A cutting and edge-grinding device and method for HDI circuit boards

Abstract

This invention relates to the technical field of circuit board edge grinding. More specifically, this invention relates to an HDI circuit board cutting and edge grinding device and method. It includes a support frame and a housing; the housing is fixedly connected to the support frame; a grinding block is connected to a drive assembly; at least eight electric push rods are connected to the drive assembly; all electric push rods are evenly divided into two groups, and the telescopic end of each group of electric push rods is commonly fixedly connected to a ring; a second ring is rotatably connected to each ring; a clamping plate is fixedly connected to each second ring; at least four elastic telescopic rods are fixedly connected to each clamping plate; and an electric suction cup is slidably connected to each clamping plate. In use, the four edges of the circuit board sequentially contact the grinding block immersed in clean water and undergo grinding, effectively preventing dust diffusion. After grinding, only the four edges of the circuit board are wetted with clean water, which, compared to the prior art that wets the entire circuit board, improves drying efficiency.

Description

Technical Field

[0001] This invention relates to the technical field of circuit board edge grinding. More specifically, this invention relates to an HDI circuit board cutting and edge grinding equipment and method. Background Technology

[0002] Existing Chinese patent: A high-efficiency cutting and edge grinding device for circuit boards (CN214024912U), which uses an exhaust fan to remove dust generated during the grinding process, preventing dust from spreading into the air and polluting the environment;

[0003] When the above-mentioned device is used to grind the edges of the circuit board, the generated powder will first disperse into the grinding chamber and then be sucked away by the exhaust fan. Therefore, dust and impurities are always suspended in the grinding chamber. Some of the dust and impurities will flow out from the inlet and outlet of the grinding chamber, polluting the indoor environment. If clean water is splashed on the circuit board during the grinding process, the problem of dust and impurities spreading can be solved from the source. However, a lot of time needs to be spent drying the circuit board afterward before it can be stored and transferred after cutting, which is inefficient. Summary of the Invention

[0004] The present invention provides an HDI circuit board cutting and edge grinding equipment and method, the purpose of which is to overcome the disadvantage that if water is splashed on the circuit board to reduce dust during the grinding process, a lot of time needs to be spent drying the circuit board afterwards, resulting in low production efficiency.

[0005] To achieve the above objectives, the technical implementation scheme of the present invention is as follows:

[0006] A cutting and edge-grinding device for HDI circuit boards includes a support frame and a housing; the housing is fixedly connected to the support frame; it also includes a pipe, a grinding block, an electric push rod 1, a circular ring 1, a circular ring 2, a clamping plate, a spring-loaded telescopic rod, an electric suction cup, a positioning component, and a drive component; the housing is connected to the pipe; the drive component is connected to the housing; the grinding block is connected to the drive component; the drive component is used to drive the grinding block to move horizontally; at least eight electric push rods 1 are connected to the drive component; the drive component is used to drive the electric push rods 1 to move horizontally and vertically; all electric push rods 1 are evenly divided into two groups, and the telescopic end of each group of electric push rods 1 is fixedly connected to a circular ring 1; a circular ring 2 is rotatably connected to each circular ring 1; the drive component is used to drive the circular ring 2 to rotate; a clamping plate is fixedly connected to each circular ring 2; at least four spring-loaded telescopic rods are fixedly connected to each clamping plate; an electric suction cup is slidably connected to each clamping plate, and the electric suction cup is fixedly connected to the telescopic end of the corresponding spring-loaded telescopic rod; a positioning component for positioning the circuit board is connected to the housing.

[0007] Furthermore, the grinding block has a U-shaped cross-section and at least two chamfered portions.

[0008] Furthermore, the positioning component includes a limiting block, an electric push rod II, and a positioning block; at least four limiting blocks are fixedly connected to the outer shell; the limiting block has a U-shaped cross-section; an electric push rod II is provided inside the outer shell, and the electric push rod II is fixedly connected to the corresponding limiting block; the telescopic end of the electric push rod II is fixedly connected to a positioning block, and the positioning block is in sliding contact with the corresponding limiting block.

[0009] Furthermore, it also includes a cleaning component; the cleaning component is connected to the outer casing; the cleaning component includes a second connecting plate and a rubber frame; the second connecting plate is fixedly connected to the outer casing; a through groove is provided on the second connecting plate; the rubber frame is fixedly connected to the second connecting plate and is located in the through groove.

[0010] Furthermore, it also includes a water-absorbing component; the water-absorbing component is connected to the second connecting plate; the water-absorbing component includes a sponge block and a squeezing unit; the sponge block is connected to the second connecting plate; the squeezing unit is connected to the second connecting plate and is used to squeeze the water out of the sponge block.

[0011] Furthermore, the extrusion unit includes a filter screen, a push block, and a linkage assembly; the filter screen is fixedly connected to the second connecting plate, and the filter screen is in contact with the sponge block; the push block is slidably connected to the second connecting plate, and the push block is in contact with the sponge block; the linkage assembly is connected to the second connecting plate, and the linkage assembly is used to drive the push block to perform vertical movement.

[0012] Furthermore, the upper side of the push block has an arc surface that is higher in the middle and lower at both ends.

[0013] Furthermore, the linkage assembly includes linkage blocks, friction strips, and springs; at least two linkage blocks are slidably connected to the second connecting plate, and the linkage blocks are fixedly connected to the push block; all linkage blocks are fixedly connected to the friction strip, and the friction strip is located above the rubber frame; several springs are fixedly connected to the lower side of the push block, and the springs are fixedly connected to the second connecting plate.

[0014] Furthermore, it also includes a U-shaped strip; a groove is provided on the second connecting plate, and the groove is located outside the sponge block; a through groove is provided on the second connecting plate, and the through groove communicates with the groove; a U-shaped strip is fixedly connected to the second connecting plate, and the U-shaped strip is located outside the groove.

[0015] A method for using an HDI circuit board cutting and edge grinding equipment includes the following steps:

[0016] Step 1: Water injection. Manually inject clean water into the outer shell until the polishing block is submerged.

[0017] Step 2, loading: The circuit board is moved into the positioning assembly by an external conveyor mechanism;

[0018] Step 3, positioning: The circuit board is positioned using positioning components;

[0019] Step 4, polishing: Polish the lower edge of the circuit board using a polishing block;

[0020] Step 5: Rotate the circuit board three times, each time by driving the drive component to rotate 90 degrees.

[0021] Step six: Polishing. After each rotation of the circuit board, the lower edge of the circuit board after rotation is polished using a polishing block.

[0022] Beneficial effects: The present invention adopts the above technical solution, in which the four edges of the circuit board come into contact with the polishing block immersed in clean water in turn and are polished, effectively avoiding the spread of dust. After polishing, only the four edges of the circuit board are wetted with clean water. Compared with the prior art which wets the entire circuit board, it is beneficial to improve the drying efficiency.

[0023] The rubber frame scrapes away the water remaining on the underside of the circuit board, preventing it from spreading to the middle of the circuit board and increasing the drying difficulty. At the same time, the sponge block absorbs the water remaining on the thick surface of the circuit board, preventing it from spreading to the middle of the circuit board and increasing the drying difficulty. Meanwhile, the push block squeezes out the water from the sponge block, keeping the sponge block absorbent. The friction between the upward-moving circuit board and the friction strip drives the push block to move, eliminating the need for additional electric drive components. The structure is ingenious. In addition, the upper side of the push block is set as an arc surface that is high in the middle and low at both ends, so that the push block can squeeze the middle of the sponge block onto the raised filter screen to ensure that the water in the sponge block is fully squeezed out.

[0024] The U-shaped strip intercepts the water squeezed out of the sponge block, allowing it to flow into the groove and then back into the outer shell through the permeable channel. This prevents the water from being squeezed onto the friction strip, thus avoiding a decrease in the squeezing effect on the sponge block due to reduced friction of the friction strip. Attached Figure Description

[0025] Figure 1 This invention illustrates a first structural schematic diagram of the HDI circuit board cutting and edge grinding equipment.

[0026] Figure 2 This invention illustrates a second structural schematic diagram of the HDI circuit board cutting and edge grinding equipment.

[0027] Figure 3 A schematic diagram of the positioning component of the present invention is shown;

[0028] Figure 4 A schematic diagram of the structure of the grinding block of the present invention is shown;

[0029] Figure 5 A schematic diagram of the structure of the driving component of the present invention is shown;

[0030] Figure 6 A schematic diagram of the cleaning component of the present invention is shown;

[0031] Figure 7 A schematic diagram of the water-absorbing component of the present invention is shown;

[0032] Figure 8 A schematic diagram of the structure of the U-shaped strip of the present invention is shown.

[0033] The symbols in the attached diagram represent: 1-Support frame, 2-Outer shell, 3-Pipe, 4-Grinding block, 5-Electric push rod one, 6-Ring one, 7-Ring two, 8-Clamping plate, 9-Elastic telescopic rod, 10-Electric suction cup, 201-Limiting block, 202-Electric push rod two, 203-Positioning block, 204-Electric push rod three, 205-Linkage rod, 206-Electric slide rail one, 207-Electric slider one, 208-U-shaped plate, 209-Electric slide rail two 2010-Electric slider II, 2011-Connecting plate I, 2012-Motor, 2013-Spur gear, 2014-Gear ring, 2015-Connecting plate II, 2016-Rubber frame, 2017-Sponge block, 2018-Filter screen, 2019-Push block, 2020-Linkage block, 2021-Friction strip, 2022-Spring, 2023-U-shaped strip, 91-Chamfered part, 92-Through groove I, 93-Groove, 94-Through groove II. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings. It is hereby declared that the directional terms such as up, down, left, right, front, back, inside, and outside used in this text are based solely on the accompanying drawings and are not intended to specifically limit the invention.

[0035] Implementation Plan 1

[0036] An HDI circuit board cutting and edge grinding equipment, such as Figures 1-5As shown, it includes a support frame 1 and a housing 2; the housing 2 is bolted to the support frame 1, and the support frame 1 is made of alloy material; it also includes a pipe 3, a grinding block 4, an electric push rod 5, a ring 6, a ring 7, a clamping plate 8, a spring telescopic rod 9, an electric suction cup 10, a positioning assembly, and a drive assembly; the pipe 3 is connected to and bolted to the housing 2; the drive assembly is connected to the housing 2; the grinding block 4 is connected to the drive assembly; the drive assembly is used to drive the grinding block 4 to move horizontally; eight electric push rods 5 are connected to the drive assembly; the drive assembly is used to drive the electric push rods 5 The circuit board can move horizontally and vertically. All electric actuators 5 are divided into two groups, and the telescopic ends of each group of electric actuators 5 are fixedly connected to a ring 6. Each ring 6 is rotatably connected to a ring 7. The drive assembly is used to drive the ring 7 to rotate. Each ring 7 is welded with a clamping plate 8. Each clamping plate 8 is fixedly connected to four elastic telescopic rods 9. Each clamping plate 8 is slidably connected to an electric suction cup 10, which is fixedly connected to the telescopic end of the corresponding elastic telescopic rod 9. The outer shell 2 is connected to a positioning assembly for positioning the circuit board.

[0037] The grinding block 4 has a U-shaped cross section and at least two chamfered portions 91, making it easier for the circuit board to be inserted into the grinding block 4.

[0038] The positioning assembly includes a limit block 201, an electric push rod 202, and a positioning block 203. Four limit blocks 201 are bolted to the outer casing 2. The limit blocks 201 are made of a smooth material. The cross-section of the limit blocks 201 is U-shaped. The limit blocks 201 are used to position the circuit board vertically and horizontally. An electric push rod 202 is provided inside the outer casing 2. The electric push rod 202 is bolted to the corresponding limit block 201. The telescopic end of the electric push rod 202 is fixed to the positioning block 203. The positioning block 203 slides in contact with the corresponding limit block 201. The positioning block 203 is used to position the circuit board horizontally.

[0039] The drive assembly includes an electric push rod 204, a linkage rod 205, an electric slide rail 206, an electric slider 207, a U-shaped plate 208, an electric slide rail 209, an electric slider 2010, a connecting plate 2011, a motor 2012, a spur gear 2013, and a gear ring 2014. The electric push rod 204 is bolted to the outer side of the housing 2. Two linkage rods 205 are slidably connected to the housing 2, and the linkage rods 205 are bolted to the grinding block 4. The telescopic end of the electric push rod 204 is bolted to the corresponding linkage rod 205. Two electric slide rails 206 are bolted to the inner side of the housing 2. Each electric slide rail 206 is slidably connected to two electric... Slider 1 207; all electric sliders 1 207 are fixedly connected to a U-shaped plate 208; four electric slide rails 209 are bolted to the U-shaped plate 208; each electric slide rail 209 is slidably connected to an electric slider 2010; two connecting plates 1 2011 are provided on the inner side of the U-shaped plate 208, and the connecting plates 1 2011 are bolted to the corresponding electric sliders 2010; each ring 1 6 is bolted to a motor 2012; the output shaft of each motor 2012 is fixedly connected to a spur gear 2013; each ring 2 7 is fixedly connected to a gear ring 2014, which meshes with the corresponding spur gear 2013.

[0040] First, manually plug the pipe 3 with an external plug. Pour clean water into the bottom of the openings on both sides of the outer casing 2, just enough to submerge the grinding block 4. Manually or through an external conveying mechanism, insert the circuit board upright between the two limiting blocks 201 until the circuit board contacts the positioning block 203. The positioning block 203 then positions the circuit board left and right. At this time, the thickness surface of the circuit board simultaneously contacts the two adjacent upper and lower limiting blocks 201. The two adjacent upper and lower limiting blocks 201 work together to position the circuit board up and down. At the same time, the width of the U-shaped groove of the limiting block 201 is equal to the thickness of the circuit board, thus the limiting block 201 positions the circuit board front and back. Then, start the electric slide rail 206 and the electric slide rail. Block 207, the electric slider 207 drives the U-shaped plate 208 and its parts to move to the right, causing the two electric suction cups 10 to move to the middle position of the front and rear sides of the circuit board, respectively. Then, the electric push rod 5 pushes the ring 6 to move, the ring 6 drives the ring 7 to move, and the ring 7 drives the clamping plate 8 and its parts to move, causing the two electric suction cups 10 to move towards each other and contact the circuit board at the same time. As the ring 7 drives the clamping plate 8 to continue moving, the electric suction cups 10 are blocked by the circuit board and cannot continue to move, so the clamping plate 8 slides on the electric suction cups 10 and stretches the elastic telescopic rod 9. The two clamping plates 8 continue to move towards each other, clamping the circuit board. At the same time, the electric suction cups 10 hold the circuit board in place. Then, the electric push rod 202 drives... Positioning block 203 moves upward, stopping its obstruction and limiting of the circuit board. Then, electric slider 207 drives U-shaped plate 208 and its components back to their original position, moving the circuit board directly above grinding block 4. Electric slide rail 209 and electric slider 2010 are activated, causing connecting plate 2011 and its components to move downward. This, through clamping plate 8 and electric suction cup 10, moves the circuit board downward, inserting its lower edge into the U-shaped groove of grinding block 4, with the lower edge submerged in water. Electric push rod 204 drives linkage rod 205 in linear reciprocating motion, which in turn drives grinding block 4 in linear reciprocating motion, thus grinding the lower edge of the circuit board. The circuit board is polished to remove any remaining burrs from its lower edge. Both the polishing block 4 and the lower edge of the circuit board are submerged in clean water to disperse the polishing dust. After polishing, the electric push rod 204 stops moving, and the electric slider 2010 moves the connecting plate 2011 and its components upwards, moving the circuit board away from the polishing block 4. The motor 2012 is then activated, driving the spur gear 2013 to rotate. The spur gear 2013 drives the gear ring 2014 to rotate, which in turn drives the ring 7 to rotate on the ring 6. The ring 7 rotates the components on it by 90 degrees, thus rotating the circuit board by 90 degrees. This process is repeated to polish the lower edge of the rotated circuit board. This cycle continues.After grinding all four edges of the circuit board clean, the electric slider 2010 drives the connecting plate 2011 and its components to move upwards and reset, aligning the circuit board with the two left-side limiting blocks 201. Then, the electric slider 207 drives the U-shaped plate 208 and its components to move to the left, inserting the ground circuit board into the two left-side limiting blocks 201. Finally, the ground circuit board is removed via an external conveying mechanism. During the grinding process, only the four edges of the circuit board are wetted with water, which, compared to existing technologies that wet the entire circuit board, improves efficiency. In addition to improving drying efficiency, while the grinding block 4 grinds the circuit board, an external conveyor mechanism can move the circuit board to be ground into the right-hand limit block 201, and another external conveyor mechanism can remove the ground circuit board from the left-hand limit block 201, thus achieving assembly line operation. During use, the four edges of the circuit board sequentially contact the grinding block 4, which is immersed in clean water, and are then ground, effectively preventing dust diffusion. After grinding, only the four edges of the circuit board are wetted with clean water, which, compared to existing technologies that wet the entire circuit board, improves drying efficiency.

[0041] Implementation Plan 2

[0042] Based on implementation plan 1, such as Figure 6 and Figure 7 As shown, it also includes a cleaning component; the cleaning component is connected to the housing 2; the cleaning component includes a second connecting plate 2015 and a rubber frame 2016; the second connecting plate 2015 is bolted to the housing 2; the second connecting plate 2015 has a through groove 92; the rubber frame 2016 is fixed to the second connecting plate 2015 and is located in the through groove 92, and the water remaining on the surface of the circuit board is scraped off through the rubber frame 2016.

[0043] It also includes a water-absorbing component; the water-absorbing component is connected to the connecting plate 2015; the water-absorbing component includes a sponge block 2017 and a squeezing unit; the sponge block 2017 is connected to the connecting plate 2015, and the sponge block 2017 absorbs the water remaining on the thickness surface of the circuit board; the squeezing unit is connected to the connecting plate 2015, and the squeezing unit is used to squeeze the water out of the sponge block 2017.

[0044] The extrusion unit includes a filter screen 2018, a push block 2019, and a linkage assembly; the filter screen 2018 is fixedly connected to the connecting plate 2015, and the filter screen 2018 is in contact with the sponge block 2017; the push block 2019 is slidably connected to the connecting plate 2015, and the push block 2019 is in contact with the sponge block 2017. Through the cooperation of the filter screen 2018 and the push block 2019, the clean water in the sponge block 2017 is squeezed out; the linkage assembly is connected to the connecting plate 2015, and the linkage assembly is used to drive the push block 2019 to move vertically.

[0045] The upper side of the push block 2019 has an arc surface that is high in the middle and low at both ends.

[0046] The linkage assembly includes a linkage block 2020, a friction strip 2021, and a spring 2022. Two linkage blocks 2020 are slidably connected to the connecting plate 2015, and the linkage blocks 2020 are bolted to the push block 2019. All linkage blocks 2020 are fixedly connected to the friction strip 2021, and the friction strip 2021 is located above the rubber frame 2016. During the upward movement of the circuit board, the friction force drives the friction strip 2021 to move upward, and the friction strip 2021 links the push block 2019 to move upward to perform a pressing operation. Several springs 2022 are fixedly connected to the lower side of the push block 2019, and the springs 2022 are made of alloy material.

[0047] After one edge of the circuit board is polished, the circuit board moves upward away from the water and then rotates 90 degrees to polish the other edge. After rotation, the water remaining on the edge of the circuit board will spread to the center, thus increasing the difficulty of drying. Therefore, during polishing, the clamping plate 8 and the electric suction cup 10 drive the circuit board downward, so that the lower edge of the circuit board passes through the rubber frame 2016 and then contacts the polishing block 4. After polishing, the clamping plate 8 and the electric suction cup 10 drive the circuit board upward, so that the lower edge of the circuit board moves upward and passes through the rubber frame 2016, thereby scraping away the water remaining on the lower side of the circuit board through the rubber frame 2016, preventing it from spreading to the center of the circuit board and increasing the difficulty of drying.

[0048] The rubber frame 2016 cannot remove the water remaining on the thickness surface of the circuit board. Therefore, after the lower edge of the circuit board moves upward and passes through the rubber frame 2016, the electric push rod 5 drives the ring 6 and its components to move forward, so that the circuit board moves directly above the sponge block 2017. Then, the electric slider 2010 drives the connecting plate 2011 and its components to move downward, so that the circuit board moves downward and contacts the sponge block 2017. The sponge block 2017 absorbs the water remaining on the thickness surface of the circuit board, preventing it from spreading to the middle of the circuit board and increasing the drying difficulty.

[0049] After the sponge block 2017 becomes saturated with water, the water trapped within it must be squeezed out before the water absorption process can continue. Therefore, during the polishing process, the side of the circuit board comes into contact with the friction strip 2021. After polishing, the circuit board uses friction to move the friction strip 2021 upwards. The friction strip 2021 then moves the linkage block 2020 upwards, which in turn moves the push block 2019 upwards. The upward movement of the push block 2019 squeezes the sponge block 2017, thereby squeezing out the water from it and... When the spring 2022 is stretched, the distance of sliding friction between the circuit board and the friction strip 2021 is much greater than the distance that the push block 2019 needs to move upward. This allows the push block 2019 to fully squeeze the sponge block 2017 and squeeze out the water. In use, the push block 2019 squeezes out the water from the sponge block 2017, keeping the sponge block 2017 absorbent. The friction between the upward-moving circuit board and the friction strip 2021 drives the push block 2019 to move. No additional electric drive components are required, making the structure ingenious.

[0050] Since the filter screen 2018 is only fixed to the connecting plate 2015 at its edges, the deformation capacity of the middle part of the filter screen 2018 is much greater than that of its edges. Therefore, after the filter screen 2018 is squeezed by the sponge block 2017, the middle part of the filter screen 2018 will bulge upwards. This results in the relatively low squeezing effect of the push block 2019 on the middle part of the sponge block 2017. Therefore, the upper side of the push block 2019 is set as an arc surface that is high in the middle and low at both ends, so that the push block 2019 can squeeze the middle part of the sponge block 2017 onto the bulging filter screen 2018, so as to ensure that the clean water in the sponge block 2017 is fully squeezed out.

[0051] Implementation Plan 3

[0052] Based on implementation plan 2, such as Figure 8 As shown, it also includes a U-shaped strip 2023; a groove 93 is provided on the second connecting plate 2015, and the groove 93 is located outside the sponge block 2017; a through groove 94 is provided on the second connecting plate 2015, and the through groove 94 communicates with the groove 93; the U-shaped strip 2023 is bolted to the second connecting plate 2015, and the U-shaped strip 2023 is located outside the groove 93. The U-shaped strip 2023 intercepts the squeezed water and prevents the water from flowing to the surface of the friction strip 2021.

[0053] During the upward squeezing of water from sponge block 2017, the water first flows to the upper side of connecting plate 2015, then flows into through groove 92, wetting rubber frame 2016 and friction strip 2021. This reduces the friction between friction strip 2021 and circuit board, making it difficult for friction strip 2021 to move upward fully, thus reducing the squeezing effect on sponge block 2017. Therefore, U-shaped strip 2023 intercepts the water squeezed from sponge block 2017, allowing it to flow into groove 93 and then back into outer shell 2 through through groove 94. This prevents water from being squeezed onto friction strip 2021, thus avoiding the problem of reduced squeezing effect on sponge block 2017 due to decreased friction of friction strip 2021.

[0054] A method for using an HDI circuit board cutting and edge grinding equipment includes the following steps:

[0055] Step 1: Water injection. Manually inject clean water into the outer shell 2, submerging the polishing block 4.

[0056] Step 2, loading: The circuit board is moved into the positioning assembly by an external conveyor mechanism;

[0057] Step 3, positioning: The circuit board is positioned using positioning components;

[0058] Step 4, polishing: Polish the lower edge of the circuit board using polishing block 4;

[0059] Step 5: Rotate the circuit board three times, each time by driving the drive component to rotate 90 degrees.

[0060] Step 6: Polishing. After each rotation of the circuit board, the lower edge of the circuit board after rotation is polished using polishing block 4.

[0061] Although the present invention has been described in detail with reference to the above embodiments, it will be apparent to those skilled in the art that various changes or modifications can be made to the invention without departing from the principles and spirit of the invention as defined by the claims. Therefore, the detailed description of the embodiments in this disclosure is for illustrative purposes only and is not intended to limit the invention; rather, the scope of protection is defined by the content of the claims.

Claims

1. An HDI circuit board cutting and edge grinding device, comprising a support frame (1); a housing (2) is fixedly connected to the support frame (1); characterized in that: The outer casing (2) is connected to a pipe (3); the outer casing (2) is connected to a drive assembly; the drive assembly is connected to a grinding block (4); the drive assembly is used to drive the grinding block (4) to move horizontally; the drive assembly is connected to at least eight electric push rods (5); the drive assembly is used to drive the electric push rods (5) to move horizontally and vertically; all the electric push rods (5) are divided into two groups, and the telescopic ends of each group of electric push rods (5) are all fixedly connected to a ring (6); each ring (6) is rotatably connected to a ring (7); the drive assembly is used to drive the ring (7) to rotate; each ring (7) is fixedly connected to a clamp (8); each clamp (8) is fixedly connected to at least four elastic telescopic rods (9); each clamp (8) is slidably connected to an electric suction cup (10), and the electric suction cup (10) is fixedly connected to the telescopic end of the corresponding elastic telescopic rod (9); the outer casing (2) is connected to a positioning assembly for positioning the circuit board; The cross-section of the grinding block (4) is U-shaped, and at least two chamfered parts (91) are provided on the grinding block (4). The positioning component includes a limiting block (201); at least four limiting blocks (201) are fixedly connected to the outer shell (2); the cross section of the limiting block (201) is U-shaped; an electric push rod (202) is provided on the inner side of the outer shell (2), and the electric push rod (202) is fixedly connected to the corresponding limiting block (201); a positioning block (203) is fixedly connected to the telescopic end of the electric push rod (202), and the positioning block (203) is in sliding contact with the corresponding limiting block (201); It also includes a cleaning component; the cleaning component is connected to the outer shell (2); the cleaning component includes a second connecting plate (2015); the second connecting plate (2015) is fixedly connected to the outer shell (2); a through groove (92) is opened on the second connecting plate (2015); a rubber frame (2016) is fixedly connected to the second connecting plate (2015), and the rubber frame (2016) is located in the through groove (92); It also includes a water-absorbing component; the water-absorbing component is connected to the connecting plate 2 (2015); the water-absorbing component includes a sponge block (2017); the sponge block (2017) is connected to the connecting plate 2 (2015); the squeezing unit is connected to the connecting plate 2 (2015), and the squeezing unit is used to squeeze out the water in the sponge block (2017); before polishing, clean water is manually injected into the outer shell (2), and the clean water submerges the polishing block (4).

2. The HDI circuit board cutting and edge grinding equipment according to claim 1, characterized in that: The extrusion unit includes a filter screen (2018); the filter screen (2018) is fixedly connected to the second connecting plate (2015), and the filter screen (2018) is in contact with the sponge block (2017); a push block (2019) is slidably connected to the second connecting plate (2015), and the push block (2019) is in contact with the sponge block (2017); a linkage assembly is connected to the second connecting plate (2015), and the linkage assembly is used to drive the push block (2019) to perform vertical movement.

3. The HDI circuit board cutting and edge grinding equipment according to claim 2, characterized in that: The upper side of the push block (2019) is an arc surface that is high in the middle and low at both ends.

4. The HDI circuit board cutting and edge grinding equipment according to claim 3, characterized in that: The linkage assembly includes a linkage block (2020); at least two linkage blocks (2020) are slidably connected on the connecting plate two (2015), and the linkage blocks (2020) are fixedly connected to the push block (2019); all linkage blocks (2020) are fixedly connected to a friction strip (2021), and the friction strip (2021) is located above the rubber frame (2016); several springs (2022) are fixedly connected to the lower side of the push block (2019), and the springs (2022) are fixedly connected to the connecting plate two (2015).

5. An HDI circuit board cutting and edge grinding equipment according to any one of claims 3-4, characterized in that: It also includes a U-shaped strip (2023); a groove (93) is provided on the second connecting plate (2015), and the groove (93) is located outside the sponge block (2017); a through groove (94) is provided on the second connecting plate (2015), and the through groove (94) is connected to the groove (93); a U-shaped strip (2023) is fixed on the second connecting plate (2015), and the U-shaped strip (2023) is located outside the groove (93).

6. A method of using an HDI circuit board cutting and edge grinding equipment, characterized in that, This method uses the HDI circuit board cutting and edge grinding equipment as described in claim 5, and includes the following steps: Step 1: Water injection. Manually inject clean water into the outer shell (2) until the polishing block (4) is submerged. Step 2, loading: The circuit board is moved into the positioning assembly by an external conveyor mechanism; Step 3, positioning: The circuit board is positioned using positioning components; Step 4, polishing: polish the lower edge of the circuit board using polishing block (4); Step 5: Rotate the circuit board three times, each time by driving the drive component to rotate 90 degrees. Step 6: Polishing. After each rotation of the circuit board, the lower edge of the circuit board after rotation is polished by the polishing block (4).

Images