Detection chip assembly tool, liquid injection device, method, electronic device and medium

Abstract

The application provides a detection chip assembly tool, a liquid injection device, a method, electronic equipment and a medium. The tool is used for installation in a vacuum pumping assembly. The tool comprises a base used for installation on a detection chip. The base is respectively provided with a reaction cavity covering the detection chip and a fluid channel communicated with the reaction cavity. The base is further provided with a liquid inlet groove structure communicated with the fluid channel and used for injection of a buffer solution. When the detection chip is filled with the buffer solution, the vacuum pumping assembly is started to exhaust air in the detection chip assembly tool. Pressure relief is performed after the vacuum pumping assembly is pumped. Under the action of negative pressure, the buffer solution in the liquid inlet groove structure flows into the reaction cavity along the fluid channel to fill the detection chip. The application effectively uses the mode of first pumping and then automatic liquid injection, avoids the generation of gas-liquid mixture, and does not need manual operation of a liquid transfer gun, thereby improving the liquid injection efficiency and precision of the detection chip.

Description

Technical Field

[0001] This application relates to the field of gene detection technology, and in particular to a microwell array detection chip assembly tooling, liquid injection device, method, electronic device and medium. Background Technology

[0002] The working principle of detection chips, such as micropore array sequencing chips, is as follows: Within a cavity filled with an electrochemical buffer solution, an insulating film with nanoscale pores (such as a phospholipid bilayer or artificial membrane) divides the cavity into two chambers. When a voltage is applied to the electrolyte chamber, ions or other small molecules can pass through the pores, forming a stable and detectable ionic current. By understanding the size and surface characteristics of the nanopores, the applied voltage, and the solution conditions, different types of biomolecules can be detected.

[0003] Microwell array sequencing chips are mainly composed of thousands of microwells, and the inner walls of the microwell array are all made of hydrophobic materials. Filling with electrochemical buffer is an indispensable sequencing condition.

[0004] Changing the hydrophilicity or hydrophobicity of the inner wall of a microwell array to make it hydrophilic allows electrochemical buffer solutions to penetrate into the microwell array through hydrophilicity. However, the surface modification of materials is relatively complex and costly, and some types of sequencing chips require the microwell surface to be hydrophobic. Therefore, this method cannot meet the buffer filling requirements of hydrophobic microwell array sequencing chips.

[0005] Therefore, the commonly used method for filling buffer into microwell array sequencing chips is as follows: use a pipette to disperse the buffer on top of the microwell array, then place it in a vacuum chamber and evacuate until the liquid is filled.

[0006] However, the filling method currently in use has the following drawbacks:

[0007] 1. The use of pipettes for liquid injection and the start and stop of the vacuum pump both require manual operation, which increases labor costs and reduces filling efficiency and accuracy;

[0008] 2. Because the liquid is injected first and then the air is removed, an absolute vacuum cannot be achieved inside the micropores, and the buffer solution cannot be completely filled.

[0009] 3. During vacuuming, some air bubbles may remain in the buffer solution, forming a gas-liquid mixture, which can affect subsequent sequencing. Summary of the Invention

[0010] The main objective of this application is to provide a tooling, liquid injection device, method, electronic device, and medium for testing chip components, so as to improve the above-mentioned deficiencies in the prior art.

[0011] This application solves the above-mentioned technical problems through the following technical solution:

[0012] As one aspect of this application, a testing chip assembly tooling is provided for mounting on a vacuum assembly;

[0013] The detection chip assembly fixture includes:

[0014] A base for mounting on a detection chip, the base being provided with a reaction chamber for covering the detection chip and a fluid channel communicating with the reaction chamber, the base also being provided with a liquid inlet structure communicating with the fluid channel and for injecting buffer solution;

[0015] When filling the detection chip with buffer solution, the vacuum assembly is activated to expel the air from the detection chip assembly fixture. In response to the vacuum assembly evacuating the vacuum, the pressure is released, and under negative pressure, the buffer solution in the liquid inlet structure flows along the fluid channel into the reaction chamber to fill the detection chip.

[0016] As an optional implementation, the base includes a cover plate and a bottom plate, with the cover plate covering the bottom plate;

[0017] The cover plate has a recessed area, and the bottom plate has a hollowed-out area. The bottom of the recessed area and the hollowed-out area form the reaction chamber.

[0018] A fluid groove is provided on the base plate, and the fluid groove and the bottom of the cover plate form the fluid channel;

[0019] The liquid inlet structure is provided on the top of the cover plate.

[0020] As an optional implementation, the bottom plate is also provided with an air storage groove, and the air storage groove and the bottom of the cover plate form an air storage position;

[0021] The gas storage compartment is connected to the reaction chamber and is used to store residual air pushed in by the buffer solution when the buffer solution is filled into the reaction chamber.

[0022] As an optional implementation, the detection chip assembly fixture also includes a fixing base;

[0023] The detection chip is fixedly mounted on the fixed base.

[0024] As another aspect of this application, a liquid injection device for a detection chip is provided, including a liquid injection assembly, a vacuuming assembly, a control module, and a detection chip assembly tooling as described above.

[0025] The detection chip assembly tooling is installed on the vacuum assembly, and the liquid injection assembly is used to inject buffer solution into the liquid inlet tank structure;

[0026] The control module is configured to activate the vacuum assembly to expel air from the detection chip assembly fixture when the detection chip is filled with buffer solution.

[0027] The control module is also configured to, in response to detecting the formation of a preset vacuum condition within the detection chip assembly fixture, activate the liquid injection assembly to inject buffer solution into the liquid inlet tank structure, and control the vacuum pumping assembly to release pressure. Under negative pressure, the buffer solution in the liquid inlet tank structure flows along the fluid channel groove into the reaction chamber to fill the detection chip.

[0028] As an optional implementation, the vacuum assembly includes a chip assembly fixing plate, a vacuum tank, a vacuum tank cover, a vacuum pipeline, a vacuum pump, and a vacuum valve.

[0029] The detection chip assembly fixture is mounted on the chip assembly mounting plate;

[0030] The chip assembly fixing plate is fixedly disposed inside the vacuum tank;

[0031] The vacuum tank cover is fitted onto the vacuum tank body;

[0032] One end of the extraction pipeline is located inside the vacuum tank;

[0033] The vacuum pump is installed on the air extraction pipeline and is used to extract air from the vacuum tank.

[0034] The vacuum valve is connected to the vacuum pump and is also in communication with the control module.

[0035] As an optional implementation, the vacuum assembly also includes a vacuum detection pressure gauge, a pressure relief speed control valve, and a gas filter;

[0036] The vacuum pressure gauge is communicatively connected to the control module and is used to detect the pressure inside the vacuum tank.

[0037] The pressure relief speed control valve is connected to the vacuum valve and is used to relieve pressure and regulate the pressure relief speed;

[0038] The gas filter is installed on the extraction pipeline.

[0039] As an optional implementation, the injection assembly includes an injection needle, an injection needle fixing component, an injection pump, an injection pump inlet solenoid valve, an injection pump outlet solenoid valve, and connecting pipelines.

[0040] The injection needle is fixedly mounted on the injection needle holder and is used to inject the buffer solution into the inlet tank structure;

[0041] The injection needle fixing component is disposed inside the vacuum tank;

[0042] The injection pump is connected to the injection needle via the connecting tubing and is used to deliver buffer solution to the injection needle;

[0043] The injection pump inlet solenoid valve is connected to the inlet of the injection pump and is communicatively connected to the control module;

[0044] The solenoid valve at the outlet of the injection pump is connected to the outlet of the injection pump and is communicatively connected to the control module.

[0045] As an optional implementation, the injection assembly further includes an adjusting screw and a guide rod;

[0046] The adjusting screw is mounted on the injection needle fixing member and is used to adjust the distance between the injection needle and the inlet groove structure;

[0047] The guide rod is disposed between the chip assembly fixing plate and the injection needle fixing component.

[0048] As an optional implementation, the injection assembly further includes a buffer solution container;

[0049] The buffer solution container is connected to the injection pump via the connecting tubing and is used to contain the buffer solution.

[0050] As another aspect of this application, a liquid injection method for a detection chip is provided, which is implemented using the liquid injection device for the detection chip as described above, the liquid injection method comprising:

[0051] When the detection chip is filled with buffer solution, the vacuum assembly is activated to remove the air from the detection chip assembly fixture.

[0052] In response to the detection of a preset vacuum condition within the detection chip assembly fixture, the liquid injection assembly is activated to inject buffer solution into the liquid inlet tank structure, and the vacuum pumping assembly is controlled to release pressure. Under negative pressure, the buffer solution in the liquid inlet tank structure flows along the fluid channel groove into the reaction chamber to fill the detection chip.

[0053] In another aspect of this application, an electronic device is provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the liquid injection method of the detection chip as described above.

[0054] As another aspect of this application, a computer-readable medium is provided that stores computer instructions thereon, which, when executed by a processor, implement the liquid injection method for the detection chip as described above.

[0055] Based on the contents of this application, those skilled in the art will understand other aspects of the contents of this application.

[0056] The positive and progressive effects of this application are as follows:

[0057] This application effectively utilizes a method of first vacuuming and then automatically injecting liquid, so that the gas in the micro-pore array of the detection chip does not pass through the solution, thereby effectively avoiding the generation of gas-liquid mixtures. Moreover, it eliminates the need for manual operation with a pipette, achieving automatic vacuuming, automatic liquid injection, and automatic pressure relief with a single click, reducing labor costs and minimizing staff contact with chemicals, thereby greatly improving the liquid injection efficiency and accuracy of the detection chip. Attached Figure Description

[0058] The features and advantages of this application can be better understood after reading the detailed description of the embodiments in conjunction with the following accompanying drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0059] Figure 1a This is a first assembly schematic diagram of a test chip assembly tooling according to an embodiment of the present application.

[0060] Figure 1b This is a second assembly diagram of a test chip assembly tooling according to an embodiment of the present application.

[0061] Figure 2a This is a schematic diagram of the base and the detection chip of a detection chip assembly tooling according to an embodiment of the present application.

[0062] Figure 2b This is an assembly diagram of the base of a testing chip assembly tooling according to an embodiment of the present application.

[0063] Figure 3 This is a schematic diagram of the structure of a micro-hole array detection chip.

[0064] Figure 4a This is a schematic diagram of the gas inside the micropores of the detection chip after using the traditional liquid injection method.

[0065] Figure 4b This is a schematic diagram of the gas inside the micropores of the detection chip after it has been tooled with the detection chip assembly provided in this application.

[0066] Figure 5 This is a schematic diagram of the module structure of a liquid injection device for a detection chip according to another embodiment of the present application.

[0067] Figure 6aThis is a front structural schematic diagram of the pump valve assembly of the liquid injection device for a detection chip according to another embodiment of the present application.

[0068] Figure 6b This is a schematic diagram of the back structure of the pump valve assembly of the liquid injection device for a detection chip according to another embodiment of the present application.

[0069] Figure 7 This is a schematic diagram of the assembly of the vacuum component and the liquid injection component of the liquid injection device for a detection chip according to another embodiment of the present application.

[0070] Figure 8 This is a schematic diagram of the electronic control interface of a liquid injection device for a detection chip according to another embodiment of the present application.

[0071] Figure 9 This is a schematic flowchart of a liquid injection method for a detection chip according to another embodiment of the present application.

[0072] Figure 10 This is a schematic diagram of an electronic device that implements a liquid injection method for a detection chip according to another embodiment of this application.

[0073] Explanation of reference numerals in the attached figures:

[0074] Solenoid valve 1 at the outlet of the injection pump; Solenoid valve 2 at the inlet of the injection pump;

[0075] 3. Injection pump; 4. Vacuum pump;

[0076] Vacuum valve 5; Electronic control board 6;

[0077] 7. Mounting plate; 8. Vacuum tank cover plate;

[0078] 9. Injection needle; 10. Injection needle fixing component;

[0079] Adjusting screw 11; guide rod 12;

[0080] Chip assembly mounting plate 13; Chip assembly 14;

[0081] Vacuum tank 15; base 161;

[0082] Cover plate 1611; Recessed area 16111;

[0083] Base plate 1612; Hollowed-out area 16121;

[0084] Fluid tank 16122; Gas storage tank 16123;

[0085] Liquid inlet tank structure 1613; fastening screw 162;

[0086] Fixed base 163; Reaction chamber 164;

[0087] Detection chip 17; Micropore 171;

[0088] Buffer container 24; Vacuum pressure gauge 25;

[0089] 26. Pressure relief speed control valve; 27. Gas filter. Detailed Implementation

[0090] The present application is further illustrated below by way of embodiments, but this does not limit the present application to the scope of the embodiments described.

[0091] It should be noted that references to "an embodiment," "an alternative embodiment," "another embodiment," etc., in the specification indicate that the described embodiments may include specific features, structures, or characteristics, but each embodiment may not necessarily include that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. In addition, when a specific feature, structure, or characteristic is described in connection with an embodiment, whether or not it is explicitly described, implementing such a feature, structure, or characteristic in conjunction with other embodiments is within the knowledge of those skilled in the art.

[0092] In the description of this application, it should be understood that the terms "center," "lateral," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the content of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the content of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "multiple" means two or more. Additionally, the term "comprising" and any variations thereof are intended to cover non-exclusive inclusion.

[0093] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0094] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments. Unless the context clearly indicates otherwise, the singular forms “a” and “an” as used herein are also intended to include the plural. It should also be understood that the terms “comprising” and / or “including” as used herein specify the presence of the stated features, integers, steps, operations, units, and / or components, without excluding the presence or addition of one or more other features, integers, steps, operations, units, components, and / or combinations thereof.

[0095] Detection chips, such as microwell array sequencing chips, are mainly composed of thousands of microwells, and the inner walls of the microwell array are all made of hydrophobic materials. The filling of electrochemical buffer is an indispensable sequencing condition.

[0096] Currently, sequencing chips are filled with buffer solution using a method of first injecting the solution and then vacuuming. A sealing gasket or other method is used to form a reservoir within the microwell array. Buffer solution is added to the surface of the microwell array, and a sealing device keeps the solution on the sequencing chip surface before placing it in a vacuum chamber and evacuating. During this process, air inside the microwell array is drawn out as the negative pressure inside the vacuum chamber increases until the pressure inside the microwells matches the surface pressure of the liquid. However, since absolute vacuum cannot be achieved, and the liquid on the surface of the microwell array has a certain degree of gravity (i.e., vacuum chamber pressure = microwell pressure + liquid gravity), the vacuum level inside the microwell array is less than the vacuum level inside the vacuum chamber, meaning some air cannot escape. Furthermore, the air escaping from the microwells needs to enter the surface buffer solution, leading to the formation of microbubbles. Due to surface tension, some larger bubbles will burst due to pressure changes, while some microbubbles remain suspended in the buffer solution, forming a gas-liquid mixture. Therefore, after depressurization, the buffer solution inside the microwell array is a gas-liquid mixture, affecting the operational stability of the sequencing chip.

[0097] To overcome the aforementioned deficiencies, this embodiment provides a liquid injection device for a detection chip, including a liquid injection assembly, a vacuum assembly, a control module, and a detection chip assembly fixture as described above. The detection chip assembly fixture is mounted on the vacuum assembly, and the liquid injection assembly is used to inject buffer solution into the liquid inlet tank structure. The control module is configured to activate the vacuum assembly to expel air from the detection chip assembly fixture when the detection chip is filled with buffer solution. The control module is also configured to activate the liquid injection assembly to inject buffer solution into the liquid inlet tank structure in response to the detection of a preset vacuum condition formed in the detection chip assembly fixture, and to control the vacuum assembly to depressurize. Under negative pressure, the buffer solution in the liquid inlet tank structure flows along the fluid channel groove into the reaction chamber to fill the detection chip.

[0098] In this embodiment, the detection chip is preferably a sequencing chip, but it is not limited to sequencing chips. Other biological or chemical detection chips can also be used, and adjustments or selections can be made according to actual or potential needs. Besides sequencing, this liquid injection device can also be applied to various other fields such as protein analysis, single-cell analysis, and drug screening. In addition to achieving the functions described above, adjustments or selections can be made based on actual or potential needs.

[0099] In this embodiment, the method of first evacuating the vacuum and then automatically injecting liquid is effectively utilized, so that the gas in the micro-pore array of the detection chip does not pass through the solution, thereby effectively avoiding the generation of gas-liquid mixture. Moreover, there is no need for manual operation with a pipette. Automatic vacuuming, automatic liquid injection, and automatic pressure relief are achieved with one click, reducing labor costs and reducing the contact between workers and chemicals, thereby greatly improving the liquid injection efficiency and accuracy of the detection chip.

[0100] As one embodiment, the liquid injection device for the detection chip provided in this embodiment mainly includes a detection chip assembly tooling, a vacuuming assembly, a liquid injection assembly, and a control module.

[0101] like Figure 1a and Figure 1b As shown, the testing chip assembly fixture mainly includes a base 161, several fastening screws 162, and a fixing base 163.

[0102] like Figure 2b As shown, the base 161 mainly includes a cover plate 1611 and a base plate 1612. The cover plate 1611 covers the base plate 1612. The cover plate 1611 has a recessed area 16111. The base plate 1612 has a hollowed-out area 16121. The bottom of the recessed area 16111 (i.e. the bottom of the cover plate 1611) and the hollowed-out area 16121 form a closed reaction chamber 164. The base plate 1612 has a fluid groove 16122. The fluid groove 16122 and the bottom of the cover plate 1611 form a fluid channel. The top of the cover plate 1611 also has a liquid inlet groove structure 163.

[0103] As an optional implementation, such as Figure 2a and 2b As shown, a gas storage tank 16123 is also provided on the bottom plate 1612. The gas storage tank 16123 and the bottom of the cover plate 1611 form a sealed gas storage position, which is connected to the reaction chamber 164.

[0104] refer to Figure 1a , Figure 2a and Figure 7As shown, the detection chip 17 is fixedly installed together with the base 161 and the fixed base 163 by a number of fastening screws 162 to form a chip assembly 14, thereby forming a sealed reaction chamber 164, a fluid channel and a gas storage position.

[0105] In this embodiment, the number of fastening screws 162 or the method of fixing the detection chip is not specifically limited. As long as the corresponding fixing effect can be achieved, the corresponding adjustments and selections can be made according to actual needs.

[0106] like Figure 6b and Figure 7 As shown, the vacuum assembly mainly includes a chip assembly fixing plate 13, a vacuum tank 15, a vacuum tank cover plate 8, a vacuum pipeline (not shown in the figure), a vacuum pump 4, and a vacuum valve 5.

[0107] Chip assembly 14 is mounted on chip assembly mounting plate 13, which is located inside vacuum tank 15. Vacuum tank cover plate 8 is placed on vacuum tank 15. One end of the suction pipe is located inside vacuum tank 15. Vacuum pump 4 is located on suction pipe and is used to extract air from vacuum tank 15. Vacuum valve 5 is connected to vacuum pump 4, and the vacuum pump 4 is started by controlling the closing of vacuum valve to extract air from vacuum tank 15.

[0108] As a preferred embodiment, such as Figure 5 As shown, the vacuum assembly also includes a vacuum pressure gauge 25, a pressure relief valve 26, and at least two gas filters 27.

[0109] The vacuum pressure gauge 25 is used to detect the pressure inside the vacuum tank 15; the pressure relief speed regulating valve 26 is connected to the vacuum valve 5 and is used to relieve pressure and regulate the pressure relief speed.

[0110] Two gas filters 27 are installed at the outlet of vacuum pump 4 and the pressure relief port of vacuum valve 5, respectively, to prevent the evaporation of electrochemical buffer solution from causing pollution of the experimental environment, and to effectively prevent dust and impurities from entering vacuum valve 5 and causing malfunction when outside air enters vacuum tank 15, and to prevent buffer solution pollution when entering vacuum tank 15.

[0111] In this embodiment, the type of vacuum pumping component is not specifically limited. As long as the corresponding function can be achieved, other vacuum generators can be used to replace the vacuum pump.

[0112] like Figure 5 , 6a 6b and Figure 7 As shown, the injection assembly includes an injection needle 9, an injection needle fixing component 10, an injection pump 3, an injection pump inlet solenoid valve 2, an injection pump outlet solenoid valve 1, connecting pipes, an adjusting screw 11, a guide rod 12, and a buffer solution container 24.

[0113] The injection needle 9 is fixedly mounted on the injection needle fixing member 10 and is used to inject buffer solution into the inlet tank structure 1613; the injection needle fixing member 10 is located inside the vacuum tank 15.

[0114] The injection pump 3 is connected to the injection needle 9 via a connecting line and is used to deliver buffer solution to the injection needle 9.

[0115] The inlet solenoid valve 2 of the injection pump is connected to the inlet of the injection pump 3, and the outlet solenoid valve 1 of the injection pump is connected to the outlet of the injection pump 3.

[0116] The adjusting screw 11 is mounted on the injection needle fixing member 10 and is used to adjust the distance between the injection needle 9 and the inlet groove structure 1613.

[0117] The guide rod 12 is positioned between the chip assembly fixing plate 13 and the injection needle fixing member 10 to ensure the positional accuracy of the injection needle when it moves up and down.

[0118] The buffer container 24 is connected to the dispensing pump 3 via a connecting tube and is used to hold the buffer solution.

[0119] The control module can communicate with the injection pump outlet solenoid valve 1, the injection pump inlet solenoid valve 2, the vacuum valve 5, the vacuum detection pressure gauge 25, and the pressure relief speed control valve 26, respectively.

[0120] In this embodiment, as a preferred implementation, a total of four injection assemblies are designed. The principle and materials of each injection assembly are basically the same, and can be adjusted and selected according to actual needs.

[0121] In this embodiment, as a preferred implementation, four micro-well array detection chips are designed to be processed simultaneously. The assembled chip assembly is placed on the chip assembly fixing plate 13. The fixing position adopts a ring design according to the chip structure to make full use of the planar space. The height of the injection needle from the liquid inlet structure is adjusted by adjusting the screw 11. The height above the liquid surface is preferably 3mm-5mm. Too high a distance will cause splashing, and too close a distance will cause the injection needle to come into contact with the buffer solution, causing crystallization. However, this height is not specifically limited and can be adjusted and selected according to actual needs.

[0122] refer to Figure 6a and 6b As shown, the control module may include an electronic control board 6 for controlling the valve body and a computer device (not shown) for performing calculations and control. The injection pump 3, vacuum pump 4, and various valve bodies and electronic control board 6 controlling these pumps are all mounted on a mounting plate 7 to save installation space and facilitate management and maintenance. The high-precision injection pump must be vertically fixed to allow air to escape.

[0123] In this embodiment, the control module is configured to activate the vacuum assembly when it is necessary to fill the detection chip 17 with electrochemical buffer solution, that is, to activate the corresponding vacuum pump 4 to expel the air in the detection chip 17 (i.e., the air in the entire chip assembly 14). Specifically, the air in the reaction chamber 164 is discharged from the drain hole of the liquid inlet structure 1613 along the fluid channel formed by the fluid tank 16122. The pressure in the vacuum tank 15 is detected in real time by the vacuum detection pressure gauge 25 and fed back to the control module.

[0124] The control module is also configured to, as an optional implementation, activate the liquid injection component, i.e., activate the corresponding liquid injection pump 3 to inject the buffer solution into the liquid inlet tank structure after detecting that a preset vacuum condition has been formed in the chip assembly 14, and control the vacuum pumping component to depressurize. Under the action of negative pressure, the buffer solution in the liquid inlet tank structure flows into the reaction chamber along the fluid channel groove to fill the detection chip.

[0125] The gas storage position is used to store residual air pushed in by the buffer solution as it flows into the reaction chamber along the fluid channel, thus not affecting the working performance of the micro-well array detection chip. The gas storage position is designed at the end of the detection chip, which is a non-working area and does not need to be completely filled with buffer solution. When the buffer solution is injected from front to back, the residual air is gradually pushed into the gas storage position.

[0126] Specifically, the chip assembly fixture forms a semi-closed cavity for the micro-hole array detection chip. A funnel-shaped vent and liquid inlet structure are used, and a vacuum pump is activated to evacuate the container to -95 kPa to -100 kPa to expel air from the micropores of the detection chip. Once the preset vacuum condition is reached within the vacuum container, the liquid injection assembly is activated to inject liquid into the liquid inlet structure. While the liquid injection assembly is activated, the vacuum pump continues to operate to maintain the vacuum state, effectively preventing the generation of air bubbles due to liquid flow.

[0127] The specific steps for starting the liquid injection assembly are as follows: First, open the inlet solenoid valve of the liquid injection pump. At this time, the liquid injection pump will draw buffer solution from the buffer solution container. After drawing a certain amount of buffer solution, close the inlet solenoid valve of the liquid injection pump, and then open the outlet solenoid valve of the liquid injection pump. At this time, the liquid injection pump will inject the buffer solution into the liquid inlet tank structure through the injection needle. After injecting a preset amount (e.g., 300 μL) of buffer solution, stop the liquid injection and wait for a preset time period (e.g., 10 seconds). After that, turn off the vacuum pump and open the pressure relief speed control valve to release pressure and connect to atmospheric pressure. At this time, the buffer solution flows into the reaction chamber under atmospheric pressure, thereby filling the detection chip. In addition, any residual trace air during the filling process will be squeezed to the gas storage position.

[0128] The electrochemical buffer solution is placed in the buffer container without frequent human contact; the corresponding valve can control the liquid flow, ensuring a seal is formed during vacuuming and preventing liquid spillage; the high-precision injection pump can accurately control the injection volume, injection speed, and injection time; the injection needle ensures accurate liquid injection position and reduces liquid residue problems.

[0129] refer to Figure 3 As shown, the diameter of a single micropore 171 in the detection chip 17 is typically from tens of micrometers to one hundred micrometers. Traditional liquid injection methods will create... Figure 4a The results show that gas cannot escape from micropore 171 (unfilled areas represent gas, filled areas represent liquid), and liquid cannot fill it; the filling situation in this embodiment is as follows. Figure 4b As shown, it can be seen that the micropores 171 can be completely filled.

[0130] In this embodiment, reference Figure 8 As shown, utilizing the electronic control interface, the control module enables one-click control of the entire process. After the chip assembly is placed inside the vacuum tank, clicking the "custom run" button on the electronic control interface will automatically run the entire process. After operation, the chip assembly is removed, at which point the micropores have been filled with electrochemical buffer solution. Simultaneously, it can satisfy monomer control, allowing individual control of the opening or closing of each corresponding valve, the operation of the plunger pump, etc.

[0131] Specifically, the electronic control board 6 communicates with the electronic control interface of the computer device (host computer). Each valve can be individually controlled, or they can be operated in combination via autonomous timing, reducing manual intervention. The number of control channels can be freely selected, and the number of runs and cycle patterns can be defined to achieve fully automated control. The host computer issues logic commands via a high-speed data cable to the electronic control board. Handshake signal judgment and data verification are used to ensure the correctness of the commands, allowing the electronic control board to control the corresponding components to achieve automatic vacuuming, automatic liquid injection, and automatic filling. This ensures the accuracy and unattended operation of the entire process, thereby ensuring that the electrochemical buffer solution completely enters the micro-pore array of the detection chip.

[0132] In this embodiment, any pump or valve unit can be controlled via a computer device, or the logic timing can be saved and run with a single click. The operation is flexible and convenient, and each parameter can be adjusted individually.

[0133] The liquid injection device for the detection chip provided in this embodiment has the following beneficial effects:

[0134] 1. The vacuum environment can effectively remove air from the micro-pore array of the detection chip, and the gas storage position can effectively avoid the situation where air remains in the micropores due to the inability to achieve absolute vacuum, thereby enabling the effective filling of the micro-pore array by the electrochemical buffer solution.

[0135] 2. No manual operation of the pipette is required, reducing labor costs and minimizing staff contact with chemicals; the pipette tips are disposable consumables, and this embodiment eliminates the need for using tips, thus saving costs.

[0136] 3. In this embodiment, all components of the injection device can be electronically controlled by the control module. One-click operation can be performed on the client side of the computer device through the electronic control interface, which is convenient and fast. Moreover, the injection time, injection speed and injection volume can be precisely controlled, thereby improving the overall stability and effectively avoiding human error.

[0137] As another embodiment, this embodiment provides a liquid injection method for a detection chip, which is implemented using the liquid injection device for the detection chip as described above. Figure 9 As shown, this injection method mainly includes the following steps:

[0138] Step 201: Receive the instruction to fill the detection chip with buffer solution;

[0139] Step 202: Activate the vacuum pumping unit to remove air from the chip assembly;

[0140] Step 203: Obtain the pressure inside the vacuum tank;

[0141] Step 204: In response to the pressure reaching the preset value, the liquid injection assembly is activated to fill the detection chip with buffer solution.

[0142] Specifically, in step 201, when it is necessary to fill the detection chip with electrochemical buffer, the assembled chip assembly is placed into the vacuum chamber, and the operator issues the instruction to fill the buffer through the electronic control interface.

[0143] In step 202, the vacuum pumping assembly is activated, that is, the corresponding vacuum pump is activated to expel the air from the chip assembly.

[0144] In step 203, the pressure inside the vacuum tank is detected in real time using a vacuum pressure gauge and fed back to the control module.

[0145] In step 204, in response to the detection that the pressure inside the vacuum tank has reached a preset value, the liquid injection component is activated to inject the buffer solution into the liquid inlet tank structure, and the vacuum pumping component is controlled to release the pressure. Under the negative pressure, the buffer solution in the liquid inlet tank structure flows into the reaction chamber along the fluid channel to fill the detection chip.

[0146] The liquid injection method for the detection chip provided in this embodiment effectively utilizes the method of first evacuating the vacuum and then automatically injecting the liquid, so that the gas in the micro-pore array of the detection chip does not pass through the solution, thereby effectively avoiding the generation of gas-liquid mixture. Moreover, it eliminates the need for manual operation with a pipette, and achieves automatic vacuuming, automatic liquid injection, and automatic pressure relief with one click, reducing labor costs and minimizing the contact between workers and chemicals, thereby greatly improving the liquid injection efficiency and accuracy of the detection chip.

[0147] Figure 10 This is a schematic diagram of the structure of an electronic device according to this embodiment. The electronic device includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the program, it implements the liquid injection method for the detection chip as described in the above embodiment. Figure 10 The electronic device 30 shown is merely an example and should not impose any limitations on the functionality and scope of use of the embodiments of this application.

[0148] like Figure 10 As shown, the electronic device 30 can be manifested as a general-purpose computing device, such as a server device. The components of the electronic device 30 may include, but are not limited to: at least one processor 31, at least one memory 32, and a bus 33 connecting different system components (including memory 32 and processor 31).

[0149] Bus 33 includes a data bus, an address bus, and a control bus.

[0150] The memory 32 may include volatile memory, such as random access memory (RAM) 321 and / or cache memory 322, and may further include read-only memory (ROM) 323.

[0151] The memory 32 may also include a program / utility 325 having a set (at least one) of program modules 324, including but not limited to: an operating system, one or more application programs, other program modules, and program data, each or some combination of these examples may include an implementation of a network environment.

[0152] The processor 31 executes various functional applications and data processing by executing computer programs stored in the memory 32, such as the liquid injection method of the detection chip in the above embodiment of this application.

[0153] Electronic device 30 can also communicate with one or more external devices 34 (e.g., keyboard, pointing device, etc.). This communication can be performed via input / output (I / O) interface 35. Furthermore, the model-generating device 30 can also communicate with one or more networks (e.g., local area network (LAN), wide area network (WAN), and / or public networks, such as the Internet) via network adapter 36. Figure 10 As shown, network adapter 36 communicates with other modules of the model-generated device 30 via bus 33. It should be understood that, although not shown in the figure, other hardware and / or software modules can be used in conjunction with the model-generated device 30, including but not limited to: microcode, device drivers, redundant processors, external disk drive arrays, RAID (disk array) systems, tape drives, and data backup storage systems.

[0154] It should be noted that although several units / modules or sub-units / modules of the electronic device have been mentioned in the detailed description above, this division is merely exemplary and not mandatory. In fact, according to the embodiments of this application, the features and functions of two or more units / modules described above can be embodied in one unit / module. Conversely, the features and functions of one unit / module described above can be further divided and embodied by multiple units / modules.

[0155] This embodiment also provides a computer-readable storage medium storing a computer program thereon, which, when executed by a processor, implements the steps in the liquid injection method for the detection chip as described in the above embodiment.

[0156] The readable storage medium may be more specifically adopted, including but not limited to: portable disk, hard disk, random access memory, read-only memory, erasable programmable read-only memory, optical storage device, magnetic storage device, or any suitable combination thereof.

[0157] In a possible implementation, this application can also be implemented as a program product comprising program code that, when executed on a terminal device, causes the terminal device to perform steps in the liquid injection method for the detection chip as described in the above embodiments.

[0158] The program code for executing this application can be written in any combination of one or more programming languages. The program code can be executed entirely on the user device, partially on the user device, as a standalone software package, partially on the user device and partially on a remote device, or entirely on a remote device.

[0159] While specific embodiments of this application have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of this application is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of this application, but all such changes and modifications fall within the scope of protection of this application.

Claims

1. A liquid injection device for a detection chip, characterized in that, This includes tooling for liquid injection components, vacuum pumping components, control modules, and detection chip components; The detection chip assembly fixture includes: A base for mounting on a detection chip, the base being provided with a reaction chamber for covering the detection chip and a fluid channel communicating with the reaction chamber, the base also being provided with a liquid inlet structure communicating with the fluid channel and for injecting buffer solution; The base includes a cover plate and a bottom plate, with the cover plate covering the bottom plate; The bottom plate is also provided with an air storage groove, which forms an air storage position with the bottom of the cover plate; The gas storage position is connected to the reaction chamber and is used to store residual air pushed in by the buffer solution when the buffer solution is filled into the reaction chamber; The detection chip assembly fixture is mounted on the vacuum assembly, and the liquid injection assembly is used to inject buffer solution into the liquid inlet tank structure; the control module is configured to activate the vacuum assembly to expel air from the detection chip assembly fixture when the detection chip is filled with buffer solution. The control module is also configured to, in response to detecting the formation of a preset vacuum condition within the detection chip assembly fixture, activate the liquid injection assembly to inject buffer solution into the liquid inlet tank structure, and control the vacuum pumping assembly to release pressure. Under negative pressure, the buffer solution in the liquid inlet tank structure flows along the fluid channel groove into the reaction chamber to fill the detection chip.

2. The liquid injection device for the detection chip as described in claim 1, wherein the vacuum assembly includes a chip assembly fixing plate, a vacuum tank, a vacuum tank cover, a vacuum pipeline, a vacuum pump, and a vacuum valve; The detection chip assembly fixture is mounted on the chip assembly mounting plate; The chip assembly fixing plate is fixedly disposed inside the vacuum tank; The vacuum tank cover is fitted onto the vacuum tank body; One end of the extraction pipeline is located inside the vacuum tank; The vacuum pump is installed on the air extraction pipeline and is used to extract air from the vacuum tank. The vacuum valve is connected to the vacuum pump and is also in communication with the control module.

3. The liquid injection device for the detection chip as described in claim 2, wherein the vacuum assembly further includes a vacuum detection pressure gauge, a pressure relief speed control valve, and a gas filter; The vacuum pressure gauge is communicatively connected to the control module and is used to detect the pressure inside the vacuum tank. The pressure relief speed control valve is connected to the vacuum valve and is used to relieve pressure and regulate the pressure relief speed; The gas filter is installed on the extraction pipeline.

4. The liquid injection device for the detection chip as described in claim 2, wherein the liquid injection assembly includes an injection needle, an injection needle fixing component, an injection pump, an injection pump inlet solenoid valve, an injection pump outlet solenoid valve, and connecting pipelines; The injection needle is fixedly mounted on the injection needle holder and is used to inject the buffer solution into the inlet tank structure; The injection needle fixing component is disposed inside the vacuum tank; The injection pump is connected to the injection needle via the connecting tubing and is used to deliver buffer solution to the injection needle; The injection pump inlet solenoid valve is connected to the inlet of the injection pump and is communicatively connected to the control module; The solenoid valve at the outlet of the injection pump is connected to the outlet of the injection pump and is communicatively connected to the control module.

5. The liquid injection device for the detection chip as described in claim 4, wherein the liquid injection assembly further includes an adjusting screw and a guide rod; The adjusting screw is mounted on the injection needle fixing member and is used to adjust the distance between the injection needle and the inlet groove structure; The guide rod is disposed between the chip assembly fixing plate and the injection needle fixing component.

6. The liquid injection device for the detection chip as described in claim 4, wherein the liquid injection assembly further includes a buffer solution container; The buffer solution container is connected to the injection pump via the connecting tubing and is used to contain the buffer solution.

7. The liquid injection device for the detection chip as described in claim 1, wherein the cover plate has a recessed area, the bottom plate has a hollowed-out area, and the bottom of the recessed area and the hollowed-out area form the reaction chamber; A fluid groove is provided on the base plate, and the fluid groove and the bottom of the cover plate form the fluid channel; The liquid inlet structure is provided on the top of the cover plate.

8. The liquid injection device for the detection chip as described in claim 1, wherein the detection chip assembly fixture further includes a fixing base; The detection chip is fixedly mounted on the fixed base; And / or, The detection chip has a micropore array.

9. A method for injecting liquid into a detection chip, characterized in that, This is achieved using the liquid injection device of the detection chip as described in any one of claims 1-8, wherein the liquid injection method includes: When the detection chip is filled with buffer solution, the vacuum assembly is activated to remove the air from the detection chip assembly fixture. In response to the detection of a preset vacuum condition in the tooling of the detection chip assembly, the liquid injection assembly is activated to inject the buffer solution into the liquid inlet tank structure, and the vacuum pumping assembly is controlled to release the pressure. Under the negative pressure, the buffer solution in the liquid inlet tank structure flows into the reaction chamber along the fluid channel groove to fill the detection chip. The gas storage tank is used to store residual air pushed in by the buffer solution when the buffer solution flows into the reaction chamber along the fluid channel.

10. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the liquid injection method for the detection chip as described in claim 9.

11. A computer-readable medium having computer instructions stored thereon, characterized in that, The computer instructions, when executed by the processor, implement the liquid injection method for the detection chip as described in claim 9.

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