Aluminum-magnesium alloy electroplating equipment and method

Abstract

The present invention relates to the technical field of electroplating equipment, and specifically discloses an aluminum-magnesium alloy electroplating equipment and a method thereof, comprising an electroplating tank and a filter plate, the filter plate comprising a first connecting plate and a second connecting plate which are rotatably connected, a support sleeve is rotatably arranged at the edge of the electroplating tank, the second connecting plate is slidably arranged in the support sleeve, an intermediate rod is arranged in the electroplating tank, a control component is arranged on the intermediate rod, the control component is connected to the first connecting plate, a collecting frame is arranged on the side of the electroplating tank, when the second connecting plate moves into the collecting frame, it is in the same inclined plane as the first connecting plate, a flushing component is arranged on the first connecting plate, the flushing component is used to transport the electroplating solution to the first connecting plate to clean up impurities, a reflux hole connected to the collecting frame is opened on the side of the electroplating tank, the aluminum-magnesium alloy electroplating equipment and the method thereof of the present invention have the effect of improving the electroplating efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of electroplating equipment, and in particular to aluminum-magnesium alloy electroplating equipment and a method thereof. Background Art

[0002] Aluminum-magnesium alloy electroplating refers to the process of plating other metals or alloy thin layers on the surface of aluminum-magnesium alloy using the principle of electrolysis. The process of attaching a metal film to the surface of aluminum-magnesium alloy through electrolysis plays a role in preventing metal oxidation or improving its wear resistance. During electroplating, the plating metal or other insoluble materials serve as the anode, and the aluminum-magnesium alloy to be plated serves as the cathode. The cations of the plating metal are reduced on the surface of the aluminum-magnesium alloy to form a plating layer. During electroplating, some detached metal particle impurities or other impurities will remain in the plating solution. In order to avoid affecting the electroplating, the impurities in the plating solution need to be cleaned in time.

[0003] The patent document with the announcement number CN111519237B discloses a cleaning device based on the electroplating liquid in the electroplating tank, including a bottom plate, a plating tank is arranged in the middle of the upper surface of the bottom plate, cylinders are arranged at the left and right ends of the upper surface of the bottom plate, the piston rod of the cylinder is fixedly connected to the left and right ends of the lower surface of the lifting plate, the middle part of the lifting plate is rotatably connected to the rotating shaft, the lower part of the rotating shaft is provided with a stirring rod, the front and rear sides of the lifting plate are provided with a fixed plate, the middle part of the fixed plate is slidably connected to the sliding rod, and the lower end of the sliding rod is provided with a filter frame. The filter frame is driven up and down by the cylinder to clean the impurities in the electroplating tank.

[0004] However, the solution still has the following problems: when the impurities in the filter frame need to be cleaned centrally, the cylinder drives the filter frame to move upward to the outside of the electroplating tank, and the impurities in the filter frame are manually cleaned centrally. After the filter frame is cleaned, the filter frame is placed in the electroplating tank again. However, the process of cleaning the filter frame is relatively cumbersome, which affects the electroplating efficiency. Summary of the invention

[0005] The present invention provides an aluminum-magnesium alloy electroplating device and a method thereof, aiming to solve the problem in the related art that it is inconvenient to clean impurities in a filter frame, thereby affecting the electroplating efficiency.

[0006] In the first aspect, the present invention provides an aluminum-magnesium alloy electroplating device, comprising an electroplating tank and a filter plate arranged in the electroplating tank, the filter plate comprising a first connecting plate and a second connecting plate which are rotatably connected, a support sleeve is rotatably arranged at the edge of the electroplating tank, the second connecting plate is slidably arranged in the support sleeve, an intermediate rod is arranged in the electroplating tank, a control component is arranged on the intermediate rod, the control component is connected to the first connecting plate and is used to adjust the position of the first connecting plate, a collecting frame is arranged on the side of the electroplating tank, and the side edge of the second connecting plate is in the same inclined plane as the first connecting plate when it moves into the collecting frame, a flushing component is arranged on the first connecting plate, the flushing component is used to transport the electroplating solution to the first connecting plate to clean up impurities, and a reflux hole connected to the collecting frame is opened on the side of the electroplating tank.

[0007] The effect is that the control component drives the first connecting plate and the second connecting plate to rotate to the outside of the electroplating tank, and the second connecting plate slides relative to the support sleeve. After the first connecting plate and the second connecting plate are rotated to the outside of the electroplating tank and are in the same inclined plane, the flushing component cleans the first connecting plate and the second connecting plate, and at the same time concentrates impurities in the collection frame. The flushing component and the control component are used to clean the first connecting plate and the second connecting plate, thereby improving the electroplating efficiency.

[0008] Preferably, the control assembly includes a control member, a control screw and a control block, the control block is slidably arranged on the intermediate rod along the vertical direction, the control block is rotatably connected to the first connecting plate, the control screw is rotatably arranged on the intermediate rod, the control screw and the control block are threadedly matched, the control member is arranged on the intermediate rod, and the output end of the control member is connected to the control screw to drive the control screw to rotate.

[0009] The effect is that the control member drives the control screw to rotate, the rotation of the control screw drives the control block to move, the movement of the control block drives the first connecting plate to move and rotate at the same time, thereby adjusting the positions of the first connecting plate and the second connecting plate.

[0010] Preferably, an intermediate groove is provided in the intermediate rod, and a liquid inlet and a liquid outlet connected to the intermediate groove are provided on the side of the intermediate rod in the vertical direction, the liquid inlet is located in the electroplating liquid, and the liquid outlet is located outside the electroplating liquid, the flushing assembly includes a flushing part and a flushing pipe, the flushing pipe is connected to the control assembly and is located on the side of the first connecting plate away from the second connecting plate, an opening is provided at the end of the flushing pipe, and the flushing pipe is connected with the intermediate groove when the flushing pipe moves to the liquid outlet, the flushing part is arranged on the side of the electroplating tank, and the output end of the flushing part is arranged in the intermediate groove for transporting the electroplating liquid to the flushing pipe.

[0011] The effect is that the flushing component drives the plating liquid into the middle tank through the liquid inlet, then enters the flushing pipe through the liquid outlet, and finally enters the first connecting plate and the second connecting plate from the flushing pipe to clean the impurities, so as to process the first connecting plate and the second connecting plate.

[0012] Preferably, a mounting frame is provided on the side of the first connecting plate, a clamping rod is provided in the mounting frame for sliding along a direction toward the second connecting plate, a matching block is provided on the side of the second connecting plate, a matching groove is provided on the matching block, the matching groove includes an abutting surface and an inclined surface, the inclined surface is inclined close to the side of the second connecting plate rotation axis along a direction away from the second connecting plate rotation axis, an elastic member is provided in the mounting frame, the elastic member and the clamping rod are connected to drive the clamping rod to abut against the inclined surface, and the side surface of the clamping rod abuts against the abutting surface when the first connecting plate and the second connecting plate rotate to the same plane.

[0013] The effect is that when the first connecting plate and the second connecting plate rotate to the same plane, the clamping rod moves to abut the abutment surface under the action of the elastic member, the first connecting plate continues to move in the same direction, and the second connecting plate and the first connecting plate remain in the same plane, so that the two can rotate to the same inclined plane, thereby facilitating the cleaning of impurities above the two into the collection frame.

[0014] Preferably, the first connecting plate, the second connecting plate and the collecting frame are each provided with two groups, the two groups of the first connecting plates are rotatably connected, the clamping rod is provided on one of the first connecting plates, and a limiting block is provided on the other first connecting plate, a limiting groove is provided on the limiting block, the clamping rod is inserted into the limiting groove when the clamping rod abuts against the inclined surface, the two groups of first connecting plates are in the same plane when the clamping rod and the limiting groove cooperate, and the clamping rod and the limiting groove are separated when the clamping rod abuts against the abutting surface.

[0015] The effect is that two groups of first connecting plates and second connecting plates are provided, and after the two groups of first connecting plates are rotated to the outside of the electroplating tank, they are both in an inclined state so that the first connecting plates and the second connecting plates can be cleaned by the flushing assembly.

[0016] Preferably, the limiting block and the mounting frame are both provided with a stopper on the side facing away from the bottom of the electroplating tank, and the two stoppers abut against each other when the two groups of the first connecting plates are in the same plane.

[0017] The effect is that two stoppers are set to abut against each other, so that the two first connecting plates are in the same plane when they are moved into the electroplating tank, so that the first connecting plates can be moved and placed at the bottom of the electroplating tank, and at the same time, the positions of the first connecting plates and the second connecting plates can be adjusted again to clean the electroplating liquid.

[0018] Preferably, a flushing port is provided on the side of the flushing pipe, and the flushing port is arranged along the axial direction of the first connecting plate.

[0019] The effect is that the electroplating liquid flushes the first connecting plate and the second connecting plate through the flushing port, and the flushing port is arranged along the length direction of the first connecting plate, thereby improving the cleaning efficiency of impurities on the first connecting plate.

[0020] Preferably, baffles are provided on the outer sides of the collecting frame and the electroplating tank, and the baffles are used to shield the flushing electroplating liquid.

[0021] The effect is that the baffle is provided to reduce the phenomenon that the plating solution flows to the outside of the plating tank when the impurities on the first connecting plate and the second connecting plate are flushed.

[0022] Preferably, a plurality of the reflux holes are opened in the horizontal direction, and the reflux holes are arranged close to the bottom of the collecting frame. The reflux holes are used to guide the electroplating solution remaining in the impurities to flow back into the electroplating tank.

[0023] The effect is that the electroplating solution containing impurities can flow back into the electroplating tank.

[0024] In a second aspect, the present invention provides an aluminum-magnesium alloy electroplating method, using the above-mentioned aluminum-magnesium alloy electroplating equipment, comprising the following steps:

[0025] Placing the aluminum-magnesium alloy in an electroplating tank for electroplating;

[0026] The control member drives the control screw to rotate and then drives the control block to move, and the movement of the control block drives the first connecting plate to move;

[0027] The movement of the first connecting plate drives the second connecting plate to move and rotate simultaneously;

[0028] After the second connecting plate rotates to be in the same plane as the first connecting plate, the clamping rod moves into the limiting groove;

[0029] Continue to move the first connecting plate until the side edge of the second connecting plate is in the collection frame;

[0030] The flushing part drives the electroplating solution through the middle tank into the flushing pipe, and then cleans the first connecting plate and the second connecting plate;

[0031] The impurities on the first connecting plate and the second connecting plate enter into the collecting frame.

[0032] The effect is that the control block drives the first connecting plate and the second connecting plate to rotate to the outside of the electroplating tank, cleans the impurities in the electroplating solution, and then cleans the first connecting plate and the second connecting plate through the flushing component, thereby improving the electroplating efficiency.

[0033] Beneficial effects: The present invention drives the first connecting plate and the second connecting plate to rotate to the outside of the electroplating tank through the control part to clean the impurities in the electroplating solution. Then the flushing part transports the electroplating solution to the flushing pipe to clean the first connecting plate and the second connecting plate, so that the impurities on the first connecting plate and the second connecting plate are flushed into the collection frame, which is convenient for cleaning the first connecting plate and the second connecting plate, so that the first connecting plate and the second connecting plate can be placed in the electroplating tank again, thereby improving the electroplating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0035] Figure 2 It is a structural schematic diagram of the filter plate in the present invention.

[0036] Figure 3 It is a structural schematic diagram of the control component in the present invention.

[0037] Figure 4 It is a structural schematic diagram of the flushing component in the present invention.

[0038] Figure 5 It is a schematic diagram of a state in which the first connecting plate and the second connecting plate rotate to the same inclined plane in the present invention.

[0039] Figure 6 It is a structural schematic diagram of the installation frame in the present invention.

[0040] Figure 7 It is a structural schematic diagram of the matching block in the present invention.

[0041] Figure 8 It is a schematic diagram of a state in which the first connecting plate and the second connecting plate are in the same plane in the present invention.

[0042] Reference numerals:

[0043] 1. Plating tank; 11. Reflux hole; 12. Baffle; 2. Filter plate; 21. First connecting plate; 22. Second connecting plate; 3. Control assembly; 31. Control member; 32. Control screw; 33. Control block; 4. Support sleeve; 5. Intermediate rod; 51. Intermediate groove; 52. Liquid inlet; 53. Liquid outlet; 6. Collecting frame; 7. Flushing assembly; 71. Flushing member; 72. Flushing pipe; 721. Flushing port; 722. Opening; 8. Mounting frame; 81. Clamping rod; 82. Elastic member; 83. Limiting block; 831. Limiting groove; 84. Stopper; 9. Matching block; 91. Matching groove; 911. Abutment surface; 912. Inclined surface. DETAILED DESCRIPTION

[0044] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0045] The present invention discloses an aluminum-magnesium alloy electroplating device. Figure 1 and Figure 2 The aluminum-magnesium alloy electroplating equipment includes an electroplating tank 1, a filter plate 2 for filtering impurities in the electroplating solution is arranged in the electroplating tank 1, and a control component 3 is arranged in the electroplating tank 1, and the control component 3 is used to adjust the position of the filter plate 2. When it is necessary to process the impurities in the electroplating solution, the control component 3 drives the filter plate 2 to move to the outside of the electroplating tank 1, and at the same time, the impurities in the electroplating solution are filtered and the electroplating solution is cleaned.

[0046] Reference Figure 1 and Figure 2 A support sleeve 4 is rotatably provided at the edge of the electroplating tank 1. The filter plate 2 includes a first connecting plate 21 and a second connecting plate 22. The first connecting plate 21 and the second connecting plate 22 are rotatably connected. The second connecting plate 22 is slidably provided in the support sleeve 4. The first connecting plate 21 is provided on a side of the second connecting plate 22 close to the inside of the electroplating tank 1. After the first connecting plate 21 is placed at the bottom of the electroplating tank 1, the second connecting plate 22 corresponds to the side wall of the electroplating tank 1. An intermediate rod 5 is provided in the electroplating tank 1 along the vertical direction. The control component 3 is provided on the intermediate rod 5. The control component 3 is connected to the first connecting plate 21 for adjusting the position of the first connecting plate 21. In the initial state, the first connecting plate 21 is located at the bottom of the electroplating tank 1, and the second connecting plate 22 corresponds to the side wall of the electroplating tank 1. The control component 3 drives the first connecting plate 21 to move toward the outside of the electroplating liquid, and at the same time drives the second connecting plate 22 to slide in the support sleeve 4 while driving the support sleeve 4 to rotate accordingly, until the first connecting plate 21 and the second connecting plate 22 move to the outside of the electroplating liquid, and the impurities in the electroplating liquid are filtered by the first connecting plate 21 and the second connecting plate 22, thereby cleaning the electroplating liquid.

[0047] Reference Figures 1 to 3The control assembly 3 includes a control member 31, a control screw 32 and a control block 33. The control block 33 is slidably arranged on the intermediate rod 5 in the vertical direction. The control block 33 is connected to the rotation axis of the first connecting plate 21, that is, the first connecting plate 21 is rotatably connected to the control block 33. The control screw 32 is arranged on the intermediate rod 5 along the sliding direction of the control block 33, and the control screw 32 is rotatably arranged on the intermediate rod 5. The control screw 32 penetrates the control block 33 and is threadedly connected with the control block 33, that is, when the control screw 32 rotates, it can drive the control block 33 to move. The control member 31 is arranged on the intermediate rod 5. The control member 31 can be set as a motor, and the output end of the control member 31 is connected to the control screw 32 through a coupling. The control member 31 drives the control screw 32 to rotate, and the rotation of the control screw 32 drives the control block 33 to move, thereby adjusting the position of the first connecting plate 21.

[0048] Reference Figures 1 to 4 In order to facilitate the cleaning of impurities on the first connecting plate 21 and the second connecting plate 22, a collecting frame 6 is provided on the side of the electroplating tank 1. The side of the second connecting plate 22 can be rotated into the collecting frame 6. After the side of the second connecting plate 22 is rotated into the collecting frame 6, the first connecting plate 21 is rotated to be in the same plane as the second connecting plate 22, and the planes where the two are located are inclined. A flushing component 7 is provided on the first connecting plate 21, and the flushing component 7 is used to flush the impurities on the first connecting plate 21 and the second connecting plate 22 into the collecting frame 6 for collection. In order to clean the first connecting plate 21 and the second connecting plate 22, the electroplating efficiency is improved.

[0049] Reference Figure 3 and Figure 4, an intermediate groove 51 is provided in the intermediate rod 5, and a liquid inlet 52 and a liquid outlet 53 are provided on the side of the intermediate rod 5 close to the electroplating solution. The liquid inlet 52 is provided close to the bottom of the electroplating tank 1, and the liquid outlet 53 is provided close to the end of the intermediate rod 5 away from the bottom of the electroplating tank 1, that is, the liquid inlet 52 is provided in the electroplating solution, and the liquid outlet 53 is provided outside the electroplating solution. The flushing assembly 7 includes a flushing part 71 and a flushing pipe 72, and the flushing pipe 72 is connected to the control block 33 in the control assembly 3. The flushing pipe 72 is provided on the side of the first connecting plate 21 away from the second connecting plate 22, and the flushing pipe 72 is provided along the axial direction of the first connecting plate 21, and a flushing port 721 is provided on the side of the flushing pipe 72 close to the first connecting plate 21, and the flushing port 721 is provided along the length direction of the flushing pipe 72. An opening 722 is provided at one end of the flushing pipe 72 close to the middle rod 5, and the end of the flushing pipe 72 abuts against the side of the middle rod 5, that is, the flushing pipe 72 can drive the opening 722 to move to the liquid outlet 53, so that the inside of the flushing pipe 72 is connected with the middle tank 51. The flushing member 71 is configured as a water pump, which is arranged outside the electroplating tank 1, and the output end of the water pump extends into the middle tank 51. The flushing member 71 is used to allow the electroplating liquid to enter the middle tank 51 through the liquid inlet 52, and use the middle tank 51 as a conveying channel, and then enter the flushing pipe 72 through the liquid outlet 53, and finally spray out through the flushing port 721 to flush the impurities on the first connecting plate 21 and the second connecting plate 22, and clean the impurities into the collection frame 6.

[0050] Reference Figure 1 and Figure 2 A reflux hole 11 is provided on the side wall of the electroplating tank 1, and the reflux hole 11 is connected to the inside of the collecting frame 6. After the electroplating liquid drives the impurities into the collecting frame 6, the electroplating liquid contained in the impurities enters the electroplating tank 1 through the reflux hole 11. In addition, the reflux hole 11 is arranged close to the bottom of the collecting frame 6, which further facilitates the electroplating liquid contained in the impurities to enter the electroplating tank 1. A plurality of reflux holes 11 are provided at intervals along the length direction of the side of the electroplating tank 1, and the reflux holes 11 are used for filtering. The electroplating liquid contained in the impurities enters the electroplating tank 1 through the plurality of reflux holes 11, thereby improving the reflux efficiency of the electroplating liquid.

[0051] Reference Figures 5 to 7In order to facilitate the first connecting plate 21 and the second connecting plate 22 to rotate to the same plane when they are moved to the outside of the electroplating tank 1, a mounting frame 8 is provided on the side of the first connecting plate 21, and the mounting frame 8 is arranged on the side of the first connecting plate 21 away from the control block 33. A clamping rod 81 is slidably arranged in the mounting frame 8, and the clamping rod 81 is arranged along the length direction of the side of the first connecting plate 21, and the clamping rod 81 is slidably arranged in the mounting frame 8 along its own length direction. A matching block 9 is provided on the second connecting plate 22, and a matching groove 91 is provided on the side of the matching block 9 close to the first connecting plate 21. The matching groove 91 includes a contact surface 911 and an inclined surface 912. The contact surface 911 is parallel to the filtering surface of the second connecting plate 22, and the inclined surface 912 is inclined on the side close to the rotation axis of the second connecting plate 22 along the rotation direction away from the second connecting plate 22. The inclined surface 912 is arranged on the side of the abutting surface 911 close to the side wall of the electroplating tank 1, and an elastic member 82 is arranged in the mounting frame 8. The elastic member 82 can be set as a spring. One end of the spring is connected to the mounting frame 8, and the other end is connected to the clamping rod 81. The end of the clamping rod 81 extends to the outside of the mounting frame 8. The elastic member 82 is used to drive the clamping rod 81 to move in the direction toward the second connecting plate 22.

[0052] Reference Figures 5 to 7 In the initial state, the elastic member 82 drives the clamping rod 81 to abut against the inclined surface 912. At this time, the first connecting plate 21 is located at the bottom of the electroplating tank 1. When the first connecting plate 21 moves, it drives the second connecting plate 22 to rotate relative to the first connecting plate 21. When the second connecting plate 22 rotates, the clamping rod 81 abuts against different positions on the inclined surface 912. At the same time, the clamping rod 81 moves relative to the mounting frame 8. When the second connecting plate 22 rotates to the same plane as the first connecting plate 21, the clamping rod 81 moves into the matching groove 91. At the same time, the side of the clamping rod 81 abuts against the abutting surface 911, restricting the second connecting plate 22, so that the second connecting plate 22 stops rotating relative to the first connecting plate 21, so that the second connecting plate 22 and the first connecting plate 21 are in the same plane. So that when the side of the second connecting plate 22 rotates into the collecting frame 6, the first connecting plate 21 and the second connecting plate 22 are in the same inclined plane, so as to flush the impurities. After cleaning, the control block 33 drives the first connecting plate 21 to move in the opposite direction, and the second connecting plate 22 rotates in the opposite direction relative to the first connecting plate 21, and the clamping rod 81 moves again to abut against the inclined surface 912, so that the first connecting plate 21 moves to the bottom of the electroplating tank 1.

[0053] Reference Figures 6 to 8The first connecting plate 21, the second connecting plate 22 and the collecting frame 6 are each provided with two groups, and the two first connecting plates 21 are rotatably connected. The two first connecting plates 21 are both connected to the control block 33, that is, when the control block 33 moves, the two first connecting plates 21 can be driven to rotate at the same time, and the two groups of connecting plates can be adjusted at the same time. The mounting frame 8 is set on one of the first connecting plates 21, and a limiting block 83 is set on the other first connecting plate 21. A limiting groove 831 is provided on the limiting block 83. The end of the clamping rod 81 away from the matching block 9 extends to the limiting groove 831. When the clamping rod 81 abuts against the inclined surface 912, the clamping rod 81 and the limiting groove 831 are buckled. When the clamping rod 81 and the limiting groove 831 are buckled, the two first connecting plates 21 are in the same plane, and the two move synchronously. When the clamping rod 81 and the abutting surface 911 are in contact, the clamping rod 81 and the limiting groove 831 are separated, and the control block 33 continues to move, which can drive the two groups of first connecting plates 21 and second connecting plates 22 to rotate in opposite directions to an inclined state, thereby improving the cleaning efficiency of impurities. In addition, in order to facilitate the first connecting plate 21 and the second connecting plate 22 to be fixed in the same inclined plane, the other group of first connecting plates 21 and second connecting plates 22 are also fixed in the same inclined plane, in this embodiment, the mounting frame 8, the clamping rod 81 and the matching block 9 are provided with two groups, and the two groups of mounting frames 8, the clamping rod 81 and the matching block 9 correspond to the opposite sides of the first connecting plate 21, respectively, so that after the first connecting plate 21 and the second connecting plate 22 are rotated to the same inclined plane, the two groups of clamping rods 81 are simultaneously in contact with the corresponding abutting surface 911, that is, the fixing principle and method of the two groups of first connecting plates 21 and second connecting plates 22 are the same, so that the two groups of first connecting plates 21 and second connecting plates 22 are both kept in the same inclined plane.

[0054] Reference Figure 6 and Figure 7 A stopper 84 is provided on the side of the limit block 83 and the mounting frame 8 away from the bottom of the electroplating tank 1. When the two first connecting plates 21 are in the same plane, the two stoppers 84 abut against each other. After the impurities are cleaned, the reverse movement control block 33 drives the first connecting plate 21 to rotate in the opposite direction. After the two first connecting plates 21 rotate in the opposite direction to the same plane, the stopper 84 abuts against each other, and the first connecting plate 21 stops rotating. The first connecting plate 21 continues to move to drive the second connecting plate 22 to rotate. The rotation of the second connecting plate 22 drives different positions on the inclined surface 912 to abut against the clamping rod 81, driving the clamping rod 81 to move until the clamping rod 81 and the limit groove 831 are engaged, so as to move the first connecting plate 21 again to clean the impurities in the electroplating tank 1.

[0055] Reference Figure 1 and Figure 2A baffle 12 is provided on the side of the electroplating tank 1, and the baffle 12 is provided on the side of the collecting frame 6. After the first connecting plate 21 and the second connecting plate 22 are rotated to the outside of the electroplating tank 1, the baffle 12 blocks the sides of the first connecting plate 21 and the second connecting plate 22 to reduce the phenomenon that the plating solution flows out of the outside of the electroplating tank 1 when flushing impurities.

[0056] The implementation principle of the present invention is: the control block 33 moves to drive the first connecting plate 21 and the second connecting plate 22 to rotate to the outside of the electroplating tank 1 to clean the impurities in the electroplating solution, and then the flushing part 71 drives the electroplating solution to be sprayed on the first connecting plate 21 and the second connecting plate 22 through the flushing port 721 of the flushing pipe 72, and the impurities on the first connecting plate 21 and the second connecting plate 22 are flushed into the collection frame 6, and then the first connecting plate 21 and the second connecting plate 22 are cleaned, so as to filter the electroplating solution again, and at the same time facilitate the centralized cleaning of impurities to improve the electroplating efficiency.

[0057] The invention also discloses an aluminum-magnesium alloy electroplating method, which adopts the aluminum-magnesium alloy electroplating equipment.

[0058] An aluminum-magnesium alloy electroplating method comprises the following steps:

[0059] S1, placing the aluminum-magnesium alloy in an electroplating tank 1 for electroplating;

[0060] S2, when there are too many impurities in the electroplating tank 1, the control member 31 drives the control screw 32 to rotate, the control screw 32 rotates to drive the control block 33 to move, and the control block 33 moves to drive the first connecting plate 21 to rotate and move;

[0061] S3, the first connecting plate 21 moves to drive the second connecting plate 22 to move, and the second connecting plate 22 rotates at the same time;

[0062] S4, after the second connecting plate 22 rotates to be in the same plane as the first connecting plate 21, the clamping rod 81 moves into the limiting groove 831;

[0063] S5, continue to move the first connecting plate 21 until the side of the second connecting plate 22 enters the collecting frame 6;

[0064] S6, the flushing member 71 drives the electroplating solution through the middle tank 51 into the flushing pipe 72, and then cleans the first connecting plate 21 and the second connecting plate 22;

[0065] S7 , the impurities on the first connecting plate 21 and the second connecting plate 22 enter the collecting frame 6 , and the electroplating solution contained in the impurities enters the electroplating tank 1 through the reflux hole 11 .

[0066] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. An aluminum-magnesium alloy electroplating device, comprising an electroplating tank and a filter plate arranged in the electroplating tank, characterized in that: The filter plate comprises a first connecting plate and a second connecting plate which are rotatably connected, a support sleeve is rotatably provided at the edge of the electroplating tank, the second connecting plate is slidably provided in the support sleeve, an intermediate rod is provided in the electroplating tank, a control component is provided on the intermediate rod, the control component is connected to the first connecting plate and is used to adjust the position of the first connecting plate, a collecting frame is provided on the side of the electroplating tank, and the side edge of the second connecting plate is in the same inclined plane as the first connecting plate when it moves into the collecting frame, a flushing component is provided on the first connecting plate, the flushing component is used to transport the electroplating solution to the first connecting plate to clean up impurities, and a reflux hole connected to the collecting frame is provided on the side of the electroplating tank; The control assembly includes a control member, a control screw and a control block, wherein the control block is slidably arranged on the intermediate rod along the vertical direction, the control block is rotatably connected to the first connecting plate, the control screw is rotatably arranged on the intermediate rod, the control screw and the control block are threadedly matched, the control member is arranged on the intermediate rod, and the output end of the control member is connected to the control screw to drive the control screw to rotate; The middle rod is provided with a middle groove, and the side of the middle rod is provided with a liquid inlet and a liquid outlet connected with the middle groove in the vertical direction, the liquid inlet is located in the electroplating liquid, and the liquid outlet is located outside the electroplating liquid, the flushing assembly includes a flushing piece and a flushing pipe, the flushing pipe is connected to the control block in the control assembly and is located on the side of the first connecting plate away from the second connecting plate, the end of the flushing pipe is provided with an opening, and when the flushing pipe moves to the liquid outlet, the flushing pipe is connected with the middle groove through the opening, the flushing piece is arranged on the side of the electroplating tank, and the output end of the flushing piece is arranged in the middle groove for conveying the electroplating liquid to the flushing pipe; The side of the first connecting plate is provided with an installation frame, and a clamping rod is slidably provided in the installation frame in a direction toward the second connecting plate. The side of the second connecting plate is provided with a matching block, and the matching block is provided with a matching groove, and the matching groove includes an abutting surface and an inclined surface, and the side of the inclined surface close to the second connecting plate rotation axis is inclined in a direction away from the second connecting plate rotation axis, and an elastic member is provided in the installation frame, and the elastic member and the clamping rod are connected to drive the clamping rod to abut against the inclined surface, and the side surface of the clamping rod abuts against the abutting surface when the first connecting plate and the second connecting plate rotate to the same plane; The first connecting plate, the second connecting plate and the collecting frame are each provided with two groups, and the two groups of the first connecting plates are rotatably connected. The clamping rod is set on one of the first connecting plates, and a limiting block is set on the other first connecting plate. A limiting groove is provided on the limiting block. When the clamping rod abuts the inclined surface, the clamping rod is inserted into the limiting groove. When the clamping rod and the limiting groove cooperate, the two groups of first connecting plates are in the same plane, and when the clamping rod abuts the abutting surface, the clamping rod and the limiting groove are separated; the installing frame, the clamping rod and the matching block are each provided with two groups, so that after the first connecting plate and the second connecting plate are rotated to the same inclined plane, the two groups of clamping rods abut against the corresponding abutting surfaces at the same time, and the fixing principle and method of the two groups of first connecting plates and second connecting plates are the same.

2. The aluminum-magnesium alloy electroplating equipment according to claim 1, characterized in that: The limiting block and the installation frame are both provided with a stopper on one side away from the bottom of the electroplating tank, and the two stoppers abut against each other when the two groups of the first connecting plates are in the same plane.

3. The aluminum-magnesium alloy electroplating equipment according to claim 1, characterized in that: A flushing port is provided on the side of the flushing pipe, and the flushing port is arranged along the axial direction of the first connecting plate.

4. The aluminum-magnesium alloy electroplating equipment according to claim 1, characterized in that: Baffles are arranged on the outside of the collecting frame and the electroplating tank, and the baffles are used to shield the flushing electroplating liquid.

5. The aluminum-magnesium alloy electroplating equipment according to claim 1, characterized in that: A plurality of reflux holes are provided in the horizontal direction. The reflux holes are arranged close to the bottom of the collecting frame. The reflux holes are used to guide the electroplating liquid remaining in the impurities to flow back into the electroplating tank.

6. An aluminum-magnesium alloy electroplating method, using the aluminum-magnesium alloy electroplating equipment according to claim 1, characterized in that: The steps include: Placing the aluminum-magnesium alloy in an electroplating tank for electroplating; The control member drives the control screw to rotate and then drives the control block to move, and the movement of the control block drives the first connecting plate to move; The movement of the first connecting plate drives the second connecting plate to move and rotate simultaneously; After the second connecting plate rotates to be in the same plane as the first connecting plate, the clamping rod moves into the limiting groove; Continue to move the first connecting plate until the side edge of the second connecting plate is in the collection frame; The flushing part drives the electroplating solution through the middle tank into the flushing pipe, and then cleans the first connecting plate and the second connecting plate; The impurities on the first connecting plate and the second connecting plate enter into the collecting frame.

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