Thickness detection mechanism of wafer thinning machine

Abstract

The utility model discloses a thickness detection mechanism of a wafer thinning machine, which relates to the technical field of wafer processing, and is technically characterized in that the thickness detection mechanism is used for being installed on the wafer thinning machine and comprises a position adjusting assembly connected with the wafer thinning machine, and the other end of the position adjusting assembly is provided with two thickness detection probes. A protective cover covers the thickness detection mechanism, and an ash removal assembly is arranged on the protective cover; according to the utility model, the influence of dust on the thickness detection precision can be reduced, and the long-term detection precision is ensured.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a thickness detection mechanism for a wafer thinning machine. Background Technology

[0002] Semiconductor wafers are the basic materials for manufacturing semiconductor devices. They are usually thin wafers made of silicon or other semiconductor materials. Wafers undergo a series of processing steps, such as doping, photolithography, and etching, to form the desired semiconductor devices, such as transistors, diodes, and integrated circuits. In the semiconductor processing industry, wafers are usually thinned and polished during the wafer fabrication process. The thinning process can reduce the wafer to a certain thickness, while the polishing process can remove the damaged layer on the surface of the thinned wafer and improve the wafer yield.

[0003] A thickness detection mechanism for a wafer thinning machine, with application number CN202322641809.X, improves detection efficiency by integrating the thickness detection components. However, the thickness detection mechanism described in this prior art has limitations in dust prevention: it has an opening at the bottom, which may introduce dust during detection, affecting long-term accuracy. Summary of the Invention

[0004] To address the aforementioned technical problems, the purpose of this utility model is to provide a thickness detection mechanism for a wafer thinning machine, reducing the impact of dust on the accuracy of thickness detection and ensuring long-term detection accuracy.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A thickness detection mechanism for a wafer thinning machine is provided for installation on the wafer thinning machine. It includes a position adjustment component connected to the wafer thinning machine, and two thickness detection probes are provided at the other end of the position adjustment component. The thickness detection probe is covered with a protective cover, and a dust removal component is provided on the protective cover.

[0007] Preferably, the dust removal assembly includes an air pump disposed outside the protective cover, the air pump being connected to a high-pressure nozzle, the high-pressure nozzle extending into the protective cover and facing the inner wall of the protective cover.

[0008] Preferably, the dust removal assembly includes an annular rotating gear rotatably connected to the protective cover. The inner wall of the rotating gear is uniformly provided with a plurality of air deflectors. The outer wall of the protective cover is provided with a rotating drive component. The output shaft of the rotating drive component is fixedly provided with a drive gear, and the drive gear meshes with the rotating gear.

[0009] Preferably, the rotation drive component is a motor.

[0010] Preferably, the position adjustment component is configured as an inclined lifting hydraulic cylinder connected to the wafer thinning machine.

[0011] Preferably, the position adjustment assembly includes an electric slide that is laterally connected to the wafer thinning machine, and the movable part of the electric slide is connected to a lifting electric cylinder.

[0012] Preferably, the protective cover is provided with an LED light strip, which is designed to be a ring-shaped structure that fits into the inner wall of the protective cover.

[0013] This utility model has the following beneficial effects:

[0014] Precise thickness measurement: By setting up two thickness measurement probes, precise measurement of wafer thickness can be achieved. This design ensures the accuracy and reliability of the measurement data, which helps in precise control during the wafer thinning process.

[0015] Protective shield: The protective shield effectively protects the thickness detection probe from external environmental interference and damage, such as dust and debris. This helps extend the probe's lifespan and reduce detection errors caused by external factors.

[0016] High-efficiency dust removal mechanism: The design of the dust removal components ensures that the inner wall of the protective cover remains clean, reducing the impact of dust and thus maintaining the long-term stability of the thickness detection probe's accuracy. The combination of an air pump and high-pressure nozzles can periodically or as needed remove dust and debris from the inner wall of the protective cover, ensuring a clean and unobstructed working environment for the detection probe. Additionally, another dust removal component can be included: a rotating gear and deflector design enhances the dust removal effect, using the airflow generated by the rotation to carry dust and debris out of the protective cover.

[0017] Optimized lighting: The LED strip inside the protective housing provides excellent illumination, enabling the inspection probes to clearly identify the wafer surface during operation. The ring-shaped design of the LED strip ensures uniform illumination, further improving inspection accuracy. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a front view of the first embodiment of the present invention.

[0020] Figure 2 This is a cross-sectional view of the protective cover according to the first embodiment of the present invention.

[0021] Figure 3 This is a partial cross-sectional view of the second embodiment of the present invention.

[0022] Figure 4 This is a cross-sectional view of the protective cover according to the second embodiment of the present utility model.

[0023] In the diagram: 1. Wafer thinning machine; 2. Thickness detection probe; 3. Protective cover; 401. Air pump; 402. High-pressure nozzle; 403. Rotating gear; 404. Air deflector; 405. Rotating drive component; 406. Drive gear; 501. Lifting hydraulic cylinder; 502. Electric slide table; 503. Lifting electric cylinder; 6. LED strip. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0025] First embodiment

[0026] A thickness detection mechanism for a wafer thinning machine, such as Figure 1 As shown, it is used for installation on a wafer thinning machine 1, including a position adjustment component connected to the wafer thinning machine 1, and two thickness detection probes 2 are provided at the other end of the position adjustment component. The thickness detection probe is covered with a protective cover 3, and a dust removal component is provided on the protective cover 3.

[0027] like Figure 1 As shown, the protective cover 3 directly covers the outside of the thickness detection probe 2, forming a physical barrier that effectively prevents external dust from directly contacting the probe. This reduces the possibility of dust accumulation on the probe surface, thus avoiding interference with the probe's measurement accuracy. The dust removal component on the protective cover 3 can periodically or as needed remove dust from the inside of the protective cover 3 and the probe surface. This active cleaning mechanism further ensures that the probe surface remains clean at all times, reducing the impact of dust adhesion on the measurement results.

[0028] The presence of the protective cover 3 and the dust removal assembly reduces the need for frequent maintenance and probe performance degradation caused by dust accumulation. This extends the probe's lifespan while lowering maintenance costs. Long-term dust accumulation can lead to a gradual increase in probe measurement errors, but this technical solution maintains the stability of probe measurement performance by effectively preventing dust accumulation. This helps ensure the accuracy and consistency of thickness detection during wafer thinning. In the actual operating environment of the wafer thinning machine 1, dust and debris are unavoidable. This technical solution, by providing an effective dust prevention and cleaning mechanism, enables the thickness detection mechanism to operate stably in this harsh environment for extended periods, thereby guaranteeing long-term detection accuracy.

[0029] like Figures 1 to 2 As shown, the dust removal assembly mainly consists of a ring-shaped rotating gear 403, air deflectors 404, a rotating drive component 405 (motor), and a drive gear 406. Multiple air deflectors 404 are evenly arranged in a ring on the inner wall of the rotating gear 403. These air deflectors 404 generate airflow when rotating, which is used to blow away dust from the inside of the protective cover 3 and the surface of the thickness detection probe 2.

[0030] like Figures 1 to 2 As shown, a drive gear 406 is fixedly mounted on the output shaft of the rotation drive 405 (motor), which meshes with the rotation gear 403. When the motor starts, its output shaft drives the drive gear 406 to rotate, which in turn drives the rotation gear 403 and the air deflector 404 to rotate synchronously. During the rotation of the air deflector 404, due to its shape and arrangement, one or more airflows are generated. These airflows flow along the inside of the protective cover 3, blowing away dust adhering to the probe surface and the inner wall of the protective cover 3. By starting the motor periodically or as needed, the cleanliness of the inside of the protective cover 3 and the probe surface can be ensured, thereby improving the accuracy of thickness detection.

[0031] like Figure 1 As shown, the position adjustment assembly mainly consists of components such as an electric slide 502 and a lifting cylinder 503. The electric slide 502 is horizontally connected to the wafer thinner 1 and is used to adjust the position of the thickness detection probe 2 in the horizontal direction. The lifting cylinder 503 is connected to the movable part of the electric slide 502 and is used to adjust the position of the probe in the vertical direction. By controlling the movement of the electric slide 502, the horizontal position of the probe on the wafer thinner 1 can be precisely adjusted to meet the inspection requirements of wafers of different sizes or positions. At the same time, by controlling the extension and retraction of the lifting cylinder 503, the vertical distance between the probe and the wafer can be adjusted to ensure that the probe can accurately contact the wafer surface for thickness detection.

[0032] like Figures 1 to 2As shown, an LED light strip 6 is installed inside the protective cover 3, and the light strip 6 is designed as a ring that fits into the inner wall of the protective cover 3. The LED light strip 6 provides sufficient light to illuminate the inside of the protective cover 3 and the working area of ​​the probe. This helps the operator to clearly observe the working status of the probe and the condition of the wafer surface during the inspection process. At the same time, good lighting conditions also help to improve the accuracy and reliability of thickness inspection.

[0033] Second embodiment

[0034] like Figures 3 to 4 As shown, the position adjustment component is configured as an inclined lifting hydraulic cylinder 501 connected to the wafer thinner 1. By controlling the extension and retraction of the lifting hydraulic cylinder 501, the position of the thickness detection probe 2 in the vertical direction (and possibly inclined direction) can be adjusted. This inclined adjustment method may help to better adapt to the working space of the wafer thinner 1, especially when the wafer size, shape, or position changes, allowing for more flexible adjustment of the probe position to ensure accurate thickness detection.

[0035] like Figures 3 to 4 As shown, the dust removal assembly includes an air pump 401 located outside the protective cover 3. The air pump 401 is connected to a high-pressure nozzle 402, which extends into the protective cover 3 and faces the inner wall of the protective cover 3. The air pump 401 generates a high-pressure airflow, which is sprayed into the interior of the protective cover 3 through the high-pressure nozzle 402. The sprayed high-pressure airflow generates a strong impact force, blowing away dust and debris adhering to the inner wall of the protective cover 3, the probe surface, and the wafer surface. By periodically or as needed activating the air pump 401, the cleanliness of the interior of the protective cover 3 and the probe surface can be ensured, thereby improving the accuracy of thickness detection.

[0036] The above are merely specific embodiments of this utility model, but the technical features of this utility model are not limited thereto. Any simple changes, equivalent substitutions, or modifications made based on this utility model to solve essentially the same technical problems and achieve essentially the same technical effects are all covered within the protection scope of this utility model.

Claims

1. A thickness detection mechanism of a wafer thinning machine, for installation on a wafer thinning machine (1), characterized in that: Including the position adjusting assembly connected with wafer thinning machine (1), the other end of position adjusting assembly is provided with two thickness detection probe (2), the thickness detection probe is provided with protective cover (3) outside, the protective cover (3) is provided with dust removal assembly.

2. The thickness detection mechanism of a wafer thinning machine according to claim 1, wherein: The dust removal assembly includes a gas pump (401) disposed outside the protective cover (3), the gas pump (401) is connected with a high-pressure nozzle (402), the high-pressure nozzle (402) extends into the protective cover (3) and faces the inner wall of the protective cover (3).

3. The thickness detection mechanism of a wafer thinning machine according to claim 1, wherein: The dust removal assembly includes a rotating gear (403) rotatably connected with the protective cover (3), a plurality of wind deflectors (404) are uniformly arranged on the inner wall of the rotating gear (403), the outer wall of the protective cover (3) is provided with a rotating drive (405), the output shaft of the rotating drive (405) is fixedly provided with a drive gear (406), and the drive gear (406) is engaged with the rotating gear (403).

4. The thickness detection mechanism of a wafer thinning machine according to claim 3, wherein: The rotating drive (405) is an electric motor.

5. The thickness detection mechanism of a wafer thinning machine according to any one of claims 2 to 4, wherein: The position adjusting assembly is a diagonal lifting hydraulic cylinder (501) connected with the wafer thinning machine (1).

6. The thickness detection mechanism of a wafer thinning machine according to any one of claims 2 to 4, wherein: The position adjusting assembly includes an electric sliding table (502) transversely connected with the wafer thinning machine (1), and the movable part of the electric sliding table (502) is connected with a lifting electric cylinder (503).

7. The thickness detection mechanism of a wafer thinning machine according to claim 1, wherein: The protective cover (3) is provided with an LED light strip (6), and the light strip (6) is arranged in the form of a ring on the inner wall of the protective cover (3).

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