A binding method of high-scorpium-content aluminum-scandium alloy target material

Abstract

The application provides a binding method of high scandium content aluminum scandium alloy target material. The method is that a pure nickel film is plated on the welding surface of the high scandium content (Sc content is greater than or equal to 20 at%) aluminum scandium alloy target material, then the aluminum scandium alloy target material plated with nickel and a back plate are heated to 200-250 DEG C, In-Ga-Sn-Bi-Al alloy solder is placed, the solder is uniformly scraped and coated, and the ultrasonic wave is used to infiltrate the solder to enhance the wettability of the solder and the target material, finally the target material and the back plate are buckled together, pressure is continuously applied to the surface of the target assembly until the target assembly is cooled to room temperature, and finally the high scandium content aluminum scandium alloy target assembly with a welding binding rate greater than or equal to 95% and a welding binding strength greater than or equal to 12 MPa is obtained.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of target material preparation and relates to a binding method of an aluminum-scandium alloy target material. BACKGROUND

[0002] The AlSc alloy target material is mainly used for magnetron sputtering of an AlScN film, and has more excellent piezoelectric properties than existing piezoelectric films such as AlN, ZnO and lead zirconate titanate (PZT), and is a core material of devices such as high-frequency mobile communication radio frequency filters and MEMS micro advanced sensors. Meanwhile, the piezoelectric properties and quality factor of the AlScN film prepared from the target material with increased scandium content are improved. However, the melting point of Al is 660 DEG C, and the melting point of Sc is 1541 DEG C, and the melting point difference between the two is large, and the solid solubility of Sc in Al is low. With the increase of scandium content in the aluminum-scandium alloy, hard and brittle intermediate compound phases (such as Al3Sc, Al2Sc, AlSc and AlSc2) are formed, which leads to the characteristics of easy brittle cracking and poor heat dissipation of the aluminum-scandium alloy with high scandium content (Sc content ≥ 20 at%). In addition, the linear expansion coefficient of the aluminum-scandium alloy and the backing plate material is large, so it is difficult to bind the aluminum-scandium alloy target material with high scandium content and the metal backing plate.

[0003] Chinese patent application "Method for forming and welding integrated preparation of aluminum-scandium alloy target material" (application number: CN202210513870.3) discloses a diffusion welding method of an aluminum-scandium alloy target material and an aluminum alloy backing plate and an aluminum-scandium alloy target material assembly prepared by the method. The welding method comprises: sequentially performing ultrasonic cleaning and pickling on the target material and the backing plate, placing the pickled aluminum-scandium alloy target material and aluminum alloy backing plate in an aluminum alloy sheath for sealing, then heating and softening the obtained aluminum alloy sheath, rolling and heat treating, and finally machining to obtain the desired target material assembly. However, the scandium content in the aluminum-scandium target material described in the patent is ≤ 20 at%. Diffusion welding has advantages such as welding rate and welding strength, but the welding process is complex, the surface of the target material and the backing plate needs to be treated in multiple ways, which is not conducive to industrialized production, and the metal sheath used is a disposable consumable, the backing plate after welding cannot be reused, and the production cost is high.

[0004] Chinese patent application "A welding method of aluminum-scandium target material and aluminum alloy back plate" (application number: CN202210238571.3) discloses a method of welding aluminum alloy back plate by electron beam welding of aluminum-scandium alloy target material. The patent adopts electron beam welding with ≥3 passes, a welding line speed of 10-15 mm / s, and a beam current of 20-60 mA for electron beam welding. However, the scandium content in the aluminum-scandium target material described in the patent is ≤20 at%. Electron beam welding is convenient for automatic production, and the welding process and quality are more stable. However, the target material electron beam welding method is greatly affected by the equipment, the equipment cost is high, the welding cavity space is limited, the electron beam is easily disturbed, the production environment requirements are relatively high, and the back plate after welding cannot be reused. If the welding defect is large, the product after welding is difficult to repair through secondary processing.

[0005] The brazing process of the target material is simpler than the above two welding methods, and the requirements for equipment are also relatively low, which has certain advantages in terms of production cost. Since the brazing temperature is relatively low, the deformation and residual stress of the brazed material are small, so the brazed back plate can be reused multiple times to reduce costs. The brazing method can adapt to the requirements of various product sizes, as long as the heating platform is adjusted to meet the requirements of large-size products, and the rework processing of defective products in production is simple. The traditional brazing method uses pure indium solder binding. The advantages of pure indium solder are good wettability and small solder hardness, and it is not easy to cause debonding during shaping and processing after welding. However, due to the low melting point of pure indium solder, the sputtering temperature may approach or be higher than the melting point of pure indium solder during sputtering of large-power or large-size targets, causing the solder to soften or even melt again, resulting in target debonding. At the same time, as the scandium content in the aluminum-scandium alloy target material increases, the wettability of pure indium solder on the surface of the aluminum-scandium alloy target material gradually deteriorates, resulting in a significant decrease in the welding bonding rate of high scandium content (Sc content ≥20 at%) targets.

[0006] The present application improves the brazing method by improving the composition of the brazing material, surface treatment of the aluminum-scandium alloy target material, and innovative binding process, and develops a brazing binding method for high scandium content aluminum-scandium alloy target material, which has important practical significance. SUMMARY

[0007] The present application provides a binding method for high scandium content (Sc content of 20-50 at%) aluminum-scandium alloy target material, and the welding bonding rate of the target material and the back plate after binding is ≥95 % and the welding bonding strength is ≥12 MPa.

[0008] In order to achieve the above-mentioned application purpose, the present application provides the following technical solutions:

[0009] The present application provides a brazing method for aluminum-scandium alloy target material, which comprises the following steps:

[0010] (1) First, a pure nickel film is plated on the welding surface of the aluminum scandium alloy target material.

[0011] (2) The plated aluminum scandium alloy target material and the back plate are heated, and then the filler metal is placed on the welding surface of the aluminum scandium alloy target material and the back plate.

[0012] (3) After the filler metal is melted, the welding surface is subjected to ultrasonic immersion, and after the immersion is completed, the aluminum scandium alloy target material and the back plate are buckled together to form a target material assembly, then pressure is continuously applied to the surface of the target material assembly, then heating is stopped and cooling to room temperature is performed, and finally the welded target material assembly is obtained.

[0013] In the present application, since the scandium content of the aluminum scandium alloy target material is ≥20 at%, preferably 20-50 at%, the brazing performance is poor, and surface treatment is required to improve the brazing performance. Plating nickel on the welding surface of the target material not only improves the wettability between the target material and the filler metal, but also further improves the welding bonding rate, and also reduces the internal stress generated due to the difference in thermal expansion coefficient between the target material and the back plate during heating and cooling. Through effective matching of the plating solution formula and the plating process, a low-stress nickel plating layer can be formed on the surface of the aluminum scandium alloy target material, and the effective adhesion of the nickel plating layer on the surface of the aluminum scandium alloy target material is ensured. At the same time, in the present application, the welding surface of the target material and the back plate is heated, and then ultrasonic immersion is introduced. The application of ultrasonic waves can remove bubbles and oxide films between the filler metal and the welding surface, thereby increasing the wettability of the filler metal and helping to improve the welding bonding rate. The welding bonding rate is a very important performance parameter of the target material assembly. High welding bonding rate can increase the contact area, thereby improving the welding strength and increasing the heat conduction efficiency between the target material and the back plate, thereby avoiding heat accumulation in the target material.

[0014] The filler metal composition of the present application is based on In as the main element, and trace alloying elements such as Ga, Sn, Bi, Al are added. The addition of Ga element can improve the wettability and flowability of the filler metal, and also improve the corrosion resistance of the filler metal; the addition of Sn element can improve the strength of the filler metal and adjust the melting point of the filler metal; the addition of Bi element can reduce the surface tension of the filler metal melt and improve its oxidation resistance; the addition of Al element can improve the strength of the filler metal, improve its oxidation resistance, and adjust the melting point of the filler metal.

[0015] The following is a preferred technical solution of the present application, but is not a limitation of the technical solution provided by the present application. Through the following technical solution, the technical purpose and beneficial effects of the present application can be better achieved and realized.

[0016] As a preferred technical solution of the present application, the aluminum scandium alloy target material is subjected to surface polishing treatment before plating nickel in step (1); and the back plate is subjected to surface polishing treatment before heating in step (2). The purpose is to ensure that the surface of the aluminum scandium alloy target material and the back plate is clean and smooth, and to avoid affecting the brazing quality due to surface stains or unevenness.

[0017] Preferably, the surface roughness Ra of the scandium alloy target and the back plate after the polishing treatment is 0.3-1.0 μm.

[0018] As a preferred technical solution of the present application, the plating method in step (1) is brush plating of nickel, which has the advantages of easy operation, adaptability to different shapes of plated parts, possibility of electroplating at specific positions, high deposition rate, simple equipment, etc. compared with other electroplating technologies.

[0019] Preferably, the electroplating solution in step (1) is a nickel sulfamate-based solution, which has the advantages of low internal stress, high plating rate and high current efficiency.

[0020] Preferably, the electroplating solution in step (1) contains nickel sulfamate: 340-360 g / L, nickel chloride: 8-10 g / L, and boric acid: 40-50 g / L.

[0021] Preferably, the pH value of the electroplating solution is 3.8-4.4, the temperature during electroplating is 15-30 ℃, the voltage is 10-13 V, and the moving speed of the plating pen is 1-5 cm / s.

[0022] As a preferred technical solution of the present application, the thickness of the pure nickel film in step (1) is 4-10 μm.

[0023] The thickness of the pure nickel film should be kept within a certain range, because if the film thickness is too thin, the filler metal can easily penetrate the pore defects in the pure nickel layer, resulting in perforation or even rupture of the film and reducing the welding bonding rate. If the film thickness is too thick, the internal stress of the film will increase, the adhesion of the film to the target substrate will decrease, and the film may fall off or crack during welding, resulting in joint quality problems, and the cost of nickel plating will also increase.

[0024] As a preferred technical solution of the present application, the aluminum scandium alloy target and the back plate in step (2) are placed on a welding platform for heating, and the welding surfaces of both are upward, and the material of the back plate can be pure copper, copper alloy or aluminum alloy.

[0025] Preferably, the aluminum scandium alloy target and the back plate in step (2) are heated to a brazing temperature of 200-250 ℃.

[0026] Preferably, the aluminum scandium alloy target and the back plate in step (2) are placed with filler metal after reaching the brazing temperature.

[0027] In the present application, the brazing temperature is appropriately higher than the melting point of the filler metal. A high brazing temperature helps to improve the flowability and wettability of the filler metal; however, an excessively high brazing temperature can cause oxidation of the filler metal, reduce the flowability and wettability of the filler metal, and also possibly cause changes in the properties of the target, thereby reducing the overall quality of the target assembly.

[0028] Preferably, the brazing filler metal used in step (2) is mainly composed of In, and Sn, Ga, Bi, Al and other elements are added.

[0029] Preferably, the content of Ga in the brazing filler metal is 8.0-9.5 wt%, the content of Sn is 5.0-7.0 wt%, the content of Bi is 1.5-3.0 wt%, the content of Al is 0.5-1.0 wt%, and the balance is In.

[0030] As a preferred technical solution of the present application, after the brazing filler metal is melted in step (3), the brazing filler metal on the welding surface is first scraped and coated uniformly, and then ultrasonic immersion is performed.

[0031] Preferably, the power of the ultrasonic wave used in the ultrasonic immersion of step (3) is 500-800 W.

[0032] Preferably, the frequency of the ultrasonic wave used in the ultrasonic immersion of step (3) is 20-30 kHz.

[0033] Preferably, the moving speed of the ultrasonic vibration head used in the ultrasonic immersion of step (3) is 0.5-1 cm / s.

[0034] Preferably, the ultrasonic immersion time of step (3) should be controlled within 8-20 min.

[0035] Preferably, after the ultrasonic immersion of step (3), the excess brazing filler metal on the side of the welding surface should be removed.

[0036] As a preferred technical solution of the present application, the way of applying pressure in step (3) is to place a counterweight on the surface of the target assembly that has been buckled.

[0037] Preferably, the pressure generated by the counterweight in step (3) is 1300-4500 Pa.

[0038] Preferably, step (3) is characterized in that the counterweight is maintained during the cooling process until the temperature cools to room temperature.

[0039] The role of the counterweight in the present application is to generate good contact between the target and the back plate by applying pressure, which helps to improve the bonding strength of the target and the substrate. The weight of the counterweight is related to the surface area of the welding surface of the target and the back plate. If the pressure generated by the counterweight is too small, the bonding between the target and the back plate will be weak, and the welding bonding strength will be insufficient. If the pressure generated by the counterweight is too large, the brazing filler metal between the target and the back plate will be too thin, resulting in weak bonding and insufficient welding bonding strength.

[0040] As a preferred technical scheme of the present application, the cooling rate in step (3) has certain requirements.

[0041] Preferably, the cooling rate in step (3) is 5-15 ℃ / min.

[0042] The present application has the following advantages:

[0043] (1) By introducing a nickel plating layer, the wettability between the brazing filler metal and the target material is improved, thereby improving the welding bonding rate, and also reducing the internal stress caused by the difference in thermal expansion coefficient of the target assembly. Meanwhile, the nickel plating process of the present application can ensure the effective adhesion of the nickel plating layer on the surface of the aluminum-scandium alloy target material. In combination with the ultrasonic wetting effect, the welding bonding rate of the target assembly is further improved, the weldability of the high-scandium content aluminum-scandium alloy is increased, and finally the welding bonding rate of the target assembly is ≥95%.

[0044] (2) By designing the brazing filler metal, on the one hand, the wettability, flowability and oxidation resistance of the brazing filler metal are improved, and on the other hand, the melting point and mechanical properties of the brazing filler metal are adjusted, thereby ensuring that the welding bonding strength of the target assembly is ≥12 MPa, and the target detachment phenomenon at high working temperature can be avoided, which is suitable for sputtering of large-power and large-size target materials.

[0045] (3) The brazing method of the present application has the advantages of simple operation, good welding quality, high efficiency, good process stability and low production cost. BRIEF DESCRIPTION OF DRAWINGS

[0046] Figure 1 FIG. 1 is a schematic diagram of the binding structure of the high-scandium content aluminum-scandium alloy target material of the present application. DETAILED DESCRIPTION

[0047] In order to better explain the present application and facilitate understanding, the present application will be described in detail below through specific implementation examples and comparative examples.

[0048] Example 1

[0049] First, the aluminum-scandium alloy target material (scandium content: 20 at%) and the pure copper back plate were polished by using sandpaper and polishing agent of different mesh numbers, so that the roughness of the welding surface thereof reached 0.3 μm. Then, the polished aluminum-scandium alloy target material was electro-brush plated with a layer of pure nickel film on the surface thereof. The specific electro-brush plating formula and parameters are as follows:

[0050] The electro-brush plating formula contains nickel sulfamate: 350 g / L, nickel chloride: 9 g / L, and boric acid: 50 g / L.

[0051] The electro-brush plating parameters are as follows: pH value is 4.4, temperature is 15 ℃, voltage is 12 V, and plating pen moving speed is 3 cm / s.

[0052] The thickness of the plating layer is 4 μm.

[0053] After the nickel plating is completed, the brazing process is started. The aluminum scandium alloy target and the back plate are placed on a constant temperature heating platform with the welding surface facing upwards. When the aluminum scandium alloy target and the back plate are heated to 200 °C, the indium-based filler metal is placed on the welding surface of the aluminum scandium alloy target and the back plate. After the filler metal is melted, the filler metal on the welding surface is scraped and coated evenly. Then, the molten filler metal is treated by ultrasonic immersion. The specific composition of the indium-based filler metal and the ultrasonic process parameters are as follows:

[0054] The composition of the filler metal is as follows: the content of Ga is 9.5 wt%, the content of Sn is 7.0 wt%, the content of Bi is 2.0 wt%, the content of Al is 0.5 wt%, and the remainder is In.

[0055] The ultrasonic process is as follows: the ultrasonic power is 500 W, the frequency is 30 kHz, the immersion time is 20 min, and the moving speed of the vibration head is 0.5 cm / s.

[0056] After the ultrasonic immersion treatment is completed, the excess filler metal on the side of the welding surface is removed. Then, the aluminum scandium alloy target and the back plate are buckled together to form a target assembly. Then, a counterweight block capable of generating a pressure of 3000 Pa is placed on the surface of the target assembly. The temperature is reduced at a rate of 10 °C / min until the target assembly cools to room temperature. Finally, the counterweight block is removed, and the final target assembly is obtained.

[0057] After detection, the welding bonding rate of the obtained aluminum scandium alloy target assembly is 96.6%, and the welding bonding strength is 13.8 MPa.

[0058] Example 2

[0059] First, the aluminum scandium alloy target (the content of scandium is 35 at%) and the 6061 aluminum alloy back plate are polished and polished using sandpaper and polishing agent of different mesh sizes, so that the roughness of their welding surfaces reaches 0.8 μm. Then, a layer of pure nickel film is plated on the surface of the polished aluminum scandium alloy target by electro-brush plating. The specific electro-brush plating formula and parameters are as follows:

[0060] The electro-brush plating formula contains nickel sulfamate: 340 g / L, nickel chloride: 8 g / L, and boric acid: 50 g / L.

[0061] The electro-brush plating parameters are as follows: the pH value is 3.8, the temperature is 20 °C, the voltage is 10 V, and the moving speed of the plating pen is 1 cm / s.

[0062] The thickness of the plating layer is 10 μm.

[0063] After the nickel plating is completed, the brazing process is started. The aluminum scandium alloy target and the back plate are placed on a constant temperature heating platform with the welding surface facing upwards. When the aluminum scandium alloy target and the back plate are heated to 250 °C, the indium-based filler metal is placed on the welding surface of the aluminum scandium alloy target and the back plate. After the filler metal is melted, the filler metal on the welding surface is scraped and coated evenly. Then, the molten filler metal is treated by ultrasonic immersion. The specific composition of the indium-based filler metal and the ultrasonic process parameters are as follows:

[0064] The composition of the filler metal is as follows: the content of Ga is 8.0 wt%, the content of Sn is 5.0 wt%, the content of Bi is 1.5 wt%, the content of Al is 1.0 wt%, and the remainder is In.

[0065] The ultrasonic process is as follows: the ultrasonic power is 800 W, the frequency is 20 kHz, the immersion time is 8 min, and the moving speed of the vibration head is 1.0 cm / s.

[0066] After the ultrasonic immersion treatment is completed, the excess filler metal on the welding surface is removed. Then, the aluminum scandium alloy target and the back plate are buckled together to form a target assembly. Then, a counterweight block capable of generating a pressure of 1300 Pa is placed on the surface of the target assembly. The temperature is reduced at a rate of 5 °C / min until the target assembly cools to room temperature. Finally, the counterweight block is removed, and the final target assembly is obtained.

[0067] After detection, the welding bonding rate of the obtained aluminum scandium alloy target assembly is 97.4%, and the welding bonding strength is 15.4 MPa.

[0068] Example 3

[0069] First, the aluminum scandium alloy target (the content of scandium is 50 at%) and the copper chromium zirconium alloy back plate are polished and polished using sandpaper and polishing agent of different mesh sizes, so that the roughness of their welding surfaces reaches 0.8 μm. Then, the polished aluminum scandium alloy target is coated with a thin film of pure nickel on its surface by electro-brush plating. The specific electro-brush plating formula and parameters are as follows:

[0070] The electro-brush plating formula contains nickel sulfamate: 360 g / L, nickel chloride: 10 g / L, and boric acid: 45 g / L.

[0071] The electro-brush plating parameters are as follows: the pH value is 4.0, the temperature is 30 °C, the voltage is 13 V, and the moving speed of the plating pen is 5 cm / s.

[0072] The thickness of the plating layer is 9 μm.

[0073] After the nickel plating is completed, brazing is performed. The aluminum scandium alloy target and the back plate are placed on a constant temperature heating platform with the welding surface facing upwards. When the aluminum scandium alloy target and the back plate are heated to 220°C, indium-based filler metal is placed on the welding surface of the aluminum scandium alloy target and the back plate. After the filler metal is melted, the filler metal on the welding surface is scraped and evenly coated. Ultrasonic immersion treatment is performed on the molten filler metal using an ultrasonic device. The specific composition of the indium-based filler metal and the ultrasonic process parameters are as follows:

[0074] The composition of the filler metal is as follows: the content of Ga is 9.0 wt%, the content of Sn is 6.0 wt%, the content of Bi is 3.0 wt%, the content of Al is 0.7 wt%, and the remainder is In.

[0075] The ultrasonic process parameters are as follows: ultrasonic power 600 W, frequency 25 kHz, immersion time 15 min, and vibration head moving speed 0.8 cm / s.

[0076] After the ultrasonic immersion treatment is completed, the excess filler metal on the welding surface is removed. Then, the aluminum scandium alloy target and the back plate are buckled together to form a target assembly. A counterweight block capable of generating a pressure of 4500 Pa is placed on the surface of the target assembly. The temperature is lowered at a rate of 15°C / min until the target assembly cools to room temperature. Finally, the counterweight block is removed, and the final target assembly is obtained.

[0077] After detection, the welding bonding rate of the obtained aluminum scandium alloy target assembly is 95.8%, and the welding bonding strength is 12.8 MPa.

[0078] Example 4

[0079] First, the aluminum scandium alloy target (scandium content 30 at%) and the pure copper back plate are polished and polished using sandpaper of different mesh sizes and polishing agents, so that the roughness of their welding surfaces reaches 0.5 μm. Then, the polished aluminum scandium alloy target is coated with a thin layer of pure nickel film using electro-brush plating. The specific electro-brush plating formula and parameters are as follows:

[0080] The electro-brush plating formula contains the following components: 350 g / L of nickel sulfamate, 9 g / L of nickel chloride, and 40 g / L of boric acid.

[0081] The electro-brush plating parameters are as follows: pH value 4.1, temperature 25°C, voltage 12 V, and plating pen moving speed 2 cm / s.

[0082] The plating thickness is 5 μm.

[0083] After the nickel plating is completed, brazing is performed. The aluminum scandium alloy target and the back plate are placed on a constant temperature heating platform with the welding surface facing upwards. When the aluminum scandium alloy target and the back plate are heated to 210°C, indium-based filler metal is placed on the welding surface of the aluminum scandium alloy target and the back plate. After the filler metal is melted, the filler metal on the welding surface is scraped and evenly coated. Ultrasonic immersion treatment is performed on the molten filler metal using an ultrasonic device. The specific composition of the indium-based filler metal and the ultrasonic process parameters are as follows:

[0084] The composition of the filler metal is as follows: the content of Ga is 8.5 wt%, the content of Sn is 5.0 wt%, the content of Bi is 2.0 wt%, the content of Al is 0.5 wt%, and the remainder is In.

[0085] The ultrasonic process parameters are as follows: ultrasonic power 500 W, frequency 30 kHz, immersion time 12 min, and vibration head moving speed 0.6 cm / s.

[0086] After the ultrasonic immersion treatment is completed, the excess filler metal on the welding surface is removed. Then, the aluminum scandium alloy target and the back plate are buckled together to form a target assembly. A counterweight block capable of generating a pressure of 2000 Pa is placed on the surface of the target assembly. The temperature is lowered at a rate of 10°C / min until the target assembly cools to room temperature. Finally, the counterweight block is removed, and the final target assembly is obtained.

[0087] It is detected that the welding bonding rate of the obtained aluminum scandium alloy target assembly is 96.1%, and the welding bonding strength is 13.6 MPa.

[0088] Example 5

[0089] First, the aluminum scandium alloy target (scandium content 50 at%) and the 6061 aluminum alloy back plate are polished and polished using sandpaper and polishing agent of different mesh sizes, so that the roughness of their welding surfaces reaches 0.8 μm. Then, a thin film of pure nickel is plated on the surface of the polished aluminum scandium alloy target using electro-brush plating. The specific electro-brush plating formula and parameters are as follows:

[0090] The electro-brush plating formula contains the following components: nickel sulfamate 360 g / L, nickel chloride 10 g / L, and boric acid 45 g / L.

[0091] The electro-brush plating parameters are as follows: pH value 3.9, temperature 20°C, voltage 12 V, and plating pen moving speed 2 cm / s.

[0092] The plating thickness is 8 μm.

[0093] After the nickel plating is completed, the brazing process is started. The aluminum scandium alloy target and the back plate are placed on a constant temperature heating platform with the welding surface facing upwards. When the aluminum scandium alloy target and the back plate are heated to 230°C, the indium-based filler metal is placed on the welding surface of the aluminum scandium alloy target and the back plate. After the filler metal is melted, the filler metal on the welding surface is scraped and coated evenly. Then, the molten filler metal is treated by ultrasonic immersion. The specific composition of the indium-based filler metal and the ultrasonic process parameters are as follows:

[0094] The composition of the filler metal is as follows: the content of Ga is 8.0 wt%, the content of Sn is 6.0 wt%, the content of Bi is 1.8 wt%, the content of Al is 0.8 wt%, and the remainder is In.

[0095] The ultrasonic process is as follows: the ultrasonic power is 600 W, the frequency is 30 kHz, the immersion time is 10 min, and the moving speed of the vibration head is 0.5 cm / s.

[0096] After the ultrasonic immersion treatment is completed, the excess filler metal on the welding surface is removed. Then, the aluminum scandium alloy target and the back plate are buckled together to form a target assembly. Then, a counterweight block capable of generating a pressure of 4000 Pa is placed on the surface of the target assembly. The temperature is lowered at a rate of 8°C / min until the target assembly cools to room temperature. Finally, the counterweight block is removed, and the final target assembly is obtained.

[0097] After detection, the welding bonding rate of the obtained aluminum scandium alloy target assembly is 97.6%, and the welding bonding strength is 13.1 MPa.

[0098] Example 6

[0099] First, the aluminum scandium alloy target (the content of scandium is 40 at%) and the copper chromium zirconium alloy back plate are polished and polished using sandpaper and polishing agent of different mesh sizes, so that the roughness of their welding surfaces reaches 0.8 μm. Then, the polished aluminum scandium alloy target is coated with a layer of pure nickel film on its surface by electro-brush plating. The specific electro-brush plating formula and parameters are as follows:

[0100] The electro-brush plating formula contains nickel sulfamate: 350 g / L, nickel chloride: 10 g / L, and boric acid: 50 g / L.

[0101] The electro-brush plating parameters are as follows: the pH value is 4.2, the temperature is 25°C, the voltage is 12 V, and the moving speed of the plating pen is 4 cm / s.

[0102] The thickness of the plating layer is 7 μm.

[0103] After the nickel plating is completed, the brazing process is started. The aluminum scandium alloy target and the back plate are placed on a constant temperature heating platform with the welding surface facing upwards. When the aluminum scandium alloy target and the back plate are heated to 240 °C, the indium-based filler metal is placed on the welding surface of the aluminum scandium alloy target and the back plate. After the filler metal is melted, the filler metal on the welding surface is scraped and coated evenly. Then, the molten filler metal is treated by ultrasonic immersion. The specific composition of the indium-based filler metal and the ultrasonic process parameters are as follows:

[0104] The composition of the filler metal is as follows: the content of Ga is 8.3 wt%, the content of Sn is 5.5 wt%, the content of Bi is 2.5 wt%, the content of Al is 0.6 wt%, and the remainder is In.

[0105] The ultrasonic process is as follows: the ultrasonic power is 700 W, the frequency is 30 kHz, the immersion time is 20 min, and the moving speed of the vibration head is 0.5 cm / s.

[0106] After the ultrasonic immersion treatment is completed, the excess filler metal on the side of the welding surface needs to be removed. Then, the aluminum scandium alloy target and the back plate are buckled together to form a target assembly. Next, a counterweight block capable of generating a pressure of 3500 Pa is placed on the surface of the target assembly, and the temperature is lowered at a rate of 5 °C / min until the target assembly cools to room temperature. Finally, the counterweight block is removed, and the final target assembly is obtained.

[0107] After detection, the welding bonding rate of the obtained aluminum scandium alloy target assembly is 98.1%, and the welding bonding strength is 15.1 MPa.

[0108] Example 7

[0109] First, the aluminum scandium alloy target (the content of scandium is 30 at%) and the pure copper back plate are polished and polished using sandpaper and polishing agent of different mesh numbers, so that the roughness of their welding surfaces reaches 0.8 μm. Then, a thin film of pure nickel is plated on the surface of the polished aluminum scandium alloy target by electro-brush plating. The specific electro-brush plating formula and parameters are as follows:

[0110] The electro-brush plating formula contains the following components: 340 g / L of nickel sulfamate, 8 g / L of nickel chloride, and 45 g / L of boric acid.

[0111] The electro-brush plating parameters are as follows: the pH value is 4.0, the temperature is 25 °C, the voltage is 10 V, and the moving speed of the plating pen is 2 cm / s.

[0112] The thickness of the plating layer is 6 μm.

[0113] After the nickel plating is completed, brazing processing is started. The aluminum scandium alloy target and the back plate are placed on a constant temperature heating platform with the welding surface facing upwards for heating. When the aluminum scandium alloy target and the back plate are heated to 210°C, the indium-based filler metal is placed on the welding surface of the aluminum scandium alloy target and the back plate. After the filler metal is melted, the filler metal on the welding surface is first scraped and evenly coated, and then the ultrasonic wave equipment is used to perform ultrasonic wave infiltration treatment on the molten filler metal. The specific indium-based filler metal composition and ultrasonic process parameters are as follows:

[0114] The filler metal composition is that the content of Ga is 9.2 wt%, the content of Sn is 5.5 wt%, the content of Bi is 1.5 wt%, the content of Al is 0.9 wt%, and the remainder is In.

[0115] The ultrasonic process is that the ultrasonic power is 500 W, the frequency is 25 kHz, the infiltration time is 18 min, and the vibration head moving speed is 0.7 cm / s.

[0116] After the ultrasonic wave infiltration treatment is completed, the excess filler metal on the side of the welding surface needs to be removed, and then the aluminum scandium alloy target and the back plate are buckled together to form a target assembly. Then a counterweight block capable of generating a pressure of 2500 Pa is placed on the surface of the target assembly, and the temperature is lowered at a speed of 10°C / min until the target assembly cools to room temperature. Finally, the counterweight block is removed, and the final target assembly is obtained.

[0117] It is detected that the welding bonding rate of the obtained aluminum scandium alloy target assembly is 99.2%, and the welding bonding strength is 15.9 MPa.

[0118] Comparative Example 1

[0119] First, the aluminum scandium alloy target (the content of scandium is 20 at%) and the pure copper back plate are polished and polished by using sandpaper and polishing agent with different mesh numbers, so that the roughness of the welding surface reaches 0.3 μm. After polishing, the aluminum scandium alloy target is not plated with nickel, and direct brazing processing is performed. The welding surface of the aluminum scandium alloy target and the back plate is placed on a constant temperature heating platform with the welding surface facing upwards for heating. When the aluminum scandium alloy target and the back plate are heated to 200°C, the indium-based filler metal is placed on the welding surface of the aluminum scandium alloy target and the back plate. After the filler metal is melted, the filler metal on the welding surface is first scraped and evenly coated, and then the ultrasonic wave equipment is used to perform ultrasonic wave infiltration treatment on the molten filler metal. The specific indium-based filler metal composition and ultrasonic process parameters are as follows:

[0120] The filler metal composition is that the content of Ga is 9.5 wt%, the content of Sn is 7.0 wt%, the content of Bi is 2.0 wt%, the content of Al is 0.5 wt%, and the remainder is In.

[0121] The ultrasonic process is as follows: ultrasonic power 500 W, frequency 30 kHz, immersion time 20 min, and vibration head moving speed 0.5 cm / s.

[0122] After the ultrasonic immersion treatment, the excess brazing filler metal on the welding surface is removed, and then the aluminum-scandium alloy target and the backing plate are buckled together to form a target assembly. Then a counterweight capable of generating a pressure of 3000 Pa is placed on the surface of the target assembly, and the target assembly is cooled at a rate of 10 ℃ / min until it cools to room temperature. Finally, the counterweight is removed, and the final target assembly is obtained.

[0123] It is detected that the welding joint rate of the obtained aluminum-scandium alloy target assembly is 85.8%, and the welding joint strength is 7.9 MPa.

[0124] As can be seen from Example 1 and Comparative Example 1, when the nickel plating treatment of the welding surface of the aluminum-scandium alloy target is omitted in the preparation method, the welding joint rate and the welding joint strength of the aluminum-scandium alloy target assembly prepared thereby are significantly reduced.

[0125] Comparative Example 2

[0126] First, the aluminum-scandium alloy target (the scandium content is 35 at%) and the 6061 aluminum alloy backing plate are polished using sandpaper and polishing agents of different mesh sizes, so that the roughness of their welding surfaces reaches 0.8 μm. Then, a pure nickel film is plated on the surface of the polished aluminum-scandium alloy target by electro-brush plating. The specific electro-brush plating formula and parameters are as follows:

[0127] The electro-brush plating formula contains nickel sulfamate: 340 g / L, nickel chloride: 8 g / L, and boric acid: 50 g / L.

[0128] The electro-brush plating parameters are as follows: pH value is 3.8, temperature is 20 ℃, voltage is 10 V, and plating pen moving speed is 1 cm / s.

[0129] The plating thickness is 10 μm.

[0130] After the nickel plating is completed, brazing processing is started. The welding surfaces of the aluminum-scandium alloy target and the backing plate are placed on a constant temperature heating platform for heating. When the aluminum-scandium alloy target and the backing plate are heated to 250 ℃, the indium-based brazing filler metal is placed on the welding surfaces of the aluminum-scandium alloy target and the backing plate. After the brazing filler metal is melted, the brazing filler metal on the welding surfaces is evenly scraped and coated. Without ultrasonic immersion, the aluminum-scandium alloy target and the backing plate are buckled together to form a target assembly.

[0131] The specific composition of the indium-based brazing filler metal is as follows:

[0132] The solder composition comprises 8.0 wt% of Ga, 5.0 wt% of Sn, 1.5 wt% of Bi, 1.0 wt% of Al, and the balance of In.

[0133] Then, a weight block capable of generating a pressure of 1300 Pa is placed on the surface of the target assembly, and the temperature is lowered at a rate of 5 °C / min until the target assembly is cooled to room temperature. Finally, the weight block is removed, and the final target assembly is obtained.

[0134] It is detected that the welding bonding rate of the obtained aluminum scandium alloy target assembly is 87.2%, and the welding bonding strength is 8.2 MPa.

[0135] As can be seen from Example 2 and Comparative Example 2, when the ultrasonic infiltration treatment of the molten solder on the welding surface of the aluminum scandium alloy target and the back plate is absent in the preparation method, the welding bonding rate and the welding bonding strength of the obtained aluminum scandium alloy target assembly are significantly reduced.

[0136] Comparative Example 3

[0137] First, the aluminum scandium alloy target (the scandium content is 50 at%) and the copper chromium zirconium alloy back plate are polished and polished by using sandpaper and polishing agent with different mesh numbers, so that the roughness of the welding surface thereof reaches 0.8 μm. Then, a pure nickel film is plated on the surface of the polished aluminum scandium alloy target by electro-brush plating. The specific electro-brush plating formula and parameters are as follows:

[0138] The electro-brush plating formula comprises 360 g / L of nickel sulfamate, 10 g / L of nickel chloride, and 45 g / L of boric acid.

[0139] The electro-brush plating parameters are as follows: the pH value is 4.0, the temperature is 30 °C, the voltage is 13 V, and the moving speed of the plating pen is 5 cm / s.

[0140] The thickness of the plated layer is 9 μm.

[0141] After the nickel plating is completed, the soldering process is started. The welding surface of the aluminum scandium alloy target and the back plate is placed on a constant temperature heating platform for heating. When the aluminum scandium alloy target and the back plate are heated to 350 °C, the indium-based solder is placed on the welding surface of the aluminum scandium alloy target and the back plate, respectively. After the solder is melted, the solder on the welding surface is first coated uniformly, and then the ultrasonic wave equipment is used to perform ultrasonic wave infiltration treatment on the molten solder. The specific composition of the indium-based solder and the ultrasonic process parameters are as follows:

[0142] The solder composition comprises 9.0 wt% of Ga, 6.0 wt% of Sn, 3.0 wt% of Bi, 0.7 wt% of Al, and the balance of In.

[0143] The ultrasonic process parameters are: ultrasonic power 600 W, frequency 25 kHz, immersion time 15 min, and vibration head moving speed 0.8 cm / s.

[0144] After the ultrasonic immersion treatment, the excess brazing filler metal on the welding surface is removed, and then the aluminum scandium alloy target and the backing plate are buckled together to form a target assembly. Then a counterweight capable of generating a pressure of 4500 Pa is placed on the surface of the target assembly, and the temperature is lowered at a rate of 15 ℃ / min until the target assembly cools to room temperature. Finally, the counterweight is removed, and the final target assembly is obtained.

[0145] It is detected that the welding bonding rate of the obtained aluminum scandium alloy target assembly is 89.1%, and the welding bonding strength is 8.4 MPa.

[0146] As can be seen from Example 3 and Comparative Example 3, when the brazing temperature exceeds the limited range, the welding bonding rate and the welding bonding strength of the aluminum scandium alloy target assembly prepared thereby are both significantly decreased.

[0147] Comparative Example 4

[0148] First, the aluminum scandium alloy target (the scandium content is 30 at%) and the pure copper backing plate are polished and polished using sandpaper and polishing agent of different mesh numbers, so that the roughness of their welding surfaces reaches 0.5 μm. Then a thin film of pure nickel is plated on the surface of the polished aluminum scandium alloy target by electro-brush plating. The specific electro-brush plating formula and parameters are as follows:

[0149] The electro-brush plating formula contains nickel sulfamate: 350 g / L, nickel chloride: 9 g / L, and boric acid: 40 g / L.

[0150] The electro-brush plating parameters are: pH value is 4.1, temperature is 25 ℃, voltage is 12 V, and plating pen moving speed is 2 cm / s.

[0151] The plating thickness is 5 μm.

[0152] After the nickel plating is completed, the brazing process is started. The welding surfaces of the aluminum scandium alloy target and the backing plate are placed on the constant temperature heating platform for heating. When the aluminum scandium alloy target and the backing plate are heated to 210 ℃, the pure indium brazing filler metal is placed on the welding surfaces of the aluminum scandium alloy target and the backing plate. After the brazing filler metal is melted, the brazing filler metal on the welding surface is first scraped and coated uniformly, and then the ultrasonic immersion treatment is performed on the molten brazing filler metal by using an ultrasonic device. The specific ultrasonic process parameters are as follows:

[0153] The ultrasonic process parameters are: ultrasonic power 500 W, frequency 30 kHz, immersion time 12 min, and vibration head moving speed 0.6 cm / s.

[0154] After the ultrasonic infiltration treatment, the excess brazing filler metal on the welding surface of the aluminum scandium alloy target and the backing plate is removed, and then the aluminum scandium alloy target and the backing plate are buckled together to form a target assembly. Then a counterweight capable of generating a pressure of 2000 Pa is placed on the surface of the target assembly, and the temperature is lowered at a rate of 10 ℃ / min until the target assembly cools to room temperature. Finally, the counterweight is removed, and the final target assembly is obtained.

[0155] It is detected that the welding bonding rate of the obtained aluminum scandium alloy target assembly is 90.1%, and the welding bonding strength is 9.1 MPa.

[0156] As can be seen from Example 4 and Comparative Example 4, when pure indium brazing filler metal is used, the welding bonding rate and the welding bonding strength of the obtained aluminum scandium alloy target assembly are both significantly reduced.

[0157] Comparative Example 5

[0158] First, the aluminum scandium alloy target (the scandium content is 50 at%) and the 6061 aluminum alloy backing plate are polished and polished using sandpaper and polishing agents of different mesh numbers, so that the roughness of the welding surface thereof reaches 0.8 μm. Then, a thin film of pure nickel is plated on the surface of the polished aluminum scandium alloy target by electro-brush plating. The specific electro-brush plating formula and parameters are as follows:

[0159] The electro-brush plating formula contains nickel sulfamate: 360 g / L, nickel chloride: 10 g / L, and boric acid: 45 g / L.

[0160] The electro-brush plating parameters are as follows: pH value is 3.9, temperature is 20 ℃, voltage is 12 V, and plating pen moving speed is 2 cm / s.

[0161] The plating thickness is 16 μm.

[0162] After the nickel plating is completed, brazing processing is started. The welding surface of the aluminum scandium alloy target and the backing plate is placed on a constant temperature heating platform for heating. When the aluminum scandium alloy target and the backing plate are heated to 230 ℃, the indium-based brazing filler metal is placed on the welding surface of the aluminum scandium alloy target and the backing plate. After the brazing filler metal is melted, the brazing filler metal on the welding surface is first scraped and coated uniformly, and then the ultrasonic equipment is used to perform ultrasonic infiltration treatment on the molten brazing filler metal. The specific composition of the indium-based brazing filler metal and the ultrasonic process parameters are as follows:

[0163] The composition of the brazing filler metal is as follows: the content of Ga is 8.0 wt%, the content of Sn is 6.0 wt%, the content of Bi is 1.8 wt%, the content of Al is 0.8 wt%, and the balance is In.

[0164] The ultrasonic process parameters are as follows: ultrasonic power is 600 W, frequency is 30 kHz, infiltration time is 10 min, and vibration head moving speed is 0.5 cm / s.

[0165] After the ultrasonic infiltration treatment, the excess brazing filler metal on the welding surface of the aluminum scandium alloy target and the backing plate is removed, and then the aluminum scandium alloy target and the backing plate are buckled together to form a target assembly. Then a counterweight capable of generating a pressure of 4000 Pa is placed on the surface of the target assembly, and the temperature is lowered at a rate of 8 ℃ / min until the target assembly cools to room temperature. Finally, the counterweight is removed, and the final target assembly is obtained.

[0166] It is detected that the welding bonding rate of the obtained aluminum scandium alloy target assembly is 86.6%, and the welding bonding strength is 8.5 MPa.

[0167] As can be seen from Example 5 and Comparative Example 5, when the plating thickness exceeds the limited range, the welding bonding rate and the welding bonding strength of the aluminum scandium alloy target assembly prepared thereby are significantly reduced.

[0168] Comparative Example 6

[0169] First, the aluminum scandium alloy target (the scandium content is 40 at%) and the copper-chromium-zirconium alloy backing plate are polished and polished using sandpaper and polishing agents of different mesh numbers, so that the roughness of the welding surface thereof reaches 0.8 μm. Then, a thin film of pure nickel is plated on the surface of the polished aluminum scandium alloy target by electro-brush plating. The specific electro-brush plating formula and parameters are as follows:

[0170] The electro-brush plating formula contains nickel sulfamate: 400 g / L, nickel chloride: 25 g / L, and boric acid: 25 g / L.

[0171] The electro-brush plating parameters are as follows: pH value is 5.0, temperature is 25 ℃, voltage is 20 V, and plating pen moving speed is 2 cm / s.

[0172] The plating thickness is 7 μm.

[0173] After the nickel plating is completed, brazing processing is started. The welding surface of the aluminum scandium alloy target and the backing plate is placed on a constant temperature heating platform for heating. When the aluminum scandium alloy target and the backing plate are heated to 240 ℃, the indium-based brazing filler metal is placed on the welding surface of the aluminum scandium alloy target and the backing plate, respectively. After the brazing filler metal is melted, the brazing filler metal on the welding surface is first scraped and coated uniformly, and then the ultrasonic equipment is used to perform ultrasonic infiltration treatment on the molten brazing filler metal. The specific composition of the indium-based brazing filler metal and the ultrasonic process parameters are as follows:

[0174] The composition of the brazing filler metal is as follows: the content of Ga is 8.3 wt%, the content of Sn is 5.5 wt%, the content of Bi is 2.5 wt%, the content of Al is 0.6 wt%, and the balance is In.

[0175] The ultrasonic process parameters are as follows: ultrasonic power is 700 W, frequency is 30 kHz, infiltration time is 20 min, and vibration head moving speed is 0.5 cm / s.

[0176] After the ultrasonic infiltration treatment, the excess brazing filler metal on the welding surface of the aluminum scandium alloy target and the backing plate is removed, and then the aluminum scandium alloy target and the backing plate are buckled together to form a target assembly. Then a counterweight capable of generating a pressure of 3500 Pa is placed on the surface of the target assembly, and the temperature is lowered at a rate of 5 ℃ / min until the target assembly cools to room temperature. Finally, the counterweight is removed, and the final target assembly is obtained.

[0177] It is detected that the welding bonding rate of the obtained aluminum scandium alloy target assembly is 91.1%, and the welding bonding strength is 9.3 MPa.

[0178] As can be seen from Example 6 and Comparative Example 6, when the electroplating solution formula and voltage are out of the limited range, the welding bonding rate and the welding bonding strength of the aluminum scandium alloy target assembly prepared thereby are both significantly decreased.

[0179] Comparative Example 7

[0180] First, the aluminum scandium alloy target (the scandium content is 30 at%) and the pure copper backing plate are polished by using sandpaper and polishing agent, so that the roughness of the welding surface of the aluminum scandium alloy target and the pure copper backing plate reaches 0.8 μm. Then, a thin layer of pure nickel film is plated on the surface of the polished aluminum scandium alloy target by electro-brush plating. The electro-brush plating formula and parameters are as follows:

[0181] The electroplating formula contains nickel sulfamate: 340 g / L, nickel chloride: 8 g / L, and boric acid: 45 g / L.

[0182] The electroplating parameters are as follows: the pH value is 4.0, the temperature is 25 ℃, the voltage is 10 V, and the moving speed of the plating pen is 2 cm / s.

[0183] The plating thickness is 6 μm.

[0184] After the nickel plating is completed, brazing processing is started. The welding surface of the aluminum scandium alloy target and the backing plate is placed on a constant temperature heating platform for heating. When the aluminum scandium alloy target and the backing plate are heated to 210 ℃, the indium-based brazing filler metal is placed on the welding surface of the aluminum scandium alloy target and the backing plate. After the brazing filler metal is melted, the brazing filler metal on the welding surface is first scraped and coated uniformly, and then the ultrasonic equipment is used to perform ultrasonic infiltration treatment on the molten brazing filler metal. The composition of the indium-based brazing filler metal and the ultrasonic process parameters are as follows:

[0185] The composition of the brazing filler metal is as follows: the content of Ga is 9.2 wt%, the content of Sn is 5.5 wt%, the content of Bi is 1.5 wt%, the content of Al is 0.9 wt%, and the balance is In.

[0186] The ultrasonic process is as follows: the ultrasonic power is 300 W, the frequency is 25 kHz, the infiltration time is 50 min, and the moving speed of the vibration head is 0.7 cm / s.

[0187] After the ultrasonic infiltration treatment, the excess brazing filler metal on the side of the welding surface is removed, and then the aluminum scandium alloy target material and the back plate are buckled together to form a target assembly. Then a counterweight capable of generating a pressure of 2500 Pa is placed on the surface of the target assembly, and the temperature is lowered at a rate of 10 ℃ / min until the target assembly cools to room temperature. Finally, the counterweight is removed to obtain the final target assembly.

[0188] It is detected that the welding bonding rate of the obtained aluminum scandium alloy target assembly is 92.2%, and the welding bonding strength is 9.7 MPa.

[0189] As can be seen from Example 7 and Comparative Example 7, when the ultrasonic power and the infiltration time exceed the limited range, the welding bonding rate and the welding bonding strength of the aluminum scandium alloy target assembly prepared thereby are both significantly decreased.

[0190] Table 1 is a comparison of the welding performance of the aluminum scandium alloy target of the examples and the comparative examples. As can be seen from Table 1, the welding bonding rate of the aluminum scandium alloy target assembly prepared by the present application is ≥95%, and the welding bonding strength is ≥12 MPa.

[0191] Table 1 is a comparison of the welding performance of the aluminum scandium alloy target of the examples and the comparative examples. As can be seen from Table 1, the welding bonding rate of the aluminum scandium alloy target assembly prepared by the present application is ≥95%, and the welding bonding strength is ≥12 MPa.

[0192]

[0193] The applicant declares that the present application is illustrated by the above examples to explain the detailed method of the present application, but the present application is not limited to the above detailed method, and any technical solution falling within the idea of the present application falls within the protection scope of the present application. It should be noted that for ordinary skilled persons in the technical field, some improvements and refinements without departing from the principle of the present application should also be considered as the protection scope of the present application.

Claims

1. A method of binding a high scandium content aluminum scandium alloy target material, characterized by, The method comprises the following steps: (1) first, a pure nickel film is plated on the welding surface of the aluminum-scandium alloy target material; (2) the plated aluminum-scandium alloy target material and the back plate are heated, and then the filler metal is placed on the welding surface of the aluminum-scandium alloy target material and the back plate; (3) after the filler metal is melted, the welding surface is subjected to ultrasonic immersion, after the immersion is completed, the aluminum-scandium alloy target material and the back plate are buckled together to form a target material assembly, then pressure is continuously applied to the surface of the target material assembly, then heating is stopped and cooling is performed to room temperature, and finally the welded target material assembly is obtained; In step (1), the plating method is electro-brush plating of nickel; the electroplating solution formula contains nickel sulfamate: 340-360 g / L, nickel chloride: 8-10 g / L, and boric acid: 40-50 g / L; the pH value of the electroplating solution is 3.8-4.4, the temperature during electroplating is 15-30 DEG C, the voltage is 10-13 V, and the moving speed of the plating pen is 1-5 cm / s; the thickness of the pure nickel film is 4-10 microns; In step (2), the content of Ga in the filler metal is 8.0-9.5 wt%, the content of Sn is 5.0-7.0 wt%, the content of Bi is 1.5-3.0 wt%, the content of Al is 0.5-1.0 wt%, and the balance is In; In step (3), after the filler metal is melted, the filler metal on the welding surface is first evenly scraped and coated, and then ultrasonic immersion is performed; the power of the ultrasonic wave used for ultrasonic immersion is 500-800 W, the frequency of the ultrasonic wave is 20-30 kHz, the moving speed of the ultrasonic vibration head is 0.5-1 cm / s, the ultrasonic immersion time is controlled to be 8-20 min, and after the ultrasonic immersion, the excess filler metal on the side of the welding surface is removed.

2. The binding method of claim 1, wherein, In step (1), the content of scandium in the aluminum-scandium alloy target material is 20-50 at%.

3. The binding method of claim 1, wherein, In step (1), the aluminum-scandium alloy target material is subjected to surface polishing treatment before being plated with nickel; in step (2), the back plate is subjected to surface polishing treatment before being heated; after the polishing treatment, the surface roughness Ra of the aluminum-scandium alloy target material and the back plate is 0.3-1.0 microns.

4. The binding method of claim 1, wherein, In step (2), the material of the back plate is pure copper, copper alloy or aluminum alloy; the heating temperature is 200-250 DEG C.

5. The binding method of claim 1, wherein, In step (3), the pressure applying mode is that a counterweight block is placed on the surface of the buckled target material assembly, the pressure generated by the counterweight block is 1300-4500 Pa; during the cooling process, the counterweight block is maintained to exist until the temperature is cooled to room temperature.

6. The binding method of claim 1, wherein, In step (3), the cooling speed of the cooling process is 5-15 DEG C / min.

Images