Tin immersion production system and method for electronic components

Abstract

The invention relates to a tin immersion production system for electronic components, which comprises a machine table, the top surface of the machine table is provided with a material conveying mechanism, a clamping mechanism, an impurity removal mechanism and a welding aid mechanism, and the clamping mechanism comprises a mounting plate, a mounting seat and two clamping plates which are symmetrically distributed; the impurity removing mechanism comprises a tin slag groove, a support, a first reciprocating pushing mechanism and a scraper blade. According to the technical scheme, the electronic component can be conveyed through the material conveying component, the clamping mechanism is controlled through the mechanical arm to clamp the conveyed electronic component, then the clamped electronic component makes contact with the weld-aid component, and then the mechanical arm is controlled to make the clamped electronic component make contact with tin liquid in the tin bath for tin immersion operation; and after tin immersion is completed, residual tin oxide on the tin liquid is removed through the impurity removal mechanism, the purposes of optimizing the whole tin immersion process and improving the tin immersion efficiency and the tin immersion treatment quality are achieved, multiple electronic components can be clamped through the clamping mechanism for tin immersion, and the working efficiency of tin immersion is further improved.

Description

Technical Field

[0001] The invention relates to the technical field of electronic component processing, and in particular to a tin immersion production system and method for electronic components. Background Art

[0002] In the assembly and production process of electronic products, it is usually necessary to install electronic components on the PCB (printed circuit board) and then fix the electronic components on the PCB by welding. At present, the commonly used welding methods mainly include dip soldering, wave soldering, reflow soldering, etc. For PCB boards with through-hole insertion, dip soldering is still the main method. Dip soldering is a method of immersing the PCB board with electronic components inserted in tin in a molten tin furnace to complete the welding of many solder joints at one time.

[0003] The operation process of dip soldering is as follows: 1. Put tin into the tin furnace and heat the tin furnace to melt the tin; 2. Apply flux on the printed circuit board and component pins, usually by dipping the soldering surface of the printed circuit board and the component pins into the flux solution or foam, or spraying the flux solution onto the soldering surface of the printed circuit board and the component pins through a spray device; 3. Preheating can raise the printed circuit board and the component pins to a certain temperature and dry the applied flux; 4. Dip the soldering surface of the printed circuit board and the component pins into the melted tin in the tin furnace, so that the soldering surface of the printed circuit board and the component pins are in contact with the melted tin for a period of time and then take them out. The tin will be soldered on the soldering surface of the printed circuit board and the component pins, completing the soldering process. 5. Cut the pins of the soldered printed circuit board (cut off the redundant pins of the electronic components).

[0004] In order to ensure the effect of dip soldering and reduce the labor intensity of workers, an automatic tinning machine is often used to complete the entire process of dip soldering. The existing technology can meet general use requirements, but it still has the following disadvantages in actual use: 1. The tinning device for electronic components in the prior art has poor automation, low tinning processing efficiency, and poor tinning process control, so the quality of tinning of electronic components needs to be further improved; 2. The tinning device for electronic components in the prior art has a limited number of tinning processes in the same batch, and the tinning efficiency needs to be further improved. Summary of the invention

[0005] In view of this, an object of the present invention is to provide a tin immersion production system and method for electronic components to solve the problems raised in the above background technology.

[0006] The present invention is achieved through the following technical solutions: A soldering dipping production system for electronic components, including a machine platform. There are two sets of solder baths oppositely distributed on the top surface of the machine platform. A feeding mechanism, a clamping mechanism, a impurity removing mechanism and a soldering aid mechanism are arranged on the top surface of the machine platform. The feeding mechanism consists of a first feeding member, a second feeding member and a third feeding member. Both ends of the second feeding member are respectively connected to one end of the first feeding member and the third feeding member. Feeding channels for the movement of chips are opened on the top surfaces of the first feeding member, the second feeding member and the third feeding member; The clamping mechanism includes a mounting plate, a mounting seat and two symmetrically distributed clamping plates. Mounting holes are opened on the mounting plate. The mounting seat is mounted in the mounting holes. The two clamping plates are slidably matched with the bottom surface of the mounting seat; The impurity removing mechanism includes a solder dross tank, a bracket, a fifth reciprocating pushing mechanism and a scraper. One end of the bracket is mounted on the top surface of the machine platform, and the other end extends upward. The fifth reciprocating pushing mechanism is horizontally mounted on the top surface of the bracket. The scraper is mounted on one side of the fifth reciprocating pushing mechanism and is located above the notch of the solder bath; The soldering aid mechanism includes a liquid storage tank mounted on the top surface of the machine platform and a mounting groove clamped on the top surface of the liquid storage tank. A sponge body is arranged in the mounting groove.

[0007] Furthermore, the first feeding member includes a first connecting plate, two oppositely distributed clamping plates, a cleaning component and a collecting plate. The two oppositely distributed clamping plates are both mounted on the top surface of the first connecting plate and are respectively mounted at both ends of the first connecting plate. First sliding grooves for the sliding of the chip box are opened on the opposite surfaces of the two clamping plates. The cleaning component is mounted on one side of the first connecting plate. The collecting plate is mounted on the other side away from the cleaning component; The second feeding member includes a second connecting plate, a connecting hole and a third reciprocating pushing mechanism. The second connecting plate is in the shape of "厂". The connecting hole is opened at the bending part of the second connecting plate and horizontally penetrates the second connecting plate and is located in the feeding channel. The third reciprocating pushing mechanism is mounted on the bottom surface of the second connecting plate. The output direction of the third reciprocating pushing mechanism is the direction of the connecting hole; The third feeding member includes a fixed seat and a third connecting plate. The third connecting plate is mounted on the top surface of the fixed seat. The feeding channel is opened on the top surface of the third connecting plate.

[0008] Furthermore, the cleaning component includes a first reciprocating pushing mechanism and a pushing plate. The first reciprocating pushing mechanism is mounted on the bottom surface of the first connecting plate. An L-shaped plate is connected to one side of the first reciprocating pushing mechanism. The top surface of the horizontal plate of the L-shaped plate is higher than the first connecting plate. The L-shaped plate is connected to the pushing plate. The end of the pushing plate away from the L-shaped plate is slidably matched with the top surface of the first connecting plate and is located between the two clamping plates; An activity groove is opened at the bottom end of the first sliding groove close to the collecting plate. The activity groove horizontally penetrates the side wall of the first sliding groove. A second reciprocating pushing mechanism is arranged outside the first sliding groove above the activity groove. The bottom end of the second reciprocating pushing mechanism is connected to an activity block slidably matched in the activity groove.

[0009] Furthermore, a flipping mechanism is provided on one side of the third feeding member, and the flipping mechanism is used to flip the chips conveyed to the third feeding member. The flipping mechanism includes a support plate, a motor, a movable plate and two fixed rods installed on the same side of the fixed seat, the lower end of the fixed rod is connected to one side of the support plate, and the upper end extends upward and is higher than the third connecting plate, the motor is installed on the top surface of one side of the support plate, the output shaft of the motor is connected to a rotating rod, and ear plates are connected at both ends of the movable plate, the two ear plates respectively abut against the upper ends of the two fixed rods, the end of the rotating rod away from the motor is fixedly connected to one of the ear plates, and rotatably cooperates with one of the fixed rods, and the other ear plate is connected to the other fixed rod by a pin shaft.

[0010] Furthermore, a second slide groove is provided on the bottom surface of the mounting seat, and the second slide groove extends along the length direction of the mounting seat. The outer sides of the two clamping plates are connected to fixed plates, one end of the fixed plate is connected to the outer side of the clamping plate, and the other end extends upward. The top surfaces of the two fixed plates are installed with electric sliders that slide in the second slide groove. The two electric sliders respectively drive the two clamping plates to move synchronously toward each other or synchronously away from each other along the second slide groove.

[0011] Furthermore, two fourth reciprocating propulsion mechanisms are installed on the mounting plate, and the bottom ends of the two fourth reciprocating propulsion mechanisms longitudinally penetrate the bottom end of the mounting plate. The bottom ends of the two fourth reciprocating propulsion mechanisms are connected with an adsorption plate, and the adsorption plate is located between the two clamping plates.

[0012] Furthermore, a sixth reciprocating driving mechanism is vertically installed on one side of the bracket away from the tin slag tank, and the top surface of the sixth reciprocating driving mechanism is connected to the fifth reciprocating driving mechanism; A guide plate is arranged on the top surface of one side of the tin bath, the guide plate and the tin slag bath are installed on the same side of the tin bath, and the guide plate is located above the tin slag bath.

[0013] Furthermore, the top surfaces of the side walls on the opposite sides of the liquid storage tank are provided with card slots, and the opposite sides of the installation slot are respectively card-connected with the two card slots, and the sponge body is consistent with the internal space of the installation slot.

[0014] Furthermore, a plurality of through holes are provided on the bottom surface of the inner wall of the installation groove, and the plurality of through holes penetrate longitudinally through the bottom surface of the inner wall of the installation groove. A liquid injection hole is also provided on the bottom surface of the inner wall of the installation groove, and the liquid injection hole penetrates longitudinally through the bottom surface of the inner wall of the installation groove. The bottom surface of the liquid injection hole is connected to a liquid inlet pipe, and a one-way valve is arranged on the liquid inlet pipe.

[0015] In addition, the present invention also provides a tinning production method for electronic components, comprising the following steps: S1: Put tin into the tin bath, start the heating program to heat the tin bath, so that the tin block is gradually melted by the heat until it is completely converted into liquid tin, i.e., molten tin; S2: placing electronic components, allowing the electronic components to pass through the first feeding member and the second feeding member in sequence and enter the third feeding member, and flipping the electronic components through the flipping mechanism, so that the pins of the electronic components are uniformly facing downward and the side away from the pins is facing upward; S3: The clamping mechanism clamps the electronic component on the flipping mechanism so that the pins of the electronic component are located outside the clamping mechanism, and then the electronic component is brought into contact with the fluxing member to apply flux to the electronic component; S4: operate the clamping device to immerse the clamped electronic components into a tin tank filled with tin liquid, so that the pins of the electronic components are in contact with the liquid tin in the tank, thereby performing soldering.

[0016] The beneficial effects of the present invention are: The tinning production system and method for electronic components are as follows: the electronic components can be transported by a feeding member, and the transported electronic components are clamped by a clamping mechanism controlled by a mechanical arm, and then the clamped electronic components are brought into contact with a fluxing member so that the pins of the electronic components are coated with flux, and then the mechanical arm is controlled to bring the clamped electronic components into contact with the tin liquid in a tin tank for tinning operation; after the tinning is completed, the residual tin oxide on the tin liquid is removed by a cleaning mechanism, thereby achieving the purpose of optimizing the whole tinning process, improving the tinning efficiency and the quality of the tinning treatment, and multiple electronic components can be clamped and tinned by the clamping mechanism, further improving the working efficiency of the tinning.

[0017] Other advantages, objectives and features of the present invention will be described in the following description to some extent, and to some extent, will be obvious to those skilled in the art based on the following examination and study, or can be taught from the practice of the present invention. The objectives and other advantages of the present invention can be realized and obtained through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A perspective view of the present invention; Figure 2 It is a schematic diagram of the top surface structure of the machine platform of the present invention (first viewing angle); Figure 3 It is a schematic diagram of the top surface structure of the machine platform of the present invention (second viewing angle); Figure 4 It is a schematic diagram of the structure of the feeding mechanism of the present invention; Figure 5 It is a schematic structural diagram of the first material feeding component of the present invention (second viewing angle); Figure 6 It is a schematic structural diagram of the first material feeding component of the present invention (second viewing angle); Figure 7 For the present invention Figure 6A partial enlarged view of middle A; Figure 8 Schematic diagram of the structure of the second material feeding member of the present invention (first viewing angle); Fig. 9 is a schematic structural diagram of a second material feeding member of the present invention (second viewing angle); Fig.10 For the present invention Fig. 9 A partial enlarged view of B in the middle; Fig.11 It is a schematic diagram of the structure of the third feeding member and the turning mechanism of the present invention (first viewing angle); Fig.12 It is a schematic diagram of the structure of the third feeding member and the turning mechanism of the present invention (second viewing angle); Fig.13 A top view of the third material feeding member and the turning mechanism of the present invention; Fig.14 It is a schematic diagram of the structure of the clamping mechanism of the present invention (first viewing angle); Fig.15 An exploded view of the clamping mechanism of the present invention; Fig.16 An exploded view of the soldering mechanism of the present invention; Fig.17 It is a schematic diagram of the internal structure of the soldering mechanism of the present invention; Fig.18 A top view of the soldering mechanism of the present invention; Fig.19 It is a schematic diagram of the structure of the impurity removal mechanism of the present invention; In the figure: 1. Machine; 2. Tin bath; 3. Feeding mechanism; 301, first feeding member; 3011, first connecting plate; 3012, clamping plate; 3013, cleaning assembly; 3014, collecting plate; 3015, first chute; 3016, first reciprocating driving mechanism; 3017, pushing plate; 3018, L plate; 3019, movable groove; 30110, second reciprocating driving mechanism; 30111, movable block; 30112, discharge port; 302, second material feeding member; 3021, second connecting plate; 3022, connecting hole; 3023, third reciprocating driving mechanism; 303, third material feeding member; 3031, fixing seat; 3032, third connecting plate; 304, material feeding channel; 4. Clamping mechanism; 401. Mounting plate; 402. Mounting seat; 403. Mounting hole; 404. Clamping plate; 405. Second slide groove; 406. Fixed plate; 407. Electric slider; 408. Fourth reciprocating driving mechanism; 409. Adsorption plate; 5. impurity removal mechanism; 501. bracket; 502. fifth reciprocating driving mechanism; 503. scraper; 504. sixth reciprocating driving mechanism; 505. tin slag trough; 506. guide plate; 6. Soldering mechanism; 601. Liquid storage tank; 602. Mounting slot; 603. Card slot; 604. Through hole; 605. Liquid injection hole; 606. Liquid inlet pipe; 607. One-way valve; 7. Flipping mechanism; 701. Support plate; 702. Motor; 703. Movable plate; 704. Ear plate; 705. Fixing rod; 706. Slide rail; 707. Sliding block; 708. Limiting plate; 8. Movable seat; 9. Robotic arm; 10. Chip storage tray. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0022] In the above description of the present invention, it should be noted that the terms "one side", "the other side", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the invention is usually placed when in use, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0023] In addition, the term "same" does not mean that the parts must be absolutely the same, but slight differences are allowed. The term "vertical" only means that the positional relationship between the parts is more vertical than "parallel", and does not mean that the structure must be completely vertical, but can be slightly tilted.

[0024] See also Figure 1-19 The present invention provides a technical solution: a tinning production system for electronic components, comprising a machine 1, two sets of tin baths 2 arranged oppositely on the top surface of the machine 1, a feeding mechanism 3, a clamping mechanism 4, a cleaning mechanism 5 and a soldering mechanism 6 arranged on the top surface of the machine 1, the feeding mechanism 3 comprising a first feeding member 301, a second feeding member 302 and a third feeding member 303, the two ends of the second feeding member 302 are respectively connected to one end of the first feeding member 301 and the third feeding member 303, and the top surfaces of the first feeding member 301, the second feeding member 302 and the third feeding member 303 are all provided with feeding channels 304 for chip movement; The clamping mechanism 4 includes a mounting plate 401, a mounting seat 402 and two symmetrically distributed clamping plates 404. The mounting plate 401 is provided with a mounting hole 403. The mounting seat 402 is mounted in the mounting hole 403. The two clamping plates 404 are slidably matched with the bottom surface of the mounting seat 402. The impurity removal mechanism 5 includes a tin slag tank 505, a bracket 501, a fifth reciprocating driving mechanism 502 and a scraper 503. One end of the bracket 501 is installed on the top surface of the machine 1, and the other end extends upward. The fifth reciprocating driving mechanism 502 is installed horizontally on the top surface of the bracket 501. The scraper 503 is installed on one side of the fifth reciprocating driving mechanism 502 and is located above the notch of the tin tank 2. The soldering mechanism 6 comprises a liquid storage tank 601 mounted on the top surface of the machine platform 1 and a mounting groove 602 clamped on the top surface of the liquid storage tank 601 , and a sponge is arranged in the mounting groove 602 .

[0025] In the present technical solution, two mounting seats 402 are arranged on the top surface of the machine 1, and the two mounting seats 402 are connected to a robotic arm 9 (the robotic arm 9 is a robot that can simulate the movement of human arms. It is composed of multiple joints and actuators and can be remotely controlled by a controller to complete various complex industrial operations. It is a mature technology in the prior art, so this application will not describe it in detail here). One end of the robotic arm 9 away from the mounting seat 402 is connected to the clamping mechanism 4; a chip storage tray is also arranged on the top surface of the machine 1, and the chip storage tray is used for the clamping mechanism 4 to place the tinned electronic components thereon.

[0026] First, the electronic components to be processed are placed in turn into the feeding channel 304 on the top surface of the first feeding member 301, and during the placement process, the side of the electronic components with the pins faces upwards, and the side away from the pins faces downwards. When the chips flow through the feeding channel 304 through the second feeding member 302 in turn, and finally stay in the feeding channel 304 on the third feeding member 303, the mechanical arm 9 is then controlled to drive the clamping mechanism 4 to move above the feeding channel 304 on the third feeding member 303, and then the clamping mechanism 4 is controlled to clamp the electronic components on the third feeding member 303, with only the pins of the clamped electronic components leaking out of the clamping mechanism 4, and then the mechanical arm 9 is controlled again to drive the clamping mechanism 4 and the clamped electronic components to move above the soldering mechanism 6, and gradually move downwards, so that the pins of the electronic components are aligned with the soldering mechanism 6. The sponge on the soldering mechanism 6 is in contact, which is convenient for applying the soldering flux to the pins of the electronic components. Then, the mechanical arm 9 is controlled again to drive the clamping mechanism 4 and the clamped electronic components to move to the top of the tin bath 2, and gradually move downward to immerse the pins of the electronic components in the tin liquid to perform the tin immersion operation. The mechanical arm 9 can control the left or right side of the clamping mechanism 4 to be inclined at 5°-50° with the liquid surface of the tin liquid, which is convenient for protecting the places other than the pins of the electronic components from the liquid tin. During the tin immersion process, the surface of the liquid tin will inevitably be exposed to the air, thereby producing direct chemical contact with oxygen, triggering an oxidation reaction, and this oxidation does not only occur in the initial stage of tin immersion. As the tin immersion continues, the liquid tin continuously has new surfaces exposed to the air during the flow, so the oxidation reaction will continue to proceed; When the tinning process is completed, the control clamping structure places the tinned electronic components on the chip storage tray. A layer of tin oxide produced during the tinning process of the electronic components can be observed on the surface of the liquid tin. This layer of tin oxide is the direct result of the chemical reaction between the tin liquid and the oxygen in the air. Therefore, before tinning the next batch of electronic components, the tin oxide floating on the surface of the liquid tin needs to be cleaned. By starting the fifth reciprocating propulsion mechanism 502, the scraper 503 moves back and forth along the notch direction of the tin bath 2 to scrape the tin oxide from the tin bath 2.

[0027] Among them, electronic components can be transported through the feeding member, and the conveyed electronic components can be clamped by the clamping mechanism 4 controlled by the mechanical arm 9, and then the clamped electronic components are contacted with the flux member to coat the pins of the electronic components with flux, and then the mechanical arm 9 is controlled to contact the clamped electronic components with the tin liquid in the tin bath 2 for tinning operation. After the tinning is completed, the residual tin oxide on the tin liquid is removed by the impurity removal mechanism 5, thereby achieving the purpose of optimizing the whole tinning process, improving the tinning efficiency and the quality of the tinning treatment, and multiple electronic components can be clamped and tinned by the clamping mechanism 4, further improving the working efficiency of the tinning.

[0028] In this embodiment: The first feeding member 301 includes a first connecting plate 3011, two oppositely distributed clamping plates 3012, a cleaning assembly 3013 and a collecting plate 3014. The two oppositely distributed clamping plates 3012 are both installed on the top surface of the first connecting plate 3011 and are respectively installed at both ends of the first connecting plate 3011. A first sliding groove 3015 for the chip box to slide is formed on the opposite surfaces of the two clamping plates 3012. The cleaning assembly 3013 is installed on one side of the first connecting plate 3011, and the collecting plate 3014 is installed on the other side away from the cleaning assembly 3013; The second feeding member 302 includes a second connecting plate 3021, a connecting hole 3022 and a third reciprocating pushing mechanism 3023. The second connecting plate 3021 is in the shape of a "factory". The connecting hole 3022 is formed at the bending part of the second connecting plate 3021, horizontally penetrates the second connecting plate 3021 and is located in the feeding channel 304. The third reciprocating pushing mechanism 3023 is installed on the bottom surface of the second connecting plate 3021, and the output direction of the third reciprocating pushing mechanism 3023 is the direction of the connecting hole 3022; The third feeding member 303 includes a fixed seat 3031 and a third connecting plate 3032. The third connecting plate 3032 is installed on the top surface of the fixed seat 3031. The feeding channel 304 is formed on the top surface of the third connecting plate 3032.

[0029] In this technical solution, at the bottom of the clamping plate 3012 installed on the top surface of the first connecting plate 3011 and close to one end of the second feeding member 302, a discharge port 30112 is formed. The discharge port 30112 is used to allow electronic components to smoothly slide out from it and enter the feeding channel 304.

[0030] When in use, multiple electronic component boxes are placed one by one between a pair of clamps 3012, and the two ends of these electronic component boxes will respectively form a sliding fit with the first slide groove 3015 opened on the inner side of the clamp 3012, that is, the electronic component boxes can move smoothly along the first slide groove 3015, and as the electronic component boxes are added one by one, they will be arranged along the first slide groove 3015 until the first slide groove 3015 is completely filled with electronic component boxes. When all the electronic components in the electronic component boxes located at the lower end of the first slide groove 3015 enter the feeding channel 304, they will enter the feeding channel 304 on the second connecting plate 3021 and the third connecting plate 3032 in turn and slide down. When the electronic components slide from the feeding channel 304 on the first connecting plate 3011 to the feeding channel 304 on the second connecting plate 3021, they will be 021 stops sliding at the bend, and then the third reciprocating pushing mechanism 3023 is started, and the inner rod of the third reciprocating pushing mechanism 3023 will extend through the connecting hole 3022 until the electronic component located at the bend of the second connecting plate 3021 is pushed into the third feeding member 303, and so on and so forth until the feeding channel 304 on the third feeding member 303 is filled with electronic components. In addition, when all the electronic components in the electronic component box located at the lower end of the first slide groove 3015 enter the feeding channel 304, the cleaning assembly 3013 will start working and push out the electronic component box located at the lower end so that it falls on the collecting plate 3014. Subsequently, the remaining electronic component boxes will slide downward one by one due to gravity, so that new electronic components can continue to be transported through the feeding channel 304, thereby achieving the purpose of improving the loading efficiency.

[0031] In this embodiment: the cleaning assembly 3013 includes a first reciprocating driving mechanism 3016 and a push plate 3017, the first reciprocating driving mechanism 3016 is installed on the bottom surface of the first connecting plate 3011, and an L plate 3018 is connected to one side of the first reciprocating driving mechanism 3016, the top surface of the horizontal plate of the L plate 3018 is higher than the first connecting plate 3011, the L plate 3018 is connected to the push plate 3017, and the end of the push plate 3017 away from the L plate 3018 is slidably matched with the top surface of the first connecting plate 3011 and is located between the two clamping plates 3012; A movable groove 3019 is provided at the bottom end of one side of the first slide groove 3015 close to the collecting plate 3014. The movable groove 3019 transversely penetrates the side wall of the first slide groove 3015, and a second reciprocating driving mechanism 30110 is provided on the outer side of the first slide groove 3015 above the movable groove 3019. The bottom end of the second reciprocating driving mechanism 30110 is connected to a movable block 30111 that slides and fits in the movable groove 3019.

[0032] In the present technical solution, an opening is constructed between the bottom of the first slide groove 3015 beside the collecting plate 3014 and the first connecting plate 3011, and the vertical dimension of the opening matches the chip box; the second reciprocating driving mechanism 30110 is extended in its initial configuration, at which time the middle and lower ends of the movable block 30111 are just within the range of this opening.

[0033] When in use, after all the chips in the chip box at the bottom of the first slide groove 3015 have entered the feeding channel 304, it is necessary to remove the empty chip box from between the two clamping plates 3012 to facilitate the remaining electronic component boxes to fall for feeding. First, the second reciprocating driving mechanism 30110 is started, and the second reciprocating driving mechanism 30110 changes from an extended state to a retracted state. When the second reciprocating driving mechanism 30110 is retracted, it can drive the movable block 30111 to rise along the movable groove 3019, so that the movable block 30111 It is completely retracted into the movable groove 3019 from the opening, and then the first reciprocating driving mechanism 3016 is started. The first reciprocating driving mechanism 3016 changes from an extended state to a contracted state. During the contraction of the first reciprocating driving mechanism 3016, the L plate 3018 and the push plate 3017 are driven to contract synchronously along the direction of the first connecting plate 3011. During the contraction of the push plate 3017 along the direction of the first connecting plate 3011, the chip box located at the lower end of the first slide groove 3015 is pushed out and falls on the collection plate 3014 for collection.

[0034] In this embodiment: a flip mechanism 7 is provided on one side of the third feeding member 303, and the flip mechanism 7 is used to flip the chips conveyed to the third feeding member 303. The flip mechanism 7 includes a support plate 701, a motor 702, a movable plate 703 and two fixed rods 705 installed on the same side of the fixed seat 3031, the lower end of the fixed rod 705 is connected to one side of the support plate 701, and the upper end extends upward and is higher than the third connecting plate 3032, the motor 702 is installed on the top surface of one side of the support plate 701, the output shaft of the motor 702 is connected to the rotating rod, and the two ends of the movable plate 703 are connected to ear plates 704, the two ear plates 704 respectively contact the upper ends of the two fixed rods 705, the end of the rotating rod away from the motor 702 is fixedly connected to one of the ear plates 704, and is rotatably matched on one of the fixed rods 705, and the other ear plate 704 is connected to the other fixed rod 705 through a pin.

[0035] In the present technical solution, a slide rail 706 is provided on one side of the support plate 701, and the slide rail 706 is distributed in the up and down directions of the support plate 701. A slider 707 is slidably fitted on the slide rail 706, and the top surface of the slider 707 is connected to a limiting plate 708. When the movable plate 703 is flipped, the bottom surface of the flipped movable plate 703 contacts the top surface of the limiting plate 708, and the flipping angle of the movable plate 703 is limited to prevent the angle deviation of the movable plate 703 after flipping.

[0036] After the third reciprocating pushing mechanism 3023 pushes the chip into the feeding channel 304 on the third connecting plate 3032, the motor 702 is started, and the motor 702 drives the rotating rod connected to the output shaft to rotate, and the rotating rod drives an ear plate 704 fixedly connected thereto and the entire movable plate 703 to move together. At the same time, the ear plate 704 connected to the other end of the movable plate 703 will also rotate on the pin shaft due to the action of the movable plate 703 connected to the rotating rod. This series of actions enables the movable plate 703 to push the chip from the top of the third connecting plate 3032, thereby realizing the flipping of the chip, so that the pins of the electronic components are uniformly facing downward and the side away from the pins is facing upward, so that the pins are exposed to the outside for tinning when clamped by the clamping mechanism 4.

[0037] In this embodiment: a second slide groove 405 is provided on the bottom surface of the mounting seat 402, and the second slide groove 405 extends along the length direction of the mounting seat 402. The outer sides of the two clamping plates 404 are connected to fixed plates 406. One end of the fixed plate 406 is connected to the outer side of the clamping plate 404, and the other end extends upward. The top surfaces of the two fixed plates 406 are installed with electric sliders 407 that slide in cooperation with the second slide groove 405. The two electric sliders 407 respectively drive the two clamping plates 404 to move synchronously toward each other or synchronously away from each other along the second slide groove 405.

[0038] When in use, the clamping mechanism 4 is controlled by the mechanical arm 9 to move above the electronic components. First, the two electric sliders 407 are controlled to move synchronously in opposite directions along the second slide groove 405 to expand the distance between the two clamping plates 404. When the electronic components are located between the two clamping plates 404, they are clamped and fixed. The two electric sliders 407 are controlled to move synchronously in opposite directions along the second slide groove 405 to facilitate clamping of the electronic components.

[0039] In this embodiment: two fourth reciprocating propulsion mechanisms 408 are installed on the mounting plate 401, and the bottom ends of the two fourth reciprocating propulsion mechanisms 408 longitudinally penetrate the bottom end of the mounting plate 401, and the bottom ends of the two fourth reciprocating propulsion mechanisms 408 are connected to an adsorption plate 409, and the adsorption plate 409 is located between the two clamping plates 404.

[0040] When in use, the clamping mechanism 4 is controlled by the mechanical arm 9 to move above the electronic component. First, the two electric sliders 407 are controlled to move synchronously in opposite directions along the second slide groove 405 to expand the distance between the two clamping plates 404. Then, the fourth reciprocating driving mechanism 408 is started. The output direction of the fourth reciprocating driving mechanism 408 is downward, and it drives the adsorption plate 409 to move downward until the adsorption plate 409 adsorbs the electronic component. Then, the two electric sliders 407 are controlled to move synchronously toward each other along the second slide groove 405 to reduce the distance between the two clamping plates 404 until the opposite surfaces of the two clamping plates 404 respectively collide with the opposite sides of the adsorption plate 409, and the pins of the electronic components are located on the outside of the two clamping plates 404, which is convenient for tin dipping of the pins of the electronic components.

[0041] In this embodiment: a sixth reciprocating driving mechanism 504 is vertically installed on one side of the bracket 501 away from the tin slag tank 505, and the top surface of the sixth reciprocating driving mechanism 504 is connected to the fifth reciprocating driving mechanism 502; A guide plate 506 is disposed on the top surface of one side of the tin bath 2 . The guide plate 506 and the tin slag bath 505 are installed on the same side of the tin bath 2 , and the guide plate 506 is located above the tin slag bath 505 .

[0042] Before scraping off the tin oxide floating on the surface of the liquid tin, first control the sixth reciprocating propulsion mechanism 504 to push upward, which can drive the fifth reciprocating propulsion mechanism 502 and the scraper 503 to rise synchronously until the bottom surface of the scraper 503 is higher than the surface of the liquid tin, then start the fifth reciprocating propulsion mechanism 502, and the fifth reciprocating propulsion mechanism 502 pushes the scraper 503 in the direction away from the tin slag groove 505 to reach the other end, then control the sixth reciprocating propulsion mechanism 504 to shrink downward, drive the fifth reciprocating propulsion mechanism 502 and the scraper 503 to descend synchronously until the bottom surface of the scraper 503 contacts the surface of the liquid tin, then control the fifth reciprocating propulsion mechanism 502 again, and the fifth reciprocating propulsion mechanism 502 drives the scraper 503 to push the floating tin oxide to shrink in the direction close to the tin slag groove 505 until the tin oxide is pushed into the tin slag groove 505.

[0043] In this embodiment: the top surfaces of the side walls on opposite sides of the liquid storage tank 601 are provided with the card slots 603 , and the two opposite sides of the installation slot 602 are respectively card-connected with the two card slots 603 , and the sponge body is consistent with the internal space of the installation slot 602 .

[0044] Both ends of the mounting groove 602 are clamped in the clamping grooves 603 on the opposite sides of the liquid storage tank 601. When the liquid storage tank 601 needs to be cleaned, the mounting groove 602 can be removed to facilitate cleaning of the inside of the liquid storage tank 601.

[0045] In this embodiment: a plurality of through holes 604 are provided on the bottom surface of the inner wall of the mounting groove 602, and the plurality of through holes 604 vertically penetrate the bottom surface of the inner wall of the mounting groove 602. A liquid injection hole 605 is also provided on the bottom surface of the inner wall of the mounting groove 602, and the liquid injection hole 605 vertically penetrates the bottom surface of the inner wall of the mounting groove 602. The bottom surface of the liquid injection hole 605 is connected to a liquid inlet pipe 606, and a one-way valve 607 is provided on the liquid inlet pipe 606.

[0046] The soldering flux is poured into the liquid storage tank 601 through the liquid injection hole 605 and the liquid inlet pipe 606. As the liquid level of the soldering flux in the liquid storage tank 601 gradually rises until it touches the bottom of the mounting groove 602, the soldering flux will penetrate the liquid injection hole 605 and flow into the mounting groove 602. At this time, the soldering flux injection process is terminated immediately, and the liquid inlet pipe 606 is equipped with a one-way valve 607. This design ensures that after the liquid storage tank 601 is filled with soldering flux, it can effectively prevent the soldering flux from flowing back.

[0047] In addition, the present invention also provides a tinning production method for electronic components, comprising the following steps: S1: putting tin into the tin bath 2, starting the heating program to heat the tin bath 2, so that the tin block is gradually melted by the heat until it is completely converted into liquid tin, i.e., liquid tin; The tin bath 2 is provided with a heating element (such as an electric heating tube) and a temperature control system, which can ensure that the tin liquid maintains fluidity and stability within a set temperature range, thereby improving the efficiency of tinning of electronic components and the quality of tinning treatment.

[0048] S2: electronic components are put in, so that the electronic components pass through the first feeding member 301 and the second feeding member 302 in sequence and enter the third feeding member 303, and the electronic components are turned over by the turning mechanism 7, so that the pins of the electronic components are uniformly facing downward and the side away from the pins is facing upward; Among them, by flipping the electronic components, it is ensured that each electronic component can be presented to the clamping mechanism 4 in the best state when clamping, thereby avoiding clamping failure or damage caused by the pins being blocked. At the same time, the continuous transportation and staggered clamping method in batches enable the two groups of tin baths 2 to work simultaneously without interfering with each other, thereby realizing the parallelization of the tinning operation and further improving the production efficiency.

[0049] S3: The clamping mechanism 4 clamps the electronic component on the flipping mechanism 7 so that the pins of the electronic component are located outside the clamping mechanism 4, and then the electronic component is brought into contact with the fluxing member to apply flux to the electronic component; Among them, the flux uses acid flux or neutral flux, and the clamping mechanism 4 can accurately and stably clamp the electronic components to ensure their stable position and posture during the fluxing process. At the same time, through automatic contact with the fluxing component, the flux can be evenly and fully applied to the welding parts of the electronic components, providing a good foundation for subsequent tinning operations.

[0050] Compared with the traditional manual application method, this automated flux application method not only improves work efficiency, but also reduces problems such as uneven application, excessive or insufficient application caused by human factors. At the same time, since direct human contact with the flux is avoided, the potential harm to the operator is greatly reduced.

[0051] Therefore, in the tinning process of electronic components, the use of acid flux or neutral flux combined with automated clamping and fluxing components is an efficient and safe operation method.

[0052] S4: operate the clamping device to immerse the clamped electronic components into the tin tank 2 filled with tin liquid, so that the pins of the electronic components are in contact with the liquid tin in the tank, thereby performing soldering.

[0053] Among them, electronic components need to undergo two tinning operations, and flux needs to be applied to the pins before each tinning operation to improve the quality of the tinning.

[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the purpose and scope of the technical solution of the present invention, which should be included in the scope of the claims of the present invention.

Claims

1. A tinning production system for electronic components, comprising a machine (1), wherein the top surface of the machine (1) is provided with two sets of tin baths (2) arranged in opposite directions, characterized in that: On the top surface of the machine table (1), a feeding mechanism (3), a clamping mechanism (4), a impurity removing mechanism (5) and a soldering aid mechanism (6) are provided. The feeding mechanism (3) is composed of a first feeding member (301), a second feeding member (302) and a third feeding member (303). Both ends of the second feeding member (302) are respectively connected to one end of the first feeding member (301) and the third feeding member (303). On the top surfaces of the first feeding member (301), the second feeding member (302) and the third feeding member (303), a feeding channel (304) for the movement of the chip is provided. The clamping mechanism (4) includes a mounting plate (401), a mounting seat (402) and two symmetrically distributed clamping plates (404). A mounting hole (403) is provided on the mounting plate (401). The mounting seat (402) is mounted in the mounting hole (403). The two clamping plates (404) are slidably engaged with the bottom surface of the mounting seat (402). The impurity removing mechanism (5) includes a solder dross tank (505), a bracket (501), a fifth reciprocating pushing mechanism (502) and a scraper (503). One end of the bracket (501) is mounted on the top surface of the machine table (1), and the other end extends upward. The fifth reciprocating pushing mechanism (502) is horizontally mounted on the top surface of the bracket (501). The scraper (503) is mounted on one side of the fifth reciprocating pushing mechanism (502) and is located above the notch of the tin tank (2). The soldering aid mechanism (6) includes a liquid storage tank (601) mounted on the top surface of the machine table (1) and a mounting groove (602) clamped on the top surface of the liquid storage tank (601). A sponge body is provided in the mounting groove (602).

2. The immersion tin production system for electronic components according to claim 1, characterized in that: The first feeding member (301) includes a first connecting plate (3011), two oppositely distributed clamping plates (3012), a cleaning assembly (3013) and a collecting plate (3014). The two oppositely distributed clamping plates (3012) are both mounted on the top surface of the first connecting plate (3011) and are respectively mounted at both ends of the first connecting plate (3011). On the opposite surfaces of the two clamping plates (3012), a first sliding groove (3015) for the sliding of the chip box is provided. The cleaning assembly (3013) is mounted on one side of the first connecting plate (3011). The collecting plate (3014) is mounted on the other side away from the cleaning assembly (3013). The second feeding member (302) includes a second connecting plate (3021), a connecting hole (3022) and a third reciprocating pushing mechanism (3023). The second connecting plate (3021) is in the shape of "厂". The connecting hole (3022) is provided at the bent part of the second connecting plate (3021), horizontally penetrates the second connecting plate (3021) and is located in the feeding channel (304). The third reciprocating pushing mechanism (3023) is mounted on the bottom surface of the second connecting plate (3021). The output direction of the third reciprocating pushing mechanism (3023) is the direction of the connecting hole (3022). The third material feeding member (303) comprises a fixed seat (3031) and a third connecting plate (3032), wherein the third connecting plate (3032) is installed on the top surface of the fixed seat (3031), and the material feeding channel (304) is opened on the top surface of the third connecting plate (3032).

3. The immersion tin production system for electronic components according to claim 2, characterized in that: The cleaning assembly (3013) comprises a first reciprocating driving mechanism (3016) and a push plate (3017), wherein the first reciprocating driving mechanism (3016) is mounted on the bottom surface of the first connecting plate (3011), an L plate (3018) is connected to one side of the first reciprocating driving mechanism (3016), the top surface of the transverse plate of the L plate (3018) is higher than the first connecting plate (3011), the L plate (3018) is connected to the push plate (3017), and one end of the push plate (3017) away from the L plate (3018) is slidably matched to the top surface of the first connecting plate (3011) and is located between the two clamping plates (3012); A movable groove (3019) is provided at the bottom end of one side of the first slide groove (3015) close to the collecting plate (3014), and the movable groove (3019) transversely penetrates the side wall of the first slide groove (3015), and a second reciprocating driving mechanism (30110) is provided on the outer side of the first slide groove (3015) above the movable groove (3019), and the bottom end of the second reciprocating driving mechanism (30110) is connected to a movable block (30111) that is slidably fitted in the movable groove (3019).

4. The immersion tin production system for electronic components according to claim 1, characterized in that: A flipping mechanism (7) is provided on one side of the third feeding member (303), and the flipping mechanism (7) is used to flip the chips fed to the third feeding member (303). The flipping mechanism (7) comprises a support plate (701), a motor (702), a movable plate (703) and two fixed rods (705) installed on the same side of the fixed seat (3031), wherein the lower end of the fixed rod (705) is connected to one side of the support plate (701), and the upper end extends upward and is higher than the third connecting plate (3032). The motor (702) ) is installed on the top surface of one side of the support plate (701), the output shaft of the motor (702) is connected to a rotating rod, both ends of the movable plate (703) are connected to ear plates (704), the two ear plates (704) respectively contact the upper ends of the two fixed rods (705), the end of the rotating rod away from the motor (702) is fixedly connected to one of the ear plates (704), and is rotatably matched on one of the fixed rods (705), and the other ear plate (704) is connected to the other fixed rod (705) through a pin shaft.

5. The immersion tin production system for electronic components according to claim 1, characterized in that: The bottom surface of the mounting seat (402) is provided with a second slide groove (405), and the second slide groove (405) extends along the length direction of the mounting seat (402). The outer sides of the two clamping plates (404) are connected with fixed plates (406), one end of the fixed plate (406) is connected to the outer side of the clamping plate (404), and the other end extends upward. The top surfaces of the two fixed plates (406) are installed with electric sliders (407) that are slidably matched with the second slide groove (405), and the two electric sliders (407) respectively drive the two clamping plates (404) to move synchronously toward each other or synchronously away from each other along the second slide groove (405).

6. The immersion tin production system for electronic components according to claim 5, characterized in that: Two fourth reciprocating driving mechanisms (408) are installed on the mounting plate (401), and the bottom ends of the two fourth reciprocating driving mechanisms (408) longitudinally penetrate the bottom end of the mounting plate (401). The bottom ends of the two fourth reciprocating driving mechanisms (408) are connected to an adsorption plate (409), and the adsorption plate (409) is located between the two clamping plates (404).

7. The immersion tin production system for electronic components according to claim 1, characterized in that: A sixth reciprocating driving mechanism (504) is vertically installed on one side of the bracket (501) away from the tin slag tank (505), and the top surface of the sixth reciprocating driving mechanism (504) is connected to the fifth reciprocating driving mechanism (502); A guide plate (506) is provided on the top surface of one side of the tin bath (2); the guide plate (506) and the tin slag bath (505) are both installed on the same side of the tin bath (2), and the guide plate (506) is located above the tin slag bath (505).

8. The immersion tin production system for electronic components according to claim 1, characterized in that: The top surfaces of the side walls on opposite sides of the liquid storage tank (601) are provided with card slots (603), and the two opposite sides of the installation slot (602) are respectively card-connected with the two card slots (603), and the sponge body is consistent with the internal space of the installation slot (602).

9. The immersion tin production system for electronic components according to claim 8, characterized in that: The bottom surface of the inner wall of the mounting groove (602) is provided with a plurality of through holes (604), and the plurality of through holes (604) vertically penetrate the bottom surface of the inner wall of the mounting groove (602). The bottom surface of the inner wall of the mounting groove (602) is also provided with a liquid injection hole (605), and the liquid injection hole (605) vertically penetrates the bottom surface of the inner wall of the mounting groove (602). The bottom surface of the liquid injection hole (605) is connected to a liquid inlet pipe (606), and a one-way valve (607) is provided on the liquid inlet pipe (606).

10. A tin immersion production method for electronic components, comprising a tin immersion production system for electronic components as claimed in any one of claims 1 to 9, characterized in that: The specific usage is as follows: S1: putting tin into a tin bath (2), starting a heating program to heat the tin bath (2), so that the tin block is gradually melted by the heat until it is completely converted into liquid tin, i.e., liquid tin; S2: placing electronic components, allowing the electronic components to pass through the first feeding member (301) and the second feeding member (302) in sequence and enter the third feeding member (303), and flipping the electronic components through the flipping mechanism (7) so that the pins of the electronic components are all facing downwards and the side away from the pins is facing upwards; S3: The clamping mechanism (4) clamps the electronic component on the flipping mechanism (7) so that the pins of the electronic component are located outside the clamping mechanism (4), and then the electronic component is brought into contact with the fluxing member to apply flux to the electronic component; S4: operating the clamping device to immerse the clamped electronic component into a tin tank (2) filled with tin liquid, so that the pins of the electronic component are in contact with the liquid tin in the tank, thereby performing a soldering process.

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