A method for cutting a crystal in a rhombic configuration

Abstract

The present invention provides a method for cutting a rhombic configuration crystal, which relates to the technical field of artificial multifunctional crystals. Before cutting, the polarization direction of the crystal raw material is determined, and the polarization direction is marked on the crystal raw material; the cutting shape of the crystal raw material is optimized to a rhombus, and the cutting path of the crystal rhombus cutting pattern is planned; the crystal raw material is cut along the planned cutting path to form a plurality of rhombic crystals; the rhombic crystals are installed on a metal crystal bracket, and the polarization direction of the crystal is made to be consistent with the marked polarization direction. It solves the problems that the existing crystal cutting method cannot judge the polarization direction matching; a rectangular crystal cutting method with polarization direction matching is given, and the crystal material loss is relatively large. Under the same crystal loss, the heat dissipation of the crystal is not good; the adjustment range of the crystal is limited, and the adjustment efficiency is not high.

Description

Technical Field

[0001] The present invention relates to the technical field of artificial multifunctional crystals, and particularly relates to a method for cutting a rhombic configuration crystal. Background Art

[0002] Artificial crystals are an important optical material with good optical properties and stable physical properties, and are widely used in the fields of optics, lasers, optical communications, etc. In practical applications, after the artificial crystal is grown, it needs to be cut into devices according to the usage requirements before it can be used. Crystal cutting is to cut the crystal according to the required crystal cutting direction, and cut the crystal into the required size and shape to facilitate the processing of devices. In the traditional cutting method, the crystal is first measured, and then the crystal is oriented to find the cutting reference plane. On this basis, according to the usage requirements, the cutting angle and cutting position are determined. After cutting into slices, polishing and coating, and then cutting into individual small crystal devices.

[0003] And the current cutting methods for artificial crystals mainly include the following several types:

[0004] 1. Traditional cutting method: First, the crystal is measured, and then the crystal is oriented to find the cutting reference plane. On this basis, according to the usage requirements, the cutting angle and cutting position are determined. After cutting into slices, polishing and coating, and then cutting into individual small crystal devices.

[0005] 2. Laser cutting method: The crystal is cut by using a laser beam. Laser cutting has the advantages of fast cutting speed, high cutting accuracy, and small cutting loss.

[0006] 3. Mechanical cutting method: Traditional mechanical cutting tools, such as wire cutting, internal circle cutting, etc. are used to cut the crystal. The advantage of this method is that the cutting process is relatively stable and the cutting loss is small.

[0007] 4. Chemical etching cutting method: The crystal is etched and cut by using a chemical etching agent. The advantage of this method is that the cutting process is relatively simple and the cutting loss is small.

[0008] Currently, using the above-mentioned several processing methods, the cross-section of the processed crystal is square or circular, and there are the following several problems:

[0009] 1. It is impossible to judge the polarization direction matching of the crystal: The existing cutting methods cannot judge the polarization direction matching of the crystal during the cutting process, resulting in limited performance of the crystal in actual applications.

[0010] 2. The crystal material loss is relatively large: Under the same crystal loss, the existing cutting methods lead to poor heat dissipation of the crystal, affecting the service life and stability of the crystal.

[0011] 3. Limited crystal adjustment range: The existing cutting method results in a small contact area between the crystal and the crystal bracket (heat sink), limited crystal adjustment range, and low adjustment efficiency.

[0012] To solve the above problems, a rhombic configuration crystal cutting method needs to be proposed. By optimizing the crystal cutting shape, the purpose is to achieve crystal polarization direction identification, reduce crystal processing loss, increase the contact area between the crystal and the crystal bracket, and improve crystal adjustment efficiency. Summary of the Invention

[0013] To solve the above problems, the present invention proposes a rhombic configuration crystal cutting method, aiming to solve the problems that the existing crystal cutting method cannot determine the polarization direction matching of the crystal; the rectangular crystal cutting method with polarization direction matching has a large crystal material loss. Under the same crystal loss, the crystal has poor heat dissipation; the crystal adjustment range is limited and the adjustment efficiency is not high.

[0014] Based on the above purpose, the present invention provides a rhombic configuration crystal cutting method, including the following steps:

[0015] Determine the polarization direction of the crystal raw material before cutting, and mark the polarization direction on the crystal raw material;

[0016] Optimize the cutting shape of the crystal raw material into a rhombus, and plan the cutting path of the crystal rhombic cutting pattern;

[0017] Cut the crystal raw material along the planned cutting path to form a plurality of rhombic crystals;

[0018] Install the rhombic crystal on the metal crystal bracket, and make the polarization direction of the crystal consistent with the marked polarization direction.

[0019] As a further solution of the present invention, when determining the polarization direction of the crystal raw material, a polarization detection device is used to determine the polarization direction, and the polarization detection device is a polarization microscope for determining the polarization direction of the crystal.

[0020] As a further solution of the present invention, when the cutting shape of the crystal raw material is optimized into a rhombus, each acute angle of the rhombus is set to 60°, and each obtuse angle is 120°.

[0021] As a further solution of the present invention, when planning the cutting path of the crystal rhombic cutting pattern, the spacing of the crystal rhombic cutting pattern is set to d, which is the same as the side length of the square cutting and the same crystal loss.

[0022] As a further solution of the present invention, the crystal rhombic cutting pattern of the crystal is used to identify the polarization direction of the crystal raw material.

[0023] As a further solution of the present invention, when cutting the crystal raw material along the planned cutting path, a cutting machine is used for cutting and the multiple rhombic crystals after cutting are cleaned to remove the chips and impurities generated during the cutting process; wherein, the cutting machine is a laser cutting machine or a wire cutting machine.

[0024] As a further solution of the present invention, when cutting the crystal raw material along the planned cutting path, the polarization matching direction of the large crystal piece is marked, and the crystal is cut in a rhombic configuration, and the acute angle of the cut rhombic configuration is kept at 60°, and the obtuse angle is kept at 120°.

[0025] As a further solution of the present invention, the contact area formed by multiple rhombic crystals and the metal crystal bracket is increased by at least 16% compared with the contact area of a standard square-cut crystal with the same side length.

[0026] As a further solution of the present invention, the cutting contact area of the two contact surfaces of the rhombic crystal and the metal crystal bracket heat sink is 1.16 times that of a standard square-cut crystal with the same side length.

[0027] As a further solution of the present invention, the cutting contact area of the rhombic crystal increases the adjustment range of the pump light source in two directions relative to the standard square-cut crystal, and the pump light source of the rhombic crystal is a semiconductor laser or a fiber laser.

[0028] Compared with the prior art, a method for cutting a rhombic configuration crystal proposed by the present invention has the following beneficial effects:

[0029] 1. Crystal polarization direction marking: Through the rhombic cutting shape, the polarization matching direction of the crystal can be conveniently marked, avoiding secondary judgment during crystal debugging and improving the efficiency of crystal cutting.

[0030] 2. Reducing crystal processing loss: Compared with square cutting, under the same loss conditions, the contact area between the crystal and the crystal bracket (heat sink) in rhombic cutting increases by 16%, thereby improving the heat dissipation of the crystal and increasing the crystal adjustment efficiency.

[0031] 3. Increasing the contact area between the crystal and the crystal bracket (heat sink) and improving crystal heat dissipation: Rhombic cutting increases the contact area of the crystal, which is beneficial to the heat dissipation of the crystal and improves the service life and stability of the crystal.

[0032] 4. Improving crystal adjustment efficiency: Rhombic cutting makes the adjustment range of the pump light source of the crystal larger, thereby improving the efficiency of crystal adjustment.

[0033] In summary, the present invention provides a method for cutting a rhombic configuration crystal, which has the advantages of crystal polarization direction identification, reducing crystal processing loss, increasing the contact area between the crystal and the crystal holder (heat sink), and improving crystal adjustment efficiency, and is applicable to the cutting of artificial multifunctional crystals.

[0034] These aspects or other aspects of the present application will be more clearly understood in the following description of the embodiments. It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention, and those of ordinary skill in the art can obtain other embodiments based on these drawings without creative efforts.

[0036] In the figures:

[0037] Figure 1 FIG. is a cutting schematic diagram of a square cutting shape in the traditional cutting method.

[0038] Figure 2 FIG. is a cross-sectional schematic diagram of a square cutting shape in the traditional cutting method.

[0039] Figure 3 FIG. is a cutting schematic diagram of a rhombic cutting shape in the method for cutting a rhombic configuration crystal of the present invention.

[0040] Figure 4 FIG. is a cross-sectional schematic diagram of a rhombic cutting shape in the method for cutting a rhombic configuration crystal of the present invention.

[0041] Figure 5 FIG. is a schematic diagram of the polarization matching direction identification before cutting in the method for cutting a rhombic configuration crystal of the present invention.

[0042] Figure 6 FIG. is a cross-sectional schematic diagram of a rhombic cutting example in the method for cutting a rhombic configuration crystal of the present invention.

[0043] Figure 7 FIG. is a sector diagram of the contact area of a rhombic crystal in the method for cutting a rhombic configuration crystal of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0044] Next, in combination with the drawings and the specific embodiments, the present application will be further described. It should be noted that, on the premise of no conflict, the following described embodiments or technical features can be arbitrarily combined with each other to form new embodiments.

[0045] To make the objectives, technical solutions, and advantages of the present invention more clearly understood, the following further elaborates on the embodiments of the present invention in detail with reference to specific embodiments and the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0046] It should be noted that all the expressions using "first" and "second" in the embodiments of the present invention are for distinguishing two non-identical entities or non-identical parameters with the same name. It can be seen that "first" and "second" are only for the convenience of expression and should not be construed as a limitation on the embodiments of the present invention. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, device, product, or equipment that includes a series of steps or units inherently includes other steps or units.

[0047] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0048] The flowcharts shown in the accompanying drawings are only illustrative examples, and do not necessarily include all the contents and operations / steps, nor do they necessarily need to be executed in the described order. For example, some operations / steps can be decomposed, combined, or partially merged. Therefore, the actual execution order may change according to the actual situation.

[0049] After the artificial crystal is grown, it needs to be cut into devices according to the usage requirements before it can be used. Crystal cutting is to cut the crystal in the crystal cutting direction required by the processing, and cut the crystal into the required size and shape to facilitate the processing of the device.

[0050] Due to the traditional cutting method, first measure the crystal, then orient the crystal to find the cutting reference plane. On this basis, determine the cutting angle and cutting position according to the usage requirements. Cut into slices, polish and coat with a film, and then cut into individual small crystal devices. For the cutting schematic diagram of the traditional cutting method, see Figure 1 and Figure 2 as shown. When the large crystal is generally cut into usable crystal devices, the general cutting shape is square. In this way, cutting means such as wire cutting or internal circle cutting are used, and the cutting loss is small. And it is convenient to assemble the crystal on the metal crystal bracket as a heat sink.

[0051] In view of this, in order to solve the problems that the existing crystal cutting methods cannot judge the polarization direction matching of crystals; a rectangular crystal cutting method with polarization direction matching is given, and the crystal material loss is relatively large. Under the same crystal loss, the heat dissipation of the crystal is not good; the crystal adjustment range is limited and the adjustment efficiency is not high. The present invention proposes a rhombic configuration crystal cutting method and an application method.

[0052] The following will describe in detail some embodiments of the present application with reference to the drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0053] See Figure 3 and Figure 4 As shown in, the embodiments of the present invention provide a rhombic configuration crystal cutting method, which mainly includes the following steps:

[0054] Step S10: Determine the polarization direction of the crystal raw material before cutting, and mark the polarization direction on the crystal raw material;

[0055] Step S20: Optimize the cutting shape of the crystal raw material into a rhombus, and plan the cutting path of the crystal rhombus cutting pattern;

[0056] Step S30: Cut the crystal raw material along the planned cutting path to form a plurality of rhombic crystals;

[0057] Step S40: Install the rhombic crystal on the metal crystal bracket, and make the polarization direction of the crystal consistent with the marked polarization direction.

[0058] In this embodiment, when determining the polarization direction of the crystal raw material, a polarization detection device is used to determine the polarization direction, and the polarization detection device can be a polarization microscope for determining the polarization direction of the crystal. When the present invention optimizes the cutting shape of the crystal raw material into a rhombus, each acute angle of the rhombus is set to 60°, and each obtuse angle is 120°. Adopt the cutting method as shown in Figure 3 , Figure 4 and Figure 5 When planning the cutting path of the crystal rhombus cutting pattern, the spacing of the crystal rhombus cutting pattern is set to d, which is the same as the side length of the square cutting, and the crystal loss is the same. At the same time, the crystal rhombus cutting pattern of the crystal is used to identify the polarization direction of the crystal raw material, and the polarization matching direction of the large crystal piece is marked before cutting, and the best polarization direction is ensured to be the direction of the arrow shown in Figure 5 during cutting. In this way, the polarization matching direction can be identified only by relying on the shape of the rhombus. There is no need to make a secondary judgment during crystal debugging.

[0059] When using traditional cutting methods, in order to identify the polarization matching direction of the crystal, small crystal pieces are cut into rectangles, which directly leads to an increase in crystal loss. The width of the crystal is restricted by the size of the pump light and the output light beam and cannot be too small.

[0060] In this embodiment, diamond cutting is adopted. Under the same loss as square cutting, the contact area between the crystal and the crystal bracket (heat sink) is compared as Figure 6 and Figure 7 shown. Taking Figure 6 shown as an example, the crystal cutting spacing is the same at 0.55 mm. When square cutting is used, the contact side length with the heat sink is 0.55 mm. After diamond cutting, the lengths of the four sides of the diamond are:

[0061]

[0062] That is, with the same crystal loss cutting, after diamond cutting, the side length is 0.64 / 0.55 = 1.16 times the original.

[0063] See Figure 7 shown. The contact area formed by multiple diamond-shaped crystals and the metal crystal bracket is at least 16% larger than the contact area of a standard square-cut crystal with the same side length. Compared with square crystals, under the same crystal loss, the contact areas of the two contact surfaces of the diamond crystal with the heat sink are each increased by 16%. The cutting contact area of the two contact surfaces of the diamond crystal with the metal crystal bracket heat sink is 1.16 times the cutting contact area of a standard square-cut crystal with the same side length. The larger the contact area, the better the heat dissipation state of the crystal, improving the heat dissipation of the crystal.

[0064] At the same time, the cutting contact area of the diamond crystal increases the adjustment range of the pump light source in two directions compared with the standard square-cut crystal. The pump light source of the diamond crystal is a semiconductor laser or a fiber laser. Diamond cutting makes the adjustment range of the pump light source in both directions larger, improving the crystal adjustment efficiency.

[0065] Therefore, a diamond configuration crystal cutting method proposed by the present invention can conveniently identify the polarization matching direction of the crystal through the diamond cutting shape, avoiding secondary judgment during crystal debugging and improving the crystal cutting efficiency. Compared with square cutting, under the same loss conditions, the contact area between the crystal and the crystal bracket (heat sink) in diamond cutting is increased by 16%, thereby improving the heat dissipation of the crystal, increasing the crystal adjustment efficiency, and reducing the crystal processing loss.

[0066] Moreover, the contact area between the crystal and the crystal holder (heat sink) is increased, improving the heat dissipation of the crystal: the diamond cutting increases the contact area of the crystal, which is beneficial to the heat dissipation of the crystal, and improves the service life and stability of the crystal. The diamond cutting also enlarges the adjustment range of the pump light source of the crystal, thereby improving the adjustment efficiency of the crystal.

[0067] In summary, the present invention provides a diamond configuration crystal cutting method, which has the advantages of crystal polarization direction identification, reduction of crystal processing loss, increase of the contact area between the crystal and the crystal holder (heat sink), and improvement of crystal adjustment efficiency, and is applicable to the cutting of artificial multifunctional crystals.

[0068] It should be understood that, as used herein, unless the context clearly supports the exception, the singular form "a" is also intended to include the plural form. It should also be understood that the "and / or" used herein refers to any and all possible combinations of one or more of the associated listed items. The serial numbers of the disclosed embodiments of the present invention are only for description and do not represent the advantages or disadvantages of the embodiments.

[0069] Those of ordinary skill in the art should understand that: the discussion of any of the above embodiments is only exemplary, and is not intended to imply that the scope of the disclosure of the embodiments of the present invention (including the claims) is limited to these examples; under the concept of the embodiments of the present invention, the technical features between the above embodiments or different embodiments can also be combined, and there are many other variations in different aspects of the above embodiments of the present invention, which are not provided in detail for the sake of brevity. Therefore, any omission, modification, equivalent replacement, improvement, etc. made within the spirit and principle of the embodiments of the present invention shall be included in the protection scope of the embodiments of the present invention.

Claims

1. A method for cutting a rhombic configuration crystal, characterized in that, It includes the following steps: Determine the polarization direction of the crystal raw material before cutting, and mark the polarization direction on the crystal raw material; Optimize the cutting shape of the crystal raw material into a rhombus, and plan the cutting path of the crystal rhombus cutting pattern; Cut the crystal raw material along the planned cutting path to form a plurality of rhombic crystals; Mount the rhombic crystals on a metal crystal bracket, and make the polarization direction of the crystal consistent with the marked polarization direction; Among them, when the cutting shape of the crystal raw material is optimized into a rhombus, each acute angle of the rhombus is set to 60°, and each obtuse angle is 120°; when planning the cutting path of the crystal rhombus cutting pattern, the spacing of the crystal rhombus cutting pattern is set to d, which is the same as the side length of the square cutting, and the crystal loss is the same; When cutting the crystal raw material along the planned cutting path, use a cutting machine for cutting and clean the plurality of rhombic crystals after cutting to remove debris and impurities generated during the cutting process; among them, the cutting machine is a laser cutting machine or a wire cutting machine; when cutting the crystal raw material along the planned cutting path, mark the polarization matching direction of the large crystal piece, and cut the crystal in a rhombic configuration, and the acute angle of the cut rhombic configuration remains at 60°, and the obtuse angle remains at 120°.

2. The rhombic configuration crystal cutting method according to claim 1, characterized in that When determining the polarization direction of the crystal raw material, use a polarization detection device to determine the polarization direction, and the polarization detection device is a polarization microscope for determining the polarization direction of the crystal.

3. The rhombic configuration crystal cutting method according to claim 2, wherein, The crystal rhombus cutting pattern of the crystal is used to identify the polarization direction of the crystal raw material.

4. The rhombic configuration crystal cutting method according to claim 3, characterized in that, The contact area formed by the plurality of rhombic crystals and the metal crystal bracket is increased by at least 16% compared to the contact area of the standard square-cut crystal with the same side length.

5. The rhombic configuration crystal cutting method according to claim 4, characterized in that The cutting contact area of the two contact surfaces of the rhombic crystal and the heat sink of the metal crystal bracket is 1.16 times that of the cutting contact area of the standard square-cut crystal with the same side length.

6. The rhombic configuration crystal cutting method according to claim 5, characterized in that, The cutting contact area of the rhombic crystal increases the adjustment range of the pump light source in two directions compared to the standard square-cut crystal, and the pump light source of the rhombic crystal is a semiconductor laser or a fiber laser.

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