A method, circuit and device for implementing mechanical life test function

Abstract

The application relates to the field of relay testing, in particular to a method, circuit and device for realizing a mechanical life test function, which comprises the following steps: obtaining test data, wherein the test data comprises a conduction voltage current value, a on-off time value and a set load value; determining a current voltage for electrifying a high-voltage direct-current relay through the conduction voltage current value, determining a simulated load and electrically connecting the simulated load on the high-voltage direct-current relay through the set load value; determining a frequency for electrifying and deenergizing the high-voltage direct-current relay through the on-off time value; collecting a detection value; and determining result data through the detection value and the on-off time value, wherein the result data indicates whether the high-voltage direct-current relay works normally. The application has the effect that the detection result is closer to the result in actual application requirements.

Description

Technical Field

[0001] The present application relates to the field of relay testing, and in particular to a method, circuit, and device for implementing a mechanical life test function. Background Art

[0002] With the development of the new energy industry, high-voltage DC relays are being used more and more widely, placing higher demands on their performance. Therefore, the mechanical life performance of high-voltage DC relays needs to be verified before leaving the factory. However, existing testing equipment usually collects the on and off status of high-voltage DC relays in the no-load state, resulting in test results that are different from the status during actual use. It is very easy for the test results to deviate from the actual application requirements. Summary of the Invention

[0003] In order to improve the problem that the detection result judgment is easily out of line with the actual application requirements, the present application provides a method, circuit and device for realizing the mechanical life test function.

[0004] This application provides a method for implementing a mechanical life test function, which adopts the following technical solutions:

[0005] A method for implementing a mechanical life test function, comprising:

[0006] Acquire test data, the test data including on-state voltage and current values, on-off time values, and set load values;

[0007] Determine the current and voltage of the high-voltage DC relay by the conduction voltage and current value, determine the simulated load by the set load value and electrically connect it to the high-voltage DC relay;

[0008] The frequency of energizing and deenergizing the high-voltage DC relay is determined by the on-off time value, a detection value is collected, and result data is determined by the detection value and the on-off time value, and the result data indicates whether the high-voltage DC relay is working normally.

[0009] By adopting the above technical solution and increasing the simulated load, the product can be closer to the actual application environment in the life test environment, making the test more realistic and improving the feasibility; setting the simulated load by setting the load value is more convenient and quick, reducing the need to adjust or even replace the simulated load when testing different products, thereby improving test efficiency.

[0010] Optionally, determining a simulated load by setting the load value and electrically connecting the simulated load to a high-voltage DC relay includes:

[0011] The test data also includes a selection mode, and the detection value includes a collected current value and a collected voltage value;

[0012] Determine to obtain the collected current value or the collected voltage value through the selection mode, and obtain the set value;

[0013] The current, voltage or internal resistance of the high-voltage DC relay that needs to be adjusted is determined according to the selection mode, the set value and the detection value.

[0014] By adopting the above technical solution, users can select the corresponding mode according to the device or product being tested, which further makes the simulated load more realistic and the test results more reliable.

[0015] Optional, including:

[0016] The selection mode includes at least constant current mode, constant voltage mode, constant resistance mode, and constant power mode;

[0017] If the constant current mode is obtained, the collected current value is obtained, and the collected current value is compared with the set value to determine whether the collected current value is less than the set value, and the current of the high-voltage DC relay is increased; if the collected current value is greater than the set value, the current of the high-voltage DC relay is reduced;

[0018] If the constant voltage mode is obtained, the collected voltage value is obtained, and the collected voltage value is compared with the set value to determine whether the collected voltage value is less than the set value, and the voltage of the high-voltage DC relay is increased; if the collected voltage value is greater than the set value, the voltage of the high-voltage DC relay is reduced;

[0019] If the constant resistance mode is obtained, the collected current value and the collected voltage value are obtained, a simulated internal resistance value is determined based on the collected current value and the collected voltage value, and a judgment is made by comparing the simulated internal resistance value with the set value. If the simulated internal resistance value is less than the set value, the voltage of the high-voltage DC relay is increased or the current of the high-voltage DC relay is decreased; if the simulated internal resistance value is greater than the set value, the voltage of the high-voltage DC relay is decreased or the current of the high-voltage DC relay is increased;

[0020] If the constant power mode is obtained, the collected current value and the collected voltage value are obtained, the power value is determined by the collected current value and the collected voltage value, and the power value is compared with the set value for judgment. If the power value is less than the set value, the current of the high-voltage DC relay is increased; if the power value is greater than the set value, the current of the high-voltage DC relay is reduced.

[0021] By adopting the above technical solution, the simulated load can be made more realistic according to the environment to be simulated. For example, when simulating that the device under test is electrically connected to the circuit of a factory fan, the constant power mode can be selected. When simulating that the device under test is electrically connected to the circuit of a battery charger, the constant current mode can be selected. This allows users to simulate different conditions, further improving the simulation realism and improving inspection efficiency.

[0022] Optional, including:

[0023] Scan and read the identification code on the high-voltage DC relay to obtain the test piece information;

[0024] Scan and read the identification code on the workstation where the high-voltage DC relay is placed to obtain the workstation information;

[0025] Corresponding the test signal to the workstation information and storing them in a database;

[0026] The test data obtained during the life test of the high-voltage DC relay corresponds to the test piece information and is stored in a database.

[0027] By adopting the above technical solution, the equipment under test is matched with the workstation, and then the test data is stored in the corresponding location of the database, which greatly facilitates traceability. If there is no problem on the spot, when the problem is discovered later, the corresponding data can be directly retrieved from the database to find out which equipment under test at which workstation has the problem.

[0028] This application provides a device for realizing mechanical life test function, which adopts the following technical solution:

[0029] A device for implementing a mechanical life test function includes a base, wherein the base is provided with multiple workstations, and multiple test heads are also slidably provided on the base, wherein the test heads are used to electrically connect to contacts of high-voltage DC relays on corresponding workstations. The base is also provided with a display screen for displaying the test data and the result data. The test heads are used to perform on-off life tests on high-voltage DC relays, and a load is electrically connected to the high-voltage DC relay through the test heads to obtain the result data and output it to the display screen for display. The test heads are also controlled by the display screen.

[0030] By adopting the above technical solution, the device under test is placed on the workstation, and then the conduction and disconnection are achieved by raising and lowering the test head, which facilitates the testing of the device under test, and also facilitates the display of test data and the control of the test head.

[0031] Optionally, the plurality of test heads are divided into at least two groups, and the test heads in different groups independently perform on-off life tests on the high-voltage DC relay.

[0032] By adopting the above technical solution, multiple groups of test heads work alternately, so that users can install the next batch of devices under test after the previous batch starts testing, and then start testing, and then unload the previous batch of devices under test and install the new devices under test, which greatly improves test efficiency and reduces idle time between tests.

[0033] This application provides a circuit for realizing a mechanical life test function, which adopts the following technical solutions:

[0034] A circuit for implementing a mechanical life test function, comprising:

[0035] The power supply module is used to control the on-off power supply of the main contacts and auxiliary contacts of the high-voltage DC relay;

[0036] A fixing module, used for attracting and fixing the output end of the power supply module on the contact of the high-voltage DC relay;

[0037] The electronic load is electrically connected to the high-voltage DC relay and is used to simulate the load condition of the high-voltage DC relay when in use.

[0038] By adopting the above technical solution, the contacts of the device under test are fixedly attracted to conduct and released to disconnect through the fixed module, thereby improving the stability of the contact connection; the electronic load is used to simulate the load, thereby improving the inspection efficiency, improving the product reliability, and ensuring the product pass rate.

[0039] Optionally, the electronic load includes:

[0040] A load simulation module, electrically connected to the high-voltage DC relay to provide a simulated load, so as to simulate the load electrically connected to the high-voltage DC relay in the use environment;

[0041] an analog control module, receiving the set value input by the user, calculating a PWM wave value based on the set value and outputting the PWM wave value to the load simulation module, thereby controlling the load simulated by the load simulation module;

[0042] The analog acquisition module collects the working status of the load simulation module, obtains the collected current value and the collected voltage value, and outputs them to the analog control module, and the analog control module performs corresponding calculations on the collected current value and the collected voltage value.

[0043] By adopting the above technical solution, the current and voltage are collected by the analog acquisition module, and then the load simulation module is controlled by the analog control module after calculation and processing, so that the corresponding load is simulated by the load simulation module, the operability is improved, and the purpose of accurately detecting the load voltage and precisely adjusting the load current is achieved.

[0044] Optionally, the load simulation module includes a receiving end, a comparator U1, and a field effect transistor P2. The receiving end receives the PWM wave value output by the analog control module, and the receiving end outputs it to the non-inverting input end of the comparator U1. The inverting input end of the comparator U1 receives the current input of the high-voltage DC relay. The output end of the comparator U1 is output to the gate of the field effect transistor P2 to control the on-off ratio of the source and drain of the field effect transistor P2, thereby achieving the purpose of regulating the current.

[0045] The analog control module includes a chip U7A, one chip U7A corresponds to multiple load simulation modules, multiple pins of the chip U7A are used to output PWM wave values, and the PWM wave values ​​output by different pins of the chip U7A correspond to the receiving ends of different load simulation modules;

[0046] The analog acquisition module includes a resistor R21, a resistor R43, a resistor R42, and an operational amplifier U3. The resistor R21 and the resistor R43 are electrically connected to the voltage input of the high-voltage DC relay. The input end of the operational amplifier U3A is connected in parallel between the resistor R21 and the resistor R43. The output end of the operational amplifier U3A outputs an AD_VOLT signal to the chip U7A to obtain the collected voltage value. The resistor R42 is electrically connected to the inverting input end of the comparator U1. The non-inverting input end of the operational amplifier U3B is connected in parallel between the resistor R42 and the inverting input end of the comparator U1. The inverting input end of the comparator U1 is electrically connected to the other end of the resistor R42. The output end of the operational amplifier U3B outputs an AD_CURR signal to the chip U7A to obtain the collected current value. The chip U7A calculates and processes the collected voltage value and the collected current value.

[0047] By adopting the above technical solution, the voltage is sampled by dividing the resistors R21 and R43, and then the AD_VOLT signal is output to the chip U7A through the operational amplifier U3. The large current is sampled through the resistor R42, and then the conduction amount of the field effect tube P2 is changed after comparing it with the PWM wave value through the comparator U1, thereby adjusting the current. At the same time, the current sampled by the resistor R42 is output to the chip U7A through the operational amplifier U3B as the AD_CURR signal, realizing real-time feedback and real-time control and adjustment of the voltage and current, so as to achieve the stability of the analog load and greatly improve the stability.

[0048] Optionally, the electronic load further includes:

[0049] The startup module includes multiple startup circuits, each of which includes a control input terminal, a photocoupler P7, a power supply terminal, and an output terminal. The control input terminal is electrically connected to the input terminal of the photocoupler P7 to realize on-off control of pins 3 and 4 of the output terminal of the photocoupler P7. The power supply terminal is electrically connected to pin 3 of the output terminal of the photocoupler P7. Pin 4 of the output terminal of the photocoupler P7 serves as the output terminal of the startup module to output a QD signal to the chip U7A to control the startup of the chip U7A.

[0050] A real-time detection module includes multiple real-time detection circuits, the real-time detection circuits including a photoelectric coupler P3, an input end, a power supply end, a transistor T1, and a light-emitting diode LED3. The input end is used to receive the OUT signal output by the chip U7A. The input end is electrically connected to the input end of the photoelectric coupler P3 to realize on-off control of the output end of the photoelectric coupler P3. The output end of the photoelectric coupler P3 is electrically connected to the base of the transistor T1 to control the on-off between the collector and the emitter of the transistor T1. The light-emitting diode LED3 is electrically connected to the power supply end and the collector of the transistor T1.

[0051] The communication module is used to receive user remote control and output a communication signal to the control input end of the start module. The communication module includes a chip U13 for communication and an isolated power supply circuit for powering the chip U13.

[0052] By adopting the above technical solution, the starting module is controlled through the communication module, thereby achieving the purpose of remote control, which is more convenient and the real-time detection module can more intuitively display whether the current circuit is normally connected.

[0053] In summary, this application includes at least one of the following beneficial technical effects:

[0054] 1. Achieve the purpose of accurately detecting load voltage and precisely adjusting load current, improve inspection efficiency, improve product reliability, and ensure product pass rate.

[0055] 2. Targeted load simulation to improve the authenticity of the test.

[0056] 3. Easy to trace. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] Figure 1 It is a flow chart of a method for realizing a mechanical life test function in an embodiment of the present application.

[0058] Figure 2 2 is a flowchart highlighting step S2.

[0059] Figure 3 2 is a flowchart highlighting step S3.

[0060] Figure 4 This is a schematic diagram of the overall structure of a device for realizing a mechanical life test function in an embodiment of the present application.

[0061] Figure 5 This is a circuit diagram of a circuit for realizing a mechanical life test function in an embodiment of the present application.

[0062] Figure 6 This is a circuit diagram of the load simulation module and the analog acquisition module.

[0063] Figure 7 It is a circuit diagram of the analog control module, the starting module, the real-time detection module, and the communication module.

[0064] Figure 8 This is a schematic diagram highlighting the amplifier circuit of the analog control module.

[0065] Figure 9 This is a schematic diagram of the amplification circuit that highlights the startup module.

[0066] Figure 10 It is a schematic diagram highlighting the amplifier circuit of the communication module.

[0067] Figure 11 It is a schematic diagram of the amplification circuit highlighting the real-time detection module.

[0068] Figure 12 yes Figure 7 Schematic diagram of the amplifier circuit at point A.

[0069] Explanation of the accompanying symbols: 1. Base; 11. Work station; 12. Test head; 13. Display screen; 2. Power supply module; 21. Fixing module; 22. Electronic load; 3. Load simulation module; 31. Analog control module; 32. Analog acquisition module; 33. Startup module; 34. Real-time detection module; 35. Communication module. DETAILED DESCRIPTION

[0070] The following is combined with Figure 1-12 This application is described in further detail.

[0071] The embodiment of the present application discloses a method for realizing a mechanical life test function. Figure 1 , the method for realizing the mechanical life test function comprises the following steps:

[0072] S1. Obtain test data, including on-state voltage and current values, on-off time values, and set load values;

[0073] S11, determining the current and voltage of the high-voltage DC relay according to the conduction voltage and current values, determining the simulated load according to the load value and electrically connecting it to the high-voltage DC relay;

[0074] S12. Determine the frequency of energizing and deenergizing the high-voltage DC relay by the on-off time value, collect the detection value, and determine result data by the detection value and the on-off time value. The result data indicates whether the high-voltage DC relay is working normally.

[0075] In detail: the test data is parameter data that the user needs to set before the test. For example, the on-state voltage and current values ​​are the preset test current or test voltage values ​​applied to the test equipment. In the embodiment of the present application, the test equipment is a high-voltage DC relay, that is, the on-state voltage and current values ​​are voltages or currents sufficient to trigger the overvoltage protection, overcurrent protection, or overload protection of the high-voltage DC relay. The on-off time value is the on-time and off-time of the voltage and current corresponding to the on-state voltage and current values. For example, the on-off time value can be set to 0.2s, 0.3s, and 50 times, that is, the on-state is 0.2s and the off-state is 0.3s, and the on-state and off-state are cycled once, and this cycle is repeated 50 times.

[0076] The load value is set to simulate the load condition of the load electrically connected to the high-voltage DC relay. The set load value can be a current value, a voltage value, a resistance value, or a power value, so as to simulate the load condition of the high-voltage DC relay in a constant current working environment, a constant voltage working environment, a constant resistance working environment, or a constant power working environment. At the same time, the detection value is collected in real time during the power-on and power-off test. For example, the collected detection value can be 0.1s, 0.4s, and 49 times, that is, the circuit is turned on for 0.1s and then turned off for 0.4s, and this is the 49th time. The on-time is less than the on-off time value, which means that the high-voltage DC relay is normally disconnected after being triggered, indicating that this time the circuit is normally triggered and disconnected, and is output to the user as the result data.

[0077] Reference Figure 2 The process of determining the simulated load by setting the load value and electrically connecting the load to the high voltage DC relay further includes the following steps:

[0078] S2. The test data also includes a selection mode, which includes at least a constant current mode, a constant voltage mode, a constant resistance mode, and a constant power mode. The detection value includes a collected current value and a collected voltage value.

[0079] S21. Determine the acquisition of a collected current value or a collected voltage value by selecting a mode, and obtain a set value, and determine the current, voltage, or internal resistance of the high-voltage DC relay that needs to be adjusted according to the selected mode, the set value, and the detected value.

[0080] Detailed: Before the test begins, the user can select a mode based on the load condition they want to simulate. For example, if they want to simulate a constant power condition (where the HVDC relay is connected to a constant power device, such as a factory fan that plugs in and works directly without gear adjustment), they can select the constant power mode to keep the power of the simulated load connected to the HVDC relay constant.

[0081] Reference Figure 2 , step S21 includes the following steps:

[0082] S22. If the constant current mode is obtained, the collected current value is obtained, and the collected current value is compared with the set value. If the collected current value is less than the set value, the current of the high-voltage DC relay is increased; if the collected current value is greater than the set value, the current of the high-voltage DC relay is reduced;

[0083] S23. If the constant voltage mode is obtained, the collected voltage value is obtained, and the collected voltage value is compared with the set value. If the collected voltage value is less than the set value, the voltage of the high-voltage DC relay is increased; if the collected voltage value is greater than the set value, the voltage of the high-voltage DC relay is decreased;

[0084] S24. If the constant resistance mode is obtained, the collected current value and the collected voltage value are obtained, and a simulated internal resistance value is determined based on the collected current value and the collected voltage value. The simulated internal resistance value is compared with a set value for judgment. If the simulated internal resistance value is less than the set value, the voltage of the high-voltage DC relay is increased or the current of the high-voltage DC relay is decreased. If the simulated internal resistance value is greater than the set value, the voltage of the high-voltage DC relay is decreased or the current of the high-voltage DC relay is increased.

[0085] S25. If the constant power mode is obtained, the collected current value and the collected voltage value are obtained, and the power value is determined by the collected current value and the collected voltage value. The power value is compared with the set value for judgment. If the power value is less than the set value, the current of the high-voltage DC relay is increased; if the power value is greater than the set value, the current of the high-voltage DC relay is reduced.

[0086] In detail: If the constant current mode is selected, the setting range of the set value is (0, power supply current), that is, the current regulation in the constant current mode can be adjusted within a range less than the power supply current. In this embodiment, the current size is adjusted by adjusting the duty cycle of the PWM wave, so that the maximum current can be adjusted to the same as the power supply current. Therefore, the set value must be less than the power supply current. If the set value is greater than the power supply current, an alarm will be issued. The collected current value is compared with the set value, and the current size is adjusted by adjusting the duty cycle of the PWM wave, so that the collected current value is close to the set value.

[0087] If the constant power mode is selected, the power value can be obtained by multiplying the collected current value and the collected voltage value. In this embodiment, the constant power mode is mainly based on the collected voltage value. That is, if the collected voltage value changes and causes the power value to be higher or lower than the set value, the duty cycle of the PWM wave is also adjusted, thereby adjusting the current, so that the collected current value changes accordingly, so that the power value is close to the set value.

[0088] Reference Figure 3 After step S12, the following steps are further included:

[0089] S3, scanning and reading the identification code on the high-voltage DC relay to obtain the test piece information;

[0090] S31, scanning and reading the identification code on the workstation where the high-voltage DC relay is placed to obtain workstation information;

[0091] S32, matching the test signal with the workstation information and storing it in a database;

[0092] S33. The test data obtained during the life test of the high-voltage DC relay corresponds to the test piece information and is stored in a database.

[0093] In detail: the workstation information of the identification code on the workstation is pre-scanned, identified, and stored in the database. After the high-voltage DC relay is placed on the workstation, the identification code on the high-voltage DC relay is scanned, and then the identification code on the workstation is scanned again. The purpose of scanning the identification code on the workstation this time is to correspond the test piece signal of the high-voltage DC relay identification code to the position of the workstation information in the database and store it. Then, the test data generated by the subsequent test of this high-voltage DC relay will be directly corresponded to the test piece signal and stored in the database for subsequent traceability and retrieval.

[0094] The embodiment of the present application discloses a device for realizing a mechanical life test function. Figure 4The device for realizing the mechanical life test function includes a base 1, a plurality of workstations 11 are formed on the base 1, and a plurality of test heads 12 are lifted and lowered on the base 1. The high-voltage DC relay is placed on the workstation 11, and a high-voltage DC relay is placed on each workstation 11 for on-off life test. The test head 12 corresponds to the workstation 11 one by one. The test head 12 includes a driving member and a conducting contact. The conducting contact includes a coil and an armature for energizing. When the coil is energized, a magnetic attraction is generated to attract the armature to close and conduct the main contact or auxiliary contact of the high-voltage DC relay, and the load is electrically connected to the high-voltage DC relay to simulate the load. In this embodiment, the driving member can be a cylinder, which is fixedly connected to the base 1. The telescopic rod of the driving member is fixedly connected to the conducting contact. The conducting contact moves up and down, and the conducting contact is used to be electrically connected to the main contact and auxiliary contact of the high-voltage DC relay. In this embodiment, the workstations 11 are divided into two groups, arranged in two rows on the base 1. When the workstations 11 and test head 12 in the upper row are testing a high-voltage DC relay, the high-voltage DC relay in the lower row can be removed and replaced. When the lower row of high-voltage DC relays is tested again, the high-voltage DC relay in the upper row of workstations 11 is tested and replaced with a new one. In this embodiment, the display screen 13 is a touch screen that can be touched to generate corresponding signals to control the test head 12.

[0095] Reference Figure 4 The base 1 is also provided with a display screen 13 for displaying test data and result data. The test head 12 is used to perform on-off life test on the high-voltage DC relay, obtain result data and output it to the display screen 13 for display.

[0096] The embodiment of the present application discloses a circuit for realizing a mechanical life test function. Figure 1 The circuit for implementing the mechanical life test function includes a power supply module 2, a fixed module 21, and an electronic load 22. The power supply module 2 includes a DC0-12V power supply for powering the main contacts of the high-voltage DC relay and a DC0-5V power supply for powering the auxiliary contacts of the high-voltage DC relay. The fixed module 21 includes multiple solid-state relays and a DC0-75V power supply for powering each solid-state relay. The solid-state relays are used to control the conduction and disconnection of the coil, thereby controlling the movement of the armature, thereby controlling the on-off of the main contacts or auxiliary contacts of the high-voltage DC relay. The electronic load 22 is electrically connected to the high-voltage DC relay and is used to simulate the load conditions of the high-voltage DC relay in the circuit of the working environment.

[0097] Reference Figure 5 and Figure 6 and Figure 7The electronic load 22 includes a load simulation module 3, an analog control module 31, an analog acquisition module 32, a startup module 33, a real-time detection module 34, and a communication module 35. The load simulation module 3 includes a receiving end, a comparator U1, a field effect transistor P2, diodes D1-D13, a fuse F1, a resistor R20, a resistor R25, a resistor R26, a resistor R36, a resistor R32, a resistor R5, a resistor R33, a resistor R39, a resistor R40, a resistor R42, a resistor R34, a capacitor C2, a capacitor C5, a capacitor C4, a capacitor C7, a capacitor C9, and a ground terminal GND. The receiving end receives the PWM wave value output by the analog control module 31, and the receiving end is electrically connected to the non-inverting input terminal of the comparator U1B. The resistor R25 and the resistor R26 are connected in series between the receiving end and the non-inverting input terminal of the comparator U1B. The input terminal of the comparator U1B is electrically connected to the non-inverting input terminal of the comparator U1A, the inverting input terminal of the comparator U1B is connected in parallel to the output terminal of the comparator U1B, and the resistor R36 is connected in series between the output terminal of the comparator U1B and the non-inverting input terminal of the comparator U1A. One end of the capacitor C4 and one end of the resistor R32 are connected in parallel between the resistor R36 and the inverting input terminal of the comparator U1A. The other end of capacitor C4 and the other end of resistor R32 are connected in parallel to ground, the output end of comparator U1A is electrically connected to the gate of field effect transistor P2, resistor R33 is connected in series between the output end of comparator U1A and the gate of field effect transistor P2, both ends of resistor R5 are connected in parallel to both ends of resistor R33, both ends of capacitor C7 are connected in parallel between the inverting input end and the output end of comparator U1A, resistor R39 and resistor R40 are connected in series between the inverting input end of comparator U1A and the source of field effect transistor P2, one end of capacitor C9 is connected in parallel between resistor R39 and resistor R40, the other end of capacitor C9 is grounded, and resistor R One end of resistor R42 is connected in parallel between resistor R40 and the source of field effect transistor P2, the other end of resistor R42 is electrically connected to the input terminal of the device under test, and the resistor R42 and the input terminal of the device under test are also grounded. Resistor R34 and fuse F1 are connected in series between the drain of field effect transistor P2 and the input terminal of the device under test. In this embodiment, the number of diodes is thirteen, namely diodes D1-D13. The number of diodes can be increased or decreased as needed. The two ends of diodes D1-D13 are connected in parallel between the drain of field effect transistor P2 and the input terminal of the device under test to provide a light-emitting reminder. Pin 4 of comparator U1 is electrically connected to ground terminal GND.The receiving end receives the PWM wave value, filters it, and stabilizes it before outputting it to the non-inverting input of comparator U1A. The inverting input of comparator U1A samples the current at the input of the device under test via resistor R42. This is then filtered and compared using capacitor C9 and other components, thereby controlling the high and low levels of the output of comparator U1A and, in turn, the high and low levels of the gate of field-effect transistor P2. This controls the on-off ratio between the drain and source of field-effect transistor P2, thereby regulating the current. In this embodiment, comparator U1 can be a 358 model, and field-effect transistor P2 can be an IRF540-2.5 yuan-TO220 model. By controlling the duty cycle of the PWM wave value and adjusting the conduction of field-effect transistor P2, accurate load voltage detection and precise load current regulation are achieved.

[0098] Reference Figure 6 and Figure 8 The analog control module 31 includes a chip U7A. One chip U7A corresponds to multiple load simulation modules 3. In this embodiment, pins 29, 30, 31, and 32 of the chip U7A are all used to output PWM wave values. The PWM wave values ​​output by different pins of the chip U7A correspond to the receiving ends of different load simulation modules 3. The PWM wave values ​​here can be the same or different. Pin 29 of the chip U7A outputs a PWM3 wave value, pin 30 of the chip U7A outputs a PWM1 wave value, pin 31 of the chip U7A outputs a PWM2 wave value, and pin 32 of the chip U7A outputs a PWM4 wave value. For example, refer to Figure 5 The electronic load circuits in the circuit are numbered 1-4 from top to bottom, corresponding to PMW1, PWM2, PWM3, and PWM4. One chip U7A simultaneously controls four load simulation modules 3. In this embodiment, the chip U7A may be a STM32F103C8 microcontroller.

[0099] Reference Figure 6 and Figure 8The analog acquisition module 32 includes a resistor R21, a resistor R43, a resistor R42, an operational amplifier U3, a resistor R27, a resistor R2, a resistor R4, a resistor R3, a resistor R23, a resistor R86, a resistor R19, a resistor R29, a resistor R87, a resistor R24, a resistor R1, a resistor R22, a capacitor C3, a capacitor C12 and a ground terminal GND, one end of the resistor R27 is connected in parallel between the resistor R42 and the resistor R40, the other end of the resistor R27 is connected to the non-inverting input terminal of the operational amplifier U3B, one end of the resistor R2 and one end of the capacitor C3 are connected in parallel between the resistor R27 and the non-inverting input terminal of the operational amplifier U3B, the other end of the resistor R2 and the other end of the capacitor C3 are respectively grounded, one end of the resistor R4 is connected in parallel to the input terminal of the device under test, the other end of the resistor R4 is electrically connected to the inverting input terminal of the operational amplifier U3B, and one end of the resistor R3 is connected in parallel to the operational amplifier U 3B is the reverse input terminal, the other end of the resistor R3 is electrically connected to the ground terminal GND, the two ends of the resistor R23 are connected in parallel between the reverse input terminal and the output terminal of the operational amplifier U3B, one end of the resistor R86 is electrically connected between the resistor R23 and the output terminal of the operational amplifier U3B, the other end of the resistor R86 is electrically connected to the ground terminal GND, the resistor R19 is connected in series to the output terminal of the operational amplifier U3B, and the output of the output terminal of the operational amplifier U3B passes through the resistor R19 and outputs the AD_CURR signal to the chip U7A to obtain the collected current value. In this embodiment, PWM1-4 corresponds to the four signals of AD_CURR1-4, for example, PWM1 wave value input, output AD_CURR1 signal; PWM2 wave value input, output AD_CURR2 signal; PWM3 wave value input, output AD_CURR3 signal; PWM4 wave value input, output AD_CURR4 signal.Resistor R29, resistor R44, and resistor R43 are connected in series between the voltage input terminal of the high-voltage DC relay and the non-inverting input terminal of the operational amplifier U3A. One end of the resistor R21 is electrically connected to the voltage input terminal of the high-voltage DC relay. The other end of the resistor R21 is connected in parallel between the resistor R43 and the resistor R29. One end of the capacitor C12 is electrically connected between the non-inverting input terminal of the operational amplifier U3A and the resistor R29. The other end of the capacitor C12 is grounded. The resistor R24 ​​is connected in parallel between the inverting input terminal and the output terminal of the operational amplifier U3A. The resistor R87 is connected in parallel to the inverting input terminal of the operational amplifier U3A. The other end of the resistor R87 is grounded. The resistor R1 One end of resistor R1 is connected in parallel to the output of operational amplifier U3A. The other end of resistor R1 is grounded. Resistor R22 is connected in series to the output of operational amplifier U3A. The output of operational amplifier U3A passes through resistor R22 and outputs the AD_VOLT signal to chip U7A to obtain the collected voltage value. In this embodiment, PWM1-4 correspond to the four signals AD_VOLT1-4. For example, if the PWM1 waveform value is input, the AD_VOLT1 signal is output; if the PWM2 waveform value is input, the AD_VOLT2 signal is output; if the PWM3 waveform value is input, the AD_VOLT3 signal is output; and if the PWM4 waveform value is input, the AD_VOLT4 signal is output. Chip U7A calculates and processes the AD_VOLT and AD_CURR signals to obtain the collected voltage and current values. Then, further calculations are performed on the collected voltage and current values ​​to obtain result data or other data. In this embodiment, operational amplifier U3 can be a 358 model. The current sampled by resistor R42 is fed back through the remote operational amplifier U3 and output to chip U7A to obtain the sampled current value. After the input voltage of the device under test is divided and sampled by resistors R21, R43, and R44, the sampled voltage is amplified by the operational amplifier U3 and output to chip U7A to obtain the sampled voltage value. The PA3 pin of chip U7A receives the AD_CURR1 signal, the PA6 pin of chip U7A receives the AD_CURR2 signal, the PA1 pin of chip U7A receives the AD_CURR3 signal, the PA4 pin of chip U7A receives the AD_CURR4 signal, the PA2 pin of chip U7A receives the AD_VOLT1 signal, the PA7 pin of chip U7A receives the AD_VOLT2 signal, the PA0 pin of chip U7A receives the AD_VOLT3 signal, and the PA5 pin of chip U7A receives the AD_VOLT4 signal.

[0100] Reference Figure 6 and Figure 7In this embodiment, the load simulation module 3 and the analog acquisition module 32 are arranged on the same circuit board, while others such as the analog control module 31, the starting module 33, the real-time detection module 34, and the communication module 35 are all arranged on another circuit board. In this embodiment, the figure mark is based on one circuit board, that is, if the figure marks in different circuit boards are the same, but they are different components, for example, the socket SP2 on the circuit board where the analog acquisition module 32 is located and the socket SP2 on the circuit board where the starting module 33 is located are different components, and the same component described in the embodiment of the present application is the same component, for example, the socket SP1 on the circuit board where the analog acquisition module 32 is located and the socket SP1 on the circuit board where the starting module 33 is located are the same component. The socket SP1 on the circuit board where the analog acquisition module 32 is located outputs the PWM wave value to the receiving end of the load simulation module 3, and receives the AD_VOLT signal and AD_CURR signal output by the analog acquisition module 32 to the chip U7A. The socket SP1 provides +5V power supply, +12V power supply and three ground terminals.

[0101] Reference Figure 9In this embodiment, the startup module 33 includes four startup circuits, which include a control input terminal, a photocoupler P7, a power supply terminal, an output terminal, a resistor R1, a resistor R51, a resistor R63, a resistor R55, a light-emitting diode D7, and a diode D6. The power supply terminal includes a power supply, a 3V3 power supply, and a -24V power supply. The control input terminal is a socket SP6. The positive electrode of the diode D6 is electrically connected to the control input terminal, and the negative electrode of the diode D6 is electrically connected to the input terminal of the photocoupler P7. The negative electrode of the diode D6 and one input terminal of the photocoupler P7 are also grounded. The resistor R63 and the light-emitting diode D7 are connected in series between the other input terminal of the photocoupler P7 and the control input terminal. The two ends of the resistor R1 and the resistor R51 are connected in parallel with the resistor R63 and the two ends of the light-emitting diode D7. The resistor R55 is connected in series with the four ends of the photocoupler P7. Pin 3 of the optocoupler P7 is connected to the 3V3 power supply, and pin 3 of the optocoupler P7 is grounded. Pin 3 of the optocoupler P7 and resistor R55 are used as the output terminal to output the QD signal to chip U7A. In this embodiment, since there are four startup loops, the QD signals are QD1, QD2, QD3, and QD4 respectively. One input terminal of the optocouplers P7, P8, P9, and P10 in each startup loop is connected in parallel to the power supply, while the other input terminal is electrically connected to the control input terminal. All four pins are connected in parallel to the 3V3 power supply, and the output terminals respectively output QD1, QD2, QD3, and QD4 signals. Pin 25 of chip U7A receives the QD4 signal, pin 26 of chip U7A receives the QD3 signal, pin 27 of chip U7A receives the QD2 signal, and pin 28 of chip U7A receives the QD1 signal. In this embodiment, the optocouplers P7, P8, P9, and P10 can be TLP181 models. By controlling the signal inputted at the input end, the on / off of the input ends of the photoelectric couplers P7, P8, P9 and P10 is controlled, thereby realizing the on / off control of the output ends 3 and 4 of the photoelectric coupler P7. By turning on and off the output ends 3 and 4 of the photoelectric couplers P7, P8, P9 and P10, the high and low level states of the 3V3 power supply to the output end are changed, thereby making the output end 4 of the photoelectric coupler P7, P8, P9 and P10 serve as the output end of the startup module 33 to output different QD signals to the chip U7A, so as to perform startup control on the chip U7A.

[0102] Reference Figure 8 and Figure 10The communication module 35 is used to receive user remote control and output communication signals to the control input terminal of the start module 33. The communication module 35 includes a chip U13 for communication and an isolated power supply circuit for powering the chip U13. The communication module 35 includes a chip U13, a chip U8, a chip U9, a chip U10, a chip U11, a rectifier bridge B1, a rectifier bridge B2, a rectifier bridge B3, a socket SP7, a socket SP8, a socket SP10, a socket SP11, a resistor R5, a resistor R6, a resistor R84, a resistor R88, a resistor R90, a resistor R85, a resistor R17, a resistor R18, a resistor R75, a resistor R91, a resistor R92, a transformer E3, a transformer E4, a capacitor C1, and a capacitor C2. 17, capacitor C19, capacitor C18, capacitor C20, capacitor E5, capacitor C13, light-emitting diode LED1, light-emitting diode LED8, light-emitting diode LED9, light-emitting diode LED10, light-emitting diode LED11, light-emitting diode LED12, multiple power supply terminals and multiple ground terminals, socket SP7 is connected in parallel to the input terminals of transformer E3 and transformer E4 as the power supply terminal, the input terminals of rectifier bridge B1 and rectifier bridge B2 are both connected in parallel to pins 3 and 5 of transformer E3, the positive pole of transformer B1 is electrically connected to the Vin terminal of chip U8, the negative pole of transformer B1 is electrically connected to the GND terminal of chip U8, capacitor C17 is connected in parallel between the Vin terminal and GND terminal of chip U8, pin 3 of chip U8 is grounded, capacitor C19 is connected in parallel between pin 3 of chip U8 and the GND terminal of chip U8, the GND terminal of chip U8 is grounded, resistor R84 is electrically connected between pin 3 of chip U8 and the positive pole of light-emitting diode LED8, light-emitting diode The negative electrode of LED8 is grounded; capacitor C1 is connected in parallel between the positive and negative electrodes of rectifier bridge B2; resistor R5 is electrically connected between the positive electrode of rectifier bridge B2 and pin 2 of socket strip SP10; pin 1 of socket strip SP10 is electrically connected to pin 2 of socket strip SP11; pin 1 of socket strip SP11 is connected in parallel to pin 4 of rectifier bridge B2; resistor R6 is electrically connected between pin 2 of socket strip SP10 and the positive electrode of light-emitting diode LED1; and the negative electrode of light-emitting diode LED1 is connected in parallel to pin 4 of rectifier bridge B2;The input end of the rectifier bridge B3 is electrically connected to pins 3 and 5 of the transformer E4, capacitor C18 is connected in parallel between the positive and negative poles of the rectifier bridge B3, the positive pole of the rectifier bridge B3 is electrically connected to the Vin end of the chip U9, the negative pole of the rectifier bridge B3 is electrically connected to the GND end of the chip U9, capacitor C20 is connected in parallel between the GND end of the chip U9 and pin 3 of the chip U9, the GND end of the chip U9 is grounded, pin 3 of the chip U9 is grounded, pin 3 of the chip U9 is electrically connected to the INPUT end of the chip U10, the G end of the chip U10 is grounded, a field effect tube model SOT-223 is electrically connected to the chip U10, pins 2 and 4 of the chip U10 are grounded in parallel, the positive pole of capacitor E5 is connected in parallel to pins 2 and 4 of the chip U10, and the negative pole of capacitor E5 is connected in parallel to the G end of the chip U10 , capacitor C13 is connected in parallel to both ends of capacitor E5, resistor R85 is electrically connected between pin 2 of chip U10 and the positive electrode of light-emitting diode LED9, and the negative electrode of light-emitting diode LED9 is grounded; one end of resistor R17 and one end of resistor R18 are connected in parallel to ground, the other end of resistor R17 is electrically connected to the positive electrode of light-emitting diode LED11, resistor R18 is electrically connected to the positive electrode of light-emitting diode LED12, the negative electrode of light-emitting diode LED11 outputs TX1 signal, the negative electrode of light-emitting diode LED12 outputs RX1 signal, the RXD pin of chip U13 corresponds to the RX1 signal of light-emitting diode LED12, the TXD pin of chip U13 corresponds to the TX1 signal of light-emitting diode LED11, and the RE pin and DE pin of chip U13 are connected in parallel to CON 4851 signal, the PV pin of chip U13 is electrically connected to resistor R75 and then grounded, the 16 pins of chip U13 receive +5V1 power supply, the 13 pin of chip U13 is electrically connected to resistor R91, the 12 pin of chip U13 is electrically connected to resistor R92, the resistor R91 and the resistor R92 are electrically connected to the socket SP8, the 43 pin of chip U7A is used to transmit the RX1 signal, and the 42 pin of chip U7A is used to transmit the TX1 signal. In this embodiment, chip U13 can use the COMM_485_ADM2483 model, chip U11 can use the B0505S-1WR2 1W 1500V model, chip U8 can use the 7812 model, chip U9 can use the 7805 model, chip U10 can use a model with 3.3V parameters, transformer E3 can use a model with 3W / 13V parameters, transformer E4 can use a model with 3W / 7.5V parameters, and rectifier bridges B1, B2, and B3 can use the MB10S model. Transformer E3, transformer E4, rectifier bridges B1, B2, and B3, as well as filter and rectifier chips U8, U9, and U10, isolate the power input and provide power to chip U13 as an isolated power supply to achieve communication. Users can remotely communicate with chip U13 through the TXD and RXD pins, and then communicate and control the power strip SP6.

[0103] Reference Figure 8 and Figure 11 The real-time detection module 34 includes four real-time detection circuits, which include a photoelectric coupler P3, an input end, a power supply end, a transistor T1, a light-emitting diode LED3, a resistor R59, a resistor R67, a resistor R76, a resistor R80, and a socket SP5. In the real-time detection circuit, the power supply end is a +24V power supply and a -24V power supply. The input end is used to receive the OUT signal output by the chip U7A. The input end is electrically connected to the input end of the photoelectric coupler P3 through the resistor R59. The other input end of the photoelectric coupler P3 is grounded to pin 4. The resistor R67 is connected in series between pin 3 of the photoelectric coupler P3 and the base of the transistor T1. The emitter of the transistor T1 is electrically connected to the -24V power supply. The resistor R76 is electrically connected between the collector of the transistor T1 and the socket SP5. The light-emitting diode L The negative pole of ED3 is connected in parallel between the resistor R76 and the socket SP5, and the resistor R80 is electrically connected between the positive pole of the light-emitting diode LED3 and the +24V power supply; in this embodiment, the OUT signal corresponds to four real-time detection circuits, so there are OUT1 signal, OUT2 signal, OUT3 signal, and OUT4 signal, the PB11 pin of the chip U7A outputs the OUT1 signal, the PB10 pin of the chip U7A outputs the OUT2 signal, the PB2 pin of the chip U7A outputs the OUT3 signal, and the PB1 pin of the chip U7A outputs the OUT4 signal; there are four real-time detection circuits in total, and the input ends of the four real-time detection circuits receive the OUT1 signal, OUT2 signal, OUT3 signal, and OUT4 signal respectively, and the four real-time detection circuits are electrically connected to the socket SP5 respectively. The high and low levels of the OUT1-4 signals are used to control the on / off of the output of the photocoupler P3-6. The output of the photocoupler P3-6 controls the on / off between the collector and emitter of the transistor T1-4, thereby controlling the on / off of the light-emitting diode LED3-6, thereby achieving the purpose of on / off reminder. In this embodiment, the photocoupler P3-6 can be an EL357 model, and the transistor T1-4 can be an 8050 model.

[0104] Reference Figure 12The electronic load 22 also includes socket strips SP1, SP2, SP3, SP9, a dip switch U6, a crystal oscillator Y2, a resistor R11, a capacitor C11, a chip U5, a resistor R9, a socket strip SP4, a resistor R12, and a resistor R16 installed on the circuit board where the chip U7A is located. The socket strips SP1-4 are electrically connected to the socket strips SP1 on the other four load simulation modules 3 to transmit PWM1-4 wave values, AD_VLOT1-4 signals, and AD_CURR1-4 signals. The four output ends of the dip switch U6 are grounded in parallel and each outputs an IN1 signal, an IN2 signal, an IN3 signal, and an IN4 signal to the chip U7A. The PC15 pin of the chip U7A receives the IN1 signal, the PC14 pin of the chip U7A receives the IN2 signal, the PC13 pin of the chip U7A receives the IN3 signal, and the 46 pin of the chip U7A receives the IN4 signal. Socket strip SP4 receives 3V3 power and is electrically connected to the SWDIO interface and SWCLK receiver for interactive data and signal transmission with chip U7A. Pin 37 of chip U7A is used to electrically connect to the SWCLK receiver for synchronous data transmission, and pin 34 of chip U7A is used to electrically connect to the SWDIO receiver for interactive data and signal transmission. In this embodiment, chip U5 can adopt the 24C02 model. The A0, A1, A2, and VSS terminals of chip U5 are connected to ground in parallel. The A0, A1, and A2 terminals of chip U5 are used for address selection, and the null is 0. Pin 5 of chip U5 is used for SDA signal transmission, and pin 6 of chip U5 is used for SCL signal transmission. The SDA signal and SCL signal are electrically connected to chip U7A through resistors R12 and R16 respectively. Pin 40 of chip U7A is used for SDA signal transmission, and pin 41 of chip U7A is used for SCL signal transmission to facilitate control of external devices such as sensors. The RST signal is transmitted to the NRST pin of chip U7A through resistor R11 and capacitor C11 for reset. Pin 45 of chip U7A is used for CON 4851 signal transmission. Pin 36 of chip U7A receives 3V3 power supply. Pin 35 of chip U7A is electrically connected to ground terminal GND. The VBAT pin of chip U7A must be connected to 3V3 when there is no battery. The VSSA pin of chip U7A is internally connected to VREF-, and the VDDA pin of chip U7A is internally connected to VREF+. The PD0 pin of chip U7A transmits the X1 signal, and the PD1 pin of chip U7A transmits the X2 signal.

[0105] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A method for realizing a mechanical life test function, characterized in that: include: Acquire test data, the test data including on-state voltage and current values, on-off time values, and set load values; Determine the current and voltage of the high-voltage DC relay by the conduction voltage and current value, determine the simulated load by the set load value and electrically connect it to the high-voltage DC relay; determining a frequency of energizing and deenergizing the high-voltage DC relay by using the on-off time value, collecting a detection value, and determining result data by using the detection value and the on-off time value, wherein the result data indicates whether the high-voltage DC relay is operating normally; The simulated load is determined by setting the load value and electrically connected to the high-voltage DC relay, including: The test data also includes a selection mode, and the detection value includes a collected current value and a collected voltage value; Determine to obtain the collected current value or the collected voltage value through the selection mode, and obtain the set value; Determining the current, voltage or internal resistance of the high-voltage DC relay that needs to be adjusted according to the selection mode, the set value and the detection value; The selection mode includes at least constant current mode, constant voltage mode, constant resistance mode, and constant power mode; If the constant current mode is obtained, the collected current value is obtained, and the collected current value is compared with the set value to determine whether the collected current value is less than the set value, and the current of the high-voltage DC relay is increased; if the collected current value is greater than the set value, the current of the high-voltage DC relay is reduced; If the constant voltage mode is obtained, the collected voltage value is obtained, and the collected voltage value is compared with the set value to determine whether the collected voltage value is less than the set value, and the voltage of the high-voltage DC relay is increased; if the collected voltage value is greater than the set value, the voltage of the high-voltage DC relay is reduced; If the constant resistance mode is obtained, the collected current value and the collected voltage value are obtained, a simulated internal resistance value is determined based on the collected current value and the collected voltage value, and a judgment is made by comparing the simulated internal resistance value with the set value. If the simulated internal resistance value is less than the set value, the voltage of the high-voltage DC relay is increased or the current of the high-voltage DC relay is decreased; if the simulated internal resistance value is greater than the set value, the voltage of the high-voltage DC relay is decreased or the current of the high-voltage DC relay is increased; If the constant power mode is obtained, the collected current value and the collected voltage value are obtained, a power value is determined based on the collected current value and the collected voltage value, and a judgment is made by comparing the power value with the set value. If the power value is less than the set value, the current of the high-voltage DC relay is increased; if the power value is greater than the set value, the current of the high-voltage DC relay is reduced; If the constant current mode is selected, the setting range of the set value is (0, power supply current), that is, the current regulation of the constant current mode can be adjusted within a range less than the power supply current. The PWM wave is used to adjust the duty cycle to adjust the current size, so that the maximum current can be adjusted to the same as the power supply current. Therefore, the set value must be less than the power supply current. If the set value is greater than the power supply current, an alarm will be issued. The collected current value is compared with the set value, and the current size is adjusted by adjusting the duty cycle of the PWM wave, so that the collected current value is close to the set value. If the constant power mode is selected, the power value can be obtained by multiplying the collected current value and the collected voltage value. The constant power mode is mainly based on the collected voltage value. That is, if the collected voltage value changes and causes the power value to be higher or lower than the set value, the duty cycle of the PWM wave is also adjusted, thereby adjusting the current, so that the collected current value changes accordingly to make the power value close to the set value.

2. The method for realizing mechanical life test function according to claim 1, characterized in that: include: Scan and read the identification code on the high-voltage DC relay to obtain the test piece information; Scan and read the identification code on the workstation where the high-voltage DC relay is placed to obtain the workstation information; Corresponding the test signal to the workstation information and storing them in a database; The test data obtained during the life test of the high-voltage DC relay corresponds to the test piece information and is stored in a database.

3. A device for implementing a mechanical life test function, according to the method for implementing a mechanical life test function according to claim 1, characterized in that: The invention comprises a base (1), wherein a plurality of workstations (11) are provided on the base (1), and a plurality of test heads (12) are also slidably provided on the base (1), wherein the test heads (12) are used to be electrically connected to contacts of high-voltage DC relays on the corresponding workstations (11), and a display screen (13) for displaying the test data and the result data is also provided on the base (1), wherein the test heads (12) are used to perform an on-off life test on the high-voltage DC relay, wherein a load is electrically connected to the high-voltage DC relay via the test heads (12), the result data is obtained and output to the display screen (13) for display, and the test heads (12) are controlled via the display screen (13).

4. The device for realizing mechanical life test function according to claim 3, characterized in that: The plurality of test heads (12) are divided into at least two groups, and the test heads (12) in different groups independently perform on-off life tests on the high-voltage DC relay.

5. A circuit for realizing a mechanical life test function, the device for realizing a mechanical life test function according to claim 3, characterized in that: include: A power supply module (2) is used to control the on / off power supply of the main contacts and auxiliary contacts of the high-voltage DC relay; A fixing module (21) is used to attract and fix the output end of the power supply module (2) to the contact of the high-voltage DC relay; The electronic load (22) is electrically connected to the high-voltage DC relay and is used to simulate the load condition of the high-voltage DC relay when in use.

6. The circuit for realizing mechanical life test function according to claim 5, characterized in that: The electronic load (22) includes: A load simulation module (3) is electrically connected to the high-voltage DC relay to provide a simulated load, so as to simulate the load electrically connected to the high-voltage DC relay in the use environment; The simulation control module (31) receives the set value input by the user, calculates the PWM wave value based on the set value and outputs it to the load simulation module (3), thereby controlling the load simulated by the load simulation module (3); The analog acquisition module (32) acquires the working state of the load simulation module (3), obtains the acquired current value and the acquired voltage value, and outputs them to the analog control module (31), and the analog control module (31) performs corresponding calculation processing on the acquired current value and the acquired voltage value.

7. The circuit for realizing mechanical life test function according to claim 6, characterized in that: The load simulation module (3) includes a receiving end, a comparator U1, and a field effect transistor P2. The receiving end receives the PWM wave value output by the analog control module (31), and the receiving end outputs it to the non-inverting input end of the comparator U1. The inverting input end of the comparator U1 receives the current input of the high-voltage DC relay. The output end of the comparator U1 outputs it to the gate of the field effect transistor P2 to control the on-off ratio of the source and drain of the field effect transistor P2, thereby achieving the purpose of regulating the current. The analog control module (31) includes a chip U7A, one chip U7A corresponds to a plurality of the load simulation modules (3), a plurality of pins of the chip U7A are used to output PWM wave values, and the PWM wave values ​​output by different pins of the chip U7A correspond to different receiving ends of the load simulation modules (3); The analog acquisition module (32) includes a resistor R21, a resistor R43, a resistor R42, and an operational amplifier U3. The resistor R21 and the resistor R43 are electrically connected to the voltage input of the high-voltage DC relay. The input end of the operational amplifier U3A is connected in parallel between the resistor R21 and the resistor R43. The output end of the operational amplifier U3A outputs an AD_VOLT signal to the chip U7A to obtain the acquired voltage value. The resistor R42 is electrically connected to the inverting input end of the comparator U1. The non-inverting input end of the operational amplifier U3B is connected in parallel between the resistor R42 and the inverting input end of the comparator U1. The inverting input end of the comparator U1 is electrically connected to the other end of the resistor R42. The output end of the operational amplifier U3B outputs an AD_CURR signal to the chip U7A to obtain the acquired current value. The chip U7A calculates and processes the acquired voltage value and the acquired current value.

8. The circuit for realizing mechanical life test function according to claim 7, characterized in that: The electronic load (22) further includes: A startup module (33) includes a plurality of startup circuits, wherein the startup circuits include a control input terminal, a photoelectric coupler P7, a power supply terminal, and an output terminal. The control input terminal is electrically connected to the input terminal of the photoelectric coupler P7 to realize on-off control of pins 3 and 4 of the output terminal of the photoelectric coupler P7. The power supply terminal is electrically connected to pin 3 of the output terminal of the photoelectric coupler P7. Pin 4 of the output terminal of the photoelectric coupler P7 serves as the output terminal of the startup module (33) to output a QD signal to the chip U7A to control startup of the chip U7A. A real-time detection module (34) includes a plurality of real-time detection circuits, wherein the real-time detection circuit includes a photoelectric coupler P3, an input end, a power supply end, a transistor T1, and a light-emitting diode LED3, wherein the input end is used to receive an OUT signal output by the chip U7A, the input end is electrically connected to the input end of the photoelectric coupler P3 to realize on-off control of the output end of the photoelectric coupler P3, the output end of the photoelectric coupler P3 is electrically connected to the base of the transistor T1 to control the on-off between the collector and the emitter of the transistor T1, and the light-emitting diode LED3 is electrically connected to the power supply end and the collector of the transistor T1; The communication module (35) is used to receive user remote control and output a communication signal to the control input end of the start module (33). The communication module (35) includes a chip U13 for communication and an isolated power supply circuit for powering the chip U13.

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