Detection device, system and method for edge detection of silicon-based substrate module

Abstract

The present disclosure discloses a detection device for edge detection of a silicon-based substrate module and its system and method, the detection device comprising: a first light source, whose light emitting portion is arranged on a first lateral side in the horizontal direction of an edge to be detected of the silicon-based substrate module; and a detection camera, which is arranged on a first longitudinal side in the vertical direction of the silicon-based substrate module, the lens of the detection camera is arranged toward the edge to be detected, and the central axis of the lens of the detection camera is arranged to form an angle of 40° to 50° with the horizontal surface of the silicon-based substrate module. The scheme disclosed in the present disclosure can significantly improve the detection effect of hidden cracks in the silicon-based substrate module by arranging a first light source located on the first lateral side of the edge to be detected, and a detection camera arranged on the first longitudinal side in the vertical direction of the edge to be detected and forming an angle of 40° to 50° with the horizontal plane of the silicon-based substrate module.

Description

Technical Field

[0001] The present disclosure generally relates to the field of detection technology. More specifically, the present disclosure relates to a detection device and a system and method thereof for edge detection of a silicon-based substrate module. Background Art

[0002] Among the current micro display devices, silicon-based substrate modules such as MicroOLED modules are more common, and such modules use single crystal silicon as the substrate. Among them, the production process of such modules generally involves the procedure of wafer cutting, which can easily cause hidden crack defects at the edge of the silicon-based substrate module, leading to functional problems or hidden dangers in the product. Therefore, hidden crack detection of silicon-based substrate modules is extremely important. However, hidden crack defects are generally located inside the edge of the product. Since they are basically invisible from the surface, they cannot be detected by manual microscopy, nor can they be detected using conventional optical imaging detection methods. There is currently no feasible detection solution for this defect.

[0003] In view of this, there is an urgent need to provide a detection device solution for edge detection of silicon-based substrate modules, so as to avoid detection errors caused by hidden crack defects and improve detection efficiency and detection accuracy. Summary of the invention

[0004] In order to at least solve one or more of the technical problems mentioned above, the present disclosure proposes a detection solution for edge detection of a silicon-based substrate module in the following aspects.

[0005] In a first aspect, the present disclosure provides a detection device for edge detection of a silicon-based substrate module, comprising: a first light source, a light-emitting portion of which is arranged on a first lateral side in a horizontal direction of an edge to be inspected of the silicon-based substrate module; and a detection camera, which is arranged on a first longitudinal side in a vertical direction of the silicon-based substrate module, the lens of the detection camera is set toward the edge to be inspected, and the central axis of the lens of the detection camera is arranged to form an angle of 40° to 50° with the horizontal surface of the silicon-based substrate module.

[0006] In some embodiments, the central axis of the lens of the detection camera is arranged to form an angle of 45° with the horizontal surface of the silicon-based substrate module.

[0007] In some embodiments, the inspection camera is disposed on a second lateral side opposite to the first lateral side.

[0008] In some embodiments, a second light source is further included, and a light emitting portion of the second light source is coaxially arranged with the lens of the detection camera.

[0009] In some embodiments, a reflective lens is further included, which is disposed on a side opposite to the first longitudinal side, and a reflective surface of the reflective lens faces the first light source.

[0010] In some embodiments, the distance between the light emitting portion of the first light source and the edge to be inspected is 1 mm to 9 mm.

[0011] In some embodiments, the distance between the light emitting portion of the second light source and the edge to be inspected is 40 mm to 80 mm.

[0012] In some embodiments, the first light source is an infrared light source that can emit infrared light with a wavelength of 1300 nm.

[0013] In a second aspect, the present disclosure provides a detection system for edge detection of a silicon-based substrate module, comprising: one or more detection devices according to the second aspect; and a control module, which is electrically connected to a first light source and a detection camera of the detection device for control and processes images taken by the detection camera.

[0014] In a third aspect, the present disclosure provides a method for detecting the edge of a silicon-based substrate module using the detection system according to the second aspect, comprising: positioning a first light source on a first lateral side of the edge to be inspected of the silicon-based substrate module, and positioning a detection camera on a first longitudinal side of the edge to be inspected, wherein a lens of the detection camera faces the edge to be inspected, and a central axis of the lens of the detection camera forms an angle of 40° to 50° with a horizontal surface of the silicon-based substrate module; illuminating the edge to be inspected with the first light source, and capturing an image with the detection camera; and allowing a control module to read the image captured by the detection camera through a visual algorithm, and determine whether there are defects in the edge to be inspected in the image.

[0015] Through the detection device for edge detection of silicon-based substrate modules as provided in the first aspect and multiple embodiments, the disclosed embodiment can significantly improve the detection effect of hidden cracks in silicon-based substrate modules by providing a first light source located on the first lateral side of the edge to be detected, and a detection camera provided on the first longitudinal side of the edge to be detected in the vertical direction and at an angle of 40° to 50° with the horizontal plane of the silicon-based substrate module. Furthermore, in some embodiments, by limiting the angle between the detection camera lens and the horizontal plane of the silicon-based substrate module to 45°, the clarity of the image obtained by the detection device can be further improved. Furthermore, in some embodiments, by providing a second light source coaxially arranged with the detection camera lens, bottom-side supplementary light can be provided for the silicon-based substrate module, further improving the detection effect of hidden crack defects. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] By reading the detailed description below with reference to the accompanying drawings, the above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0017] Figure 1A three-dimensional schematic diagram of a detection device for edge detection of a silicon-based substrate module according to some embodiments of the present disclosure is shown;

[0018] Figure 2 A three-dimensional schematic diagram of a detection device for edge detection of a silicon-based substrate module according to some embodiments of the present disclosure is shown;

[0019] Figure 3 A three-dimensional schematic diagram of a detection device for edge detection of a silicon-based substrate module according to some embodiments of the present disclosure is shown;

[0020] Figure 4 An exemplary structural block diagram of a silicon-based substrate module edge detection system according to some embodiments of the present disclosure is shown;

[0021] Figure 5 An exemplary flow chart of a silicon-based substrate module edge detection method according to some embodiments of the present disclosure is shown. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.

[0023] It should be understood that the terms "include" and "comprising" used in the specification and claims of the present disclosure indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections thereof.

[0024] It should also be understood that the terms used in this disclosure are only for the purpose of describing specific embodiments and are not intended to limit the disclosure. As used in this disclosure and claims, the singular forms of "a", "an", and "the" are intended to include the plural forms unless the context clearly indicates otherwise. It should also be further understood that the term "and / or" used in this disclosure and claims refers to any combination of one or more of the associated listed items and all possible combinations, including these combinations.

[0025] As used in this specification and claims, the term "if" can be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0026] The specific implementation of the present disclosure is described in detail below with reference to the accompanying drawings.

[0027] Figure 1 A three-dimensional schematic diagram of a detection device for edge detection of a silicon-based substrate module in some embodiments of the present disclosure is shown. Among them, the detection device for edge detection of a silicon-based substrate module is used to detect the edge of a silicon-based substrate module 10 such as a MicroOLED module. In this embodiment, the detection device may include a first light source 30, which is arranged on the first lateral side in the horizontal direction of the horizontally placed silicon-based substrate module 10. The light-emitting portion 31 of the first light source 30 is arranged toward the edge 11 to be detected of the silicon-based substrate module 10, so as to emit detection light in the horizontal direction. The detection device for edge detection of a silicon-based substrate module may also include a detection camera 20, which is arranged on the first longitudinal side in the vertical direction of the silicon-based substrate module 10, and the lens 21 of the detection camera 20 is arranged to face the edge 11 to be detected at an inclined angle to capture the image of the edge 11 to be detected being illuminated. The central axis A1 of the lens 21 of the detection camera 20 can be arranged to be 40° to 50° with the angle A0 between the horizontal surface of the silicon-based substrate module 10.

[0028] In this embodiment, the silicon-based substrate module 10 to be inspected can be arranged on a carrier 90, and the carrier 90 can be, for example, a detection fixture fixed to a detection platform 80, which includes a positioning structure that can match the shape of the silicon-based substrate module 10 to limit the position of the silicon-based substrate module 10. In this embodiment, the silicon-based substrate module 10 is roughly in the shape of a rectangular sheet, which can be composed of CG glass and a silicon-based substrate stacked on each other, and a sealing ring can be sandwiched between the two. The silicon-based substrate module 10 has one side of CG glass attached to the upper surface of the carrier 90, so that one side of the silicon-based substrate is vertically facing upward. And the edge 11 to be inspected of the silicon-based substrate module 10 can at least partially protrude from the carrier 90 in the horizontal direction, so that the edge 11 to be inspected is transparent in the vertical direction, which is convenient for the detection camera 20 to detect the edge portion. The light-emitting portion 31 of the first light source 30 is arranged on the first lateral side in the horizontal direction of the silicon-based substrate module 10, and is arranged near the edge 11 to be detected. The distance between the light-emitting portion 31 and the edge 11 to be detected in the horizontal direction can be 1mm to 9mm, so that the detection light is concentrated on the position to be detected. The detection camera 20 is arranged on the upper side of the silicon-based substrate module 10 in the vertical direction, and at the same time, it is located on the second lateral side opposite to the first lateral side relative to the edge 11 to be detected of the silicon-based substrate module 10. And the lens 21 of the detection camera 20 can be arranged to be at an angle of 40° to 50° with the horizontal direction. In some implementation scenarios, the aforementioned angle can be 45°. The first light source 30 can be fixed on the light source bracket by means of an adjustment platform of the first light source 30. The adjustment platform of the first light source 30 can be an angle positioning mechanism such as an angle slide that can rotate relative to an adjustment center axis, so that the central axis of the light-emitting portion 31 of the first light source 30 can be adjusted within a range of ±5° with the horizontal plane of the silicon-based substrate module 10. In this embodiment, the central axis of the light emitting portion 31 can be arranged parallel to the horizontal plane of the silicon-based substrate module 10, so as to directly irradiate the edge 11 to be inspected to obtain the theoretically optimal detection effect. However, by setting an angle-adjustable light source adjustment platform, corresponding fine-tuning can be performed according to the actual situation of the product edge, and it can be adapted to products with inclined edges, further avoiding the situation where the horizontal detection light is refracted or reflected by the product edge. Similarly, the detection camera 20 can also be fixed to the camera bracket with the aid of the detection camera adjustment platform 25, so as to make corresponding angle adjustments to the detection camera 20. It can be understood that in order to ensure clear and stable imaging, the center of the rotation adjustment trajectory of the adjustment platform of the above-mentioned first light source 30 and the detection camera adjustment platform 25 can be set to the position of the edge 11 to be inspected.

[0029] In this embodiment, the first light source 30 uses a point infrared light source that can emit infrared light with a wavelength of 1300nm. This setting is extremely effective in improving the detection effect of hidden cracks on the edge 11 to be inspected of the silicon-based substrate module 10. Specifically, in the module process of the later stage of MicroOLED module production, for example, the wafer cutting procedure is generally involved, and in this process, hidden crack defects are easily caused at the edge of the MicroOLED module, resulting in functional problems or hidden dangers in the product. The hidden crack defects described herein are located inside the product. If an ordinary common light source is used for irradiation, it is difficult to penetrate the product material and the edge defects that need to be detected cannot be illuminated. Therefore, it is necessary to use a light source with stronger penetration for irradiation, and light with a longer wavelength has stronger penetration. At the same time, the clarity of optical imaging is inversely proportional to the wavelength. In order to ensure the clarity of the imaging, it is necessary to comprehensively consider the selected light source. Therefore, an infrared light source with a wavelength of 1300 nm is used to illuminate the edge 11 to be inspected, and the detection camera 20 is set to a corresponding infrared camera to capture and image the illuminated edge 11 to be inspected, which not only meets the clarity requirement but also improves the detection effect of hidden crack defects.

[0030] It is understandable that, although the above-mentioned embodiment describes a technical solution of using an infrared light source with a wavelength of 1300nm to irradiate the silicon-based substrate module 10, other light sources can be provided under the premise of meeting specific clarity and penetration requirements. For example, when the product has a smaller thickness or the location where the hidden defects are generated is closer to the edge of the silicon-based substrate module 10, it is also possible to consider selecting a light source with a smaller wavelength to obtain a higher-definition image according to actual needs, and when the state of the hidden defects at the edge of the product is unstable, or the category of the product to be inspected changes frequently, a light source with a variable wavelength can also be used for irradiation, and a multi-spectral detection camera can be used for imaging accordingly.

[0031] In one implementation scenario, the detection device disclosed herein may also be provided with a second light source 40, which is provided on a light source bracket by means of a second light source adjustment platform 41. The second light source 40 may be provided to be located at a first lateral side of the edge 11 to be inspected, and to be located at the vertical lower side of the first light source 30. The light-emitting portion of the second light source 40 is provided toward the edge 11 to be inspected, and the central axis of the light-emitting portion of the second light source 40 may coincide with the central axis A1 of the lens 21 of the detection camera 20. In other words, the light-emitting portion of the second light source 40 may be provided to be opposite to the lens 21 of the detection camera 20, and the edge 11 to be inspected is located on an axis common to the two. This enables the illumination light emitted by the second light source 40 to be projected through the edge 11 to be inspected to the lens 21 of the detection camera 20, providing the detection camera 20 with illumination from the back side of the edge 11 to be inspected, so that the detection camera 20 can clearly capture the structure within the edge 11 to be inspected. It can be understood that the purpose of arranging the detection camera 20 and the second camera relative to each other is to improve the imaging effect of the structure of the edge 11 to be inspected within the field of view of the detection camera 20 through the illumination of the second camera light. On the premise of irradiating the bottom side of the edge 11 to be inspected, the light-emitting part of the second light source 40 can also be set to be not coaxial with the axis of the lens of the detection camera 20.

[0032] A reflective element 50 may also be provided on the vertical lower side of the edge to be inspected 11. The reflective element 50 may be a sheet-shaped reflective lens, which is arranged vertically as a whole, arranged on the second lateral side relative to the edge to be inspected 11, and its reflective surface is arranged in the direction of the first light source 30, so as to reflect the light emitted by the first light source 30 and / or the second light source 40. Part of the light reflected by the reflective element 50 can be irradiated to the bottom side of the edge to be inspected 11, thereby better utilizing the illumination of the light source and further improving the imaging effect. In some implementation scenarios, the distance Dm1 between the reflective surface of the reflector and the edge to be inspected 11 in the lateral direction of the horizontal plane may be 5mm, the distance Dm2 between the vertical upper end of the reflector and the bottom surface of the silicon-based substrate module may be 2mm, and the reflector may be tilted in the vertical direction so that its reflective surface has an adjustable tilt angle Am toward the first lateral direction, and in this embodiment, the angle may be freely adjusted between 0° and 5°.

[0033] See also Figure 2 , Figure 2A three-dimensional schematic diagram of a detection device for edge detection of a silicon-based substrate module according to some embodiments of the present disclosure is shown. In this embodiment, the adjustment platform of the first light source 30 and the detection camera adjustment platform 25 may include an XYZ three-direction adjustment mechanism. By using the XYZ three-direction adjustment mechanism, the detection camera 20 and the first light source 30 are adjusted in spatial position, so that the camera is focused on the edge to be detected 11, or the illumination of the first light source 30 meets the required brightness conditions, thereby improving the quality of the detection image. At the same time, the targets of the detection camera 20, the first light source 30 and the edge to be detected 11 can also be adjusted to be in the same vertical reference plane, thereby ensuring the accuracy of the detection. The XYZ three-direction adjustment mechanism can be, for example, composed of a stacked combination of manual adjustment slides in the three directions of XYZ, so that the spatial positions of the corresponding detection components can be adjusted manually. In addition, in some embodiments, in addition to the XYZ three-direction adjustment mechanism, an angle adjustment mechanism for adjusting the tilt angle can also be provided. By means of the XYZ three-direction adjustment mechanism 23 and the angle adjustment mechanism of the detection camera adjustment platform 25, the moving adjustment distance of the detection camera 20 in the vertical direction can be, for example, 40 mm, and the moving adjustment distance in the horizontal and longitudinal directions along the horizontal plane can also be 40 mm, and the angle can be adjusted within the range of ±5° relative to the edge to be inspected 11. By means of the XYZ three-direction adjustment mechanism 33 of the adjustment platform of the first light source 30, the moving adjustment distance of the first light source 30 in the horizontal direction can be 8 mm, that is, the lateral distance D1 between its light-emitting portion 31 and the edge to be inspected 11 can be adjusted between 5 mm±4 mm, and the adjustment distance in the vertical direction is 10 mm, and the angle can also be adjusted within the range of ±5°. Similar to the setting method of the first light source 30, the second light source adjustment platform 41 can also include an XYZ three-direction adjustment mechanism 43 for adjusting the position of the second light source 40 and a corresponding angle adjustment mechanism, wherein the second light source adjustment platform 41 can be adjusted in the vertical direction by 10 mm, and its movement adjustment in the horizontal plane direction can be coordinated with its movement adjustment in the vertical direction, so that the distance between the light-emitting part of the second light source 40 and the edge to be inspected 11 can be adjusted between 40 mm and 80 mm, and the angle can be adjusted within the range of ±5°, so as to ensure suitable lighting and further avoid the illumination of the bottom side of the edge to be inspected 11 affecting the illumination effect of the first light source 30 on the hidden crack defects on the edge.

[0034] It is understandable that the XYZ adjustment mechanisms corresponding to the above-mentioned several detection elements can be selected and configured according to actual needs. For example, if longitudinal adjustment is not required, only the adjustment mechanisms in the X and Y directions can be set. Alternatively, only one linear adjustment mechanism can be set, so that the adjustment direction of the linear adjustment mechanism is 45° with the horizontal plane direction of the silicon-based substrate module 10, so that the adjustment device structure is simpler and the adjustment is more convenient. In addition, an adjustment mechanism with an electric drive device can also be set to further facilitate the adjustment work.

[0035] In some implementation scenarios, a second detection camera 70 may also be provided. The second detection camera 70 may be provided on the vertical upper side of the silicon-based substrate module 10, and the axis of the camera lens thereof is perpendicular to the horizontal plane of the silicon-based substrate module 10, so as to obtain an image of the silicon-based substrate module 10 in the top-view direction. Through the top-view image, it is possible to determine whether the appearance of the silicon-based substrate module 10 is normal, and to determine whether the silicon-based substrate module 10 is accurately placed in the predetermined position by means of visual inspection. In addition, the carrier platform 90 in the device may further include a rotating mechanism 60. The rotating mechanism 60 may be, for example, an electric turntable, and a fixture for placing the silicon-based substrate module 10 in an angularly positioned manner is fixedly provided on the upper surface of the rotating portion thereof, so that rapid switching between a plurality of edges 11 to be inspected may be performed by rotating the turntable.

[0036] See also Figure 3 , Figure 3 A three-dimensional schematic diagram of a detection device for edge detection of a silicon-based substrate module according to some embodiments of the present disclosure is shown. Different from the aforementioned embodiments, in this embodiment, the detection camera 20 is arranged on the lower side of the silicon-based substrate module 10 in the vertical direction, and the second light source 40 is arranged on the upper side of the silicon-based substrate module 10 in the vertical direction. At this time, the lower side of the silicon-based substrate module 10 in the vertical direction is the first longitudinal side. Accordingly, for example, when the silicon-based substrate module 10 is a structure composed of CG glass and a silicon-based substrate stacked on each other, the silicon-based substrate module 10 can be changed to have one side of the silicon-based substrate attached to the upper surface of the carrier 90, so that one side of the CG glass is vertically facing upward. In this setting, the position of the detection camera 20 is lower, which facilitates the adjustment of the camera position and other parameters.

[0037] When the angle between the lens axis and the horizontal plane of the silicon-based substrate module 10 is 45°, the lens 21 of the detection camera 20 can capture a comprehensive optimal image composed of the reflected light of the hidden crack defect identification surface and the edge 11 to be inspected under the irradiation of the first light source 30. Specifically, the hidden crack defects described herein are usually cracks extending parallel to the horizontal plane of the silicon-based substrate module 10. Therefore, such cracks often overlap in the vertical direction perpendicular to the horizontal surface of the silicon-based substrate module 10, and the projection of the bottom crack is blocked by the upper crack, resulting in blurred images and difficulty in distinguishing the number, shape and specific location of the cracks. When observing in a direction parallel to the horizontal surface of the silicon-based substrate module 10, since the crack extension direction is in the same direction as the observer's observation direction, its projection area in the horizontal direction is extremely small, resulting in the inability to observe the specific situation of the crack. Therefore, when the inspection camera 20 and the silicon-based substrate module 10 are at a horizontal angle of 45°, the central axis of the inspection camera 20 lens and the hidden crack defect at the edge to be inspected 11 form an angle, so that multiple cracks can form independent projections in the lens field of view even in a stacked state, avoiding the problem of overlapping. At the same time, when the first light source 30 is used to illuminate the edge to be inspected 11, the light emitted by the first light source 30 is reflected inside the hidden crack, clearly showing the internal structure of the crack, and can form a larger projection area in the direction of the inspection camera 20 lens.

[0038] It is understood by those skilled in the art that, although the angle between the lens axis of the detection camera 20 and the horizontal plane of the silicon-based substrate module 10 is set to 45° in some of the embodiments described above, this disclosure does not impose an exclusive restriction on this angle. Therefore, according to different application scenarios, a suitable angle can be selected and set between 40° and 50°.

[0039] See also Figure 4 , Figure 4An exemplary structural block diagram of a detection system for edge detection of a silicon-based substrate module according to some embodiments of the present disclosure is shown. In this embodiment, the detection system 100 for edge detection of a silicon-based substrate module includes at least one detection device for edge detection of a silicon-based substrate module according to the above-mentioned embodiment, and a control module electrically connected to the device. Among them, the control module may, for example, include an IO (input / output) submodule for connecting and controlling a light source or camera of one or more detection devices for edge detection of a silicon-based substrate module, a storage submodule connected to the IO submodule, and a computing processing submodule, etc. With the help of the various functional submodules it contains, the control module can control the switch of a camera or light source of at least one detection device for edge detection of a silicon-based substrate module. Further, the control module can also read the picture taken by the detection camera 20 according to the picture and the visual algorithm built into the control module, judge the condition of the edge 11 to be detected through the picture, and can perform the next step according to the judgment result, or output the judgment result to other receiving ends such as a display. In addition, the detection system 100 may also include a conveying device, a transportation device, etc. For example, the conveying device may be a mechanical arm for conveying or adjusting the position of the silicon-based substrate module 10, which can clamp the silicon-based substrate module 10 and move it in three directions along the XYZ axis for conveying. The mechanical arm can also be used to rotate along a rotation axis, so that after detecting an edge 11 to be inspected of the silicon-based substrate module 10, the other edge of the silicon-based substrate module 10 is adjusted to be aligned with the detection camera 20 and the first light source 30 by rotation. The transport device may be, for example, a transmission belt, and the carrier 90 is fixedly arranged on the moving plane of the transmission belt as a fixed fixture, and the silicon-based substrate module 10 loaded thereon is transported and moved with the movement of the transmission belt. The above-mentioned carrier 90 may also include a rotating mechanism 60 for rotating around a vertical direction, and the rotating mechanism 60 may be used to rotate the silicon-based substrate module 10 carried thereon, so that after detecting an edge 11 to be inspected of the silicon-based substrate module 10, another edge 11 to be inspected can be switched for inspection by the rotating mechanism 60.

[0040] Figure 5 FIG. 6 is an exemplary flow chart of a detection method 600 for edge detection of a silicon-based substrate module according to some embodiments of the present disclosure. It can be understood that the method 600 can be combined with the above Figure 4 The detection system 100 for edge detection of a silicon-based substrate module is described.

[0041] like Figure 5As shown in, in step S601, the silicon-based substrate module 10 is set in a detection device for edge detection of the silicon-based substrate module, and the first light source 30 is located at the first lateral side of the edge to be detected 11, and the detection camera 20 is located at the first longitudinal side of the edge to be detected 11, the lens 21 of the detection camera 20 is facing the edge to be detected 11, and the central axis of the lens 21 of the detection camera 20 is at an angle of 40° to 50° with the horizontal direction of the silicon-based substrate module 10. Then, at step S602, the first light source 30 is used to illuminate the edge to be detected 11 through the control module, and the detection camera 20 is used to capture an image. At step S603, the control module is used to read the image captured by the detection camera 20 through a visual algorithm, and determine whether there is a defect. As an additional operation, at step S604, the result obtained by the control module through calculation and analysis can be output to an external device to perform the next step or issue a prompt message. The next step can be to exclude defective products or automatically replace the detection product in response to the judgment result.

[0042] It is understandable that, according to different application scenarios, the above method 600 may also include additional steps, alternative steps or modified steps. For example, after step S601, that is, after the silicon-based substrate module 10 is set in the detection device for edge detection of the silicon-based substrate module, the second detection camera 70 may be made to visually identify the silicon-based substrate module 10 and adjust its position to align the edge 11 to be detected with the detection camera 20 and the first light source 30. When the detection system includes a conveying device, after step S602, that is, after detecting one edge 11 to be detected of the silicon-based substrate module 10, additional steps may be added, such as driving the conveying device to rotate the silicon-based substrate module 10 by 90° so that another edge 11 to be detected of the silicon-based substrate module 10 is aligned with the detection camera 20 and the first light source 30. Alternatively, when the carrier 90 includes a rotating mechanism 60, after step S602, that is, after the detection of one edge 11 to be inspected is completed, the rotating mechanism 60 can be rotated by a corresponding angle to align another edge 11 to be inspected of the silicon-based substrate module 10 with the detection camera 20 and the first light source 30. It can be understood that the present disclosure does not limit the order and number of executions of the multiple steps described above, and the specific steps to be adopted and the way in which they are combined are subject to their ability to meet specific functional requirements. For example, when the product is rectangular, the above-mentioned step of rotating the silicon-based substrate module with the aid of a conveying device or a rotating mechanism can be repeated multiple times to detect its four edges respectively.

[0043] The detection device for silicon-based substrate module detection in this embodiment can effectively avoid distortion of detection results caused by unclear images or crack overlap when detecting hidden crack defects by setting a light source that illuminates the edge to be detected horizontally and a detection camera that is set at an angle to the horizontal plane of the module, thereby improving the detection rate of defective products and avoiding functional problems or hidden dangers of the product. At the same time, it is simple to operate, and is very convenient to adjust and maintain, and is particularly suitable for edge detection of silicon-based substrate modules such as MicroOLED modules.

[0044] Although multiple embodiments of the present disclosure have been shown and described herein, it will be apparent to those skilled in the art that such embodiments are provided by way of example only. Those skilled in the art may think of many changes, modifications, and alternatives without departing from the thought and spirit of the present disclosure. It should be understood that in the process of practicing the present disclosure, various alternatives to the embodiments of the present disclosure described herein may be adopted. The attached claims are intended to define the scope of protection of the present disclosure, and therefore cover equivalents or alternatives within the scope of these claims.

Claims

1. A detection device for edge detection of a silicon-based substrate module, characterized in that: include: A first light source (30), a light emitting portion of which is arranged on a first lateral side in a horizontal direction of the edge (11) to be inspected of the silicon-based substrate module (10), and the first light source (30) is aligned with the edge (11) to be inspected in a horizontal direction, and the first light source (30) is an infrared light source capable of emitting infrared light with a wavelength of 1300 nm; A detection camera (20) arranged on a first longitudinal side in a vertical direction of the silicon-based substrate module (10) and located on a second lateral side of the edge (11) to be detected that is opposite to the first lateral side; a second light source (40), wherein a light-emitting portion of the second light source (40) is coaxially arranged with a lens (21) of the detection camera (20); a reflective lens, which is arranged on a side opposite to the first longitudinal side, with its reflective surface facing the first light source (30); and The lens (21) of the detection camera (20) is arranged toward the edge (11) to be inspected, and the central axis (A1) of the lens (21) of the detection camera (20) is arranged to form an angle of 40° to 50° with the horizontal surface of the silicon-based substrate module (10), and the distance between the light-emitting portion of the first light source (30) and the edge (11) to be inspected is 1 mm to 9 mm.

2. The detection device according to claim 1, characterized in that: The central axis (A1) of the lens (21) of the detection camera (20) is arranged to form an angle of 45° with the horizontal surface of the silicon-based substrate module (10).

3. The detection device according to claim 1, characterized in that: The distance between the light emitting portion of the second light source (40) and the edge to be inspected (11) is 40 mm to 80 mm.

4. A detection system for edge detection of a silicon-based substrate module, characterized in that: include: One or more detection devices according to any one of claims 1 to 3; as well as A control module is electrically connected to the first light source (30) and the detection camera (20) of the detection device for control, and processes images captured by the detection camera (20).

5. A method for detecting the edge of a silicon-based substrate module using the detection system according to claim 4, characterized in that: include: The first light source (30) is located at a first lateral side of the edge (11) to be inspected of the silicon-based substrate module (10), and the detection camera (20) is located at a first longitudinal side of the edge (11) to be inspected, wherein the lens (21) of the detection camera (20) faces the edge (11) to be inspected, and the central axis (A1) of the lens (21) of the detection camera (20) forms an angle of 40° to 50° with the horizontal surface of the silicon-based substrate module (10); causing the first light source (30) to illuminate the edge to be inspected (11), and causing the inspection camera (20) to capture an image; as well as The control module is instructed to read the image captured by the detection camera (20) through a visual algorithm, and to determine whether the edge to be detected (11) in the image has a defect.

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