An automatic chip placement machine for electronic components

Abstract

The invention discloses an automatic chip mounter for electronic components, and relates to the technical field of electronic component processing. The chip mounter comprises a chip mount box, a receiving slide is arranged on the chip mount box, a receiving chain group is arranged in the receiving slide, a positioning box is arranged on the receiving chain group, a welt frame is arranged on the chip mount box, a plurality of movable welters are arranged on the welt frame, the movable welters are slidably connected with the welt frame, a feeder is arranged on the chip mount box, a plurality of feeding crawlers are arranged in the feeder, each feeding crawler is slidably connected with the feeder, a feedback area is arranged on the chip mount box, a feedback hydraulic rod is arranged in the feedback area, an oscillation component is arranged on the output end of the feedback hydraulic rod, a discharge trough is arranged in the feedback area, the discharge trough is connected with the oscillation component, a receiving plate is arranged in the feedback area, and an operating microcomputer is arranged on the chip mount box. The invention has the function of automatic welt of electronic boards and electronic components.

Description

Technical Field

[0001] The invention relates to the technical field of electronic component processing, in particular to an automatic placement machine for electronic components. Background Art

[0002] The fully automatic placement machine is a device used to achieve high-speed and high-precision fully automatic placement of components. The placement machine is the main equipment in the electronic component production line. The placement machine has developed from the early low-speed mechanical placement machine to the high-speed placement machine. Electronic products pursue miniaturization. Its function is to accurately install surface-mounted components on the fixed position of the PCB. The placement machine is located behind the screen printer in the SMT production line. The placement machine has many advantages, such as high assembly density, small size and light weight of electronic products. Generally, after using SMT, the volume of electronic products is reduced by 40% to 60%, the weight is reduced by 60% to 80%, the reliability is high, the vibration resistance is strong, and the solder joint defect rate is low.

[0003] However, the existing fully automatic placement machines have certain inconveniences when in use. Since the fully automatic placement machines are high-precision equipment, they are prone to deviations due to vibrations during use, especially during the placement process. The placement device will vibrate when it is moving and the edge bonding device will vibrate during movement. This vibration is particularly obvious. In addition, when the placement head is in use, it is easily affected by static electricity and dust when selecting components. At the same time, in the production process, solder paste leakage is also prone to occur, mainly due to the instability of the solder paste when it is applied. Therefore, these series of problems need to be overcome one by one, so we provide a more advanced fully automatic edge bonding machine. Summary of the invention

[0004] The object of the present invention is to provide an automatic placement machine for electronic components to solve the problems raised in the above background technology.

[0005] In order to solve the above technical problems, the present invention provides the following technical solution: an automatic placement machine for electronic components.

[0006] The patch machine includes a patch box, a receiving slide is arranged on the patch box, a receiving chain group is arranged in the receiving slide, a positioning box is arranged on the receiving chain group, a patch box is provided with a welt frame, a plurality of mobile welters are arranged on the welt frame, the mobile welters are slidably connected with the welt frame, a feeder is arranged on the patch box, a plurality of feeding tracks are arranged in the feeder, each feeding track is slidably connected with the feeder, a feedback area is arranged on the patch box, a feedback hydraulic rod is arranged in the feedback area, an oscillation component is arranged on the output end of the feedback hydraulic rod, a discharge trough is arranged in the feedback area, the discharge trough is connected with the oscillation component, a receiving board is arranged in the feedback area, an operating microcomputer is arranged on the patch box, and when electronic components are being patched, the electronic board or electronic components are first placed on the patch box. The device is sent into the receiving slide, and then the receiving chain group will drive the electronic board to move. Then, according to the shape of the electronic board, the patch program is set on the operating computer, and then it continues to be transported to the vicinity of the positioning box. Then, the mobile patch device will patch the electronic board, and the patch circuit board or tin sheet will be transmitted in the feeder. The mobile patch device will obtain the patch circuit board and tin sheet, and then move on the mobile frame. According to the program control in the operating computer, the mobile patch device will stick the patch circuit board and tin sheet on the electronic board, and then the bonded electronic board will be sent to the feedback area, and then the feedback hydraulic rod will be started. The oscillation component will fully detect the electronic board, detect the bonding strength of the electronic board, and feed it back to the operating computer.

[0007] A positioning component is arranged in the positioning box, and the positioning component includes a positioning infrared device and a positioning receiver. The positioning infrared device and the positioning receiver are respectively arranged on both sides of the receiving slide. A signal processor is arranged in the positioning box. The positioning infrared device and the positioning receiver are electrically connected to the signal processor through wires, and the signal processor is electrically connected to the operating microcomputer through wires. During the positioning process, the receiving slide will send the electronic board to the position detected by the positioning component. When entering the detection area, the positioning infrared device will cooperate with the positioning receiver. The positioning infrared device emits infrared rays, and the positioning receiver receives infrared rays until the electronic board blocks the infrared rays. Under the action of the signal processor, the blocking signal will be transmitted to the operating microcomputer to complete the positioning operation.

[0008] The receiving slide includes a single-sided slide and a single-sided auxiliary track. The positioning infrared device and the positioning receiver are respectively arranged on the single-sided slide and the single-sided auxiliary track. A receiving chain group is arranged in the single-sided slide and the single-sided auxiliary track. A telescopic rod group is arranged between the single-sided slide and the single-sided auxiliary track. A plurality of loading blocks are arranged on the receiving chain group. A telescopic cylinder is arranged in the patch box. An adaptable plate is arranged on the output end of the telescopic cylinder. The adaptable plate is connected to the single-sided slide. A transmission gear is rotatably connected in the patch box. An expansion plate is arranged on the single-sided auxiliary track. The expansion plate and the adaptable plate are respectively meshed with the transmission gear.

[0009] The mobile bordering device includes a mobile frame, which is slidably connected to the bordering frame. A mobile motor is arranged in the bordering frame, a mobile module is arranged on the output end of the mobile motor, the mobile frame is connected to the mobile module, and the bordering frame is provided with a receiving slide above. The mobile motor is electrically connected to the operating microcomputer through a wire, and a sliding box is slidably connected to the mobile frame. When performing the patch operation, the mobile motor is started, and the mobile module will be driven by the mobile motor to make the mobile frame move in the bordering frame, and the sliding box will move on the mobile frame to collect the patch circuit board and the tin sheet, and then it will move above the electronic board to wait for the patch operation instruction.

[0010] A sliding motor is provided on the sliding box, which meshes with the teeth on the moving frame, a solder paste box is provided on the sliding box, a solder rack is provided on the solder paste box, a solder gun is provided on the solder rack, and a guide assembly is provided on the solder rack. A plurality of capture clamps are slidably connected to the sliding box, and a plurality of capture servos are provided in the sliding block, each capture servo is respectively connected to the corresponding capture clamp, and the sliding box will move on the moving frame, and the sliding motor will drive the sliding box to move. Before bonding, the solder paste box is required to apply solder paste to it. During the coating process, the guide assembly can guide it to avoid leakage of solder paste or deviation. Then the capture servo is started, and the capture servo will drive the capture clamp to move. The capture clamp captures the formed SMD circuit board and bonds it to the electronic board. Then the receiving slide will send the bonded electronic board into the feedback area.

[0011] The guide assembly includes a guide sheet and a guide probe. The guide sheet is arranged on the solder rack. The solder rack is rotationally connected to the sliding box through an electric shaft. A guide fan wheel is rotationally connected inside the guide probe. The guide probe is connected to the negative pressure machine through a conduit. The guide fan wheel is in sliding contact with the guide sheet. A plurality of protrusions are arranged on the guide fan wheel. The solder gun will deliver the solder paste in the solder paste box to the electronic board. Then the negative pressure machine will be started to make the guide fan wheel rotate in the guide tube, and the guide probe will generate suction to remove dust and guide the bonding direction of the solder paste. During the rotation of the guide fan wheel, the expansion sheet on the guide probe will be deformed and greatly pressed on the guide sheet, causing the guide sheet to vibrate. This can shape the solder paste and reduce the problem of leakage.

[0012] A feeding motor is provided in the feeder, and the output end of the feeding motor is connected to the feeding crawler. A correction frame is provided in the feeder, and a plurality of correction plates are provided on the correction frame. Each correction plate is rotationally connected to the correction frame through an electric shaft, and the correction plate is electrically connected to the operating microcomputer through a wire. A plurality of dividing slots are provided on the feeder, and each dividing slot is provided with a graphic locator, and the graphic locator is electrically connected to the operating microcomputer through a wire. During the operation of transmitting the patch circuit board, the feeding motor will drive the feeding crawler to operate, and the feeding crawler will place the formed patch circuit board and tin plate on the feeding crawler, and the graphic locator detects the posture of the patch circuit board and adjusts the posture of the correction plate on the correction frame, thereby adjusting the posture of the patch circuit board, thereby ensuring the smoothness of the capture operation of the capture clamp.

[0013] The vibration component includes a vibration frame, which is respectively connected to the single-sided slide and the single-sided auxiliary track. The vibration frame is provided with a transverse groove and a transverse auxiliary groove. The transverse groove, the transverse auxiliary groove and the vibration frame are slidably connected. The vibration frame is provided with a transverse motor. The output end of the transverse motor is meshed with the teeth on the transverse groove. The vibration frame is provided with a vibration gear. The transverse auxiliary groove and the transverse groove are respectively meshed with the vibration gear. When the electronic board enters the feedback area, the transverse motor will drive the transverse groove and the transverse auxiliary groove to move in the vibration frame. Under the transmission of the vibration gear, the transverse groove and the transverse auxiliary groove will approach each other. Under the action of the feedback hydraulic rod, the single-sided slide and the single-sided auxiliary track will contact with the transverse groove and the transverse auxiliary groove, thereby causing the single-sided slide and the single-sided auxiliary track to shake, thereby detecting the bonding degree of the patch circuit board.

[0014] A first blocking cylinder is arranged on the vibration frame, a blocking plate is arranged on the output end of the first blocking cylinder, a blocking sub-plate is slidably connected to the end of the vibration frame away from the blocking plate, and the blocking sub-plate is arranged on the output end of the second blocking cylinder, and a sound wave generator and a sound wave receiving plate are arranged on the feedback area, and the sound wave generator and the sound wave receiving plate are electrically connected to the operating microcomputer through wires respectively. During the detection process, the first blocking cylinder and the second blocking cylinder will drive the blocking plate and the blocking sub-plate to move on the vibration frame, so that the receiving slideway will shake up and down, so as to detect the adhesion degree of the solder paste on the electronic board, and the sound wave generator and the sound wave receiving plate are used to transmit and determine the position of the tested electronic board, so that the position of the patch circuit board on the electronic board can be detected and fed back to the operating microcomputer.

[0015] Compared with the prior art, the beneficial effects achieved by the present invention are: 1. The present invention adopts a feed slide with an automatic expansion function, which is controlled by a microcomputer and adapts to the production of electronic boards of various specifications, making the transportation of electronic boards smoother and reducing damage to the electronic boards. At the same time, the positioning components are used to fully reduce the problem of product edge errors caused by position deviation during the transportation of electronic boards.

[0016] 2. The present invention adopts a structural component with an automatic guiding function, which can guide the solder paste, and can fully reduce the problems of solder paste leakage and solder paste contamination with dust during the solder paste bonding process. At the same time, after adopting the guiding structure, the placement position of the solder paste can also be fully guided, and the problem of too much or too little solder paste can be reduced.

[0017] 3. The present invention adopts a structural component with automatic adjustment of the feeding position, which can fully adjust the bonding circuit board or tin sheet to be bonded, avoiding the problem of falling off during the grabbing process, and also reduces the problem of bonding deviation of the bonding circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0020] Figure 2 It is a schematic diagram of the internal structure of the patch box of the present invention;

[0021] Figure 3 It is a schematic diagram of the receiving slide structure of the present invention;

[0022] Figure 4 It is a schematic diagram of the internal structure of the welt frame of the present invention;

[0023] Figure 5 It is a structural schematic diagram of the mobile edge applicator of the present invention;

[0024] Figure 6 It is a schematic diagram of the partial structure of the feeder of the present invention;

[0025] Figure 7 It is a schematic diagram of the structure of the oscillating component of the present invention;

[0026] Figure 8 yes Figure 2 The structural schematic diagram of A is partially enlarged in the middle;

[0027] Fig. 9 It is a schematic diagram of the structure of the guide assembly of the present invention;

[0028] In the figure: 1. SMD box; 2. Receiving slide; 201. Single-sided slide; 202. Single-sided auxiliary slide; 204. Loading block; 205. Telescopic cylinder; 206. Adaptive plate; 207. Transmission gear; 208. Expansion plate; 3. Receiving chain group; 4. Positioning box; 5. Welt frame; 6. Mobile welt; 601. Mobile frame; 602. Mobile motor; 603. Mobile module; 604. Sliding box; 605. Sliding motor; 606. Solder paste box; 607. Solder rack; 608. Solder gun; 609. Capture clamp; 610. Sliding block; 611. Capture servo; 7. Feeder; 701. Feeding motor; 702. Correction rack; 703. Correction sheet; 704. Material distribution trough ;705, graphic locator;8, feeding crawler;9, feedback area;10, feedback hydraulic rod;11, oscillation assembly;1101, vibration frame;1102, transverse groove;1103, transverse sub-groove;1104, transverse motor;1105, vibration gear;1106, first blocking cylinder;1107, blocking plate;1108, blocking sub-plate;1109, second blocking cylinder;1110, sound wave generator;1111, sound wave receiving plate;12, discharge chute;13, operating microcomputer;14, positioning assembly;1401, positioning infrared device;1402, positioning receiver;15, guide assembly;1501, guide plate;1502, guide probe;1503, guide fan wheel. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] The patch machine includes a patch box 1, a receiving slide 2 is arranged on the patch box 1, a receiving chain group 3 is arranged in the receiving slide 2, a positioning box 4 is arranged on the receiving chain group 3, a patch box 11 is provided with a welt frame 5, a plurality of mobile welters 6 are arranged on the welt frame 5, and the mobile welters 6 are slidably connected with the welt frame 5, a feeder 7 is arranged on the patch box 1, a plurality of feeding tracks 8 are arranged in the feeder 7, and each feeding track 8 is slidably connected with the feeder 7, a feedback area 9 is arranged on the patch box 1, a feedback hydraulic rod 10 is arranged in the feedback area 9, an oscillation component 11 is arranged on the output end of the feedback hydraulic rod 10, a discharge trough 12 is arranged in the feedback area 9, and the discharge trough 12 is connected with the oscillation component 11, a receiving plate is arranged in the feedback area 9, an operating microcomputer 13 is arranged on the patch box 1, and an electronic component When the device is being mounted, the electronic board or electronic components are first sent into the receiving slide, and then the receiving chain group will drive the electronic board to move. Then, according to the shape of the electronic board, the mounting program is set on the operating microcomputer, and then it continues to be transported to the vicinity of the positioning box. Then, the mobile patch device will mount the electronic board, and the patch circuit board or tin sheet will be transmitted in the feeder. The mobile patch device will obtain the patch circuit board and tin sheet, and then move on the mobile frame. According to the program control in the operating microcomputer, the mobile patch device will attach the patch circuit board and tin sheet to the electronic board, and then the attached electronic board will be sent to the feedback area, and then the feedback hydraulic rod will be started. The oscillation component will fully detect the electronic board, detect the bonding strength of the electronic board, and feed it back to the operating microcomputer.

[0031] A positioning component 14 is arranged in the positioning box 4, and the positioning component 14 includes a positioning infrared device 1401 and a positioning receiver 1402. The positioning infrared device 1401 and the positioning receiver 1402 are respectively arranged on both sides of the receiving slide 2. A signal processor is arranged in the positioning box 4. The positioning infrared device 1401 and the positioning receiver 1402 are electrically connected to the signal processor through wires, and the signal processor is electrically connected to the operating microcomputer 13 through wires. During the positioning process, the receiving slide will send the electronic board to the position detected by the positioning component. When entering the detection area, the positioning infrared device will cooperate with the positioning receiver. The positioning infrared device emits infrared rays, and the positioning receiver receives infrared rays until the electronic board blocks the infrared rays. Under the action of the signal processor, the blocking signal will be transmitted to the operating microcomputer to complete the positioning operation.

[0032] The receiving slide 2 includes a single-sided slide 201 and a single-sided auxiliary track 202, a positioning infrared device 1401 and a positioning receiver 1402 are respectively arranged on the single-sided slide 201 and the single-sided auxiliary track 202, a receiving chain group 3 is arranged in the single-sided slide 201 and the single-sided auxiliary track 202, a telescopic rod group is arranged between the single-sided slide 201 and the single-sided auxiliary track 202, a plurality of loading blocks 204 are arranged on the receiving chain group 3, a telescopic cylinder 205 is arranged in the patch box 1, an adaptable plate 206 is arranged on the output end of the telescopic cylinder 205, the adaptable plate 206 is connected to the single-sided slide 201, and a transmission gear 2 is rotatably connected in the patch box 1 07. An expansion plate 208 is provided on the single-sided auxiliary track 202. The expansion plate 208 and the adaptation plate 206 are respectively meshed with the transmission gear 207. During transportation, the operating microcomputer will receive the specification information of the electronic board, and then the operating microcomputer will control the telescopic cylinder to operate, driving the adaptation plate and the expansion plate to move. Under the action of the transmission gear, the single-sided slide and the single-sided auxiliary track are moved closer or farther away to adapt to the transportation operation of electronic boards of different specifications. Then the electronic board is sent to the patch area by the load-bearing chain group, and then the patch is carried out. The loading block is used to receive the circuit board to reduce the sliding damage caused during transportation.

[0033] The mobile bordering device 6 includes a mobile frame 601, which is slidably connected to the bordering frame 5. A mobile motor 602 is arranged in the bordering frame 5. A mobile module 603 is arranged on the output end of the mobile motor 602. The mobile frame 601 is connected to the mobile module 603. The bordering frame 5 is provided with a receiving slide 2 above. The mobile motor 602 is electrically connected to the operating microcomputer 13 through a wire. A sliding box 604 is slidably connected to the mobile frame 601. When performing the patch operation, the mobile motor is started, and the mobile module will be driven by the mobile motor, so that the mobile frame moves in the bordering frame, and the sliding box will move on the mobile frame to collect the patch circuit board and the tin sheet, and then it will move above the electronic board to wait for the patch operation instruction.

[0034] The sliding box 604 is provided with a sliding motor 605, which meshes with the teeth on the moving frame 601. The sliding box 604 is provided with a solder paste box 606, and the solder paste box 606 is provided with a solder rack 607. The solder rack 607 is provided with a solder gun 608, and the solder rack 607 is provided with a guide assembly 15. The sliding box 604 is slidably connected with a plurality of capture clips 609, and a plurality of capture servos 611 are provided in the sliding block 610, and each capture servo 611 is respectively connected to the corresponding capture clip 609. The moving box will move on the moving frame, and the sliding motor will drive the sliding box to move. Before bonding, a solder paste box is needed to apply solder paste to it. During the coating process, the guide component can guide it to avoid solder paste leakage or offset problems. Then start the capture servo, which will drive the capture clamp to move. The capture clamp captures the formed SMD circuit board and bonds it to the electronic board. Then the receiving slide will send the bonded electronic board into the feedback area.

[0035] The guide assembly 15 includes a guide piece 1501 and a guide probe 1502. The guide piece 1501 is arranged on the solder rack 607. The solder rack 607 is rotationally connected to the sliding box 604 through an electric shaft. A guide fan wheel 1503 is rotationally connected inside the guide probe 1502. The guide probe 1502 is connected to the negative pressure machine through a conduit. The guide fan wheel 1503 is in sliding contact with the guide piece 1501. The guide fan wheel 1503 is provided with a plurality of protrusions. The solder gun will send the solder paste in the solder paste box to the electronic board. Then the negative pressure machine will be started to make the guide fan wheel rotate in the guide tube, and the guide probe will generate suction. While removing dust, it can also guide the bonding direction of the solder paste. During the rotation of the guide fan wheel, the expansion piece on the guide probe will be deformed and greatly pressed on the guide piece, causing the guide piece to vibrate, which can shape the solder paste and reduce the problem of leakage.

[0036] A feeding motor 701 is provided in the feeder 7, and the output end of the feeding motor 701 is connected to the feeding crawler 8. A correction frame 702 is provided in the feeder 7, and a plurality of correction plates 703 are provided on the correction frame 702. Each correction plate 703 is rotationally connected to the correction frame 702 through an electric shaft, and the correction plate 703 is electrically connected to the operating microcomputer 13 through a wire. A plurality of material dividing troughs 704 are provided on the feeder 7, and each material dividing trough 704 is provided with a graphic locator 705, and the graphic locator 705 is electrically connected to the operating microcomputer 13 through a wire. During the operation of transmitting the patch circuit board, the feeding motor will drive the feeding crawler to operate, and the feeding crawler will place the formed patch circuit board and tin plate on the feeding crawler, and the graphic locator detects the posture of the patch circuit board and adjusts the posture of the correction plate on the correction frame, thereby adjusting the posture of the patch circuit board, thereby ensuring the smoothness of the capture operation of the capture clamp.

[0037] The vibration assembly 11 includes a vibration frame 1101, which is connected to the single-side slideway 201 and the single-side auxiliary slideway 202 respectively. The vibration frame 1101 is provided with a transverse groove 1102 and a transverse auxiliary groove 1103. The transverse groove 1102 and the transverse auxiliary groove 1103 are slidably connected with the vibration frame 1101. The vibration frame 1101 is provided with a transverse motor 1104. The output end of the transverse motor 1104 meshes with the teeth on the transverse groove 1102. The vibration frame 1101 is provided with a vibration gear. 1105, the transverse sub-slot 1103 and the transverse slot 1102 are respectively meshed with the vibration gear 1105. When the electronic board enters the feedback area, the transverse motor will drive the transverse slot and the transverse sub-slot to move in the vibration frame. Under the transmission of the vibration gear, the transverse slot and the transverse sub-slot will approach each other. Under the action of the feedback hydraulic rod, the single-sided slide and the single-sided sub-slot will contact with the transverse slot and the transverse sub-slot, thereby causing the single-sided slide and the single-sided sub-slot to shake, thereby detecting the bonding degree of the SMD circuit board.

[0038] A first blocking cylinder 1106 is arranged on the vibration frame 1101, and a blocking plate 1107 is arranged on the output end of the first blocking cylinder 1106. A blocking sub-plate 1108 is slidably connected to the end of the vibration frame 1101 away from the blocking plate 1107, and the blocking sub-plate 1108 is arranged on the output end of the second blocking cylinder 1109. A sound wave generator 1110 and a sound wave receiving plate 1111 are arranged on the feedback area 9. The sound wave generator 1110 and the sound wave receiving plate 1111 are electrically connected to the operating microcomputer 13 through wires respectively. During the detection process, the first blocking cylinder and the second blocking cylinder will drive the blocking plate and the blocking sub-plate to move on the vibration frame, so that the receiving slideway will shake up and down, thereby detecting the adhesion degree of the solder paste on the electronic board, and using the sound wave generator and the sound wave receiving plate to transmit and determine the position of the tested electronic board, the position of the SMD circuit board on the electronic board can be detected and fed back to the operating microcomputer.

[0039] The working principle of the present invention is as follows: when electronic components are being mounted, the specifications of the electronic board are input into the operating microcomputer 13, and the telescopic cylinder 205 is operated to drive the adaption plate 206 and the expansion plate 208 to move. Under the action of the transmission gear 207, the single-sided slideway 201 and the single-sided auxiliary track 202 are moved closer or farther away, and then the receiving chain group 3 will drive the electronic board to move, and the mounting program is set on the operating microcomputer 13, and the electronic board is transported to the vicinity of the positioning box 4. The positioning infrared device 1401 will cooperate with the positioning receiver 1402, and the positioning infrared device 1401 will emit infrared rays, and the positioning receiver 1402 will receive the infrared rays until the electronic board blocks the infrared rays. Under the action of , the blocking signal will be transmitted to the operating microcomputer 13, and then the mobile patch device 6 will patch the electronic board, and the feeder 7 will transmit the patch circuit board or tin sheet, and the feeding motor 701 will drive the feeding crawler 8 to operate, and the feeding crawler 8 will put the formed patch circuit board and tin sheet on the feeding crawler 8, and the graphic locator 705 will detect the posture of the patch circuit board and adjust the posture of the correction piece 703 on the correction frame 702, and the mobile patch device 6 will obtain the patch circuit board and tin sheet, and then move on the mobile frame 5. According to the program control in the operating microcomputer 13, the sliding box 604 will move on the moving frame 601, and the sliding motor 605 will The sliding box 604 is driven to move, and before the bonding, a solder paste box is needed to apply solder paste to it. During the coating process, the solder gun 608 will send the solder paste in the solder paste box 606 to the electronic board, and then the negative pressure machine will be started to make the guide fan wheel 1503 rotate in the guide tube 1502, and the guide probe 1502 will generate suction, so that the guide sheet 1501 controls the shape of the solder paste to avoid the problem of solder paste leakage or deviation, and then the capture servo 611 is started, and the capture servo 611 will drive the capture clamp 609 to move, and the capture clamp 609 captures the formed SMD circuit board and bonds it to the electronic board, and then the bonded electronic board is completed. It will be sent into the feedback area 9, and then the feedback hydraulic rod 10 will be started. When the electronic board enters the feedback area 9, the transverse motor 1104 will drive the transverse groove 1102 and the transverse sub-groove 1103 to move in the vibration frame 1101. Under the transmission of the vibration gear 1105, the transverse groove 1102 and the transverse sub-groove 1103 will be close to each other, and the first blocking cylinder 1106 and the second blocking cylinder 1109 will drive the blocking plate 1107 and the blocking sub-plate 1108 to move on the vibration frame 1101. The sound wave generator 1110 and the sound wave receiving plate are used to transmit and determine the position of the tested electronic board, detect the bonding strength of the electronic board, and feed it back to the operating microcomputer 13.

[0040] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0041] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An automatic placement machine for electronic components, characterized in that: The patch machine comprises a patch box (1), the patch box (1) is provided with a receiving slideway (2), a receiving chain group (3) is provided in the receiving slideway (2), a positioning box (4) is provided on the receiving chain group (3), the patch box (1) is provided with a welt frame (5), a plurality of movable welt devices (6) are provided on the welt frame (5), the movable welt devices (6) are slidably connected to the welt frame (5), the patch box (1) is provided with a feeder (7), a plurality of feeders (6) are provided in the feeder (7), and a plurality of feeders (6) are provided in the feeder (7). A material crawler (8), each of the feeding crawlers (8) is slidably connected to the feeder (7), a feedback area (9) is provided on the patch box (1), a feedback hydraulic rod (10) is provided in the feedback area (9), an oscillation component (11) is provided on the output end of the feedback hydraulic rod (10), a discharge trough (12) is provided in the feedback area (9), the discharge trough (12) is connected to the oscillation component (11), a receiving plate is provided in the feedback area (9), and an operating microcomputer (13) is provided on the patch box (1).

2. The electronic component automatic placement machine according to claim 1, characterized in that: A positioning component (14) is arranged in the positioning box (4), and the positioning component (14) includes a positioning infrared sensor (1401) and a positioning receiver (1402). The positioning infrared sensor (1401) and the positioning receiver (1402) are arranged on both sides of the receiving slideway (2) respectively. A signal processor is arranged in the positioning box (4), and the positioning infrared sensor (1401) and the positioning receiver (1402) are electrically connected to the signal processor through a wire, and the signal processor is electrically connected to the operating microcomputer (13) through a wire.

3. The electronic component automatic placement machine according to claim 2, characterized in that: The receiving slideway (2) comprises a single-side slideway (201) and a single-side auxiliary track (202); the positioning infrared device (1401) and the positioning receiver (1402) are respectively arranged on the single-side slideway (201) and the single-side auxiliary track (202); a receiving chain group (3) is arranged in the single-side slideway (201) and the single-side auxiliary track (202); a telescopic rod group is arranged between the single-side slideway (201) and the single-side auxiliary track (202); and a plurality of loading devices are arranged on the receiving chain group (3). The patch box (1) is provided with a telescopic cylinder (205), an adaptable plate (206) is provided on the output end of the telescopic cylinder (205), the adaptable plate (206) is connected to the single-sided slideway (201), a transmission gear (207) is rotatably connected in the patch box (1), an expansion plate (208) is provided on the single-sided auxiliary track (202), and the expansion plate (208) and the adaptable plate (206) are respectively meshed with the transmission gear (207).

4. The electronic component automatic placement machine according to claim 1, characterized in that: The mobile edge-adhering device (6) comprises a mobile frame (601), the mobile frame (601) is slidably connected to the edge-adhering frame (5), a mobile motor (602) is arranged inside the edge-adhering frame (5), a mobile module (603) is arranged on the output end of the mobile motor (602), the mobile frame (601) is connected to the mobile module (603), the edge-adhering frame (5) is provided with a receiving slideway (2) above, the mobile motor (602) is electrically connected to the operating microcomputer (13) through a wire, and a sliding box (604) is slidably connected to the mobile frame (601).

5. The electronic component automatic placement machine according to claim 4, characterized in that: The sliding box (604) is provided with a sliding motor (605), the sliding motor (605) is meshed with teeth on the moving frame (601), the sliding box (604) is provided with a solder paste box (606), the solder paste box (606) is provided with a solder rack (607), the solder rack (607) is provided with a solder gun (608), the solder rack (607) is provided with a guide assembly (15), the sliding box (604) is slidably connected with a plurality of capture clamps (609), a plurality of capture servos (611) are provided in the sliding block (610), and each of the capture servos (611) is respectively connected to a corresponding capture clamp (609).

6. The electronic component automatic placement machine according to claim 5, characterized in that: The guide assembly (15) includes a guide plate (1501) and a guide probe (1502). The guide plate (1501) is arranged on a solder rack (607). The solder rack (607) is rotationally connected to a sliding box (604) via an electric shaft. A guide impeller (1503) is rotationally connected inside the guide probe (1502). The guide probe (1502) is connected to a negative pressure machine via a conduit. The guide impeller (1503) is in sliding contact with the guide plate (1501). A plurality of protrusions are arranged on the guide impeller (1503).

7. The electronic component automatic placement machine according to claim 1, characterized in that: The feeder (7) is provided with a feeding motor (701), the output end of the feeding motor (701) is connected to the feeding crawler (8), the feeder (7) is provided with a correction frame (702), a plurality of correction plates (703) are provided on the correction frame (702), each of the correction plates (703) is rotationally connected to the correction frame (702) via an electric shaft, the correction plates (703) are electrically connected to the operating microcomputer (13) via a wire, the feeder (7) is provided with a plurality of material distribution troughs (704), each of the material distribution troughs (704) is provided with a graphic locator (705), and the graphic locator (705) is electrically connected to the operating microcomputer (13) via a wire.

8. The electronic component automatic placement machine according to claim 1, characterized in that: The vibration component (11) comprises a vibration frame (1101), the vibration frame (1101) is connected to a single-side slideway (201) and a single-side auxiliary slideway (202) respectively, the vibration frame (1101) is provided with a transverse groove (1102) and a transverse auxiliary groove (1103), the transverse groove (1102), the transverse auxiliary groove (1103) and the vibration frame (1101) are slidably connected, the vibration frame (1101) is provided with a transverse motor (1104), the output end of the transverse motor (1104) is meshed with teeth on the transverse groove (1102), the vibration frame (1101) is provided with a vibration gear (1105), the transverse auxiliary groove (1103) and the transverse groove (1102) are respectively meshed with the vibration gear (1105).

9. The electronic component automatic placement machine according to claim 8, characterized in that: The vibration frame (1101) is provided with a first blocking cylinder (1106), and a blocking plate (1107) is provided on the output end of the first blocking cylinder (1106). The vibration frame (1101) is slidably connected with a blocking sub-plate (1108) at one end away from the blocking plate (1107), and the blocking sub-plate (1108) is provided on the output end of the second blocking cylinder (1109). The feedback area (9) is provided with a sound wave generator (1110) and a sound wave receiving plate (1111), and the sound wave generator (1110) and the sound wave receiving plate (1111) are respectively electrically connected to the operating microcomputer (13) through wires.

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