Wafer centering device and wafer centering method

Abstract

The present invention provides a wafer centering device and a wafer centering method, wherein the wafer centering device comprises: a control console; a track assembly, which is arranged in the control console; a clamping assembly, which is connected to the track assembly; a sensor assembly, which is composed of a transmitting component and a receiving component, which are arranged on both sides of the clamping assembly; wherein the transmitting component emits a light beam, and the receiving component receives the light beam, and when the light beam is blocked, the sensor assembly obtains a signal, obtains the offset of the wafer edge, and the track assembly adjusts the clamping assembly according to the offset. The present invention solves the problem of how to solve the problem of insufficient precision of wafers during processing.

Description

Technical Field

[0001] The present invention relates to the field of positioning technology, and in particular to a wafer centering device and a wafer centering method. Background Art

[0002] With the continuous development of science and technology, traditional wafer alignment devices rely on relatively basic automation technology. Manual operation or simple automatic alignment cannot achieve the high precision required for modern semiconductor manufacturing. Traditional device operation is time-consuming and error-prone. It is difficult to adapt to the requirements of wafers of different sizes and types. It lacks real-time monitoring and automatic correction capabilities and requires frequent manual intervention, which affects production efficiency.

[0003] It can be seen that for wafer centering devices, improving centering accuracy, enhancing automation level, and enhancing flexibility and adaptability are relatively direct ways to improve production efficiency. Summary of the invention

[0004] The problem solved by the present invention is how to solve the problem of insufficient precision during wafer processing.

[0005] In order to solve the above problems, the present invention provides a wafer alignment device, comprising: a control console, a track assembly, a clamping assembly, and a sensor assembly, wherein the track assembly is arranged in the control console; the clamping assembly is connected to the track assembly; the sensor assembly consists of a transmitting component and a receiving component, and the transmitting component and the receiving component are arranged on both sides of the clamping assembly; wherein the transmitting component emits a light beam, and the receiving component receives the light beam, and when the light beam is blocked, the sensor assembly obtains a signal, obtains the offset of the wafer edge, and the track assembly adjusts the clamping assembly according to the offset.

[0006] The technical effect achieved after adopting this technical solution is: through the light beam detection of the sensor component, the position of the wafer edge can be determined with high precision, and then the center of the wafer can be calculated to achieve precise centering; after the sensor detects the offset of the wafer edge, the track component automatically adjusts the position of the clamping component to improve the centering accuracy and enhance the level of automation.

[0007] Furthermore, the wafer centering device also includes: a bracket, the bracket is arranged on the control console, the sensor component is arranged on the bracket, and the bracket is provided with a through hole for the light beam to pass through.

[0008] The technical effect achieved after adopting this technical solution: the bracket structure not only supports the sensor assembly, but its designed through-hole also ensures the smooth transmission of the light beam, increasing the stability and reliability of the system operation.

[0009] Further, the clamping assembly includes at least two clamping arms and a wafer mounting position disposed between the two clamping arms;

[0010] The sensor assembly is provided with a plurality of sensors, and the plurality of sensors are arranged around the wafer mounting position, and the plurality of sensors are all oriented toward the center of the wafer mounting position.

[0011] The technical effect achieved after adopting this technical solution is: the design of the clamping component can adapt to wafers of different sizes, and multiple sensors are arranged around the wafer mounting position, which can ensure the centering accuracy of wafers of different shapes and improve the centering accuracy of the device; multiple sensors are all facing the center of the wafer mounting position, and can detect the precise offset of the wafer at multiple angles.

[0012] Furthermore, the bracket includes: a first bracket and a second bracket, wherein the first bracket is located on one side of the console and connected to the console; the second bracket is connected to the first bracket and is provided with a through hole, and the second bracket is arranged on the side of the clamping assembly away from the console.

[0013] The technical effect achieved after adopting this technical solution: ensuring the stability and safety of the wafer in the device.

[0014] Furthermore, the bracket also includes a sensor controller, and the sensor controller is installed on the first bracket.

[0015] The technical effect achieved after adopting this technical solution: it is easy to maintain and adjust, so that the device can make intelligent decisions.

[0016] Furthermore, the second bracket is located between the transmitting component and the receiving component.

[0017] The technical effects achieved after adopting this technical solution are: optimizing the beam path, simplifying the device structure, ensuring the stability of the sensor components, and the safety of the wafer.

[0018] Furthermore, the clamping assembly is provided with a plurality of positioning components, and the positioning components are used to fix the wafer.

[0019] The technical effect achieved after adopting this technical solution is: ensuring the stability of the wafer in the device and preventing damage to the wafer during the detection process.

[0020] In order to solve the above problems, the present invention provides a wafer centering method, which is implemented by any of the above wafer centering devices, and the wafer centering method comprises:

[0021] Step 1: Clamp the wafer with a clamping assembly;

[0022] Step 2: The sensor assembly detects the wafer and calculates the center position;

[0023] Step 3: According to the center position of the circle, the track assembly adjusts the clamping assembly to center the wafer.

[0024] The technical effect achieved after adopting this technical solution: by detecting and calculating the center position of the wafer through the sensor component, the centering process can be completed quickly, reducing waiting time and improving overall efficiency.

[0025] Further, the sensor includes at least two sensors;

[0026] Step 2 specifically includes:

[0027] The two sensors detect the offset of two positions corresponding to the edge of the wafer, and calculate the center position of the wafer in combination with the radius of the wafer.

[0028] The technical effect achieved after adopting this technical solution: improving accuracy.

[0029] Further, the sensor assembly includes three sensors;

[0030] Step 2 specifically includes:

[0031] Based on any two sensors as a group, the offset of two positions corresponding to the edge of the wafer is detected, and the center position of the wafer is calculated in combination with the radius of the wafer; based on multiple wafer center positions detected by multiple groups of sensors, the distance between the multiple wafer center positions is calculated to determine whether it is less than a set threshold. If so, three sensors are used to calculate the center position of the wafer and the radius of the wafer. If not, the clamping assembly is corrected from the reference position, and then the center position of the wafer and the radius of the wafer are calculated using three sensors.

[0032] The technical effect achieved after adopting this technical solution: using three sensors for cross-validation can avoid possible misreading of a single sensor. By comparing the data of multiple sensors, the accuracy of the centering results can be ensured and error accumulation can be reduced. When it is detected that the distance between multiple center positions is greater than the threshold, the correction program will be started and re-centering will be ensured to ensure the stability of the centering process.

[0033] In summary, the above-mentioned technical solutions of the present application may have one or more of the following advantages or beneficial effects: i) By using sensors surrounding the wafer mounting position, the wafer edge can be accurately monitored, so as to know the wafer deviation and quickly make corrections to improve the accuracy of the alignment. ii) The wafer position is automatically detected by the sensor without manual intervention, and the track assembly is automatically adjusted to improve the degree of automation. iii) The clamping assembly is adjustable and can adapt to a variety of wafer sizes and types. By adjusting to suit different alignment requirements, the scope of use of the wafer alignment device is increased. iv) The sensor controller monitors the wafer position in real time and controls the clamping assembly to quickly adjust the alignment, thereby improving production efficiency. V) The sensor controller controls the automatic correction and alignment of the clamping components, reducing the consumption of manpower and resources and reducing operating costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is a schematic structural diagram of a wafer centering device according to an embodiment of the present invention;

[0035] Figure 2 A top view of a wafer centering device according to an embodiment of the present invention;

[0036] Figure 3 A schematic diagram of a support and sensor assembly of a wafer centering device according to an embodiment of the present invention;

[0037] Figure 4 A schematic diagram of a clamping assembly of a wafer centering device according to an embodiment of the present invention;

[0038] Figure 5 It is a front view of a wafer centering device according to an embodiment of the present invention;

[0039] Figure 6 The figure is a flow chart of a wafer centering method in an embodiment of the present invention.

[0040] Description of reference numerals:

[0041] 100-wafer centering device; 110-control console; 120-track assembly; 130-clamping assembly; 131-clamping arm; 132-wafer mounting position; 133-positioning component; 140-sensor assembly; 141-transmitting component; 142-receiving component; 143-sensor; 150-bracket; 151-first bracket; 152-second bracket; 152a-through hole; 153-sensor controller. DETAILED DESCRIPTION

[0042] The object of the present invention is to provide a wafer centering device and a wafer centering method, so as to solve the problem of insufficient precision during wafer processing.

[0043] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0044] See also Figure 1 , Figure 2The present invention provides a wafer centering device 100, comprising: a control console 110, a track assembly 120, a clamping assembly 130 and a sensor assembly 140, wherein the track assembly 120 is arranged in the control console 110; the clamping assembly 130 is connected to the track assembly 120; the sensor assembly 140 is composed of a transmitting component 141 and a receiving component 142, and the transmitting component 141 and the receiving component 142 are arranged on both sides of the clamping assembly 130; wherein the transmitting component 141 is used to emit a light beam, and the receiving component 142 is used to receive the light beam, when the light beam is blocked, the sensor assembly 140 obtains a signal, obtains the offset of the wafer edge, and the track assembly 120 adjusts the clamping assembly 130 according to the offset.

[0045] In this embodiment, through the light beam detection of the sensor component 140, the position of the edge of the wafer can be determined with high precision, and then the center of the wafer can be calculated to achieve precise centering; after the sensor 143 detects the offset of the wafer edge, the track component 120 automatically adjusts the position of the clamping component 130 to improve the centering accuracy and enhance the level of automation.

[0046] Specifically, the clamping assembly 130 fixes the wafer and transports it to the control console 110 through the track assembly 120. The sensor assembly 140 is a light sensor. The emitting component 141 emits a light beam, and the receiving component 142 receives the light beam. When the receiving component 142 does not completely receive the light beam, the sensor assembly 140 obtains a signal, thereby knowing the offset of the edge of the wafer. The track assembly 120 adjusts the position of the clamping assembly 130 according to the offset of the edge of the wafer to recalibrate the center of the wafer.

[0047] See also Figure 3 The wafer centering device 100 further includes a bracket 150 , the bracket 150 is disposed on the console 110 , the sensor assembly 140 is disposed on the bracket 150 , and the bracket 150 is provided with a through hole 152 a for the light beam to pass through.

[0048] In this embodiment, the bracket 150 structure not only supports the sensor assembly 140, but the through hole 152a designed therein also ensures the smooth transmission of the light beam, thereby increasing the stability and reliability of the system operation.

[0049] Specifically, the bracket 150 is connected to the console 110 , the sensor assembly 140 is fixed on the bracket 150 , and a through hole is provided on the bracket 150 for accommodating the light beam emitted by the transmitting assembly to pass through.

[0050] See also Figure 4 The clamping assembly 130 includes at least two clamping arms 131 and a wafer mounting position 132 arranged between the two clamping arms 131; the sensor assembly 140 is provided with a plurality of sensors 143, and the plurality of sensors 143 are arranged around the wafer mounting position 132, and the plurality of sensors 143 are all facing the center of the wafer mounting position 132.

[0051] In this embodiment, the design of the clamping assembly 130 can adapt to wafers of different sizes, and multiple sensors 143 surrounding the wafer mounting position 132 can ensure the centering accuracy of wafers of different shapes, thereby improving the centering accuracy of the device; the multiple sensors 143 are all facing the center of the wafer mounting position 132, and can detect the precise offset of the wafer at multiple angles.

[0052] Specifically, the wafer is fixed on the wafer mounting position 132 between the clamping arms 131, and then the clamping assembly 130 moves the wafer to a specific position through the track assembly 120. The multiple sensors 143 on the bracket 150 surround the wafer mounting position 132, and the multiple sensors 143 are simultaneously facing the center of the wafer mounting position 132.

[0053] See also Figure 5 The bracket 150 includes: a first bracket 151 and a second bracket 152, wherein the first bracket 151 is located at one side of the console 110 and is connected to the console 110; the second bracket 152 is connected to the first bracket 151, and the second bracket 152 is provided with a through hole 152a, and the second bracket 152 is arranged on a side of the clamping assembly 130 away from the console 110.

[0054] In this embodiment, the stability and safety of the wafer in the device are guaranteed.

[0055] Specifically, the first bracket 151 is installed at the bottom of the console 110 , the second bracket 152 is provided with a through hole 152 a for accommodating the passage of the light beam, and the clamping assembly 130 is disposed between the second bracket 152 and the console 110 .

[0056] See also Figure 3 The bracket 150 also includes a sensor controller 153 , which is installed on the first bracket 151 .

[0057] In this embodiment, the clamping assembly 130 is easily maintained and adjusted, so that the device can make intelligent decisions.

[0058] Specifically, the first bracket 151 is installed with a sensor controller 153 , and the signals obtained by all sensors 143 are aggregated to the sensor controller 153 . The sensor controller 153 controls the adjustment of the clamping assembly 130 on the track assembly 120 or the adjustment of the clamping arm 131 .

[0059] See also Figure 5 , the second bracket 152 is located between the transmitting component 141 and the receiving component 142 .

[0060] In this embodiment, the beam path is optimized, the device structure is simplified, and the stability of the sensor assembly 140 and the safety of the wafer are ensured.

[0061] Specifically, the second bracket 152 is disposed between the emitting component 141 and the receiving component 142 . The light beam emitted by the emitting component 141 passes through the through hole 152 a on the second bracket 152 and is disposed at the edge of the wafer. Thereafter, the light beam is received by the receiving component 142 .

[0062] See also Figure 4 The clamping assembly 130 is provided with a plurality of positioning components 133, and the positioning components 133 are used to fix the wafer.

[0063] In this embodiment, the stability of the wafer in the device is ensured to prevent the wafer from being damaged during the detection process.

[0064] Specifically, a plurality of positioning components 133 are provided on one side of the clamping assembly 130 facing the wafer mounting position 132 , and the positioning components 133 are used to fix the wafer when the clamping assembly 130 moves on the track assembly 120 and the sensor assembly 140 detects the edge of the wafer.

[0065] Preferably, four positioning components 133 are provided on one side of the clamping assembly 130 facing the wafer mounting position 132 , that is, two positioning components 133 are provided on each of the two clamping arms 131 for fixing the wafer.

[0066] In order to solve the above problems, the present invention provides a wafer centering method, which is implemented by any of the above wafer centering devices, and the wafer centering method comprises:

[0067] Step 1: The clamping assembly 130 fixes the wafer;

[0068] Step 2: The sensor assembly 140 detects the wafer and calculates the center position;

[0069] Step 3: According to the position of the center of the circle, the track assembly 120 adjusts the clamping assembly 130 to center the wafer.

[0070] In this embodiment, the sensor assembly 140 detects and calculates the center position of the wafer, so that the centering process can be completed quickly, the waiting time can be reduced, and the overall efficiency can be improved.

[0071] Specifically, the wafer is placed on the wafer mounting position 132 between the clamping arms 131, and then the clamping arms 131 are closed, and the edge of the wafer is fixed by multiple positioning components 133, which does not damage the wafer and ensures its stability. The transmitting component 141 and the receiving component 142 of the sensor assembly 140 are respectively arranged on both sides of the wafer. The transmitting component 141 emits a light beam, which will cover the edge area of ​​the wafer. When the light beam encounters the edge of the wafer, part of the light beam will be blocked. The receiving component 142 will detect the change in the range of the light beam, thereby determining the specific position of the edge of the wafer; according to the received signal, the offset of the edge of the wafer relative to the preset position is calculated. Multiple sensors 143 will have multiple sets of detection data, and the center position of the wafer can be determined by calculation. After the sensor assembly 140 determines the center position of the wafer, it compares the position with the preset specific position, calculates the offset, and the sensor controller 153 makes a decision to control the clamping assembly 130 to move on the track assembly 120 until the center of the wafer is completely aligned with the working center of the equipment.

[0072] The sensor assembly 140 includes at least two sensors 143;

[0073] Step 2 specifically includes:

[0074] The two sensors 143 detect the offsets of two positions corresponding to the wafer edge, and calculate the center position of the wafer in combination with the radius of the wafer.

[0075] In this embodiment, the two sensors 143 detect simultaneously to improve the accuracy of the offset.

[0076] Specifically, two sensors 143 are set on opposite sides of the wafer, and each sensor 143 measures the distance between the position where the light beam is blocked by the edge of the wafer and a preset reference point, that is, the offset of the edge of the wafer. The detection data of the two sensors 143 are transmitted to the sensor controller 153. The center position of the wafer can be determined by calculation using the offset detected by the two sensors 143 and the wafer radius. Combined with the known radius of the wafer, the center coordinates are calculated through geometric relationships.

[0077] The sensor assembly 140 includes three sensors 143;

[0078] Step 2 specifically includes:

[0079] Based on any two sensors 143 as a group, the offset of two positions corresponding to the edge of the wafer is detected, and the center position of the wafer is calculated in combination with the radius of the wafer; based on the multiple wafer center positions detected by multiple groups of sensors 143, the distance between the multiple wafer center positions is calculated, and it is determined whether it is less than a set threshold. If so, the three sensors 143 are used to calculate the wafer center position and the radius of the wafer. If not, the clamping assembly 130 is corrected from the reference position, and then the three sensors 143 are used to calculate the wafer center position and the radius of the wafer.

[0080] In this embodiment, three sensors 143 are used for cross-validation to avoid possible misreading of a single sensor. By comparing the data of multiple sensors 143, the accuracy of the centering result is ensured and the error accumulation is reduced. When it is detected that the distance between multiple center positions is greater than a threshold, a correction program is started to re-center to ensure the stability of the centering process.

[0081] Specifically, the three sensors 143 are divided into three groups, each group has two sensors 143. The three sensors are divided into a first sensor, a second sensor and a third sensor, the first sensor and the second sensor are in one group, the first sensor and the third sensor are in one group, and the second sensor and the third sensor are in one group. The two sensors 143 in each group will respectively detect the offset of the wafer edge position, which reflects the deviation of the wafer edge from the preset position of the sensor 143. Using the deviation detected by each group of sensors 143 and the known radius of the wafer, the corresponding wafer center position can be calculated respectively, and the wafer center position calculated by different sensor 143 groups is compared. According to the distance between the calculated wafer centers, it is determined whether it is less than the threshold. If it is less than the threshold, a more accurate wafer center position and radius are calculated using the data of the three groups of sensors 143 and the known radius; if it is greater than the threshold, it may indicate that there is an abnormality in the sensor 143 data, and the sensor 143 controller will instruct the clamping assembly 130 to make corrections from a known reference position and try the centering process again.

[0082] The purpose of the present invention is to provide a wafer centering device 100 and a wafer centering method, which are used to solve the problem of insufficient precision of the wafer during processing. Specifically, the wafer is placed in the wafer mounting position 132 between the clamping arms 131 in the clamping assembly 130, and the wafer is fixed by multiple positioning components 133 inside the clamping assembly 130, and then transported to the specified position of the control console 110 through the track assembly 120. The sensor assembly 140 on the bracket 150 is composed of a transmitting component 141 and a receiving component 142. The transmitting component 141 emits a light beam, and the receiving component 142 receives the light beam to detect the position of the edge of the wafer. The positioning method of the wafer centering device 100 is to place the wafer on the wafer mounting position 132 between the clamping arms 131, and then the clamping arms 131 are closed, and the edge of the wafer is fixed by multiple positioning components 133, which neither damages the wafer nor ensures its stability. The emitting component 141 and the receiving component 142 of the sensor assembly 140 are respectively arranged on both sides of the wafer. The emitting component 141 emits a light beam, which will cover the edge area of ​​the wafer. When the light beam encounters the edge of the wafer, part of the light beam will be blocked. The receiving component 142 will detect the change in the range of the light beam, thereby determining the specific position of the edge of the wafer; based on the received signal, the offset of the edge of the wafer relative to the preset position is calculated. Multiple sensors 143 will have multiple sets of detection data, and the center position of the wafer can be determined by calculation. After the sensor assembly 140 determines the center position of the wafer, it compares the position with the preset specific position and calculates the offset. The sensor controller 153 makes a decision and controls the clamping assembly 130 to move on the track assembly 120 until the center of the wafer is completely aligned with the working center of the equipment.

[0083] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A wafer centering device, used to implement a wafer centering method, characterized in that: The wafer centering device comprises: Console; A track assembly, wherein the track assembly is disposed in the console; A clamping assembly, the clamping assembly is connected to the track assembly, and comprises: at least two clamping arms and a wafer mounting position arranged between the two clamping arms; A sensor assembly, the sensor assembly is composed of a transmitting component and a receiving component, the transmitting component and the receiving component are arranged on both sides of the clamping assembly; wherein the transmitting component emits a light beam, the receiving component receives the light beam, when the light beam is blocked, the sensor assembly obtains a signal, obtains the offset of the wafer edge, and the track assembly adjusts the clamping assembly according to the offset; the sensor assembly is provided with a plurality of sensors, the plurality of sensors are arranged around the wafer mounting position, and the plurality of sensors are all oriented toward the center of the wafer mounting position; A bracket, the bracket is arranged on the console, the sensor assembly is arranged on the bracket, the bracket is provided with a through hole for light beams to pass through, the bracket comprises: a first bracket and a second bracket, the first bracket is located at one side of the console, the first bracket is connected to the console; the second bracket is connected to the first bracket, the second bracket is provided with the through hole, and the second bracket is arranged at a side of the clamping assembly away from the console; Wherein, the wafer centering method comprises: Step 1: The clamping assembly fixes the wafer; Step 2: The sensor assembly detects the wafer and calculates the center position of the circle; The sensor assembly includes at least two sensors, and the two sensor components detect the offset of two positions corresponding to the edge of the wafer, and calculate the center position of the wafer in combination with the radius of the wafer; The sensor assembly includes three sensors, and any two of the sensors are grouped together to detect the offset of two positions corresponding to the edge of the wafer, and the center position of the wafer is calculated in combination with the radius of the wafer; based on the multiple center positions of the wafer detected by the multiple groups of sensors, the distance between the multiple center positions of the wafer is calculated to determine whether it is less than a set threshold, and if so, the three sensors are used to calculate the center position of the wafer and the radius of the wafer, and if not, the clamping assembly is corrected from the reference position, and the three sensors are used to calculate the center position of the wafer and the radius of the wafer; Step 3: According to the center position of the circle, the track assembly adjusts the clamping assembly to center the wafer.

2. The wafer centering device according to claim 1, characterized in that: The bracket further includes a sensor controller, which is mounted on the first bracket.

3. The wafer centering device according to claim 1, characterized in that: The second bracket is located between the transmitting component and the receiving component.

4. The wafer centering device according to claim 1, characterized in that: The clamping assembly is provided with a plurality of positioning components, and the positioning components are used to fix the wafer.

5. A wafer centering method, implemented by the wafer centering device according to any one of claims 1 to 4, characterized in that: The wafer centering method comprises: Step 1: The clamping assembly fixes the wafer; Step 2: The sensor assembly detects the wafer and calculates the center position of the circle; Step 3: According to the center position of the circle, the track assembly adjusts the clamping assembly to center the wafer.

6. The wafer centering method according to claim 5, characterized in that: The sensor assembly includes at least two sensors; The step 2 specifically includes: The two sensor components detect the offset of two positions corresponding to the edge of the wafer, and calculate the center position of the wafer in combination with the radius of the wafer.

7. The wafer centering method according to claim 6, characterized in that: The sensor assembly includes three sensors; The step 2 specifically includes: Based on any two of the sensors forming a group, the offsets of two positions corresponding to the edge of the wafer are detected, and the center position of the wafer is calculated in combination with the radius of the wafer; based on the multiple center positions of the wafer detected by multiple groups of the sensors, the distance between the multiple center positions of the wafer is calculated, and it is determined whether it is less than a set threshold. If so, the center position of the wafer and the radius of the wafer are calculated using three of the sensors. If not, the clamping assembly is corrected from the reference position, and then the center position of the wafer and the radius of the wafer are calculated using three of the sensors.

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