A semiconductor etching method and etching apparatus

Abstract

This invention discloses a semiconductor etching method and etching apparatus, relating to the field of semiconductor technology. The semiconductor etching method includes the following steps: S1: Cleaning the etching products in the etching area. The wafer to be etched is placed in the etching apparatus, and a mask layer is formed on the wafer; S2: Using the etching equipment of the etching apparatus to perform etching operations, alternating between etching operations and the above-mentioned cleaning; S3: After etching is completed, the remaining mask layer and surrounding etching products on the wafer surface are blown away, and the etching apparatus transfers the etched wafer to the cleaning area; S4: The cleaning area is located inside the etching apparatus. The cleaning structure in the cleaning area cleans the wafer. After the wafer is cleaned, it is removed. This allows for effective etching, ensuring the etching effect, and facilitating the cleaning of the wafer after etching. The wafer does not need to be removed from the apparatus, reducing the possibility of semiconductor contamination.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a semiconductor etching method and etching apparatus. Background Technology

[0002] Chinese patent application number 202110179380.X discloses a semiconductor etching apparatus and etching method. The semiconductor etching apparatus includes a process chamber, with excitation coils disposed on the top wall and / or side wall of the process chamber. A magnetron sputtering assembly is disposed within the process chamber and mounted on the side wall of the process chamber, located above a support member for holding the wafer within the process chamber. The magnetron sputtering assembly includes a base assembly and a shielding assembly. The base assembly is used to fix the target material and attract plasma to bombard the target material. The shielding assembly is rotatable and used to selectively shield the target material. The semiconductor etching apparatus provided by the above technical solution can solve the problem of bottom notches easily generated during current etching processes, which pose a significant risk of leakage current in semiconductor devices.

[0003] However, the semiconductor etching equipment and method also have some problems. For example, there is a certain distance between the etching equipment and the cleaning equipment, which can easily lead to contamination of the semiconductor material and affect the yield of the semiconductor etched products. In addition, air can easily seep into the equipment, which can affect the semiconductor etching effect. Summary of the Invention

[0004] The purpose of this application is to provide a semiconductor etching method and etching apparatus to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this application provides the following technical solution: a semiconductor etching method, comprising the following steps:

[0006] S1: Clean the etching products in the etching area, place the wafer to be etched into the etching device, and a mask layer is formed on the wafer;

[0007] S2: Use etching equipment to perform etching operations, alternating between etching operations and the cleaning described above;

[0008] S3: After etching is completed, the remaining mask layer and surrounding etching products on the wafer surface are blown away, and the etching device transfers the etched wafer to the cleaning area.

[0009] S4: The cleaning area is located inside the etching equipment. The cleaning structure in the cleaning area cleans the wafer. After the wafer is cleaned, it is removed.

[0010] The above structure allows for effective etching, ensuring the etching effect and facilitating the cleaning of the wafer after etching.

[0011] A semiconductor etching apparatus includes a support base box. A sealing cover is bolted to the top of the support base box. A partition frame is integrally machined inside the sealing cover. A cleaning device is bolted to the cleaning area inside the sealing cover. An etching chamber is located on the left side inside the sealing cover. A sealed lifting door is slidably connected inside the partition frame. A rotating shaft is rotatably fitted through a hole at the top of the support base box. The bottom end of the rotating shaft extends into the interior of the support base box and is keyed to a worm gear. A transfer disc is keyed to the top end of the rotating shaft. Negative pressure tanks are bolted to both sides inside the support base box and communicate with the sealing cover. An air extraction cylinder is bolted to the bottom of the interior of the support base box and communicates with the two negative pressure tanks. A reduction mechanism meshes with the rear side of the worm gear. A reciprocating mechanism is bolted to the piston rod of the air extraction cylinder. The reciprocating mechanism is connected to the reduction mechanism.

[0012] Furthermore, the transmission of the structure can drive the transfer plate to rotate, and the transfer plate can carry the etched semiconductor directly into the bottom of the cleaning equipment without removing it from the device, reducing the possibility of semiconductor contamination. The generated negative pressure can be used to suck out air in time, protecting the inside of the sealing cover.

[0013] Preferably, the reduction mechanism includes a power motor, a drive wheel, a transmission belt, a driven wheel, and a sprocket assembly. The bottom of the power motor is bolted to the bottom of the support base box, the output end of the power motor is keyed to the shaft of the drive wheel, the inside of the drive wheel is driven to the bottom of the transmission belt, the top of the transmission belt is driven to the inside of the driven wheel, and the driven wheel is keyed to the sprocket assembly.

[0014] Furthermore, the power supply to the drive motor is turned on, and the drive motor is fixed by the support base to ensure the smooth operation of the drive motor. The drive motor can drive the drive wheel to rotate, the drive wheel can drive the transmission belt to rotate, and the transmission belt can drive the driven wheel to rotate. The radius of the drive wheel is smaller than the radius of the driven wheel, which can produce a deceleration effect on the driven wheel. The driven wheel can drive the sprocket assembly to rotate.

[0015] Preferably, the sprocket assembly includes a main sprocket, a chain, a secondary sprocket, and a worm. The right side of the main sprocket is keyed to the left side of the driven sprocket. The teeth of the main sprocket mesh with the inside of the chain. The top of the inside of the chain meshes with the teeth of the secondary sprocket. The axis of the secondary sprocket is keyed to the right end of the worm. The surface of the worm meshes with the rear side of the worm wheel. The worm is keyed to the reciprocating mechanism.

[0016] Furthermore, the driven wheel can drive the main sprocket to rotate, the main sprocket can drive the chain to rotate, the chain can drive the secondary sprocket to rotate, the secondary sprocket can drive the worm to rotate, and the worm can drive the worm wheel to rotate.

[0017] Preferably, a support plate is bolted to the right side of the middle of the support base box, the shaft of the main sprocket is rotatably connected to the right side of the support plate, and the right end of the worm gear surface is rotatably sleeved with the hole at the top of the support plate.

[0018] Furthermore, the main sprocket is rotatably mounted on a support plate via bearings to ensure the smoothness of its rotation, and the worm gear is rotatably mounted on a support plate via bearings, with the support plate providing support.

[0019] Preferably, the reciprocating mechanism includes a crankshaft, a transmission frame, a slide bar, and a reciprocating assembly. The left end of the worm gear is keyed to the right end of the crankshaft, the curved part of the crankshaft is rotatably sleeved with the top end of the transmission frame, the bottom end of the transmission frame is hinged to the top of the slide bar, and the slide bar is slidably connected to the reciprocating assembly.

[0020] Furthermore, the worm gear can drive the crankshaft to rotate. The crankshaft and the transmission frame are eccentrically connected. The crankshaft can drive the transmission frame to move up and down. The transmission frame is rotated with the crankshaft through bearings. The transmission frame can drive the slide bar to move up and down. The slide bar can drive the reciprocating assembly to move.

[0021] Preferably, the reciprocating assembly includes a slider, an L-shaped frame, a sliding sleeve, and a transmission bar. The groove of the transmission bar is slidably connected to the rear side of the slider. The surface of the slider is hinged to the left end of the L-shaped frame. The bottom end of the surface of the L-shaped frame is slidably connected to the inside of the sliding sleeve. The rear side of the sliding sleeve is hinged to the surface of the transmission bar. The left end of the transmission bar is bolted to the piston rod of the vacuum pump.

[0022] Furthermore, the slide bar can drive the slider to move up and down, the slider can drive the L-shaped frame to rotate forward and backward, the L-shaped frame can slide inside the slide sleeve and drive the slide sleeve to move left and right, the slide sleeve can drive the transmission bar to move left and right, and the transmission bar can drive the piston of the vacuum pump to move left and right.

[0023] Preferably, both ends of the crankshaft are rotatably sleeved with support blocks, the top of the support blocks are bolted to the top of the support base box, and the rear side of the slide rail is slidably connected to a slide frame, the rear side of the slide frame is bolted to the interior of the support base box.

[0024] Furthermore, the crankshaft is rotatably mounted on a bearing and a support block. The support block is used to stabilize the crankshaft and ensure the long-term operation of the crankshaft and transmission frame. The slide bar is slidably mounted on a slide rail and a slide frame to guide the slide bar.

[0025] Preferably, the rear side of the transmission bar is slidably connected to a limiting frame, the rear side of the limiting frame is bolted to the interior of the support base box, and the hole on the rear side of the L-shaped frame is hinged to the interior of the support base box.

[0026] Furthermore, the transmission bar is slidably set with a slide rail and a limit frame to guide the transmission bar, making it convenient for the transmission bar to drive the air pump. The L-shaped frame is rotatably set with a bearing and a supporting base box.

[0027] Preferably, a vent is provided at the bottom of the support base box, and a breathable mesh is snapped into the vent. The air outlet of the air extraction cylinder corresponds to the vent of the support base box.

[0028] Furthermore, the vent of the supporting base box is used for air to enter and exit, making it convenient for the air pump to discharge the internal air. The air pump is connected to two negative pressure tanks through pipes, and the two negative pressure tanks are connected to the sealing cover through pipes. A solenoid valve is installed on the pipes, and the heat of the power motor is also carried away by the air entering and exiting.

[0029] In summary, the technical effects and advantages of this invention are as follows:

[0030] 1. The reduction mechanism can drive the rotating shaft to rotate through the worm gear, and the rotating shaft can then drive the semiconductor material to switch directly between the etching chamber and the cleaning equipment via the transfer plate;

[0031] 2. The deceleration mechanism can drive the air pump to reciprocate through the reciprocating mechanism. The air pump can generate negative pressure inside the negative pressure tank, which facilitates the extraction of air from inside the sealed cover.

[0032] The transmission mechanism of the structure can drive the transfer tray to rotate, which can then carry the etched semiconductor directly into the bottom of the cleaning equipment without removing it from the device, reducing the possibility of semiconductor contamination. The generated negative pressure can also be used to promptly suck out air, protecting the inside of the sealed cover. Attached Figure Description

[0033] Figure 1 This is a flowchart illustrating the process of an embodiment of this application;

[0034] Figure 2 This is a front view schematic diagram of an embodiment of this application;

[0035] Figure 3 This is a schematic diagram of the deceleration mechanism according to an embodiment of this application;

[0036] Figure 4 This is a three-dimensional schematic diagram of the main sprocket according to an embodiment of this application;

[0037] Figure 5 This is a three-dimensional schematic diagram of the crankshaft according to an embodiment of this application;

[0038] Figure 6 This is a three-dimensional schematic diagram of the slide bar according to an embodiment of this application;

[0039] Figure 7 This is a top view of the slide bar according to an embodiment of this application;

[0040] Figure 8 This is a top view of a worm gear according to an embodiment of this application.

[0041] In the diagram: 1. Support base box; 2. Reduction mechanism; 21. Power motor; 22. Drive wheel; 23. Transmission belt; 24. Driven wheel; 25. Main sprocket; 26. Chain; 27. Secondary sprocket; 28. Worm gear; 3. Reciprocating mechanism; 31. Crankshaft; 32. Transmission frame; 33. Sliding groove; 34. Slider; 35. L-shaped frame; 36. Sliding sleeve; 37. Transmission bar; 4. Sealing cover; 5. Divider frame; 6. Cleaning equipment; 7. Worm gear; 8. Rotating shaft; 9. Transfer plate; 10. Air extraction cylinder; 11. Negative pressure tank; 12. Ventilation mesh; 13. Etching chamber; 14. Sealed lifting door. Detailed Implementation

[0042] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0043] Example

[0044] refer to Figure 1-8 This embodiment proposes a semiconductor etching method, including the following steps:

[0045] S1: Clean the etching products in the etching area, place the wafer to be etched into the etching device, and a mask layer is formed on the wafer;

[0046] S2: Use etching equipment to perform etching operations, alternating between etching operations and the cleaning described above;

[0047] S3: After etching is completed, the remaining mask layer and surrounding etching products on the wafer surface are blown away, and the etching device transfers the etched wafer to the cleaning area.

[0048] S4: The cleaning area is located inside the etching equipment. The cleaning structure in the cleaning area cleans the wafer. After the wafer is cleaned, it is removed.

[0049] The aforementioned mechanism can effectively perform etching, ensure the etching effect, and facilitate the cleaning of the wafer after etching.

[0050] As a preferred embodiment of this invention, a semiconductor etching apparatus includes a support base box 1. A sealing cover 4 is bolted to the top of the support base box 1. A partition frame 5 is integrally machined inside the sealing cover 4. A cleaning device 6 is bolted to the cleaning area inside the sealing cover 4. An etching chamber 13 is provided on the left side inside the sealing cover 4. A sealed lifting door 14 is slidably connected inside the partition frame 5. A rotating shaft 8 is rotatably sleeved in the hole at the top of the support base box 1. The bottom end of the rotating shaft 8 extends into the interior of the support base box 1 and is keyed to a worm gear 7. A transfer plate 9 is keyed to the top end of the rotating shaft 8. Negative pressure tanks 11 are bolted to both sides inside the support base box 1. The negative pressure tanks 11 are connected to the sealing cover 4. An air extraction cylinder 10 is bolted to the bottom end inside the support base box 1. The air extraction cylinder 10 is connected to the two negative pressure tanks 11. A reduction mechanism 2 is engaged on the rear side of the worm gear 7. A reciprocating mechanism 3 is bolted to the piston rod of the air extraction cylinder 10. The reciprocating mechanism 3 and the reduction mechanism 2 are connected.

[0051] The transmission structure can drive the transfer disk 9 to rotate, and the transfer disk 9 can carry the etched semiconductor directly into the bottom of the cleaning equipment 6 without removing it from the device, reducing the possibility of semiconductor contamination. The generated negative pressure can be used to suck out air in time, protecting the inside of the sealing cover 4.

[0052] In this embodiment, the reduction mechanism 2 includes a power motor 21, a drive wheel 22, a transmission belt 23, a driven wheel 24, and a sprocket assembly. The bottom of the power motor 21 is bolted to the bottom of the support base box 1. The output end of the power motor 21 is keyed to the shaft of the drive wheel 22. The inside of the drive wheel 22 is connected to the bottom of the transmission belt 23. The top of the transmission belt 23 is connected to the inside of the driven wheel 24. The driven wheel 24 is keyed to the sprocket assembly.

[0053] When the power supply to the motor 21 is turned on, the motor 21 is fixed by the support base box 1 to ensure the smooth operation of the motor 21. The motor 21 can drive the drive wheel 22 to rotate, the drive wheel 22 can drive the transmission belt 23 to rotate, and the transmission belt 23 can drive the driven wheel 24 to rotate. The radius of the drive wheel 22 is smaller than the radius of the driven wheel 24, which can produce a deceleration effect on the driven wheel 24. The driven wheel 24 can drive the sprocket assembly to rotate, and the sprocket assembly can drive the worm gear 7 to rotate.

[0054] In this embodiment, the sprocket assembly includes a main sprocket 25, a chain 26, a secondary sprocket 27, and a worm 28. The right side of the main sprocket 25 is keyed to the left side of the driven wheel 24. The teeth of the main sprocket 25 mesh with the inside of the chain 26. The top end of the inside of the chain 26 meshes with the teeth of the secondary sprocket 27. The axis of the secondary sprocket 27 is keyed to the right end of the worm 28. The surface of the worm 28 meshes with the rear side of the worm wheel 7. The worm 28 is keyed to the reciprocating mechanism 3.

[0055] The driven wheel 24 can drive the main sprocket 25 to rotate, the main sprocket 25 can drive the chain 26 to rotate, the chain 26 can drive the auxiliary sprocket 27 to rotate. The size of the main sprocket 25 is smaller than that of the auxiliary sprocket 27, which can produce a speed reduction effect on the auxiliary sprocket 27. The auxiliary sprocket 27 can drive the worm 28 to rotate, the worm 28 can drive the worm wheel 7 to rotate, and the worm 28 can drive the reciprocating mechanism 3 to move.

[0056] In this embodiment, a support plate is bolted to the right side of the middle of the support base box 1, the shaft of the main sprocket 25 is rotatably connected to the right side of the support plate, and the right end of the worm gear 28 is rotatably sleeved with the hole at the top of the support plate.

[0057] The main sprocket 25 is rotatably mounted on a support plate via a bearing to ensure the smoothness of its rotation. The worm gear 28 is rotatably mounted on a support plate via a bearing, and the support plate is used for support.

[0058] In this embodiment, the reciprocating mechanism 3 includes a crankshaft 31, a transmission frame 32, a slide bar 33, and a reciprocating assembly. The left end of the worm gear 28 is keyed to the right end of the crankshaft 31. The curved part of the crankshaft 31 is rotatably sleeved with the top end of the transmission frame 32. The bottom end of the transmission frame 32 is hinged to the top end of the slide bar 33. The slide bar 33 is slidably connected to the reciprocating assembly.

[0059] The worm gear 28 can drive the crankshaft 31 to rotate. The crankshaft 31 and the transmission frame 32 are eccentrically connected. The crankshaft 31 can drive the transmission frame 32 to move up and down. The transmission frame 32 is rotatably connected to the crankshaft 31 through bearings. The transmission frame 32 can drive the slide bar 33 to move up and down. The slide bar 33 can drive the reciprocating assembly to move. The reciprocating assembly can drive the vacuum pump 10 to move.

[0060] In this embodiment, the reciprocating assembly includes a slider 34, an L-shaped frame 35, a sliding sleeve 36, and a transmission bar 37. The groove of the sliding bar 33 is slidably connected to the rear side of the slider 34. The surface of the slider 34 is hinged to the left end of the L-shaped frame 35. The bottom end of the surface of the L-shaped frame 35 is slidably connected to the inside of the sliding sleeve 36. The rear side of the sliding sleeve 36 is hinged to the surface of the transmission bar 37. The left end of the transmission bar 37 is bolted to the piston rod of the vacuum pump 10.

[0061] The slide bar 33 can drive the slider 34 to move up and down, the slider 34 can drive the L-shaped frame 35 to rotate forward and backward, the L-shaped frame 35 can slide inside the slide sleeve 36 and drive the slide sleeve 36 to move left and right, the slide sleeve 36 can drive the transmission bar 37 to move left and right, and the transmission bar 37 can drive the piston of the vacuum pump 10 to move left and right.

[0062] In this embodiment, both ends of the crankshaft 31 are rotatably sleeved with support blocks, the top of the support blocks are bolted to the top of the support base box 1, and the rear side of the slide rail 33 is slidably connected with a slide frame, the rear side of the slide frame is bolted to the interior of the support base box 1.

[0063] The crankshaft 31 is rotatably mounted on a bearing and a support block. The support block is used to stabilize the crankshaft 31 and ensure the long-term operation of the crankshaft 31 and the transmission frame 32. The slide bar 33 is slidably mounted on a slide rail and a slide frame to guide the slide bar 33.

[0064] In this embodiment, a limit frame is slidably connected to the rear side of the transmission bar 37, and the rear side of the limit frame is bolted to the interior of the support base box 1. The hole on the rear side of the L-shaped frame 35 is hinged to the interior of the support base box 1.

[0065] The transmission bar 37 is slidably set with the slide rail and the limit frame to guide the transmission bar 37, so that the transmission bar 37 can drive the air pump 10 to move. The L-shaped frame 35 is rotatably set with the support base box 1 through the bearing.

[0066] In this embodiment, a vent is opened at the bottom of the support base box 1, and a breathable mesh 12 is snapped into the vent. The air outlet of the air extraction cylinder 10 corresponds to the vent of the support base box 1.

[0067] The vent of the support base box 1 is used for air to enter and exit, which facilitates the exhaust of air from the inside by the air pump 10. The air pump 10 is connected to two negative pressure tanks 11 through pipes. The two negative pressure tanks 11 are connected to the sealing cover 4 through pipes, and a solenoid valve is installed on the pipe. The heat of the power motor 21 will also be carried away by the air entering and exiting.

[0068] Working Principle: The cleaning device 6 can adopt the existing semiconductor etching cleaning structure. The etching chamber 13 is used to install etching equipment. The power supply to the motor 21 is connected, and the motor 21 is fixed by the support base 1 to ensure stable operation. The motor 21 drives the drive wheel 22 to rotate, which in turn drives the transmission belt 23 to rotate. The transmission belt 23 drives the driven wheel 24 to rotate. The radius of the drive wheel 22 is smaller than that of the driven wheel 24, which can reduce the speed of the driven wheel 24. The driven wheel 24 drives the main sprocket 25 to rotate, which in turn drives the chain 26 to rotate. The chain 26 drives the secondary sprocket 27 to rotate, which in turn drives the worm gear 28 to rotate. The worm gear 28 drives the worm wheel 7 to rotate, which in turn drives the rotating shaft 8 to rotate. The rotating shaft 8 is rotatably connected to the support base 1 via bearings. The rotating shaft 8 can drive the transfer disc 9 to rotate. The conveyor plate 9 can carry the etched semiconductor into the bottom of the cleaning device 6. The cleaning device 6 is used to clean the semiconductor. The worm gear 28 can drive the crankshaft 31 to rotate. The crankshaft 31 and the transmission frame 32 are eccentrically connected. The crankshaft 31 can drive the transmission frame 32 to move up and down. The transmission frame 32 is rotated with the crankshaft 31 through bearings. The transmission frame 32 can drive the sliding bar 33 to move up and down. The sliding bar 33 can drive the slider 34 to move up and down. The slider 34 can drive the L-shaped frame 35 to rotate forward and backward. The L-shaped frame 35 can slide inside the sliding sleeve 36 and drive the sliding sleeve 36 to move left and right. The sliding sleeve 36 can drive the transmission bar 37 to move left and right. The transmission bar 37 can drive the piston of the vacuum pump 10 to move left and right. The vacuum pump 10 can use an existing piston-type vacuum pump. The vacuum pump 10 can extract air from the inside of the two negative pressure tanks 11. The negative pressure tanks 11 can extract air from the inside of the sealing cover 4 by setting valves.

[0069] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A semiconductor etching method, characterized in that, Includes the following steps: S1: Clean the etching products in the etching area, place the wafer to be etched into the etching device, and a mask layer is formed on the wafer; S2: Use etching equipment to perform etching operations, alternating between etching operations and the cleaning described above; S3: After etching is completed, the remaining mask layer and surrounding etching products on the wafer surface are blown away, and the etching device transfers the etched wafer to the cleaning area. S4: The cleaning area is located inside the etching equipment. The cleaning structure in the cleaning area cleans the wafer. After the wafer is cleaned, it is removed. According to the above semiconductor etching method, a support base box (1) is included. A sealing cover (4) is bolted to the top of the support base box (1). A partition frame (5) is integrally machined inside the sealing cover (4). A cleaning device (6) is bolted to the cleaning area inside the sealing cover (4). An etching chamber (13) is provided on the left side inside the sealing cover (4). A sealing lifting door (14) is slidably connected inside the partition frame (5). A rotating shaft (8) is rotatably sleeved on the hole at the top of the support base box (1). The bottom end of the rotating shaft (8) extends... A worm gear (7) is keyed to the inside of the support base box (1), and a transfer plate (9) is keyed to the top of the rotating shaft (8). Negative pressure tanks (11) are bolted to both sides inside the support base box (1). The negative pressure tanks (11) are connected to the sealing cover (4). An air pump (10) is bolted to the bottom inside the support base box (1). The air pump (10) is connected to the two negative pressure tanks (11). A reduction mechanism (2) is engaged on the rear side of the worm gear (7). A reciprocating mechanism (3) is bolted to the piston rod of the air pump (10). The deceleration mechanism (2) includes a power motor (21), a drive wheel (22), a transmission belt (23), a driven wheel (24), and a sprocket assembly. The bottom of the power motor (21) is bolted to the bottom of the support base box (1). The output end of the power motor (21) is keyed to the shaft of the drive wheel (22). The inside of the drive wheel (22) is connected to the bottom of the transmission belt (23). The top of the inside of the transmission belt (23) is connected to the inside of the driven wheel (24). The driven wheel (24) is keyed to the sprocket assembly.

2. The semiconductor etching method according to claim 1, characterized in that, The sprocket assembly includes a main sprocket (25), a chain (26), a secondary sprocket (27), and a worm (28). The right side of the main sprocket (25) is keyed to the left side of the driven wheel (24). The teeth of the main sprocket (25) mesh with the inside of the chain (26). The top of the inside of the chain (26) meshes with the teeth of the secondary sprocket (27). The axis of the secondary sprocket (27) is keyed to the right end of the worm (28). The surface of the worm (28) meshes with the rear side of the worm wheel (7). The worm (28) is keyed to the reciprocating mechanism (3).

3. The semiconductor etching method according to claim 2, characterized in that, The support base box (1) is bolted to the right side of the middle section, and the main sprocket (25) is rotatably connected to the right side of the support plate. The right end of the worm gear (28) is rotatably sleeved with the hole at the top of the support plate.

4. The semiconductor etching method according to claim 3, characterized in that, The reciprocating mechanism (3) includes a crankshaft (31), a transmission frame (32), a slide bar (33), and a reciprocating assembly. The left end of the worm (28) is keyed to the right end of the crankshaft (31). The curved part of the crankshaft (31) is rotatably sleeved with the top end of the transmission frame (32). The bottom end of the transmission frame (32) is hinged to the top end of the slide bar (33). The slide bar (33) is slidably connected to the reciprocating assembly.

5. A semiconductor etching method according to claim 4, characterized in that, The reciprocating assembly includes a slider (34), an L-shaped frame (35), a sliding sleeve (36), and a transmission bar (37). The groove of the sliding bar (33) is slidably connected to the rear side of the slider (34). The surface of the slider (34) is hinged to the left end of the L-shaped frame (35). The bottom end of the surface of the L-shaped frame (35) is slidably connected to the inside of the sliding sleeve (36). The rear side of the sliding sleeve (36) is hinged to the surface of the transmission bar (37). The left end of the transmission bar (37) is bolted to the piston rod of the vacuum pump (10).

6. The semiconductor etching method according to claim 4, characterized in that, Both ends of the crankshaft (31) are rotatably sleeved with support blocks. The top of the support blocks is bolted to the top of the support base box (1). The rear side of the slide bar (33) is slidably connected with a slide frame. The rear side of the slide frame is bolted to the interior of the support base box (1).

7. A semiconductor etching method according to claim 5, characterized in that, The rear side of the transmission bar (37) is slidably connected to a limit frame, the rear side of the limit frame is bolted to the interior of the support base box (1), and the hole on the rear side of the L-shaped frame (35) is hinged to the interior of the support base box (1).

8. A semiconductor etching method according to claim 1, characterized in that, A vent is opened at the bottom of the support base box (1), and a breathable mesh (12) is snapped into the inside of the vent. The air outlet of the air pump (10) corresponds to the vent of the support base box (1).

Images