Injection molding equipment and molding method of diode

Abstract

The present invention relates to the field of diode injection molding technology, and discloses a diode injection molding device and molding method, including a frame, the top of the frame is fixedly connected to a table, the top of the table is fixedly connected to a diode injection molding assembly and a shifting assembly for loading and unloading the diode, the injection molding assembly includes a mounting frame 1, the mounting frame 1 is fixedly connected to the top of the table, and two light rods are fixedly connected to both sides of the mounting frame 1. The present invention forms an injection mold cavity by setting two shifting injection mold assemblies, and an upper injection mold assembly and a lower injection mold assembly move up and down to open and close, and switches the two shifting injection mold assemblies through a driving mechanism to achieve rapid loading and unloading operations, effectively solving the problem of pausing injection molding during loading and unloading, thereby wasting working hours and low production efficiency, and closing the mold tightly through the pressure generated by air pressure, effectively avoiding the situation where gaps are generated during injection molding.

Description

Technical Field

[0001] The invention relates to the technical field of diode injection molding, in particular to a diode injection molding device and a molding method. Background Art

[0002] Diodes are very basic and important components in electronic circuits. They play many roles in circuits, including rectification, switching, voltage regulation, etc.

[0003] The axial diode is a commonly used rectifier device. The axial diode is a diode with legs at both ends. It is a discrete component. The main application of the axial diode is rectification, which only allows current to pass in one direction. The existing axial diode injection mold mainly arranges the poles on the mold surface and injects them into the cavity for packaging.

[0004] The commonly used diode injection molds still have the following problems during injection molding:

[0005] 1. The diode injection mold is generally composed of an upper mold and a lower mold, and the injection molding process is carried out through the mold cavity formed after the mold is closed. When the diode is injection-molded and packaged, in order to improve the injection molding efficiency, generally multiple groups of diodes are injection-molded at the same time. After the injection molding is completed, it is more laborious to take the material, and the injection molding needs to be suspended, resulting in a waste of working time;

[0006] 2. When opening and closing the mold, the hard contact between the upper mold and the lower mold is likely to cause damage to the mold. When the upper mold and the lower mold contact the mold through an elastic structure, the pressure generated during injection molding is likely to cause the upper mold and the lower mold to move slightly, resulting in a gap in the injection mold cavity, causing the burrs of the product after injection molding to expand;

[0007] 3. At present, in the process of solving the problem of fast material loading and unloading through the transverse mold, how to realize the mobile positioning of the transverse mold, the influence of micro-vibration of the transverse mold on the position of the diode, and the station switching without pausing injection molding are all urgent problems that need to be solved. Summary of the invention

[0008] 1. Technical issues to be resolved

[0009] In view of the deficiencies in the prior art, the present invention provides an injection molding device and a molding method for a diode, which is mainly used to solve the problem that a diode injection mold is generally composed of an upper mold and a lower mold, and the injection molding is performed through a mold cavity formed after the mold is closed. When the diode is injection-molded and packaged, in order to improve the injection molding efficiency, generally multiple groups of diodes are injection-molded at the same time. After the injection molding is completed, it is more laborious to take the material, and the injection molding needs to be suspended, resulting in a waste of working time. When the mold is opened and closed, the hard contact between the upper mold and the lower mold is likely to cause damage to the mold. When the upper mold and the lower mold contact the closed mold through an elastic structure, the pressure generated during injection molding is likely to cause the upper mold and the lower mold to move slightly, thereby causing a gap in the injection mold cavity and causing the burrs of the injection molded product to expand. In the process of solving the problem of fast material loading and taking by lateral movement of the mold, how to realize the mobile positioning of the lateral movement mold, the influence of micro-vibration of the lateral movement mold on the position of the diode, and the station switching without pausing the injection molding are all problems that need to be solved urgently.

[0010] (II) Technical solution

[0011] To achieve the above object, the present invention provides the following technical solutions:

[0012] A diode injection molding device comprises a frame, the top of the frame is fixedly connected to a table, the top of the table is fixedly connected to a diode injection molding assembly and a transfer assembly for loading and unloading the diode, the injection molding assembly comprises a mounting frame 1, the mounting frame 1 is fixedly connected to the top of the table, two light rods are fixedly connected to both sides of the mounting frame 1, and an upper injection mold assembly and a lower injection mold assembly that can be movably opened and closed are respectively provided between the multiple light rods and at the top and bottom of the mounting frame 1, the transfer assembly comprises a mounting frame 2, the mounting frame 2 is fixedly connected to the top of the table, the top of the mounting frame 2 is fixedly connected to two tracks, two transfer-type injection mold assemblies are slidably connected between the two tracks via a slide, and a driving mechanism for driving the two transfer-type injection mold assemblies to move is provided on the top of the mounting frame 2.

[0013] Furthermore, the movable injection mold assembly includes a movable frame, which is slidably connected between two rails through a slide, an embedding groove is provided on the top of the movable frame, a mold core is clamped in the embedding groove, and the mold core and the embedding groove are fixed by an adsorption mechanism, and guide sleeves are fixedly connected at the four corners of the bottom of the movable frame, a plurality of positioning support grooves and positioning stop grooves for positioning the diodes are provided inside the mold core, and the positioning support grooves and the positioning stop grooves are connected, a plurality of slide grooves are provided on both sides of the mold core, and anti-loosening components are provided in the slide grooves for fixing the diodes in the positioning support grooves and the positioning stop grooves.

[0014] On the basis of the above-mentioned scheme, the anti-loosening component includes a moving block, which is slidably connected inside the slide slot. One end of the moving block is provided with a slot for blocking the diode pole pin. The other end of the moving block is provided with an inclined surface for causing the moving block to be squeezed and moved along the slide slot. A reset spring is fixedly connected between the two ends of the moving block and the slide slot to rebound and reset the moving block.

[0015] As a further solution of the present invention, the adsorption mechanism includes a plurality of mounting holes, which are respectively opened on the bottom inner wall at the four corners of the embedding groove, and a magnetic block that can generate magnetic attraction to the mold core is fixedly connected in the plurality of mounting holes.

[0016] Furthermore, the driving mechanism includes a plurality of vertical bearing seats, and the plurality of vertical bearing seats are respectively fixedly connected at the four corners of the top of the mounting frame 2, and the plurality of vertical bearing seats are rotatably connected with a synchronous pulley 2, and the two synchronous pulleys 2 located on the same side are connected by a synchronous belt transmission, and the synchronous belt is fixed to two movable injection mold assemblies, wherein a connecting shaft is fixedly connected between the two opposite synchronous pulleys 2, and a synchronous pulley 1 is fixedly connected to one side of the connecting shaft, a servo motor is fixedly connected to the top inner wall of the mounting frame 2, and one end of the servo motor output shaft is fixedly connected to a driving pulley connected to the synchronous pulley 1 by a transmission belt transmission, and a positioning component for positioning the moving position of the movable injection mold assembly is provided between the movable injection mold assembly and the mounting frame 2.

[0017] Based on the above scheme, the positioning component includes slot-type photoelectric switch 1 and slot-type photoelectric switch 2, and the slot-type photoelectric switch 1 and slot-type photoelectric switch 2 are both fixedly connected to one side of mounting frame 2, and one side of the two movable injection mold assemblies is fixedly connected with an induction frame.

[0018] As a further scheme of the present invention, the upper injection mold assembly and the lower injection mold assembly respectively include an upper mounting plate and a lower mounting plate, and the upper mounting plate and the lower mounting plate are respectively slidably connected between a plurality of light rods through a slide, and the top outer wall and the bottom outer wall of the mounting frame are respectively fixedly connected with an upper driving cylinder and a lower driving cylinder, and one end of the piston rod of the upper driving cylinder and the lower driving cylinder is respectively connected with the upper mounting plate and the lower mounting plate through a buffer assembly, one side of the upper mounting plate is fixedly connected with an upper connecting frame, and the bottom of the upper connecting frame is fixedly connected with an upper template, and the bottom of the upper template is provided with a plurality of upper mold cavities and a pressing groove for pressing and positioning the diode pole feet, one side of the upper connecting frame is fixedly connected with a plurality of interconnected injection pipes and connecting pipes, and the bottom end of the injection pipe passes through the upper template and is connected with the upper mold cavity, the top of the lower mounting plate is fixedly connected with a lower template, and the top of the lower template is provided with a lower mold cavity corresponding to the upper mold cavity, and the top four corners of the lower template are fixedly connected with guide columns that are plugged into the guide sleeve.

[0019] Furthermore, a cooling water pipe is provided inside the lower mold plate, and both ends of the cooling water pipe pass through one side of the lower mold plate, and a heating element is provided on the circumferential outer wall of the plurality of injection molding pipes.

[0020] On the basis of the above-mentioned scheme, the buffer assembly includes a connecting seat, which can be fixedly connected to the top of the upper mounting plate and the bottom of the lower mounting plate respectively. An inner cavity is opened in the connecting seat, and a movable piston is slidably connected in the inner cavity. The top of the movable piston is fixedly connected to a connecting rod. The top of the connecting rod passes through the connecting seat and can be fixed to one end of the piston rod of the upper driving cylinder and the lower driving cylinder respectively through a coupling. A compression spring is provided between the inner cavity and the movable piston, and a sealing ring in contact with the inner wall of the inner cavity is provided on the circumferential outer side of the movable piston. An air pipe connected to the inner cavity is fixedly connected to one side of the connecting seat.

[0021] The present invention also provides a diode injection molding method, comprising the following steps:

[0022] S1: First, the movable injection mold assembly is provided with a separate mold core, so that the mold core is taken out and placed by a robot to batch replace the diodes to be injected therein. Since the diodes are placed in the positioning support grooves and positioning stop grooves provided in the mold core, the positioning support grooves support the diode pole pins, and the positioning stop grooves limit the position of the diode pole pins and the injection position of the diodes is limited;

[0023] S2: At the same time, when the mold core is installed on the moving frame, the inclined surface of the moving block contacts and squeezes the corner of the embedded groove, causing the moving block to be forced to move inward along the slide groove, and then the diode pole foot placed in the positioning retaining groove is clamped and fixed through the clamping groove opened at the end of the moving block. At this time, the reset spring is shortened and generates elastic force, so that the anti-loosening component can automatically release the clamping and fixing state of the diode pole foot when the mold core is separated from the moving frame through the reset spring, thereby facilitating the subsequent removal of the diode;

[0024] S3: Then, the servo motor is started to rotate and the synchronous pulley 1 and the connecting shaft are driven to rotate through the driving pulley. The connecting shaft rotates to make the multiple synchronous pulleys 2 rotate synchronously through the synchronous belt. At this time, the synchronous belt moves and drives the two movable injection mold assemblies to move at the same time. The two movable injection mold assemblies are switched between the position state 1 and the position state 2 through the slot-type photoelectric switch 1 and the slot-type photoelectric switch 2.

[0025] S4: During injection molding, the upper injection mold assembly and the lower injection mold assembly are closed by the upper driving cylinder and the lower driving cylinder, and then an injection mold cavity for injection molding the diode is formed by the upper mold cavity and the lower mold cavity, and then the external injection molding machine is connected through the connecting pipe and the formed injection mold cavity is quantitatively injected through the injection molding pipe;

[0026] S5: At the same time, the elastic force generated by the compression deformation of the compression spring causes the upper injection mold assembly and the lower injection mold assembly to be elastically compressed when they are fitted with the movable injection mold assembly, and since the positions of the piston rods of the upper driving cylinder and the lower driving cylinder are fixed at this time, the inner cavity is inflated through the air pipe to increase the air pressure in the inner cavity to a certain threshold, so that the pressure generated by the air pressure causes the upper injection mold assembly and the lower injection mold assembly to fit tightly with the movable injection mold assembly, and effectively avoids the situation of gaps during injection molding, effectively reduces the burrs of the product after injection molding, and improves the injection molding accuracy of the product;

[0027] S6: After the injection molding is completed, the position where the diode is injected is quickly cooled down through the cooling water pipe, and then the upper injection mold assembly and the lower injection mold assembly are respectively moved outward and separated from the closed mold state of the movable injection mold assembly. At this time, the injection molding of the diode in the movable injection mold assembly is completed and the rapid demolding process is achieved through the anti-loosening component;

[0028] S7: Then, the position states of the two movable injection mold components are switched through the driving mechanism to achieve rapid loading and unloading operations.

[0029] (III) Beneficial effects

[0030] Compared with the prior art, the present invention provides a diode injection molding device and molding method, which has the following beneficial effects:

[0031] 1. The present invention provides two movable injection mold assemblies, and the upper injection mold assembly and the lower injection mold assembly move up and down to open and close to form an injection mold cavity, and switches the two movable injection mold assemblies through a driving mechanism to achieve rapid loading and unloading operations, effectively solving the problem of pausing injection molding during loading and unloading, thereby wasting working time and low production efficiency.

[0032] 2. The present invention provides a separate mold core in the movable injection mold assembly, so that the mold core can be taken out and placed by a robot, and the diodes to be injected in the mold core can be replaced in batches.

[0033] 3. The present invention uses an anti-loosening component to simultaneously compress and fix the diode pole pins when the mold core is installed on the shifting frame, and uses a reset spring to automatically release the clamping and fixing state of the diode pole pins when the mold core is detached from the shifting frame, thereby facilitating the subsequent removal of the diode.

[0034] 4. The present invention locates the moving positions of the two movable injection mold assemblies by means of the slot-type photoelectric switch 1 and the slot-type photoelectric switch 2, thereby realizing the position determination of the position state 1 and the position state 2 of the two movable injection mold assemblies.

[0035] 5. The present invention uses elastic components to make the upper injection mold assembly and the lower injection mold assembly fit tightly with the movable injection mold assembly in an elastically compressed state when the mold is closed, thereby reducing burrs on the product after injection molding.

[0036] 6. The present invention inflates the inner cavity through an air pipe to increase the air pressure in the inner cavity to a certain threshold value, so that the pressure generated by the air pressure makes the upper injection mold assembly and the lower injection mold assembly close to the movable injection mold assembly, and effectively avoids the situation where gaps are generated during injection molding. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 A schematic diagram of the front three-dimensional structure of a diode injection molding device and molding method proposed by the present invention;

[0038] Figure 2 A partially enlarged structural schematic diagram of a diode injection molding device and molding method proposed by the present invention;

[0039] Figure 3 A schematic diagram of the structure of a transfer component of a diode injection molding device and molding method proposed by the present invention;

[0040] Figure 4 It is an enlarged structural schematic diagram of a movable injection mold assembly of a diode injection molding device and molding method proposed by the present invention;

[0041] Figure 5 A schematic diagram of the exploded structure of a movable injection mold assembly of a diode injection molding device and molding method proposed by the present invention;

[0042] Figure 6 A schematic diagram of a cross-sectional structure of a mold core of a diode injection molding device and molding method proposed by the present invention;

[0043] Figure 7 A schematic diagram of the structure of the anti-loosening component of a diode injection molding device and molding method proposed by the present invention;

[0044] Figure 8 It is a schematic diagram of the enlarged structure of the injection molding component of the injection molding equipment and molding method of a diode proposed by the present invention;

[0045] Fig. 9It is a schematic diagram of the enlarged structure of an upper injection mold assembly of an injection molding device and molding method for a diode proposed by the present invention;

[0046] Fig.10 A schematic diagram of the bottom structure of an upper injection mold assembly of a diode injection molding device and molding method proposed by the present invention;

[0047] Fig.11 It is a schematic diagram of the enlarged structure of the lower injection mold assembly of a diode injection molding device and molding method proposed by the present invention;

[0048] Fig.12 It is a schematic diagram of the enlarged structure of a buffer component of a diode injection molding device and molding method proposed by the present invention;

[0049] Fig.13 The present invention provides a schematic cross-sectional structural diagram of a buffer component of a diode injection molding device and molding method.

[0050] In the figure: 1, frame; 2, table; 3, transfer assembly; 4, injection assembly; 5, driving mechanism; 6, transfer type injection mold assembly; 7, upper injection mold assembly; 8, mounting frame 1; 9, lower injection mold assembly; 10, mounting frame 2; 11, connecting shaft; 12, servo motor; 13, synchronous pulley 1; 14, track; 15, transfer frame; 16, vertical bearing seat; 17, synchronous pulley 2; 18, slot type photoelectric switch 1; 19, induction frame; 20, synchronous belt; 21, slot type photoelectric switch 2; 22, mold core; 23, guide sleeve; 24, embedded groove; 25, anti-loosening component; 26, magnetic block; 27, mounting hole; 28 , positioning support groove; 29, positioning stop groove; 30, moving block; 31, inclined plane; 32, reset spring; 33, slot; 34, slide; 35, upper drive cylinder; 36, upper mounting plate; 37, lower mounting plate; 38, light rod; 39, buffer assembly; 40, lower drive cylinder; 41, upper connecting frame; 42, upper mold plate; 43, heating element; 44, injection molding pipe; 45, connecting pipe; 46, pressing groove; 47, upper mold cavity; 48, lower mold cavity; 49, cooling water pipe; 50, guide column; 51, lower mold plate; 52, connecting seat; 53, air pipe; 54, connecting rod; 55, moving piston; 56, inner cavity; 57, compression spring. DETAILED DESCRIPTION

[0051] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0052] Reference Figure 1-Figure 13 A diode injection molding device and molding method, including a frame 1, a table 2 is fixed to the top of the frame 1 by bolts, a diode injection molding component 4 and a transfer component 3 for loading and unloading the diode are fixed to the top of the table 2 by bolts, the injection molding component 4 includes a mounting frame 8, the mounting frame 8 is fixed to the top of the table 2 by bolts, two light rods 38 are fixed to both sides of the mounting frame 8 by bolts, and a movable upper injection mold component 7 and a lower injection mold component 9 are respectively provided between the plurality of light rods 38 and at the top and bottom of the mounting frame 8, the transfer component 3 includes a mounting frame 10, the mounting frame 10 is fixed to the top of the table 2 by bolts, the top of the mounting frame 10 is fixed to two rails 14 by bolts, and two rails 14 are slidably connected by a slide table. A movable injection mold assembly 6 is provided, and a driving mechanism 5 for driving the two movable injection mold assemblies 6 to move is provided on the top of the mounting frame 10. The upper injection mold assembly 7 and the lower injection mold assembly 9 are moved up and down to open and close to form an injection mold cavity, and then the positions of the two movable injection mold assemblies 6 are moved so that the movable injection mold assembly 6 is located inside the upper injection mold assembly 7 and the lower injection mold assembly 9 when the mold is closed, and the diode to be injected in the movable injection mold assembly 6 is placed in the injection mold cavity for injection molding. After the upper injection mold assembly 7 and the lower injection mold assembly 9 are opened, the two movable injection mold assemblies 6 are switched by the driving mechanism 5 to realize fast loading and unloading operations, effectively solving the problem of pausing injection molding during loading and unloading, thereby wasting working time and low production efficiency.

[0053] In order to realize fast loading and unloading, the movable injection mold assembly 6 in the present invention includes a movable frame 15, which is slidably connected between the two rails 14 through a slide, and an embedding groove 24 is provided on the top of the movable frame 15, in which a mold core 22 is clamped, and the mold core 22 is fixed to the embedding groove 24 by an adsorption mechanism, and the adsorption mechanism includes a plurality of mounting holes 27, and the plurality of mounting holes 27 are respectively provided on the bottom inner wall at the four corners of the embedding groove 24, and a magnetic block 26 that can generate magnetic attraction to the mold core 22 is fixed in the plurality of mounting holes 27 by bolts, so that the mold core 22 is magnetically fixed when it is installed in the embedding groove 24 by a manipulator, and a guide sleeve 23 is fixed at the four corners of the bottom of the movable frame 15 by bolts. The core 22 is provided with a plurality of positioning support grooves 28 and positioning stop grooves 29 for positioning the diodes, and the positioning support grooves 28 and the positioning stop grooves 29 are connected, and a plurality of slide grooves 34 are provided on both sides of the mold core 22, and the slide grooves 34 are provided with anti-loosening components 25 for fixing the diodes in the positioning support grooves 28 and the positioning stop grooves 29, and the anti-loosening components 25 include a moving block 30, and the moving block 30 is slidably connected inside the slide grooves 34, and one end of the moving block 30 is provided with a card groove 33 for avoiding and blocking the diode pole feet, and the other end of the moving block 30 is provided with an inclined surface 31 that causes the moving block 30 to be squeezed by force to move along the slide groove 34, and the two ends of the moving block 30 are fixed to the slide grooves 34 by bolts to fix the moving block 33. 0 is used for rebounding and resetting the reset spring 32, and the two mobile injection mold assemblies 6 can move along the track 14. The mobile injection mold assembly 6 is provided with a separate mold core 22, so that the mold core 22 is taken out and placed by a manipulator to replace the diode to be injected therein. Since the diode is placed in the positioning support groove 28 and the positioning retaining groove 29 provided in the mold core 22, the positioning support groove 28 supports the diode pole foot, and the positioning retaining groove 29 limits the position of the diode pole foot and limits the injection position of the diode. In addition, since the mobile injection mold assembly 6 generates friction vibration when moving and loading materials, the diode position is prone to micro-movement, which affects the injection molding accuracy. Therefore, the anti-loosening is adopted. Component 25 enables the diode pole feet to be compressed and fixed at the same time when the mold core 22 is installed on the shifting frame 15. The anti-loosening component 25 is formed through the inclined surface 31 at the bottom of the moving block 30, so that when the mold core 22 is installed on the shifting frame 15, the inclined surface 31 of the moving block 30 contacts and squeezes the corner of the embedding groove 24, so that the moving block 30 is forced to move inward along the slide groove 34, and then the diode pole feet placed in the positioning retaining groove 29 are clamped and fixed through the clamping groove 33 formed at the end of the moving block 30. At this time, the reset spring 32 is shortened and generates elastic force, so that the anti-loosening component 25 can automatically release the clamping and fixing state of the diode pole feet through the reset spring 32 when the mold core 22 is detached from the shifting frame 15, thereby facilitating the subsequent removal of the diode.

[0054] The driving mechanism 5 in the present invention includes a plurality of vertical bearing seats 16, and the plurality of vertical bearing seats 16 are respectively fixed at the top four corners of the mounting frame 10 by bolts. The plurality of vertical bearing seats 16 are rotatably connected with a synchronous pulley 17, and the two synchronous pulleys 17 located on the same side are connected by a synchronous belt 20, and the synchronous belt 20 is fixed to the two movable injection mold assemblies 6, wherein the connecting shaft 11 is fixed between the two opposite synchronous pulleys 17 by bolts, and a side key of the connecting shaft 11 is connected to a synchronous pulley 13, and the top of the mounting frame 10 is fixed with a connecting shaft 11. The inner wall is fixed with a servo motor 12 by bolts, and one end of the output shaft of the servo motor 12 is keyed to a driving pulley connected to a synchronous pulley 13 through a transmission belt. A positioning component for positioning the moving position of the movable injection mold assembly 6 is provided between the movable injection mold assembly 6 and the mounting frame 2 10. The positioning component includes a slot-type photoelectric switch 18 and a slot-type photoelectric switch 21. The slot-type photoelectric switch 18 and the slot-type photoelectric switch 21 are both fixed to one side of the mounting frame 2 10 by bolts. One side of the two movable injection mold assemblies 6 is fixed with a sensor by bolts. The frame 19 starts the servo motor 12, so that the servo motor 12 rotates and drives the synchronous pulley 13 and the connecting shaft 11 to rotate through the driving pulley. The connecting shaft 11 rotates to move the multiple synchronous pulleys 17 through the synchronous belt 20, and at the same time drives the two mobile injection mold assemblies 6 to move. The moving positions of the two mobile injection mold assemblies 6 are located through the slot-type photoelectric switch 18 and the slot-type photoelectric switch 21, and the two mobile injection mold assemblies 6 move synchronously and have two position states. Position state 1: one of the mobile injection mold assemblies 6 is located at the position of the slot-type photoelectric switch 21 through the induction frame 19 and can load materials. At this time, another mobile injection mold assembly 6 is located between the upper injection mold assembly 7 and the lower injection mold assembly 9 and performs injection molding; Position state 2: After the injection molding is completed, the other mobile injection mold assembly 6 is moved to the position of the slot-type photoelectric switch 18 through the induction frame 19 and performs unloading and loading operations. At this time, the mobile injection mold assembly 6 that has completed loading is moved from the position of the slot-type photoelectric switch 21 to between the upper injection mold assembly 7 and the lower injection mold assembly 9 and performs injection molding operations. In this way, the two position states are reciprocated, and uninterrupted injection molding operations are achieved through the two mobile injection mold assemblies 6, and the loading and unloading time is saved, thereby effectively improving the injection molding production efficiency.

[0055] In order to realize the rapid opening and closing of the injection mold, the upper injection mold assembly 7 and the lower injection mold assembly 9 in the present invention respectively include an upper mounting plate 36 and a lower mounting plate 37, and the upper mounting plate 36 and the lower mounting plate 37 are respectively slidably connected between a plurality of light rods 38 through a slide, and the top outer wall and the bottom outer wall of the mounting frame 8 are respectively fixed with an upper driving cylinder 35 and a lower driving cylinder 40 by bolts, and one end of the piston rod of the upper driving cylinder 35 and the lower driving cylinder 40 is respectively connected with the upper mounting plate 36 and the lower mounting plate 37 through a buffer assembly 39, and one side of the upper mounting plate 36 is fixed with an upper connecting frame 41 by bolts. The upper connecting frame 41 is fixed with an upper mold plate 42 at the bottom by bolts, and a plurality of upper mold cavities 47 and a pressing groove 46 for pressing and positioning the diode pole pins are provided at the bottom of the upper connecting frame 41. A plurality of injection molding pipes 44 and connecting pipes 45 are fixed with bolts on one side of the upper connecting frame 41, and the bottom end of the injection molding pipe 44 passes through the upper mold plate 42 and is connected with the upper mold cavity 47. A lower mold plate 51 is fixed with bolts on the top of the lower mounting plate 37, and a lower mold cavity 48 corresponding to the upper mold cavity 47 is provided on the top of the lower mold plate 51. The four corners of the top of the lower mold plate 51 are fixed with bolts to engage with the guide sleeve 23. The guide column 50 is used to guide the lower template 51 when the mold is closed, so that the guide sleeve 23 is matched with the guide column 50 to guide and position the lower template 51 when the mold is closed, which effectively improves the accuracy of the injection molding position. The upper injection mold assembly 7 and the lower injection mold assembly 9 can realize the opening and closing of the mold through the upper driving cylinder 35 and the lower driving cylinder 40. When the mold is closed: it can match and close the mold with the movable injection mold assembly 6, and form an injection mold cavity for injection molding of the diode through the upper mold cavity 47 and the lower mold cavity 48, and then connect with the external injection molding machine through the connecting pipe 45 and perform quantitative injection molding on the formed injection mold cavity through the injection molding pipe 44; when the mold is opened: The upper injection mold assembly 7 and the lower injection mold assembly 9 move outwards and separate from the closed mold state with the movable injection mold assembly 6. At this time, the diode injection in the movable injection mold assembly 6 is completed and the rapid demolding process is achieved. The buffer assembly 39 arranged between the upper injection mold assembly 7 and the lower injection mold assembly 9 and the upper driving cylinder 35 and the lower driving cylinder 40 has two functions. Function 1: Since the upper driving cylinder 35 and the lower driving cylinder 40 respectively buffer the upper injection mold assembly 7 and the lower injection mold assembly 9 when they move to the closed mold state with the movable injection mold assembly 6, the mold damage caused by hard contact is avoided;Function 2: The elastic component provided in the buffer component 39 enables the upper injection mold component 7 and the lower injection mold component 9 to move to a close fit with the movable injection mold component 6 when the mold is closed, thereby reducing the burrs of the product after injection molding. The lower mold plate 51 is provided with a cooling water pipe 49 inside, and both ends of the cooling water pipe 49 pass through one side of the lower mold plate 51, so that the position of the diode after injection molding is quickly cooled by the cooling water pipe 49. The circumferential outer walls of the multiple injection molding pipes 44 are provided with heating elements 43, which are heating wires, so that the materials in the injection molding pipes 44 are kept warm. ;

[0056] Due to the elastic component provided, the upper injection mold assembly 7 and the lower injection mold assembly 9 are tightly fitted with the movable injection mold assembly 6 in an elastically compressed state when the mold is closed. The pressure generated during injection molding is likely to cause the upper injection mold assembly 7 and the lower injection mold assembly 9 to slightly move with the movable injection mold assembly 6, thereby causing a gap in the injection mold cavity, resulting in the expansion of the burrs produced on the product after injection molding. In order to solve such problems, the buffer assembly 39 in the present invention includes a connecting seat 52, which can be fixed to the top of the upper mounting plate 36 and the bottom of the lower mounting plate 37 by bolts, respectively. An inner cavity 56 is provided in the connecting seat 52, and a movable piston 55 is slidably connected to the inner cavity 56. The top of the movable piston 55 is fixed with a connecting rod 54 by bolts. The top of the connecting rod 54 passes through the connecting seat 52 and can be connected to the upper drive cylinder 35 and the lower drive cylinder 37 respectively through a coupling. One end of the piston rod of the driving cylinder 40 is fixed, and a clamping spring 57 is provided between the inner cavity 56 and the movable piston 55. A sealing ring in contact with the inner wall of the inner cavity 56 is provided on the outer circumference of the movable piston 55. An air pipe 53 connected to the inner cavity 56 is welded on one side of the connecting seat 52. Therefore, the elastic force generated by the compression deformation of the clamping spring 57 makes the upper injection mold assembly 7 and the lower injection mold assembly 9 elastically compressed when they are fitted with the movable injection mold assembly 6. Since the positions of the piston rods of the upper driving cylinder 35 and the lower driving cylinder 40 are fixed at this time, the inner cavity 56 is inflated through the air pipe 53, so that the air pressure in the inner cavity 56 is increased to a certain threshold value, so that the pressure generated by the air pressure makes the upper injection mold assembly 7 and the lower injection mold assembly 9 fit tightly with the movable injection mold assembly 6, and effectively avoids the situation where gaps are generated during injection molding.

[0057] The present invention also provides a diode injection molding method, comprising the following steps:

[0058] S1: First, the movable injection mold assembly 6 is provided with a separate mold core 22, so that the mold core 22 is taken out and placed by a robot, and the diodes to be injected in the mold core 22 are replaced in batches. Since the diodes are placed in the positioning support grooves 28 and the positioning retaining grooves 29 provided in the mold core 22, the positioning support grooves 28 support the diode pole pins, and the positioning retaining grooves 29 limit the position of the diode pole pins and the injection position of the diodes is limited;

[0059] S2: At the same time, when the mold core 22 is installed on the shifting frame 15, the inclined surface 31 of the moving block 30 contacts and squeezes the corner of the embedding groove 24, causing the moving block 30 to be forced to move inward along the slide groove 34, and then the diode pole foot placed in the positioning retaining groove 29 is clamped and fixed by the clamping groove 33 opened at the end of the moving block 30. At this time, the reset spring 32 is shortened and generates elastic force, so that the anti-loosening component 25 can automatically release the clamping and fixing state of the diode pole foot when the mold core 22 is separated from the shifting frame 15 through the reset spring 32, thereby facilitating the subsequent removal of the diode;

[0060] S3: Then, the servo motor 12 is started to rotate and the synchronous pulley 13 and the connecting shaft 11 are driven to rotate through the driving pulley. The connecting shaft 11 rotates to make the multiple synchronous pulleys 17 rotate synchronously through the synchronous belt 20. At this time, the synchronous belt 20 moves and drives the two movable injection mold assemblies 6 to move at the same time. The two movable injection mold assemblies 6 are switched between the position state 1 and the position state 2 through the slot-type photoelectric switch 18 and the slot-type photoelectric switch 21.

[0061] S4: During injection molding, the upper injection mold assembly 7 and the lower injection mold assembly 9 are closed by the upper driving cylinder 35 and the lower driving cylinder 40, and then an injection mold cavity for injection molding the diode is formed by the upper mold cavity 47 and the lower mold cavity 48, and then the connection pipe 45 is connected to an external injection molding machine and the formed injection mold cavity is quantitatively injected through the injection molding pipe 44;

[0062] S5: At the same time, the elastic force generated by the compression deformation of the clamping spring 57 causes the upper injection mold assembly 7 and the lower injection mold assembly 9 to be elastically compressed when they are fitted with the movable injection mold assembly 6, and since the positions of the piston rods of the upper driving cylinder 35 and the lower driving cylinder 40 are fixed at this time, the inner cavity 56 is inflated through the air pipe 53, so that the air pressure in the inner cavity 56 is increased to a certain threshold value, so that the pressure generated by the air pressure causes the upper injection mold assembly 7 and the lower injection mold assembly 9 to fit tightly with the movable injection mold assembly 6, and effectively avoids the situation of gaps during injection molding, effectively reduces the burrs of the product after injection molding, and improves the injection molding accuracy of the product;

[0063] S6: After the injection molding is completed, the position where the diode is injected is quickly cooled down through the cooling water pipe 49, and then the upper injection mold assembly 7 and the lower injection mold assembly 9 are respectively moved outward and separated from the closed mold state of the movable injection mold assembly 6. At this time, the injection molding of the diode in the movable injection mold assembly 6 is completed and the anti-loosening component 25 is used to achieve rapid demolding.

[0064] S7: Then, the position states of the two movable injection mold assemblies 6 are switched through the driving mechanism 5 to realize rapid loading and unloading operations, thereby effectively solving the problem of pausing injection molding during loading and unloading, thereby causing waste of working hours and low production efficiency.

[0065] The electrical components mentioned in this article are all connected to an external main controller and 220V mains electricity, and the main controller can be a conventional known device for controlling a computer or the like.

[0066] In the description of this article, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, a direct connection, or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0067] In the description of this article, it should be noted that relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0068] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A diode injection molding device, comprising a frame (1), the top of the frame (1) being fixedly connected to a table (2), It is characterized in that The top of the table (2) is fixedly connected to a diode injection molding assembly (4) and a transfer assembly (3) for loading and unloading the diodes. The injection molding assembly (4) comprises a mounting frame (8), the mounting frame (8) is fixedly connected to the top of the table (2), two light rods (38) are fixedly connected to both sides of the mounting frame (8), and an upper injection mold assembly (7) and a lower injection mold assembly (9) that can be moved and opened are respectively provided between the plurality of light rods (38) and at the top and bottom of the mounting frame (8). The transfer assembly (3) comprises a mounting frame (10), the mounting frame (10) is fixedly connected to the top of the table (2), the top of the mounting frame (10) is fixedly connected to two rails (14), two transfer type injection mold assemblies (6) are slidably connected between the two rails (14) via a slide, and a driving mechanism (5) is provided on the top of the mounting frame (10) for driving the two transfer type injection mold assemblies (6) to move. The movable injection mold assembly (6) comprises a movable frame (15), the movable frame (15) being slidably connected between two rails (14) via a slide, an embedding groove (24) being provided at the top of the movable frame (15), a mold core (22) being clamped in the embedding groove (24), the mold core (22) being fixed to the embedding groove (24) via an adsorption mechanism, a guide sleeve (23) being fixedly connected at the four corners of the bottom of the movable frame (15), a plurality of positioning support grooves (28) and positioning retaining grooves (29) for positioning diodes being provided inside the mold core (22), and the positioning support grooves (28) and the positioning retaining grooves (29) being connected, a plurality of slide grooves (34) being provided on both sides of the mold core (22), and an anti-loosening component (25) being provided in the slide groove (34) for fixing the diodes in the positioning support groove (28) and the positioning retaining groove (29); The anti-loosening component (25) comprises a moving block (30), the moving block (30) being slidably connected inside a slide groove (34), one end of the moving block (30) being provided with a slot (33) for blocking the diode pole, the other end of the moving block (30) being provided with an inclined surface (31) for causing the moving block (30) to be pressed and moved along the slide groove (34), and a return spring (32) for rebounding and returning the moving block (30) being fixedly connected between the two ends of the moving block (30) and the slide groove (34); The adsorption mechanism comprises a plurality of mounting holes (27), the plurality of mounting holes (27) being respectively arranged on the bottom inner wall at the four corners of the embedding groove (24), and a magnetic block (26) capable of generating magnetic attraction for the mold core (22) being fixedly connected to each of the plurality of mounting holes (27); The driving mechanism (5) comprises a plurality of vertical bearing seats (16), wherein the plurality of vertical bearing seats (16) are respectively fixedly connected to the top four corners of the second mounting frame (10), and the plurality of vertical bearing seats (16) are rotatably connected to the second synchronous pulley (17), and the two second synchronous pulleys (17) located on the same side are connected by a synchronous belt (20), and the synchronous belt (20) is fixed to the two movable injection mold assemblies (6), wherein a connecting shaft (11) is fixedly connected between the two opposite second synchronous pulleys (17), and one side of the connecting shaft (11) is fixedly connected to the first synchronous pulley (13), and the top inner wall of the second mounting frame (10) is fixedly connected to a servo motor (12), and one end of the output shaft of the servo motor (12) is fixedly connected to a driving pulley connected to the first synchronous pulley (13) by a transmission belt, and a positioning component for positioning the moving position of the movable injection mold assembly (6) is provided between the second mounting frame (10); The positioning component comprises a slot-type photoelectric switch 1 (18) and a slot-type photoelectric switch 2 (21), wherein the slot-type photoelectric switch 1 (18) and the slot-type photoelectric switch 2 (21) are both fixedly connected to one side of the mounting frame 2 (10), and one side of the two movable injection mold assemblies (6) is fixedly connected to a sensing frame (19); The upper injection mold assembly (7) and the lower injection mold assembly (9) respectively comprise an upper mounting plate (36) and a lower mounting plate (37), the upper mounting plate (36) and the lower mounting plate (37) being slidably connected between a plurality of light rods (38) via a slide, the top outer wall and the bottom outer wall of the mounting frame (8) being fixedly connected to an upper driving cylinder (35) and a lower driving cylinder (40), respectively, one end of the piston rod of the upper driving cylinder (35) and the lower driving cylinder (40) being connected to the upper mounting plate (36) and the lower mounting plate (37) via a buffer assembly (39), one side of the upper mounting plate (36) being fixedly connected to an upper connecting frame (41), the bottom of the upper connecting frame (41) being fixedly connected to the upper driving cylinder (35) and the lower driving cylinder (40) The upper template (42) is fixedly connected to the upper template (42), and the bottom of the upper template (42) is provided with a plurality of upper mold cavities (47) and a pressing groove (46) for pressing and positioning the diode pole pins; one side of the upper connecting frame (41) is fixedly connected with a plurality of interconnected injection pipes (44) and connecting pipes (45), and the bottom end of the injection pipe (44) passes through the upper template (42) and is connected to the upper mold cavity (47); the top of the lower mounting plate (37) is fixedly connected with a lower template (51), and the top of the lower template (51) is provided with a lower mold cavity (48) corresponding to the upper mold cavity (47); and the top four corners of the lower template (51) are fixedly connected with guide columns (50) that are plugged into the guide sleeve (23); A cooling water pipe (49) is provided inside the lower mold plate (51), and both ends of the cooling water pipe (49) pass through one side of the lower mold plate (51), and a heating element (43) is provided on the circumferential outer wall of each of the plurality of injection molding pipes (44); The buffer assembly (39) comprises a connecting seat (52), which can be fixedly connected to the top of the upper mounting plate (36) and the bottom of the lower mounting plate (37), respectively. An inner cavity (56) is provided in the connecting seat (52), and a movable piston (55) is slidably connected in the inner cavity (56). The top of the movable piston (55) is fixedly connected to a connecting rod (54), and the top of the connecting rod (54) passes through the connecting seat (52) and can be fixed to one end of the piston rod of the upper driving cylinder (35) and the lower driving cylinder (40) respectively through a coupling. A compression spring (57) is provided between the inner cavity (56) and the movable piston (55), and a sealing ring in contact with the inner wall of the inner cavity (56) is provided on the outer circumference of the movable piston (55). One side of the connecting seat (52) is fixedly connected to an air pipe (53) connected to the inner cavity (56).

2. A diode injection molding method, applicable to a diode injection molding device as claimed in claim 1, It is characterized in that The following steps are involved: S1: First, the movable injection mold assembly (6) is provided with a separate mold core (22), so that the mold core (22) can be taken out and placed by a robot, and the diodes to be injected therein are replaced in batches. Since the diodes are placed in the positioning support grooves (28) and the positioning retaining grooves (29) provided in the mold core (22), the positioning support grooves (28) support the diode pole pins, and the positioning retaining grooves (29) limit the position of the diode pole pins and the injection molding position of the diodes; S2: At the same time, when the mold core (22) is installed on the shifting frame (15), the inclined surface (31) of the moving block (30) contacts and squeezes the corner of the embedding groove (24), causing the moving block (30) to be forced to move inward along the slide groove (34), and then the diode pole foot placed in the positioning retaining groove (29) is clamped and fixed through the clamping groove (33) opened at the end of the moving block (30). At this time, the reset spring (32) is shortened and generates elastic force, so that the anti-loosening component (25) can automatically release the clamping and fixing state of the diode pole foot when the mold core (22) is separated from the shifting frame (15) through the reset spring (32), thereby facilitating the subsequent removal of the diode; S3: Then, the servo motor (12) is started to rotate and the synchronous pulley 1 (13) and the connecting shaft (11) are driven to rotate through the driving pulley. The connecting shaft (11) rotates to cause the plurality of synchronous pulleys 2 (17) to rotate synchronously through the synchronous belt (20). At this time, the synchronous belt (20) moves and simultaneously drives the two movable injection mold assemblies (6) to move. The two movable injection mold assemblies (6) are switched between the position state 1 and the position state 2 through the slot-type photoelectric switch 1 (18) and the slot-type photoelectric switch 2 (21); S4: During injection molding, the upper injection mold assembly (7) and the lower injection mold assembly (9) are closed by the upper driving cylinder (35) and the lower driving cylinder (40), and then an injection mold cavity for injection molding the diode is formed by the upper mold cavity (47) and the lower mold cavity (48), and then the connection pipe (45) is connected to an external injection molding machine and a quantitative injection molding operation is performed on the formed injection mold cavity through the injection molding pipe (44); S5: At the same time, the elastic force generated by the compression deformation of the compression spring (57) causes the upper injection mold assembly (7) and the lower injection mold assembly (9) to be elastically compressed when they are fitted with the movable injection mold assembly (6). Since the positions of the piston rods of the upper driving cylinder (35) and the lower driving cylinder (40) are fixed at this time, the inner cavity (56) is inflated through the air pipe (53) to increase the air pressure in the inner cavity (56) to a certain threshold value, so that the pressure generated by the air pressure causes the upper injection mold assembly (7) and the lower injection mold assembly (9) to fit tightly with the movable injection mold assembly (6), and effectively avoids the generation of gaps during injection molding, effectively reduces the burrs of the product after injection molding, and improves the injection molding accuracy of the product; S6: After the injection molding is completed, the position where the diode is injected is quickly cooled down through the cooling water pipe (49), and then the upper injection mold assembly (7) and the lower injection mold assembly (9) are respectively moved outward and separated from the closed mold state of the movable injection mold assembly (6). At this time, the injection molding of the diode in the movable injection mold assembly (6) is completed and a quick demoulding process is achieved through the anti-loosening component (25); S7: Then, the position states of the two movable injection mold assemblies (6) are switched through the driving mechanism (5) to achieve rapid loading and unloading operations.

Images