A packaging welding structure for semiconductor devices

Abstract

The present invention belongs to the technical field of welding equipment, and discloses a packaging welding structure of a semiconductor device, and its technical key points are: comprising a workbench, a support frame is fixedly installed on the surface of the workbench, a hydraulic cylinder is fixedly installed on the top wall of the support frame, a welding machine is fixedly installed on the telescopic end of the hydraulic cylinder, a welding rod is arranged on the bottom wall of the welding machine, a fixed cylinder is sleeved on the outer side of the bottom end of the welding rod, a first positioning component connected to the fixed cylinder is arranged on the bottom wall of the welding machine, a cleaning mechanism that cooperates with the welding rod is arranged in the inner cavity of the fixed cylinder, the cleaning mechanism comprises a cleaning brush, a second positioning component and a rotating component, the rotating component comprises a rotating part and a driving part, when the fixed cylinder and the welding rod move relative to each other in the vertical direction, the cleaning brush can be controlled to automatically rotate around the welding rod, the cleaning brush can automatically clean the welding slag attached to the surface of the welding rod, and effectively improve the welding efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of welding equipment, in particular to a packaging welding structure of a semiconductor device. Background Art

[0002] Semiconductor refers to a material whose conductivity can be controlled, ranging from insulator to conductor. Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous. In the semiconductor manufacturing process, after the wafer processing is completed and tested, it is necessary to cut the wafer into small chips according to the needs, and then attach the cut chips to the corresponding substrate and solder the pins, and then package them.

[0003] During the welding process, welding slag is easily adhered to the bottom of the welding rod. Existing welding equipment cannot automatically clean the welding slag attached to the bottom of the welding rod. The welding slag at the bottom of the welding rod needs to be cleaned manually, resulting in low welding efficiency. Summary of the invention

[0004] The object of the present invention is to provide a packaging welding structure of a semiconductor device to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A semiconductor device packaging welding structure comprises a workbench, support legs are fixedly installed around the bottom wall of the workbench, a support frame is fixedly installed on the surface of the workbench, the support frame is an inverted U-shaped structure, a substrate is placed on the surface of the workbench, a wafer is arranged on the surface of the substrate, a hydraulic cylinder is fixedly installed on the top wall of the support frame, a welding machine is fixedly installed on the telescopic end of the hydraulic cylinder, a welding rod is arranged on the bottom wall of the welding machine, a fixed cylinder is sleeved on the outer side of the bottom end of the welding rod, and the upper and lower ends of the fixed cylinder are connected, and the bottom wall of the welding machine is provided with a first positioning component connected to the fixed cylinder, the first positioning component is used to control the fixed cylinder to move along the axis direction of the welding rod, and the inner cavity of the fixed cylinder is provided with A cleaning mechanism that cooperates with the welding rod, the cleaning mechanism includes a cleaning brush, a second positioning assembly and a rotating assembly, the second positioning assembly is located on the inner wall of the fixed cylinder and is connected to the cleaning brush, the second positioning assembly controls multiple groups of cleaning brushes to be distributed in a circular shape with equal spacing around the welding rod in the inner cavity of the fixed cylinder, the rotating assembly includes a rotating part and a driving part, the rotating part is located on the side wall of the fixed cylinder and is connected to the second positioning assembly, the first positioning assembly and the rotating part are respectively connected to the driving part, when the fixed cylinder moves along the axial direction of the welding rod, the driving part controls the cleaning brush to rotate around the welding rod in the inner cavity of the fixed cylinder by cooperating with the rotating part.

[0007] As a further solution of the present invention: the first positioning assembly includes a fixing ring fixedly installed on the top of the fixing cylinder, a plurality of sliding holes distributed in a ring shape are opened on the surface of the fixing ring, a plurality of vertical rods located on the outside of the welding rod are fixedly installed on the bottom wall of the welding machine, one end of the vertical rod away from the welding machine extends downward through the sliding hole to the bottom of the fixing ring and is fixedly connected with a baffle, and an extrusion spring is fixedly installed on the bottom wall of the welding machine, the extrusion spring is sleeved on the outside of the welding rod and connected to the fixing ring.

[0008] As a further solution of the present invention: the second positioning assembly includes an annular groove opened on the annular inner wall of the fixed cylinder, a rotating ring is rotatably installed in the annular groove, the rotating ring extends to the outside of the annular groove and is fixedly installed with a carrying ring located in the inner cavity of the fixed cylinder, multiple groups of cleaning brushes are evenly distributed on the surface of the carrying ring, and the rotating ring is connected to the rotating part.

[0009] As a further solution of the present invention: the rotating part includes a transmission groove opened outwardly from the side wall of the ring groove, the transmission groove is located in the fixed ring and is connected to a group of sliding holes, a rotating column is rotatably installed in the transmission groove, a ring-shaped gear ring is arranged on the side wall of the rotating ring, a fixed gear disk meshing with the gear ring is fixedly installed on the surface of the rotating column, and the driving part is connected to the rotating column.

[0010] As a further solution of the present invention: the driving part includes a first rotating rod rotatably installed in the transmission groove, an active bevel gear plate is fixedly installed on the surface of the first rotating rod, a driven bevel gear plate meshing with the active bevel gear plate is fixedly installed on the bottom end of the rotating column, a second rotating rod is rotatably installed on the side of the transmission groove facing the sliding hole, synchronous disks are respectively fixedly installed on the surfaces of the first rotating rod and the second rotating rod, the two sets of synchronous disks are commonly connected with a synchronous belt, a rack is fixedly installed on the side wall of the vertical rod, and a control gear plate extending into the sliding hole and meshing with the rack is fixedly installed on the surface of the second rotating rod.

[0011] As a further solution of the present invention: a plurality of brackets are fixedly installed on the bottom end of the annular inner wall of the fixed cylinder, and the plurality of brackets are jointly fixedly installed with a scraper ring that cooperates with the welding rod.

[0012] As a further solution of the present invention: an annular protective pad is arranged at the bottom end of the fixed cylinder, and the protective pad is made of rubber material.

[0013] Compared with the prior art, the beneficial effect of the present invention is that by setting a rotating assembly composed of a rotating part and a driving part to cooperate with the second positioning assembly and the first positioning assembly, when the fixed cylinder and the welding rod move relative to each other in the vertical direction, the cleaning brush can be controlled to automatically rotate around the welding rod, and the cleaning brush can automatically clean the welding slag attached to the surface of the welding rod, thereby effectively improving the welding efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1The present invention is a schematic structural diagram of a packaging welding structure of a semiconductor device provided in an embodiment of the present invention.

[0015] Figure 2 for Figure 1 Schematic diagram of the enlarged structure of A.

[0016] Figure 3 for Figure 1 Schematic diagram of the enlarged structure of B.

[0017] Figure 4 The present invention is a schematic diagram of a fixing cylinder and its connection structure in a packaging welding structure of a semiconductor device provided in an embodiment of the present invention.

[0018] Among them: 1- workbench, 2- support frame, 3- hydraulic cylinder, 4- welding machine, 41- welding rod, 5- fixed cylinder, 6- first positioning assembly, 61- fixed ring, 62- sliding hole, 63- vertical rod, 64- baffle, 65- extrusion spring, 7- cleaning mechanism, 71- cleaning brush, 72- second positioning assembly, 721- ring groove, 722- rotating ring, 723- bearing ring, 73- rotating assembly, 731- rotating part, 7311 -transmission groove, 7312-rotating column, 7313-fixed gear plate, 7314-gear ring, 732-driving part, 7321-first rotating rod, 7322-active helical gear plate, 7323-driven helical gear plate, 7324-second rotating rod, 7325-synchronizing disk, 7326-synchronizing belt, 7327-rack, 7328-control gear plate, 8-bracket, 9-scraper ring, 10-substrate, 11-wafer, 12-protective pad. DETAILED DESCRIPTION

[0019] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0020] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0021] like Figure 1 , Figure 2 , Figure 4As shown, it is a structural diagram of a packaging welding structure of a semiconductor device provided by an embodiment of the present invention, comprising a workbench 1, support legs are fixedly installed on the four sides of the bottom wall of the workbench 1, a support frame 2 is fixedly installed on the surface of the workbench 1, and the support frame 2 is an inverted U-shaped structure. A substrate 10 is placed on the surface of the workbench 1, and a wafer 11 is arranged on the surface of the substrate 10. A hydraulic cylinder 3 is fixedly installed on the top wall of the support frame 2, and a welding machine 4 is fixedly installed on the telescopic end of the hydraulic cylinder 3. A welding rod 41 is arranged on the bottom wall of the welding machine 4, and a fixed cylinder 5 is sleeved on the outer side of the bottom end of the welding rod 41, and the upper and lower ends of the fixed cylinder 5 are connected. The bottom wall of the welding machine 4 is provided with a first positioning component 6 connected to the fixed cylinder 5, and the first positioning component 6 is used to control the fixed cylinder 5 to move along the axial direction of the welding rod 41, and the inner cavity of the fixed cylinder 5 is provided with a welding rod 41. The cleaning mechanism 7 cooperates with the rod 41, and the cleaning mechanism 7 includes a cleaning brush 71, a second positioning component 72 and a rotating component 73. The second positioning component 72 is located on the inner wall of the fixed cylinder 5 and is connected to the cleaning brush 71. The second positioning component 72 controls multiple groups of cleaning brushes 71 to be distributed in a circular shape with equal intervals around the welding rod 41 in the inner cavity of the fixed cylinder 5. The rotating component 73 includes a rotating part 731 and a driving part 732. The rotating part 731 is located on the side wall of the fixed cylinder 5 and is connected to the second positioning component 72. The first positioning component 6 and the rotating part 731 are respectively connected to the driving part 732. When the fixed cylinder 5 moves along the axial direction of the welding rod 41, the driving part 732 controls the cleaning brush 71 to rotate around the welding rod 41 in the inner cavity of the fixed cylinder 5 by cooperating with the rotating part 731.

[0022] Initially, the first positioning assembly 6 supports and positions the fixed cylinder 5, so that the fixed cylinder 5 is sleeved on the outer side of the bottom end of the welding rod 41, and the substrate 10 and the chip 11 to be welded are placed on the surface of the workbench 1, and the hydraulic cylinder 3 pushes the welding machine 4 to move vertically downward, and the welding rod 41 and the fixed cylinder 5 move upward synchronously. The bottom end of the fixed cylinder 5 first contacts the surface of the chip 11, and the welding rod 41 continues to move downward in the inner cavity of the fixed cylinder 5 and contacts the pins on the surface of the chip 11 for welding. After welding, the welding rod 41 first moves upward. At this time, the first positioning assembly 6 controls the fixed cylinder 5 to continue to be on the surface of the chip 11. When the welding rod 41 moves relatively in the vertical direction in the fixed cylinder 5, the driving part 732, the rotating part 731 and the second positioning assembly 72 cooperate with each other to control multiple groups of cleaning brushes 71 to rotate around the welding rod 41. The cleaning brush 71 can automatically clean the welding slag attached to the bottom end of the welding rod 41, which is convenient for subsequent continuous welding processing and effectively improves the welding efficiency.

[0023] like Figure 1 , Figure 2 , Figure 4As shown, as a preferred embodiment of the present invention, the first positioning assembly 6 includes a fixing ring 61 fixedly mounted on the top of the fixing tube 5, and a plurality of sliding holes 62 distributed in an annular shape are provided on the surface of the fixing ring 61. A plurality of vertical rods 63 located on the outside of the welding rod 41 are fixedly mounted on the bottom wall of the welding machine 4. One end of the vertical rod 63 away from the welding machine 4 extends downward through the sliding hole 62 to the bottom of the fixing ring 61 and is fixedly connected with a baffle 64. An extrusion spring 65 is fixedly mounted on the bottom wall of the welding machine 4. The extrusion spring 65 is sleeved on the outside of the welding rod 41 and is connected to the fixing ring 61.

[0024] When in use, multiple groups of vertical rods 63 and baffles 64 cooperate with each other to support and position the fixed ring 61, and then support and position the fixed cylinder 5. The extrusion spring 65 applies pressure to the fixed ring 61, so that the fixed cylinder 5 and the fixed ring 61 are at the bottom end of the vertical rod 63. When the bottom end of the fixed cylinder 5 contacts the surface of the chip 11 and the welding machine 4 continues to move downward, the fixed cylinder 5 and the fixed ring 61 move relatively upward in the vertical direction on the surface of the vertical rod 63, and the position of the fixed cylinder 5 can be conveniently adjusted.

[0025] like Figure 1 , Figure 2 , Figure 3 As shown, as a preferred embodiment of the present invention, the second positioning assembly 72 includes an annular groove 721 opened on the annular inner wall of the fixed cylinder 5, a rotating ring 722 is rotatably installed in the annular groove 721, the rotating ring 722 extends to the outside of the annular groove 721 and is fixedly installed with a supporting ring 723 located in the inner cavity of the fixed cylinder 5, a plurality of groups of cleaning brushes 71 are evenly distributed on the surface of the supporting ring 723, and the rotating ring 722 is connected to the rotating part 731.

[0026] The rotating ring 722 cooperates with the annular groove 721 to support and position the bearing ring 723 in the fixed cylinder 5. The bearing ring 723 supports and positions the cleaning brush 71 in the inner cavity of the fixed cylinder 5, so that multiple groups of cleaning brushes 71 are distributed in a ring around the welding rod 41. When the welding rod 41 and the fixed cylinder 5 move relative to each other in the vertical direction, the rotating part 731 controls the rotating ring 722 to rotate in the annular groove 721, and then can drive the bearing ring 723 to rotate synchronously in the fixed cylinder 5. The bearing ring 723 drives the cleaning brush 71 to rotate around the welding rod 41, and the cleaning brush 71 can automatically clean the welding slag attached to the bottom end of the welding rod 41.

[0027] like Figure 1 , Figure 2As shown, as a preferred embodiment of the present invention, the rotating part 731 includes a transmission groove 7311 opened outward from the side wall of the ring groove 731, the transmission groove 7311 is located in the fixed ring 61 and is connected with a group of sliding holes 62, a rotating column 7312 is rotatably installed in the transmission groove 7311, a ring-shaped gear ring 7314 is provided on the side wall of the rotating ring 722, a fixed gear disk 7313 meshing with the gear ring 7314 is fixedly installed on the surface of the rotating column 7312, and the driving part 732 is connected to the rotating column 7312.

[0028] When in use, the driving part 732 drives the rotating column 7312 to rotate, thereby driving the fixed gear plate 7313 to rotate synchronously in the transmission groove 7311 , and the fixed gear plate 7313 meshes with the gear ring 7314 for transmission, driving the rotating ring 722 to rotate in the ring groove 721 .

[0029] like Figure 1 , Figure 2 As shown, as a preferred embodiment of the present invention, the driving part 732 includes a first rotating rod 7321 rotatably installed in the transmission groove 7311, an active bevel gear plate 7322 is fixedly installed on the surface of the first rotating rod 7321, a driven bevel gear plate 7323 meshing with the active bevel gear plate 7322 is fixedly installed on the bottom end of the rotating column 7312, a second rotating rod 7324 is rotatably installed on the side of the transmission groove 7311 facing the sliding hole 62, synchronous disks 7325 are fixedly installed on the surfaces of the first rotating rod 7321 and the second rotating rod 7324, and the two sets of synchronous disks 7325 are commonly connected with a synchronous belt 7326, a rack 7327 is fixedly installed on the side wall of the vertical rod 63, and a control toothed disk 7328 extending into the sliding hole 62 and meshing with the rack 7327 is fixedly installed on the surface of the second rotating rod 7324.

[0030] When the fixed cylinder 5 and the welding rod 41 move relative to each other in the vertical direction, the fixed ring 61 on the surface of the fixed cylinder 5 moves synchronously along the vertical direction on the surface of the vertical rod 63. At this time, the control gear plate 7328 rolls along the surface of the rack 7327, and the control gear plate 7328 drives the second rotating rod 7324 to rotate synchronously. Through the cooperation of two sets of synchronous plates 7325 and the synchronous belt 7326, the first rotating rod 7321 can be driven to rotate. The first rotating rod 7321 drives the active bevel gear plate 7322 to rotate. The active bevel gear plate 7322 and the driven bevel gear plate 7323 are engaged for transmission, which can drive the rotating column 7312 to rotate in the transmission groove 7311.

[0031] like Figure 1 , Figure 3As shown in the figure, as a preferred embodiment of the present invention, multiple sets of brackets 8 are fixedly installed at the bottom end of the annular inner wall of the fixed cylinder 5, and the multiple sets of brackets 8 are jointly fixedly installed with a scraper ring 9 that cooperates with the welding rod 41. When the welding rod 71 moves in the vertical direction in the fixed cylinder 5, the welding rod 71 passes through the scraper ring 9, and the scraper ring 9 can further clean the welding slag on the surface of the welding rod 71.

[0032] like Figure 1 , Figure 3 As shown in FIG. 1 , as a preferred embodiment of the present invention, a ring-shaped protective pad 12 is provided at the bottom of the fixed cylinder 5, and the protective pad 12 is made of rubber material. The protective pad 12 at the bottom of the fixed cylinder 5 contacts the surface of the wafer 11, and can be flexibly pressed to avoid damage to the wafer 11.

[0033] The working principle of the present invention is as follows: the substrate 10 and the wafer 11 to be welded are placed on the surface of the workbench 1, the hydraulic cylinder 3 pushes the welding machine 4 to move vertically downward, the welding rod 41 and the fixed cylinder 5 move upward synchronously, the bottom end of the fixed cylinder 5 first contacts the surface of the wafer 11, the welding rod 41 continues to move downward in the inner cavity of the fixed cylinder 5 and contacts the pins on the surface of the wafer 11 for welding, after the welding is completed, the welding rod 41 first moves upward, at this time the first positioning assembly 6 controls the fixed cylinder 5 to continue to be on the surface of the wafer 11, and the welding rod 41 moves in the fixed cylinder 5 in the vertical direction. When the pair moves, the fixed ring 61 on the surface of the fixed cylinder 5 moves synchronously along the vertical direction on the surface of the vertical rod 63. At this time, the control toothed disc 7328 rolls along the surface of the rack 7327, and the control toothed disc 7328 drives the second rotating rod 7324 to rotate synchronously. Through the cooperation of the two sets of synchronous discs 7325 and the synchronous belt 7326, the first rotating rod 7321 can be driven to rotate, and the first rotating rod 7321 drives the active helical toothed disc 7322 to rotate. The active helical toothed disc 7322 and the driven helical toothed disc 7323 are meshed and driven, and the rotating column 7312 can be driven to rotate in the transmission groove 7311. The rotating column 7312 drives the fixed toothed disc 7313 to rotate synchronously in the transmission groove 7311, and the fixed toothed disc 7313 and the gear ring 7314 are meshed and driven, driving the rotating ring 722 to rotate in the ring groove 721. The rotating ring 722 drives the carrying ring 723 to rotate synchronously in the fixed cylinder 5 , and the carrying ring 723 drives the cleaning brush 71 to rotate around the welding rod 41 . The cleaning brush 71 can automatically clean the welding slag attached to the bottom end of the welding rod 41 .

[0034] The preferred embodiments of the present invention are described in detail above, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in this field without departing from the purpose of the present invention.

Claims

1. A semiconductor device packaging welding structure, comprising a workbench, support legs are fixedly installed around the bottom wall of the workbench, a support frame is fixedly installed on the surface of the workbench, the support frame is an inverted U-shaped structure, a substrate is placed on the surface of the workbench, a wafer is arranged on the surface of the substrate, a hydraulic cylinder is fixedly installed on the top wall of the support frame, a welding machine is fixedly installed on the telescopic end of the hydraulic cylinder, and a welding rod is arranged on the bottom wall of the welding machine, characterized in that: A fixed cylinder is sleeved on the outer side of the bottom end of the welding rod, and the upper and lower ends of the fixed cylinder are connected. The bottom wall of the welding machine is provided with a first positioning component connected to the fixed cylinder, and the first positioning component is used to control the movement of the fixed cylinder along the axis direction of the welding rod. The first positioning component includes a fixed ring fixedly installed on the top of the fixed cylinder, and a plurality of sliding holes distributed in an annular shape are opened on the surface of the fixed ring. A plurality of groups of vertical rods located on the outer side of the welding rod are fixedly installed on the bottom wall of the welding machine. One end of the vertical rod away from the welding machine extends downward through the sliding hole to the bottom of the fixed ring and is fixedly connected with a baffle. An extrusion spring is fixedly installed on the bottom wall of the welding machine, and the extrusion spring is sleeved on the welding The outer side of the rod is connected to the fixed ring, and the inner cavity of the fixed cylinder is provided with a cleaning mechanism that cooperates with the welding rod, and the cleaning mechanism includes a cleaning brush, a second positioning component and a rotating component. The second positioning component is located on the inner wall of the fixed cylinder and is connected to the cleaning brush. The second positioning component controls multiple groups of cleaning brushes to be distributed in a circular shape with equal spacing around the welding rod in the inner cavity of the fixed cylinder. The second positioning component includes an annular groove provided on the annular inner wall of the fixed cylinder, and a rotating ring is rotatably installed in the annular groove. The rotating ring extends to the outer side of the annular groove and is fixedly installed with a bearing ring located in the inner cavity of the fixed cylinder. Multiple groups of cleaning brushes are evenly distributed on the surface of the bearing ring. The rotating ring is connected to the rotating part, and the rotating assembly includes a rotating part and a driving part. The rotating part is located on the side wall of the fixed cylinder and is connected to the second positioning assembly. The first positioning assembly and the rotating part are respectively connected to the driving part. When the fixed cylinder moves along the axial direction of the welding rod, the driving part controls the cleaning brush to rotate around the welding rod in the inner cavity of the fixed cylinder by cooperating with the rotating part. The rotating part includes a transmission groove opened outwardly on the side wall of the ring groove. The transmission groove is located in the fixed ring and is connected to a group of sliding holes. A rotating column is rotatably installed in the transmission groove. The side wall of the rotating ring is provided with an annular gear ring. The surface of the rotating column is fixed A fixed toothed disc meshing with the gear ring is installed, and the driving part is connected to the rotating column, and the driving part includes a first rotating rod rotatably installed in the transmission groove, an active helical toothed disc is fixedly installed on the surface of the first rotating rod, and a driven helical toothed disc meshing with the active helical toothed disc is fixedly installed on the bottom end of the rotating column, and a second rotating rod is rotatably installed on the side of the transmission groove facing the sliding hole, and synchronous discs are fixedly installed on the surfaces of the first rotating rod and the second rotating rod respectively, and the two sets of synchronous discs are commonly connected with a synchronous belt, a rack is fixedly installed on the side wall of the vertical rod, and a control toothed disc extending into the sliding hole and meshing with the rack is fixedly installed on the surface of the second rotating rod.

2. A semiconductor device packaging welding structure according to claim 1, characterized in that: A plurality of brackets are fixedly installed on the bottom end of the annular inner wall of the fixed cylinder, and the plurality of brackets are jointly fixedly installed with a scraper ring which cooperates with the welding rod.

3. A semiconductor device packaging welding structure according to claim 1, characterized in that: An annular protective pad is arranged at the bottom end of the fixing cylinder, and the protective pad is made of rubber material.

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