A power protection module based on SIP package

Abstract

The present invention discloses a power protection module based on SIP packaging, which belongs to the technical field of integrated circuit packaging. The power protection module includes a shell and an internal circuit functional unit. The shell adopts an HTCC ceramic integrated shell. Two circuit functional units with the same structure are located in the internal cavity of the shell and are distributed on the left and right. Each circuit functional unit is composed of a diode, an operational amplifier, an optical coupler, a triode and a plurality of resistors and capacitors, and a plurality of input pins and output pins are reserved in the cavity. The power protection module realizes the functions of outputting a protection signal, outputting a fault indication signal and uploading a fault signal by collecting a voltage sampling signal and a reference voltage signal, and the voltage reference value of the protection action and the delay time of the protection action can be adjusted by configuring peripheral parameters, and has a reset function after protection. The present invention is conducive to miniaturization and lightweight of the power supply, and reduces the difficulty of production and assembly.

Description

Technical Field

[0001] The invention belongs to the technical field of integrated circuit packaging, and in particular relates to a power protection module based on SIP packaging. Background Art

[0002] Since power supply products are widely used in key fields such as communications, industrial control, military industry, and aerospace, it is crucial to improve the reliability of power supply and protect electrical equipment. With the development of electronic equipment technology, the requirements for miniaturization and lightweight of power supply are getting higher and higher. Therefore, how to reduce the area occupied by hybrid circuits in PCB boards is particularly critical. It is difficult to compress the size of discrete components such as inductors, resistors, and capacitors. How to integrate more components in a limited space to achieve better working performance is a direction that needs to be optimized urgently. There are unstable factors in the working state of the power supply, which leads to overcurrent, overvoltage, overheating and other fault phenomena in the circuit. The protection circuit can prevent such faults from affecting the safety of the power supply circuit and load. Summary of the invention

[0003] In order to solve the above technical problems, the present invention provides a power protection module based on SIP packaging. A plurality of highly integrated bare cores are used to package two protection circuit units. Through internal layout design, the overall volume of the module is about half of that when discrete devices are used, which greatly reduces the area occupied by the protection circuit on the PCB board.

[0004] To achieve the above purpose, the technical solution adopted by the present invention is as follows:

[0005] A power protection module based on SIP packaging, the power protection module comprising a shell and an internal circuit function unit; wherein the shell adopts an HTCC ceramic integrated shell, the internal circuit function unit comprises a first circuit function unit and a second circuit function unit, the first circuit function unit and the second circuit function unit are distributed in the inner cavity of the shell on the left and right sides;

[0006] The first circuit function unit includes the following structure: an input sampling voltage signal end is connected to one end of the first resistor and one end of the first capacitor respectively, the other end of the first resistor is connected to the positive input end of the first operational amplifier, the other end of the first capacitor is connected to the analog ground, an input reference voltage signal end is connected to one end of the second resistor and one end of the second capacitor, the other end of the second resistor is connected to the negative input end of the first operational amplifier, the other end of the second capacitor is connected to the analog ground, a power supply voltage end is connected to one end of the third capacitor, the cathode of the first diode, one end of the fourth capacitor, one end of the third resistor, one end of the thirteenth resistor, and the power supply end of the first operational amplifier, a ground end of the first operational amplifier is connected to the analog ground, an output end of the first operational amplifier is connected to one end of the fourth resistor, one end of the fifth resistor, and an output pin of the first circuit unit, the other end of the fourth resistor is connected to the cathode of the second diode, the other end of the fifth resistor is connected to one end of the fifth capacitor, the anode of the first diode, the anode of the second diode, one end of the seventh resistor, and the output pin of the first circuit unit, the other end of the fifth capacitor is connected to the analog ground, and the other end of the seventh resistor is connected to one end of the eighth resistor, the anode of the third diode, one end of the sixth capacitor, and the positive input end of the second operational amplifier. , the other end of the fourth capacitor is connected to one end of the sixth resistor, the other end of the third resistor, and the negative input end of the second operational amplifier, the other end of the sixth capacitor is connected to the analog ground, the cathode of the third diode is connected to the external reset signal, the other end of the eighth resistor is connected to the cathode of the fourth diode, the anode of the fourth diode is connected to the anode of the fifth diode, the cathode of the sixth diode, and the output end of the second operational amplifier, the cathode of the fifth diode is connected to one end of the ninth resistor, the other end of the ninth resistor is connected to the first output signal end, the anode of the sixth diode is connected to one end of the tenth resistor, the other end of the tenth resistor is connected to one end of the eleventh resistor, The base of the first triode is connected, the emitter of the first triode is connected to the other end of the eleventh resistor and the analog ground, the collector of the first triode is connected to one end of the twelfth resistor, one end of the fourteenth resistor, and the cathode of the primary diode of the first optical coupler, the other end of the twelfth resistor is connected to the second output signal terminal, the other end of the fourteenth resistor is connected to the other end of the thirteenth resistor and the anode of the primary diode of the first optical coupler, the emitter of the secondary triode of the first optical coupler is connected to the anode of the seventh diode and the third output signal terminal, and the collector of the secondary triode of the first optical coupler is connected to the cathode of the seventh diode and the fourth output signal terminal;

[0007] The second circuit functional unit has the same structure as the first circuit functional unit.

[0008] Preferably, the ceramic base and the metal cover of the power protection module are packaged using a fully sealed packaging structure, and the packaging process is parallel seam welding.

[0009] Preferably, the diodes, transistors, operational amplifiers and optocouplers in the power protection module are all made of bare circuit components, bonded to the conduction band between the substrate and a gold wire with a diameter of 30 μm, the capacitors are chip capacitors, and the resistors are processed by combining thick film technology with surface mount welding.

[0010] Preferably, wiring is done inside the HTCC ceramic integrated housing, holes are filled and circuits are printed using screen printing technology, thick film technology and metal bonding methods are combined to achieve electrical connection between the first circuit functional unit and the second circuit functional unit, and the module is integrated through fully sealed packaging.

[0011] Preferably, the thick film process includes a thick film substrate printing process and a thick film assembly process, wherein the thick film substrate printing process includes using a thick film hybrid integrated circuit semi-automatic printing process for high-power resistors to print and produce a high-precision resistor film layer on a resistor substrate.

[0012] Preferably, the HTCC ceramic integrated housing and the bare circuit components are bonded by physical and chemical methods using metal materials;

[0013] Preferably, the HTCC ceramic integrated housing pin adopts the CSOP wing-shaped pin form. The wing-shaped pin is more conducive to absorbing the stress between the housing and the PCB board, solving the problems of ceramic body, device pins, solder joint cracking caused by the mismatch of thermal expansion coefficients between the high-temperature co-fired ceramic and the PCB board, and improving reliability.

[0014] Preferably, the optical coupler is arranged at the edge of the layout, and a sufficient preset safety distance is left between the optical coupler and surrounding devices and conduction bands to ensure that the optical coupler has a sufficient safety distance.

[0015] The beneficial effects of the present invention are:

[0016] The structural design of the present invention reduces the area occupied by the protection circuit unit on the PCB board, which is conducive to miniaturization and lightness of the power supply; modularizing the protection circuit unit can reduce the difficulty of production and assembly and increase the speed of maintenance and replacement; and adopting the HTCC ceramic integrated housing improves the circuit insulation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of a three-dimensional model of a power protection module based on SIP packaging of the present invention;

[0018] Figure 2 This is a schematic diagram of the bottom pins of a power protection module based on SIP packaging of the present invention;

[0019] Figure 3 The present invention is a schematic diagram of a first circuit functional unit circuit based on SIP packaging.

[0020] Reference numerals:

[0021] 1. Housing; 2. First circuit functional unit; 3. Second circuit functional unit; 4. Optocoupler. DETAILED DESCRIPTION

[0022] The power protection module based on SIP package provided by the present invention is further described in detail below in conjunction with the accompanying drawings, and the technical solution in the embodiment of the present invention is fully described. It should be noted that the accompanying drawings are all simplified and use non-precise proportions, which are only used to facilitate and clearly assist in explaining the embodiments of the present invention.

[0023] The design idea of ​​the present invention is to combine two identical protection circuit functional units with the SIP packaging concept to form a functional module. In the SIP power protection module, a relatively small bare core is used, and the resistor is processed by combining thick film printing and surface mount welding. The thick film process is used for the resistor with higher power, and the surface mount welding method is used for the resistor with lower power to integrate, and the electrical connection with other components is realized by gold wire bonding.

[0024] like Figure 1 As shown, the embodiment of the present invention specifically provides a three-dimensional structure diagram of a power protection module based on SIP packaging. The housing 1 adopts an HTCC ceramic integrated housing. Inside the cavity of the housing 1, there are a first circuit functional unit 2 and a second circuit functional unit 3. The two circuit functional units are identical and are distributed on the left and right. Each functional unit is respectively provided with a triode, an optical coupler 4, a thick film resistor substrate, a diode, an operational amplifier and other devices required for the circuit, such as Figure 3 As shown, a specific circuit internal connection structure is given. The transistor, diode, operational amplifier, and optical coupler 4 are bare circuit chips, which are bonded to the conductive strip between the substrate and a gold wire with a diameter of 30 μm.

[0025] An optocoupler 4 is arranged inside the SIP power protection module to realize electrical isolation between the primary and secondary sides, and sufficient safety distance needs to be left. Therefore, when designing the layout, the optocoupler 4 is arranged at the edge of the layout, and sufficient safety distance is left from the surrounding devices and conduction bands.

[0026] The thick film resistor substrate 5 is fixed by using an insulating adhesive bonding process, and the other low-power resistors are welded by using a surface mount method.

[0027] See also Figure 1 and Figure 3, the first circuit functional unit includes the following structure: the input sampling voltage signal terminal Vin1 is respectively connected to one end of the first resistor R1 and one end of the first capacitor C1, the other end of the first resistor R1 is connected to the positive input end of the first operational amplifier N1, the other end of the first capacitor C1 is connected to the analog ground AGND, the input reference voltage signal terminal Vref1 is connected to one end of the second resistor R2 and one end of the second capacitor C2, the other end of the second resistor R2 is connected to the negative input end of the first operational amplifier N1, the other end of the second capacitor C2 is connected to the analog ground AGND, one end of the power supply voltage Vdd1 is connected to one end of the third capacitor C3, the cathode of the first diode V1, One end of the fourth capacitor C4, one end of the third resistor R3, one end of the thirteenth resistor R13, and the power supply end of the first operational amplifier N1 are connected, the ground end of the first operational amplifier is connected to the analog ground AGND, the output end of the first operational amplifier N1 is connected to one end of the fourth resistor R4, one end of the fifth resistor R5, and the first circuit unit output pin Del1+, the other end of the fourth resistor R4 is connected to the cathode of the second diode V2, the other end of the fifth resistor R5 is connected to one end of the fifth capacitor C5, the anode of the first diode V1, the anode of the second diode V2, one end of the seventh resistor R7, and the first circuit unit output pin Del1-, the other end of the fifth capacitor C5 is connected to the analog The seventh resistor R7 is connected to the analog ground AGND, the other end of the seventh resistor R7 is connected to one end of the eighth resistor R8, the anode of the third diode V3, one end of the sixth capacitor C6, and the positive input terminal of the second operational amplifier N2, the other end of the fourth capacitor C4 is connected to one end of the sixth resistor R6, the other end of the third resistor R3, and the negative input terminal of the second operational amplifier N2, the other end of the sixth capacitor C6 is connected to the analog ground AGND, the cathode of the third diode V3 is connected to the external reset signal REST1, the other end of the eighth resistor R8 is connected to the cathode of the fourth diode V4, the anode of the fourth diode V4 is connected to the anode of the fifth diode V5, the cathode of the sixth diode V6, and the input terminal of the second operational amplifier N2 The output terminal is connected, the cathode of the fifth diode V5 is connected to one end of the ninth resistor R9, the other end of the ninth resistor R9 is connected to the first output signal terminal port1, the anode of the sixth diode V6 is connected to one end of the tenth resistor R10, the other end of the tenth resistor R10 is connected to one end of the eleventh resistor R11 and the base of the first transistor Q1, the emitter of the first transistor Q1 is connected to the other end of the eleventh resistor R11 and the analog ground AGND, the collector of the first transistor Q1 is connected to one end of the twelfth resistor R12, one end of the fourteenth resistor R14, and the cathode of the primary diode of the first optical coupler D1, the other end of the twelfth resistor R12 is connected to the second output signal terminal port LED1, the other end of the fourteenth resistor R14 is connected to the other end of the thirteenth resistor R13 and the anode of the primary diode of the first optical coupler D1, the emitter of the secondary transistor of the first optical coupler D1 is connected to the anode of the seventh diode V7 and the third output signal terminal port WS1-,The collector of the secondary transistor of the first optical coupler D1 is connected to the cathode of the seventh diode V7 and the fourth output signal terminal port WS1+;

[0028] The second circuit functional unit has the same structure as the first circuit functional unit.

[0029] like Figure 2 The present invention is a schematic diagram of the bottom pins of a power protection module based on SIP packaging, which adopts the CSOP wing-shaped lead-out form, with an outer pin spacing of 2.54 mm and a number of 22. The wing-shaped pins are more conducive to absorbing the stress between the housing 1 and the PCB board, thereby improving reliability. The packaging process is parallel seam welding, and the fully sealed packaging structure is a mature process commonly used in hybrid circuits.

[0030] The functions that the power protection module based on SIP package can achieve are as follows:

[0031] 1. It has the function of outputting protection signals. When the voltage sampling signal Vin1 input to the module exceeds the reference voltage signal Vref1, the first output signal port1 can complete the level flip from low level to high level after the set delay time;

[0032] 2. With protection delay function. The power protection module has reserved pins for expanding peripheral circuits. A delay capacitor can be connected in parallel between the Dell- pin and the AGND pin, and a delay resistor can be connected in parallel between the Dell+ pin and the Dell- pin. The protection action delay time function can be adjusted by setting the values ​​of the capacitor and resistor;

[0033] 3. It has the function of outputting protection indication signals. When the protection action occurs, the second output signal port LED1 signal as the protection indication signal should be outputted at the same time as the first output signal port1 signal as the protection signal;

[0034] 4. It has the function of outputting fault upload signals. The protection upload signal should be output at the same time as the protection signal, and the protection upload signal needs to be isolated by an optical coupler;

[0035] 5. It has the function of resetting the protection circuit. When the protection circuit is activated, the reset pin REST1 signal is grounded, a series of protection actions of the protection circuit are canceled, and the protection circuit is reset.

[0036] refer to Figure 2-Figure 3, a plurality of input pins and output pins are reserved in the cavity of the housing 1. In the first circuit functional unit, the input reference voltage signal Vref1 is the first pin Pin1 of the power protection module, the input sampling voltage signal Vin1 is the second pin Pin2 of the power protection module, the output pin Del1+ is the third pin Pin3 of the power protection module, the output pin Del1- is the fourth pin Pin4 of the power protection module, the reset signal REST1 is the eighteenth pin Pin18 of the power protection module, the first output signal port1 is the nineteenth pin Pin19 of the power protection module, the second output signal port LED1 is the nineteenth pin Pin20 of the power protection module, the third output signal port WS1+ is the twenty-first pin Pin21 of the power protection module, and the fourth output signal port WS1- is the twenty-second pin Pin22 of the power protection module. The seventh pin Pin7 and the sixteenth pin Pin16 of the power protection module are empty pins; the remaining pins are input pins and output pins of the second circuit functional unit.

[0037] The specific embodiments described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A power protection module based on SIP packaging, characterized in that: The power protection module includes a shell and an internal circuit function unit; wherein the shell adopts an HTCC ceramic integrated shell, and the internal circuit function unit includes a first circuit function unit and a second circuit function unit, and the first circuit function unit and the second circuit function unit are distributed in the internal cavity of the shell on the left and right sides; The first circuit functional unit includes the following structure: an input sampling voltage signal terminal Vin1 is connected to one end of a first resistor R1 and one end of a first capacitor C1 respectively, the other end of the first resistor R1 is connected to the positive input end of a first operational amplifier N1, the other end of the first capacitor C1 is connected to an analog ground AGND, an input reference voltage signal terminal Vref1 is connected to one end of a second resistor R2 and one end of a second capacitor C2, the other end of the second resistor R2 is connected to the negative input end of the first operational amplifier N1, the other end of the second capacitor C2 is connected to the analog ground AGND, one end of a power supply voltage Vdd1 is connected to one end of a third capacitor C3, the cathode of a first diode V1, and the cathode of a third capacitor C4. One end of the fourth capacitor C4, one end of the third resistor R3, one end of the thirteenth resistor R13, and the power supply end of the first operational amplifier N1 are connected, the ground end of the first operational amplifier is connected to the analog ground AGND, the output end of the first operational amplifier N1 is connected to one end of the fourth resistor R4, one end of the fifth resistor R5, and the first circuit unit output pin Del1+, the other end of the fourth resistor R4 is connected to the cathode of the second diode V2, the other end of the fifth resistor R5 is connected to one end of the fifth capacitor C5, the anode of the first diode V1, the anode of the second diode V2, one end of the seventh resistor R7, and the first circuit unit output pin Del1-, the other end of the fifth capacitor C5 is connected to the analog ground AGND. The seventh resistor R7 is connected to the analog ground AGND, the other end of the seventh resistor R7 is connected to one end of the eighth resistor R8, the anode of the third diode V3, one end of the sixth capacitor C6, and the positive input terminal of the second operational amplifier N2, the other end of the fourth capacitor C4 is connected to one end of the sixth resistor R6, the other end of the third resistor R3, and the negative input terminal of the second operational amplifier N2, the other end of the sixth capacitor C6 is connected to the analog ground AGND, the cathode of the third diode V3 is connected to the external reset signal REST1, the other end of the eighth resistor R8 is connected to the cathode of the fourth diode V4, the anode of the fourth diode V4 is connected to the anode of the fifth diode V5, the cathode of the sixth diode V6, and the input terminal of the second operational amplifier N2 The output terminal is connected, the cathode of the fifth diode V5 is connected to one end of the ninth resistor R9, the other end of the ninth resistor R9 is connected to the first output signal terminal port1, the anode of the sixth diode V6 is connected to one end of the tenth resistor R10, the other end of the tenth resistor R10 is connected to one end of the eleventh resistor R11 and the base of the first transistor Q1, the emitter of the first transistor Q1 is connected to the other end of the eleventh resistor R11 and the analog ground AGND, the collector of the first transistor Q1 is connected to one end of the twelfth resistor R12, one end of the fourteenth resistor R14, and the cathode of the primary diode of the first optical coupler D1, the other end of the twelfth resistor R12 is connected to the second output signal terminal port LED1, the other end of the fourteenth resistor R14 is connected to the other end of the thirteenth resistor R13 and the anode of the primary diode of the first optical coupler D1, the emitter of the secondary transistor of the first optical coupler D1 is connected to the anode of the seventh diode V7 and the third output signal terminal port WS1-,The collector of the secondary transistor of the first optical coupler D1 is connected to the cathode of the seventh diode V7 and the fourth output signal terminal port WS1+; The second circuit functional unit has the same structure as the first circuit functional unit; The first optical coupler D1 is arranged at the edge of the first circuit functional unit, leaving a preset safety distance from surrounding devices and conduction strips.

2. According to the SIP package-based power protection module of claim 1, it is characterized in that: The diode, triode, operational amplifier and optical coupler in the power protection module are all bare circuit components.

3. According to claim 2, a power protection module based on SIP packaging is wired inside the HTCC ceramic integrated shell, the holes are filled and the circuits are printed by screen printing technology, and the electrical connection between the first circuit functional unit and the second circuit functional unit is achieved by combining thick film technology and metal bonding method, and the module is integrated through full sealed packaging.

4. According to the power protection module based on SIP packaging as claimed in claim 3, the thick film process includes a thick film substrate printing process and a thick film assembly process, wherein: The thick film substrate printing process includes using a thick film hybrid integrated circuit semi-automatic printing process for high-power resistors to print and produce a high-precision resistor film layer on a resistor substrate.

5. A power protection module based on SIP packaging according to claim 4, characterized in that: The HTCC ceramic integrated housing and the bare circuit components are bonded by using metal materials through physical and chemical methods.

6. A power protection module based on SIP packaging according to claim 5, characterized in that: The HTCC ceramic integrated housing adopts a CSOP wing-shaped pin form.

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