A circuit board intelligent testing device and testing method thereof

Abstract

The present invention relates to an intelligent testing device for a circuit board and a testing method thereof, comprising a pressure device and an electrical detection device, wherein the pressure device comprises: a frame structure, wherein a U-shaped piece is arranged on the frame structure; a bidirectional driving component, wherein the bidirectional driving component is connected with an abutment component to clamp the circuit board placed in the U-shaped piece; a reciprocating component, which is arranged on the frame structure and connected with a pressure roller; an adjusting mechanism, which is arranged on the frame structure, wherein the adjusting mechanism comprises two groups of telescopic deflection components and a connecting component, wherein a lifting plate is connected between the two groups of telescopic deflection components, and when the bidirectional driving component drives the abutment component to move, the telescopic deflection component moves to drive the lifting plate to move up and down; a pressing component, wherein the pressing component is connected with the reciprocating component, and when the pressing roller moves, the roller wheel arranged on the pressing component cooperates with the adjusting mechanism to drive the pressing roller to move toward the circuit board and apply pressure to the circuit board, thereby realizing that the pressure applied by the pressing roller to the circuit board can be changed with the thickness of the circuit board.

Description

Technical Field

[0001] The invention relates to circuit board detection, in particular to intelligent circuit board testing equipment and a testing method thereof. Background Art

[0002] During the production test process, circuit boards are subject to different degrees of stress. Due to the extensive use of lead-free solders instead of traditional tin-lead solders, the welding problems caused by stress have been greatly stimulated. Since the solder joints of components are very sensitive to strain failure, the strain characteristics of circuit boards under the worst conditions are critical. For different solder alloys, package types, surface treatments or laminate materials, excessive strain can lead to various modes of failure. These failures include solder ball cracking, line damage, laminate-related adhesion failure (pad lift) or cohesive failure (pad cratering) and package substrate cracking.

[0003] The use of strain measurement to control printed circuit board warpage has proven to be very beneficial to the electronics industry and has long been recognized by the industry as a method of identifying damaging manufacturing processes. However, as interconnect density increases and becomes more brittle, the potential for damage caused by warpage also increases. Both circuit board foundries and component suppliers are required to operate at customer-specified strain levels.

[0004] When stress testing a circuit board, the change in resistance of a strain gauge is generally used to quantify the strain value of the circuit board. Specifically, the strain gauge is attached to a specified position on the circuit board, and then the circuit board with the strain gauge is subjected to different tests, assembly, and manual operations. Steps that exceed the strain limit are considered to be too strained, and confirmation is performed to adjust the excessive test results.

[0005] This method requires mounting strain gauges on the surface of the circuit board, and in order to ensure the accuracy of the values, the strain gauges need to be firmly adhered to the surface of the circuit board. This means that after the test is completed, the strain gauges need to be torn off. During the tearing process, on the one hand, the workload is increased, and on the other hand, the circuit board is easily subjected to secondary strain during the tearing process, affecting its structure.

[0006] Moreover, depending on the operating frequency of the circuit, the thickness of the circuit board is often inconsistent. The higher the frequency, the thinner the circuit board. Circuit boards of different thicknesses have different strain limits when causing the resistance of the strain gauge to change. This requires corresponding software programming for circuit boards of different thicknesses during testing, which requires a lot of preparation work for the test. Summary of the invention

[0007] The object of the present invention is to provide a circuit board intelligent testing device and a testing method thereof to solve the problems raised in the above background technology.

[0008] To achieve the above object, the present invention provides the following technical solutions:

[0009] A circuit board intelligent testing device includes a pressure-applying device and an electrical detection device, wherein the pressure-applying device includes:

[0010] A frame structure, wherein two U-shaped members are symmetrically arranged on the frame structure;

[0011] Two sets of bidirectional driving components are provided and are respectively installed on the U-shaped member, the bidirectional driving components are connected to abutment members movably arranged through the U-shaped member, and the bidirectional driving components can drive the abutment members to move toward the inside of the U-shaped member to clamp the circuit board placed in the U-shaped member;

[0012] A reciprocating assembly is arranged on the frame structure, a pressure roller is connected to the reciprocating assembly, and the reciprocating assembly can drive the pressure roller to move along the length direction of the frame structure;

[0013] An adjusting mechanism is arranged on the frame structure and is linked with the two sets of the two-way driving components. The adjusting mechanism includes two sets of telescopic deflection components and a connecting component. A lifting plate is connected between the two sets of telescopic deflection components. When the two-way driving component drives the abutment member to move, the telescopic deflection component moves to drive the lifting plate to move up and down.

[0014] A pressing assembly is connected to the reciprocating assembly. When the pressing roller moves, the roller wheel arranged on the pressing assembly cooperates with the adjusting mechanism to drive the pressing roller to move toward the circuit board and apply pressure to the circuit board.

[0015] As a further solution of the present invention: the two groups of the bidirectional drive components are connected by a belt, the bidirectional drive components include a bidirectional screw rod rotatably mounted on the U-shaped member, two threaded sleeves threadedly connected thereto are symmetrically mounted on the bidirectional screw rod, and a cross bar is mounted on each of the two threaded sleeves, and the two cross bars are respectively slidably matched with two inclined grooves symmetrically arranged on the abutment member;

[0016] One of the threaded sleeves is connected to the connecting assembly.

[0017] As a further solution of the present invention: the connecting assembly includes a turntable rotatably mounted on the frame structure, a pulling rod is rotatably mounted at an eccentric position of the turntable, the pulling rod is located at the lower part of the turntable shaft, and one end of the pulling rod away from the turntable is connected to the threaded sleeve;

[0018] The rotating disk is connected to a bevel gear set arranged on the frame structure, and the bevel gear set is connected to the telescopic deflection assembly.

[0019] As a further solution of the present invention: the telescopic deflection assembly comprises a rotating plate connected to the bevel gear set, a telescopic plate is sleeved on the rotating plate, and one end of the telescopic plate away from the rotating plate is connected to the end of the lifting plate;

[0020] The lifting plate is symmetrically provided with two No. 1 sliding blocks, and the No. 1 sliding blocks are slidably matched with the guide members provided on the frame structure.

[0021] As a further solution of the present invention: the reciprocating assembly includes two transmission wheels rotatably mounted on the frame structure, one of the transmission wheels is connected to a driving device arranged on the frame structure, and a transmission chain is sleeved between the two transmission wheels;

[0022] The reciprocating assembly also includes two guide rods symmetrically mounted on the frame structure, a sliding sleeve is slidably mounted on the guide rods, a follower frame is fixedly connected between the two sliding sleeves, and the follower frame is connected to the transmission chain via a chimeric structure.

[0023] As a further solution of the present invention: the engaging structure includes an engaging groove arranged along the length direction of the follower frame and an engaging block rotatably mounted on the transmission chain, and the engaging block can slide in the engaging groove.

[0024] As a further solution of the present invention: the pressing assembly comprises a vertical plate fixedly mounted on the follower frame, the vertical plate is provided with a slide groove along its length direction, a second slider rotatably connected to the roller is slidably mounted in the slide groove, a first spring is fixedly mounted on the second slider, and one end of the first spring away from the second slider is connected to the side wall of the slide groove;

[0025] The pressing assembly further includes an energy storage structure connecting the pressing roller and the second sliding block.

[0026] As a further solution of the present invention: the energy storage structure comprises a connecting plate fixedly mounted on the second slider, two vertical rods are slidably mounted in the connecting plate, one end of the vertical rod away from the connecting plate is provided with a connecting plate connected to the roller, and a second spring is also sleeved on the vertical rod, one end of the second spring is connected to the connecting plate, and the other end is connected to the connecting plate;

[0027] A follower sleeve plate is fixedly mounted on the connecting plate, and the follower sleeve plate is slidably fitted with a fixing rod fixedly mounted on the connecting plate.

[0028] A method for testing a circuit board using the test device comprises the following steps:

[0029] Step 1: Insert the circuit board to be tested from the middle of the two U-shaped pieces, and place the circuit board to be tested in the middle of the U-shaped pieces;

[0030] Step 2: Manually drive the bidirectional driving component to move, and when the bidirectional driving component moves, the abutment member moves toward the inside of the U-shaped member until the abutment member abuts against the circuit board to be tested, thereby clamping and fixing the circuit board;

[0031] Step 3: When the bidirectional driving component is in motion, the telescopic deflection component is driven by the connecting component to change the angle of the telescopic deflection component and change the height of the lifting plate at the same time;

[0032] Step 4: Control the movement of the reciprocating assembly to drive the pressing assembly and the pressure roller to move laterally. During the lateral displacement of the pressing assembly, the roller wheel rolls with the telescopic deflection assembly and the lifting plate to move the pressure roller toward the circuit board and apply pressure to the circuit board.

[0033] Step 5: After the pressure is applied, place the circuit board to be tested in the electrical testing device to test its electrical performance

[0034] Compared with the prior art, the present invention has the following beneficial effects:

[0035] By means of the linkage-arranged bidirectional driving assembly and the adjusting mechanism, the angles of the rotating plate and the telescopic plate and the height of the lifting plate are linked with the movement of the abutment member, so that the pressure strength of the pressure roller can be automatically changed. Compared with the existing equipment, which is performed by software, multiple debugging is required before detection, which undoubtedly increases the time cost. The present invention perfectly solves this problem through mechanical linkage, making it applicable to the testing of circuit boards of different thicknesses and more suitable for popularization and use.

[0036] By setting up a reciprocating component and a downward pressing component, stress detection under extreme conditions is simulated. At the same time, during the movement of the pressure roller, the No. 2 spring is further compressed through the cooperation of the roller, the telescopic plate and the lifting plate, so that the pressure roller has a certain pressure on the circuit board. Since the angle of the telescopic plate and the height of the lifting plate can be changed with the thickness of the circuit board, the elasticity of the No. 2 spring is compressed to be different, so that the pressure roller applies different pressure when acting on circuit boards of different thicknesses. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 The present invention is a schematic structural diagram of an embodiment of a circuit board intelligent testing device.

[0038] Figure 2 This is a schematic structural diagram from another angle in an embodiment of a circuit board intelligent testing device.

[0039] Figure 3This is a structural schematic diagram from another angle in an embodiment of a circuit board intelligent testing device.

[0040] Figure 4 The present invention is a schematic diagram of the structure of a bidirectional driving component and an adjusting mechanism in one embodiment of a circuit board intelligent testing device.

[0041] Figure 5 for Figure 4 A schematic diagram of the enlarged structure at point A in the middle.

[0042] Figure 6 The present invention is a schematic diagram of the structure of a bidirectional driving component in one embodiment of a circuit board intelligent testing device.

[0043] Figure 7 An exploded view of a bidirectional drive component in one embodiment of a circuit board intelligent testing device.

[0044] Figure 8 The present invention is a schematic diagram of the structure of the connection components in one embodiment of the intelligent testing device for circuit boards.

[0045] Fig. 9 This is a schematic diagram of the structure of a reciprocating component and a pressing component in an embodiment of a circuit board intelligent testing device.

[0046] Fig.10 The present invention is a schematic structural diagram of an interlocking block and an interlocking groove in one embodiment of a circuit board intelligent testing device.

[0047] In the figure: 1. base; 2. mounting plate; 3. U-shaped part; 4. bidirectional screw rod; 5. threaded sleeve; 6. cross bar; 7. abutment; 8. inclined groove; 9. belt; 10. rubber cushion; 11. pulling rod; 12. turntable; 13. bevel gear set; 14. rotating plate; 15. telescopic plate; 16. lifting plate; 17. No. 1 slider; 18. guide member; 19. driving device; 20. transmission wheel; 21. transmission chain; 22. engaging block; 23. follower frame; 24. engaging groove; 25. sliding sleeve; 26. guide rod; 27. vertical plate; 28. slide groove; 29. ​​No. 1 spring; 30. No. 2 slider; 31. roller; 32. connecting plate; 33. vertical rod; 34. connecting plate; 35. pressure roller; 36. follower sleeve plate; 37. fixing rod; 38. No. 2 spring. DETAILED DESCRIPTION

[0048] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0049] In addition, when an element in the present invention is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only embodiment.

[0050] See also Figures 1 to 10 In an embodiment of the present invention, a circuit board intelligent testing device includes a pressure device and an electrical detection device, and the pressure device includes: a frame structure, a two-way driving component, an adjustment mechanism, a reciprocating component and a pressing component.

[0051] The frame structure includes a base 1 and a mounting plate 2 detachably connected to the base 1. Exemplarily, the detachable connection is by bolt connection or snap connection, so that it is more convenient to disassemble the device for maintenance.

[0052] Two U-shaped parts 3 are symmetrically arranged on the frame structure, and a rubber cushion 10 is arranged on the U-shaped part 3;

[0053] Two sets of bidirectional driving components are provided and are respectively installed on the U-shaped member 3. The bidirectional driving components are connected to the abutment member 7 movably arranged through the U-shaped member 3, and the bidirectional driving components can drive the abutment member 7 to move toward the inside of the U-shaped member 3 to clamp the circuit board placed in the U-shaped member 3;

[0054] The bidirectional drive components are connected by a belt 9, and the bidirectional drive component includes a bidirectional screw rod 4 rotatably mounted on the U-shaped member 3, and two threaded sleeves 5 threadedly connected thereto are symmetrically mounted on the bidirectional screw rod 4, and a cross bar 6 is mounted on the two threaded sleeves 5, and the two cross bars 6 are respectively slidably matched with two inclined grooves 8 symmetrically arranged on the abutment member 7;

[0055] One of the threaded sleeves 5 is connected to the connecting assembly.

[0056] When in use, the circuit board to be tested is inserted from the sides of the two U-shaped parts 3, and the circuit board is located in the middle of the U-shaped part 3. Then, by rotating one of the two-way screw rods 4, the two two-way screw rods 4 rotate simultaneously under the action of the belt 9. When the two-way screw rods 4 rotate, the two threaded sleeves 5 symmetrically arranged on the two-way screw rods 4 will move closer to or away from each other, and drive the cross bars 6 to move closer to or away from each other. Specifically, when the two cross bars 6 move away from each other, since the two cross bars 6 are slidably arranged in two inclined grooves 8, when the two cross bars 6 move away from each other, the abutment 7 will move toward the inside of the U-shaped part 3 and gradually place the circuit board in the U-shaped part 3, and when the abutment 7 abuts against the circuit board, the circuit board is fixed.

[0057] Through the above arrangement, the circuit board can be fixed more conveniently. At the same time, since the two-way screw rod 4 and the threaded sleeve 5 are connected by a thread, and the threaded connection has a self-locking property, when the circuit board is clamped and the external force is removed from the two-way screw rod 4, the threaded sleeve 5 will not move in the axial direction of the two-way screw rod 4, thereby improving the stability during clamping and fixing. Moreover, due to the self-locking property of the threaded connection, the adjustment mechanism connected to the threaded sleeve 5 is also more stable, thereby improving the stability of the entire device.

[0058] It should be noted that a rubber pad 10 is provided between the U-shaped member 3 and the circuit board. On the one hand, it can prevent the edge of the circuit board from being crushed due to excessive clamping force on the circuit board caused by excessive movement of the abutment member 7. On the other hand, when pressure is applied to the circuit board, the circuit board will be deformed. At this time, the rubber pad 10 connecting the two sides of the circuit board has a certain elasticity, so that the two ends of the circuit board can move slightly, and after the pressure is finished, the rubber pad 10 is reset to drive the two ends of the circuit board to reset, so that when the circuit board is bent, the clamping position of the circuit board will not be broken.

[0059] See also Figure 4 , Figure 5 , Figure 8 The adjusting mechanism is arranged on the frame structure and is linked with the two sets of the two-way driving components. The adjusting mechanism includes two sets of telescopic deflection components and a connecting component. A lifting plate 16 is connected between the two sets of the telescopic deflection components. When the two-way driving component drives the abutment member 7 to move, the telescopic deflection component moves to drive the lifting plate 16 to move up and down;

[0060] The connecting assembly includes a turntable 12 rotatably mounted on the frame structure, a pulling rod 11 is rotatably mounted at an eccentric position of the turntable 12, the pulling rod 11 is located at the lower part of the rotating shaft of the turntable 12, and one end of the pulling rod 11 away from the turntable 12 is connected to the threaded sleeve 5;

[0061] The rotating disk 12 is connected to a bevel gear set 13 disposed on the frame structure, and the bevel gear set 13 is connected to the telescopic deflection assembly.

[0062] The bevel gear set 13 includes a first bevel gear and a second bevel gear which are rotatably mounted on the frame structure and mesh with each other, the first bevel gear is connected to the rotating shaft of the rotating disk 12, and the second bevel gear is connected to the telescopic deflection assembly;

[0063] The telescopic deflection assembly includes a rotating plate 14 connected to the bevel gear set 13, a telescopic plate 15 is sleeved on the rotating plate 14, and one end of the telescopic plate 15 away from the rotating plate 14 is connected to the end of the lifting plate 16;

[0064] Two first sliding blocks 17 are symmetrically arranged on the lifting plate 16 , and the first sliding blocks 17 are slidably matched with the guide members 18 arranged on the frame structure.

[0065] When the two threaded sleeves 5 move away from each other, the threaded sleeve 5 away from the mounting plate 2 will drive the pulling rod 11 to move. At this time, since the pulling rod 11 is located below the rotating shaft of the rotating disk 12, when one end of the pulling rod 11 is pulled, the other end thereof will drive the rotating disk 12 to rotate, and under the action of the bevel gear set 13, the rotating plate 14 will be driven to rotate. In this process, the lifting plate 16 can only move in the vertical direction of the space under the guiding effect of the cooperation between the No. 1 slider 17 and the guide member 18. When the rotating plate 14 rotates, the end of the lifting plate 16 The telescopic plate 15 has a certain pulling force, so that the telescopic plate 15 can move relative to the rotating plate 14, and at the same time, the lifting plate 16 can be lifted and lowered, that is, the rotating plate 14, the telescopic plate 15, the No. 1 slider 17 and the guide member 18 can be set so that when the rotating plate 14 rotates, the lifting plate 16 can be lifted and lowered. Specifically, when the movement of the threaded sleeve 5 is greater, the thickness of the circuit board clamped by the abutment member 7 and the U-shaped member 3 is thinner, and the rotating plate 14 will rotate upward at this time, and the lifting plate 16 will move upward. On the contrary, the thicker the circuit board is, the lifting plate 16 will move downward.

[0066] The purpose of the above-mentioned arrangement is that the thickness of circuit boards used in different devices is often different, and when pressure is applied to circuit boards of different thicknesses, the pressure applied is obviously different. When the reciprocating component drives the pressing component to move, the pressure strength of the pressure roller 35 comes from the angle of the rotating plate 14, the telescopic plate 15 and the height of the lifting plate 16. Through the linkage setting, the angle of the rotating plate 14, the telescopic plate 15 and the height of the lifting plate 16 are linked with the movement of the abutment 7, so that the pressure strength of the pressure roller 35 can be automatically changed. Compared with the existing equipment, it is carried out through software, so that multiple debugging is required before detection, which undoubtedly increases the time cost. The present invention perfectly solves this problem through mechanical linkage, so that it is applicable to the testing of circuit boards of different thicknesses and is more suitable for popularization and use.

[0067] See also Fig. 9 , Fig.10 The reciprocating assembly is arranged on the frame structure, and a pressure roller 35 is connected to the reciprocating assembly, and the reciprocating assembly can drive the pressure roller 35 to move along the length direction of the frame structure;

[0068] The reciprocating assembly includes two transmission wheels 20 rotatably mounted on the frame structure, one of the transmission wheels 20 is connected to a driving device 19 disposed on the frame structure, and a transmission chain 21 is sleeved between the two transmission wheels 20;

[0069] The reciprocating assembly further comprises two guide rods 26 symmetrically mounted on the frame structure, a sliding sleeve 25 is slidably mounted on the guide rods 26, a follower frame 23 is fixedly connected between the two sliding sleeves 25, the follower frame 23 is connected to the transmission chain 21 via a fitting structure, the fitting structure comprises a fitting groove 24 arranged along the length direction of the follower frame 23 and a fitting block 22 rotatably mounted on the transmission chain 21, the fitting block 22 can slide in the fitting groove 24;

[0070] The pressing assembly is connected to the reciprocating assembly. When the pressing roller 35 moves, the roller 31 arranged on the pressing assembly cooperates with the adjusting mechanism to drive the pressing roller 35 to move toward the circuit board and apply pressure to the circuit board;

[0071] The pressing assembly comprises a vertical plate 27 fixedly mounted on the follower frame 23, the vertical plate 27 is provided with a slide groove 28 along its length direction, a second slider 30 rotatably connected to the roller 31 is slidably mounted in the slide groove 28, a first spring 29 is fixedly mounted on the second slider 30, and one end of the first spring 29 away from the second slider 30 is connected to the side wall of the slide groove 28;

[0072] The pressing assembly further includes an energy storage structure connecting the pressure roller 35 and the second slider 30, the energy storage structure including a connecting plate 32 fixedly mounted on the second slider 30, two vertical rods 33 slidably mounted in the connecting plate 32, one end of the vertical rod 33 away from the connecting plate 32 is provided with a connecting plate 34 connected to the roller 31, and a second spring 38 is also sleeved on the vertical rod 33, one end of the second spring 38 is connected to the connecting plate 32, and the other end is connected to the connecting plate 34;

[0073] A follower sleeve plate 36 is fixedly mounted on the connecting plate 32 , and the follower sleeve plate 36 is slidably fitted with a fixing rod 37 fixedly mounted on the connecting plate 32 .

[0074] In the initial state, the second spring 38 is in a compressed state. At this time, the distance between the connecting plate 32 and the pressure roller 35 is constant. At the same time, the pressure roller 35 is at the end of the stroke, and a certain distance is maintained between the pressure roller 35 and the circuit board. This is mainly because the first spring 29 pulls the second slider 30, and the roller 31 abuts against the telescopic plate 15, so that the height of the pressure roller 35 is constant. When testing, the driving device 19 works, driving the transmission wheel 20 connected to the output shaft of the driving device 19 to rotate, and the transmission chain 21 sleeved on the transmission wheel 20 moves. At this time, the interlocking block 22 moves with the transmission chain 21, and the interlocking block 22 The sliding member 24 is arranged in the engaging groove 24. When the transmission chain 21 moves, the follower frame 23 moves accordingly and drives the vertical plate 27 to move. When the vertical plate 27 moves linearly, the roller 31 drives the No. 2 slider 30 to move downward under the drive of the telescopic plate 15, so as to drive the connecting plate 32 and the pressure roller 35 to move toward the circuit board. After the pressure roller 35 abuts against the circuit board, the connecting plate 32 continues to move downward and further compresses the No. 2 spring 38. The compression of the No. 2 spring 38 generates an elastic force which is applied to the pressure roller 35, so that the pressure roller 35 generates a certain pressure on the circuit board, thereby bending the circuit board for stress detection of the circuit board.

[0075] Furthermore, when the pressure roller 35 moves to the other end of the circuit board, it rises under the action of the No. 1 spring 29 and the other set of telescopic plates 15, that is, the pressure roller 35 will not apply pressure to both sides of the circuit board. This is mainly because when pressure is applied to the end of the circuit board, since the end of the circuit board is clamped, there is a risk of the circuit board breaking if pressure is applied, and since the transmission chain 21 is a double-layer closed structure, when the engaging block 22 moves to the circumferential section of the transmission chain 21, the engaging block 22 will slide in the engaging groove 24 and drive the follower frame 23 to move in the reverse direction, thereby achieving two or more pressures on a single circuit board to simulate stress detection under extreme conditions.

[0076] After the pressure is applied, the circuit board is removed and powered on to test the electrical performance of the circuit board.

[0077] Through the above arrangement, during the movement of the pressure roller 35, the No. 2 spring 38 is further compressed through the cooperation of the roller 31, the telescopic plate 15 and the lifting plate 16, so that the pressure roller 35 has a certain pressure on the circuit board. Since the angle of the telescopic plate 15 and the height of the lifting plate 16 can be changed with the thickness of the circuit board, the elasticity of the No. 2 spring 38 is compressed to be different, so that the pressure roller 35 has different pressure when acting on circuit boards of different thicknesses.

[0078] As an embodiment of the present invention, a method for testing a circuit board using the testing device is also proposed, comprising the following steps:

[0079] Step 1: insert the circuit board to be tested from the middle of the two U-shaped pieces 3, and place the circuit board to be tested in the middle of the U-shaped pieces 3;

[0080] Step 2: Manually drive the bidirectional driving assembly to move, and when the bidirectional driving assembly moves, the abutting member 7 moves toward the inside of the U-shaped member 3 until the abutting member 7 abuts against the circuit board to be detected, thereby clamping and fixing the circuit board;

[0081] Step 3: When the bidirectional driving assembly is in motion, the telescopic deflection assembly is driven by the connecting assembly to change the angle of the telescopic deflection assembly and change the height of the lifting plate 16;

[0082] Step 4: Control the reciprocating assembly to drive the pressing assembly and the pressure roller 35 to move laterally. During the lateral displacement of the pressing assembly, the roller 31 rolls with the telescopic deflection assembly and the lifting plate 16 to move the pressure roller 35 toward the circuit board and apply pressure to the circuit board.

[0083] Step 5: After the pressure is applied, place the circuit board to be tested in the electrical testing device to test its electrical performance.

[0084] To summarize, when in use, the circuit board to be tested is inserted from the sides of the two U-shaped parts 3, and the circuit board is located in the middle of the U-shaped part 3. Then, by rotating one of the two-way screw rods 4, the two two-way screw rods 4 are rotated simultaneously under the action of the belt 9. When the two-way screw rods 4 rotate, the two threaded sleeves 5 symmetrically arranged on the two-way screw rods 4 will move closer to or away from each other, and drive the cross bars 6 to move closer to or away from each other. Specifically, when the two cross bars 6 move away from each other, since the two cross bars 6 are slidably arranged in two inclined grooves 8, when the two cross bars 6 move away from each other, the abutment 7 will move toward the inside of the U-shaped part 3 and gradually place the circuit board in the U-shaped part 3, and when the abutment 7 abuts against the circuit board, the circuit board is fixed.

[0085] Through the above arrangement, the circuit board can be fixed more conveniently. At the same time, since the two-way screw rod 4 and the threaded sleeve 5 are connected by a thread, and the threaded connection has a self-locking property, when the circuit board is clamped and the external force is removed from the two-way screw rod 4, the threaded sleeve 5 will not move in the axial direction of the two-way screw rod 4, thereby improving the stability during clamping and fixing. Moreover, due to the self-locking property of the threaded connection, the adjustment mechanism connected to the threaded sleeve 5 is also more stable, thereby improving the stability of the entire device.

[0086] When the two threaded sleeves 5 move away from each other, the threaded sleeve 5 away from the mounting plate 2 will drive the pulling rod 11 to move. At this time, since the pulling rod 11 is located below the rotating shaft of the rotating disk 12, when one end of the pulling rod 11 is pulled, the other end thereof will drive the rotating disk 12 to rotate, and under the action of the bevel gear set 13, the rotating plate 14 will be driven to rotate. In this process, the lifting plate 16 can only move in the vertical direction of the space under the guiding effect of the cooperation between the No. 1 slider 17 and the guide member 18. When the rotating plate 14 rotates, the end of the lifting plate 16 The telescopic plate 15 has a certain pulling force, so that the telescopic plate 15 can move relative to the rotating plate 14, and at the same time, the lifting plate 16 can be lifted and lowered, that is, the rotating plate 14, the telescopic plate 15, the No. 1 slider 17 and the guide member 18 can be set so that when the rotating plate 14 rotates, the lifting plate 16 can be lifted and lowered. Specifically, when the movement of the threaded sleeve 5 is greater, the thickness of the circuit board clamped by the abutment member 7 and the U-shaped member 3 is thinner, and the rotating plate 14 will rotate upward at this time, and the lifting plate 16 will move upward. On the contrary, the thicker the circuit board is, the lifting plate 16 will move downward.

[0087] The purpose of the above-mentioned arrangement is that the thickness of circuit boards used in different devices is often different, and when pressure is applied to circuit boards of different thicknesses, the pressure applied is obviously different. When the reciprocating component drives the pressing component to move, the pressure strength of the pressure roller 35 comes from the angle of the rotating plate 14, the telescopic plate 15 and the height of the lifting plate 16. Through the linkage setting, the angle of the rotating plate 14, the telescopic plate 15 and the height of the lifting plate 16 are linked with the movement of the abutment 7, so that the pressure strength of the pressure roller 35 can be automatically changed. Compared with the existing equipment, it is carried out through software, so that multiple debugging is required before detection, which undoubtedly increases the time cost. The present invention perfectly solves this problem through mechanical linkage, so that it is applicable to the testing of circuit boards of different thicknesses and is more suitable for popularization and use.

[0088] In the initial state, the second spring 38 is in a compressed state. At this time, the distance between the connecting plate 32 and the pressure roller 35 is constant. At the same time, the pressure roller 35 is at the end of the stroke, and a certain distance is maintained between the pressure roller 35 and the circuit board. This is mainly because the first spring 29 pulls the second slider 30, and the roller 31 abuts against the telescopic plate 15, so that the height of the pressure roller 35 is constant. When testing, the driving device 19 works, driving the transmission wheel 20 connected to the output shaft of the driving device 19 to rotate, and the transmission chain 21 sleeved on the transmission wheel 20 moves. At this time, the interlocking block 22 moves with the transmission chain 21, and the interlocking block 22 The sliding member 24 is arranged in the engaging groove 24. When the transmission chain 21 moves, the follower frame 23 moves accordingly and drives the vertical plate 27 to move. When the vertical plate 27 moves linearly, the roller 31 drives the No. 2 slider 30 to move downward under the drive of the telescopic plate 15, so as to drive the connecting plate 32 and the pressure roller 35 to move toward the circuit board. After the pressure roller 35 abuts against the circuit board, the connecting plate 32 continues to move downward and further compresses the No. 2 spring 38. The compression of the No. 2 spring 38 generates an elastic force which is applied to the pressure roller 35, so that the pressure roller 35 generates a certain pressure on the circuit board, thereby bending the circuit board for stress detection of the circuit board.

[0089] Furthermore, when the pressure roller 35 moves to the other end of the circuit board, it rises under the action of the No. 1 spring 29 and the other set of telescopic plates 15, that is, the pressure roller 35 will not apply pressure to both sides of the circuit board. This is mainly because when pressure is applied to the end of the circuit board, since the end of the circuit board is clamped, there is a risk of the circuit board breaking if pressure is applied, and since the transmission chain 21 is a double-layer closed structure, when the engaging block 22 moves to the circumferential section of the transmission chain 21, the engaging block 22 will slide in the engaging groove 24 and drive the follower frame 23 to move in the reverse direction, thereby achieving two or more pressures on a single circuit board to simulate extreme stress detection.

[0090] After the pressure is applied, the circuit board is removed and powered on to test the electrical performance of the circuit board.

[0091] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0092] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A circuit board intelligent testing device, comprising a pressure device and an electrical detection device, characterized in that: The pressure applying device comprises: A frame structure, wherein two U-shaped members (3) are symmetrically arranged on the frame structure; Two sets of bidirectional drive components are provided and are respectively mounted on the U-shaped member (3); the bidirectional drive components are connected to an abutment member (7) movably arranged through the U-shaped member (3); and the bidirectional drive components can drive the abutment member (7) to move toward the inside of the U-shaped member (3) to clamp the circuit board placed in the U-shaped member (3); A reciprocating assembly is arranged on the frame structure, a pressure roller (35) is connected to the reciprocating assembly, and the reciprocating assembly can drive the pressure roller (35) to move along the length direction of the frame structure; an adjusting mechanism, arranged on the frame structure and linked to the two sets of bidirectional drive components, the adjusting mechanism comprising two sets of telescopic deflection components and a connecting component, a lifting plate (16) being connected between the two sets of telescopic deflection components, and when the bidirectional drive component drives the abutment member (7) to move, the telescopic deflection component moves to drive the lifting plate (16) to move up and down; a pressing assembly, the pressing assembly being connected to the reciprocating assembly, and when the pressing roller (35) moves, a roller (31) arranged on the pressing assembly cooperates with the adjusting mechanism to drive the pressing roller (35) to move toward the circuit board and apply pressure to the circuit board; The two groups of bidirectional drive components are connected via a belt (9), and the bidirectional drive components include a bidirectional screw rod (4) rotatably mounted on the U-shaped member (3), two threaded sleeves (5) threadedly connected thereto are symmetrically mounted on the bidirectional screw rod (4), and a cross bar (6) is mounted on each of the two threaded sleeves (5), and the two cross bars (6) are respectively slidably matched with two inclined grooves (8) symmetrically arranged on the abutment member (7); One of the threaded sleeves (5) is connected to the connecting assembly; The connecting assembly comprises a rotating disk (12) rotatably mounted on the frame structure, a pulling rod (11) rotatably mounted at an eccentric position of the rotating disk (12), the pulling rod (11) being located at the lower part of the rotating shaft of the rotating disk (12), and one end of the pulling rod (11) away from the rotating disk (12) is connected to the threaded sleeve (5); The rotating disk (12) is connected to a bevel gear set (13) arranged on the frame structure, and the bevel gear set (13) is connected to the telescopic deflection assembly; The telescopic deflection assembly comprises a rotating plate (14) connected to the bevel gear set (13), a telescopic plate (15) is sleeved on the rotating plate (14), and an end of the telescopic plate (15) away from the rotating plate (14) is connected to an end of the lifting plate (16); Two first sliding blocks (17) are symmetrically arranged on the lifting plate (16), and the first sliding blocks (17) are slidably matched with guide members (18) arranged on the frame structure; The reciprocating assembly comprises two transmission wheels (20) rotatably mounted on the frame structure, one of the transmission wheels (20) is connected to a driving device (19) arranged on the frame structure, and a transmission chain (21) is sleeved between the two transmission wheels (20); The reciprocating assembly further comprises two guide rods (26) symmetrically mounted on the frame structure, a sliding sleeve (25) being slidably mounted on the guide rods (26), a follower frame (23) being fixedly connected between the two sliding sleeves (25), and the follower frame (23) and the transmission chain (21) being connected via a chimeric structure; The pressing assembly comprises a vertical plate (27) fixedly mounted on the follower frame (23), the vertical plate (27) being provided with a slide groove (28) along its length direction, a second slider (30) rotatably mounted in the slide groove (28) and connected to the roller (31), a first spring (29) being fixedly mounted on the second slider (30), and an end of the first spring (29) away from the second slider (30) being connected to a side wall of the slide groove (28); The pressing assembly further comprises an energy storage structure connecting the pressing roller (35) and the second sliding block (30).

2. A circuit board intelligent testing device according to claim 1, characterized in that: The interlocking structure comprises an interlocking groove (24) arranged along the length direction of the follower frame (23) and an interlocking block (22) rotatably mounted on the transmission chain (21); the interlocking block (22) can slide in the interlocking groove (24).

3. A circuit board intelligent testing device according to claim 1, characterized in that: The energy storage structure comprises a connecting plate (32) fixedly mounted on the second slider (30), two vertical rods (33) being slidably mounted in the connecting plate (32), a connecting plate (34) connected to the roller (31) being arranged at one end of the vertical rod (33) away from the connecting plate (32), a second spring (38) being sleeved on the vertical rod (33), one end of the second spring (38) being connected to the connecting plate (32), and the other end being connected to the connecting plate (34); A follower sleeve plate (36) is fixedly mounted on the connecting plate (32), and the follower sleeve plate (36) is slidably fitted with a fixing rod (37) fixedly mounted on the connecting plate (32).

4. A method for testing a circuit board using the circuit board intelligent testing device as claimed in claim 1, characterized in that: The following steps are involved: Step 1: inserting the circuit board to be tested from the middle of the two U-shaped members (3), and placing the circuit board to be tested in the middle of the U-shaped members (3); Step 2: manually driving the bidirectional driving component to move, and when the bidirectional driving component moves, the abutment member (7) is driven to move toward the inside of the U-shaped member (3) until the abutment member (7) abuts against the circuit board to be tested, thereby clamping and fixing the circuit board; Step 3: When the bidirectional driving component is in motion, the telescopic deflection component is driven through the connecting component to change the angle of the telescopic deflection component and simultaneously change the height of the lifting plate (16); Step 4: Control the movement of the reciprocating assembly to drive the pressing assembly and the pressure roller (35) to move laterally. During the process of the pressing assembly moving laterally, the roller (31) rolls with the telescopic deflection assembly and the lifting plate (16) to move the pressure roller (35) toward the circuit board and apply pressure to the circuit board; Step 5: After the pressure is applied, place the circuit board to be tested in the electrical testing device to test its electrical performance.

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