Workpiece inspection device

Abstract

The present invention relates to a workpiece inspection device that inspects workpieces stored in a tray without reducing productivity even when a large inspection tool is used. The workpiece inspection device (10) comprises: a first carrier (11) that transfers a first stage (21) that has loaded a workpiece (30a) stored in a tray (26) at a first handover position (31) to an inspection position (35); an inspection tool (15) that inspects the workpiece (30) at the inspection position (35); a second carrier (12) that transfers a second stage (22) that has loaded another workpiece (30b) at a second handover position (32) to an inspection position (35) after the first stage (21) has retreated; and a conveying unit (25) that loads a workpiece (30) before inspection from a tray (26) to a first handover position (31) and a second handover position (32), and that unloads the inspected workpiece (30a, 30b) from the first handover position (31) and the second handover position (32) to the tray (26).

Description

Technical Field

[0001] The present invention relates to a workpiece inspection technology for picking up and inspecting workpieces stored in a tray. Background Art

[0002] Inspection of semiconductor packaging or chips after being divided from a wafer is generally divided into the following two types. The first type is an in-tray method in which the workpieces are kept in a tray for storing the workpieces to be inspected and the inspection is performed (for example, Patent Document 1). The second type is a pick-and-place method in which the workpieces are taken out of the tray and placed on an inspection table for inspection, and then are put back into the tray after the inspection is completed (for example, Patent Document 2).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2009-295814

[0006] Patent Document 2: Japanese Patent Application Publication No. 2003-114251 Summary of the invention

[0007] Problems to be solved by the invention

[0008] However, if the inspection tool is small and light and can be placed on the XY stage and moved, then the in-tray method has no problem. However, in the case of a large optical system such as an optical three-dimensional measuring instrument for inspecting bumps, it is difficult to place the inspection tool on the XY stage and move it, so it is difficult to implement the in-tray method. In addition, when the workpiece needs to be adsorbed or pressed during inspection, the in-tray method is not suitable.

[0009] On the other hand, the pick and place method can overcome the disadvantages of the above-mentioned in-tray method, but requires a replacement operation of moving the workpiece to be inspected in and out of the tray. Therefore, this replacement operation takes a long time, and there is a problem of reduced productivity.

[0010] The present invention has been made in consideration of such circumstances, and an object of the present invention is to provide a workpiece inspection technology that does not reduce productivity even when a large inspection tool is used.

[0011] Means for solving problems

[0012] The workpiece inspection device of the present invention comprises: a first carrier, which moves the first carrier having the workpiece loaded at the first handover position to the inspection position; an inspection tool, which inspects the workpiece at the inspection position in a fixed state; a second carrier, which moves the second carrier having another workpiece loaded at the second handover position to the inspection position after the first carrier has retreated; a carrier moving unit, which moves the first carrier and the second carrier, which are arranged parallel to each other, independently back and forth in a direction intersecting with the respective transfer directions of the first carrier and the second carrier; and a conveying unit, which moves the workpiece before inspection to the first handover position and the second handover position, and moves the workpiece after inspection out of the first handover position and the second handover position, wherein the workpiece inspection device executes Next process: when the inspection tool finishes the inspection of the workpiece placed on the first platform, the platform moving unit retreats the first platform toward the intersection direction at the inspection position and replaces it with the second platform; while the inspection tool is inspecting the workpiece placed on the second platform, the conveying unit moves out the inspected workpiece at the first handover position and moves in the workpiece before inspection; when the inspection tool finishes the inspection of the workpiece placed on the second platform, the platform moving unit retreats the second platform toward the intersection direction at the inspection position and replaces it with the first platform; and while the inspection tool is inspecting the workpiece placed on the first platform, the conveying unit moves out the inspected workpiece at the second handover position and moves in the workpiece before inspection.

[0013] Effects of the Invention

[0014] According to the present invention, a workpiece inspection technology is provided that does not cause a decrease in productivity even when a large inspection tool is used. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a plan view showing the workpiece inspection device according to the first embodiment of the present invention.

[0016] Figure 2 (A) to (D) are explanatory diagrams of the operation of the workpiece inspection device according to the first embodiment.

[0017] Figure 3 (E) to (H) are explanatory diagrams of the operation of the workpiece inspection device according to the first embodiment.

[0018] Figure 4 (I) to (L) are explanatory diagrams of the operation of the workpiece inspection device according to the first embodiment.

[0019] Figure 5(A) is a top perspective view of a multilayer wiring substrate having protrusions arranged on the top surface, which is applied as a workpiece of the present embodiment, and (B) is a side perspective view of an LSI package having an LSI chip mounted on the multilayer wiring substrate.

[0020] Figure 6 It is a plan view showing a workpiece inspection device according to a second embodiment of the present invention.

[0021] Figure 7 This is a longitudinal sectional view of a suction jig for sucking the bottom surface of a multilayer wiring board, which is applied to a workpiece inspection device according to a third embodiment of the present invention. DETAILED DESCRIPTION

[0022] (First Embodiment)

[0023] Hereinafter, embodiments of the present invention will be described based on the drawings. Figure 1 1 is a top view of a workpiece inspection device 10A (10) according to a first embodiment of the present invention. Thus, the workpiece inspection device 10 comprises: a first stage 11, which moves the first stage 21, which has loaded the workpiece 30a at the first handover position 31, to the inspection position 35; an inspection tool 15, which inspects the workpiece 30 at the inspection position 35; a second stage 12, which moves the second stage 22, which has loaded another workpiece 30b at the second handover position 32, to the inspection position 35 after the first stage 21 has retreated; and a conveying unit 25, which loads the workpiece 30 before inspection into the first handover position 31 and the second handover position 32, and unloads the workpieces 30a and 30b after inspection from the first handover position 31 and the second handover position 32.

[0024] In the embodiment, the process of carrying the uninspected workpiece 30 stored in the tray 26 to the first delivery position 31 and the second delivery position 32 in sequence and carrying the inspected workpiece 30 out of the first delivery position 31 and the second delivery position 32 to the same position of the same tray 26 is described. However, the process of carrying the workpiece 30 in and out is not limited to this. For example, the pallet of the carrying-in source may be different from the pallet of the carrying-out destination, and the pallet of the carrying-out destination may be different depending on the inspection result (OK, NG).

[0025] Furthermore, the workpiece inspection device 10 includes a stage moving unit 16 that moves the first stage 11 and the second stage 12 that are arranged parallel to each other in a direction intersecting the longitudinal direction of each stage. The first stage 11 is combined with the stage moving unit 16, so that the first stage 21 repeatedly moves back and forth between the first handover position 31 and the inspection position 35. Similarly, the second stage 12 is combined with the stage moving unit 16, so that the second stage 22 repeatedly moves back and forth between the second handover position 32 and the inspection position 35.

[0026] Furthermore, the first stage 11 and the second stage 12 are configured to be movable independently of the stage moving unit 16. Thus, the workpiece 30 can be moved to perform inspection at any position while the inspection tool 15 is fixed.

[0027] In addition, as a modification of the workpiece inspection device 10, it is also possible to adopt a mode that does not require such a stage moving unit 16. For example, the first stage 11 and the second stage 12 are arranged so that the long side directions are aligned along the radial direction centered on the inspection position 35. In this way, the workpiece 30 can be loaded from the first handover position and the second handover position at the radial ends of the first stage 11 and the second stage 12, respectively, and transferred to the inspection position 35 at the radial center thereof.

[0028] Then, the stage moving part 16 preferably adopts a linear motor stage of a movable coil type, which is constructed to have a guide and a fixed permanent magnet on its base, and a movable coil is arranged on the base of the movable first stage 11 and the second stage 12. As a result, the stage moving part 16 can make the first stage 11 and the second stage 12 move independently of each other through a compact structure. A linear motor stage of a movable coil type can also be used for the first stage 11 and the second stage 12. In addition, a general ball screw method can also be used for the stage moving part 16, the first stage 11 and the second stage 12.

[0029] In addition, the conveying unit 25 obtains the pallet 26 containing (fully loaded with) the workpieces 30 before inspection from the left side in the figure. Then, the pallet 26 is alternately positioned near the first delivery position 31 and the second delivery position 32 to perform the delivery of the workpieces 30. Furthermore, the pallet 26 containing (fully loaded with) the workpieces 30 after inspection is discharged to the left side in the figure.

[0030] The conveying unit 25 that performs such an operation includes a conveyor 27 that carries and moves the pallet 26, and a conveying robot (28a, 28b) that picks up or releases the workpiece 30 and delivers it between the pallet 26 and the delivery positions 31, 32. In addition, the operation of the conveying unit 25 may be achieved by combining multiple linear motions as shown in the figure, or by combining a multi-axis robot arm that also has rotational motion.

[0031] The conveyor 27 is formed by arranging two rows of brackets made of belts or plastic chains. The workpiece pallets 26 arranged two-dimensionally are supported at both ends by the conveyor 27 and move in the left-right direction in the figure and are positioned near the first delivery position 31 or the second delivery position 32.

[0032] based on Figure 2 (A)~(D), Figure 3 (E)~(H), Figure 4(I) to (L) of the present invention will explain the operation of the workpiece inspection device 10A according to the first embodiment. Figure 2 In the initial state of (A), the first stage 21 of the first stage 11 is at the first handover position 31, and the second stage 22 of the second stage 12 is at the second handover position 32. Then, the conveying unit 25 obtains the tray 26 containing the workpiece 30 before inspection from the left side of the figure, and positions it near the first handover position 31. In this state, the workpiece 30a contained in the tray 26 is carried into the first stage 21 located at the first handover position 31.

[0033] Next, if Figure 2 As shown in (B), the first stage 11 transfers the first stage 21 carrying the workpiece 30a to the inspection position 35, and the inspection tool 15 starts the inspection of the workpiece 30a. On the other hand, the conveying unit 25 positions the tray 26 containing the workpiece 30 before inspection near the second delivery position 32. In this state, the workpiece 30b stored in the tray 26 is carried to the second stage 22 located at the second delivery position 32.

[0034] Next, if Figure 2 As shown in (C), the conveying unit 25 positions the tray 26 containing the workpiece 30 before inspection near the first delivery position 31. Then, the second stage 12 keeps its position unchanged, moves the second stage 22 to the opposite side and enters a standby state until the inspection of the workpiece 30a of the first stage 21 is completed.

[0035] Then, if Figure 2 As shown in (D), when the inspection of the workpiece 30a is completed, the first stage 11 retreats from the inspection position 35. Then, at the same time (in a replacement manner), the second stage 12 moves the second stage 22 that was previously on standby to the inspection position 35, and the inspection tool 15 starts the inspection of the workpiece 30b.

[0036] Next, if Figure 3 As shown in (E), during the inspection of the workpiece 30b placed on the second stage 12, the first stage 11 maintains its position and moves the first stage 21 carrying the inspected workpiece 30a to the first delivery position 31. Furthermore, the conveying unit 25 carries the inspected workpiece 30a from the first delivery position 31 to the tray 26.

[0037] Next, if Figure 3 As shown in FIG. 2 (F), during the inspection of the workpiece 30 b placed on the second stage 12 , the workpiece 30 c stored in the tray 26 is carried into the first stage 21 located at the first delivery position 31 .

[0038] Next, if Figure 3As shown in (G), the conveying unit 25 positions the tray 26 containing the workpiece 30 before inspection near the second delivery position 32. Then, the first stage 11 keeps its position unchanged, moves the first stage 21 to the opposite side and enters a standby state until the inspection of the workpiece 30b of the second stage 22 is completed.

[0039] Next, if Figure 3 As shown in (H), when the inspection of the workpiece 30b is completed, the second stage 12 retreats from the inspection position 35. Then, at the same time (in a replacement manner), the first stage 11 moves the first stage 21 that was previously on standby to the inspection position 35, and the inspection tool 15 starts the inspection of the workpiece 30c.

[0040] Next, if Figure 4 As shown in (I), during the inspection of the workpiece 30c placed on the first stage 11, the second stage 12 keeps its position unchanged and moves the second stage 22 carrying the inspected workpiece 30b to the second delivery position 32. Furthermore, the conveying unit 25 carries the inspected workpiece 30b from the second delivery position 32 to the tray 26.

[0041] Next, if Figure 4 As shown in FIG. 2 (J), during the inspection of the workpiece 30 c placed on the first stage 11 , the workpiece 30 d stored in the tray 26 is carried into the second stage 22 located at the second delivery position 32 .

[0042] Next, if Figure 4 As shown in (K), the conveying unit 25 positions the tray 26 containing the workpiece 30 before inspection near the first delivery position 31. Then, the second stage 12 keeps its position unchanged, moves the second stage 22 to the opposite side and enters a standby state until the inspection of the workpiece 30c of the first stage 21 is completed.

[0043] Then, if Figure 4 As shown in (L), when the inspection of the workpiece 30c is completed, the first stage 11 retreats from the inspection position 35. Then, at the same time (in a replacement manner), the second stage 12 moves the second stage 22 that was previously on standby to the inspection position 35, and the inspection tool 15 starts the inspection of the workpiece 30d. Figure 3 In the process from (E), when there are no more uninspected workpieces 30 on the tray 26, the conveying unit 25 discharges the tray 26 and obtains a new tray.

[0044] In this way, when the inspection of one workpiece 30 is completed, the inspection of the next workpiece 30 waiting nearby can be started while the workpiece 30 is being withdrawn (in a replacement manner). As a result, the workpiece 30 can be continuously supplied to the inspection position 35 through the first stage 11 and the second stage 12, and the productivity of the workpiece inspection will not be reduced. In addition, during the inspection of the workpiece 30 at the inspection position 35, the first stage 21 and the second stage 22 can be moved in small scales relative to the inspection tool 15. As a result, even if the inspection range of the inspection tool 15 itself is narrow, the workpiece 30 can be inspected in a larger range.

[0045] Figure 5 (A) is a perspective view of the upper surface of a multilayer wiring substrate 38 having protrusions 37 arranged on the upper surface thereof, which is applied as a workpiece according to the present embodiment. Figure 5 (B) is a side perspective view of an LSI package in which an LSI chip 36 is mounted on the multilayer wiring substrate 38. In this LSI package, electrodes of the multilayer wiring substrate 38 and electrodes of the LSI chip 36 are electrically connected via bumps 37. In addition, the LSI package is encapsulated with resin as a countermeasure against degradation and heat. In this way, the method of using spherical bumps 37 for electrical connection is called flip chip mounting.

[0046] In order to make the electrodes of the multilayer wiring substrate 38 and the electrodes of the LSI chip 36 directly overlap each other, the flip chip mounting needs to make the height of the protrusion 37 consistent. The reason is that when there is a deviation in the height of the protrusion 37, a poor connection will occur. In addition, it is also required to detect the position of the protrusion, the diameter of the protrusion, the abnormal shape of other protrusions, and foreign matter on the substrate. In addition, regarding the workpiece 30, an LSI package is exemplified in the embodiment, but it is not limited to this, as long as it can be placed on the tray 26, the first stage 21 and the second stage 22.

[0047] The inspection tool 15 is a measuring and inspection device that measures various sizes of the protrusions 37 arranged on the upper surface of the multilayer wiring substrate 38 or detects foreign matter, etc. Specifically, it is a surface shape measuring machine and an image measuring machine using light, or a measuring and inspection machine that has both functions and can measure the convex and concave information of the surface. In addition, the inspection tool 15 is not particularly limited, and any type, whether contact or non-contact, can be appropriately adopted as long as it can inspect the workpiece 30.

[0048] (Second Embodiment)

[0049] Next, refer to Figure 6 A second embodiment of the present invention will be described. Figure 61 is a top view of a workpiece inspection device 10B (10) according to a second embodiment of the present invention. The workpiece inspection device 10B according to the second embodiment adopts a structure in which another inspection tool 17 (17a, 17b) is further added to the structure of the first embodiment. Figure 6 With Figure 1 The same reference numerals are used to indicate parts having the same configuration or function, and repeated descriptions thereof will be omitted.

[0050] The inspection tool 17a (17) is located at a position for inspecting the workpiece 30 on the first stage 11 opposite to the first transfer position 31. The inspection tool 17b (17) is located at a position for inspecting the workpiece 30 on the second stage 12 opposite to the second transfer position 32.

[0051] Compared with the first embodiment, the first stage 11 and the second stage 12 of the second embodiment can extend their front ends so that the inspection tool 15 does not interfere with the other inspection tool 17. As long as the inspection of the other inspection tool 17 can be performed during the inspection of the inspection tool 15, the productivity of the workpiece inspection will not be reduced.

[0052] As a specific example of the additional inspection tool 17, a reader of the identification ID engraved on the workpiece 30 can be cited. This makes it easy to associate the identification data of the workpiece 30 by the additional inspection tool 17 with the inspection data of the inspection tool 15 and manage them. In addition, the additional inspection tool 17 is not limited to such an identification ID reader, and any device can be used.

[0053] (Third Embodiment)

[0054] Figure 7 This is a longitudinal cross-sectional view of a suction tool for sucking the bottom surface of a multilayer wiring board used in the workpiece inspection device 10 of the third embodiment of the present invention. In order to obtain good electrical bonding, not only the shape of the protrusion 37 must be consistent, but also the presence or absence of warp and thickness deviation of the multilayer wiring board 38 must be considered.

[0055] Therefore, the third embodiment is characterized in that the suction tool 20 for sucking the bottom surface of the multilayer wiring substrate 38 is respectively provided on the first stage 21 and the second stage 22. The workpiece inspection device of the third embodiment is realized by adding the suction tool 20 to the workpiece inspection device 10 (10A, 10B) of the first embodiment or the second embodiment. The suction tool 20 is provided with a plurality of suction holes 29 that penetrate the thickness direction and communicate with the decompression device (not shown).

[0056] Explanation of symbols

[0057] 10 (10A, 10B): workpiece inspection device; 11: first stage; 12: second stage; 15: inspection tool; 16: stage moving part; 17 (17a, 17b): other inspection tool; 20: adsorption tool; 21: first stage; 22: second stage; 25: conveying part; 26: tray; 27: conveyor; 29: suction hole; 30 (30a, 30b): workpiece; 31: first handover position; 32: second handover position; 35: inspection position; 36: LSI chip; 37: bump; 38: multilayer wiring substrate.

Claims

1. A workpiece inspection device comprising: The first stage moves the first stage carrying the workpiece at the first handover position to the inspection position; An inspection tool, in a fixed state, inspects the workpiece at the inspection position; A second stage, which moves another workpiece loaded at the second transfer position to the inspection position after the first stage has retreated; a stage moving unit that independently reciprocates the first stage and the second stage that are arranged parallel to each other in a direction that intersects with the respective transfer directions of the first stage and the second stage; as well as The conveying unit carries the workpiece before inspection into the first delivery position and the second delivery position, and carries the workpiece after inspection out of the first delivery position and the second delivery position. The workpiece inspection device performs the following steps: When the inspection tool finishes the inspection of the workpiece placed on the first stage, the stage moving unit retreats the first stage in the intersecting direction at the inspection position and replaces it with the second stage; When the inspection tool inspects the workpiece placed on the second stage, the conveyor unit carries out the inspected workpiece at the first handover position and carries in the workpiece before inspection; When the inspection tool completes the inspection of the workpiece placed on the second stage, the stage moving unit retreats the second stage in the intersecting direction at the inspection position and replaces it with the first stage; and While the inspection tool is inspecting the workpiece placed on the first stage, the transport unit carries out the inspected workpiece at the second delivery position and carries in the uninspected workpiece.

2. The workpiece inspection device according to claim 1, wherein: At the inspection position, the workpiece is inspected as the first stage and the second stage move relative to the small scale of the inspection tool.

3. The workpiece inspection device according to claim 1 or 2, wherein: The workpiece is a multilayer wiring substrate having bumps arranged on the upper surface thereof to be electrically connected to the LSI chip.

4. The workpiece inspection device according to claim 3, wherein: A suction tool is provided, and the suction tool is respectively provided on the first stage and the second stage, and sucks the bottom surface of the multilayer wiring substrate.

5. The workpiece inspection device according to claim 1 or 2, wherein: Another inspection tool is provided, which performs another inspection on the workpiece on the first stage and the second stage located on the opposite side of the first transfer position and the second transfer position.

6. The workpiece inspection device according to claim 1 or 2, wherein: The above-mentioned conveying part, Obtaining a pallet storing the workpieces before inspection, The pallet is alternately positioned near the first handover position and the second handover position to perform the handover of the workpiece. The tray storing the inspected workpieces is discharged.

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