Light emitting chip carrier and light emitting device

Abstract

The light emitting chip support disclosed in the application comprises: a conductive substrate comprising a plurality of pairs of pads arranged at intervals along a first direction; each pair of pads comprises a connecting pad and a die bonding pad arranged at intervals along a second direction; wherein the connecting pad comprises a main body part and an extension part, and the die bonding pad comprises a first die bonding part and a second die bonding part; a shell forms a receiving groove group on one side of the conductive substrate, and the receiving groove group comprises first and second receiving grooves adjacent in the second direction; the plurality of pairs of pads comprises first and second adjacent pairs of pads; in the first pair of pads, the main body part is located in the first receiving groove, the extension part is connected to the main body part and extends into the second receiving groove along the second direction, and the first die bonding part is adjacent to the extension part in the second direction; the second die bonding part is connected to the first die bonding part on the side close to the second pair of pads; and the first and second pairs of pads are arranged symmetrically about the center of the receiving groove group. The embodiment of the application can realize flexible series-parallel design of light emitting devices.

Description

Technical Field

[0001] The present invention relates to the field of optoelectronic devices, and in particular to a light-emitting chip bracket and a light-emitting device. Background Art

[0002] An SMD (Surface Mounted Device) bracket is a type of LED (Light Emitting Diode) bracket. Based on the SMD bracket, LED chips are mounted, soldered, and packaged to form the final LED light-emitting device. Existing multi-channel LED brackets typically have one positive and negative pair per channel, resulting in a small heat dissipation area, a small die bonding area, and difficulty in connecting different pairs of circuits in series and parallel at the package end.

[0003] Therefore, an object of the present invention is to provide an LED bracket that can realize flexible series and parallel design. Summary of the Invention

[0004] Therefore, in order to overcome at least some of the defects in the prior art, embodiments of the present invention provide a light-emitting chip bracket and a light-emitting device, which have the characteristics of enabling flexible serial and parallel design of light-emitting devices.

[0005] Specifically, on the one hand, an embodiment of the present invention provides a light-emitting chip support, comprising: a conductive substrate, the conductive substrate comprising a plurality of pairs of pads arranged at intervals along a first direction; each pair of the plurality of pads comprising a connecting pad and a die-bonding pad arranged at intervals along a second direction; the second direction is different from the first direction; wherein the connecting pad comprises a main body and an extension, and the die-bonding pad comprises a first die-bonding portion and a second die-bonding portion; a housing surrounding the conductive substrate and forming a receiving groove group located on one side of the conductive substrate; the receiving groove group comprises a first receiving groove and a second receiving groove adjacent to each other in the second direction; the plurality of pad pairs comprise adjacent first and second pad pairs; in the first pad pair, the main body is located in the first receiving groove, the extension is connected to the main body and extends into the second receiving groove along the second direction, the first die-bonding portion is disposed in the second receiving groove and is adjacent to the extension in the second direction; the second die-bonding portion is connected to a side of the first die-bonding portion close to the second pad pair; the first pad pair and the second pad pair are arranged symmetrically about the center of the receiving groove group.

[0006] As can be seen from the above, the above embodiments of the present invention can achieve one or more of the following beneficial effects: by designing the layout of the first pad pair and the second pad pair corresponding to each accommodating groove group, the second pad pair and the first pad pair are arranged symmetrically about the center of the accommodating groove group, so that the first accommodating groove includes the main body of the connecting pad and the die-bonding pad of the first pad pair, and includes the extension of the connecting pad of the second pad pair, that is, there are three connectable pads in the first accommodating groove, and the same is true for the second accommodating groove. Therefore, there are three connectable pads in each accommodating groove of the shell. Compared with the design of a pair of positive and negative electrode pads of the traditional bracket, the embodiment of the present invention can realize a flexible series and parallel design of multiple circuits in the light-emitting device. In addition, by designing the layout of the conductive substrate, the die-bonding pad area in each accommodating groove is larger, the die-bonding area is larger, better heat dissipation effect can be achieved, and a larger die-bonding position for the light-emitting chip can be provided, which can improve the luminous efficiency.

[0007] Other aspects and features of the present invention will become apparent from the following detailed description, which proceeds with reference to the accompanying drawings. It should be understood, however, that the drawings are designed for illustrative purposes only and are not intended to limit the scope of the present invention. It should also be understood that, unless otherwise indicated, the drawings are not necessarily drawn to scale and are intended merely to conceptually illustrate the structures and processes described herein. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0009] Figure 1 This is a schematic diagram of the front structure of a light-emitting chip bracket provided by one embodiment of the present invention.

[0010] Figure 2 for Figure 1 The back structure schematic diagram of the light-emitting chip bracket is shown.

[0011] Figure 3 This is a schematic diagram of the front structure of a light-emitting chip bracket provided by another embodiment of the present invention.

[0012] Figure 4 for Figure 3 The back structure schematic diagram of the light-emitting chip bracket is shown.

[0013] Figure 5 for Figure 1 Schematic diagram of the size markings of the light-emitting chip holder shown.

[0014] Figure 6 for Figure 1 The schematic diagram of the bottom area of ​​the second accommodating groove is marked in the light-emitting chip bracket shown.

[0015] Figure 7 for Figure 1The light-emitting chip bracket shown is a schematic diagram showing the areas of the respective pads in the second accommodation groove.

[0016] Figure 8 A schematic diagram of the front structure of a light-emitting device provided by an embodiment of the present invention.

[0017] Figure 9 for Figure 8 The circuit connection diagram of the light-emitting device shown.

[0018] Figure 10 for Figure 8 The diagram shows a circuit connection diagram of another embodiment of a light emitting device.

[0019] Figure 11 for Figure 8 The diagram shows a schematic diagram of electrical connections of a light emitting device in another embodiment.

[0020] Figure 12 for Figure 8 The diagram shows a circuit connection diagram of another embodiment of a light emitting device.

[0021] [Description of Reference Numerals]

[0022] 100: light-emitting chip bracket; 200: light-emitting device; 10: conductive substrate; 11: pad pair; 11a: first pad pair; 11b: second pad pair; 111: connecting pad; 1111: main body; 1112: extension; 112: die-bonding pad; 1121: first die-bonding portion; 1122: second die-bonding portion; 20: housing; 21: accommodating groove group; 211: first accommodating groove; 212: second accommodating groove; 213: first bottom edge; 214: second bottom edge; 30: light-emitting chip; 31: first light-emitting chip; 32: second light-emitting chip. DETAILED DESCRIPTION

[0023] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0024] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts should fall within the scope of protection of the present invention.

[0025] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way are interchangeable where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or that are inherent to these processes, methods, products or devices. It should also be noted that the description of "symmetry" in the description of the present invention ignores the differences caused by the accommodating grooves, the chamfers of the shell and the positive and negative pole markings on the shell appearance.

[0026] It should also be noted that the division of multiple embodiments in the present invention is only for the convenience of description and should not constitute a special limitation. The features in various embodiments can be combined and referenced to each other without contradiction.

[0027] One embodiment of the present invention provides a light emitting chip support 100, which can be used to bond, wire bond, and package a light emitting chip (such as an LED chip) to finally produce a light emitting device (such as an LED light emitting device). Figure 1 As shown, the light-emitting chip holder 100 includes a conductive substrate 10 and a housing 20 connected to the conductive substrate 10. The conductive substrate 10 includes a plurality of pairs of pads 11 spaced apart along a first direction. Each of the plurality of pad pairs 11 includes a connection pad 111 and a die-bonding pad 112 spaced apart along a second direction. The second direction is different from the first direction, for example, can be perpendicular to the first direction.

[0028] For example, Figure 1 Taking the orientation shown as an example, the first direction is the up and down direction, the second direction is the left and right direction, and the conductive substrate 10 includes 4 rows and 2 columns of pads arranged at intervals from top to bottom, wherein each pair of pad pairs 11 includes a connecting pad 111 and a die-bonding pad 112 adjacent to each other on the left and right.

[0029] In order to observe the structure of the conductive substrate 10 more clearly, Figure 2 Provided Figure 1 The back view of the light emitting chip support 100 is shown, wherein the connecting pad 111 includes a main portion 1111 and an extending portion 1112. The die-bonding pad 112 includes a first die-bonding portion 1121 and a second die-bonding portion 1122.

[0030] Continue to refer to Figure 1The housing 20 surrounds the conductive substrate 10 and forms a receiving groove group 21 on one side of the conductive substrate 10. Figure 1 In the illustrated orientation, the housing 20 forms two rows and two columns of four accommodating slots on the conductive substrate 10. The two accommodating slots in each row are combined into a accommodating slot group 21. For convenience, the two accommodating slots in a accommodating slot group 21 are referred to as the first accommodating slot 211 and the second accommodating slot 212, respectively. That is, a accommodating slot group 21 includes the first accommodating slot 211 and the second accommodating slot 212 adjacent to each other in the second direction. The side of each of the multiple accommodating slots formed by the housing 20 that is closest to the conductive substrate 10 can be referred to as the bottom of the slot. Figure 1 2 shows two upper and lower receiving groove groups 21. The plurality of pad pairs 11 include adjacent first pad pairs 11a and second pad pairs 11b, wherein each of the first pad pair 11a and the second pad pair 11b includes a connecting pad 111 and a die-bonding pad 112.

[0031] The following is based on Figure 1 , Figure 1 The first row of the accommodating groove group 21 is taken as an example, in which the first pad pair 11a ( Figure 1 Taking the pad pair 11 in the first row of the four pad pairs shown as an example, in the first pad pair 11a, the main body 1111 of the connecting pad 111 is located within the first receiving groove 211, and the extension 1112 is connected to the main body 1111 and extends along the second direction into the second receiving groove 212. The first die-bonding portion 1121 of the die-bonding pad 112 is located within the second receiving groove 212 and is adjacent to the extension 1112 in the second direction. The second die-bonding portion 1122 is connected to the side of the first die-bonding portion 1121 that is closest to the second pad pair 11b.

[0032] Continue to refer to Figure 1 In the first row of the accommodating groove group 21, the second pad pair 11b (ie Figure 1 Among the four pairs of pad pairs shown, the pad pair 11 located in the second row is symmetrically arranged with the first pad pair 11a about the center of the receiving groove group 21. That is, in the second pad pair 11b, the main body of the connecting pad 111 is located in the second receiving groove 212, the extension portion 1112 is connected to the main body 1111 and extends into the first receiving groove 211 along the second direction, and the first crystal-bonding portion 1121 of the crystal-bonding pad 112 is located in the first receiving groove 211 and is arranged adjacent to the extension portion 1112 in the second direction. The second crystal-bonding portion 1122 is connected to the side of the first crystal-bonding portion 1121 close to the first pad pair 11a. The second pad pair 11b is symmetrically arranged with the first pad pair 11a about the center of the receiving groove group 21, so that similar crystal-bonding and wire-bonding operations can be performed on the two bowls and cups through translation or rotation, which can greatly reduce the difficulty of subsequent crystal-bonding and wire-bonding operations.

[0033] by Figure 1 The connection pads 111 are approximately L-shaped or strip-shaped, and the die-bonding pads 112 are approximately Z-shaped. In another embodiment, they may also be approximately L-shaped. The connection pads 111 of the first pad pair 11a extend from right to left through the first receiving groove 211 and into the second receiving groove 212. The connection pads 111 of the second pad pair 11b extend from left to right through the second receiving groove 212 and into the first receiving groove 211. Figure 1 As can be seen in the figure, the first receiving groove 211 includes the main body 1111 of the connecting pad 111 of the first pad pair 11a, the first and second bonding portions 1121, 1122 of the bonding pad 112 of the second pad pair 11b, and the extension 1112 of the connecting pad 111 of the second pad pair 11b. The second receiving groove 212 includes the extension 1112 of the connecting pad 111 of the first pad pair 11a, the first and second bonding portions 1121, 1122 of the bonding pad 112 of the first pad pair 11a, and the main body 1111 of the connecting pad 111 of the second pad pair 11b. That is, each of the first accommodating groove 211 and the second accommodating groove 212 includes three connectable pads, which can provide a connection mode for the light-emitting devices in adjacent accommodating grooves in series and parallel, and each accommodating groove includes at least a pair of electrodes extending from opposite sides of the light-emitting chip bracket, so that the light-emitting device after die bonding and wire bonding can have all positive poles on the same side (all negative poles are also on the other opposite side). In this way, the light-emitting device can be more conveniently connected to the external circuit later, and the positive and negative poles can be better identified after marking any corner of the light-emitting device housing. For example, according to Figure 1 The orientation can be set to 4 positive poles on the left and 4 negative poles on the right. Or 4 negative poles on the left and 4 negative poles on the right. Figure 1 For example, the electrode mark is made in the lower left corner to indicate that the negative electrode (or positive electrode) is on the left side. Of course, this embodiment does not limit the position of the mark to only Figure 1 For example, when a light-emitting device is placed in the first receiving groove 211, its cathode (or anode) can be connected to the extension 1112 of the connection pad 111 of the second electrode pair 11b, so that its cathode (or anode) is connected to the left. Its anode (or cathode) can be connected to the main body 1111 of the connection pad 111 of the first electrode pair 11a or to the die-bonding pad 112 of the second electrode pair 11b, so that its anode (or cathode) is connected to the right.

[0034] Compared to conventional LED holders that only have one pair of positive and negative electrodes in one slot, the light-emitting chip holder 100 provided in this embodiment provides more possibilities for connecting the light-emitting chips that can be fixed in the first receiving slot 211 and the second receiving slot 212. For example, a light-emitting chip can be provided in each of the first receiving slot 211 and the second receiving slot 212, and the positive electrodes of both light-emitting chips can be connected to the connecting pad 111 of the first pad pair 11a, and the negative electrodes of both light-emitting chips can be connected to the connecting pad 111 of the second pad pair 11b, thereby achieving parallel connection of the two light-emitting chips. Alternatively, the positive and negative electrodes of one light-emitting chip can be connected to the connecting pad 111 and the die-bonding pad 112 of the first pad pair 11a, respectively, while the positive and negative electrodes of the other light-emitting chip can be connected to the connecting pad 111 and the die-bonding pad 112 of the second pad pair 11b, respectively, thereby achieving independent connection of the two light-emitting chips. Alternatively, the positive electrode of one light-emitting chip is connected to the die-bonding pad 112 of the second pad pair 11b, and the negative electrode is connected to the connecting pad 111 of the first pad pair 11a. The positive electrode of another light-emitting chip is connected to the connecting pad 111 of the first pad pair 11a, and the negative electrode is connected to the connecting pad 111 of the second pad pair 11b. In this way, the two light-emitting chips are connected in series. Of course, the above connection method is for illustration only and is not intended to limit the present embodiment.

[0035] In addition, according to Figure 1 The first bonding portion 1121 and the second bonding portion 1122 of the die-bonding pad 112 are connected to form a "Z" shape. Specifically, the die-bonding pad 112 surrounds the corresponding extension 1112 from both the left and bottom sides (or the right and top sides). This design maximizes the area of ​​the die-bonding pad 112, allowing it to bond larger light-emitting chips. It also increases the heat dissipation area and improves luminous efficiency. Furthermore, within a single accommodating groove group 21, the first pad pair 11a and the second pad pair 11b are arranged symmetrically around the center, making the layout of the conductive substrate 10 more compact and ensuring greater space utilization. In addition, in order to facilitate the subsequent connection of the light-emitting chip holder 100 with the external circuit, the solid crystal pad 112 makes appropriate concessions to the main body 1111 of the connecting pad 111 located in the same accommodating groove at a position close to the outside of the light-emitting chip holder 100, so that the solid crystal pad 112 and the connecting pad 111 exposed outside the shell are of sufficient size to facilitate electrical testing after the packaging is completed, so that the first solid crystal part 1121 and the second solid crystal part 1122 of the solid crystal pad 112 are connected to form a "Z" shape, and the connecting pad 111 as a whole is nearly "L"-shaped, but making concessions is not a must. The first solid crystal part 1121 and the second solid crystal part 1122 of the solid crystal pad 112 can also be connected to form a nearly "L" shape, and the connecting pad 111 as a whole is a long strip.

[0036] Taking the light emitting chip support 100 as an example, the number of pad pairs 11 is four pairs, and the number of accommodating groove groups 21 is two groups, the first pad pair 11a and the second pad pair 11b in each accommodating groove group 21 constitute a pad group, and the four pad pairs 11 are divided into two pad groups, such as Figure 1 and Figure 2 In the embodiment shown, the two pad groups are arranged in the same direction along the first direction, that is, the arrangement directions of the two pad groups are the same. Figure 1 For example, the first row has a die bonding pad 112 on the left and a connection pad 111 on the right, and the second row has a connection pad 111 on the left and a die bonding pad 112 on the right. The aforementioned bracket arrangement makes the entire light emitting chip bracket 100 roughly centrally symmetrically distributed. Or in the case of Figure 3 and Figure 4 In the embodiment shown, the two pad groups are symmetrically arranged about an axis along the second direction. Figure 3 and Figure 4 The horizontal dotted line in the middle is the axis. Figure 3 For example, in the first receiving groove group 21, the first row has the die-bonding pad 112 on the left and the connecting pad 111 on the right, and the second row has the connecting pad 111 on the left and the die-bonding pad 112 on the right. In the second receiving groove group 21, the first row has the connecting pad 111 on the left and the die-bonding pad 112 on the right, and the second row has the die-bonding pad 112 on the left and the connecting pad 111 on the right. The bracket arrangement as described above makes the relative sizes and relative positions of the die-bonding pads and the connecting pads in each receiving groove similar, which greatly ensures the convenience of subsequent operations such as die bonding and wire bonding on the bracket, greatly saving the cost of subsequent processing.

[0037] The following reference Figure 5 The dimensional relationship in the light emitting chip support 100 is described. In some embodiments, the accommodating groove group 21 has a first bottom edge 213 and a second bottom edge 214 that are opposite to each other in the first direction. The first bottom edge 213 is located on the side of the first solder pad pair 11a facing away from the second solder pad pair 11b, and the second bottom edge 214 is located on the side of the second solder pad pair 11b facing away from the first solder pad pair 11a. Figure 5 Taking the first row of the receiving groove group 21 as an example, the first bottom edge 213 is the upper bottom edge of the receiving groove group 21, the second bottom edge 214 is the lower bottom edge of the receiving groove group 21, the first pad pair 11a is a pair of pads close to the upper bottom edge, and the second pad pair 11b is a pair of pads close to the lower bottom edge. The first pad pair 11a and the second pad pair 11b are both partially or completely located between the first bottom edge 213 and the second bottom edge 214. Figure 5As shown, the upper edges of the die-bonding pads 112 and the connecting pads 111 of the first pad pair 11a are located on the side of the first bottom edge 213 facing away from the second bottom edge 214, and the lower edges are located between the first bottom edge 213 and the second bottom edge 214. The lower edges of the die-bonding pads 112 and the connecting pads 111 of the second pad pair 11b are located on the side of the second bottom edge 214 facing away from the first bottom edge 213, and the upper edges are located between the first bottom edge 213 and the second bottom edge 214.

[0038] In one embodiment, the distance between the first bottom edge 213 and the second bottom edge 214 is the groove bottom width W1. The distance from the edge of the die-bonding pad 112 of the first pad pair 11a, closest to the second pad pair 11b, to the first bottom edge 213 is the first die-bonding width W2, which is greater than half the groove bottom width W1. For example, in a 3838 model (i.e., with outer dimensions of 3.8mm*3.8mm) light-emitting chip holder 100, the groove bottom width W1 is approximately 1.43mm, and the first die-bonding width W2 can be 0.73-0.95mm, meaning that the first die-bonding width W2 accounts for 51%-66% of the groove bottom width W1. This ensures a sufficiently large die-bonding area, allowing for die-bonding of larger light-emitting chips. In addition, the size of the first die-bonding width W2 allows the light-emitting chip to be located as close to the center of the accommodating groove as possible when the light-emitting chip is fixed on the die-bonding pad 112, relatively far away from the shell 20. This can reduce the impact of the heat released by the light-emitting chip during operation on the shell 20, while making the light output of the entire light-emitting device more uniform, and can also avoid height loss caused by the side of the chip being too close to the shell 20 when the chip is large.

[0039] Further, continue to refer to Figure 5 The distance from the edge of the second die-bonding portion 1122 of the first pad pair 11a facing away from the second pad pair 11b to the first bottom edge 213 is the second die-bonding width W3. This second die-bonding width W3 is greater than one-third and less than one-half of the groove bottom width W1. For example, in a 3838 model (i.e., with outer dimensions of 3.8mm*3.8mm) light-emitting chip holder 100, the groove bottom width W1 is approximately 1.43mm. The second die-bonding width W3 can be 0.48mm-0.7mm, meaning that the second die-bonding width W3 accounts for 33%-49% of the groove bottom width W1. The difference between the first die-bonding width W2 and the second die-bonding width W3 can be considered the width of the second die-bonding portion 1122, which can range from 0.25mm to 0.47mm.

[0040] In some embodiments, the width W4 from the edge of the connecting pad 111 of the first pad pair 11a near the second pad pair 11b to the first bottom edge 213 (i.e., the width from the edge of the connecting pad 111 of the second pad pair 11b near the first pad pair 11a to the second bottom edge 214) can be considered the width of the connecting pad 111 within the receiving groove. When W4 ranges from 0.28 mm to 0.5 mm for light-emitting chip holders 100 of different sizes, the required width for electrical connection with the light-emitting chip can be ensured. In some embodiments, W4 is generally less than 0.35 mm. Furthermore, the length of the extension 1112 of the connecting pad 111 along the second direction is greater than or equal to 0.28 mm. The spacing widths between the multiple pad pairs 11, as well as the spacing widths between the connecting pad 111 and the die-bonding pad 112, are greater than or equal to 0.2 mm.

[0041] In some embodiments, the second receiving groove 212 has a groove bottom connected to the conductive substrate 10. The area of ​​the groove bottom is Figure 6 As shown in S0, the area where the die-bonding pad 112 of the first pad pair 11a contacts the bottom of the groove is Figure 7 In the embodiment, S1 is greater than or equal to 40% of S0. In some specific embodiments, S1 is 41.4% to 54.2% of the area of ​​the groove bottom S0, which can provide a larger die-bonding area.

[0042] Another embodiment of the present invention provides a light emitting device 200, comprising any one of the light emitting chip holders 100 described above. It also comprises a light emitting chip 30 electrically connected to the conductive substrate 10. A light emitting chip 30 is disposed in each of the first and second receiving grooves 211 and 212 of each receiving groove group 21. The light emitting device 200 further comprises, for example, phosphors, encapsulating glue, etc. filled in each receiving groove. Figure 8 As shown, it is a packaged light emitting device 200.

[0043] The light emitting device 200 provided in this embodiment adopts the aforementioned light emitting chip bracket 100, which also has the characteristics of being able to realize flexible series and parallel connection, providing a larger die-bonding area and better heat dissipation. For the specific connection method between the light emitting chip 30 and the conductive substrate 10, please refer to Figures 9 to 12 .

[0044] Reference Figures 9 to 12Each receiving groove of the light-emitting chip holder 100 is provided with a light-emitting chip 30, but this embodiment does not show the number of light-emitting chips 30 in each receiving groove. For ease of description, the first row of receiving groove group 21 is used as an example. The light-emitting chip 30 provided in the first receiving groove 211 is referred to as the first light-emitting chip 31, and the light-emitting chip 30 provided in the second receiving groove 212 is referred to as the second light-emitting chip 32. The first light-emitting chip 31 is fixed to the die-bonding pad 112 of the second pad pair 11b. The second light-emitting chip 32 is fixed to the die-bonding pad 112 of the first pad pair 11a. This allows the first light-emitting chip 31 to be located near the center of the first receiving groove 211, and the second light-emitting chip to be located near the center of the second receiving groove 212. This improves heat dissipation and reduces the impact of heat generation on the housing 20 material. It also makes the light output of the entire light-emitting device more uniform and avoids height loss caused by the side edges of larger chips being too close to the housing 20. It should be noted that in this embodiment, the light-emitting chip appears to be mainly fixed on the second die-bonding portion of the die-bonding pad in a direction parallel to the first or second direction, but is not actually limited to this. It can also be fixed at any position of the die-bonding pad in a direction different from the first or second direction, preferably close to the center of the receiving groove.

[0045] Reference Figure 9 Taking the first row of accommodating groove group 21 as an example, the two electrodes of the first light-emitting chip 31 are electrically connected to the connecting pad 111 and the solid crystal pad 112 of the second pad pair 11b respectively. The two poles of the second light-emitting chip 32 are electrically connected to the connecting pad 111 and the solid crystal pad 112 of the first pad pair 11a respectively. The first light-emitting chip 31 and the second light-emitting chip 32 are independently connected, and the circuit corresponding to the first light-emitting chip 31 is the circuit corresponding to the B- / B+ pin. The circuit corresponding to the second light-emitting chip 32 is the circuit corresponding to the A- / A+ pin. In addition, the two light-emitting chips 30 in the second row of accommodating groove group 21 can also refer to the above-mentioned independent connection method, corresponding to the circuit corresponding to the C- / C+ pin and the circuit corresponding to the D- / D+ pin respectively. Formation Figure 9 The four independent connections shown are as follows. Figure 9 The orientations of the positive and negative electrodes shown in the figure are for illustration only and should not be construed as limiting the understanding of this embodiment.

[0046] In another embodiment, Figure 10Taking the first row of accommodating groove groups 21 in the example, the second light-emitting chip 32 is connected in parallel with the first light-emitting chip 31. One of the two electrodes of the first light-emitting chip 31 is electrically connected to the main portion 1111 of the connecting pad 111 of the first pad pair 11a, and the other is electrically connected to the extension 1112 of the connecting pad 111 of the second pad pair 11b. One of the two electrodes of the second light-emitting chip 32 is electrically connected to the extension 1112 of the connecting pad 111 of the first pad pair 11a, and the other is electrically connected to the main portion 1111 of the connecting pad 111 of the second pad pair 11b. Figure 10 The first light emitting chip 31 and the second light emitting chip 32 are connected in parallel to the circuit corresponding to the E- / E+ pins. The second row of accommodating groove groups 21 can also refer to the above parallel connection method and be connected in parallel to the circuit corresponding to the F- / F+ pins. Figure 10 The connection method is two-by-two parallel. Of course, Figure 10 The orientations of the positive and negative electrodes shown in the figure are for illustration only and should not be construed as limiting the understanding of this embodiment.

[0047] In another embodiment, Figure 11 Taking the first row of accommodating groove groups 21 in the example, the first light-emitting chip 31 and the second light-emitting chip 32 are connected in series. One of the two electrodes of the first light-emitting chip 31 is connected to the die-bonding pad 112 of the second pad pair 11b, and the other is connected to the main body 1111 of the connecting pad 111 of the first pad pair 11a. One of the two electrodes of the second light-emitting chip 32 is connected to the extension 1112 of the connecting pad 111 of the first pad pair 11a, and the other is connected to the main body 1111 of the connecting pad 111 of the second pad pair 11b. Figure 11 The first light emitting chip 31 and the second light emitting chip 32 are connected in series to the circuit corresponding to the G- / G+ pins. The second row of accommodating groove groups 21 can be connected in series to the circuit corresponding to the H- / H+ pins in the same manner as described above. Figure 11 The two-in-series connection shown. Of course, Figure 11 The orientations of the positive and negative electrodes shown in the figure are for illustration only and should not be construed as limiting the understanding of this embodiment.

[0048] Of course, in some embodiments, it is also possible to Figure 12 In the hybrid connection shown, the two light-emitting chips 30 in the first row of the receiving slot group 21 are connected independently, corresponding to the I- / I+ pin and the L- / L+ pin respectively, and the two light-emitting chips 30 in the second row of the receiving slot group 21 are connected in parallel, corresponding to the M- / M+ pin. Figure 12 The orientations of the positive and negative electrodes shown in the figure are for illustration only and should not be construed as limiting the understanding of this embodiment.

[0049] In the light emitting device 200 , different colors of light can be set according to different connection modes of the light emitting chips 30 to realize multi-color light display and achieve different light mixing effects.

[0050] The above description is merely a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment, it is not intended to limit the present invention. Any technician familiar with the present profession can make some changes or modifications to equivalent embodiments of equivalent changes using the technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A light-emitting chip bracket (100), characterized in that: include: A conductive substrate (10), the conductive substrate (10) comprising a plurality of pad pairs (11) spaced apart along a first direction; each pad pair (11) of the plurality of pad pairs (11) comprising a connecting pad (111) and a crystal-bonding pad (112) spaced apart along a second direction; the second direction being different from the first direction; wherein the connecting pad (111) comprises a main body portion (1111) and an extension portion (1112), and the crystal-bonding pad (112) comprises a first crystal-bonding portion (1121) and a second crystal-bonding portion (1122); The housing (20) surrounds the conductive substrate (10) and forms a receiving groove group (21) located on one side of the conductive substrate (10); the receiving groove group (21) includes a first receiving groove (211) and a second receiving groove (212) adjacent to each other in the second direction; the plurality of pad pairs (11) include a first pad pair (11a) and a second pad pair (11b) adjacent to each other; in the first pad pair (11a), the main body (1111) is located in the first receiving groove (211), and the extension portion (1112) is connected to the first pad pair (11a). The first crystal-fixing portion (1121) is disposed in the second accommodating groove (212) and is arranged adjacent to the extension portion (1112) in the second direction. The second crystal-fixing portion (1122) is connected to a side of the first crystal-fixing portion (1121) close to the second solder pad pair (11b). The first solder pad pair (11a) and the second solder pad pair (11b) are symmetrically arranged about the center of the accommodating groove group (21).

2. The light-emitting chip holder (100) according to claim 1, characterized in that: The number of the plurality of pad pairs (11) is four, the number of the accommodating groove groups (21) is two, the first pad pair (11a) and the second pad pair (11b) in each accommodating groove group (21) constitute a pad group, wherein the two pad groups are arranged in the same direction along the first direction, or the two pad groups are arranged symmetrically about an axis along the second direction.

3. The light-emitting chip holder (100) according to claim 1, characterized in that: The accommodating groove group (21) has a first bottom edge (213) and a second bottom edge (214) opposite to each other in a first direction; the first bottom edge (213) is located on the side of the first pad pair (11a) facing away from the second pad pair (11b); the distance between the first bottom edge (213) and the second bottom edge (214) is the groove bottom width; the distance from the edge of the die-bonding pad (112) of the first pad pair (11a) close to the second pad pair (11b) to the first bottom edge (213) is the first die-bonding width, and the first die-bonding width is greater than half of the groove bottom width.

4. The light-emitting chip holder (100) according to claim 3, characterized in that: The distance from the edge of the second crystal-bonding portion (1122) of the first pad pair (11a) facing away from the second pad pair (11b) to the first bottom edge (213) is a second crystal-bonding width, and the second crystal-bonding width is greater than one-third of the groove bottom width and less than one-half of the groove bottom width.

5. The light-emitting chip holder (100) according to claim 1, characterized in that: The second accommodating groove (212) has a groove bottom connected to the conductive substrate (10); the area where the crystal bonding pad (112) of the first pad pair (11a) is connected to the groove bottom is greater than or equal to 40% of the area of ​​the groove bottom.

6. A light emitting device (200), characterized in that: include: The light-emitting chip bracket (100) according to any one of claims 1 to 5; A light-emitting chip (30) is electrically connected to the conductive substrate (10); the light-emitting chip is disposed in the first accommodating groove (211) and the second accommodating groove (212) in each accommodating groove group (21).

7. The light emitting device (200) according to claim 6, characterized in that The light-emitting chip comprises a first light-emitting chip (31) arranged in the first accommodating groove (211) and a second light-emitting chip (32) arranged in the second accommodating groove (212), wherein two electrodes of the first light-emitting chip (31) are respectively electrically connected to the connecting pad (111) and the die-bonding pad (112) of the second pad pair (11b); and two electrodes of the second light-emitting chip (32) are respectively electrically connected to the connecting pad (111) and the die-bonding pad (112) of the first pad pair (11a).

8. The light emitting device (200) according to claim 6, characterized in that The light-emitting chip comprises a first light-emitting chip (31) arranged in the first accommodating groove (211) and a second light-emitting chip (32) arranged in the second accommodating groove (212), the second light-emitting chip (32) being connected in parallel with the first light-emitting chip (31), one of the two electrodes of the first light-emitting chip (31) being electrically connected to the main body (1111) of the connecting pad (111) of the first pad pair (11a), and the other being electrically connected to the extension (1112) of the connecting pad (111) of the second pad pair (11b); one of the two electrodes of the second light-emitting chip (32) being electrically connected to the extension (1112) of the connecting pad (111) of the first pad pair (11a), and the other being electrically connected to the main body (1111) of the connecting pad (111) of the second pad pair (11b).

9. The light emitting device (200) according to claim 6, characterized in that The light-emitting chip comprises a first light-emitting chip (31) arranged in the first accommodating groove (211) and a second light-emitting chip (32) arranged in the second accommodating groove (212); the first light-emitting chip (31) and the second light-emitting chip (32) are connected in series, one of the two electrodes of the first light-emitting chip (31) is connected to the die-bonding pad (112) of the second pad pair (11b), and the other is connected to the main body (1111) of the connecting pad (111) of the first pad pair (11a); one of the two electrodes of the second light-emitting chip (32) is connected to the extension (1112) of the connecting pad (111) of the first pad pair (11a), and the other is connected to the main body (1111) of the connecting pad (111) of the second pad pair (11b).

10. The light emitting device (200) according to claim 6, characterized in that The light-emitting chip comprises a first light-emitting chip (31) arranged in the first accommodating groove (211) and a second light-emitting chip (32) arranged in the second accommodating groove (212); the first light-emitting chip (31) is fixed on the die-bonding pad (112) of the second pad pair (11b); and the second light-emitting chip (32) is fixed on the die-bonding pad (112) of the first pad pair (11a).

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