A pump-assisted loop heat pipe

By introducing micro -voltage pumps and Tesla valve condenser in the circuit thermal pipe, the problem of starting difficulties and unstable operation of traditional ring circuit thermal pipes at high thermal flow density and high thermal source power has achieved higher heat transfer Performance and stability.

CN118532978BActive Publication Date: 2025-01-24CHANGSHA BOFUNCTION TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202410616945.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-05-17
Publication Date
2025-01-24
Estimated Expiration
2044-05-17

AI Technical Summary

Technical Problem

The difficulty in starting and operational instability of traditional loop heat pipes under high heat flow density and high heat source power.

Method used

A pump-assisted loop heat pipe is used to provide circulation driving force by assembling a micro piezoelectric pump in the liquid reservoir and combining it with the capillary wick in the flat-plate microchannel evaporator. At the same time, the Tesla valve condenser is designed with multiple equally spaced Tesla valve flow channels to optimize the flow and condensation effect of the working fluid.

Benefits of technology

It improves the stability of the evaporator temperature, enhances the extreme heat transfer limit, and improves the operating stability and heat transfer performance of the circular heat pipe.

✦ Generated by Eureka AI based on patent content.

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    Figure CN118532978B_ABST
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Abstract

The present application relates to a pump-assisted loop heat pipe, which is applied to the field of thermal management technology. The pump-assisted loop heat pipe includes: a flat microchannel evaporator, a Tesla valve condenser, a liquid reservoir, a gas phase pipeline and a liquid phase pipeline; the flat microchannel evaporator, the Tesla valve condenser, the gas phase pipeline, the liquid phase pipeline and the liquid reservoir are all provided with pagoda-type joints, and the flat microchannel evaporator, the Tesla valve condenser, the gas phase pipeline, the liquid phase pipeline and the liquid reservoir are connected by pagoda-type joints to form a loop heat pipe; the flat microchannel evaporator is equipped with a capillary core, and the bottom surface of the capillary core is a flat plate; the Tesla valve condenser is designed with a plurality of equidistantly arranged Tesla valve flow channels, and the Tesla valve flow channels are used to condense the working fluid passing through the Tesla valve flow channels themselves; the liquid reservoir is equipped with a micro piezoelectric pump, and the micro piezoelectric pump and the liquid reservoir are connected by a pagoda-type interface. The present application can improve the heat exchange performance.
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Citation Information

Patent Citations

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  • Micro-pump auxiliary loop heat pipe for multi-heat-source heat dissipation

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  • Cooperatively-driven high-heat-flux chip phase change heat dissipation device and method

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  • Unpowered phase-change heat dissipation device

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