A loading and unloading device and epitaxial equipment

Abstract

The embodiment of the present invention provides a loading and unloading device and epitaxial equipment, wherein the loading and unloading device includes a main chamber, a storage structure, a wafer taking and placing mechanism and a lifting mechanism; the main chamber has a first opening and a second opening; the first opening is used to place a substrate into the main chamber or take out an epitaxial wafer from the main chamber; the second opening is used to communicate with the transmission chamber; the storage structure is fixedly arranged in the main chamber and located at the first opening, for storing substrates and / or epitaxial wafers, and the storage structure has a plurality of storage positions arranged in sequence along its height direction; the lifting mechanism is arranged in the main chamber, for driving the wafer taking and placing mechanism to rise or fall in the main chamber; the wafer taking and placing mechanism is arranged in the main chamber, for cooperating with the lifting mechanism, taking out the substrate from the storage structure, and transporting it to the outside of the main chamber through the second opening, and transporting the epitaxial wafer transported from the transmission chamber to the storage structure through the second opening for storage. The loading and unloading device of the embodiment of the present application has a high degree of automation.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a loading and unloading device and epitaxial equipment. Background Art

[0002] With the rapid development of the semiconductor industry, the demand for epitaxial wafers has gradually increased. Epitaxial wafers are usually produced using a silicon carbide epitaxial furnace, which includes a reaction chamber for growing epitaxial layers and a transmission cavity located at the opening of the reaction chamber. In the related art, after the silicon carbide epitaxial furnace completes the production of each epitaxial wafer, an operator needs to be arranged to take away the silicon carbide epitaxial wafer and put a new silicon carbide substrate in before the next epitaxial wafer can be produced. The operation continuity is poor and the degree of automation is low, which leads to low production efficiency. Summary of the invention

[0003] The purpose of the embodiment of the present invention is to provide a loading and unloading device and an epitaxial device to improve the continuity of the epitaxial wafer production process, thereby improving the production efficiency. The specific technical solution is as follows:

[0004] The embodiment of the first aspect of the present application proposes a loading and unloading device for loading and unloading a transfer chamber of an epitaxial device, the loading and unloading device comprising a main chamber, a storage structure, a wafer taking and placing mechanism and a lifting mechanism; the main chamber has a first opening arranged on its side wall and a second opening arranged on its top wall; the first opening is used to place a substrate into the main chamber or take out an epitaxial wafer from the main chamber; the second opening is used to communicate with the transfer chamber; the storage structure is fixedly arranged in the main chamber and located at the first opening, for storing the substrate and / or the epitaxial wafer, and the storage structure has a plurality of storage positions arranged in sequence along its height direction; the lifting mechanism is arranged in the main chamber, for driving the wafer taking and placing mechanism to rise or fall in the main chamber; the wafer taking and placing mechanism is arranged in the main chamber, for cooperating with the lifting mechanism to take out the substrate from the storage structure and transport it to the outside of the main chamber through the second opening, and the epitaxial wafer transported from the transfer chamber is transported to the storage structure through the second opening for storage.

[0005] In some embodiments of the present application, the loading and unloading device further includes: a sample feeding chamber;

[0006] The injection chamber is fixedly arranged at the second opening;

[0007] An injection cavity is formed inside the injection chamber, one end of the injection cavity is communicated with the transmission cavity, and the other end of the injection cavity is communicated with the main cavity through the second opening.

[0008] In some embodiments of the present application, the lifting mechanism includes: a power device, a synchronization assembly, at least one lead screw and at least one guide rod;

[0009] The lead screw extends in a vertical direction, and its two ends are rotatably connected to the top and bottom ends in the main chamber;

[0010] The guide rod is parallel to the lead screw and spaced apart, and both ends of the guide rod are fixedly connected to the top and bottom ends in the main chamber;

[0011] The synchronous assembly is connected to the power device and the lead screw respectively; the power device drives the lead screw to rotate through the synchronous assembly;

[0012] The sheet taking and placing mechanism is rotatably connected to the lead screw and slidably connected to the guide rod; the lead screw rotates to drive the sheet taking and placing mechanism to rise or fall.

[0013] In some embodiments of the present application, the sheet picking and placing mechanism includes: a horizontal transport component, a vertical transport component, and a fixing component;

[0014] The horizontal transport assembly and the vertical transport assembly are respectively fixedly connected to the fixed assembly, and the fixed assembly is slidably connected to the guide rod and rotatably connected to the lead screw;

[0015] The horizontal transport assembly includes a horizontal electric cylinder and a first bearing member; the first bearing member is connected to the horizontal electric cylinder; the horizontal electric cylinder drives the first bearing member to move in a horizontal direction;

[0016] The vertical transport assembly includes a vertical electric cylinder and a second carrier; the second carrier is connected to the vertical electric cylinder; the vertical electric cylinder drives the second carrier to move in a vertical direction to remove the substrate from the first carrier, or place the epitaxial wafer on the first carrier.

[0017] In some embodiments of the present application, the horizontal electric cylinder includes: a horizontal piston rod extending in a horizontal direction;

[0018] The first bearing member is a fork; one end of the fork is fixedly connected to the free end of the horizontal piston rod, and the other end has two insert teeth spaced apart in the horizontal direction;

[0019] The vertical electric cylinder comprises: a vertical piston rod extending in a vertical direction;

[0020] The second bearing member includes: a first tray base; the bottom surface of the first tray base is fixedly connected to the free end of the vertical piston rod; the orthographic projection of the second bearing member on the bottom wall of the main chamber is located between the orthographic projections of the two inserts on the bottom wall of the main chamber.

[0021] In some embodiments of the present application, the fixing assembly includes: a vertical electric cylinder mounting seat and a horizontal electric cylinder mounting seat;

[0022] The vertical electric cylinder mounting seat is provided with a first connecting hole for the guide rod to pass through and a first lead screw connecting hole for the lead screw to pass through; the vertical electric cylinder is fixedly arranged below the vertical electric cylinder mounting seat; the vertical electric cylinder mounting seat is provided with a first through hole for the vertical piston rod to pass through; the second bearing member is located above the vertical electric cylinder mounting seat;

[0023] The horizontal electric cylinder mounting seat is provided with a second connecting hole for the guide rod to pass through and a second lead screw connecting hole for the lead screw to pass through; the horizontal electric cylinder is fixedly connected to the horizontal electric cylinder mounting seat; the horizontal electric cylinder mounting seat is provided with a second through hole for the horizontal piston rod to pass through; the horizontal electric cylinder and the first bearing member are respectively located on both sides of the horizontal electric cylinder mounting seat.

[0024] In some embodiments of the present application, the power device is fixedly connected to the bottom wall of the main chamber, the power device is a reduction motor, and the output end of the reduction motor is spaced apart and arranged in parallel with the lower end of the lead screw;

[0025] The synchronous assembly includes: a synchronous belt and two synchronous pulleys; the two synchronous pulleys are fixedly connected to the output end of the reduction motor and the lower end of the lead screw respectively; the synchronous belt is arranged outside the two synchronous pulleys and is adapted to the two synchronous pulleys;

[0026] An upper sleeve is provided at the upper end of the lead screw, and a lower sleeve is provided at the lower end; the synchronous pulley is located between the upper sleeve and the lower sleeve, and the upper sleeve and the lower sleeve are both fixedly connected to the main chamber and rotatably connected to the lead screw.

[0027] In some embodiments of the present application, the storage structure includes: four support columns and a plurality of second tray bases;

[0028] The four support columns all extend in the vertical direction, are arranged in parallel and at intervals; both ends of the support columns are fixedly connected to the main chamber;

[0029] Four mounting holes are arranged at the edge of each of the second tray bases; the four supporting columns are arranged in the four mounting holes in a one-to-one correspondence;

[0030] The plurality of second tray bases are arranged in parallel and at intervals along the vertical direction to form the plurality of storage locations;

[0031] The multiple storage locations all have a first access opening arranged toward the wafer access mechanism, and a second access opening arranged toward the first opening; the first access opening is for the first carrier to take out the substrate from the storage location or place the epitaxial wafer into the storage location; the second access opening is for placing the substrate into the storage location or taking out the epitaxial wafer from the storage location.

[0032] In some embodiments of the present application, a main chamber door is provided at the first opening; a gate valve is provided between the injection chamber and the transmission chamber so that the main chamber and the injection chamber form a sealed space;

[0033] The loading and unloading device further comprises: a purge device, a gas recovery device and a controller arranged outside the main chamber;

[0034] The purge device includes an air source, an air inlet pipe and a plurality of air inlet joints; the main chamber door is provided with a plurality of air inlet holes, the plurality of air inlet joints are fixedly connected to the main chamber door and are arranged one by one corresponding to the plurality of air inlet holes; the two ends of the air inlet pipe are respectively connected to the plurality of air inlet joints and the air source;

[0035] The main chamber is provided with an exhaust hole; the gas recovery device is connected with the interior of the main chamber through the exhaust hole;

[0036] The controller is electrically connected to the sheet taking and placing mechanism and the lifting mechanism.

[0037] An embodiment of the second aspect of the present application provides an epitaxial device, including a loading and unloading device, a transmission chamber, and a reaction chamber according to any embodiment of the first aspect;

[0038] The reaction chamber is used to produce the epitaxial wafer;

[0039] The transmission chamber is located between the loading and unloading device and the reaction chamber; a robot is arranged in the transmission chamber, and the robot is used to transport the substrate or the epitaxial wafer between the loading and unloading device and the reaction chamber.

[0040] Beneficial effects of the embodiments of the present invention:

[0041] The loading and unloading device of the embodiment of the present application includes a main chamber, a storage structure, a wafer picking and placing mechanism and a lifting mechanism. Since the storage structure has multiple storage positions, multiple substrates can be placed in the storage structure for storage through the first opening; during the production process, the wafer picking and placing mechanism cooperates with the lifting mechanism to take out a substrate from a storage position of the storage structure and transport it to the outside of the main chamber through the second opening so that it can subsequently enter the reaction chamber through the transmission chamber; the substrate grows an epitaxial layer in the reaction chamber to form an epitaxial wafer, and the epitaxial wafer is transported back to the second opening through the transmission chamber, and the wafer picking and placing mechanism cooperates with the lifting mechanism to transport the epitaxial wafer through the second opening to a storage position of the storage structure for storage, and then a substrate is taken out from another storage position of the storage structure, and the above steps are repeated to produce the next epitaxial wafer until all the substrates located in the main chamber are produced. During this period, no manual loading and unloading is required, and the operation continuity is high. The epitaxial equipment can operate continuously and automatically, and multiple epitaxial wafers can be produced continuously, with a high degree of automation, thereby improving production efficiency and reducing labor cost consumption.

[0042] The epitaxial equipment of the embodiment of the present application includes the loading and unloading device described in any of the above embodiments. During the production process, the wafer picking and placing mechanism cooperates with the lifting mechanism to take out a substrate from a storage position of the storage structure and transport it to the outside of the main chamber through the second opening so that it can subsequently enter the reaction chamber through the transmission chamber; the substrate grows an epitaxial layer in the reaction chamber to form an epitaxial wafer, and the epitaxial wafer is transported back to the second opening through the transmission chamber. The wafer picking and placing mechanism cooperates with the lifting mechanism to transport the epitaxial wafer to a storage position of the storage structure through the second opening for storage, and then a substrate is taken out from another storage position of the storage structure, and the above steps are repeated to produce the next epitaxial wafer until all the substrates in the main chamber are produced. During this period, no manual loading and unloading is required, and the operation continuity is high. The epitaxial equipment can operate continuously and automatically, and can continuously produce multiple epitaxial wafers with a high degree of automation, thereby improving production efficiency and reducing labor cost consumption.

[0043] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other embodiments can also be obtained based on these drawings.

[0045] Figure 1 A schematic diagram of the structure of an epitaxial device according to an embodiment of the present application;

[0046] Figure 2 for Figure 1 Side view of

[0047] Figure 3 for Figure 1 A top view of

[0048] Figure 4 This is a schematic diagram of the structure of the loading and unloading device of the embodiment of the present application;

[0049] Figure 5 for Figure 4 Schematic diagram of the partial decomposition structure;

[0050] Figure 6 for Figure 4 The main view;

[0051] Figure 7 for Figure 4 A top view of

[0052] Figure 8 for Figure 4 Right view of;

[0053] Fig. 9 for Figure 4 Left view of

[0054] Fig.10 A diagram showing the connection relationship between the lead screw, the synchronization assembly and the power device in the embodiment of the present application;

[0055] Fig.11 for Fig.10 Schematic diagram of the decomposition structure;

[0056] Fig.12 for Fig.10 The main view;

[0057] Fig.13 It is a schematic diagram of the installation of the lifting mechanism and the sheet taking and placing mechanism in the embodiment of the present application;

[0058] Fig.14 for Fig.13 Rear view of

[0059] Fig.15 for Fig.13 Side view of

[0060] Fig.16 for Fig.13 A top view of

[0061] Fig.17 It is a schematic diagram of the exploded structure of the sheet taking and placing mechanism in the embodiment of the present application;

[0062] Fig.18 for Fig.17 A schematic diagram of the structure of the fixed components in FIG.

[0063] Fig.19 It is a front view of the sheet taking and placing mechanism in the embodiment of the present application;

[0064] Fig. 20 for Fig.19 AA section view;

[0065] Fig.21 for Fig.19 A top view of

[0066] Fig. 22 A schematic diagram of the storage structure in an embodiment of the present application;

[0067] Fig.23 for Fig. 22 Schematic diagram of the partial decomposition structure;

[0068] Fig.24 for Fig. 22 The main view;

[0069] Fig.25 for Fig. 22 Side view of

[0070] Fig.26 for Fig. 22 A top view of

[0071] Fig. 27 It is a schematic diagram of the coordination between the sheet taking and placing mechanism and the storage structure in the embodiment of the present application;

[0072] Fig.28 for Fig. 27 A top view of

[0073] Fig.29 for Fig. 27 BB cross-sectional view;

[0074] Fig.30 This is a schematic diagram of the working process of the loading and unloading device of the embodiment of the present application (steps 1 to 3);

[0075] Fig.31 This is a schematic diagram of the working process of the loading and unloading device of an embodiment of the present application (steps 4 to 6).

[0076] Description of reference numerals:

[0077] Loading and unloading device 10; transmission chamber 20; transmission chamber inlet 21; transmission chamber outlet 22; manipulator 30; graphite tray 60; gate valve 70; main chamber 100; first opening 110; second opening 120; main chamber door 130; exhaust hole 131; storage structure 200; storage position 201; first access opening 2011; second access opening 2012; support column 210; second tray base 220; mounting hole 221; hollow structure 222; second tray Plate 230; second tray fixing screw 240; height spacer 250; pick-up and placement mechanism 300; horizontal transport assembly 310; horizontal electric cylinder 311; horizontal piston rod 3111; first bearing member 312; insert gear 3121; vertical transport assembly 320; vertical electric cylinder 321; vertical piston rod 3211; second bearing member 322; first tray base 3221; first tray 3222; first tray fixing screw 3323; fixing assembly 330; hollow part 3301; vertical electric cylinder mounting seat 331; first connecting hole 3311; first lead screw connecting hole 3312; first through hole 3313; lead screw nut mounting hole 3314; fourth connecting hole 3315; horizontal electric cylinder mounting seat 332; horizontal section 3321; vertical section 3322; second connecting hole 3323; second lead screw connecting hole 3324; second through hole 3325; fifth connecting hole 3326; lifting mechanism 400; power equipment 410; reduction motor 41 1; output end 4111; synchronization assembly 420; synchronization belt 421; synchronization pulley 422; lead screw 430; lead screw shaft 431; lead screw nut 432; third connecting hole 4321; guide rod 440; upper sleeve 450; lower sleeve 460; mounting plate 470; injection chamber 500; injection cavity 501; observation window 510; purge device 600; air inlet pipe 620; air inlet connector 630; gas collecting box 640; gas recovery device 700; exhaust pipe 710. DETAILED DESCRIPTION

[0078] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field based on this application belong to the scope of protection of the present invention.

[0079] In the related art, epitaxial wafers are usually produced using a silicon carbide epitaxial furnace. After each epitaxial wafer is produced, an operator needs to be arranged to take out the silicon carbide epitaxial wafer and put a new silicon carbide substrate in before the next epitaxial wafer can be produced. The operation continuity is poor and the automation level is low, which leads to low production efficiency. In order to solve the above technical problems, the present application provides a loading and unloading device 10 and an epitaxial device.

[0080] like Figures 1 to 3 As shown, Figure 1 is a schematic diagram of the structure of the epitaxial device of an embodiment of the present application, Figure 2 for Figure 1 Side view of Figure 3 for Figure 1 The embodiment of the present application provides an epitaxial device, which includes a loading and unloading device 10, a transmission chamber 20 and a reaction chamber (not shown in the figure); the reaction chamber is used to produce epitaxial wafers; the transmission chamber 20 is located between the loading and unloading device 10 and the reaction chamber; a manipulator 30 is arranged in the transmission chamber 20, and the manipulator 30 is used to transport substrates or epitaxial wafers between the loading and unloading device 10 and the reaction chamber. Specifically, the loading and unloading device 10 can be used to store substrates and / or epitaxial wafers, such as Figure 3 As shown, the transfer chamber inlet 21 is connected to the loading and unloading device 10, and the transfer chamber outlet 22 is used to connect with the reaction chamber. During the production process, the robot 30 enters the loading and unloading device 10 to take away the substrate, and enters the reaction chamber through the transfer chamber 20. The substrate grows an epitaxial layer in the reaction chamber to form an epitaxial wafer. Then, the robot 30 enters the reaction chamber to take away the epitaxial wafer, and enters the loading and unloading device 10 through the transfer chamber 20, cooperates with the loading and unloading device 10 to complete the storage of the epitaxial wafer, and takes away a substrate again for the next processing.

[0081] The structure and operation principle of the loading and unloading device 10 in the epitaxial equipment of the embodiment of the present application are described in detail below.

[0082] The present application embodiment proposes a loading and unloading device 10, such as Figures 3 to 5 As shown, Figure 4 This is a schematic diagram of the structure of the loading and unloading device 10 according to an embodiment of the present application. Figure 5 for Figure 4Schematic diagram of a partially exploded structure, the loading and unloading device 10 is used to load and unload the transmission chamber 20 of the epitaxial device, and the loading and unloading device 10 includes a main chamber 100, a storage structure 200, a wafer loading and unloading mechanism 300 and a lifting mechanism 400; the main chamber 100 has a first opening 110 arranged on its side wall and a second opening 120 arranged on its top wall; the first opening 110 is used to place a substrate into the main chamber 100 or take out an epitaxial wafer from the main chamber 100; the second opening 120 is used to communicate with the transmission chamber 20; the storage structure 200 is fixedly arranged in the main chamber 100 and is located at the first opening The storage structure 200 has a plurality of storage positions 201 arranged in sequence along its height direction at the opening 110; the lifting mechanism 400 is arranged in the main chamber 100, and is used to drive the wafer taking and placing mechanism 300 to rise or fall in the main chamber 100; the wafer taking and placing mechanism 300 is arranged in the main chamber 100, and is used to cooperate with the lifting mechanism 400 to take out the substrate from the storage structure 200 and transport it to the outside of the main chamber 100 through the second opening 120, and to transport the epitaxial wafer transported from the transfer cavity 20 to the storage structure 200 through the second opening 120 for storage. Figures 6 to 9 The structure of the loading and unloading device 10 of the embodiment of the present application is shown from multiple perspectives. Figure 6 for Figure 4 The main view, Figure 7 for Figure 4 A top view of Figure 8 for Figure 4 Right view of Fig. 9 for Figure 4 Left view of .

[0083] The loading and unloading device 10 of the embodiment of the present application includes a main chamber 100, a storage structure 200, a wafer pick-up and placement mechanism 300 and a lifting mechanism 400. Since the storage structure 200 has multiple storage positions 201, multiple substrates can be placed in the storage structure 200 for storage through the first opening 110; during the production process, the wafer pick-up and placement mechanism 300 cooperates with the lifting mechanism 400 to take out a substrate from a storage position 201 of the storage structure 200, and transports it to the outside of the main chamber 100 through the second opening 120, so that it can subsequently enter the reaction chamber through the transmission chamber 20; the substrate grows an epitaxial layer in the reaction chamber to form an epitaxial wafer, and the epitaxial wafer The epitaxial wafer is transported back to the second opening 120 through the transfer cavity 20; the wafer placement mechanism 300 cooperates with the lifting mechanism 400 to transport the epitaxial wafer through the second opening 120 to a storage position 201 of the storage structure 200 for storage, and then a substrate is taken out from another storage position 201 of the storage structure 200, and the above steps are repeated to produce the next epitaxial wafer until all the substrates located in the main chamber 100 are produced. During this period, no manual loading and unloading is required, and the operation continuity is high. The epitaxial equipment can operate continuously and automatically, and can continuously produce multiple epitaxial wafers with a high degree of automation, thereby improving production efficiency and reducing labor cost consumption.

[0084] It is understandable that, in order to protect the substrate and epitaxial wafer, the substrate and epitaxial wafer can be always placed in the graphite tray 60, and each time the material is loaded and unloaded (the wafer is taken and placed), the substrate or epitaxial wafer is transported together with the graphite tray 60. When the substrate and epitaxial wafer are circular, the graphite tray 60 can be a circular tray, and the diameter of the graphite tray 60 is larger than the diameter of the substrate and epitaxial wafer, so that when the substrate or epitaxial wafer is placed on the graphite tray 60, it does not exceed the range of the graphite tray 60. A graphite tray 60 can be placed in advance in each storage position 201 of the storage structure 200, and the substrate can be manually placed on the graphite tray 60 located on the storage structure 200 through the first opening 110, and the epitaxial wafer can be manually taken out from the graphite tray 60 on the storage structure 200 through the first opening 110.

[0085] In some embodiments of the present application, Figures 3 to 5As shown, the loading and unloading device 10 also includes a sample injection chamber 500; the sample injection chamber 500 is fixedly arranged at the second opening 120; a sample injection cavity 501 is formed inside the sample injection chamber 500, one end of the sample injection cavity 501 is connected to the transmission cavity 20, and the other end is connected to the main chamber 100 through the second opening 120. The sample injection chamber 500 is used to interact with the transmission cavity 20, and the sample injection chamber 500 and the main chamber 100 can be designed as an integrated whole to efficiently complete the operation of taking and placing the wafer; an observation window 510 can be set on the sample injection chamber 500, so as to facilitate observation of whether there is a substrate or epitaxial wafer in the sample injection chamber 501, and the condition of the substrate or epitaxial wafer. Specifically, the number of the observation windows 510 can be two, one is formed on the top wall of the sample injection chamber 500, and the other is formed on the side wall of the sample chamber 500, so as to facilitate observation of the condition in the sample injection chamber 501 from multiple angles.

[0086] During the production process, the wafer picking and placing mechanism 300 cooperates with the lifting mechanism 400 to take out the substrate from the storage structure 200 and transport it to the sampling chamber 501 through the second opening 120, and the robot 30 enters the sampling chamber 501 to take out the substrate; after the epitaxial wafer production is completed, the robot 30 returns to the sampling chamber 501, places the epitaxial wafer on the wafer picking and placing mechanism 300, and the wafer picking and placing mechanism 300 cooperates with the lifting mechanism 400 to transport the epitaxial wafer through the second opening 120 to the storage structure 200 for storage.

[0087] In some embodiments of the present application, Figure 2 and Figure 5 As shown, a main chamber door 130 is provided at the first opening 110; a gate valve 70 is provided between the injection chamber 500 and the transmission chamber 20, so that the main chamber 100 and the injection chamber 500 form a sealed space. Specifically, the main chamber door 130 can be fixedly connected to the main body of the main chamber 100 by fasteners. The main chamber door 130 is provided at the first opening 110, and a gate valve 70 is provided between the injection chamber 500 and the transmission chamber 20, so that the main chamber 100 and the injection chamber 500 form a sealed space, which can play a dust-proof role, ensure that the epitaxial wafers or substrates are separated from the outside world during the storage process one by one, prevent the epitaxial wafers and substrates from being contaminated by external pollutants, and help improve the quality of the epitaxial wafers.

[0088] In some embodiments of the present application, Figure 4As shown, the lifting mechanism 400 includes a power device 410, a synchronization component 420, at least one lead screw 430 and at least one guide rod 440; the lead screw 430 extends in the vertical direction, and its two ends are rotatably connected to the top and bottom ends in the main chamber 100; the guide rod 440 is parallel to the lead screw 430 and is arranged at intervals, and its two ends are fixedly connected to the top and bottom ends in the main chamber 100; the synchronization component 420 is connected to the power device 410 and the lead screw 430 respectively; the power device 410 drives the lead screw 430 to rotate through the synchronization component 420; the sheet picking and placing mechanism 300 is rotatably connected to the lead screw 430 and is slidably connected to the guide rod 440; the lead screw 430 rotates to drive the sheet picking and placing mechanism 300 to rise or fall.

[0089] Specifically, Figures 10 to 12 As shown, Fig.10 4 is a connection diagram of the lead screw 430, the synchronization assembly 420 and the power device 410 in the embodiment of the present application. Fig.11 for Fig.10 Schematic diagram of the decomposition structure, Fig.12 for Fig.10 The lead screw 430 may include a lead screw shaft 431 and a lead screw nut 432. The lead screw shaft 431 is rotatably connected to the lead screw nut 432. The lead screw 430 may convert rotary motion into linear motion. Fig.13 As shown, Fig.13 The schematic diagram of the installation of the lifting mechanism 400 and the sheet picking and placing mechanism 300 in the embodiment of the present application is shown in FIG. The lead screw nut 432 is fixedly connected to the sheet picking and placing mechanism 300. Under the drive of the power device 410, the lead screw shaft 431 rotates, and the lead screw nut 432 drives the sheet picking and placing mechanism 300 fixedly connected thereto to move along the lead screw shaft 431, thereby achieving the rise or fall of the sheet picking and placing mechanism 300. The lead screw 430 has the advantages of high precision, reversibility and high efficiency, and is preferably a ball screw 430.

[0090] In some embodiments of the present application, Figure 4 , Figures 9 to 11As shown, the power device 410 is fixedly connected to the bottom wall of the main chamber 100, and the power device 410 can be a reduction motor 411, and the output end 4111 of the reduction motor 411 is spaced and arranged in parallel with the lower end of the screw 430; the synchronous component 420 includes a synchronous belt 421 and two synchronous pulleys 422; the two synchronous pulleys 422 are respectively fixedly connected to the output end 4111 of the reduction motor 411 and the lower end of the screw 430; the synchronous belt 421 is arranged on the outside of the two synchronous pulleys 422 and is adapted to the two synchronous pulleys 422; the upper end of the screw 430 is provided with an upper sleeve 450, and the lower end is provided with a lower sleeve 460; the synchronous pulley 422 is located between the upper sleeve 450 and the lower sleeve 460, and the upper sleeve 450 and the lower sleeve 460 are both fixedly connected to the main chamber 100 and rotatably connected to the screw 430. The two synchronous pulleys 422 and one synchronous belt 421 form a synchronous pulley transmission, which has the advantages of accurate transmission, stable transmission and high transmission efficiency. The upper sleeve 450 and the lower sleeve 460 can be fixedly connected to the main chamber 100 through threads, and slidably fixed to the lead screw 430.

[0091] Specifically, Figure 4 and Fig.10 As shown, the reduction motor 411 can be fixedly connected to the bottom wall of the main chamber 100 through the mounting plate 470, the first end of the mounting plate 470 is fixedly connected to the bottom wall of the main chamber 100 by fasteners, and the second end is fixedly connected to the reduction motor 411, and the second end is provided with a third through hole (not shown in the figure) for the output end 4111 of the reduction motor 411 to pass through, and a synchronous pulley 422 is sleeved on the outside of the output end 4111 of the reduction motor 411, and the main body of the reduction motor 411 and the synchronous pulley 422 are respectively located on the upper and lower sides of the mounting plate 470.

[0092] In some embodiments of the present application, Figures 13 to 16 As shown, Fig.13 FIG. 4 is a schematic diagram of the installation of the lifting mechanism 400 and the sheet placing and taking mechanism 300 in the embodiment of the present application. Fig.14 for Fig.13 The rear view of Fig.15 for Fig.13 Side view of Fig.16 for Fig.13The top view shows that the wafer picking and placing mechanism 300 includes a horizontal transport component 310, a vertical transport component 320 and a fixed component 330; the horizontal transport component 310 and the vertical transport component 320 are respectively fixedly connected to the fixed component 330, and the fixed component 330 is slidably connected to the guide rod 440 and rotatably connected to the lead screw 430; the horizontal transport component 310 includes a horizontal electric cylinder 311 and a first carrier 312; the first carrier 312 is connected to the horizontal electric cylinder 311; the horizontal electric cylinder 311 drives the first carrier 312 to move in the horizontal direction; the vertical transport component 320 includes a vertical electric cylinder 321 and a second carrier 322; the second carrier 322 is connected to the vertical electric cylinder 321; the vertical electric cylinder 321 drives the second carrier 322 to move in the vertical direction to remove the substrate from the first carrier 312, or place an epitaxial wafer on the first carrier 312.

[0093] Specifically, Figures 17 to 21 As shown, Fig.17 Schematic diagram of the exploded structure of the sheet placing and taking mechanism 300 in the embodiment of the present application. Fig.18 for Fig.17 A schematic diagram of the structure of the fixing assembly 330, Fig.19 2 is a front view of the sheet taking and placing mechanism 300 in the embodiment of the present application. Fig. 20 for Fig.19 AA section view, Fig.21 for Fig.19 The horizontal electric cylinder 311 includes a horizontal piston rod 3111 extending in the horizontal direction; the first bearing member 312 is a fork; one end of the fork is fixedly connected to the free end of the horizontal piston rod 3111, and the other end has two insert teeth 3121 arranged at intervals in the horizontal direction; the vertical electric cylinder 321 includes a vertical piston rod 3211 extending in the vertical direction; the second bearing member 322 includes a first tray base 3221; the bottom surface of the first tray base 3221 is fixedly connected to the free end of the vertical piston rod 3211; the orthographic projection of the second bearing member 322 on the bottom wall of the main chamber 100 is located between the orthographic projections of the two insert teeth 3121 on the bottom wall of the main chamber 100. Specifically, the fork can be a quartz fork; and the first tray 3222 can be a quartz tray.

[0094] The horizontal electric cylinder 311 and the vertical electric cylinder 321 may include a servo motor (not shown in the figure), a transmission assembly (not shown in the figure) and an actuator assembly (horizontal piston rod 3111 or vertical piston rod 3211). The transmission assembly converts the rotational motion of the servo motor into linear motion, and the piston rod of the actuator assembly moves along its extension direction, which has the advantage of high control accuracy.

[0095] Furthermore, if Fig.17As shown, the second carrier 322 may also include a first tray 3222, and the first tray 3222 is fixedly arranged above the first tray base 3221 by means of a first tray fixing screw 3323; when in use, the graphite tray 60 is located above the first tray 3222, and the first tray 3222, the first tray base 3221 and the graphite tray 60 are all circular; preferably, as Fig. 20 As shown, the diameters of the first tray 3222, the first tray base 3221 and the graphite tray 60 increase in sequence. At this time, the AA section of a single insert 3121 may be L-shaped, wherein the horizontal portion is used to hold the graphite tray 60, and the diameter of the graphite tray 60 should be greater than the distance L1 between the two inserts 3121 and less than the distance L2 between the vertical portions of the two inserts 3121; the diameters of the first tray 3222 and the first tray base 3221 should be less than the distance L1 between the two inserts 3121, so that the second carrier 322 can remove the graphite tray 60 containing the substrate from the fork by ascending, and can place the graphite tray 60 containing the substrate on the fork by descending.

[0096] In some embodiments of the present application, Fig.13 , Fig.17 and Fig.18 As shown, the fixing assembly 330 includes a vertical electric cylinder mounting seat 331 and a horizontal electric cylinder mounting seat 332; the vertical electric cylinder mounting seat 331 is provided with a first connecting hole 3311 for the guide rod 440 to pass through and a first lead screw connecting hole 3312 for the lead screw 430 to pass through; the vertical electric cylinder 321 is fixedly arranged below the vertical electric cylinder mounting seat 331; the vertical electric cylinder mounting seat 331 is provided with a first through hole 3313 for the vertical piston rod 3211 to pass through; the second bearing member 322 is located at Above the vertical electric cylinder mounting seat 331; the horizontal electric cylinder mounting seat 332 is provided with a second connecting hole 3323 for the guide rod 440 to pass through and a second lead screw connecting hole 3324 for the lead screw 430 to pass through; the horizontal electric cylinder 311 is fixedly connected to the horizontal electric cylinder mounting seat 332; the horizontal electric cylinder mounting seat 332 is provided with a second through hole 3325 for the horizontal piston rod 3111 to pass through; the horizontal electric cylinder 311 and the first bearing member 312 are respectively located on both sides of the horizontal electric cylinder mounting seat 332.

[0097] Specifically, Fig.13 As shown, the number of lead screws 430 can be one, and the number of guide rods 440 can be three; the three guide rods 440 and one lead screw 430 are distributed according to the four vertices of the rectangle and are arranged parallel to each other, and the three guide rods 440 and one lead screw 430 are all connected to the fixed component 330, so that the force on the fixed component 330 is more balanced, which is conducive to improving the connection reliability.

[0098] Furthermore, if Fig.17 and Fig.18As shown, the vertical electric cylinder mounting base 331 can be a flat plate; the vertical electric cylinder mounting base 331 is provided with three first connection holes 3311, a first lead screw connection hole 3312, four fourth connection holes 3315, a first through hole 3313 and four lead screw nut mounting holes 3314. Fig.13 , Fig.17 and Fig.18 As shown, the three guide rods 440 are respectively inserted into the three first connection holes 3311, and the lead screw 430 is inserted into the first lead screw connection hole 3312; the vertical electric cylinder 321 is located below the vertical electric cylinder mounting seat 331, and is fixedly connected to the vertical electric cylinder mounting seat 331 through the fourth connection hole 3315 and the fastener; the first through hole 3313 is opened in the middle position of the vertical electric cylinder mounting seat 331, and the vertical piston rod 3211 of the vertical electric cylinder 321 passes through the first connection hole 3315. The connecting hole 3311 has a free end connected to the second supporting member 322, and the second supporting member 322 is located above the vertical electric cylinder mounting seat 331; the screw nut 432 is sleeved on the outside of the screw shaft 431 and is located below the vertical electric cylinder mounting seat 331, and four third connecting holes 4321 are provided on the screw nut 432. The screw nut 432 is fixedly connected to the vertical electric cylinder mounting seat 331 through the third connecting holes 4321, the screw nut mounting hole 3314 and the fastener.

[0099] like Fig.17 and Fig.18 As shown, the horizontal electric cylinder mounting seat 332 can be an L-shaped plate, and the horizontal electric cylinder mounting seat 332 includes a horizontal section 3321 and a vertical section 3322; the first end of the horizontal section 3321 is connected to the vertical section 3322, and the second end of the horizontal section 3321 is placed above the edge of the vertical electric cylinder mounting seat 331; the second end of the horizontal section 3321 is provided with a second connecting hole 3323 and a second lead screw connecting hole 3324, the guide rod 440 is inserted into the second connecting hole 3323, and the lead screw 430 is inserted into the second connecting hole 3324. The lead screw connecting hole 3324; the vertical section 3322 is fixedly connected to the horizontal electric cylinder 311; a second through hole 3325 is provided in the middle of the vertical section 3322, and four fifth connecting holes 3326 are provided around the second through hole 3325. The horizontal electric cylinder 311 and the first supporting member 312 are respectively located on both sides of the vertical section 3322, and the first supporting member 312 is located above the vertical electric cylinder mounting seat 331; the horizontal electric cylinder 311 is fixedly connected to the vertical section 3322 through the fifth connecting hole 3326 and fasteners.

[0100] like Fig.18 As shown, in order to reduce the weight of the fixing assembly 330 , a hollow portion 3301 may be provided on the horizontal electric cylinder mounting seat 332 and the vertical electric cylinder mounting seat 331 , thereby facilitating a lightweight design of the loading and unloading device 10 .

[0101] In some embodiments of the present application, Figure 5 and Fig. 22 As shown, Fig. 22 2 is a schematic diagram of the structure of the storage structure 200 in the embodiment of the present application. The storage structure 200 includes four support columns 210 and a plurality of second tray bases 220. The four support columns 210 extend in the vertical direction, are parallel and spaced apart. Both ends of the support columns 210 are fixedly connected to the main chamber 100. Figure 22 to Figure 26 As shown, Fig.23 for Fig. 22 Schematic diagram of the partial decomposition structure, Fig.24 for Fig. 22 The main view, Fig.25 for Fig. 22 Side view of Fig.26 for Fig. 22 In the top view, four mounting holes 221 are arranged at the edge of each second tray base 220; four supporting columns 210 are arranged in the four mounting holes 221 one by one; multiple second tray bases 220 are arranged in parallel and at intervals along the vertical direction to form multiple storage positions 201; Figure 4 , Figure 5 and Fig.23 As shown, the plurality of storage positions 201 each have a first access opening 2011 disposed toward the wafer access mechanism 300, and a second access opening 2012 disposed toward the first opening 110; the first access opening 2011 is used for the first carrier 312 to take out a substrate from the storage position 201 or place an epitaxial wafer into the storage position 201; the second access opening 2012 is used to place a substrate into the storage position 201 or take out an epitaxial wafer from the storage position 201. By adopting the vertical stacked storage structure 200, a plurality of epitaxial wafers or a plurality of substrates can be stored in the main chamber 100, so that a plurality of epitaxial wafers can be produced in one continuous production.

[0102] Specifically, Fig.26 As shown, the four supporting columns 210 can be distributed according to the four vertices of the rectangle, the second pallet base 220 can be rectangular, and the four mounting holes 221 are respectively arranged corresponding to the four corners of the rectangular second pallet base 220; in order to reduce the weight of the second pallet base 220, a hollow structure 222 can be set on the second pallet base 220, so as to facilitate the lightweight design of the loading and unloading device 10.

[0103] In some embodiments of the present application, Figure 22 to Figure 25As shown, the storage structure 200 may also include a plurality of second pallets 230 and a plurality of height spacer blocks 250; the plurality of second pallets 230 are fixedly arranged one by one above the plurality of second pallet bases 220 and are located in the middle of the second pallet bases 220, and the second pallet 230 and the second pallet base 220 may be fixedly connected by second pallet fixing screws 240; four height spacer blocks 250 may be arranged between two adjacent second pallet bases 220, and the four height spacer blocks 250 are correspondingly sleeved on the outside of the four supporting columns 210, and both ends are respectively against the two adjacent second pallet bases 220; the height spacer blocks 250 play a supporting role, separating the upper and lower second pallet bases 220.

[0104] In some embodiments of the present application, Figure 27 to Figure 29 As shown, Fig. 27 Schematic diagram of the cooperation between the sheet taking and placing mechanism 300 and the storage structure 200 in the embodiment of the present application. Fig.28 for Fig. 27 A top view of Fig.29 for Fig. 27 In the BB cross-sectional view, the second tray 230 can be circular. In order to ensure that the first carrier 312 can take out the substrate from the storage position 201, and the first carrier 312 can place the epitaxial wafer into the storage position 201, and the first carrier 312 can freely move in and out of the storage position 201, the diameter of the circular second tray 230 is smaller than the distance L1 between the two insert teeth 3121.

[0105] In some embodiments of the present application, Figures 3 to 5 As shown, the loading and unloading device 10 also includes a purge device 600, a gas recovery device 700 and a controller (not shown in the figure) arranged outside the main chamber 100; the purge device 600 includes a gas source (not shown in the figure), an air inlet pipe 620 and a plurality of air inlet joints 630; a plurality of air inlet holes (not shown in the figure) are provided on the main chamber door 130, and a plurality of air inlet joints 630 are fixedly connected to the main chamber door 130 and arranged one by one corresponding to the plurality of air inlet holes; the two ends of the air inlet pipe 620 are respectively connected to the plurality of air inlet joints 630 and the gas source; an exhaust hole 131 is provided on the main chamber 100; the gas recovery device 700 is connected to the inside of the main chamber 100 through the exhaust hole 131; the controller is electrically connected to the sheet placement mechanism 300 and the lifting mechanism 400. Specifically, the gas recovery device 700 may include an exhaust pipe 710 and a gas collecting tank (not shown in the figure), and the two ends of the exhaust pipe 710 are respectively connected to the gas collecting tank and the exhaust hole 131 of the main chamber 100. Multiple air inlet connectors 630 and air inlet pipes 620 can be connected via an air collecting box 640. The air collecting box 640 can buffer the gas output from the air inlet pipe 620, so that the gas is more evenly distributed to the multiple air inlet connectors 630, making the purging more uniform and thorough.

[0106] The purging device 600 can be provided to remove ions or impurities on the surface of the substrate or epitaxial wafer, which is beneficial to improving the quality of the epitaxial wafer. The gas source can provide high-purity argon (Ar), which passes through an electrostatic eliminator (not shown in the figure) to perform surface electro-purging on the substrate or epitaxial wafer, thereby eliminating static electricity on the substrate surface and achieving the effect of purging particles on the substrate surface. The electrostatic eliminator can ionize the air into a large number of positive and negative ions through high-voltage corona discharge at the tip, and then use wind to blow a large number of positive and negative ions to the surface of the object to neutralize static electricity.

[0107] During the production process, in the process of transporting the substrate from the storage structure 200 to the sampling chamber 501, the substrate can be first transported to the storage position 201 corresponding to the air inlet, the purge device 600 is turned on to purge the substrate, and then it is transported to the sampling chamber 501; in the process of transporting the epitaxial wafer from the sampling chamber 501 to the storage structure 200 for storage, the epitaxial wafer can be first transported to the storage position 201 corresponding to the air inlet, the purge device 600 is turned on to purge the epitaxial wafer, and then it is transported to other storage positions 201 for storage.

[0108] The working process of the epitaxial device according to the embodiment of the present application is described in detail below.

[0109] like Fig.30 As shown, Fig.30 Schematic diagram of the working process of the loading and unloading device 10 according to the embodiment of the present application (steps 1 to 3);

[0110] Step 1: The operator opens the main chamber door (not shown in the figure), places the substrates one by one on the second tray 230 of the storage structure 200, and closes the main chamber door;

[0111] Step 2: The lifting mechanism 400 drives the pick-up and placement mechanism 300 to rise and fall to a position slightly lower than the substrate to be taken; the horizontal electric cylinder 311 of the pick-up and placement mechanism 300 drives the first carrier 312 to the bottom of the substrate to be taken;

[0112] Step 3: The lifting mechanism 400 drives the sheet placing and taking mechanism 300 to rise, and the first carrier 312 takes the graphite tray 60 containing the substrate from the second tray 230 of the storage structure 200;

[0113] like Fig.31 As shown, Fig.31 Schematic diagram of the working process of the loading and unloading device 10 according to the embodiment of the present application (steps 4 to 6);

[0114] Step 4: The horizontal electric cylinder 311 drives the first carrier 312 back to the top of the second carrier 322;

[0115] Step 5: The vertical electric cylinder 321 drives the second carrier 322 to rise, so that the graphite tray 60 is separated from the first carrier 312 and transferred to the second carrier 322;

[0116] Step 6: The lifting mechanism 400 drives the sheet loading and unloading mechanism 300 to rise, and the graphite tray 60 is sent into the sample loading chamber 500; the loading and unloading device 10 is finished to load the material;

[0117] Step 7, the robot 30 extends from the transmission chamber 20 into the sample injection chamber 500, takes out the graphite tray 60 containing the substrate, and enters the reaction chamber through the transmission chamber 20, and places the graphite tray 60 containing the substrate into the reaction chamber;

[0118] Step 8, the reaction chamber produces epitaxial wafers;

[0119] Step 9, after the epitaxial wafer production is completed, the manipulator 30 enters the reaction chamber to take away the graphite tray 60 containing the epitaxial wafer, and returns it to the injection chamber 501 through the transmission chamber 20; after the loading and unloading device 10 of step 6 is completed, there is no action during the process from step 7 to step 9, the second carrier 322 is still located in the injection chamber 500, and the manipulator 30 places the graphite tray 60 containing the epitaxial wafer on the second carrier 322;

[0120] Step 10: The lifting mechanism 400 drives the sheet placing and taking mechanism 300 to descend, and the graphite tray 60 returns to the chamber body and descends to a position corresponding to the storage structure 200;

[0121] Step 11: The vertical electric cylinder 321 drives the second carrier 322 to descend, so that the graphite tray 60 is separated from the second carrier 322 and transferred to the first carrier 312;

[0122] Step 12: The horizontal electric cylinder 311 drives the first carrier 312 to move above the second tray 230 of the storage structure 200;

[0123] Step 13: The lifting mechanism 400 drives the wafer placement mechanism 300 to descend, and the first carrier 312 places the graphite tray 60 containing the epitaxial wafer on the second tray 230;

[0124] Step 14: The horizontal electric cylinder 311 drives the first bearing member 312 to move horizontally and leave the storage structure 200;

[0125] Then repeat steps 2 to 14 to produce the next epitaxial wafer; when all the substrates in the main chamber 100 are produced into epitaxial wafers, the operator opens the main chamber door 130 of the main chamber 100, takes out the epitaxial wafers one by one, and repeats step 1 to produce the next batch of epitaxial wafers.

[0126] The substrate may also be purged between step 3 and step 4. After step 3, the graphite tray 60 containing the substrate may be placed on the storage position 201 corresponding to the purging device 600 for purging. After the purging is completed, the graphite tray 60 containing the substrate may be removed from the storage position 201 and then step 4 may be performed.

[0127] The epitaxial device of the embodiment of the present application includes the loading and unloading device 10 described in any of the above embodiments. During the production process, the wafer loading and unloading mechanism 300 cooperates with the lifting mechanism 400 to take out a substrate from a storage position 201 of the storage structure 200, and transports it to the outside of the main chamber 100 through the second opening 120, so that it can subsequently enter the reaction chamber through the transmission chamber 20; the substrate grows an epitaxial layer in the reaction chamber to form an epitaxial wafer, and the epitaxial wafer is transported back to the second opening 120 through the transmission chamber 20; the wafer loading and unloading mechanism 300 cooperates with the lifting mechanism 400 to transport the epitaxial wafer to a storage position 201 of the storage structure 200 through the second opening 120 for storage, and then takes out a substrate from another storage position 201 of the storage structure 200, and repeats the above steps to produce the next epitaxial wafer until all the substrates located in the main chamber 100 are produced. During this period, no manual loading and unloading is required, and the operation continuity is high. The epitaxial equipment can operate continuously and automatically, and can continuously produce multiple epitaxial wafers with a high degree of automation, thereby improving production efficiency and reducing labor cost consumption.

[0128] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0129] Each embodiment in this specification is described in a related manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0130] The above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.

Claims

1. A loading and unloading device, characterized in that: Used for loading and unloading materials in a transmission chamber (20) of an epitaxial device, comprising: a main chamber (100), a storage structure (200), a sheet loading and unloading mechanism (300) and a lifting mechanism (400); The main chamber (100) has a first opening (110) arranged on its side wall and a second opening (120) arranged on its top wall; the first opening (110) is used to place a substrate into the main chamber (100) or to take out an epitaxial wafer from the main chamber (100); the second opening (120) is used to communicate with the transmission chamber (20); The storage structure (200) is fixedly arranged in the main chamber (100) and located at the first opening (110), and is used to store the substrate and / or the epitaxial wafer. The storage structure (200) has a plurality of storage positions (201) arranged in sequence along its height direction. The lifting mechanism (400) is arranged in the main chamber (100) and is used to drive the sheet taking and placing mechanism (300) to rise or fall in the main chamber (100); The wafer loading and unloading mechanism (300) is arranged in the main chamber (100) and is used to cooperate with the lifting mechanism (400) to take out the substrate from the storage structure (200) and transport it to the outside of the main chamber (100) through the second opening (120), and to transport the epitaxial wafer transported from the transmission cavity (20) to the storage structure (200) through the second opening (120) for storage; The sheet picking and placing mechanism (300) comprises: a horizontal transport component (310), a vertical transport component (320) and a fixing component (330); The horizontal transport component (310) and the vertical transport component (320) are respectively fixedly connected to the fixing component (330), and the fixing component (330) is connected to the lifting mechanism (400); The horizontal transport assembly (310) comprises a horizontal electric cylinder (311) and a first bearing member (312); the first bearing member (312) is directly connected to the horizontal electric cylinder (311); the horizontal electric cylinder (311) drives the first bearing member (312) to move in a horizontal direction; The vertical transport component (320) comprises a vertical electric cylinder (321) and a second carrier (322); the second carrier (322) is connected to the vertical electric cylinder (321); the vertical electric cylinder (321) drives the second carrier (322) to move in a vertical direction to remove the substrate from the first carrier (312) or place the epitaxial wafer on the first carrier (312); The substrate grows an epitaxial layer to form the epitaxial wafer.

2. The loading and unloading device according to claim 1, characterized in that: The loading and unloading device further comprises: a sample feeding chamber (500); The sample injection chamber (500) is fixedly arranged at the second opening (120); An injection cavity (501) is formed inside the injection chamber (500), one end of the injection cavity (501) is connected to the transmission cavity (20), and the other end is connected to the main cavity (100) through the second opening (120).

3. The loading and unloading device according to claim 2, characterized in that: The lifting mechanism (400) comprises: a power device (410), a synchronization component (420), at least one lead screw (430) and at least one guide rod (440); The lead screw (430) extends in a vertical direction, and its two ends are rotatably connected to the top end and the bottom end in the main chamber (100); The guide rod (440) is parallel to and spaced from the lead screw (430), and both ends of the guide rod (440) are fixedly connected to the top and bottom ends in the main chamber (100); The synchronizing component (420) is connected to the power device (410) and the lead screw (430) respectively; the power device (410) drives the lead screw (430) to rotate via the synchronizing component (420); The sheet taking and placing mechanism (300) is rotatably connected to the lead screw (430) and is slidably connected to the guide rod (440); the lead screw (430) rotates to drive the sheet taking and placing mechanism (300) to rise or fall.

4. The loading and unloading device according to claim 3 is characterized in that: The fixing assembly (330) is slidably connected to the guide rod (440) and is rotationally connected to the lead screw (430).

5. The loading and unloading device according to claim 4, characterized in that: The horizontal electric cylinder (311) comprises: a horizontal piston rod (3111) extending in a horizontal direction; The first bearing member (312) is a fork; one end of the fork is fixedly connected to the free end of the horizontal piston rod (3111), and the other end has two insert teeth (3121) arranged at intervals in the horizontal direction; The vertical electric cylinder (321) comprises: a vertical piston rod (3211) extending in a vertical direction; The second bearing member (322) comprises: a first tray base (3221); the bottom surface of the first tray base (3221) is fixedly connected to the free end of the vertical piston rod (3211); and the orthographic projection of the second bearing member (322) on the bottom wall of the main chamber (100) is located between the orthographic projections of the two insert teeth (3121) on the bottom wall of the main chamber (100).

6. The loading and unloading device according to claim 5, characterized in that: The fixing assembly (330) comprises: a vertical electric cylinder mounting seat (331) and a horizontal electric cylinder mounting seat (332); The vertical electric cylinder mounting seat (331) is provided with a first connection hole (3331) for the guide rod (440) to pass through and a first lead screw connection hole (3312) for the lead screw (430) to pass through; the vertical electric cylinder (321) is fixedly arranged below the vertical electric cylinder mounting seat (331); the vertical electric cylinder mounting seat (331) is provided with a first through hole (3313) for the vertical piston rod (3211) to pass through; the second bearing member (322) is located above the vertical electric cylinder mounting seat (331); The horizontal electric cylinder mounting seat (332) is provided with a second connection hole (3323) for the guide rod (440) to pass through and a second lead screw connection hole (3324) for the lead screw (430) to pass through; the horizontal electric cylinder (311) is fixedly connected to the horizontal electric cylinder mounting seat (332); the horizontal electric cylinder mounting seat (332) is provided with a second through hole (3325) for the horizontal piston rod (3111) to pass through; the horizontal electric cylinder (311) and the first bearing member (312) are respectively located on two sides of the horizontal electric cylinder mounting seat (332).

7. The loading and unloading device according to claim 3, characterized in that: The power device (410) is fixedly connected to the bottom wall of the main chamber (100); the power device (410) is a reduction motor (411); the output end (4111) of the reduction motor (411) is spaced apart from and arranged in parallel with the lower end of the lead screw (430); The synchronous component (420) comprises: a synchronous belt (421) and two synchronous pulleys (422); the two synchronous pulleys (422) are fixedly connected to the output end (4111) of the reduction motor (411) and the lower end of the lead screw (430) respectively; the synchronous belt (421) is arranged outside the two synchronous pulleys (422) and is adapted to the two synchronous pulleys (422); An upper shaft sleeve (450) is provided at the upper end of the lead screw (430), and a lower shaft sleeve (460) is provided at the lower end; the synchronous pulley (422) is located between the upper shaft sleeve (450) and the lower shaft sleeve (460); the upper shaft sleeve (450) and the lower shaft sleeve (460) are both fixedly connected to the main chamber (100) and rotatably connected to the lead screw (430).

8. The loading and unloading device according to claim 4, characterized in that: The storage structure (200) comprises: four supporting columns (210) and a plurality of second tray bases (220); The four support columns (210) all extend in a vertical direction, are arranged in parallel and at intervals; both ends of the support columns (210) are fixedly connected to the main chamber (100); Four mounting holes (221) are arranged at the edge of each of the second tray bases (220); the four supporting columns (210) are inserted into the four mounting holes (221) in a one-to-one correspondence; The plurality of second tray bases (220) are arranged in parallel and at intervals along a vertical direction to form the plurality of storage locations (201); The plurality of storage positions (201) each have a first access opening (2011) arranged toward the wafer access mechanism (300), and a second access opening (2012) arranged toward the first opening (110); the first access opening (2011) is used for the first carrier (312) to take out the substrate from the storage position (201) or to place the epitaxial wafer into the storage position (201); the second access opening (2012) is used to place the substrate into the storage position (201) or to take out the epitaxial wafer from the storage position (201).

9. The loading and unloading device according to any one of claims 2 to 8, characterized in that: A main chamber door (130) is provided at the first opening (110); a gate valve (70) is provided between the injection chamber (500) and the transmission chamber (20), so that the main chamber (100) and the injection chamber (500) form a sealed space; The loading and unloading device further comprises: a purge device (600), a gas recovery device (700) and a controller arranged outside the main chamber (100); The purge device (600) comprises an air source, an air inlet pipe (620) and a plurality of air inlet joints (630); the main chamber door (130) is provided with a plurality of air inlet holes, the plurality of air inlet joints (630) are fixedly connected to the main chamber door (130) and are arranged in a one-to-one correspondence with the plurality of air inlet holes; two ends of the air inlet pipe (620) are respectively connected to the plurality of air inlet joints (630) and the air source; The main chamber (100) is provided with an exhaust hole (131); the gas recovery device (700) is connected to the interior of the main chamber (100) through the exhaust hole (131); The controller is electrically connected to the sheet taking and placing mechanism (300) and the lifting mechanism (400).

10. An epitaxial device, characterized in that: It comprises the loading and unloading device, the transmission chamber (20) and the reaction chamber according to any one of claims 1 to 9; The reaction chamber is used to produce the epitaxial wafer; The transmission chamber (20) is located between the loading and unloading device and the reaction chamber; a robot (30) is arranged in the transmission chamber (20), and the robot (30) is used to transport the substrate or the epitaxial wafer between the loading and unloading device and the reaction chamber.

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