A composite heat-conducting PCB circuit board

Abstract

The present invention provides a composite heat-conducting PCB circuit board, which relates to the technical field of printed circuits. It includes an upper substrate, a lower substrate and a graphene coating. A filling layer is arranged between the upper substrate and the lower substrate. The graphene coating is coated on the surface of the upper substrate. A second heat dissipation interlayer and two first heat dissipation interlayers are arranged inside the filling layer. The filling layer is filled with a gel filling layer. When the chip on the upper substrate operates, the heat of the chip will be transferred to the copper sheet and the two first heat dissipation interlayers through the upper groove. The copper sheet and the two first heat dissipation interlayers transfer the heat out respectively through the second graphite heat-conducting strip and the first graphite heat-conducting strip. The heat-conducting sheets on the inner side wall of the heat sink are attached to the second graphite heat-conducting strip and the first graphite heat-conducting strip, so that the heat can be exported, thereby reducing the overall temperature of the upper substrate. By adding a filling layer with heat-conducting channels between the upper substrate and the lower substrate, the heat transfer efficiency can be improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of printed circuits, and more specifically, particularly relates to a composite heat-conducting PCB circuit board. Background Art

[0002] With the continuous development of electronic devices, the requirements for the heat dissipation performance of circuit boards are getting higher and higher. Traditional PCB circuit boards usually have poor heat conduction performance. The wide application of high-power electronic components, such as CPUs, GPUs, etc., generates a large amount of heat. If the heat cannot be dissipated in a timely and effective manner, it will cause the temperature of the electronic device to rise, affecting its performance and reliability, and even shortening its service life.

[0003] Therefore, in view of this, research and improvement are carried out on the existing structure and deficiencies, and a composite heat-conducting PCB circuit board is provided, in order to achieve a more practical and valuable purpose. Summary of the Invention

[0004] In order to solve the above technical problems, the present invention provides a composite heat-conducting PCB circuit board to solve the above problems.

[0005] A composite heat-conducting PCB circuit board includes an upper substrate, a lower substrate, and a graphene coating. A filling layer is provided between the upper substrate and the lower substrate. The graphene coating is coated on the surface of the upper substrate. A second heat dissipation interlayer and two first heat dissipation interlayers are provided inside the filling layer. The filling layer is filled with a gel filling layer, and the gel filling layer wraps the second heat dissipation interlayer and the two first heat dissipation interlayers. At least two second graphite heat-conducting strips are inserted inside the second heat dissipation interlayer, and the left and right ends of each second graphite heat-conducting strip are flush with the lateral outer wall of the filling layer. At least two first graphite heat-conducting strips are inserted inside each of the two first heat dissipation interlayers, and the end of each first graphite heat-conducting strip is flush with the longitudinal outer wall of the filling layer. Each of the second heat dissipation interlayer and the first heat dissipation interlayer is located directly below the chip soldering position of the upper substrate.

[0006] Preferably, three upper grooves are opened below the upper substrate, and the three upper grooves are respectively opposite to the second heat dissipation interlayer and the two first heat dissipation interlayers. Ground wire holes are penetrated through the upper substrate and the lower substrate near the four corners. Heat-conducting columns are fixedly installed near the four corners of the filling layer, and the upper and lower ends of each heat-conducting column are flush with the outside of the ground wire hole. At least two heat dissipation bins are opened above each of the second heat dissipation interlayer and the first heat dissipation interlayer, and each second graphite heat-conducting strip and the first graphite heat-conducting strip are filled in the heat dissipation bin.

[0007] Preferably, two heat-conducting frames are fixedly installed inside the filling layer located on both sides of the heat dissipation bin, and each of the heat-conducting frames is provided with at least two heat-conducting grooves, each of the second graphite heat-conducting strips is located in the heat-conducting groove, and copper sheets are fixedly installed above each of the second heat dissipation interlayers and the first heat dissipation interlayers, and each of the copper sheets is located in the upper groove and fits with the top of the upper groove, a second lower groove and two first lower grooves are provided above the gel filling layer, and at least two second strip grooves are provided on both sides of the second lower groove.

[0008] Preferably, at least two first strip grooves are provided on the outer sides of the two first lower grooves, at least two heat dissipation grooves are provided through the four side walls of the filling layer, and heat sinks are arranged outside the four side walls of the filling layer, at least two heat dissipation bars are fixedly installed on the side walls of each heat sink, and each heat dissipation bar is plugged into the heat dissipation grooves provided in the filling layer, and each heat dissipation bar has two U-shaped grooves near the end of the heat sink, and the two U-shaped grooves are diagonally distributed up and down, and a heat conductive sheet is fixedly installed on the side walls of each heat sink, and the transverse and longitudinal heat conductive sheets are respectively fitted with the second graphite heat conductive sheet and the first graphite heat conductive sheet.

[0009] Compared with the prior art, the present invention has the following beneficial effects:

[0010] In the present invention, when the chip on the upper substrate is operating, the heat of the chip will be transferred to the copper sheet and the two first heat dissipation interlayers through the upper groove. The copper sheet and the two first heat dissipation interlayers transfer the heat through the second graphite thermal conductive strip and the first graphite thermal conductive strip respectively. The thermal conductive sheet on the inner wall of the heat sink is fitted with the second graphite thermal conductive strip and the first graphite thermal conductive strip to conduct the heat, thereby reducing the overall problem of the upper substrate. By adding a filling layer with a heat conductive channel between the upper substrate and the lower substrate, the heat transfer efficiency can be improved.

[0011] In the present invention, the thermal conductivity of the upper substrate can be further improved by coating a graphene coating on the surface of the upper substrate, and the graphene coating is coated by a spraying method.

[0012] In the present invention, a copper sheet is arranged above the second heat dissipation interlayer and the first heat dissipation interlayer to fit with the inner wall of the upper groove, so that the thermal conductivity between the two can be improved, and the space between every two second graphite thermal conductive strips or the first graphite thermal conductive strips is filled with a gel filling layer. When the second graphite thermal conductive strips and the first graphite thermal conductive strips conduct heat, the gel filling layer can quickly disperse the heat of multiple second graphite thermal conductive strips and the first graphite thermal conductive strips, thereby playing a role in rapid heat dissipation and cooling. At the same time, a second lower groove and two first lower grooves are provided on the gel filling layer, so that the heat transferred by the second heat dissipation interlayer and the first heat dissipation interlayer can be quickly absorbed, further improving the overall thermal conductivity.

[0013] In the present invention, multiple heat dissipation strips can play a good role in conducting the heat on the side wall of the filling layer. At the same time, the multiple heat dissipation strips are in contact with the air, which can play the ability of rapid heat dissipation. U-shaped grooves are provided at the upper and lower parts of each heat dissipation strip. Therefore, the contact area between the heat dissipation strip and the air becomes larger, further increasing the heat dissipation area. The heat conducting sheet can transfer the heat of the second graphite heat conducting strip and the first graphite heat conducting strip to the heat sink, and the heat sink can play a role in overall heat conduction.

[0014] In the present invention, four heat conducting columns installed through the four corners inside the filling layer can conduct the heat of the filling layer and the gel filling layer. By contacting the air in the ground wire hole, the heat can be conducted to the air. Description of the Drawings

[0015] Figure 1 is a schematic structural diagram of the upper substrate of the present invention;

[0016] Figure 2 is a schematic structural diagram of the gel filling layer of the present invention;

[0017] Figure 3 is a schematic structural diagram of the ground wire hole of the present invention;

[0018] Figure 4 is a schematic structural diagram of the copper sheet of the present invention;

[0019] Figure 5 is a schematic structural diagram of the heat sink of the present invention;

[0020] Figure 6 is a schematic structural diagram of the heat conducting column of the present invention;

[0021] Figure 7 is a schematic structural diagram of the first heat dissipation interlayer of the present invention;

[0022] Figure 8 is a schematic structural diagram of the second heat dissipation interlayer of the present invention.

[0023] In the figure, the correspondence between the component names and the drawing reference numerals is as follows: 1, upper substrate; 11, graphene coating; 12, ground wire hole; 13, upper groove; 14, lower substrate; 2, filling layer; 21, heat dissipation groove; 22, heat conducting column; 23, first heat dissipation interlayer; 24, first graphite heat conducting strip; 25, second heat dissipation interlayer; 26, heat dissipation chamber; 27, heat conducting frame; 28, heat conducting groove; 29, copper sheet; 3, second graphite heat conducting strip; 31, gel filling layer; 32, first lower groove; 33, first strip-shaped groove; 34, second lower groove; 35, second strip-shaped groove; 36, heat sink; 37, heat conducting sheet; 38, heat dissipation strip; 39, U-shaped groove. Detailed Embodiments

[0024] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0025] See also Figures 1-8 The present invention provides a composite heat-conducting PCB circuit board, comprising an upper substrate 1, a lower substrate 14 and a graphene coating 11, a filling layer 2 is arranged between the upper substrate 1 and the lower substrate 14, the graphene coating 11 is coated on the surface of the upper substrate 1, a second heat dissipation interlayer 25 and two first heat dissipation interlayers 23 are arranged inside the filling layer 2, a gel filling layer 31 is filled inside the filling layer 2, and the gel filling layer 31 wraps the second heat dissipation interlayer 25 and the two first heat dissipation interlayers 23, at least two second graphite heat-conducting strips 3 are inserted and installed inside the second heat dissipation interlayer 25, and the left and right ends of the second graphite heat-conducting strips 3 are both flush with the lateral outer side wall of the filling layer 2, and the copper sheet 29 and the two first heat dissipation interlayers 23 are arranged on the inner side of the filling layer 2. The thermal interlayer 23 transfers heat through the second graphite thermal conductive strip 3 and the first graphite thermal conductive strip 24 respectively. The thermal conductive sheet 37 on the inner wall of the heat sink 36 is in contact with the second graphite thermal conductive strip 3 and the first graphite thermal conductive strip 24, and the heat can be conducted out, thereby reducing the overall problem of the upper substrate 1. By adding a filling layer 2 with a heat conductive channel between the upper substrate 1 and the lower substrate 14, at least two first graphite thermal conductive strips 24 are installed inside the two first heat dissipation interlayers 23, and the end of each first graphite thermal conductive strip 24 is flush with the longitudinal outer side wall of the filling layer 2. Each second heat dissipation interlayer 25 and the first heat dissipation interlayer 23 are located directly below the chip welding position of the upper substrate 1.

[0026] Three upper grooves 13 are provided at the bottom of the upper substrate 1, and the three upper grooves 13 are respectively opposite to the second heat dissipation interlayer 25 and the two first heat dissipation interlayers 23. Grounding holes 12 are provided through the upper substrate 1 and the lower substrate 14 near the four corners. Thermal conductive columns 22 are fixedly installed near the four corners of the filling layer 2, and the upper and lower ends of each thermal conductive column 22 are flush with the outer side of the grounding hole 12. At least two heat dissipation bins 26 are provided above each second heat dissipation interlayer 25 and the first heat dissipation interlayer 23, and each second graphite thermal conductive bar 3 and the first graphite thermal conductive bar 24 are filled in the heat dissipation bin 26.

[0027] Two heat-conducting frames 27 are fixedly installed inside the filling layer 2 located on both sides of the heat dissipation chamber 26, and each heat-conducting frame 27 is provided with at least two heat-conducting grooves 28, and each second graphite heat-conducting strip 3 is located in the heat-conducting groove 28. Four heat-conducting columns 22 are installed through the four corners of the filling layer 2, which can conduct the heat of the filling layer 2 and the gel filling layer 31, and can conduct the heat to the air by contacting with the air in the ground wire hole 12. A copper sheet 29 is fixedly installed above each second heat dissipation interlayer 25 and the first heat dissipation interlayer 23, and each copper sheet 29 is located in the upper groove 13 and fits with the top of the upper groove 13. A second lower groove 34 and two first lower grooves 32 are provided above the gel filling layer 31, and at least two second strip grooves 35 are provided on both sides of the second lower groove 34.

[0028] At least two first strip grooves 33 are provided on the outside of the two first lower grooves 32, at least two heat dissipation grooves 21 are provided through the four side walls of the filling layer 2, and heat sinks 36 are provided on the outside of the four side walls of the filling layer 2, and at least two heat dissipation bars 38 are fixedly installed on the side walls of each heat dissipation bar 36, and each heat dissipation bar 38 is plugged into the heat dissipation groove 21 provided in the filling layer 2. When the second graphite heat conductive bar 3 and the first graphite heat conductive bar 24 conduct heat, the gel filling layer 31 can quickly disperse the heat of the plurality of second graphite heat conductive bars 3 and the first graphite heat conductive bar 24. At the same time, a second lower groove 34 and two first lower grooves 32 are provided on the gel filling layer 31, so that the heat transferred by the second heat dissipation interlayer 25 and the first heat dissipation interlayer 23 can be quickly absorbed. Two U-shaped grooves 39 are provided near the end of each heat dissipation bar 38 and the heat dissipation fin 36, and the two U-shaped grooves 39 are diagonally distributed up and down. A heat conductive sheet 37 is fixedly installed on the side wall of each heat dissipation fin 36, and the transverse and longitudinal heat conductive sheets 37 are respectively fitted with the second graphite heat conductive strip 3 and the first graphite heat conductive strip 24.

[0029] Working principle:

[0030] The filling layer 2 is used to fill between the upper substrate 1 and the lower substrate 14. When the chip on the upper substrate 1 is in operation, the heat of the chip will be transferred to the copper sheet 29 and the two first heat dissipation interlayers 23 through the upper groove 13. The copper sheet 29 and the two first heat dissipation interlayers 23 transfer the heat through the second graphite heat conductive strip 3 and the first graphite heat conductive strip 24 respectively. The heat conductive sheet 37 on the inner wall of the heat sink 36 is attached to the second graphite heat conductive strip 3 and the first graphite heat conductive strip 24 to conduct the heat, thereby reducing the overall problem of the upper substrate 1. By adding a filling layer 2 with a heat conductive channel between the upper substrate 1 and the lower substrate 14, the heat transfer efficiency can be improved.

[0031] Coating the surface of the upper substrate 1 with a graphene coating 11 can further improve the heat conduction performance of the upper substrate 1, and the graphene coating 11 is coated by spraying;

[0032] By arranging a copper sheet 29 above the second heat dissipation sandwich layer 25 and the first heat dissipation sandwich layer 23 to fit with the inner wall of the upper groove 13, the heat conduction ability between each pair can be improved. Each two second graphite heat conduction strips 3 or first graphite heat conduction strips 24 are filled with a gel filling layer 31. When the second graphite heat conduction strips 3 and the first graphite heat conduction strips 24 conduct heat, the gel filling layer 31 can quickly disperse the heat of multiple second graphite heat conduction strips 3 and first graphite heat conduction strips 24, thereby playing a role in quickly dissipating heat and reducing temperature. At the same time, second lower grooves 34 and two first lower grooves 32 are formed in the gel filling layer 31, so that the heat transferred by the second heat dissipation sandwich layer 25 and the first heat dissipation sandwich layer 23 can be quickly absorbed, further improving the overall heat conduction ability;

[0033] Multiple heat dissipation strips 38 on the side wall of the heat sink 36 are inserted into the heat dissipation grooves 21 formed in the filling layer 2. Therefore, the multiple heat dissipation strips 38 can play a good role in conducting the heat on the side wall of the filling layer 2. At the same time, the multiple heat dissipation strips 38 are in contact with the air, which can play the ability of quickly dissipating heat. And U-shaped grooves 39 are formed above and below each heat dissipation strip 38. Therefore, the contact area between the heat dissipation strip 38 and the air becomes larger, further increasing the heat dissipation area. The heat conduction sheet 37 can transfer the heat of the second graphite heat conduction strips 3 and the first graphite heat conduction strips 24 to the heat sink 36, and the heat sink 36 can play the role of overall heat conduction;

[0034] Four heat conduction columns 22 installed through the four corners inside the filling layer 2 can conduct the heat of the filling layer 2 and the gel filling layer 31, and transfer the heat to the air by contacting the air in the ground wire hole 12.

[0035] The embodiments of the present invention are given for the purposes of illustration and description, and are not exhaustive or limit the present invention to the disclosed form. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are chosen and described in order to better explain the principles of the present invention and its practical applications, and to enable those of ordinary skill in the art to understand the present invention and design various embodiments with various modifications suitable for specific purposes.

Claims

1. A composite thermally conductive PCB circuit board, comprising an upper substrate (1), a lower substrate (14) and a graphene coating (11), characterized in that: A filling layer (2) is provided between the upper substrate (1) and the lower substrate (14); the graphene coating (11) is coated on the surface of the upper substrate (1); a second heat dissipation interlayer (25) and two first heat dissipation interlayers (23) are provided inside the filling layer (2); a gel filling layer (31) is filled inside the filling layer (2); and the gel filling layer (31) wraps the second heat dissipation interlayer (25) and the two first heat dissipation interlayers (23); At least two second graphite heat-conducting strips (3) are inserted and installed inside the second heat-dissipating interlayer (25), and the left and right ends of the second graphite heat-conducting strips (3) are flush with the transverse outer wall of the filling layer (2); at least two first graphite heat-conducting strips (24) are inserted and installed inside the two first heat-dissipating interlayers (23), and the end of each first graphite heat-conducting strip (24) is flush with the longitudinal outer wall of the filling layer (2); Each of the second heat dissipation interlayer (25) and the first heat dissipation interlayer (23) is located directly below the chip welding position of the upper substrate (1); three upper grooves (13) are provided below the upper substrate (1), and the three upper grooves (13) are respectively opposite to the second heat dissipation interlayer (25) and the two first heat dissipation interlayers (23); grounding holes (12) are provided through the upper substrate (1) and the lower substrate (14) near the four corners; heat conducting columns (22) are fixedly installed near the four corners of the filling layer (2), and the upper and lower ends of each heat conducting column (22) are flush with the outer side of the grounding hole (12). At least two heat dissipation chambers (26) are provided above each of the second heat dissipation interlayers (25) and the first heat dissipation interlayers (23), and each of the second graphite heat conductive strips (3) and the first graphite heat conductive strips (24) are filled in the heat dissipation chambers (26). Two heat conductive racks (27) are fixedly installed inside the filling layer (2) located on both sides of the heat dissipation chambers (26), and each of the heat conductive racks (27) is provided with at least two heat conductive grooves (28), and each of the second graphite heat conductive strips (3) is located in the heat conductive grooves (28). 3), each of the copper sheets (29) is located in the upper groove (13) and fits with the top of the upper groove (13), a second lower groove (34) and two first lower grooves (32) are provided above the gel filling layer (31), at least two second strip grooves (35) are provided on both sides of the second lower groove (34), at least two first strip grooves (33) are provided on the outer sides of the two first lower grooves (32), at least two heat dissipation grooves (21) are provided through the four side walls of the filling layer (2), and the four side walls of the filling layer (2) are provided with A heat sink (36) is arranged, and at least two heat sink bars (38) are fixedly mounted on the side wall of each heat sink (36), and each heat sink bar (38) is plugged into a heat sink (21) provided in the filling layer (2), and each heat sink bar (38) is provided with two U-shaped grooves (39) near the end of the heat sink (36), and the two U-shaped grooves (39) are distributed diagonally up and down, and a heat conducting sheet (37) is fixedly mounted on the side wall of each heat sink (36), and the transverse and longitudinal heat conducting sheets (37) are respectively fitted with the second graphite heat conducting strip (3) and the first graphite heat conducting strip (24).

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