Electronic device

Abstract

An embodiment of the present application provides an electronic device, which can solve the problem of insufficient layout area of the circuit board. The electronic device includes: a housing structure, at least including a first part and a second part, and the planes where the first part and the second part are located are different; a circuit board assembly, located on one side of the housing structure; the circuit board assembly has at least two layers of circuit boards, and the at least two layers of circuit boards at least include a first circuit board and at least one second circuit board arranged in a stacked manner, the first circuit board is located on the side of the second circuit board away from the housing structure, and the distance from the first part to the first circuit board is greater than the distance from the second part to the first circuit board; the circuit board includes a first surface and a second surface, functional devices are provided at positions of the circuit board assembly corresponding to the first part, and the number of surfaces provided with functional devices is a first preset value, functional devices are provided at positions of the circuit board assembly corresponding to the second part, and the number of surfaces provided with functional devices is a second preset value, and the first preset value is greater than the second preset value.

Description

Technical Field

[0001] This application relates to the field of electronic technologies, and in particular, to an electronic device. Background Art

[0002] As the functions of electronic devices such as mobile phones and tablet computers become gradually richer and the performance is increasingly improved, it is required that more devices can be integrated on the circuit board. The circuit board in a conventional electronic device has only one layer and can only arrange more devices in the planar direction. However, with the increase in battery endurance capacity and the like, the size of the circuit board decreases, resulting in a lack of layout area. Therefore, how to arrange more devices in a limited space is an urgent problem to be solved. Summary of the Invention

[0003] To solve the above technical problems, this application provides an electronic device, which can solve the problem of insufficient layout area.

[0004] In a first aspect, an embodiment of this application provides an electronic device, which includes: a housing structure, including at least a first part and a second part, and the planes where the first part and the second part are located are different; a circuit board assembly, along a first direction, the circuit board assembly is located on one side of the housing structure, wherein the first direction is perpendicular to the plane where the first part is located; the circuit board assembly includes at least two layers of circuit boards, and the at least two layers of circuit boards at least include a first circuit board and at least one second circuit board which are stacked, along the first direction, the first circuit board is located on the side of the second circuit board away from the housing structure, and the distance from the first part to the first circuit board is greater than the distance from the second part to the first circuit board; along the first direction, the circuit board has two opposite surfaces, and the two surfaces include a first surface and a second surface, function devices are arranged on the first surface and / or the second surface, function devices are arranged at the position of the circuit board assembly corresponding to the first part, and the number of surfaces provided with function devices is a first preset value; function devices are arranged at the position of the circuit board assembly corresponding to the second part, and the number of surfaces provided with function devices is a second preset value, and the first preset value is greater than the second preset value.

[0005] Exemplarily, the first direction is the Z-axis direction in the embodiment.

[0006] Exemplarily, the plane where the first part is located is parallel to the plane where the second part is located.

[0007] Exemplarily, the plane where each circuit board is located is parallel to the plane where the first part is located.

[0008] Exemplarily, the position of the circuit board assembly corresponding to the first part is the overlapping area of the projection of the circuit board assembly on the plane formed by the X-axis and the Y-axis and the projection of the first part on the plane formed by the X-axis and the Y-axis.

[0009] Exemplarily, the position of the circuit board assembly corresponding to the second part is the overlapping area of the projection of the circuit board assembly on the plane formed by the X-axis and the Y-axis and the projection of the second part on the plane formed by the X-axis and the Y-axis.

[0010] Since each circuit board only includes two surfaces, the number of surfaces for arranging functional devices is not only related to which surface of the circuit board the functional devices are arranged on, but also related to the number of circuit boards. Since the planes where the first part and the second part are located are different, the height limit of the housing structure for the circuit board assembly is different. In the embodiments of the present application, by flexibly utilizing the height limit difference, the number of circuit boards is increased in the Z-axis direction, and the number of surfaces for arranging functional devices at different positions is different. Or, the number of circuit boards is the same, but due to the different number of surfaces for arranging functional devices, the height of the circuit board assembly in the Z-axis direction is different, fully utilizing the space of the electronic device in the Z-axis direction, increasing the device layout area, and improving the device integration, so as to solve the problem of insufficient layout area.

[0011] According to the first aspect, at the position of the circuit board assembly corresponding to the first part, the number of circuit boards is a third preset value, and at the position of the circuit board assembly corresponding to the second part, the number of circuit boards is a fourth preset value, and the third preset value is greater than or equal to the fourth preset value.

[0012] Exemplarily, at the position of the circuit board assembly corresponding to the first part of the housing structure, the number of circuit boards is three, and at the position of the circuit board assembly corresponding to the second part of the housing structure, the number of circuit boards is two. The number of surfaces of the three circuit boards is six, and the number of surfaces of the two circuit boards is four. Functional devices are arranged on five of the six surfaces, and functional devices are arranged on three of the four surfaces.

[0013] Exemplarily, at the position of the circuit board assembly corresponding to the first part of the housing structure, the number of circuit boards is two, and functional devices are arranged on all four surfaces of the two circuit boards. At the position of the circuit board assembly corresponding to the second part of the housing structure, the number of circuit boards is two, and functional devices are arranged on three of the four surfaces of the two circuit boards.

[0014] According to the first aspect, or any implementation of the above first aspect, the circuit board assembly further includes at least one layer of a third circuit board. The first circuit board includes at least a first region and a second region. The second circuit board is at least located in the first region, and the first circuit board and at least one layer of the second circuit board are stacked at intervals in sequence. The third circuit board is at least located in the second region, and the first circuit board and at least one layer of the third circuit board are stacked at intervals in sequence. The circuit board assembly further includes a support connecting member located between adjacent two circuit boards for supporting the circuit boards and electrically connecting the adjacent two circuit boards. The first region faces the first part, and the second region faces the second part. Functional devices are provided in the first region, and the number of surfaces provided with functional devices is a first preset value. Functional devices are provided in the second region, and the number of surfaces provided with functional devices is a second preset value.

[0015] That is, the number of circuit boards is relatively large, so that more functional devices can be provided without occupying the size of the horizontal plane of the electronic device.

[0016] Exemplarily, the second circuit board is not only located in the first region but also can be located in other regions. The third circuit board is not only located in the second region but also can be located in other regions.

[0017] According to the first aspect, or any implementation of the above first aspect, the electronic device further includes a rear cover. The housing structure is the rear cover of the electronic device. Of course, the housing structure is not limited to the rear cover and can also be other structures.

[0018] When the housing structure is the rear cover, the specific structure of the circuit board assembly can be set according to the shape of the rear cover, thereby making full use of the space in the Z-axis direction, increasing the device layout area, improving the device integration degree, and solving the problem of insufficient layout area.

[0019] According to the first aspect, or any implementation of the above first aspect, the electronic device further includes a rear cover, and a decorative hole is provided on the rear cover. The housing structure includes a camera decorative member (abbreviated as a decorative member). The camera decorative member includes a shielding portion and a skirt. The skirt at least partially surrounds the shielding portion. The decorative member is fixed to the battery cover through the skirt, and the shielding portion passes through the decorative hole and is exposed. The first part is the shielding portion, and the second part is the skirt. Among them, H1 > H2 > H3, where H1 is the distance from the shielding portion to the first circuit board, H2 is the distance from the rear cover to the first circuit board, and H3 is the distance from the skirt to the first circuit board. The first circuit board includes a first region, a second region, and a third region. The first region faces the shielding portion, the second region faces the skirt, and the third region faces a preset region of the rear cover, where the preset region of the rear cover is the overlapping part of the projection of the rear cover on the plane where the first circuit board is located and the third region. The number of surfaces provided with functional devices in the first region is greater than the number of surfaces provided with functional devices in the second region, and is greater than the number of surfaces provided with functional devices in the third region.

[0020] That is to say, the space between the plane where the shielding part is located and the first circuit board is relatively large, the space between the plane where the back cover is located and the first circuit board is moderate, and the space between the plane where the skirt is located and the first circuit board is relatively small. More functional devices and / or functional devices with a relatively large height are arranged in the area with a relatively large space, a moderate number of functional devices and / or functional devices with a moderate height are arranged in the area with a moderate space, and fewer functional devices and / or functional devices with a relatively small height are arranged in the area with a relatively small space, so as to make full use of the space of the electronic device in the Z-axis direction and solve the problem of insufficient layout area.

[0021] According to the first aspect, or any implementation manner of the above first aspect, along the second direction, the second region includes a first sub-region and a second sub-region arranged on both sides of the first region, wherein the second direction is perpendicular to the first direction; the circuit board assembly includes a first circuit board, two layers of second circuit boards and one layer of third circuit board. The two layers of second circuit boards are arranged in a stacked and spaced manner in the first region, and the second circuit board adjacent to the first circuit board extends to the second sub-region and the third region. The third circuit board is at least arranged in the second sub-region; the first surface is located on the side of the second surface away from the housing structure; functional devices are arranged on both surfaces of the first circuit board, functional devices are arranged on both surfaces of the second circuit board adjacent to the first circuit board, functional devices are arranged on the second surface of the second circuit board far from the first circuit board, and functional devices are arranged on the second surface of the third circuit board.

[0022] That is, the first region, the second sub-region and the third region share the same second circuit board, so as to reduce the number of circuit boards and further simplify the process steps.

[0023] Exemplarily, the second direction is the Y-axis direction in the embodiment.

[0024] According to the first aspect, or any implementation manner of the above first aspect, along the first direction, the height of the first functional device is less than the height of the second functional device, wherein the first functional device is the functional device with the highest height arranged on the second surface of the first circuit board at the first sub-region, and the second functional device is the functional device with the highest height arranged on the second surface of the first circuit board in other regions. So as to reduce the thickness of the support connecting piece at the first sub-region, and further ensure that the overall thickness of the circuit board assembly at the first sub-region is relatively small.

[0025] According to the first aspect, or any implementation manner of the above first aspect, along the first direction, the height of the functional device on the second surface of the third circuit board is greater than the height of the functional device on the surface of other circuit boards. That is, the functional devices with relatively high heights are concentratedly arranged on the second surface of the third circuit board, so as to avoid the waste of the Z-axis space caused by the uneven heights of the functional devices arranged in other regions.

[0026] According to the first aspect, or any implementation of the above first aspect, the functional devices on the second surface of the third circuit board include devices with a relatively high height such as board-to-board connectors.

[0027] According to the first aspect, or any implementation of the above first aspect, the second surface of the first circuit board, the first surface of the second circuit board adjacent to the first circuit board, and the support connecting member enclose a first accommodation space, the second surface of the second circuit board adjacent to the first circuit board, the first surface of the second circuit board away from the first circuit board, and the support connecting member enclose a second accommodation space, and the second surface of the first circuit board, the first surface of the third circuit board, and the support connecting member enclose a third accommodation space; the functional devices on the second surface of the first circuit board and corresponding to the first area, the second sub-area, and the third area and the functional devices on the first surface of the second circuit board adjacent to the first circuit board are all located in the first accommodation space, the functional devices on the second surface of the second circuit board adjacent to the first circuit board and corresponding to the first area are located in the second accommodation space, and the functional devices on the second surface of the first circuit board and corresponding to the first sub-area are located in the third accommodation space to protect the functional devices.

[0028] According to the first aspect, or any implementation of the above first aspect, shielding covers are provided on the outer sides of at least some of the functional devices on the first surface of the first circuit board, the second surface of the second circuit board away from the first circuit board, and the second surface of the second circuit board adjacent to the first circuit board and corresponding to the second sub-area to protect the functional devices.

[0029] Exemplarily, shielding covers are provided on the outer sides of the functional devices on the first surface of the first circuit board, shielding covers are provided on the outer sides of the functional devices on the second surface of the second circuit board away from the first circuit board, and / or shielding covers are provided on the outer sides of the functional devices on the second surface of the second circuit board adjacent to the first circuit board and corresponding to the second sub-area.

[0030] According to the first aspect, or any implementation of the above first aspect, a light-transmitting hole is formed in the shielding portion; the electronic device further includes a camera module, the projection of the camera module on the plane where the first portion is located overlaps with the projection of the shielding portion on the plane where the first portion is located, and the camera module collects light sources through the light-transmitting hole to implement the shooting function of the electronic device and improve the shooting effect of the camera module.

[0031] According to the first aspect, or any implementation of the above first aspect, the thickness of the camera module is greater than the distance from the shielding part to the first circuit board; the first circuit board further includes a fourth area opposite to the shielding part, and the first circuit board is provided with an avoidance hole at the fourth area, and one end of the camera module passes through the avoidance hole. That is, it ensures the normal operation of the camera module, makes full use of the space of the electronic device in the Z-axis direction, increases the device layout area, improves the device integration, and solves the problem of insufficient layout area.

[0032] According to the first aspect, or any implementation of the above first aspect, the difference between the distance from the shielding part to the first circuit board and the thickness of the camera module is within a preset range; the first circuit board further includes a fourth area opposite to the shielding part, and the camera module is arranged at the fourth area of the first circuit board, and the first circuit board is used to fix and support the camera module. In this way, the setting position of the camera module is more flexible, and the area of the support member of the middle frame can be released, which is convenient for arranging other structures on the support member.

[0033] According to the first aspect, or any implementation of the above first aspect, the difference between the distance from the shielding part to the third circuit board and the thickness of the camera module is within a preset range; the third circuit board extends to the lower part of the camera module, and the camera module is arranged on the third circuit board, and the third circuit board is used to fix and support the camera module. In this way, the setting position of the camera module is more flexible, and the area of the support member of the middle frame can be released, which is convenient for arranging other structures on the support member.

[0034] According to the first aspect, or any implementation of the above first aspect, when the circuit board assembly further includes a support connecting member, the support connecting member includes a frame board. The frame board is a kind of PCB, and its structure is the same as or basically the same as that of a conventional PCB, and it has traces for realizing electrical connection inside. The frame board can be obtained by dividing a whole PCB. When the frame board is arranged on the circuit board, the frame board occupies a small area of the circuit board, and more devices can be arranged by saving the area.

[0035] According to the first aspect, or any implementation of the above first aspect, when the circuit board assembly further includes a support connecting member, the support connecting member and the circuit board are integrally formed. For example, the above integrally formed support connecting member and circuit board can be formed by the manufacturing process of the cavity (local depression) structure of the PCB, and since the support connecting member and the circuit board do not need to be reflow soldered, the number of reflows can be reduced, and further, when the number of reflows is large, the functional devices on the circuit board can be prevented from being affected. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 FIG. is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

[0037] Figure 2 An exploded view of an electronic device provided by an embodiment of the present application;

[0038] Figure 3 is Figure 1 A cross-sectional view of the electronic device shown in the direction of WW';

[0039] Figure 4 A schematic structural diagram of a decorative member provided by an embodiment of the present application;

[0040] Figure 5 A top-view positional relationship diagram of the decorative member and the circuit board assembly provided by an embodiment of the present application;

[0041] Figure 6 A side-view positional relationship diagram of the decorative member, the circuit board assembly, and the battery cover provided by an embodiment of the present application;

[0042] Figure 7 Another side-view positional relationship diagram of the decorative member, the circuit board assembly, and the battery cover provided by an embodiment of the present application;

[0043] Figure 8 Another side-view positional relationship diagram of the decorative member, the circuit board assembly, and the battery cover provided by an embodiment of the present application;

[0044] Figure 9 Another side-view positional relationship diagram of the decorative member, the circuit board assembly, and the battery cover provided by an embodiment of the present application;

[0045] Figure 10 A flowchart of a preparation method of a circuit board assembly provided by an embodiment of the present application. Detailed implementation manners

[0046] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0047] The term "and / or" in this article is merely a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0048] In the description of the embodiments of the present application, the terms "first" and "second" in the specification and claims are used to distinguish different objects, rather than to describe a specific order of the objects. For example, the first target object and the second target object are used to distinguish different target objects, rather than to describe a specific order of the target objects.

[0049] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of words such as "exemplary" or "for example" is intended to present relevant concepts in a specific manner.

[0050] In the description of the embodiments of the present application, unless otherwise specified, the meaning of "a plurality of" refers to two or more. For example, a plurality of processing units refers to two or more processing units; a plurality of systems refers to two or more systems.

[0051] The embodiments of the present application provide an electronic device. The electronic device provided by the embodiments of the present application may be a mobile phone, a tablet computer, a laptop computer, a personal digital assistant (PDA for short), a vehicle-mounted computer, a television, a smart wearable device (such as a smart watch, a smart bracelet, etc.), a smart home device, etc. The embodiments of the present application do not make special limitations on the specific form of the above-mentioned electronic device. For the convenience of description below, the electronic device is taken as a mobile phone as an example for illustration.

[0052] See Figure 1 , Figure 1 which is a schematic structural diagram of an electronic device provided by the embodiments of the present application. As Figure 1 shown, the mobile phone includes a middle frame 10, a housing assembly 20 and a display screen 30.

[0053] Figure 1 Among them, the mobile phone 100 is in the shape of a rectangular flat plate. In order to facilitate a clear description of the subsequent structural features and the positional relationship of the structural features, the positional relationship of the various structures in the mobile phone is defined in the X-axis direction, the Y-axis direction and the Z-axis direction. Among them, the X-axis direction is the width direction of the mobile phone, the Y-axis direction (also called the second direction) is the length direction of the mobile phone, and the Z-axis direction (also called the first direction) is the thickness direction of the mobile phone. It can be understood that the coordinate system (i.e., the X-axis, the Y-axis and the Z-axis) of the electronic device can be set flexibly according to actual needs, and no specific limitation is made here. In other alternative embodiments, the shape of the electronic device may also be a square flat plate, a circular flat plate, an oval flat plate, etc. Of course, the electronic device may also be a foldable electronic device, etc.

[0054] See Figure 2, Figure 2 is an exploded view of an electronic device provided by an embodiment of the present application. As Figure 1 and Figure 2 shown, the middle frame 10 includes an appearance part 11 and a support part (not shown in the figure). The appearance part 11 of the middle frame 10, the housing assembly 20, and the display screen 30 can enclose a receiving cavity. The support part of the middle frame 10 is located between the display screen 30 and the housing assembly 20. Structures such as a printed circuit board (PCB) 40, a flexible printed circuit (FPC) 50, a camera module 60, and a battery 70 are arranged in the receiving cavity. The support part of the middle frame 10 can support some structures in the receiving cavity and / or the display screen 30. For example, the display screen 30 is fixed to the support part by an adhesive tape.

[0055] In the embodiment of the present application, the PCB 40 includes a main board 41 and a sub-board 42. Along the Y-axis direction, the main board 41 and the sub-board 42 are respectively arranged on both sides of the battery 70. The FPC 50 passes through the battery 70 (located on one side of the battery 70 along the Z-axis direction) to electrically connect the main board 41 and the sub-board 42, so as to realize the transmission of data and signals between the main board 41 and the sub-board 42.

[0056] Function devices such as a control chip are integrated on the main board 40. The control chip includes, for example, a system on chip (SoC), an application processor (AP), radio frequency devices, and baseband devices (not shown in the figure), etc. Among them, the SoC integrates, for example, a central processing unit (CPU), a graphic processing unit (GPU), and a modem, etc.

[0057] Function devices such as a universal serial bus (USB) device are integrated on the sub-board 50.

[0058] The so-called function devices are all electronic components arranged on the PCB. Exemplarily, they include both chips with control functions, USB devices, etc., and passive devices such as resistors, capacitors, and inductors.

[0059] The camera module 60 includes, for example, a rear camera 61. The number of rear cameras 61 can be one or more. When the number of rear cameras 61 is multiple, the functions of the multiple rear cameras 61 can be different. In a possible implementation, the number of rear cameras 61 is, for example, three. One of the rear cameras 61 is responsible for the main camera, one of the rear cameras 61 is responsible for zooming, and one of the rear cameras 61 is responsible for wide-angle, etc. In some embodiments, the camera module 60 further includes a flash 62. When the user uses the camera function of the mobile phone to take pictures in a dark environment, the flash 62 can provide supplementary light to improve the shooting effect.

[0060] The rear camera 61 is electrically connected to the main board 41 through the FPC 50. In some embodiments, a board to board (BTB) connector (not shown in the figure) is disposed between the FPC 50 of the rear camera 61 and the main board 41, and the FPC 50 of the rear camera 61 is electrically connected to the main board 41 through this BTB. Similarly, the FPC 50 that electrically connects the main board 41 and the daughter board 42 can also be electrically connected to the main board 41 and the daughter board 42 through a BTB, that is, a BTB can be disposed between the main board 41 and the FPC 50 (the FPC 50 that electrically connects the main board 41 and the daughter board 42), and the FPC 50 is electrically connected to the main board 41 through this BTB. Another BTB can be disposed between the daughter board 42 and the FPC 50, and the same FPC 50 is electrically connected to the daughter board 42 through this BTB, so that the main board 41 and the daughter board 42 are electrically connected through the FPC 50.

[0061] The battery 70 is used to supply power to the display screen 30, at least some of the functional devices on the main board 41, at least some of the functional devices on the daughter board 42, the camera module 60, etc., to ensure their normal operation.

[0062] Continue to refer to Figure 1 and Figure 2 , the housing assembly 20 includes a battery cover (also referred to as a rear cover or a back shell) 21 and a decorative member 22. A decorative hole 211 is formed on the battery cover 21.

[0063] Refer to Figure 3 , Figure 3 is Figure 1 a cross-sectional view of the electronic device along the WW' direction. It should be noted that, in order to more clearly show the positional relationship between the battery cover 21, the decorative member 22, and the camera module 60, Figure 3 only the battery cover 21, the decorative member 22, and the camera module 60 are shown, and other structures, such as the display screen 30 and other structures, are not shown. As Figure 2 and Figure 3As shown, the decorative member 22 includes a shielding portion 221 and a skirt portion 222. The skirt portion 222 is disposed around the shielding portion 221. The plane where the shielding portion 221 is located (i.e., the plane formed by the X-axis and the Y-axis) is different from the plane where the skirt portion 222 is located (i.e., the plane formed by the X-axis and the Y-axis), that is, the shielding portion 221 and the skirt portion 222 are respectively located in different planes. Correspondingly, the decorative member 22 further includes a connecting portion 223 connecting the shielding portion 221 and the skirt portion 222. A light-transmitting hole 2211 is formed in the shielding portion 221.

[0064] The decorative member 22 is fixed to the battery cover 21 through the skirt portion 222. The shielding portion 221 of the decorative member 22 passes through the decorative hole 211 of the battery cover 21 and is exposed. At least a part of the connecting portion 223 is located in the decorative hole 211. Along the Z-axis direction, the rear camera 61 is opposite to the shielding portion 221, that is, the projection of the rear camera 61 on the plane formed by the X-axis and the Y-axis overlaps with the projection of the shielding portion 221 on the plane formed by the X-axis and the Y-axis. The rear camera 61 collects light sources through the light-transmitting hole 2211 to implement functions such as taking pictures and / or shooting videos.

[0065] It should be noted here that Figures 1-3 Taking the connecting portion 223 being perpendicular to the shielding portion 221 and the skirt portion 222 respectively as an example for illustration, but it does not constitute a limitation to this application. In other alternative embodiments of this application, see Figure 4 , Figure 4 is a schematic structural diagram of a decorative member provided by an embodiment of this application. As Figure 4 shown, the connecting portion 223 can also be inclined. Exemplarily, the connecting portion 223 is in the shape of a crater. The so-called crater shape is a trumpet shape that is narrow at the top and wide at the bottom. By setting the crater shape, the appearance quality of the electronic device can be improved.

[0066] Regarding the shape of the decorative hole 211, the embodiment of this application does not limit the shape of the decorative hole 211. Exemplarily, the shape of the decorative hole 211 can include a runway shape, a circular shape, a rounded square shape, or a rounded rectangular shape, etc. The embodiment of this application takes the shape of the decorative hole 211 as a circular shape for illustration. It can be understood that the runway shape can be: a shape formed by two arcs and two opposite sides of a rectangle, where the two arcs are oppositely arranged and each arc is adjacent to the opposite side.

[0067] It can be understood that the shape of the shielding portion 221 corresponds to the shape of the decorative hole 211. Exemplarily, when the shape of the decorative hole 211 is circular, the shape of the shielding portion 221 is also circular.

[0068] As can be seen from the background art, with the gradual enrichment of functions and the increasing performance of electronic devices such as mobile phones and tablet computers, it is required that more devices can be integrated on the PCB (i.e., the main board and / or the secondary board). The PCB in conventional electronic devices has only one layer and can only arrange more devices in the planar direction. However, with the increase in battery endurance capacity (i.e., the increase in the size of the battery), the size of the circuit board decreases accordingly; and in order to meet better shooting requirements, the number of cameras included in the camera module is increasing, and the size of the camera module becomes larger, resulting in an increasingly large hole in the center area of the main board to avoid the camera module, and then resulting in a reduction in the projected area of the main board on the plane composed of the X-axis and the Y-axis. In this way, there is a lack of PCB layout area. In other words, the area of the PCB for setting functional devices is small and cannot meet the requirement of integrating more devices on the PCB.

[0069] Based on this, the embodiment of the present application further provides an electronic device, which includes a housing structure and a circuit board assembly located on one side of the housing structure. When the heights of different regions of the housing structure are different, the number of surfaces (the surfaces of the circuit board) for setting functional devices corresponding to different regions of the housing structure in the circuit board assembly is different. The number of surfaces for setting functional devices corresponding to the same region (the same height) but different positions of the housing structure in the circuit board assembly may be the same or different. Among them, the circuit board assembly includes at least two layers of circuit boards. Along the Z-axis direction, each layer of circuit board includes two opposite surfaces. The different number of surfaces for setting functional devices may be that the number of circuit board layers stacked corresponding to different regions of the housing structure in the circuit board assembly is different, and functional devices are arranged on both surfaces of each circuit board, or the number of circuit board layers stacked corresponding to different regions of the housing structure in the circuit board assembly is the same but the number of surfaces for setting functional devices is different, or the number of circuit board layers stacked corresponding to different regions of the housing structure in the circuit board assembly is different, and the number of surfaces for setting functional devices is also different, etc. That is, the number of circuit boards is increased by using the space in the Z-axis direction of the electronic device, thereby increasing the device arrangement area and improving the device integration degree. And the height limits of the circuit board assembly by different regions of the housing structure are different. Correspondingly, the number of surfaces for setting functional devices in the circuit board assembly opposite to different regions is different, making full use of the space in the Z-axis direction of the electronic device to solve the problem of insufficient layout area. Among them, the housing structure may be, for example, the decorative part in the above text, or a battery cover (for example, for an electronic device with different heights in different regions of the battery cover, such as a smart watch), etc. The embodiment of the present application does not limit this.

[0070] The following describes the specific structures of the housing structure and the circuit board assembly provided in the embodiments of the present application, as well as the positional relationships of the respective structures. For the convenience and clarity of describing the subsequent solutions, the following examples describe the specific structures of the housing structure and the circuit board assembly, as well as the positional relationships of the respective structures, with the housing structure being a decorative component. The following content does not limit the present application.

[0071] It can be understood that when the housing structure is a battery cover or the like, the specific structures of different regions of the battery cover corresponding to the circuit board assembly and the resulting effects are the same as those in the following examples where the housing structure is a decorative component. The specific structures of the circuit board assembly and the positional relationships of the respective structures when the housing structure is a battery cover will not be elaborated further below.

[0072] See Figure 5 and Figure 6 , Figure 5 which is a top view positional relationship diagram of the decorative component and the circuit board assembly provided in the embodiments of the present application. Figure 6 which is a side view positional relationship diagram of the decorative component, the circuit board assembly, and the battery cover provided in the embodiments of the present application. As shown in Figure 5 and Figure 6As shown, the above-mentioned PCB 40 includes a circuit board assembly 43, that is, the main board 41 and / or the secondary board 42 in the above content are the circuit board assembly 43. Among them, in the embodiments of the present application, the main board 41 is taken as an example of the circuit board assembly 43 for illustration. The circuit board assembly 43 includes a first circuit board 431. The first circuit board 431 includes at least two regions. The at least two regions include a first region A1 and a second region A2. The circuit board assembly 43 further includes at least one layer of a second circuit board 432 stacked at the first region A1 and at least one layer of a third circuit board 433 stacked at the second region A2. Along the Z-axis direction, adjacent two layers of circuit boards are stacked at intervals. The so-called adjacent two circuit boards are stacked at intervals means that along the Z-axis direction, there is a certain distance between adjacent two layers of circuit boards and they do not directly contact. The circuit board assembly 43 further includes a support connecting member 434. Along the Z-axis direction, the support connecting member 434 is located between adjacent two layers of circuit boards, used to support the circuit boards and electrically connect adjacent two circuit boards. The adjacent two circuit boards and the support connecting member 434 located between adjacent two layers of circuit boards enclose an accommodation space. Along the Z-axis direction, each layer of circuit board includes a first surface and a second surface facing away from each other. Function devices 80 are provided on the first surface and / or the second surface of each layer of circuit board, and the function devices 80 located between adjacent two layers of circuit boards are arranged in the accommodation space. That is, along the Z-axis direction, the first circuit board 431, the second circuit board 432, and the third circuit board 433 all include a first surface and a second surface facing away from each other. Function devices 80 are provided on the first surface and / or the second surface of the first circuit board 431, function devices 80 are provided on the first surface and / or the second surface of the second circuit board 432, and function devices 80 are provided on the first surface and / or the second surface of the third circuit board 433. The function devices 80 between the first circuit board 431 and one of the second circuit boards 432 are located in the accommodation space enclosed by the first circuit board 431, one of the second circuit boards 43, and the support connecting member 434 between the two circuit boards. The function devices 80 between the two second circuit boards 432 are located in the accommodation space enclosed by the two second circuit boards 432 and the support connecting member 434 between the two second circuit boards 432. The function devices 80 between the first circuit board 431 and the third circuit board 433 are located in the accommodation space enclosed by the first circuit board 431, the third circuit board 433, and the support connecting member 434 between the two circuit boards.

[0073] As can be seen from the foregoing, the decorative member includes a shielding portion 221 (also referred to as the first part) and a skirt 222 (also referred to as the second part), and the shielding portion 221 and the skirt 222 are located in different planes. Specifically, along the Z-axis direction, the distance from the plane where the shielding portion 221 is located to the first circuit board 431 is greater than the distance from the plane where the skirt 222 is located to the first circuit board 431. The first region A1 is opposite to the shielding portion 221, and the second region A2 is opposite to the skirt 222, that is, the projection of the shielding portion 221 on the first circuit board 431 overlaps with the first region A1, and the projection of the skirt 222 on the first circuit board 431 overlaps with the second region A2. The number of surfaces provided with functional devices in the first region A1 is greater than the number of surfaces provided with functional devices in the second region A2. Since each circuit board only includes two surfaces, the number of surfaces provided with functional devices is related to the number of circuit boards. When the number of surfaces provided with functional devices in the first region A1 is greater than the number of surfaces provided with functional devices in the second region A2, it can be that the number of second circuit boards 432 located in the first region A1 is greater than the number of third circuit boards 433 located in the second region A2, or the number of second circuit boards 432 located in the first region A1 is the same as the number of third circuit boards 433 located in the second region A2, but no functional devices are provided on the first surface or the second surface of the third circuit board 433 located in the second region A2, etc. In this way, the heights of the first region A1 and the second region A2, and the circuit board assembly 43 in the Z-axis direction are different, and thus can correspond to different parts of the decorative member (the first region A1 corresponds to the first part, and the second region A2 corresponds to the second part). Compared with setting more functional devices in the planar direction, the embodiment of the present application can make full use of the space of the electronic device in the Z-axis direction to solve the problem of insufficient layout area.

[0074] That is to say, the distance from the plane where the shielding portion 221 is located to the first circuit board 431 is greater than the distance from the plane where the skirt 222 is located to the first circuit board 431. Therefore, the space between the plane where the shielding portion 221 is located and the first circuit board 431 is larger, and the space between the plane where the skirt 222 is located and the first circuit board 431 is smaller. More functional devices 80 and / or functional devices 80 with a larger height are provided in the region with a larger space, and fewer functional devices 80 and / or functional devices 80 with a smaller height are provided in the region with a smaller space, so as to make full use of the space of the electronic device in the Z-axis direction to solve the problem of insufficient layout area.

[0075] It should be noted that the number of surfaces of the same area where functional devices are arranged at different positions can be the same or different, which can be specifically determined according to the height of the functional devices arranged at different positions. For example, the second area A2 includes a first sub-area A21 and a second sub-area A22. Both the first sub-area A21 and the second sub-area A22 are provided with two layers of circuit boards. Devices with a relatively high height such as BTB are arranged at the first sub-area A21. Therefore, functional devices are arranged on only three of the four surfaces of the first sub-area A21, while functional devices are arranged on all four surfaces of the second sub-area A22.

[0076] Exemplarily, continue to refer to Figure 5 and Figure 6 , the circuit board assembly 43 includes a first circuit board 431. The first circuit board 431 includes a first area A1, a second area A2, and a third area A3. The first area A1 is opposite to the shielding portion 221, that is, the projection of the shielding portion 22 on the plane where the first circuit board 431 is located overlaps with the first area A1. The second area A2 is opposite to the skirt 222, that is, the projection of the skirt 222 on the plane where the first circuit board 431 is located overlaps with the second area A2. The third area A3 is opposite to the preset area of the battery cover 21. The preset area of the battery cover 21 is the part where the projection of the battery cover 21 on the plane where the first circuit board 431 is located overlaps with the third area A3. The second area A2 includes a first sub-area A21 and a second sub-area A22. The first sub-area A21 and the second sub-area A22 correspond to different positions of the skirt 222. For example, the first sub-area A21 corresponds to the first position 2221 of the skirt 222, and the second sub-area A22 corresponds to the second position 2222 of the skirt 222. Along the Y-axis direction, the first position 2221 and the second position 2222 are located on opposite sides of the shielding portion 221. The shielding portion 221, the skirt 222, and the preset area of the battery cover 21 are all located in different planes. Specifically, along the Z-axis direction, the distance H1 from the plane where the shielding portion 221 is located to the first circuit board 431 is greater than the distance H2 from the plane where the preset area of the battery cover 21 is located to the first circuit board 431, and the distance H2 from the plane where the preset area of the battery cover 21 is located to the first circuit board 431 is greater than the distance H3 from the plane where the skirt 222 is located to the first circuit board 431.

[0077] The circuit board assembly 43 further includes two layers of second circuit boards 432 stacked in the first area A1 and one layer of third circuit board 433 stacked in the first sub-area A21 of the second area A2. The second circuit board 432 adjacent to the first circuit board 431 among the two layers of second circuit boards 432 disposed in the first area A1 extends to the second sub-area A22 of the second area A2 and the third area A3. This is because most of the area opposite to the shielding portion 221 is used to dispose the camera module 60, and the remaining partial area can be used to dispose the circuit board. The circuit board in the area adjacent to the remaining partial area (i.e., the area where the second sub-area A22 is located) and the circuit board in the area of the third area A3 adjacent to the area where the second sub-area A22 is located can be the same circuit board as the circuit board disposed in the remaining partial area, so as to reduce the number of circuit boards and further simplify the process steps. In this way, the first area A1 includes three layers of circuit boards (one layer of first circuit board 431 and two layers of second circuit boards 432), the first sub-area A21 of the second area A2 includes two layers of circuit boards (one layer of first circuit board 431 and one layer of third circuit board 433), the second sub-area A22 of the second area A2 includes two layers of circuit boards (one layer of first circuit board 431 and one layer of second circuit board 432), the third area A3 includes two layers of circuit boards (one layer of first circuit board 431 and one layer of second circuit board 432), and the second circuit board 432 in the second sub-area A22 and the second circuit board 432 in the third area A3 are the same circuit board as one of the second circuit boards 432 in the first area A1 (the second circuit board 432 adjacent to the first circuit board 431).

[0078] In the Z-axis direction, the first circuit board 431 and the third circuit board 433 are stacked at intervals, and the first circuit board 431 and the two second circuit boards 432 are stacked at intervals in sequence, that is, the first circuit board 431 and one of the second circuit boards 432 (the second circuit board 432 adjacent to the first circuit board 431) are stacked at intervals, and one of the second circuit boards 432 (the second circuit board 432 adjacent to the first circuit board 431) and the other second circuit board 432 (the second circuit board 432 far from the first circuit board 431) are stacked at intervals.

[0079] The circuit board assembly 43 further includes a support connecting member 434. Along the Z-axis direction, at least one support connecting member 434 (also referred to as the first support connecting member) is provided between the first circuit board 431 and one of the second circuit boards 432. The at least one support connecting member 434 is, for example, disposed at the periphery of the second circuit board 432. The support connecting member 434 is used to support the second circuit board 432 and electrically connect the first circuit board 431 and the second circuit board 432. At least one support connecting member 434 (also referred to as the second support connecting member) is also provided between one of the second circuit boards 432 (the second circuit board 432 adjacent to the first circuit board 431) and the other second circuit board 432 (the second circuit board 432 away from the first circuit board 431). The at least one support connecting member 434 is, for example, disposed at the periphery of the other second circuit board 432. The support connecting member 434 is used to support the other second circuit board 432 and electrically connect the two second circuit boards 432. At least one support connecting member 434 (also referred to as the third support connecting member) is also provided between the first circuit board 431 and the third circuit board 433. The at least one support connecting member 434 is, for example, disposed at the periphery of the third circuit board 433. The support connecting member 434 is used to support the third circuit board 433 and electrically connect the first circuit board 431 and the third circuit board 433. Along the Z-axis direction, each circuit board includes a first surface and a second surface facing away from each other. The second surface is on the side of the first surface facing away from the display screen 30. In other words, the first surface is on the side of the second surface facing away from the battery cover 21. The second surface of the first circuit board 431, the first surface of the third circuit board 433, and the third support connecting member 434 between the first circuit board 431 and the third circuit board 433 enclose an accommodation space (also referred to as the third accommodation space). The second surface of the first circuit board 431, the first surface of one of the second circuit boards 432, and the first support connecting member 434 between the first circuit board 431 and the second circuit board 432 enclose another accommodation space (also referred to as the first accommodation space). The second surface of one of the second circuit boards 432, the first surface of the other second circuit board 432, and the second support connecting member 434 between the two second circuit boards 432 enclose yet another accommodation space (also referred to as the second accommodation space).

[0080] Functional devices 80 are provided on both the first surface and the second surface of the first circuit board 431. Functional devices 80 are provided on both the first surface and the second surface of one of the second circuit boards 432 (the second circuit board 432 adjacent to the first circuit board 431). Functional devices 80 are provided only on the second surface of the other second circuit board 432. Functional devices 80 are provided only on the second surface of the third circuit board 433. Moreover, the height of the tallest functional device 80 at the first sub-region A21 of the second region A2 is less than the height of the tallest functional device 80 at the first region A1, so as to reduce the thickness of the support connecting member 434 between the first circuit board 431 and the third circuit board 433, thereby ensuring that the overall thickness of the circuit board assembly 43 at the first sub-region A21 is as small as possible. Also, the functional devices 80 on the second surface of the first circuit board 431 corresponding to the first region A1, the second sub-region A22, and the third region A3, and the functional devices 80 on the first surface of the second circuit board 432 are all located in the first accommodation space. The functional devices 80 on the second surface of the second circuit board 432 adjacent to the first circuit board 431 corresponding to the first region A1 are located in the second accommodation space. The functional devices 80 on the second surface of the first circuit board 431 corresponding to the first sub-region are located in the third accommodation space, so as to protect the functional devices 80. In addition, a shielding cover 90 can be provided outside the functional devices 80 not provided in the accommodation space to protect the functional devices 80. For example, shielding covers 90 are provided outside the functional devices 80 on the first surface of the first circuit board 431 and the functional devices 80 on the second surface of the second circuit board 432, etc.

[0081] That is to say, due to the different distances from the shielding portion 221 of the decorative member 22, the skirt 222 of the decorative member 22, and the preset area of the battery cover 21 to the first circuit board 41, that is, the different heights of the shielding portion 221 of the decorative member 22, the skirt 222 of the decorative member 22, and the preset area of the battery cover 21 restricting the circuit board assembly 43, by utilizing the height difference limit, functional devices 80 are arranged on five surfaces in the first area A1 (two surfaces of the first circuit board 431, two surfaces of one of the second circuit boards 432, and the second surface of the other second circuit board 432). Functional devices 80 are arranged on four surfaces in the second sub-area A22 of the second area A2 and the third area A3 (two surfaces of the first circuit board 431 and two surfaces of one of the second circuit boards 432). And because the height of the preset area of the battery cover 21 corresponding to the third area A3 is relatively high, the height of the functional device 80 on one of the surfaces in the third area A3 is relatively large. For example, at the position where the second surface of the second circuit board 432 corresponds to the third area A3, in this way, the thickness of the support connecting member 434 between the first circuit board 431 and the second circuit board 432 can be reduced. Functional devices are arranged on three surfaces in the first sub-area A21 of the second area A2, so that a functional device with a relatively high height can be arranged on one of the surfaces in the first sub-area A21 of the second area A2. For example, a BTB with a relatively high thickness is arranged on the second surface of the third circuit board 433, such as the BTB connecting the FPC 50 and the main board 41 in the above content. The Z-axis space of the whole machine is fully utilized to solve the problem of insufficient layout area.

[0082] It can be understood that the thickness of the support connecting member 434 can be determined according to the height and clearance of the actually arranged functional devices (the clearance of the functional devices on the two opposite surfaces of the two circuit boards in the Z-axis direction).

[0083] Regarding the type of the support connecting member 434, the embodiment of the present application does not limit the type of the support connecting member 434, as long as it can support the circuit board and can electrically connect two adjacent circuit boards.

[0084] In a possible implementation manner, continue to refer to Figure 6 , the support connecting member 434 includes a frame board (FB), and the FB is a PCB board with a hollow or partially hollow middle.

[0085] In another possible implementation manner, refer to Figure 7 , Figure 7 is another side view position relationship diagram of the decorative member, the circuit board assembly, and the battery cover provided by the embodiment of the present application. As Figure 7As shown, the support connector 434 is integrally formed with the circuit board, that is, the first support connector and one of the second circuit boards 432 are integrally formed, the second support connector and the other second circuit board 432 are integrally formed, and the third support connector and the third circuit board 433 are integrally formed. For example, the above integrally formed first support connector and one of the second circuit boards 432, the above integrally formed second support connector and the other second circuit board 432, and the above integrally formed third support connector and the third circuit board 433 can be formed through the manufacturing process of the cavity (local depression) structure of the Pcb.

[0086] When the main board in the mobile phone is the circuit board assembly 43, since both the circuit board assembly 43 and the camera module 60 are disposed in the area opposite to the shielding portion 221 of the decorative member 22, therefore, in order to avoid interference between the circuit board assembly 43 and the camera module 60, the circuit board assembly 43 can be correspondingly improved according to the thickness (dimension along the Z-axis) of the camera module 60.

[0087] In a possible implementation manner, the thickness of the camera module 60 is relatively thick. For example, the thickness of the camera module 60 is greater than the distance from the shielding portion 221 to the first circuit board 431. To avoid the camera module 60, continue to refer to Figure 6 , the first circuit board 431 further includes a fourth area A4, and the fourth area A4 is opposite to the shielding portion 221, that is, the projection of the shielding portion 221 on the first circuit board 431 overlaps with the fourth area A4. To avoid the camera, an avoidance hole is provided in the fourth area A4 of the first circuit board 431, and one end of the camera module 60 passes through the avoidance hole and is fixedly connected to the support member of the middle frame 10, and the camera module 60 is supported by the support member.

[0088] Regarding the size of the avoidance hole, the embodiments of the present application do not limit the size of the avoidance hole, and those skilled in the art can set it according to the actual situation, as long as it can avoid interference and shielding of the camera module 60 and ensure the normal operation of the camera module 60.

[0089] In another possible implementation manner, the thickness of the camera module 60 is moderate. For example, the difference between the distance from the shielding portion 221 to the first circuit board 431 and the thickness of the camera module 60 is within a preset range, and the preset range is, for example, between 0.5 - 3.5 mm, such as the difference between the distance from the shielding portion 221 to the first circuit board 431 and the thickness of the camera module 60 is 0.5 mm, 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm or 3.5 mm, etc. Refer to Figure 8 , Figure 8 is another side view positional relationship diagram of the decorative member, the circuit board assembly and the battery cover provided by the embodiments of the present application. As Figure 8As shown, the first circuit board 431 further includes a fourth region A4. The fourth region A4 is opposite to the shielding portion 221, that is, the projection of the shielding portion 221 on the first circuit board 431 overlaps with the fourth region A4. The camera module 60 is disposed at the fourth region A4 of the first circuit board 431. The first circuit board 431 is used to fix and support the camera module 60. In this way, the setting position of the camera module 60 is more flexible, and the area of the support member of the middle frame 10 can be released, facilitating the setting of other structures on the support member.

[0090] In another possible implementation, the thickness of the camera module 60 is relatively thin. For example, the difference between the distance from the shielding portion 221 to the third circuit board 433 and the thickness of the camera module 60 is within a preset range. The preset range is, for example, between 0.5 - 3.5 mm. For example, the difference between the distance from the shielding portion 221 to the third circuit board 433 and the thickness of the camera module 60 is 0.5 mm, 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm or 3.5 mm, etc. Refer to Figure 9 , Figure 9 which is another side view position relationship diagram of the decorative member, circuit board assembly and battery cover provided by the embodiments of the present application. As Figure 9 shown, the third circuit board 433 extends below the camera module 60. The camera module 60 is disposed on the third circuit board 433. That is, not only functional devices such as BTB are disposed on the second surface of the third circuit board 433, but also the camera module 60 is disposed. The third circuit board 433 is used to fix and support the camera module 60. In this way, the setting position of the camera module 60 is more flexible, and the area of the support member of the middle frame 10 can be released, facilitating the setting of other structures on the support member.

[0091] In summary, in the electronic device provided by the embodiments of the present application, due to the different distances from the shielding portion 221 of the decorative member 22, the skirt 222 of the decorative member 22 and the preset region of the battery cover 21 to the first circuit board 41, that is, the height limits of different positions of the decorative member 22 on the circuit board assembly 43 are different. By flexibly utilizing the height limit differences, the number of circuit boards is increased in the space in the Z-axis direction, and the number of surfaces for setting functional devices at different positions is different, making full use of the space in the Z-axis direction of the electronic device, increasing the device layout area, and improving the device integration degree, thus solving the problem of insufficient layout area.

[0092] The embodiments of the present application also provide a preparation method for a circuit board assembly, which is used to prepare the circuit board assembly as Figure 6 shown, and has the same beneficial effects. For the details not described in detail below, reference can be made to the description above. The preparation method of the circuit board assembly will be described below with reference to Figure 6 the circuit board assembly, and the following content does not constitute a limitation to the present application.

[0093] See Figure 10 , Figure 10 , which is a flowchart of a method for preparing a circuit board assembly provided by an embodiment of the present application. As Figure 10 shown, the method for preparing a circuit board assembly includes the following steps:

[0094] S101. Provide a first circuit board mother board, two second circuit board mother boards, and a third circuit board mother board, where each circuit board mother board includes a plurality of circuit board setting areas.

[0095] To simplify the process steps, a circuit board mother board with a larger size can be provided first. After devices are set on each circuit board setting area of the circuit board mother board, the circuit board mother board is divided into boards, where the division is performed according to the number of circuit board setting areas to form a plurality of circuit boards, that is, one circuit board setting area corresponds to one circuit board.

[0096] S102. Set a plurality of functional devices on the second surface of one of the second circuit board mother boards, where the number and type of functional devices in each circuit board setting area of the second circuit board mother board are the same.

[0097] S103. Set a plurality of second support connectors on the first surface of the second circuit board mother board in step S102, where the number of second support connectors in each circuit board setting area of the second circuit board mother board is the same.

[0098] It can be understood that before setting the second support connectors on the first surface of the second circuit board mother board, it is necessary to first form the second support connectors. For example, the second support connector mother board is first divided into boards to form a plurality of second support connectors. The specific steps for forming the second support connectors can refer to the existing technology, and the embodiments of the present application will not elaborate.

[0099] S104. Divide the second circuit board mother board on which the functional devices and the second support connectors have been set to form a plurality of second circuit boards, and the second surface of the second circuit board is provided with functional devices, and at least one second support connector is provided on the first surface.

[0100] The second circuit board 432 departing from the first circuit board 431 in the above content is formed through step S104.

[0101] S105. Set a plurality of functional devices and a plurality of first support connectors on the first surface of the other second circuit board mother board, where the number and type of functional devices in each circuit board setting area of the second circuit board mother board are the same, and the number of first support connectors in each circuit board setting area is the same.

[0102] It can be understood that before the first support connection member is disposed on the first surface of the second circuit board mother board, it is necessary to first form the first support connection member. For example, the mother board of the first support connection member is first divided into boards to form a plurality of first support connection members. The specific steps for forming the first support connection member can refer to the prior art and will not be elaborated in the embodiments of the present application.

[0103] S106. Dispose functional devices on the second surface of another second circuit board mother board and dispose the second circuit board in step S104, wherein the number and type of functional devices in each circuit board setting area of the second circuit board mother board are the same, and each circuit board setting area of the second circuit board mother board corresponds to a second circuit board in step S104.

[0104] S107. Divide the second circuit board mother board on which the functional devices and the second circuit board in step S104 are disposed to form a plurality of second circuit boards, wherein functional devices are disposed on the first surface of the second circuit board and at least one first support connection is disposed, and functional devices are disposed on the second surface of the second circuit board and a second circuit board in step S104 is disposed.

[0105] The second circuit board 432 adjacent to the first circuit board 431 in the above content is formed through step S107, and the second circuit board 432 disposed on the second circuit board 432 facing away from the first circuit board 431 is provided.

[0106] S108. Dispose a plurality of functional devices on the second surface of the third circuit board mother board, wherein the number and type of functional devices in each circuit board setting area of the third circuit board mother board are the same.

[0107] S109. Dispose a plurality of third support connection members on the first surface of the third circuit board mother board, wherein the number of third support connection members in each circuit board setting area of the third circuit board mother board is the same.

[0108] It can be understood that before the third support connection member is disposed on the first surface of the third circuit board mother board, it is necessary to first form the third support connection member. For example, the mother board of the third support connection member is first divided into boards to form a plurality of third support connection members. The specific steps for forming the third support connection member can refer to the prior art and will not be elaborated in the embodiments of the present application.

[0109] S110. Divide the third circuit board mother board on which the functional devices and the third support connection members are disposed to form a plurality of third circuit boards, and functional devices are disposed on the second surface of the third circuit board and at least one third support connection member is disposed on the first surface.

[0110] The third circuit board 433 in the above content is formed through step S110.

[0111] S111. Arrange a plurality of functional devices on a first surface of a first circuit board motherboard, wherein the number and type of functional devices in each circuit board arrangement area of the first circuit board motherboard are the same.

[0112] S112. Arrange the third circuit board formed in step S110 and the second circuit board formed in step S107 on the first surface of the first circuit board motherboard, wherein the number and type of functional components in each circuit board arrangement area of the first circuit board motherboard are the same, and each circuit board arrangement area of the first circuit board motherboard corresponds to a third circuit board in step S110 and a second circuit board in step S107.

[0113] S113. The first circuit board motherboard on which functional devices, a second circuit board, and a third circuit board are provided is divided into panels to form a plurality of first circuit boards, wherein functional devices are provided on the first surface of the first circuit board, and a third circuit board in step S110 and a second circuit board in step S107 are provided on the second surface.

[0114] The first circuit board 431 mentioned above is formed through step S113 , and two layers of second circuit boards and one layer of third circuit board are provided on the first circuit board 431 , that is, the circuit board assembly 43 mentioned above is formed.

[0115] It is understandable that when the circuit board assembly further includes other structures, such as a shielding cover, etc., the steps for preparing the circuit board assembly can be adaptively adjusted.

[0116] It should be noted that the above example merely illustrates a process for preparing a circuit board assembly and does not constitute a limitation of the present application. For example, multiple functional devices may be first disposed on the first surface of a first circuit board motherboard, and then multiple functional devices may be disposed on the second surface of one of the second circuit board motherboards.

[0117] Each of the above steps can be performed, for example, through a reflow soldering process. The functional components on the second surface of the second circuit board 432, which is away from the first circuit board 431, need to undergo multiple reflows, for example, at least two low-temperature reflows (a low-temperature reflow soldering process is used when soldering the supporting connectors) and two high-temperature reflows (a high-temperature reflow soldering process is used when soldering the functional components). This means that even multiple reflows will not affect the functional components on each circuit board.

[0118] In addition, when the support connecting member 434 is integrally formed with the circuit board, that is, the first support connecting member is integrally formed with one of the second circuit boards 432, the second support connecting member is integrally formed with the other second circuit board 432, and the third support connecting member is integrally formed with the third circuit board 433. For example, the above-mentioned integrally formed first support connecting member and one of the second circuit boards 432, the above-mentioned integrally formed second support connecting member and the other second circuit board 432, and the above-mentioned integrally formed third support connecting member and the third circuit board 433 can be formed by the manufacturing process of the cavity (local depression) structure of the Pcb. The number of reflows can be further reduced. For example, it only undergoes two high-temperature reflows (high-temperature reflow soldering process is used when soldering functional devices). The specific process steps are similar to the above process steps, and the only difference is that the step of setting the support connecting member is not included. For details, reference can be made to the above steps and will not be elaborated here.

[0119] As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, characterized in that, Comprising: Rear cover; Rear camera; Camera decorative part, the camera decorative part is fixed on the rear cover, the camera decorative part includes a shielding part and a skirt, and the plane where the shielding part is located is different from the plane where the skirt is located; Circuit board assembly, along a first direction, the circuit board assembly is located on one side of the rear cover, wherein the first direction is perpendicular to the plane where the shielding part is located; The circuit board assembly includes at least two layers of circuit boards, and at least two layers of the circuit boards include a first circuit board and at least one second circuit board that are arranged in a stacked and spaced manner. Along the first direction, the first circuit board is located on the side of the second circuit board away from the rear cover; At the position of the circuit board assembly corresponding to the shielding part, the number of the circuit boards is a third value; at the position of the circuit board assembly corresponding to the skirt, the number of the circuit boards is a fourth value, and the third value is greater than the fourth value; The distance from the shielding part to the first circuit board is greater than the distance from the skirt to the first circuit board; along the first direction, the circuit board includes opposite first and second surfaces, and functional devices are arranged on the first surface and / or the second surface; Functional devices are arranged at the position of the circuit board assembly corresponding to the shielding part, and the number of the surfaces provided with the functional devices is a first value; Functional devices are arranged at the position of the circuit board assembly corresponding to the skirt, and the number of the surfaces provided with the functional devices is a second value, and the first value is greater than the second value; The thickness of the rear camera is greater than the distance from the shielding part to the first circuit board; the first circuit board further includes a fourth area, the fourth area is opposite to the light-transmitting hole on the shielding part, and the first circuit board is provided with an avoidance hole at the fourth area, and one end of the rear camera passes through the avoidance hole.

2. An electronic device, characterized in that, Comprising: Rear cover; Rear camera; Camera decorative part, the camera decorative part is fixed on the rear cover, the camera decorative part includes a shielding part and a skirt, and the plane where the shielding part is located is different from the plane where the skirt is located; Circuit board assembly, along a first direction, the circuit board assembly is located on one side of the rear cover, wherein the first direction is perpendicular to the plane where the shielding part is located; The circuit board assembly includes at least two layers of circuit boards, and at least two layers of the circuit boards include a first circuit board and at least one second circuit board that are arranged in a stacked and spaced manner. Along the first direction, the first circuit board is located on the side of the second circuit board away from the rear cover; At the position of the circuit board assembly corresponding to the shielding part, the number of the circuit boards is a third value; at the position of the circuit board assembly corresponding to the skirt, the number of the circuit boards is a fourth value, and the third value is greater than the fourth value; The distance from the shielding part to the first circuit board is greater than the distance from the skirt to the first circuit board; along the first direction, the circuit board includes opposite first and second surfaces, and functional devices are arranged on the first surface and / or the second surface; A functional device is provided at a position of the circuit board assembly corresponding to the shielding portion, and the number of surfaces provided with the functional device is a first value; A functional device is provided at a position of the circuit board assembly corresponding to the skirt, and the number of surfaces provided with the functional device is a second value, and the first value is greater than the second value; The thickness of the rear camera and the distance difference between the shielding portion and the first circuit board are within a first preset range; the first circuit board further includes a fourth region, the fourth region is opposite to the light-transmitting hole on the shielding portion, the rear camera is disposed at the fourth region of the first circuit board, and the first circuit board is used for fixing and supporting the rear camera.

3. An electronic device, characterized in that, Including: A rear cover; A rear camera; A camera decorative member fixed to the rear cover, the camera decorative member including a shielding portion and a skirt, and the plane where the shielding portion is located is different from the plane where the skirt is located; A circuit board assembly, in a first direction, the circuit board assembly is located on one side of the rear cover, wherein the first direction is perpendicular to the plane where the shielding portion is located; The circuit board assembly includes at least two layers of circuit boards, and at least two layers of the circuit boards include a first circuit board and at least one second circuit board that are spaced apart and stacked, and in the first direction, the first circuit board is located on a side of the second circuit board away from the rear cover; At a position of the circuit board assembly corresponding to the shielding portion, the number of circuit boards is a third value; at a position of the circuit board assembly corresponding to the skirt, the number of circuit boards is a fourth value, and the third value is greater than the fourth value; The distance from the shielding portion to the first circuit board is greater than the distance from the skirt to the first circuit board; in the first direction, the circuit board includes opposite first and second surfaces, and a functional device is disposed on the first surface and / or the second surface; A functional device is provided at a position of the circuit board assembly corresponding to the shielding portion, and the number of surfaces provided with the functional device is a first value; A functional device is provided at a position of the circuit board assembly corresponding to the skirt, and the number of surfaces provided with the functional device is a second value, and the first value is greater than the second value; The circuit board assembly further includes at least one layer of a third circuit board, and at least one layer of the third circuit board is spaced apart and stacked with the first circuit board; The difference between the thickness of the rear camera and the distance from the shielding portion to the third circuit board is within a second preset range; the rear camera is opposite to the light-transmitting hole on the shielding portion, the third circuit board extends below the rear camera, the rear camera is disposed on the third circuit board, and the third circuit board is used for fixing and supporting the rear camera.

4. The electronic device according to any one of claims 1 to 3, characterized in that, The first circuit board includes at least a first region and a second region, and the second circuit board at least corresponds to the first region; The first area is opposite to the shielding portion, and the second area is opposite to the skirt. Functional devices are arranged in the first area, and the number of surfaces on which the functional devices are arranged is the first value; functional devices are arranged in the second area, and the number of surfaces on which the functional devices are arranged is the second value.

5. The electronic device according to any one of claims 1 to 3, characterized in that, The circuit board assembly further includes a supporting connector, which is located between two adjacent stacked circuit boards and is used to support the circuit boards and electrically connect the two adjacent circuit boards.

6. The electronic device according to claim 1 or 2, characterized in that The circuit board assembly further includes at least one third circuit board, wherein the at least one third circuit board is stacked with the first circuit board in an interval; The first circuit board includes at least a first area and a second area, the second circuit board corresponds to at least the first area, and the third circuit board also corresponds to at least the second area.

7. The electronic device according to claim 3, characterized in that, The first circuit board includes at least a first area and a second area, the second circuit board corresponds to at least the first area, and the third circuit board also corresponds to at least the second area.

8. The electronic device according to claim 4, characterized in that, The first circuit board further includes a third area, and the third area is opposite to the preset area of the back cover; The number of surfaces provided with functional devices in the first region is greater than the number of surfaces provided with functional devices in the second region, and greater than the number of surfaces provided with functional devices in the third region.

9. The electronic device according to claim 8, wherein Along a second direction, the second region includes a first sub-region and a second sub-region arranged on both sides of the first region, wherein the second direction is perpendicular to the first direction; The circuit board assembly includes a first circuit board and two layers of second circuit boards, the two layers of second circuit boards are stacked in the first area at intervals, and the second circuit board adjacent to the first circuit board extends to the second sub-area and the third area.

10. The electronic device according to claim 6, characterized in that, The at least one second circuit board layer includes two second circuit boards, one of the two second circuit boards is adjacent to the first circuit board, and the other of the two second circuit boards is away from the first circuit board; Functional devices are provided on both surfaces of the first circuit board, functional devices are provided on the second surface of the second circuit board adjacent to the first circuit board, functional devices are provided on the second surface of the second circuit board away from the first circuit board, and functional devices are provided on the second surface of the third circuit board, wherein the first surface is located on a side of the second surface facing away from the back cover; The first surface of the circuit board is a surface of the circuit board facing away from the back cover, and the second surface of the circuit board is a surface of the circuit board facing the back cover.

11. The electronic device according to any one of claims 1-3, characterized in that, The at least one second circuit board layer includes two second circuit boards, one of the two second circuit boards is adjacent to the first circuit board, and the other of the two second circuit boards is away from the first circuit board; A shielding cover is provided on the outer sides of at least some functional components on the first surface of the first circuit board; A shielding cover is provided on the outer sides of at least some functional components on the second surface of the second circuit board away from the first circuit board; and / or, A shielding cover is provided outside at least part of the functional devices on the second surface of the second circuit board adjacent to the first circuit board; The first surface of the circuit board is the surface of the circuit board facing away from the rear cover, and the second surface of the circuit board is the surface of the circuit board facing the rear cover.

12. The electronic device according to any one of claims 1 to 3, characterized in that, The rear camera collects light sources through the light-transmitting holes.

13. The electronic device according to claim 5, wherein The support connecting member is integrally formed with the circuit board.

14. The electronic device according to claim 2, wherein The first preset range is 0.5 mm - 3.5 mm.

15. The electronic device according to claim 3, wherein The second preset range is 0.5 mm - 3.5 mm.

16. The electronic device according to claim 9, wherein Along the first direction, the height of the first functional device is less than the height of the second functional device, where the first functional device is the functional device with the highest height on the second surface of the first circuit board at the first sub-region, and the second functional device is the functional device with the highest height on the second surface of the first circuit board in other regions; The first surface of the circuit board is the surface of the circuit board facing away from the rear cover, and the second surface of the circuit board is the surface of the circuit board facing the rear cover.

17. The electronic device according to claim 6, characterized in that, Along the first direction, the height of the functional devices on the second surface of the third circuit board is greater than the height of the functional devices on the surfaces of other circuit boards; The first surface of the circuit board is the surface of the circuit board facing away from the rear cover, and the second surface of the circuit board is the surface of the circuit board facing the rear cover.

18. The electronic device according to claim 17, wherein The functional devices on the second surface of the third circuit board include board-to-board connectors.

19. The electronic device according to claim 9, characterized in that, The circuit board assembly further includes a support connecting member, and the support connecting member is located between two adjacent circuit boards arranged in a stacked manner; The at least one layer of second circuit boards includes two layers of second circuit boards. One of the two layers of second circuit boards is adjacent to the first circuit board, and the other layer of the two layers of second circuit boards is away from the first circuit board; The second surface of the first circuit board, the first surface of the second circuit board adjacent to the first circuit board, and the support connecting member enclose a first accommodation space; The functional devices corresponding to the first region, the second sub-region, and the third region on the second surface of the first circuit board are all located in the first accommodation space; The first surface of the circuit board is the surface of the circuit board facing away from the rear cover, and the second surface of the circuit board is the surface of the circuit board facing the rear cover.

20. The electronic device according to claim 19, wherein The second surface of the second circuit board adjacent to the first circuit board, the first surface of the second circuit board away from the first circuit board, and the support connecting member enclose a second accommodation space; The functional devices corresponding to the first region on the second surface of the second circuit board adjacent to the first circuit board are located in the second accommodation space.

21. The electronic device according to claim 10, wherein The circuit board assembly further includes a support connecting member, and the support connecting member is located between two adjacent circuit boards arranged in a stacked manner; Along a second direction, the second region includes a first sub-region and a second sub-region disposed on both sides of the first region, wherein the second direction is perpendicular to the first direction; A second surface of the first circuit board, a first surface of the third circuit board, and the support connecting member enclose a third accommodation space; Function devices on the second surface of the first circuit board and corresponding to the first sub-region are located in the third accommodation space.

Images