Ceramic substrate and copper clad laminate prepared therefrom

Abstract

The application relates to a ceramic substrate and a copper-clad plate prepared from the same, which comprises an insulating substrate sintered from aluminum nitride, the insulating substrate comprising a middle substrate and two end substrates, the two end substrates being sintered and fixed with two bottom surfaces of the middle substrate respectively, and each of the end substrates being provided with a substrate connecting component, the substrate connecting component comprising a base, the base being movably connected with the end substrate and being capable of rotating around the circumferential direction of the end substrate, and the base being connected with a locking member, the locking member being capable of contacting the surface edge of the end substrate and being capable of moving along the surface edge of the end substrate in the circumferential direction with the base; the application has the beneficial effects that the copper sheet can be stably connected with the ceramic substrate through the substrate connecting component, the copper sheet can be separated from the ceramic substrate through the substrate connecting component, the copper sheet can be directly replaced when the copper sheet is damaged, the ceramic substrate can be repeatedly used, the cost and waste are reduced, and the operation is simple.

Description

Technical Field

[0001] This invention belongs to the field of ceramic substrate preparation technology, specifically relating to a ceramic substrate and the copper-clad laminate prepared therefrom. Background Technology

[0002] Ceramic-based copper clad laminates are widely used in high-power semiconductor modules, automotive electronics, sensors, and high-power LED lighting because they possess both the excellent thermal conductivity of ceramic substrates and the good electrical conductivity and airtightness of copper layers. Existing technology discloses a ceramic copper clad laminate and its preparation method: CN117362066A. This method involves preparing a ceramic copper clad laminate using Ti-containing solder and Cu-P-Sn solder. High-temperature sintering allows Ti elements to react with elements such as N in the ceramic to form a Ti-ceramic reaction layer, which wets the ceramic and facilitates better bonding of the Cu-P-Sn solder to the ceramic substrate through the Ti-ceramic reaction layer.

[0003] However, in the final product of this technology, the Cu-P-Sn solder on the surface of the ceramic copper-clad substrate is difficult to peel off from the ceramic surface. The ceramic itself has high strength, and in the working environment, the Cu-P-Sn solder on the surface will gradually wear down, resulting in a decrease in conductivity. However, the ceramic itself does not experience significant wear. When the Cu-P-Sn solder can no longer meet the usage requirements, the ceramic will also be scrapped and unusable because it cannot be separated from the Cu-P-Sn solder, resulting in a waste of ceramic materials and increased costs. Summary of the Invention

[0004] The purpose of this invention is to provide a ceramic substrate that can stably bond copper sheets to the ceramic surface and allow the copper sheets to be separated from the ceramic, and the copper-clad laminate prepared therefrom.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows: a ceramic substrate comprising an insulating substrate sintered from aluminum nitride, the key structural features of which are: the insulating substrate comprises an intermediate substrate and two end substrates, the two end substrates being sintered and fixed to the two bottom surfaces of the intermediate substrate respectively; each end substrate is provided with a substrate connecting component, the substrate connecting component comprising a base, the base being movably connected to the end substrate and capable of rotating around the circumference of the end substrate; a locking component is connected to the base, the locking component being able to contact the surface edge of the end substrate and being able to move circumferentially along the surface edge of the end substrate with the base.

[0006] Furthermore, the intermediate substrate and the two end substrates are all disk-shaped, and the centers of the intermediate substrate and the two end substrates are all located on the same straight line. The diameter of the intermediate substrate is smaller than the diameter of the two end substrates.

[0007] Furthermore, the terminal substrate is provided with a mounting groove, which includes an outer rotating groove and an inner elongation groove. The outer rotating groove and the inner elongation groove are interconnected. The base is connected in the outer rotating groove, and the locking member is movably connected to the base.

[0008] Furthermore, there are four bases, which are fixedly connected to each other by connecting rings. The four bases are simultaneously arrayed in the outer rotating slot and engage with the outer rotating slot.

[0009] Furthermore, the locking component includes a movable screw, the lower end of which is located in the inner groove, and the upper end which passes through the base and is connected to an anti-detachment disc, which is located outside the outer groove.

[0010] Furthermore, the movable screw is threadedly connected to the base, and an outer cylinder assembly is fitted on the movable screw. The outer cylinder assembly is located between the anti-detachment disc and the base. The outer cylinder assembly includes an inner fixed cylinder and an outer sliding cylinder, and the inner fixed cylinder is fixedly connected to the movable screw.

[0011] Furthermore, the outer sliding cylinder is movably sleeved on the outer circumference of the inner fixed cylinder and can rotate around the inner fixed cylinder. A sleeve rod is fixedly connected to the outer sliding cylinder, and the free end of the sleeve rod is connected to a limit plate.

[0012] Furthermore, a return spring and a contact rod are fitted onto the sleeve rod. The two ends of the return spring are fixed to the sleeve rod and the contact rod, respectively. The contact rod is located between the limiting plate and the return spring, and the contact rod can slide along the length of the sleeve rod.

[0013] Furthermore, a copper sheet can be attached to the surface of the end substrate, and the free end of the contact rod can abut against the edge of the copper sheet, so that the copper sheet and the end substrate form a stable connection.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: by setting the substrate connecting component, other adhesive materials can be attached to the surface of the end substrate, giving the insulating substrate other properties and application environments; by fitting the base in the outer rotating groove and rotating it within the outer rotating groove, the locking component on the base is driven to move circumferentially along the edge of the end substrate, thereby locking and connecting the adhesive material on the end substrate; at the same time, by using the movable screw in conjunction with the outer cylinder assembly, the distance between the locking component and the end substrate can be adjusted, and the position of the contact rod in conjunction with the return spring can be adjusted. When the contact rod is on the surface of the copper sheet, the connection between the copper sheet and the end substrate can be enhanced; when the contact rod is between the copper sheet and the end substrate, the separation of the copper sheet and the end substrate can be accelerated.

[0015] This invention enables a stable connection between a copper sheet and a ceramic substrate through a substrate connecting component, and also allows the copper sheet to be separated from the ceramic substrate. When the copper sheet is damaged, it can be directly replaced, and the ceramic substrate can be reused, reducing costs and waste, and the operation is simple. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall main view structure of the present invention;

[0017] Figure 2 This is a schematic diagram of the left-side structure of the end substrate of the present invention;

[0018] Figure 3 This is a schematic diagram of the connection structure between the base and the movable screw of the present invention;

[0019] Figure 4 This is a schematic diagram of the main structure of the substrate connection component of the present invention;

[0020] Figure 5 This is a top view of the cross-sectional structure of the outer cylinder assembly of the present invention;

[0021] Figure 6 This is a schematic diagram of the structure of the copper sheet being locked by the locking component and connected to the end substrate of the present invention;

[0022] Figure 7 This is a schematic diagram of the locking structure of the present invention when the copper sheet is separated from the terminal substrate;

[0023] Among them, 1-insulating substrate, 2-substrate connecting component, 3-intermediate substrate, 4-end substrate, 5-outer rotating groove, 6-inner extension groove, 7-base, 8-connecting ring, 9-locking component, 10-movable screw, 11-anti-detachment disc, 12-outer cylinder assembly, 13-inner fixed cylinder, 14-outer sliding cylinder, 15-annular groove, 16-slider, 17-sleeve rod, 18-limiting disc, 19-return spring, 20-contact rod, 21-copper sheet. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only for illustration and explanation of the present invention and are not intended to limit the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can be arranged and designed in various different configurations. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention. In the embodiments, the components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the present application.

[0025] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to an electrical connection; they can refer to a hydraulic connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] See Figures 1 to 2 As shown, a ceramic substrate includes an insulating substrate 1, which is sintered from aluminum nitride as the main raw material. Therefore, the insulating substrate 1 has good thermal conductivity and electrical insulation, as well as good mechanical strength. The insulating substrate 1 is provided with a substrate connecting component 2, which can connect the front and back sides of the insulating substrate 1 to other materials, thereby enabling the insulating substrate 1 to have other properties and application environments.

[0027] The aforementioned insulating substrate 1 includes an intermediate substrate 3 and two end substrates 4. Both the intermediate substrate 3 and the end substrates 4 are disc-shaped. The two end substrates 4 are sintered and fixed to the two bottom surfaces of the intermediate substrate 3, respectively. The intermediate substrate 3 is located between the two end substrates 4, and the diameter of the intermediate substrate 3 is smaller than the diameter of the two end substrates 4. Therefore, the intermediate substrate 3 and the two end substrates 4 form an insulating substrate 1 with an "I"-shaped cross-section. Simultaneously, the centers of the intermediate substrate 3 and the two end substrates 4 are located on the same straight line. The substrate connecting component 2 is disposed on the two end substrates 4. Specifically:

[0028] See Figures 3 to 5As shown, mounting slots are formed on the sides of both end substrates 4. The mounting slots include an outer rotating slot 5 and an inner elongation slot 6. The outer rotating slot 5 and the inner elongation slot 6 are interconnected and are both closed annular rings. The inner elongation slot 6 is closer to the center of the end substrate 4 than the outer rotating slot 5. That is, the outer rotating slot 5 is located on the circumferential side of the end substrate 4, while the inner elongation slot 6 is located on the bottom surface of the outer rotating slot 5. The substrate connecting component 2 is fitted and installed within the outer rotating slot 5. The substrate connecting component 2 includes a base 7, of which four bases 7 are arranged in an array within the outer rotating slot 5 and engage with it. Simultaneously, these four bases 7 are positioned relative to each other... The four bases 7 are fixedly connected by connecting rings 8, meaning that the distance between any two adjacent bases 7 is equal. The same end of each base 7 is engaged and snapped into the outer rotating groove 5, while the other end extends out of the outer rotating groove 5. These four bases 7 can rotate along the outer rotating groove 5 and cannot be separated from the bases 7. During this process, the connecting rings 8 are also located in the outer rotating groove 5 and rotate accordingly. At this time, a locking member 9 is provided on the base 7. The locking member 9 can contact the surface of the end substrate 4. When there is an adhesive material on the surface of the end substrate 4, the locking member 9 can firmly lock the adhesive material to the end substrate 4, making it stably connected to the end substrate 4 and preventing it from falling off.

[0029] The locking component 9 includes a movable screw 10. Each base 7 is connected to a movable screw 10. The lower end of the movable screw 10 is located in the inner groove 6, and the upper end passes through the base 7 and is connected to an anti-detachment disc 11. The anti-detachment disc 11 is located outside the outer rotating groove 5, and the movable screw 10 and the base 7 are threaded together. At this time, an outer cylinder assembly 12 is sleeved on the movable screw 10. The outer cylinder assembly 12 is located between the anti-detachment disc 11 and the base 7. The outer cylinder assembly 12 includes an inner fixed cylinder 13 and an outer sliding cylinder 14. The inner fixed cylinder 13 is fixedly connected to the movable screw 10, and the outer sliding cylinder 14 is sleeved on the outer side of the inner fixed cylinder 13. An annular groove 15 is formed on the outer circumferential surface of the inner fixed cylinder 13. A slider 16 is fixedly connected to the inner wall of the outer sliding cylinder 14. The slider 16 can slide in the annular groove 15. At this time, the distance between the outer cylinder assembly 12 and the base 7 can be adjusted by turning the movable screw 10. When the movable screw 10 is turned, the inner fixed cylinder 13 will rotate with the movable screw 10 and move vertically. Due to the cooperation between the slider 16 and the annular groove 15, the outer sliding cylinder 14 will not rotate, but will only move vertically with the inner fixed cylinder 13, so as to realize the adjustment of the distance between the outer cylinder assembly 12 and the base 7.

[0030] At this time, a sleeve rod 17 is fixedly connected to the outer circumference of the outer slide cylinder 14. The sleeve rod 17 is perpendicular to the movable screw 10. The free end of the sleeve rod 17 is connected to a limiting plate 18. A return spring 19 and a contact rod 20 are sleeved on the sleeve rod 17. When the return spring 19 is stretched, it can generate a restoring force. One end of the return spring 19 is fixed to the sleeve rod 17, and the other end is fixed to the contact rod 20. The contact rod 20 is located between the limiting plate 18 and the return spring 19, and the contact rod 20 can slide along the length direction of the sleeve rod 17, stretching the return spring 19, so that the return spring 19 generates a restoring force under the action of the stretching force. The contact rod 20 is arranged parallel to the movable screw 10, and the contact rod 20 is in contact with the screw. The free end of the rod 20 can make contact with the surface edge of the end substrate 4. When it is necessary to attach the adhesive material to the surface of the end substrate 4, the free end of the contact rod 20 makes contact with the surface edge of the adhesive material. That is, the contact rod 20 will lock the position of the adhesive material, making it impossible for the adhesive material to separate from the end substrate 4. At the same time, the contact rod 20 also facilitates the removal of the adhesive material. At this time, a conical angle is set at the free end of the contact rod 20. When the lifespan of the adhesive material is greatly worn, by adjusting the position of the contact rod 20, the conical angle of the free end of the contact rod 20 is gradually inserted between the adhesive material and the end substrate 4, which facilitates the removal of the adhesive material.

[0031] In the initial state, there is a distance between the outer cylinder assembly 12 and the base 7, and the contact rod 20 is located above the end plate 4 but not in contact with it. At this time, the return spring 19 is in a relaxed state. When it is necessary to lock the adhesive material on the end plate 4, first turn the movable screw 10, causing the movable screw 10 to move the outer cylinder assembly 12 closer to the base 7. Then the contact rod 20 will move closer to the end plate 4 until it contacts the end plate 4. At this time, move the contact rod 20 closer to the limiting plate 18, and the return spring 19 will be stretched and generate a restoring force until the contact rod 20 returns to its original position. When the end of the contact rod is in contact with the surface of the material being attached, the restoring force generated by the stretched return spring 19 acts on the contact rod 20. Since the contact rod 20 is in contact with the material being attached, the restoring force of the return spring 19 also acts on the material being attached, making the material being attached to the end substrate 4 more tightly. At this time, a pushing force can be applied to any base 7, causing the base 7 to rotate along the outer rotating groove 5. The contact rod 20 will then perform a circular motion, and the free end of the contact rod 20 will move in a circular motion against the edge of the material being attached. This can further improve the connection effect between the material being attached and the end substrate 4, so that the material being attached is stably connected to the end substrate 4.

[0032] See Figures 6 to 7As shown, based on the above ceramic substrate structure, a double-sided copper-clad laminate can be fabricated, i.e., copper sheets 21 are respectively attached to the surfaces of the two end substrates 4, and the copper sheets 21 are stably connected to the end substrates 4 through the substrate connecting component 2. Existing copper-clad laminates all use magnetron sputtering or high-temperature sintering to bond the copper layer to the surface of the ceramic substrate, which is a complex process with high cost. Moreover, after damage, the copper layer cannot be peeled off from the ceramic substrate, rendering the ceramic substrate unusable. After the copper sheets 21 are connected to the surface of the end substrates 4 through the substrate connecting component 2, after long-term use in the working environment, the copper sheets 21 will produce Significant losses and reduced conductivity, coupled with prolonged contact with air, can cause partial adhesion between the copper sheet 21 and the end substrate 4. In this case, the position of the contact rod 20 can be adjusted, moving it away from the limiting disk 18, and gradually inserting the conical angle of the free end of the contact rod 20 between the copper sheet 21 and the end substrate 4. At this time, a pushing force is applied to any base 7, causing it to rotate along the outer rotating groove 5. The conical angle of the free end of the contact rod 20 also makes a circular motion between the copper sheet 21 and the end substrate 4, thereby accelerating the separation of the copper sheet 21 from the end substrate 4 and thus achieving the disassembly of the copper sheet 21.

[0033] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be primarily defined by the scope of the claims.

Claims

1. A copper-clad laminate prepared using a ceramic substrate, comprising an insulating substrate sintered from aluminum nitride, characterized in that: The insulating substrate includes an intermediate substrate and two end substrates. The two end substrates are sintered and fixed to the two bottom surfaces of the intermediate substrate respectively. Each end substrate is provided with a substrate connecting component. The substrate connecting component includes a base. The base is movably connected to the end substrate and can rotate around the circumference of the end substrate. A locking component is connected to the base. The locking component can contact the surface edge of the end substrate and can move circumferentially along the surface edge of the end substrate with the base. The terminal substrate is provided with a mounting groove, which includes an outer rotating groove and an inner elongation groove. The outer rotating groove and the inner elongation groove are interconnected. The base is connected in the outer rotating groove, and the locking member is movably connected to the base. The locking component includes a movable screw, the lower end of which is located in the inner groove, and the upper end of which passes through the base and is connected to an anti-detachment disc, which is located on the outside of the outer groove. The movable screw is threadedly connected to the base. An outer cylinder assembly is sleeved on the movable screw. The outer cylinder assembly is located between the anti-detachment disc and the base. The outer cylinder assembly includes an inner fixed cylinder and an outer sliding cylinder. The inner fixed cylinder is fixedly connected to the movable screw. The outer sliding cylinder is movably sleeved on the outer circumferential surface of the inner fixed cylinder and can rotate around the inner fixed cylinder. A sleeve rod is fixedly connected to the outer sliding cylinder, and the free end of the sleeve rod is connected to a limit plate. The sleeve rod is fitted with a return spring and a contact rod. The two ends of the return spring are fixed to the sleeve rod and the contact rod respectively. The contact rod is located between the limiting plate and the return spring. The contact rod can slide along the length of the sleeve rod. The free end of the contact rod is provided with a conical angle. A copper sheet is attached to the surface of the end substrate, and the free end of the contact rod abuts against the edge of the copper sheet, so that the copper sheet and the end substrate form a stable connection.

2. The copper-clad laminate prepared using a ceramic substrate according to claim 1, characterized in that: The intermediate substrate and the two end substrates are all disk-shaped, and the centers of the intermediate substrate and the two end substrates are all located on the same straight line. The diameter of the intermediate substrate is smaller than the diameter of the two end substrates.

3. The copper-clad laminate prepared using a ceramic substrate according to claim 1, characterized in that: The base is provided in four parts, which are fixedly connected to each other by connecting rings. The four bases are simultaneously arrayed in the outer rotating groove and are engaged with the outer rotating groove.

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