support portion 60 includes: a first conductive portion 601 and a second conductive portion 602.

[0122] The first conductive part 601 is electrically connected to the flexible circuit board 20; the second conductive part 602 is located on the side of the first conductive part 601 away from the flexible circuit board 20, and the second conductive part 602 is electrically connected to the first conductive part 601; the display module 300 includes a heat dissipation layer 40, the second conductive part 602 is electrically connected to the heat dissipation layer 40 and is integrally formed, and the heat dissipation layer 40 is electrically connected to the display panel 10.

[0123] It should be noted that the "integrated setup" mentioned in this article refers to a specific graphic in the layer structure formed on the same layer that is continuous and unbroken.

[0124] For example, a heat dissipation layer 40 is first formed, and then a plurality of openings 41 are formed in the portion of the heat dissipation layer 40 that is opposite to the groove 21. The portion of the heat dissipation layer 40 between two adjacent openings 41 constitutes the first conductive portion 601.

[0125] In this embodiment, the manufacturing process of the display module 300 is simplified by integrating the second conductive part 602 and the heat dissipation layer 40 into the same layer.

[0126] In some embodiments, the material of the first conductive part 601 includes conductive foam. The conductive foam is a relatively soft porous material with good compressibility.

[0127] For example, such as Figure 10 As shown, the first conductive part 601 includes a foam body 611 and a conductive cloth 612 including the foam body 611. The conductive cloth can be made of metal materials such as copper or nickel.

[0128] In this embodiment, on the one hand, the material of the first conductive part 601 includes conductive foam, which realizes the electrical connection between the first conductive part 601 and the second conductive part 602. On the other hand, because the conductive foam has good compressibility, when the flexible circuit board 20 is squeezed and squeezed towards the side of the display panel 10, the conductive foam is compressed, reducing the pressure of the support part 60 on the display panel 10.

[0129] When the first conductive part 601 includes a foam body 611 and a conductive cloth 612 including the foam body 611, the first conductive part 601 is close to the flexible circuit board 20, and the conductive cloth 612 is in direct contact and electrically connected to the conductive layer in the flexible circuit board 20. The first conductive part 601 is close to the second conductive part 602, and the conductive part 612 is in direct contact and electrically connected to the second conductive part 602. Figure 11 As shown.

[0130] In some embodiments, such as Figure 12 and Figure 13 As shown, the flexible circuit board 20 includes multiple conductive layers 22 stacked together, and a first protective layer 23 and a second protective layer 24 located on both sides of the multiple conductive layers in the stacking direction. The second protective layer 24 is closer to the display panel 10 than the first protective layer 23. The bottom of the groove 21 is the conductive layer closest to the first protective layer among the multiple conductive layers.

[0131] The first protective layer 23 and the second protective layer 24 can both provide effective protection for multiple conductive layers.

[0132] The first protective layer 23 and the second protective layer 24 can both provide effective protection for the multiple conductive layers 2.

[0133] For example, the first protective layer 23 can be a single-layer structure, a double-layer structure, or a multi-layer structure. For instance, the first protective layer 23 is a single-layer structure composed of a polyimide (PI) layer. As another example, the first protective layer 23 is a double-layer structure composed of sequentially stacked adhesive layers and PI layers. The embodiments disclosed herein are not limited in this regard. The structure of the second protective layer 24 can be the same as or different from the structure of the first protective layer 23. For example, the structure of the second protective layer 24 is the same as the structure of the first protective layer 23. Both the second protective layer 24 and the first protective layer 23 are single-layer structures composed of PI layers.

[0134] For example, the material of each conductive layer 22 may include a metallic material, such as copper (Cu), or other suitable materials. When the material of the conductive layer 22 includes copper, the conductive layer 22 may be a copper foil.

[0135] For example, the number of conductive layers 22 can be two, three, or more. The embodiments of this disclosure do not limit this. For example, as Figure 12 and Figure 13 As shown, the number of conductive layers 22 is six.

[0136] It should be noted that an insulating layer 25 is provided between two adjacent conductive layers 22. The insulating layer 25 between adjacent conductive layers 22 is used to electrically insulate the two adjacent conductive layers 22.

[0137] When the bottom of the groove 21 is the conductive layer 22 closest to the first protective layer 23 among the multiple conductive layers 22, the height of the groove 21 is the sum of the thicknesses of the other conductive layers 22 excluding this conductive layer 22, the thickness of the insulating layer 25 between two adjacent conductive layers 22, and the thickness of the second protective layer 24. For example, as Figure 12 and Figure 13 As shown, when there are six conductive layers 22, the bottom of the groove 21 is the conductive layer closest to the first protective layer 23 among the multiple conductive layers 22. The height of the groove 21 is the sum of the thickness of the remaining five conductive layers 22 excluding the first protective layer 23, the thickness of the five insulating layers 25 located between the conductive layers 22, and the thickness of the second protective layer 24. For example, the height of the groove 21 can be 0.239 mm.

[0138] Furthermore, such as Figure 12 As shown, when an opening 41 opposite to the groove 21 is provided on the heat dissipation layer 40, the height of the receiving cavity R formed by the opening 41 and the groove 21 is equal to the sum of the height of the groove 21 and the height of the opening 41.

[0139] like Figure 13As shown, when the display module 300 includes both a heat dissipation layer 40 with an opening 41 and a buffer layer 50 with a through hole 51, the height of the receiving cavity R formed by the groove 21, the through hole 51 and the opening 41 is equal to the sum of the height of the groove 21, the height of the opening 41 and the height of the through hole 51.

[0140] It is understood that the component 30 has pins, and the conductive layer 2 closest to the first protective layer 23 in the multilayer conductive layer 22 can be used to set the pads. The pins of the component 30 are bonded to the pads of the flexible circuit board 20 to realize the electrical connection between the flexible circuit board 20 and the component 30.

[0141] In this embodiment, by setting the conductive layer closest to the first protective layer 23 in the multilayer conductive layer 22 as the bottom of the groove 21, the height of the groove 21 is greatly increased, and the height of the receiving cavity R for placing the component 30 is increased. This allows more components 30 to be placed in the receiving cavity R, greatly reducing the thickness of the display module 300. Consequently, the probability of interference between the component 30 and other components during the assembly process is reduced, improving the overall assembly yield and the display effect of the display module 300.

[0142] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display module, characterized in that, include: Display panel; A flexible circuit board is connected to the display panel and is located on the non-light-emitting side of the display panel; The flexible circuit board has a groove on the side near the display panel; Multiple components are disposed on the flexible circuit board; at least some of the components are located on the side of the flexible circuit board closer to the display panel and are located within the groove. A heat dissipation layer is located between the flexible circuit board and the display panel. The heat dissipation layer has an opening that faces the flexible circuit board. Along the thickness direction of the display module, the opening is disposed opposite to the groove, and the opening and the groove form a receiving cavity for accommodating at least a portion of the components; A support portion is located within the groove, dividing the groove into multiple sub-regions, each sub-region containing at least one of the components; the support portion is electrically connected to the display panel and the flexible circuit board; the support portion includes: a first conductive portion electrically connected to the flexible circuit board; a second conductive portion located on the side of the first conductive portion away from the flexible circuit board, the second conductive portion being electrically connected to the first conductive portion; the second conductive portion being electrically connected to and integrally formed with the heat dissipation layer, the heat dissipation layer being electrically connected to the display panel.

2. The display module according to claim 1, characterized in that, The plurality of components include: at least one first type of component and at least one second type of component, wherein the thickness of the second type of component is greater than the thickness of the first type of component; At least one of the first type of components is located within the receiving cavity, and the thickness of the first type of component is less than or equal to the height of the receiving cavity along the thickness direction of the display module.

3. The display module according to claim 1, characterized in that, Also includes: A buffer layer is located between the flexible circuit board and the heat dissipation layer. The buffer layer has a through hole. Along the thickness direction of the display module, the through hole is positioned opposite to the groove and opposite to the opening. The groove, the through hole, and the opening form the receiving cavity.

4. The display module according to claim 3, characterized in that, The plurality of components include: at least one first type of component and at least one second type of component, wherein the thickness of the second type of component is greater than the thickness of the first type of component; At least one of the second type of components is located within the receiving cavity, and the thickness of the second type of component is less than or equal to the height of the receiving cavity along the thickness direction of the display module.

5. The display module according to claim 1, characterized in that, The side of the support portion closest to the flexible circuit board abuts against the bottom of the groove; The opening penetrates the heat dissipation layer, and the side of the support portion away from the flexible circuit board passes through the opening and abuts against the display panel.

6. The display module according to claim 1, characterized in that, The support portion includes a first support bar and a second support bar, which are arranged intersectingly to divide the groove into the plurality of sub-regions.

7. The display module according to claim 1, characterized in that, The plurality of sub-regions include a first sub-region and a second sub-region, and the plurality of components include a first type of component and a second type of component, wherein the first type of component is disposed in the first sub-region and the second type of component is disposed in the second sub-region.

8. The display module according to claim 7, characterized in that, There are multiple first sub-regions, and the number of the first type of components is the same in each first sub-region.

9. The display module according to claim 1, characterized in that, The material of the first conductive part includes conductive foam.

10. The display module according to any one of claims 1 to 9, characterized in that, The flexible circuit board includes multiple conductive layers stacked together, and a first protective layer and a second protective layer located on both sides of the multiple conductive layers in the stacking direction, wherein the second protective layer is closer to the display panel than the first protective layer. The bottom of the groove is the conductive layer closest to the first protective layer among the multilayer conductive layers.

11. A display device, characterized in that, include: The display module as described in any one of claims 1 to 10.

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