A liner structure for a deposition process, deposition process apparatus and method

Abstract

The application discloses a liner structure for a deposition process, a deposition process device and a method of the deposition process. The liner structure comprises: a ring-shaped liner body; a first process groove formed in an inner wall of the liner body at a first depth to fix a clamping piece; and a second process groove formed in an outer wall of the liner body at a second depth, wherein a plurality of vacuum measurement holes are distributed on a groove surface of the second process groove to communicate the air pressure inside and outside the ring of the liner body. Through the liner structure, the convenience of disassembly and assembly can be realized, the liner is lightened, the process cost is reduced, the influence on the flow field of the cavity can be avoided, the stability of the pressure fluctuation in the cavity with multi-valve pressure control is improved, and the stability of the flow field state in the cavity is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing, and in particular to a liner structure for a deposition process, a deposition process device, a deposition process method, and a computer readable storage medium. BACKGROUND

[0002] In the field of semiconductor manufacturing, the stability of the process determines the quality of the electronic devices manufactured. Therefore, it is particularly important to ensure the stability of each process. Considering the convenience of installation and the performance of the double valve pressure control on the deposition process device, it can be determined that the effective volume in the process cavity is most relevant to the pressure control.

[0003] In the prior art, the process cavity can include a side wall liner, which can perform thermal transition on different regions of the process cavity based on the need of the thermal field, so as to provide a suitable flow field and thermal field for the deposition process. However, the structure of the current side wall liner is relatively cumbersome, which is not conducive to the installation and disassembly of the operator, and the relatively cumbersome side wall liner also consumes the thermal budget in the process cavity and the power consumption of the device operation, and it is difficult to reduce the process cost. Moreover, due to the addition of the three-cut liner pipe, the effective volume in the process cavity is reduced, thereby affecting the sensitivity of the cavity airflow fluctuation to the pressure. The increase in the sensitivity of the airflow fluctuation to the pressure increases the difficulty of the multi-valve pressure control for each cavity, which also increases the risk of multi-valve pressure failure. Finally, it also increases the risk of particle (PA) of the film deposited in the process cavity.

[0004] In order to solve the above problems existing in the prior art, there is an urgent need in the art for an improved liner structure for a deposition process, which not only realizes the convenience of disassembly and assembly operation, reduces the weight of the liner, and is conducive to reducing the process cost, but also avoids affecting the flow field of the cavity, improves the stability of the cavity pressure fluctuation of the multi-valve pressure control, and improves the stability of the flow field state in the cavity. SUMMARY

[0005] The following gives a brief summary of one or more aspects to provide a basic understanding of these aspects. This summary is not an extensive overview of all contemplated aspects, and is neither intended to identify key or critical elements of all aspects nor to delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.

[0006] In order to overcome the above-mentioned defects in the prior art, the present application provides a liner structure for a deposition process, a deposition process device, a deposition process method, and a computer-readable storage medium, which not only can realize the convenience of disassembly and assembly, reduce the weight of the liner, and reduce the process cost, but also can avoid the influence on the flow field of the cavity, improve the stability of the pressure fluctuation in the cavity with multi-valve pressure control, and improve the stability of the flow field state in the cavity.

[0007] Specifically, the liner structure for a deposition process according to the first aspect of the present application comprises: a ring-shaped liner body; a first process groove formed in the inner wall of the liner body at a first depth for fixing a clamping piece; and a second process groove formed in the outer wall of the liner body at a second depth, wherein a plurality of vacuum measurement holes are distributed on the groove surface of the second process groove for communicating the air pressure inside and outside the ring of the liner body.

[0008] Further, in some embodiments of the present application, the liner structure further comprises: a third process groove, wherein the third process groove is located at the lower part of the second process groove and is formed in the outer wall of the liner body at a third depth.

[0009] Further, in some embodiments of the present application, the first process groove is a ring-shaped groove formed above the inner wall of the liner body.

[0010] Further, in some embodiments of the present application, the aperture of the vacuum measurement hole is greater than 3 mm.

[0011] In addition, the deposition process device according to the second aspect of the present application comprises: a plurality of process cavities, wherein the inside of each process cavity comprises the liner structure for a deposition process according to the first aspect of the present application; and a pressure control assembly connected to the corresponding process cavities via the first ends of a plurality of pipelines, wherein the plurality of pipelines are provided with a plurality of straight-through valves, and each straight-through valve independently controls the air pressure in the corresponding process cavity.

[0012] Further, in some embodiments of the present application, the deposition process device further comprises: a vacuum pump, wherein the second ends of the plurality of pipelines are first combined into one vacuum pipeline, and then connected to the vacuum pump, and a gate valve is arranged on the vacuum pipeline to control the air pressure of each process cavity.

[0013] Further, in some embodiments of the present application, the liner structure is arranged above the process cavities, and the first process groove in the liner structure is located behind the flow guide structure of the three-cut liner pipe.

[0014] Further, in some embodiments of the present application, the deposition process apparatus further comprises a vacuum gauge, wherein a second cavity is formed between the second process groove in the liner structure and the inner wall of the cavity of the process chamber, the vacuum gauge communicates with the second process groove via the second cavity, and measures the pressure in the ring of the liner structure through a plurality of vacuum measurement holes on the surface of the second process groove.

[0015] Further, according to the third aspect of the present application, there is provided a deposition process method as described above, comprising the following steps: determining the pressure in the ring of the liner body in a plurality of process chambers of a deposition process apparatus by a vacuum gauge; adjusting the opening of a straight-through valve connected to each of the process chambers according to a target pressure of each of the process chambers, so that the pressure in the ring of each of the process chambers meets the corresponding target pressure; and performing a deposition process on a wafer in the corresponding liner body in response to the pressure in the ring of any of the process chambers meeting the corresponding target pressure.

[0016] Further, according to the third aspect of the present application, there is provided a computer readable storage medium having stored thereon computer instructions. The computer instructions, when executed by a processor, implement the deposition process method as described above provided by the third aspect of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0017] The above features and advantages of the present application will be better understood through reading the detailed description of embodiments of the present application in conjunction with the following drawings, in which: in the drawings, components are not necessarily drawn to scale, and components having similar or related properties or features can have the same or similar reference numbers.

[0018] Figure 1 A structural schematic diagram of a deposition process apparatus according to some embodiments of the present application is shown;

[0019] Figure 2 A structural schematic diagram of a liner structure for a deposition process according to some embodiments of the present application is shown;

[0020] Figure 3 A side view of a liner structure for a deposition process is shown; Figure 2 A side view of a liner structure for a deposition process is shown;

[0021] Figure 4 A structural schematic diagram of a pressure control assembly according to some embodiments of the present application is shown; and

[0022] Figure 5 A flowchart of a deposition process method according to some embodiments of the present application is shown.

[0023] REFERENCE SIGNS:

[0024] 100 deposition process apparatus;

[0025] 110 process cavity

[0026] 120, 200 bushing structure

[0027] 130 pressure control assembly

[0028] 131 straight-through valve

[0029] 132 gate valve

[0030] 133 vacuum line

[0031] 140 three-way bushing

[0032] 210 bushing body

[0033] 220 first process groove

[0034] 230 second process groove

[0035] 231 vacuum measurement hole

[0036] 240 third process groove

[0037] S510-S530 steps DETAILED DESCRIPTION

[0038] The present application will be described in detail below with reference to specific embodiments. Although the application is described with reference to the embodiments, those skilled in the art will appreciate that other alternatives and embodiments can be practiced without departing from the spirit and scope of the application. The following detailed description is not intended to limit the application. Instead, the detailed description is intended to explain the application. Further, the detailed description includes specific details for the purpose of providing a thorough understanding of the application. However, it will be apparent to those skilled in the art that the application can be practiced without these specific details. In some instances, well-known structures and functions have not been described in detail in order to avoid obscuring the application.

[0039] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or integral connection; can be mechanical connection, can also be electrical connection; can be direct connection, can also be indirect connection through an intermediate medium, can be internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0040] In addition, "upper", "lower", "left", "right", "top", "bottom", "horizontal", "vertical" used in the following description and shown in the drawings should be understood as the orientation shown in the drawing and relative to the present section. The relative terms are used only for convenience and are not intended to limit the application to any particular orientation. Therefore, they should not be construed as limiting the application.

[0041] It is to be understood that the terms "first", "second", "third", and so on, used herein to describe various components, regions, layers and / or sections, should not be construed as limiting these components, regions, layers and / or sections, and these terms are only used to distinguish different components, regions, layers and / or sections. Therefore, the first components, regions, layers and / or sections discussed below can be referred to as the second components, regions, layers and / or sections without departing from some embodiments of the application.

[0042] As described above, the current side wall lining structure is relatively bulky, which is not conducive to the installation and disassembly of the operator, and the relatively bulky side wall lining also consumes the heat budget in the process cavity, consumes the equipment operation power consumption, and it is difficult to reduce the process cost. Moreover, due to the increase of the three lining pipes, the effective volume in the process cavity is reduced, which will affect the sensitivity of the cavity airflow fluctuation to the pressure. The increase of the sensitivity of the airflow fluctuation to the pressure will increase the difficulty of the multi-valve pressure control of each cavity, and will also increase the risk of multi-valve pressure control failure. Finally, it is also easy to increase the risk of particle size (PA) of the film deposited in the process cavity.

[0043] In order to solve the above problems existing in the prior art, the present application provides a liner structure for deposition process, a deposition process equipment, a deposition process method, and a computer readable storage medium. Not only can the convenience of disassembly and assembly operation be realized, the liner weight can be reduced, and the process cost can be reduced, but also the influence on the cavity flow field can be avoided, the stability of the cavity pressure fluctuation of the multi-valve pressure control can be improved, and the stability of the flow field state in the cavity can be improved.

[0044] In some non-limiting embodiments, the above-mentioned liner structure for deposition process provided by the first aspect of the present application can be configured in the above-mentioned deposition process equipment provided by the second aspect of the present application. Moreover, the deposition process method provided by the third aspect of the present application can also be implemented by the above-mentioned deposition process equipment provided by the second aspect of the present application.

[0045] Specifically, in some non-limiting embodiments, the deposition process method provided by the third aspect of the present application can be stored in the above-mentioned computer readable storage medium provided by the fourth aspect of the present application, and the computer instructions are stored thereon. When the computer instructions are executed by the processor, the above-mentioned deposition process method provided by the third aspect of the present application can be implemented.

[0046] The working principle of the deposition process equipment will be described below in combination with some embodiments of the liner structure for deposition process and the deposition process method. Those skilled in the art can understand that the embodiments of the liner structure for deposition process and the deposition process method are only some non-limiting embodiments provided by the present application, which are intended to clearly demonstrate the main concept of the present application and provide some specific solutions for facilitating the public to implement, but not to limit the overall working mode or overall function of the deposition process equipment. Similarly, the deposition process equipment is also only a non-limiting embodiment provided by the present application, which does not limit the configuration subject of the liner structure for deposition process and the implementation subject of the deposition process method.

[0047] Please refer to Figure 1 , Figure 1 FIG. 1 shows a structural schematic diagram of a deposition process equipment according to some embodiments of the present application.

[0048] As shown in Figure 1 , in some embodiments of the present application, the deposition process equipment 100 can include a plurality of process cavities 110 (only one of which is shown in the figure). Figure 1 The inside of each process cavity 110 can include a liner structure 120 for deposition process.

[0049] Specifically, please refer to Figure 2 and Figure 3 , Figure 2 FIG. 2 shows a structural schematic diagram of a liner structure for deposition process according to some embodiments of the present application, Figure 3 as shown in Figure 2 a side view of the liner structure for deposition process.

[0050] As shown in Figure 2 and Figure 3 , in some embodiments of the present application, the liner structure for deposition process 200 can include a ring-shaped liner body 210, a first process groove 220 which can be formed on the inner wall of the liner body 210 at a first depth to fix a clamping member, and a second process groove 230 which can be formed on the outer wall of the liner body 210 at a second depth, wherein a plurality of vacuum measurement holes 231 can be distributed on the groove surface of the second process groove 230 to communicate the air pressure inside and outside the ring of the liner body 210.

[0051] As shown in Figure 2 and Figure 3As shown, the first process groove 220 is a ring groove, which can be arranged above the inner wall of the liner body 210 in a direction towards the inside of the cavity of the process chamber 110. It can be understood that the first process groove 220 is equivalent to a disassembly process groove, which can facilitate the disassembly of the liner structure 200, i.e. improve the convenience of maintaining the process chamber 110. Compared with the prior art, the liner body does not include the first process groove 220, and the inner wall of the liner body is smooth and complete. When the operator uses hands or clamping tools to grab the liner body, there is no fixed support point, so it is not easy to grab the liner body. In the present embodiment, the operator can use hands or clamping tools to vertically lift or lower the liner body 210 from the inside of the cavity of the process chamber 110 with the help of the first process groove 220. At the same time, the first process groove 229 in the present embodiment is also a ring groove structure, which can also play a role in reducing weight to some extent, i.e. reducing the overall weight of the liner structure.

[0052] Please continue to see Figure 2 and Figure 3 In the lower part of the second process groove 230, a third process groove 240 can be arranged in a direction away from the inside of the cavity of the process chamber 110. The third process groove 240 is arranged on the outer wall of the liner body 210 with a third depth. It can be understood that the third process groove 240 is equivalent to a weight reduction process groove, which is used to reduce the weight of the component, while not affecting the gas flow passage inside the cavity of the process chamber 110, and the influence on the temperature field inside the cavity can also be ignored. Through the liner structure 200 with the optimized structure in the present embodiment, the thermal budget can also be reduced, and the energy consumption of the machine can be reduced, so that the process cost can be further reduced.

[0053] As Figure 2 shown, in some optional embodiments, the aperture of the vacuum measurement hole 231 on the groove surface of the second process groove 230 can be greater than 3mm. Preferably, the vacuum measurement holes 231 can be increased to 5mm, thereby facilitating the improvement of the gas flow between the inner ring and the outer ring of the liner body 210.

[0054] Please continue to see Figure 1 In the deposition process equipment 100, a tri-cut liner 140 can also be included, which is mainly used in combination with the liner structure 200 to provide a suitable flow field and thermal field for the reaction in the process chamber 110. The liner structure 200 can be arranged above the process chamber 110, and the first process groove 220 in the liner structure 200 can be located behind the flow guide structure of the tri-cut liner 140, so that the first process groove 220 can not be directly exposed to the inside of the cavity of the process chamber 110. Therefore, the first process groove 220 will not affect the original flow field state inside the cavity of the process chamber 110.

[0055] Next, please seeFigure 4 , Figure 4 A structural diagram of a pressure control assembly is shown according to some embodiments of the present application.

[0056] In combination Figure 1 and Figure 4 As shown, the deposition process equipment 100 can further include a pressure control assembly 130. The pressure control assembly 130 can be connected to the corresponding process cavities 110 via the first ends of the plurality of pipes, respectively. The plurality of pipes can be provided with a plurality of through valves (TV) 131, and each through valve 131 can independently control the air pressure in the corresponding process cavity 110.

[0057] Further, in some optional embodiments, the deposition process equipment 100 can further include a vacuum pump (not shown in the figure). As Figure 4 shown, the second ends of the plurality of pipes in the pressure control assembly 130 can be merged into a vacuum pipe 133 first, and then connected to the vacuum pump. The vacuum pipe 133 can be provided with a gate valve 132 to control the air pressure of each process cavity 110.

[0058] In the above embodiments, the deposition process equipment 100 includes a plurality of process cavities 110, and each process cavity 110 is independently controlled by the corresponding through valve 131, and at the same time, the plurality of through valves 131 are merged into the vacuum pipe 133 and connected to the same vacuum pump. In order to reduce the sensitivity of the opening degree change of each through valve 131 to the pressure change in the corresponding process cavity 110, and according to the transformation of the ideal gas state equation, increasing the effective volume of the process cavity 110 is beneficial to achieve the above technical effect. Therefore, the above-mentioned liner structure 200 for deposition process provided by the first aspect of the present application can compensate for the decrease in the effective volume of the cavity due to the increase in the three-cut liner pipe 140, thereby effectively reducing the sensitivity of the air flow caused by the opening degree change of each through valve 131 to the pressure fluctuation in each process cavity 110, thereby reducing the disturbance between the multiple valves during pressure control, and further reducing the risk of pressure control failure of the multiple valves.

[0059] In other optional embodiments, the deposition process equipment 100 can further include a vacuum gauge (not shown in the figure). The second process groove 230 in the process cavity 110 and the inner wall of the cavity of the process cavity 110 can form a second cavity, and the vacuum gauge can be arranged in the second cavity. Since the second process groove 230 is provided with a plurality of vacuum measurement holes 231, the vacuum pressure of the second cavity and the main cavity in the ring of the liner structure 200 can be consistent. The second cavity is connected to the vacuum gauge through a hole path, so that the vacuum degree of the air pressure in the ring of the liner structure 200 can be measured through the vacuum gauge.

[0060] Next, please refer toFigure 5 , Figure 5 A flowchart of a deposition process method provided according to some embodiments of the present invention is shown.

[0061] like Figure 5 As shown, in some embodiments of the present invention, the deposition process method may include the following step S510: determining the annular gas pressure of the bushing body 210 within a plurality of process chambers 110 of the deposition process apparatus using a vacuum gauge. Next, step S520 may be performed: adjusting the opening degree of the through valve 131 connecting each process chamber 110 according to the target gas pressure of each process chamber 110, so that the annular gas pressure within each process chamber 110 meets the corresponding target gas pressure. Then, step S530 may be performed: in response to the annular gas pressure of any process chamber 110 meeting the corresponding target gas pressure, performing a deposition process on the wafer within the corresponding bushing body 210. In this embodiment, the risk of potential pressure control issues within each process chamber 110 by multiple valves can be reduced, improving pressure control stability.

[0062] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0063] In summary, the present invention provides a bushing structure for a deposition process, a deposition process equipment, a deposition process method, and a computer-readable storage medium, which not only facilitates disassembly and assembly operations and reduces the weight of the bushing, thus reducing process costs, but also avoids the influence on the cavity flow field, improves the stability of intracavity pressure fluctuations in multi-valve pressure control, and improves the stability of the intracavity flow field state.

[0064] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A liner structure for a deposition process, characterized by, The liner structure is arranged above the process cavity, and the liner structure comprises: a ring-shaped liner body; a first process groove arranged behind the flow guide structure of the three-cut liner pipe and not directly exposed inside the cavity of the process cavity, the first process groove being arranged on the inner wall of the liner body at a first depth and used for fixing a clamping member; and a second process groove arranged on the outer wall of the liner body at a second depth, wherein a plurality of vacuum measurement holes are arranged on the groove surface of the second process groove and used for connecting the air pressure inside and outside the ring of the liner body.

2. The bush structure of claim 1, wherein Further comprising: a third process groove, wherein the third process groove is arranged at the lower part of the second process groove and arranged on the outer wall of the liner body at a third depth.

3. The bushing structure of claim 1, wherein The first process groove is a ring-shaped groove arranged above the inner wall of the liner body.

4. The bushing structure of claim 1, wherein The aperture of the vacuum measurement hole is greater than 3 mm.

5. A deposition process apparatus characterized by, Further comprising: a plurality of process cavities, wherein the interior of each process cavity comprises the liner structure for deposition process according to any one of claims 1-4; and a pressure control assembly connected to the corresponding process cavities via the first ends of a plurality of pipelines, wherein the plurality of pipelines are provided with a plurality of straight-through valves, and each straight-through valve independently controls the air pressure in the corresponding process cavity.

6. The deposition process apparatus of claim 5, wherein, Further comprising: a vacuum pump, wherein the second ends of the plurality of pipelines are first combined into one vacuum pipeline and then connected to the vacuum pump, and a gate valve is arranged on the vacuum pipeline to control the air pressure of each process cavity.

7. The deposition process apparatus of claim 5, wherein, Further comprising: a vacuum gauge, wherein the second process groove in the liner structure and the inner wall of the cavity of the process cavity form a second cavity, the vacuum gauge is connected to the second process groove via the second cavity, and the air pressure inside the ring of the liner structure is measured through the plurality of vacuum measurement holes on the surface of the second process groove.

8. A deposition process method, characterized by, The deposition process method is implemented by the deposition process equipment according to any one of claims 5-7, and the deposition process method comprises the following steps: determining the air pressure inside the ring of the liner body in the plurality of process cavities of the deposition process equipment by the vacuum gauge; adjusting the opening degree of the straight-through valve connected to each process cavity according to the target air pressure of each process cavity, so that the air pressure inside the ring of each process cavity meets the corresponding target air pressure; and performing deposition process on the wafer in the corresponding liner body in response to the air pressure inside the ring of any process cavity meeting the corresponding target air pressure.

9. A computer readable storage medium having stored thereon computer instructions, wherein, The computer instructions are executed by the processor to implement the deposition process method according to claim 8. The computer instructions are executed by the processor to implement the deposition process method according to claim 8.

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