An intelligent chip packaging structure and its usage method

Abstract

The present application provides an intelligent chip packaging structure and a method for using the same, belonging to the technical field of chip packaging. It includes a fixing ring, a support assembly is installed below the fixing ring, a fixing frame is fixedly connected above the fixing ring, a top plate is fixedly arranged at the top of the fixing frame, a packaging glue storage assembly is installed on the top plate, an electric heating cylinder is installed below the packaging glue storage assembly, a discharge pipe is communicated below the electric heating cylinder, a guiding assembly is arranged on the outer side of the discharge pipe, an extrusion head is installed at the bottom of the discharge pipe, an electric push rod is installed on the inner wall of the fixing ring, and a guide rail is fixedly connected to the electric push rod. The present application can adaptively adjust the packaging shape of the chip according to the aspect ratio of different chips, and can adjust the support points at the bottom of the device according to the overall size of the chip before packaging, so as to adapt to chips with different aspect ratios for packaging.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and specifically relates to an intelligent chip packaging structure and its usage method. Background Art

[0002] In order to protect and enhance the performance of chips, chips need to be packaged. The circuits inside the chips need to be connected to the external world, but these circuits usually operate at extremely low voltages and currents. Packaging provides electrical isolation to protect the circuits from interference and electromagnetic interference. However, there are still some deficiencies in the existing packaging structures during use.

[0003] For example, the heat dissipation structure, its preparation method, chip packaging structure and chip packaging method disclosed in the publication number CN112635417A dissipate heat during packaging, but can only package chips with specific structures, cannot perform spiral packaging during the packaging process, it is difficult to ensure the integrity of packaging and the flatness of the packaging glue, cannot adaptively adjust the packaging shape of the chip according to the length-width ratio of different chips, it is difficult to adapt to different chips for packaging, the scope of application is relatively narrow, and the existing chip packaging structure cannot adjust the support points at the bottom of the device according to the overall size of the chip before packaging, and the applicability is insufficient. Summary of the Invention

[0004] In view of the problems existing in the existing packaging structure, the present invention is proposed.

[0005] To solve the above technical problems, the present invention provides the following technical solutions: An intelligent chip packaging structure includes a fixing ring. A support assembly is installed below the fixing ring. A fixing frame is fixedly connected above the fixing ring. A top plate is fixedly arranged on the top of the fixing frame. A packaging glue storage assembly is installed on the top plate. An electric heating cylinder is installed below the packaging glue storage assembly. A discharge pipe is communicated below the electric heating cylinder. A guiding assembly is arranged on the outer side of the discharge pipe. An extrusion head is installed at the bottom of the discharge pipe. An electric push rod is installed on the inner wall of the fixing ring. A guide rail is fixedly connected to the electric push rod. Connecting rods are arranged on the left and right sides of the guide rail. A first installation groove is opened in the connecting rod. A second installation groove is opened in the guide rail. An installation rod is installed in the first installation groove and the second installation groove. A motor is installed in the middle of the top plate. A rotating rod is fixedly connected to the output shaft of the motor. A connecting plate is installed below the rotating rod. An activity groove is opened in the connecting plate. The discharge pipe is slidably installed in the activity groove.

[0006] As a preferred solution of the present invention, the fixing ring, the fixing frame and the top plate are integrally formed, and the central axes of the fixing ring and the top plate are on the same straight line.

[0007] As a preferred solution of the present invention, the support components are equally angularly distributed below the fixed ring. The support components include support rods fixedly installed on the lower surface of the fixed ring. A sliding plate is slidably installed below the support rods, and a support block is fixedly arranged at the bottom of the sliding plate.

[0008] As a preferred solution of the present invention, the encapsulating glue storage component includes a housing fixedly installed on the top plate. A connecting ring is rotatably installed below the housing, and a metal hose is fixedly arranged on the connecting ring.

[0009] As a preferred solution of the present invention, rotating rings are fixedly connected to the inner and outer walls of the connecting ring, and a rotating groove for the rotating ring to rotate is opened at the bottom of the housing.

[0010] As a preferred solution of the present invention, a support plate is fixedly installed on the discharge pipe, and the diameter of the support plate is larger than the width of the movable groove.

[0011] As a preferred solution of the present invention, the guiding component includes a first guiding plate and a second guiding plate installed on the connecting rods on both sides of the guide rail. An adapter plate is fixedly arranged on the second guiding plate. The second guiding plate and the first guiding plate are slidably connected. A docking hole is opened on the adapter plate, a docking groove is opened inside the first guiding plate, and a magnetic metal rod is slidably installed in the docking hole.

[0012] As a preferred solution of the present invention, a convex block is fixedly installed on the inner wall of the first guiding plate. The convex block penetrates through the inside of the adapter plate, and the convex block and the adapter plate are slidably connected. A return spring is fixedly installed between the first guiding plate and the second guiding plate.

[0013] As a preferred solution of the present invention, the magnetic metal rod and the docking groove are mutually fitted, and the docking grooves are equally spaced inside the first guiding plate.

[0014] A usage method of an intelligent chip packaging structure includes the following steps:

[0015] S1: The overall device and the fixed ring are supported by the support components. The support positions around the bottom of the fixed ring by the support components are adjusted to adapt to chips of different sizes for packaging. The fixing frame is used to support the top plate. The preparation work is completed by pouring the encapsulating glue into the inside of the encapsulating glue storage component;

[0016] S2: The encapsulating glue will flow into the inside of the electric heating cylinder through the encapsulating glue storage component for heating and then flow into the discharge pipe and the extrusion head, and is extruded through the extrusion head to package the chip. During the packaging process, the motor drives the rotating rod and the connecting plate to rotate;

[0017] S3: During the rotation of the connecting plate, the discharge pipe will be driven to move along the spiral track of the guiding component, so as to evenly cover and fill the encapsulation glue of the chip;

[0018] S4: When encapsulating chips with different aspect ratios, according to the ratio of the length to the width of the chip, the overall structure of the guiding component is adjusted, so as to change the internal spiral track of the guiding component, so that the discharge pipe performs encapsulation work along different tracks during movement.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0020] 1. By providing a guiding component with a spiral structure, when the motor on the device drives the rotating rod and the connecting plate to rotate, the discharge pipe can be driven to move along the spiral track, so as to adapt to the encapsulation and filling of encapsulation glue for chips of different sizes, enhancing the encapsulation quality of the device, solving the defect that the existing encapsulation structure can only encapsulate chips with a specific structure and cannot perform spiral encapsulation during the encapsulation process. This encapsulation structure can ensure the integrity of the encapsulation and the flatness of the encapsulation glue.

[0021] 2. Through the electric push rod and the telescopic guiding component on the device, by extending or shortening the electric push rod and adjusting the distance between the first guiding plate and the second guiding plate at different positions, after the adjustment is completed, the magnetic metal rod is installed into the docking hole and the corresponding docking groove, so as to adjust and fix the length or width of the entire guiding component, enabling the device to adjust the spiral track structure of the guiding component to adapt to the use of chips with different aspect ratios, solving the defect that the existing encapsulation structure cannot adaptively adjust the encapsulation shape of the chip according to the aspect ratio of different chips. This device has the advantage of a wider application range.

[0022] 3. By providing the electric push rod, the guide rail and the connecting rod, the device can snap the mounting rod into the first mounting groove and the second mounting groove, so as to keep the positions of the guide rail and the connecting rod fixed, and further keep the first guiding plate or the second guiding plate in the corresponding area in a fixed state, enabling the device to extend the guiding component in different directions. Subsequently, the outer part of the guiding component can be reset by the reset spring, improving the convenience of the device during use.

[0023] 4. By providing the encapsulation glue storage component, when the discharge pipe makes a circular motion, the connecting ring and the metal hose will rotate under the shell, so as to adapt to the circular motion of the discharge pipe during circumferential encapsulation, ensuring the stability of the device during operation. Description of the Drawings

[0024] To more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below in conjunction with the drawings and detailed embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings. Among them:

[0025] Figure 1 is a schematic diagram of the overall structure of an intelligent chip packaging structure of the present invention;

[0026] Figure 2 is a schematic diagram of the bottom structure of the housing of the present invention;

[0027] Figure 3 is Figure 1 a schematic diagram of the structure at position A in

[0028] Figure 4 is a schematic diagram of the connection structure between the fixing ring and the electric push rod of the present invention;

[0029] Figure 5 is Figure 4 a schematic diagram of the structure at position B in

[0030] Figure 6 is a schematic diagram of the connection structure between the guide rail and the connecting rod of the present invention;

[0031] Figure 7 is a schematic diagram of the docking structure between the first guide plate and the connection plate of the present invention;

[0032] Figure 8 is a schematic diagram of the overall structure of the support assembly of the present invention.

[0033] Reference numerals: 1, fixing ring; 2, support assembly; 201, support rod; 202, sliding plate; 203, support block; 3, fixing frame; 4, top plate; 5, encapsulation glue storage assembly; 501, housing; 502, connection ring; 503, metal hose; 504, rotating ring; 505, rotating groove; 6, motor; 7, electric heating cylinder; 8, discharge pipe; 9, rotating rod; 10, connecting plate; 11, moving groove; 12, support plate; 13, guiding assembly; 1301, first guide plate; 1302, second guide plate; 1303, connection plate; 1304, docking hole; 1305, magnetic metal rod; 1306, docking groove; 1307, convex block; 14, return spring; 15, electric push rod; 16, guide rail; 17, connecting rod; 18, first installation groove; 19, second installation groove; 20, installation rod; 21, extrusion head. Detailed Embodiments

[0034] To make the above objects, features, and advantages of the present invention more obvious and understandable, the following detailed description of the specific embodiments of the present invention will be made in conjunction with the drawings.

[0035] Numerous specific details are set forth in the following description in order to provide a thorough understanding of the present invention. However, the present invention may be practiced in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0036] Secondly, the present invention will be described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views showing the device structure will be enlarged locally out of proportion, and the schematic diagrams are only examples and should not limit the scope of protection of the present invention herein. In addition, in actual production, three-dimensional spatial dimensions of length, width, and depth should be included.

[0037] Embodiment

[0038] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0039] As Figures 1 - 8As shown in the figure, an intelligent chip packaging structure includes a fixing ring 1. A support assembly 2 is installed below the fixing ring 1. A fixing frame 3 is fixedly connected above the fixing ring 1. A top plate 4 is fixedly arranged at the top of the fixing frame 3. The fixing frame 3 is used to support the top plate 4. The fixing ring 1 and the support assembly 2 are used to support the whole device. The support assembly 2 can adjust its own support position to adapt to the placement of chips of different sizes. An encapsulation glue storage assembly 5 is installed on the top plate 4. An electric heating cylinder 7 is installed below the encapsulation glue storage assembly 5. A discharge pipe 8 is communicated below the electric heating cylinder 7. The encapsulation glue storage assembly 5 can introduce the encapsulation glue into the electric heating cylinder 7 for heating and flow into the inside of the discharge pipe 8. A guiding assembly 13 is arranged outside the discharge pipe 8. An extrusion head 21 is installed at the bottom of the discharge pipe 8. Finally, the encapsulation glue is extruded through the extrusion head 21 for the encapsulation work. An electric push rod 15 is installed on the inner wall of the fixing ring 1. A guide rail 16 is fixedly connected to the electric push rod 15. Connecting rods 17 are arranged on the left and right sides of the guide rail 16. A first installation groove 18 is opened in the connecting rod 17. A second installation groove 19 is opened in the guide rail 16. An installation rod 20 is installed in the first installation groove 18 and the second installation groove 19. After the installation rod 20 is installed into the corresponding first installation groove 18 and the second installation groove 19, the connecting rod 17 and the guide rail 16 at this position are in a fixed state, so that the device can fix a local area outside the guiding assembly 13. A motor 6 is installed in the middle of the top plate 4. A rotating rod 9 is fixedly connected to the output shaft of the motor 6. A connecting plate 10 is installed below the rotating rod 9. A moving groove 11 is opened in the connecting plate 10. The discharge pipe 8 is slidably installed in the moving groove 11. The motor 6 can drive the rotating rod 9 and the connecting plate 10 to rotate. When the connecting plate 10 rotates, the discharge pipe 8 can move along the spiral guiding track of the guiding assembly 13. And this device can also adapt to the encapsulation work of chips with different lengths and widths by adjusting the overall length-width ratio of the guiding assembly 13.

[0040] In this example, the fixing ring 1, the fixing frame 3 and the top plate 4 are integrally formed. The central axes of the fixing ring 1 and the top plate 4 are on the same straight line, ensuring the overall stability of the device and enabling the device to be stably supported.

[0041] In this example, the support assemblies 2 are evenly distributed at equal angles below the fixing ring 1. The support assembly 2 includes a support rod 201 fixedly installed on the lower surface of the fixing ring 1. A sliding plate 202 is slidably installed below the support rod 201. A support block 203 is fixedly arranged at the bottom of the sliding plate 202. The support block 203 and the sliding plate 202 can slide below the support rod 201, so as to change the range where the chip can be placed at the bottom of the device, enabling the device to adapt to the placement and injection encapsulation of chips of different sizes.

[0042] In this example, the encapsulant storage component 5 includes a housing 501 fixedly installed on the top plate 4. A connecting ring 502 is rotatably installed below the housing 501. A metal hose 503 is fixedly arranged on the connecting ring 502. The metal hose 503 can be bent at a small angle to adapt to the spiral movement trajectory during subsequent encapsulation.

[0043] In this example, rotating rings 504 are fixedly connected to the inner and outer walls of the connecting ring 502. A rotating groove 505 for the rotating ring 504 to rotate is formed at the bottom of the housing 501. The rotating groove 505 and the rotating ring 504 keep the connecting ring 502 in a closed state while rotating, ensuring the stability of the device during operation.

[0044] In this example, a support plate 12 is fixedly installed on the discharge pipe 8. The diameter of the support plate 12 is larger than the width of the movable groove 11, so that the support plate 12 supports the discharge pipe 8, preventing the discharge pipe 8 from falling below the device and enabling the device to stably extrude the encapsulant.

[0045] In this example, the guiding component 13 includes a first guiding plate 1301 and a second guiding plate 1302 installed on the connecting rods 17 on both sides of the guide rail 16. An adapter plate 1303 is fixedly arranged on the second guiding plate 1302. The second guiding plate 1302 and the first guiding plate 1301 are slidably connected. A docking hole 1304 is formed in the adapter plate 1303. A magnetic metal rod 1305 is slidably installed in the docking hole 1304. The distance between the first guiding plate 1301 and the second guiding plate 1302 can be adjusted by sliding the adapter plate 1303, and the overall structure of the guiding component 13 can be changed during the adjustment process, enabling the device to adapt to chips with different aspect ratios for encapsulation work.

[0046] In this example, a convex block 1307 is fixedly installed on the inner wall of the first guiding plate 1301. The convex block 1307 penetrates through the interior of the adapter plate 1303, and the convex block 1307 and the adapter plate 1303 are slidably connected. The convex block 1307 ensures that the adapter plate 1303 can slide smoothly. A return spring 14 is fixedly installed between the first guiding plate 1301 and the second guiding plate 1302, and the return spring 14 facilitates the subsequent reset of the first guiding plate 1301 and the second guiding plate 1302 on the outside of the device.

[0047] In this example, the magnetic metal rod 1305 and the docking groove 1306 are in mutual contact. The docking grooves 1306 are equally spaced inside the first guiding plate 1301. The equally spaced docking grooves 1306 provide a wider adjustable range for the first guiding plate 1301. Subsequently, the magnetic metal rod 1305 can be sucked out of the device by an external magnet for position switching work.

[0048] It should be noted that the present invention is an intelligent chip packaging structure and its usage method. First, as shown in Figure 1 and Figures 4 - 8 , the overall device and the fixing ring 1 are supported by the support assembly 2. The support positions around the bottom of the fixing ring 1 by the support assembly 2 are adjusted to adapt to chips of different sizes for packaging. During the adjustment process, the support block 203 and the skateboard 202 below the sliding support rod 201 can be slid, so as to change the range where chips can be placed at the bottom of the device, thus adapting to chips of different sizes for placement and injection molding packaging work. The fixing frame 3 is used to support the top plate 4. The preparation work is completed by pouring the packaging glue into the interior of the packaging glue storage assembly 5. The packaging glue will flow into the interior of the metal hose 503 through the outer shell 501 on the packaging glue storage assembly 5, and then flow into the interior of the electric heating cylinder 7, be heated and then flow into the discharge pipe 8 and the extrusion head 21, and be extruded through the extrusion head 21 to package the chip. During the packaging process, the motor 6 drives the rotating rod 9 and the connecting plate 10 to rotate. During the rotation of the connecting plate 10, the discharge pipe 8 can perform spiral packaging injection work on the position where the chip needs to be packaged along the spiral track composed of the first guide plate 1301 and the second guide plate 1302 on the guide assembly 13, so as to ensure that the packaging glue can be evenly filled on the chip. The device can be installed into the first installation groove 18 and the second installation groove 19 on the first guide plate 1301 or the second guide plate 1302 by the installation rod 20, so that the connecting rod 17 on the first guide plate 1301 or the second guide plate 1302 is in a clamped state with the guide rail 16 through the installation rod 20, thus changing the extending or contracting direction outside the guide assembly 13 when the electric push rod 15 expands and contracts.

[0049] As shown in Figures 1 - 7 , during the rotation of the connecting plate 10, it will drive the discharge pipe 8 to move along the spiral track of the guide assembly 13, so as to evenly cover and fill the packaging glue of the chip. During the circular motion of the discharge pipe 8, it will drive the metal hose 503 and the connecting ring 502 to rotate below the outer shell 501, and the rotating ring 504 rotates inside the rotating groove 505, thus ensuring the overall sealing effect of the device. By sliding the connecting plate 1303, the distance between the first guide plate 1301 and the second guide plate 1302 can be adjusted. The convex block 1307 can ensure the smooth sliding of the connecting plate 1303. After adjusting the positions of the first guide plate 1301 and the second guide plate 1302, the magnetic metal rod 1305 can be installed into the docking hole 1304 and the corresponding docking groove 1306, so that the aspect ratio of the guide assembly 13 remains fixed after the adjustment. The discharge pipe 8 performs packaging work along different tracks during the movement. By changing the overall structure of the guide assembly 13, the device can adapt to chips with different aspect ratios for packaging work.

[0050] Although the present invention has been described above with reference to the embodiments, various modifications thereof can be made and components thereof can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed by the present invention can be combined with each other in any way, and the exhaustive description of these combinations is not given in this specification only for the sake of saving space and resources. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A smart chip packaging structure, comprising a fixing ring (1), characterized in that: A support assembly (2) is installed below the fixing ring (1), a fixing frame (3) is fixedly connected above the fixing ring (1), a top plate (4) is fixedly arranged on the top of the fixing frame (3), a packaging glue storage assembly (5) is installed on the top plate (4), an electric heating cylinder (7) is installed below the packaging glue storage assembly (5), a discharge pipe (8) is connected below the electric heating cylinder (7), a guide assembly (13) is arranged on the outside of the discharge pipe (8), an extrusion head (21) is installed at the bottom of the discharge pipe (8), an electric push rod (15) is installed on the inner wall of the fixing ring (1), and a guide assembly (13) is arranged on the upper surface of the electric push rod (15). A guide rail (16) is fixedly connected, and connecting rods (17) are arranged on the left and right sides of the guide rail (16), and a first mounting groove (18) is opened in the connecting rod (17), and a second mounting groove (19) is opened on the guide rail (16), and mounting rods (20) are installed in the first mounting groove (18) and the second mounting groove (19), and a motor (6) is installed in the middle of the top plate (4), and a rotating rod (9) is fixedly connected to the output shaft of the motor (6), and a connecting plate (10) is installed below the rotating rod (9), and a movable groove (11) is opened on the connecting plate (10), and the discharge pipe (8) is slidably installed in the movable groove (11); The support components (2) are distributed at equal angles below the fixing ring (1), and the support components (2) include a support rod (201) fixedly mounted on the lower surface of the fixing ring (1), a slide plate (202) is slidably mounted below the support rod (201), and a support block (203) is fixedly arranged at the bottom of the slide plate (202); The guide assembly (13) comprises a first guide plate (1301) and a second guide plate (1302) mounted on connecting rods (17) on both sides of the guide rail (16); a connecting plate (1303) is fixedly arranged on the second guide plate (1302); the second guide plate (1302) and the first guide plate (1301) are slidably connected; a docking hole (1304) is provided on the connecting plate (1303); a docking groove (1306) is provided inside the first guide plate (1301); a magnetic metal rod (1305) is slidably installed in the docking hole (1304).

2. The smart chip packaging structure according to claim 1, characterized in that: The fixing ring (1), the fixing frame (3) and the top plate (4) are integrally formed, and the central axes of the fixing ring (1) and the top plate (4) are on the same straight line.

3. The smart chip packaging structure according to claim 1, characterized in that: The packaging glue storage assembly (5) comprises a shell (501) fixedly mounted on the top plate (4), a connecting ring (502) is rotatably mounted below the shell (501), and a metal hose (503) is fixedly arranged on the connecting ring (502).

4. The smart chip packaging structure according to claim 3, characterized in that: A rotating ring (504) is fixedly connected to the inner and outer walls of the connecting ring (502), and a rotating groove (505) for the rotating ring (504) to rotate is provided at the bottom of the housing (501).

5. The smart chip packaging structure according to claim 1, characterized in that: A support plate (12) is fixedly mounted on the discharge pipe (8), and the diameter of the support plate (12) is greater than the width of the movable groove (11).

6. The smart chip packaging structure according to claim 4, characterized in that: A protrusion (1307) is fixedly installed on the inner wall of the first guide plate (1301), and the protrusion (1307) passes through the interior of the connecting plate (1303). The protrusion (1307) and the connecting plate (1303) are slidably connected, and a return spring (14) is fixedly installed between the first guide plate (1301) and the second guide plate (1302).

7. The smart chip packaging structure according to claim 1, characterized in that: The magnetic metal rod (1305) and the docking groove (1306) fit each other, and the docking grooves (1306) are distributed at equal intervals inside the first guide plate (1301).

8. A method for using a smart chip packaging structure, using the smart chip packaging structure according to claim 1, characterized in that: The following steps are involved: S1: The entire device and the fixing ring (1) are supported by the support component (2). The support component (2) adjusts the support position around the bottom of the fixing ring (1) to accommodate the packaging of chips of different sizes. The fixing frame (3) is used to support the top plate (4). The preparation work is completed by pouring the packaging glue into the inside of the packaging glue storage component (5); S2: The encapsulating glue flows into the interior of the electric heating cylinder (7) through the encapsulating glue storage component (5) to be heated and flows into the discharge pipe (8) and the extrusion head (21), and is extruded through the extrusion head (21) to encapsulate the chip. During the encapsulation process, the motor (6) drives the rotating rod (9) and the connecting plate (10) to rotate; S3: During the rotation process, the connecting plate (10) drives the discharge pipe (8) to move along the spiral track of the guide component (13), thereby evenly covering and filling the chip packaging glue; S4: When packaging chips with different aspect ratios, the overall structure of the guide component (13) is adjusted according to the ratio of the length and width of the chip, thereby changing the internal spiral trajectory of the guide component (13) so that the discharge tube (8) performs packaging work along different trajectories during the movement.

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