Converters and power semiconductor components

Abstract

A flow distributor (1) for a coolant substance (18) of a power semiconductor component (16) is described, comprising - a first plate (2) extending along a main extension plane of the flow distributor (1), - a second plate (3) extending along the main extension plane, - a first wall (4) arranged on the first plate (2) and the second plate (3) from a first main side of the flow distributor (1), and - a second wall (5) arranged on the first plate (2) and the second plate (3) from a second main side of the flow distributor (1) opposite the first main side, wherein - the first plate (2) is arranged adjacent to the second plate (3), - at least one first recess (6) is arranged between the first plate (2) and the second plate (3), and - at least one second recess (7) is arranged between the first plate (2) and the second plate (3). Further, a power semiconductor component (16) is described.

Description

Technical Field

[0001] This disclosure relates to a flow inverter for a coolant material in a power semiconductor component and a power semiconductor component. Summary of the Invention

[0002] Embodiments of this disclosure relate to a converter that can improve cooling efficiency. Further embodiments of this disclosure relate to a power semiconductor device.

[0003] This is achieved through the subject matter of the independent claims. Further embodiments according to the dependent claims will be apparent in the following description.

[0004] The first aspect relates to a converter for a coolant material in a power semiconductor component. Herein and hereinafter, the term "power" refers, for example, to a power semiconductor component, power semiconductor module, and / or power semiconductor chip suitable for handling voltages and currents exceeding 100V and / or exceeding 10A (exemplarily, voltages up to 6.5kV and currents up to 3600A).

[0005] The coolant material can be, for example, a liquid coolant or a gaseous coolant. Exemplarily, the heat generated during the operation of a power semiconductor module can be effectively dissipated by the coolant material.

[0006] The converter, for example, has a main extension plane. The lateral direction is parallel to the main extension plane and the vertical direction is perpendicular to the main extension plane.

[0007] According to an embodiment, the converter includes a first plate that extends along the main extension plane of the converter. For example, the first plate extends generally in a lateral direction. Here and hereinafter, "generally" means that the first plate may enclose at an angle of up to 30° or 15° (e.g., 5° or 1°) relative to the main extension plane. Exemplarily, the first plate extends parallel to the lateral direction.

[0008] For example, the first plate comprises or is made of metal or polymer. Exemplarily, the metal is a weldable metal.

[0009] According to an embodiment, the converter includes a second plate that extends along a main extension plane. For example, the second plate extends generally in a lateral direction. Here and hereinafter, "generally" means that the second plate may form an angle of up to 30° or 15° (e.g., 5° or 1°) relative to the main extension plane.

[0010] Exemplarily, the first and second plates comprise or are composed of the same material; that is, the second plate comprises or is composed of the metal or polymer of the first plate. For example, the first and second plates are integrally formed. Alternatively, the first and second plates comprise different materials.

[0011] According to an embodiment, the converter includes a first wall disposed on a first plate and a second plate from a first main side of the converter. Exemplarily, the first wall extends vertically away from the top surface of the first plate.

[0012] For example, the first wall comprises or is made of a metal or polymer. For instance, the first wall comprises the same material as the first plate. Alternatively, the first wall comprises a different material than the first plate.

[0013] The first wall is formed integrally with the first plate, for example. Alternatively, the first wall is welded to the first plate, or the first wall is fixed to the first plate by other connection methods.

[0014] According to an embodiment, the converter includes a second wall disposed on a first plate and a second plate from a second main side of the converter opposite to the first main side. Exemplarily, the first wall extends vertically away from the bottom surface of the second plate.

[0015] That is, the first plate includes a top surface and a bottom surface, which are arranged opposite to each other. The top surface and the bottom surface of the first plate are connected through a side surface of the first plate. Further, the second plate includes a top surface and a bottom surface, which are arranged opposite to each other. The top surface and the bottom surface of the second plate are connected through a side surface of the second plate. The top surface of the first plate and the bottom surface of the second plate are arranged opposite to each other.

[0016] For example, the first plate and the second plate are connected to each other by a first wall and a second wall. For example, the first wall is disposed on the first plate in a side region of the converter, and the first wall is disposed on the second plate in a central region of the converter. Exemplarily, the second wall is disposed on the first plate in the central region of the converter, and the second wall is disposed on the second plate in a side region of the converter. That is, in the extending direction of the converter, the first wall protrudes beyond the first plate in the lateral direction, and the second wall protrudes beyond the second plate in the lateral direction.

[0017] According to embodiments of the converter, the first plate and the second plate are arranged adjacent to each other. Exemplarily, the first plate and the second plate are directly adjacent to each other. For example, the second plate and the first plate are arranged side-by-side sequentially in the extending direction of the converter, for example, in the indicated order. For example, the first plate and the second plate are in direct contact with each other. Exemplarily, the first plate and the second plate are mechanically connected to each other.

[0018] According to an embodiment of the converter, at least one first notch is provided between the first plate and the second plate.

[0019] According to a further embodiment of the converter, at least one first notch is provided in the central region of the converter.

[0020] For example, the second plate includes a first notch located in the central region of the converter. For instance, the first notch extends vertically through the second plate from the top surface to the bottom surface. The central region is located in the area between the first and second plates. Furthermore, for example, the central region is at a distance from the side surface defining the converter.

[0021] According to an embodiment of the converter, at least one second notch is provided between the first plate and the second plate.

[0022] According to a further embodiment of the converter, at least one second notch is provided in at least one side region of the converter.

[0023] For example, the first plate includes at least one second notch in at least one side region of the converter. Exemplarily, the at least one second notch penetrates the first plate vertically from the top surface to the bottom surface. The at least one side region is located in a region defining at least one side surface of the converter. Furthermore, for example, the at least one side region is directly adjacent to at least one side surface of the converter.

[0024] In summary, such a converter, having this first notch and at least one second notch, for the coolant material used in power semiconductor components, offers particularly the following advantages. As described in more detail below, if such a converter is used in a cooling chamber on which power semiconductor modules are arranged, the rated current is advantageously achieved because the power semiconductor modules can be effectively cooled. Exemplarily, only the cooling of the last power semiconductor module in the row is improved, but this module limits the maximum permissible losses and thus the current capability of the entire setup. Furthermore, the uniformity of cooling for all power semiconductor modules can be improved. This is also advantageous in terms of reducing the demand for power modules and improving reliability. Cost reduction is achieved because there is an opportunity to reduce the number of chips in the power modules.

[0025] The positive effects are significant at low flow rates where the coolant temperature rises considerably. For example, if the coolant temperature at the inlet is below 0°C, there could be a temperature rise of over 60K between the inlet and outlet.

[0026] According to a further embodiment of the converter, the first plate and the second plate extend parallel to each other. For example, the first plate and the second plate extend in a common plane. Exemplarily, the common plane extends parallel to the lateral direction.

[0027] According to a further embodiment of the converter, the first wall extends entirely along the width of the first plate. Exemplarily, the width of the first plate is defined by a minimum extent of the first plate in a transverse direction perpendicular to the direction of extension.

[0028] In this embodiment, the first wall extends completely from a first side surface of the first plate to a second side surface of the first plate. Exemplarily, the first side surface of the first plate is arranged opposite to the second side surface of the first plate. The first side surface and / or the second side surface may extend parallel to the extension direction. Alternatively, the first side surface and / or the second side surface may be at an angle relative to the extension direction.

[0029] The second plate includes a first side surface and a second side surface, the first side surface extending in an extension direction, and the second side surface extending in an extension direction. Exemplarily, the first side surface and the second side surface of the second plate are arranged opposite to each other. Further, the first side surface and the first side surface of the first plate extend in a common direction, and the second side surface of the first plate and the second side surface of the second plate extend in another common direction.

[0030] For example, the converter includes a first side surface that defines the converter in a first side region, the first side surface being formed by a first side surface of a first plate and a first side surface of a second plate. Further, the converter includes a second side surface that defines the converter in a second side region, the second side surface being formed by a second side surface of a first plate and a second side surface of a second plate.

[0031] For example, the first wall terminates flush with the first side surface and the second side surface of the first plate.

[0032] According to a further embodiment of the converter, the second wall extends entirely along the width of the second plate. Exemplarily, the width of the second plate is defined by a minimum extent of the second plate in a transverse direction perpendicular to the direction of extension.

[0033] In this embodiment, the second wall extends completely from the first side surface of the second plate to the second side surface of the second plate. For example, the second wall terminates flush with both the first and second side surfaces of the second plate.

[0034] According to a further embodiment of the converter, in a plan view, the first wall has a first curved shape. For example, the first curved shape is in the form of a semicircle, half of a polygon, or a bottomless triangle.

[0035] For example, the first wall includes at least two first partial walls that are connected to each other. If there are two partial walls, the connection is located in the central portion. Each of the at least two first partial walls extends straight or curved in the lateral direction. For example, the at least two first partial walls enclose each other at an angle of less than 180° (exemplarily, 160°). For example, the enclosing angle of the at least two first partial walls faces the first plate.

[0036] For example, the first wall comprises more than two first partial walls. Directly adjacent first partial walls enclose each other at an angle of less than 180°. The enclosing angles of directly adjacent first partial walls may be different from each other. For example, the enclosing angles of the first partial walls extending through the central region and the corresponding enclosing angles of the directly adjacent first partial walls are formed symmetrically with respect to the direction of extension. Alternatively, the enclosing angles of the first partial walls extending through the central region and the corresponding enclosing angles of the directly adjacent first partial walls are formed asymmetrically with respect to the direction of extension.

[0037] For example, the first wall may consist of an even number of first partial walls, such as four first partial walls. Alternatively, the first wall may consist of an odd number of first partial walls, such as three first partial walls.

[0038] According to a further embodiment of the converter, the outer surface of the first curved shape points in the direction of the second plate. Exemplarily, the first curved shape includes an outer surface and an inner surface opposite to the outer surface. The inner surface points in the direction of the center of the first curved shape.

[0039] Due to the shape of the first wall, the coolant material can be effectively guided to the side region of the converter.

[0040] According to a further embodiment of the converter, the region of maximum curvature of the first curved shape points toward the direction of the second plate. For example, the region of maximum curvature of the first curved shape is located in the central region. Exemplarily, the first portion wall directly adjacent to the first portion wall located in the central region has the smallest enclosing angle and therefore the largest curvature.

[0041] According to a further embodiment of the converter, in a plan view, the second wall has a second curved shape. For example, the second curved shape is in the form of a semicircle or half of a polygon.

[0042] For example, the second wall includes at least two second partial walls connected to each other. Each of the at least two second partial walls extends straight or curved in the lateral direction. For example, the at least two second partial walls enclose each other at an angle of less than 180° (exemplarily, 160°). For example, the enclosing angle of the at least two second partial walls faces the second plate.

[0043] For example, the second wall comprises more than two second partial walls. Directly adjacent second partial walls enclose each other at an angle of less than 180°. The enclosing angles of directly adjacent second partial walls may differ from one another. For example, the enclosing angles of the second partial walls extending through the central region and the corresponding enclosing angles of the directly adjacent second partial walls are formed symmetrically with respect to the direction of extension. Alternatively, the enclosing angles of the second partial walls extending through the central region and the corresponding enclosing angles of the directly adjacent second partial walls are formed asymmetrically with respect to the direction of extension.

[0044] For example, the second wall comprises an even number of first part walls, such as four second part walls. Alternatively, the second wall comprises an odd number of first part walls, such as three second part walls.

[0045] According to a further embodiment of the converter, the outer surface of the second curved shape points in the direction of the first plate. Exemplarily, the second curved shape includes an outer surface and an inner surface opposite to the outer surface.

[0046] Due to the shape of the second wall, the coolant material can be effectively guided to the central region of the converter.

[0047] According to a further embodiment of the converter, the region of maximum curvature of the second curved shape points towards the direction of the first plate. For example, the region of maximum curvature of the second curved shape is located in at least one side region. Exemplarily, the directly adjacent second partial wall located in at least one side region has the smallest enclosing angle and thus the largest curvature.

[0048] According to a further embodiment of the converter, two second notches are provided between the first plate and the second plate in two opposite side regions of the converter. For example, a central region is arranged between the two opposite side regions, and exemplaryly, the first and second side regions of the converter are perpendicular to the direction of extension.

[0049] According to a further embodiment of the converter, a first notch is disposed between two second notches. For example, the first of the two second notches is disposed in a first side region, and the second of the two second notches is disposed in a second side region.

[0050] According to a further embodiment of the converter, in a plan view, the first wall and the second wall at least partially overlap each other, thereby at least partially defining the first notch and at least one second notch. For example, in a plan view, the first wall and the second wall have two points of overlap. The points of overlap define the extent of the first notch in the central region in a transverse direction perpendicular to the extension direction. Further, the first wall and the second wall define the extent of the first notch in the central region in a transverse direction located in the extension direction. That is, the first notch is defined in the central region by the first wall and the second wall.

[0051] One of the overlapping points and the first or second side surface of the converter closer to the overlapping point define at least one second notch in the plan view in a transverse direction perpendicular to the extension direction. Further, the second wall and the first wall define at least one second notch in at least one side region in the transverse direction located in the extension direction.

[0052] According to a further embodiment of the converter, the first notch is provided on the side of the first wall facing the first plate.

[0053] According to a further embodiment of the converter, at least one second notch is provided on the side of the first wall facing the second plate.

[0054] The second aspect relates to a power semiconductor device that may include the converter described above herein. Therefore, the features described in connection with the converter also apply to the power semiconductor device, and vice versa.

[0055] According to an embodiment, the power semiconductor component includes at least two power semiconductor modules, each power semiconductor module being connected to a corresponding cooling structure. For example, each power semiconductor module includes a bottom surface on which a cooling structure is disposed. Exemplarily, in a plan view, each cooling structure at least partially or completely overlaps with the corresponding power semiconductor module.

[0056] For example, each power semiconductor module is in direct contact with the cooling structure. Alternatively, a bonding layer is arranged between each power semiconductor module and the cooling structure. Each cooling structure is configured, for example, to increase the area of ​​the bottom surface of the corresponding power semiconductor module. For example, the cooling structure comprises copper, aluminum, or a composite material comprising AlSiC or MgSiC, or is made of copper, aluminum, or a composite material comprising AlSiC or MgSiC.

[0057] For example, each cooling structure includes multiple needle-like fins. For instance, the needle-like fins of one cooling structure face away from the corresponding power semiconductor module in the vertical direction. Each needle-like fin is formed, for example, by a column extending in the vertical direction. Exemplarily, all the needle-like fins have a common extending direction parallel to the vertical direction. For example, each column is conical or cylindrical in shape.

[0058] Alternatively, each cooling structure includes a fin or rib structure. Each fin extends vertically with its end facing away from the power semiconductor module. Further, each fin extends laterally across the width or length of the corresponding power semiconductor module. Exemplarily, each fin or rib is straight, or each fin or rib has a specific geometry, such as wavy, serrated, or irregular geometry.

[0059] According to an embodiment, the power semiconductor component includes a cooling chamber having an inlet and an outlet. For example, the cooling chamber includes a cover, at least two sidewalls, a front side, a back side, and a bottom, forming a cooling cavity. Exemplarily, the at least two sidewalls are connected in a lateral direction via the front side and the back side. Exemplarily, the cover and the bottom are connected in a vertical direction via the at least two sidewalls, the front side, and the back side.

[0060] For example, a cooling structure is part of a power semiconductor module. In this case, the cooling chamber (e.g., a cover) includes at least two openings. A power semiconductor module having one cooling structure is arranged over each opening, with each cooling structure protruding through the corresponding opening.

[0061] Alternatively, the cooling structure is part of the cooling chamber. In this case, exemplarily, all the cooling structures are part of the cover. For example, the cooling structure is formed integrally with the cooling chamber. Exemplarily, the cooling chamber is a closed-loop cooler.

[0062] It is possible that one of the at least two cooling structures protrudes through at least one opening into the cooling chamber, while the other of the at least two cooling structures is integrally formed with the cooling chamber.

[0063] According to embodiments of power semiconductor components, the cooling chamber is adapted to allow the coolant material within the cooling chamber to flow from the inlet to the outlet. The flow direction of the coolant material is, for example, parallel to the extension direction of the converter. Furthermore, the flow direction of the coolant material is, for example, parallel to the main extension direction of the cooling chamber, i.e., along the main extension direction of the sidewalls, cover, and bottom.

[0064] For example, an inlet is provided on the front and an outlet is provided on the back. Alternatively, an inlet and an outlet are provided on the bottom. For instance, an inlet is provided on the bottom in an area near the front and an outlet is provided on the bottom in an area near the back.

[0065] According to embodiments of the power semiconductor component, each of at least two cooling structures is sequentially disposed within the cooling chamber in the direction of flow. For example, each of the at least two cooling structures extends vertically into the cooling chamber (i.e., cavity). For example, within the cavity, the cooling structure extends from the plane of the cover toward the bottom.

[0066] For example, a gap is formed between the cooling structure (e.g., an end of the cooling structure) and the bottom of the cooling chamber. That is, the bottom portion near the bottom of the cooling chamber has no cooling structure. The height of the gap in the vertical direction is, for example, at most 2 mm, such as 0.8 mm. Alternatively, there is no gap, and the cooling structure is in direct contact with the bottom of the cooling chamber.

[0067] For example, each cooling structure is configured to create flow resistance to the coolant material flowing from the inlet to the outlet. For instance, the cover closer to the top section (where the cooling structure is located) has higher flow resistance than the cover closer to the bottom section (where no cooling structure is located). That is, the coolant material travels at a higher velocity in the bottom section than in the top section.

[0068] According to embodiments of the power semiconductor component, the cooling chamber includes a converter disposed between two of at least two cooling structures. If the power semiconductor component includes more than two power semiconductor modules, and therefore more than two coolant structures, the converter is arranged between two adjacent cooling structures closer to the outlet. Exemplarily, the converter is arranged between the two adjacent cooling structures closest to the outlet.

[0069] For example, a power semiconductor component may also include more than one converter. Exemplarily, each converter is disposed between two adjacent cooling structures. In this case, each converter has the same form. Alternatively, at least one converter may differ from the others.

[0070] For example, the circulator is part of the cooling chamber. In this case, the circulator is a component of the cooling chamber.

[0071] Alternatively, the converter can be mounted as a separate component within the cooling chamber. In this case, the converter is welded, brazed, or bonded to the cooling chamber (e.g., via a laser welding process). Alternatively, the converter may be clamped within the cooling chamber or simply placed within it.

[0072] For example, the first main side of the inverter faces the cover of the cooling chamber, while the second main side of the inverter faces the bottom of the cooling chamber.

[0073] According to a further embodiment of the power semiconductor device, the converter is configured to redirect coolant material flowing in the bottom portion of the cooling chamber before the converter in the flow direction to the top portion of the cooling chamber after the converter in the flow direction.

[0074] According to a further embodiment of the power semiconductor device, the converter is configured to redirect coolant material flowing in the top portion of the cooling chamber before the converter in the flow direction to a region near the bottom portion of the cooling chamber after the converter in the flow direction.

[0075] For example, the coolant material has a temperature gradient in the vertical direction. For instance, in the flow direction before the converter, the coolant material has a first average temperature in the top portion of the cooling chamber, and in the flow direction before the converter, the coolant material has a second average temperature in the bottom portion of the cooling chamber. Exemplarily, the first average temperature is higher than the second average temperature because the cooling structure dissipates more heat to the coolant material in the top portion. Advantageously, the converter is configured to rotate the portions of the coolant material that have different average temperatures in the vertical direction.

[0076] For example, a portion of the coolant material with a higher average temperature flowing in the top portion before the converter in the flow direction is blocked by a first wall that guides the coolant material to at least one second notch. Furthermore, a portion of the coolant material with a lower average temperature flowing in the bottom portion before the converter in the flow direction is blocked by a second wall that guides the coolant material to at least one first notch.

[0077] The portion of the coolant material that was directed to at least one second notch is redirected in the flow direction to the bottom portion of the cooling chamber after the diverter. The portion of the coolant material that was directed to the first notch is redirected in the flow direction to the top portion of the cooling chamber after the diverter.

[0078] Furthermore, the portion of the coolant material that was directed to the first notch is redirected in the flow direction to the central portion of the cooling chamber after the diverter. The portion of the coolant material that was directed to at least one second notch is redirected in the flow direction to the side portion of the cooling chamber after the diverter.

[0079] Advantageously, compared to an arrangement without a converter, the power semiconductor module positioned after the converter in the flow direction can be cooled more effectively due to this transposition of the coolant material in the top and bottom portions. For example, more uniform cooling is more effective, such as cooling the last power semiconductor module in the flow direction, which defines the maximum permissible current for the entire setup.

[0080] According to a further embodiment of the power semiconductor device, the converter of the power semiconductor device is the converter described above herein.

[0081] According to a further embodiment of the power semiconductor component, the first plate is closer to the outlet, while the second plate is closer to the inlet. That is, the direction of extension of the converter is in the direction of flow.

[0082] According to a further embodiment of the power semiconductor component, the first plate extends parallel to the cover and bottom of the cooling chamber.

[0083] According to a further embodiment of the power semiconductor component, the second plate extends parallel to the cover and bottom of the cooling chamber.

[0084] According to a further embodiment of the power semiconductor device, the first wall extends perpendicular to the cover and bottom of the cooling chamber. Alternatively, the first wall extends obliquely relative to the cover and bottom of the cooling chamber.

[0085] According to a further embodiment of the power semiconductor component, the second wall extends perpendicular to the cover and bottom of the cooling chamber. Alternatively, the second wall extends obliquely relative to the cover and bottom of the cooling chamber.

[0086] According to a further embodiment of the power semiconductor component, a first wall extends from a first side surface of the cooling chamber to a second side surface of the cooling chamber. Exemplarily, the first side surface of the converter is in direct contact with the first side surface of the cooling chamber. Further, exemplaryly, the second side surface of the converter is in direct contact with the second side surface of the cooling chamber. For example, due to manufacturing tolerances, the first wall is only in partial direct contact with both the first and second side surfaces of the cooling chamber. Alternatively, the first wall is not in direct contact with either the first or second side surface of the cooling chamber.

[0087] For example, the first wall extends upwards to the cover of the cooling chamber. Exemplarily, the first wall is in direct contact with the cover of the cooling chamber. For example, due to manufacturing tolerances, the first wall is at least partially in direct contact with the cover of the cooling chamber. Alternatively, the first wall may not be in direct contact with the cover of the cooling chamber.

[0088] According to a further embodiment of the power semiconductor component, the second wall extends from the first side surface of the cooling chamber to the second side surface of the cooling chamber. For example, due to manufacturing tolerances, the second wall only partially contacts the first and second side surfaces of the cooling chamber in direct contact. Alternatively, the second wall does not directly contact the first and second side surfaces of the cooling chamber.

[0089] For example, the second wall extends upwards to the bottom of the cooling chamber. Exemplarily, the second wall is in direct contact with the bottom of the cooling chamber. For example, due to manufacturing tolerances, the second wall is at least partially in direct contact with the bottom of the cooling chamber. Alternatively, the second wall is not in direct contact with the bottom of the cooling chamber.

[0090] In other words, the converter divides the cooling chamber (e.g., cavity) into a first part closer to the inlet and a second part closer to the outlet. Exemplarily, the first and second parts are connected to each other only through a first notch and at least one second notch of the converter.

[0091] Furthermore, this document describes a method for manufacturing power semiconductor devices, which can be used to produce or manufacture power semiconductor devices as described above herein. Therefore, features related to power semiconductor devices are also disclosed in conjunction with the method, and vice versa.

[0092] According to an embodiment of the method, at least two power semiconductor modules are provided, each power semiconductor module being connected to a corresponding cooling structure.

[0093] According to an embodiment of the method, a cooling chamber is provided, which has an inlet and an outlet.

[0094] According to an embodiment of the method, at least two power semiconductor modules are arranged on a cooling chamber.

[0095] According to an embodiment of the method, the converter is arranged between two of at least two cooling structures.

[0096] For example, the converter is integrally formed and arranged in a cooling chamber. In this case, the converter can be welded or bonded to the cooling chamber. Alternatively, the converter can be clamped inside the cooling chamber or simply placed in the cooling chamber.

[0097] Alternatively, the converter is at least partially formed by a portion of the cooling chamber. For example, a first wall is part of a cover and / or a second wall is part of a bottom. Exemplarily, the first wall and / or the second wall are welded, bonded, brazed, or clamped to a first plate and / or a second plate. Additionally, exemplaryly, the first wall is welded, brazed, or bonded to the cover, or integrally formed with the cover. Additionally, exemplaryly, the second wall is welded, brazed, or bonded to the bottom, or integrally formed with the bottom.

[0098] According to a further embodiment of the method, the converter is configured to redirect coolant material flowing in the bottom portion of the cooling chamber before the converter in the flow direction to the top portion of the cooling chamber after the converter in the flow direction.

[0099] According to a further embodiment of the method, the diverter is configured to redirect coolant material flowing in the top portion of the cooling chamber before the diverter in the flow direction to a region near the bottom portion of the cooling chamber after the diverter in the flow direction.

[0100] According to a further embodiment of the method, the converter is arranged as a separate component in the cooling chamber by at least one of welding, soft soldering, clamping, hard soldering, bonding, or insertion. Attached Figure Description

[0101] The accompanying drawings are included to provide further understanding. In the drawings, elements with the same structure and / or function may be indicated by the same reference numerals. It should be understood that the embodiments shown in the drawings are illustrative and not necessarily drawn to scale.

[0102] Figure 1 This is a three-dimensional schematic top view of a converter according to an exemplary embodiment.

[0103] Figure 2 This is a three-dimensional schematic bottom view of a converter according to an exemplary embodiment.

[0104] Figure 3 and Figure 4 Each is a cross-sectional view of a converter according to an exemplary embodiment.

[0105] Figure 5 This is a cross-sectional view of a power semiconductor device according to an exemplary embodiment, and

[0106] Figure 6 This is a three-dimensional schematic top view of a power semiconductor device according to an exemplary embodiment. Detailed Implementation

[0107] according to Figure 1 The converter 1 includes a first plate 2 and a second plate 3. The second plate 3 and the first plate 2 are arranged adjacent to each other in the indicated order along the extending direction D. A first wall 4 is arranged on the first plate 2 (e.g., at the edge of the first plate 2) from the first main side in the two side regions 13 of the converter 1, and on the second plate 3 (e.g., at the edge of the second plate 3) from the second main side in the central region 12. Furthermore, a second wall 5 is arranged on the second plate 3 in the side regions 13 of the converter 1, and on the first plate 2 in the central region 12 of the converter 1.

[0108] The first plate 2 has a first side surface 8 and a second side surface 9, and the second plate 3 has a first side surface 10 and a second side surface 11. The first side surface 8 and the second side surface 9 of the first plate 2 are arranged opposite to each other. Further, the first side surface 10 and the second side surface 11 of the second plate 3 are arranged opposite to each other. The first side surface 8 of the first plate and the first side surface 10 of the second plate form the first side surface of the converter 1. Further, the second side surface 9 of the first plate and the second side surface 11 of the second plate form the second side surface of the converter 1. Both the first side surface and the second side surface of the converter 1 extend along the extending direction D.

[0109] The first wall 4 extends completely from the first side surface 8 of the first plate to the second side surface 9 of the first plate. Furthermore, the second wall 5 extends completely from the first side surface 10 of the second plate to the second side surface 11 of the second plate.

[0110] The first wall 4 comprises four first partial walls 14, wherein directly adjacent first partial walls 14 are directly connected to each other, for example, integrally formed. The directly adjacent first partial walls 14 enclose each other at an angle. Here, the enclosing angles are all the same. Therefore, in a plan view, the first wall 4 has a first curved shape. In this exemplary embodiment, the first curved shape is half of an octagon. The outer surface 30 of the first curved shape points towards the second plate 3.

[0111] A first recess 6 is provided in the central region 12 between the first plate 2 and the second plate 3. The first recess 6 completely penetrates the second plate 3 in the central region 12. Furthermore, two second recesses 7 are provided between the first plate 2 and the second plate 3. Each of the two second recesses 7 completely penetrates the first plate 2 in the side region 13. The first recess 6 is provided between the two second recesses 7 perpendicular to the extending direction D.

[0112] In the plan view, the first wall 4 and the second wall 5 overlap each other at least partially, thereby defining at least partially the first notch 6 and the two second notches 7. Thus, the first notch 6 is defined in the central region 12 by the first wall 4 and the second wall 5.

[0113] according to Figure 2 The second wall 5 comprises three second partial walls 15, wherein directly adjacent second partial walls 15 are directly connected to each other, for example, integrally formed. The directly adjacent second partial walls 15 enclose each other at an angle. Here, the enclosing angles are all the same. Therefore, in the plan view, the second wall 5 has a second curved shape. The outer surface 31 of the second curved shape points towards the direction of the first plate 2.

[0114] Furthermore, each second notch 7 is defined by the first wall 4 and the second wall 5 in the corresponding side region 13, and in the plan view, each second notch is defined by a protrusion on the outer surface of the converter.

[0115] according to Figure 3 and Figure 4 The converter 1 includes a first plate 2 and a second plate 3, wherein the first plate 2 and the second plate 3 extend in a common plane.

[0116] The first wall 4 and the second wall 5 each extend in a direction perpendicular to the extension direction D of the converter 1.

[0117] The first plate 2 and the second plate 3, as well as the first wall 4 and the second wall 5, are formed integrally, for example.

[0118] Figure 5 The power semiconductor component 16 includes three power semiconductor modules 17, each power semiconductor module being connected to a cooling structure 21, wherein each cooling structure 21 is a part of, for example, a component of, the corresponding power semiconductor module 17.

[0119] The power semiconductor module 17 is located in the cooling chamber. Figure 5 (Not shown in the image) On the upper part, the corresponding cooling structure 21 is arranged in the cooling chamber, and the cooling chamber is combined with Figure 6 A more detailed description is provided. The cooling chamber has an inlet of 19 and an outlet of 20 ( Figure 5 (Not shown in the image), combining imports and exports Figure 6 A more detailed description is provided. Furthermore, the cooling chamber is adapted to allow the coolant substance 18 within the cooling chamber to flow in the direction FD from the inlet 19 to the outlet 20.

[0120] Power semiconductor modules 17 are sequentially arranged on the cooling chamber along the flow direction FD. Therefore, each cooling structure 21 is sequentially arranged in the cooling chamber in the direction of the flow direction FD.

[0121] In addition, according to Figures 1 to 4 The converter 1 is disposed in the cooling chamber between two of the at least two cooling structures 21. Figure 5 The area where the converter 1 is arranged is marked by two dashed lines. The converter 1 is arranged within these two dashed lines. In this exemplary embodiment, the converter 1 is arranged between the directly adjacent power semiconductor modules 17 closest to the outlet 20.

[0122] In the flow direction FD, before the converter 1, the coolant material 18 has a first average temperature in the top portion X of the cooling chamber, and in the flow direction FD, before the converter 1, the coolant material has a second average temperature in the bottom portion X' of the cooling chamber. Here, the average first average temperature is higher than the average second average temperature because the cooling structure 21 dissipates more heat to the coolant material 18 in the top portion X.

[0123] Following the flow converter 1 in the flow direction FD, the flow converter 1 vertically repositions the coolant material 18. Therefore, in the flow direction FD, following the flow converter 1, a portion of the coolant material in the top portion X is redirected to the bottom portion Y' of the cooling chamber, and in the flow direction FD, following the flow converter 1, a portion of the coolant material in the bottom portion X' is redirected to the top portion Y of the cooling chamber. Consequently, the power semiconductor module 17 closest to the outlet 20 can be effectively cooled.

[0124] Figure 6 The power semiconductor component 16 has a cooling chamber, which includes a cover 25, two side walls 24, a front side 22, a back side 23, and a bottom 26, forming a cooling cavity. A cooling structure 21 is located inside the cooling cavity.

[0125] Such as combination Figure 5 As already described, the converter 1 is arranged between the directly adjacent cooling structures 21 closest to the outlet 20. The second plate 3 faces the inlet 19, while the first plate 2 faces the outlet 20.

[0126] Figure Labels

[0127] 1. Converter

[0128] 2 First board

[0129] 3 Second board

[0130] 4 First Wall

[0131] 5. Second Wall

[0132] 6 First notch

[0133] 7 Second notch

[0134] 8 First side surface of the first plate

[0135] 9. Second side surface of the first plate

[0136] 10 The first side surface of the second plate

[0137] 11 The second side surface of the second plate

[0138] 12 Central Region

[0139] 13 lateral regions

[0140] 14 Part One Wall

[0141] 15 Part Two Wall

[0142] 16 Power Semiconductor Components

[0143] 17 Power Semiconductor Modules

[0144] 18. Coolant substances

[0145] 19 Imports

[0146] 20 Exports

[0147] 21 Cooling Structure

[0148] 22 Front

[0149] 23 Back

[0150] 24 Sidewalls

[0151] 25 lids

[0152] 26 Bottom

[0153] 28 First Main Side

[0154] 29 Second Main Side

[0155] 30 The outer surface of the first curved shape

[0156] 31 The outer surface of the second curved shape

[0157] X is located at the top section before the converter.

[0158] X' is located at the bottom section before the converter.

[0159] Y is located at the top after the converter.

[0160] Y' is located at the bottom after the converter.

[0161] D Extension direction

[0162] FD flow direction

Claims

1. A converter (1) for a coolant substance (18) for a power semiconductor component (16), the power semiconductor component having at least two power semiconductor modules (17) and a cooling chamber, the converter comprising: - First plate (2), the first plate extends along the main extension plane of the converter (1), - Second plate (3), the second plate extends along the main extension plane, - A first wall (4), the first wall being disposed on the first plate (2) and the second plate (3) from the first main side of the converter (1), and - A second wall (5), the second wall being disposed on the first plate (2) and the second plate (3) from the second main side of the converter (1) opposite to the first main side, wherein, - The first plate (2) and the second plate (3) are arranged adjacent to each other. - At least one first notch (6) is provided between the first plate (2) and the second plate (3), and - At least one second notch (7) is provided between the first plate (2) and the second plate (3).

2. The converter (1) according to claim 1, wherein, - The at least one first notch (6) is disposed in the central region (12) of the converter (1), and - The at least one second notch (7) is provided in at least one side region (13) of the converter (1).

3. The converter (1) according to claim 1 or 2, wherein, The first plate (2) and the second plate (3) extend parallel to each other.

4. The converter (1) according to claim 1 or 2, wherein, - The first wall (4) extends entirely along the width of the first plate (2), and - The second wall (5) extends completely along the width of the second plate (3).

5. The converter (1) according to claim 1 or 2, wherein, At least one of the following: - In the plan view, the first wall (4) has a first curved shape, and the outer surface of the first curved shape points in the direction of the second plate (3), and - In the plan view, the second wall (5) has a second curved shape, and the outer surface of the second curved shape points in the direction of the first plate (2).

6. The converter (1) according to claim 1 or 2, wherein, Two second notches (7) are provided between the first plate (2) and the second plate (3) in two opposite side regions (13) of the converter (1).

7. The converter (1) according to claim 6, wherein, The first notch (6) is disposed between the two second notches (7).

8. The converter (1) according to claim 1 or 2, wherein, In the plan view, the first wall (4) and the second wall (5) overlap each other at least partially, thereby defining the first notch (6) and the at least one second notch (7) at least partially.

9. The converter (1) according to claim 1 or 2, wherein, - The first notch (6) is provided on the side of the first wall (4) facing the first plate (2); - The at least one second notch (7) is provided on the side of the first wall (4) facing the second plate (3).

10. A power semiconductor device (16), the power semiconductor device comprising: - At least two power semiconductor modules (17), each power semiconductor module being connected to a corresponding cooling structure (21), and - A cooling chamber having an inlet (19) and an outlet (20), wherein, - The cooling chamber is adapted to allow the coolant substance (18) within the cooling chamber to flow in the direction of FD from the inlet (19) to the outlet (20). - Each of at least two of the cooling structures (21) is successively disposed in the cooling chamber in the direction of the flow direction (FD). - The cooling chamber includes a circulator (1) according to any one of claims 1 to 9, the circulator being disposed between two of at least two of the cooling structures (21).

11. The power semiconductor device (16) according to claim 10, wherein, - The first plate (2) is closer to the outlet (20), and - The second plate (3) is closer to the inlet (19).

12. The power semiconductor component (16) according to claim 10 or 11, wherein, At least one of the following: - The first plate (2) extends parallel to the cover and bottom of the cooling chamber. - The second plate (3) extends parallel to the cover and bottom of the cooling chamber. - The first wall (4) extends perpendicularly to the cover of the cooling chamber, and - The second wall (5) extends perpendicular to the bottom of the cooling chamber.

13. The power semiconductor component (16) according to claim 10 or 11, wherein, - The first wall (4) extends from the first side surface of the cooling chamber to the second side surface of the cooling chamber, and - The second wall (5) extends from the first side surface of the cooling chamber to the second side surface of the cooling chamber.

14. A method for producing a power semiconductor component (16), the method comprising: - Provide at least two power semiconductor modules (17), each power semiconductor module being connected to a corresponding cooling structure (21), and - Provide a cooling chamber having an inlet (19) and an outlet (20), - The at least two power semiconductor modules (17) are arranged on the cooling chamber, and - The circulator according to any one of claims 1 to 9 is arranged between two of the at least two cooling structures (21).

15. The method according to claim 14, wherein, The converter (1) is arranged as a separate component in the cooling chamber by at least one of welding, soft soldering, clamping, hard soldering, bonding or insertion.

Images