Handling system, method, and apparatus for handling pre-and post-grinding wafers, and wafer thinning apparatus

Abstract

The application discloses a wafer carrying system, method and device for carrying wafers before and after grinding and a wafer thinning device. The wafer carrying system comprises a carrying device and a controller. The carrying device comprises a grabbing assembly for grabbing wafers, wherein the grabbing assembly comprises a clamping part, a jaw arranged at the end of the clamping part and a suction cup. The controller is configured to enable the grabbing assembly to adsorb the wafer before grinding by the suction cup and enable the grabbing assembly to clamp the wafer after grinding by the jaw.

Description

Technical Field

[0001] This application belongs to the field of wafer processing technology, and specifically relates to a handling system, method, apparatus, and wafer thinning equipment for handling wafers before and after grinding. Background Technology

[0002] The ultra-precision wafer thinning equipment mainly integrates ultra-precision grinding, CMP and cleaning modules, thickness deviation and surface defect control technology, so as to meet the needs of ultra-precision wafer thinning technology in fields such as 3D IC manufacturing and advanced packaging.

[0003] In ultra-precision wafer thinning equipment, a robotic arm typically transports the wafer to an adsorption device in the inlet / outlet area. The adsorption device then carries the wafer on a rotary table to the grinding area for thinning. After thinning, the rotary table rotates again, returning the wafer to the inlet / outlet area, where the robotic arm removes the wafer from the adsorption device.

[0004] However, conventional handling robots typically use vacuum chucks to move wafers. After grinding and thinning, the wafer surface may contain particles such as slag. During vacuum adsorption, these slag particles are drawn onto the vacuum chuck. As a result, during wafer handling, slag particles can damage both the vacuum chuck and the wafer, thus affecting wafer quality and reducing the yield rate of wafer production. Summary of the Invention

[0005] This application provides a handling system, method, apparatus, and wafer thinning equipment for handling wafers before and after grinding, aiming to at least solve one of the technical problems existing in the prior art.

[0006] A first aspect of this application provides a transport system for handling wafers before and after grinding, including a transport device and a controller; the transport device includes a gripping component for gripping wafers, the gripping component including a clamping part, a chuck disposed at the end of the clamping part, and a suction cup; the controller is used to: cause the gripping component to adsorb the wafer before grinding through the suction cup, and cause the gripping component to clamp the wafer after grinding through the chuck.

[0007] A second aspect of this application provides a transport device for transporting wafers before and after grinding, comprising: a gripping assembly for gripping wafers, the gripping assembly including a clamping part, a chuck disposed at the end of the clamping part, and a suction cup, the suction cup being used to adsorb the wafer before grinding, and the chuck being used to clamp the wafer after grinding.

[0008] A third aspect of this application provides a method for transporting wafers before and after grinding, comprising: controlling a gripping component of a transport device to move to an adsorption position, causing the gripping component to adsorb the wafer before grinding via the suction cup, and causing the transport device to transport the wafer to a grinding module; and controlling the gripping component to move to a clamping position, causing the gripping component to clamp the wafer after grinding via the jaws, and causing the transport device to remove the wafer from the grinding module.

[0009] A fourth aspect of this application provides a wafer thinning apparatus, including the conveying device described above.

[0010] The beneficial effects of this application are as follows: The solution of this application can transport wafers in different states by means of a suction cup and a chuck set at the end of the clamping part. Specifically, the suction cup can be used to transport unground wafers, and the chuck can be used to transport ground wafers. Without adding a robotic arm, the wafer damage caused by the slag from the previous wafer grinding being contaminated onto the subsequent wafers is avoided as much as possible, thus improving the wafer quality. Attached Figure Description

[0011] The advantages of this application will become clearer and easier to understand through the detailed description in conjunction with the following accompanying drawings, which are merely illustrative and do not limit the scope of protection of this application, wherein:

[0012] Figure 1 This is a schematic diagram of a wafer thinning device;

[0013] Figure 2 This is a structural diagram of a conveying device;

[0014] Figure 3 This is a schematic diagram of a clamping column structure;

[0015] Figure 4 This is a schematic diagram of a wafer being moved using a clamping part;

[0016] Figure 5 This is a schematic diagram of a device that uses a suction cup to hold a wafer.

[0017] Figure 6 This is a structural diagram of a conveying device that includes a rotating component and a lifting component;

[0018] Figure 7 This is a flowchart illustrating a transportation method.

[0019] 1. Equipment front-end module;

[0020] 2. Polishing module; 21. Second transmission unit; 22. Third transmission unit; 23. Chemical mechanical polishing unit; 24. Post-processing unit;

[0021] 3. Grinding module; 31. Grinding unit; 311. Base; 312. Worktable; 313. Wafer adsorption device; 314. Loading and unloading station;

[0022] 32. Cleaning unit; 33. Fourth transmission unit;

[0023] 40. Cleaning device; 50. Adsorption type wafer handling device;

[0024] 60. Gripping component; 61. Clamping part; 611. Adsorption surface; 612. Connecting arm; 6121. First fixing section; 6122. Second fixing section; 6123. Transition section; 613. Support arm; 614. Clamping post; 615. Claw; 616. Suction cup;

[0025] 62. Base; 63. Drive assembly; 64. Guide rail;

[0026] 70. Rotating component; 80. Lifting component. Detailed Implementation

[0027] The technical solutions described in this application will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific implementations of this application, used to illustrate the concept of this application; these descriptions are illustrative and exemplary, and should not be construed as limiting the implementation methods or the scope of protection of this application. In addition to the embodiments described herein, those skilled in the art can employ other obvious technical solutions based on the content disclosed in the claims and description of this application. These technical solutions include those that make any obvious substitutions and modifications to the embodiments described herein.

[0028] The accompanying drawings in this specification are schematic diagrams used to illustrate the concept of this application and to schematically show the shapes of the various parts and their interrelationships. It should be understood that, in order to clearly show the structure of the various components of the embodiments of this application, the drawings are not drawn to the same scale, and the same reference numerals are used to indicate the same parts in the drawings.

[0029] In this application, wafer backside thinning refers to high-precision grinding of semiconductor materials before packaging to reduce their morphology to a suitable shape, thereby reducing the packaging mounting height, reducing the chip packaging volume, and improving the chip's thermal diffusion efficiency, electrical performance, and mechanical performance.

[0030] In this application, a wafer (W) is also referred to as a substrate, crystal plate, or wafer, etc., with the same meaning and practical function.

[0031] The ultra-precision thinning equipment mainly integrates ultra-precision grinding, CMP and cleaning modules, thickness deviation and surface defect control technology, so as to meet the needs of wafer ultra-precision thinning technology in fields such as 3D IC manufacturing and advanced packaging.

[0032] Figure 1 An exemplary schematic diagram of an ultra-precision thinning device is shown, as illustrated in the figure, which includes:

[0033] Equipment front-end module 1 is used to realize the entry and exit of wafers. Equipment front-end module 1 is set at the front end of the wafer thinning equipment. Equipment front-end module 1 is a transition module that realizes the transfer of wafers from the outside to the inside of the equipment, so as to realize the "dry entry and dry exit" of wafers.

[0034] Grinding module 3 is used to grind the wafer, including rough grinding and fine grinding. Grinding module 3 is located at the end of the wafer thinning equipment.

[0035] The polishing module 2 is used to perform chemical mechanical polishing on the wafer after the grinding is completed. It also has the function of transferring the wafer between the three modules (equipment front-end module 1, grinding module 3 and polishing module 2). The polishing module 2 is located between the equipment front-end module 1 and the grinding module 3.

[0036] Understandable Figure 1 The wafer thinning device shown is only one example. In other implementations, the polishing module 2 can be omitted, leaving only the front-end module 1 and the grinding module 3. In addition, the grinding module 3 can also include multiple grinding passes, such as 3 passes, 4 passes, 5 passes, etc. Similar modified embodiments that can achieve the wafer grinding and thinning function should fall within the protection scope of this application.

[0037] Device front-end module 1:

[0038] The front-end module 1 of the equipment includes a wafer storage unit and a first transmission unit. The wafer storage unit is located on one side of the front end of the wafer thinning equipment, and the first transmission unit is located between the wafer storage unit and the polishing module 2 to realize the transmission of the wafer between the wafer storage unit and the polishing module 2.

[0039] A wafer storage unit consists of multiple front-opening unified pods (FOUPs), specifically two, three, or more.

[0040] The first transfer unit includes a wafer pick-and-place robot. The wafer pick-and-place robot can rotate, extend, or fold and retract, and can also move along a transfer track. The wafer pick-and-place robot can retrieve wafers to be processed from the wafer storage unit through the door structure of the wafer transfer box and send them to the polishing module 2, and can also receive processed wafers from the polishing module 2 and place them into the wafer transfer box.

[0041] Polishing Module 2:

[0042] The polishing module 2 includes a second transmission unit 21, a third transmission unit 22, a chemical mechanical polishing unit 23, and a post-processing unit 24. The second transmission unit 21, the chemical mechanical polishing unit 23, and the post-processing unit 24 occupy the edges of the polishing module 2, respectively, while the third transmission unit 22 is located in the center.

[0043] Specifically, the second transfer unit 21 is located on one edge of the polishing module 2 and distributed along the length of the device, connecting the front-end module 1 and the grinding module 3. The chemical mechanical polishing unit 23 is located on the other edge of the polishing module 2 and is adjacent to the grinding module 3 and the second transfer unit 21, respectively. The post-processing unit 24 is located on another edge of the polishing module 2 and is adjacent to the front-end module 1, the second transfer unit 21, and the chemical mechanical polishing unit 23, respectively. The third transfer unit 22 is located near the center of the polishing module 2 and is surrounded by the second transfer unit 21, the chemical mechanical polishing unit 23, and the post-processing unit 24, used to realize the mutual transfer of wafers between the second transfer unit 21, the chemical mechanical polishing unit 23, and the post-processing unit 24.

[0044] In one embodiment, the second transmission unit 21 includes a temporary storage section and a moving buffer section for temporarily storing and transporting wafers. The temporary storage section is located near the front-end module 1 of the device and is used for temporarily storing or transferring wafers. The moving buffer section is arranged along the direction from the front-end module 1 of the device to the grinding module 3 and is bidirectionally movable.

[0045] In one embodiment, the third transfer unit 22 includes a central robot arm for transferring the ground wafer from the moving buffer section to the chemical mechanical polishing unit 23, transferring the polished wafer from the chemical mechanical polishing unit 23 to the post-processing unit 24, and transferring the cleaned wafer from the post-processing unit 24 to the temporary storage section.

[0046] After the wafer is taken out from the front-end module 1 of the equipment, it is transported to the grinding module 3 via the second transmission unit 21 for grinding. After the wafer is ground in the grinding module 3, it is transported to the chemical mechanical polishing unit 23 via the second transmission unit 21 and the third transmission unit 22 for polishing. After polishing and cleaning, the wafer is then transferred back to the front-end module 1 of the equipment via the third transmission unit 22 and the second transmission unit 21.

[0047] The post-processing unit 24 is used to clean and dry the polished wafer, and may include a horizontal brushing device and a single-chamber cleaning device.

[0048] Grinding Module 3:

[0049] The grinding module 3 includes a grinding unit 31, a cleaning unit 32, a fourth transmission unit 33, and a cleaning device 40.

[0050] The grinding unit 31 is used to perform wafer grinding and thickness measurement. For example... Figure 1 As shown, the grinding unit 31 includes a base 311, a worktable 312 mounted on the base, a wafer adsorption device 313 disposed on the worktable, and a grinding wheel corresponding to the workstation position. The worktable is used to support the wafer and can rotate about its vertical central axis. Figure 1 As shown, in one embodiment, the wafer adsorption device 313 has three units, which can rotate between the rough grinding station, the fine grinding station, and the loading / unloading station 314. Two grinding wheels respectively perform rough grinding and fine grinding. It is understood that... Figure 1 This is just one example. The number of wafer adsorption devices 313 and grinding wheels can also be other values, such as 1, 2, 4, 5, 6, etc., and 1, 3, 4, etc., of grinding wheels.

[0051] The fourth transfer unit 33 includes an adsorption-type wafer transport device 50 for transporting wafers. The adsorption-type wafer transport device 50 refers to a robotic arm used in the grinding module 3, used to transport wafers between the grinding unit 31 and the second transfer unit 21. Specifically, it is used to transfer wafers between the suction cup and the moving buffer unit corresponding to the loading / unloading station. The adsorption-type wafer transport device 50 obtains wafers from the moving buffer unit of the second transfer unit 21 and feeds them into the grinding unit 31 for grinding. After grinding and cleaning, the adsorption-type wafer transport device 50 removes the wafers from the grinding unit 31 and places them in the moving buffer unit for subsequent wafer transport.

[0052] However, in the above process, the adsorption wafer handling device 50 uses a vacuum chuck to handle the wafer. After grinding and thinning, there will be particles such as slag on the surface of the wafer. During vacuum adsorption, the slag will be adsorbed onto the vacuum chuck. Therefore, during the wafer handling process, the slag may damage the vacuum chuck and the wafer, thereby affecting the wafer quality and reducing the yield of wafer production.

[0053] To solve or alleviate the above problems, this application provides a handling device for handling wafers before and after grinding.

[0054] See Figure 2 A schematic diagram of a gripping component 60 of a conveying device is shown. The gripping component 60 is used to grip a wafer W, such as... Figure 2 As shown, the gripping component 60 includes a clamping part 61, a chuck 615 disposed at the end of the clamping part 61, and a suction cup 616. The suction cup 616 is used to adsorb the wafer W before grinding, and the chuck 615 is used to clamp the wafer W after grinding.

[0055] The solution of this application can transport wafers W in different states by means of a suction cup 616 and a chuck set at the end of the clamping part 61. Specifically, the suction cup 616 can be used to transport unground wafers W, and the chuck 615 can be used to transport ground wafers W. Without adding a robotic arm, the wafer damage caused by the handling equipment contaminating the wafers after grinding is avoided as much as possible, thus improving the wafer quality.

[0056] In this embodiment, as Figure 2 As shown, the gripping component 60 includes a base 62 and a clamping part 61 disposed on the base 62; a driving component 63 is also disposed on the base 62 for driving the clamping part 61 to move in a direction parallel to the surface of the base 62.

[0057] The drive component 63 can be a thin pneumatic gripper used to drive the clamping part 61 to perform opening and closing movements.

[0058] In this embodiment, the base 62 can be T-shaped, including a first protrusion and symmetrically arranged second and third protrusions, and the drive component 63 can be disposed on the first protrusion.

[0059] In this embodiment, see Figure 2 The clamping part 61 may specifically include a connecting arm 612, a support arm 613, and a clamping post 614. The connecting arm 612 is used to connect the drive assembly 63 and the support arm 613. The support arm 613 is used to set the clamping post 614. The end of the clamping post 614 away from the support arm 613 is provided with a claw 615 and a suction cup 616.

[0060] Optionally, in this embodiment, the connecting arm 612 includes: a first fixed section 6121 for fixed connection with the drive assembly 63; a second fixed section 6122 for fixed connection with the support arm 613; and a transition section 6123 located between the first fixed section 6121 and the second fixed section 6122 for providing clearance space for the drive assembly 63.

[0061] like Figure 2 As shown, the two connecting arms 612 are symmetrically arranged and have a figure-eight structure. The first fixed section 6121 and the second fixed section 6122 are both rectangular structures, and the transition section 6123 is a trapezoidal structure. The first fixed section 6121 and the second fixed section 6122 are connected by the trapezoidal transition section 6123, which can provide sufficient clearance space for the drive assembly 63 and ensure the strength of the connecting arms 612.

[0062] In this embodiment, the support arm 613 is a T-shaped arm, the connecting arm 612 is fixedly connected to the short side of the T-shaped arm, and clamping posts 614 are respectively provided at both ends of the T-shaped arm in the length direction.

[0063] Specifically, two connecting arms 612 are respectively mounted on the second and third protrusions of the base 62, and each of the second and third protrusions is provided with a guide rail 64 perpendicular to the length direction of the T-arm for guiding the T-arm. Thus, four clamping posts 614 can be set through the two T-arms.

[0064] The T-arm increases the number of clamping posts 614 and provides sufficient stable support for clamping. The guide rail 64 reduces errors in the movement of the T-arm, ensuring the movement accuracy of the T-arm and improving the accuracy of wafer clamping.

[0065] In this embodiment, the surface of the clamping part 61 away from the base 62 is the adsorption surface 611, the claw 615 extends inward from the adsorption surface 611, and the suction cup 616 is disposed on the adsorption surface 611.

[0066] Specifically, see Figure 3 The figure shows a schematic diagram of the structure of the clamping post 614 of the clamping part 61. The lower surface of the clamping post 614 is the adsorption surface 611. A suction cup 616 is provided on the adsorption surface 611. The adsorption surface 611 extends to the right side (towards the wafer) to form a claw 615. The claw 615 is a thin structure used to support the wafer and cooperate with the clamping post 614 to clamp the wafer W.

[0067] Figure 3 One implementation is shown where the boundary line between the jaw 615 and the clamping part 61 is a straight line segment. In other implementations, the boundary line between the jaw 615 and the clamping part 61 can match the outer periphery shape of the wafer W, i.e., an arc that matches the outer periphery shape of the wafer W, so as to clamp the wafer W more accurately and avoid damage to the wafer W as much as possible.

[0068] Furthermore, the boundary line may include multiple symmetrically arranged arc segments, which can match the outer periphery shape of wafers W of different sizes to increase the size of wafers W that the chuck 615 can hold.

[0069] In this embodiment, when the wafer W before grinding is adsorbed by the suction cup 616 of the gripping component 60, the driving component 63 can drive the clamping part 61 to move to the adsorption position, and the lifting component 80 can drive the gripping component 60 to perform lifting and lowering movements, so that the suction cup 616 moves to the surface of the wafer W and adsorbs the wafer W. Figure 4 A schematic diagram of an adsorbed wafer W is shown, as follows. Figure 4As shown, when the wafer W is adsorbed by the suction cup 616, the claw 615 is positioned above the wafer W. Figure 4 The base 62 is omitted from the text.

[0070] In this embodiment, when the ground wafer W is held by the jaws 615 of the gripping component 60, the driving component 63 can drive the gripping part 61 to move to the gripping position; the lifting component 80 can drive the gripping component 60 to perform lifting and lowering movements so that the jaws 615 move below the wafer W; the driving component 63 can drive the gripping part 61 to move inward, thereby causing the jaws 615 to grip the wafer W. Figure 5 A schematic diagram of a wafer W being clamped is shown, as follows. Figure 5 As shown, when the wafer W is clamped by the jaws 615, the jaws 615 are positioned above the wafer W. Figure 5 The base 62 is omitted from the text.

[0071] See Figure 6 In this embodiment, the transport device may further include: a support frame (not shown in the figure), a rotating component 70, and a lifting component 80; the support frame can be mounted on the base 311 of the grinding unit, the rotating component 70 is fixedly connected to the support frame, the lifting component 80 is mounted on the rotating component 70, and the gripping component 60 is mounted on the lifting component 80. The rotating component 70 can drive the lifting component 80 and the gripping component 60 to rotate together around the axial direction. The lifting component 80 can drive the gripping component 60 to move up and down. The gripping component 60 can accurately and controllably adsorb the wafer W and place it on the transfer table or accurately clamp the wafer W from the transfer table in the above manner, thereby ensuring the accurate and controllable movement position of the wafer W during the transfer process.

[0072] Specifically, when the wafer W is gripped by the jaws 615, the rotating component 70 moves the gripping component 60 to the station where the wafer W is located. The lifting component 80 lowers the gripping component 60 to a set point. The gripping column 614 retracts, causing the connected jaws 615 to move closer to the wafer W. Then, the lifting component 80 raises the gripping component 60, and the edge of the wafer W is lifted by the jaws 615 below the gripping column 614. The rotating component 70 then moves the gripping component 60 to the next station. When the next station is reached and a release action is required, the lifting component 80 lowers the gripping component 60 to the set point, the wafer W is lifted, the gripping column 614 and the connected jaws 615 open outwards, and the gripping component 60 rises, completing the release action.

[0073] When wafer W is picked up by suction cup 616, rotating component 70 moves gripping component 60 to the station where wafer W is located. Lifting component 80 lowers gripping component 60 to the set point, vacuum is turned on, and after wafer W is picked up, lifting component 80 raises gripping component 60, while rotating component 70 moves gripping component 60 to the next station. When the next station is reached and the picked-up wafer W needs to be released, lifting component 80 lowers gripping component 60 to the set point, vacuum is turned off, and lifting component 80 raises gripping component 60 to complete the release action.

[0074] Another embodiment of this application provides a handling system for a wafer thinning device, including a handling device and a controller.

[0075] The handling device includes a gripping component 60 for gripping wafer W. The gripping component 60 includes a clamping part 61, a claw 615 disposed at the end of the clamping part 61, and a suction cup 616.

[0076] The controller is used to cause the gripping component 60 to pick up the wafer W before grinding via the suction cup 616, and to cause the gripping component 60 to hold the wafer W after grinding via the chuck 615.

[0077] The controller can also be used to control the lifting assembly 80 and the rotating assembly 70, etc., all of which are within the protection scope of this application.

[0078] The structure of the conveying device can be referred to in the above embodiments, and will not be repeated here.

[0079] Another embodiment of this application provides a method for transporting wafers using the above-described transport device, such as... Figure 7 As shown, it includes:

[0080] S1. Control the gripping component of the transport device to move to the adsorption position, so that the gripping component adsorbs the wafer before grinding through the suction cup, and so that the transport device transports the wafer to the grinding module.

[0081] S2. Control the gripping component to move to the clamping position, so that the gripping component clamps the ground wafer through the jaws, and the conveying device moves the wafer out of the grinding module.

[0082] In this embodiment, steps S1 and S2 do not have a strict sequential relationship. Those skilled in the art can set up a controller to control the conveying device to execute the above steps S1 or S2 as needed, all of which are within the protection scope of this application.

[0083] Another embodiment of this application provides a wafer thinning apparatus using the above-described handling device. The specific structure of the wafer thinning apparatus can be found in [reference needed]. Figure 1 .

[0084] Another embodiment of this application provides a computer-readable storage medium having executable instructions stored thereon, which, when a processor executes the executable instructions, implement the method described above.

[0085] Another embodiment of this application provides a computer program product or computer program, which includes executable instructions stored in a computer-readable storage medium; the above method is implemented when the processor of an electronic device reads the executable instructions from the computer-readable storage medium and executes the executable instructions.

[0086] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0087] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A transport system for handling wafers before and after grinding, characterized in that, Includes conveying devices and controllers; The conveying device includes: a gripping component and a lifting component; The gripping assembly is used to grip a wafer. The gripping assembly includes a base, a driving assembly disposed on the base, and a clamping part disposed on the base. The clamping part includes a connecting arm, a supporting arm, and a clamping post. The connecting arm is used to connect the driving assembly and the supporting arm. The supporting arm is used to house the clamping post. The end of the clamping post away from the supporting arm is provided with a claw and a suction cup. The surface of the clamping post away from the base is an adsorption surface. The claw extends inward from the adsorption surface, and the suction cup is disposed on the adsorption surface. The lifting component is used to drive the gripping component to perform lifting and lowering movements; The controller is configured to: cause the gripping component to adsorb the wafer before grinding via the suction cup, and cause the gripping component to hold the wafer after grinding via the jaws; wherein, the driving component drives the clamping part to move to the adsorption position, and the lifting component drives the gripping component to perform lifting and lowering movements, so that the suction cup moves to the wafer surface and adsorbs the wafer; and, the driving component drives the clamping part to move to the clamping position, and the lifting component drives the gripping component to perform lifting and lowering movements, so that the jaws move below the wafer, and the driving component drives the clamping part to move inward, thereby causing the jaws to clamp the wafer.

2. The handling system according to claim 1, characterized in that, The base is provided with a guide rail, and the support arm is disposed on the guide rail. The guide rail is used to guide the reciprocating motion of the support arm.

3. The handling system according to claim 1, characterized in that, The conveying device also includes a rotating component, which drives the lifting component and the gripping component to rotate together around an axial direction.

4. The handling system according to claim 1, characterized in that, The boundary line between the claw and the clamping part is an arc shape that matches the outer periphery of the wafer.

5. A transport device for handling wafers before and after grinding, characterized in that, include: Grabbing components and lifting components; The gripping assembly is used to grip a wafer. The gripping assembly includes a base, a driving assembly disposed on the base, and a clamping part disposed on the base. The clamping part includes a connecting arm, a supporting arm, and a clamping post. The connecting arm is used to connect the driving assembly and the supporting arm. The supporting arm is used to house the clamping post. The end of the clamping post away from the supporting arm is provided with a claw and a suction cup. The surface of the clamping post away from the base is an adsorption surface. The claw extends inward from the adsorption surface, and the suction cup is disposed on the adsorption surface. The lifting component is used to drive the gripping component to perform lifting and lowering movements; The suction cup is used to adsorb the wafer before grinding when the lifting component drives the gripping component to descend, and at this time the claw is located above the outer periphery of the wafer and does not contact the wafer; The gripper is used to lift the wafer from below when the lifting assembly drives the gripping assembly to descend.

6. A method for handling wafers before and after grinding, employing the handling device described in claim 5, characterized in that, include: Adsorption step: Control the gripping component of the conveying device to move to the adsorption position, cause the driving component to drive the clamping part to move to the adsorption position, cause the lifting component to drive the gripping component to perform lifting and lowering motion so that the suction cup moves to the wafer surface and the wafer is adsorbed by the suction cup, and cause the conveying device to transport the wafer to the grinding module. Clamping steps: Control the gripping component to move to the clamping position, cause the driving component to drive the clamping part to move to the clamping position, cause the lifting component to drive the gripping component to perform lifting and lowering movements so that the chuck moves to below the ground wafer, then cause the driving component to drive the clamping part to move inward to drive the chuck to clamp the wafer, and cause the conveying device to move the wafer out of the grinding module.

7. A wafer thinning apparatus, characterized in that, include: The conveying device according to claim 5.

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