Method for forming a three-dimensional impact absorbing layer using UV parallel light in a multi-layer stacked structure and the impact absorbing layer formed by the method

Abstract

The present invention relates to a method for forming a three-dimensional impact-absorbing layer using UV parallel light in a multi-layer stacked structure, and the impact-absorbing layer formed by the method. Specifically, the present invention relates to a method for forming a three-dimensional impact-absorbing layer using UV parallel light in a multi-layer stacked structure by irradiating parallel light and UV to a photomask to improve impact resistance, resilience and extension force, the impact-absorbing layer formed by the method, and a component using the impact-absorbing layer. The three-dimensional impact-absorbing layer according to the manufacturing method of the present invention is composed of a shock-absorbing layer skeleton frame and a shock buffer portion around the skeleton frame, each having a different modulus value. Since the skeleton frame maintains a relatively high structural hardness and the shock buffer portion disperses internal / external impacts, a three-dimensional impact-absorbing layer with excellent impact resistance, resilience and extension force can be manufactured. The shock-absorbing layer can also be used in a stacked structure, and can also be used in a component using the stacked structure.

Description

Technical Field

[0001] The present invention relates to a method for forming a three-dimensional impact absorbing layer in a multi-layer stacking structure by using ultraviolet (UV) parallel light, and the impact absorbing layer formed by the method. Specifically, it relates to a method for producing a multi-layer stacking structure with improved impact resistance, resilience and elongation by irradiating parallel light and UV to a photomask and forming a three-dimensional impact absorbing layer in the stacking structure by using UV parallel light, and the impact absorbing layer formed by the method and a component using the impact absorbing layer. Background Art

[0002] Recently, as society has entered the formal information age, the field of displays that process and display a large amount of information has developed rapidly, and correspondingly, various flat display devices have been developed and attracted much attention. As displays are transformed from flat to curved and folded forms, existing cover windows are transformed into very thin forms such as thin films (CPI) or ultra-thin glass (UTG) in order to facilitate folding and unfolding in glass.

[0003] In addition, since such a flat-panel display device uses a glass substrate to withstand high heat generated during a manufacturing process, there are limitations in providing lightness, thinness, and flexibility.

[0004] Therefore, flexible display devices that are manufactured using flexible materials such as plastic instead of existing inflexible glass substrates and can maintain display performance intact even when bent like paper are rapidly becoming the next generation of flat panel display devices.

[0005] Flexible display devices use plastic thin film transistor substrates instead of glass substrates, and can be divided into unbreakable ones with high durability, bendable ones that are not broken and can be bent, rollable ones that can be rolled up, foldable ones that can be folded, etc. Such flexible display devices can have the advantages of space utilization, decoration and design, and can have a variety of application fields.

[0006] However, since the flexible display device needs to be able to be folded and unfolded, the back plate including the display panel and the cover window are formed in a very thin film form, and the thin film form mostly vertically transmits the impact transmitted from the outside.

[0007] That is, in the case where an impact is applied to the cover window or the back plate from the outside, as the cover window and the back plate are formed in a thin film form, the impact applied from the outside is transferred intact to the display panel located between the cover window and the back plate.

[0008] This causes damage to the display panel, thereby reducing the display quality of the display panel. Summary of the invention

[0009] Technical issues

[0010] In order to solve the above-mentioned problems, an object of the present invention is to provide a method for forming a three-dimensional impact absorbing layer using UV parallel light in order to improve impact resistance, resilience and tensile strength.

[0011] Another object of the present invention is to provide a shock absorbing layer produced by a method of forming a shock absorbing layer with a three-dimensional structure in order to improve shock resistance, restoring force, and tensile force.

[0012] Technical Solution

[0013] In order to achieve the above object, the present invention provides a method for forming a three-dimensional impact absorbing layer in a multi-layer stacked structure using UV parallel light, comprising the following steps:

[0014] (a) applying a composition for forming a shock absorbing layer on an upper portion of a substrate;

[0015] (b) forming a polymer layer on the upper portion of the composition;

[0016] (c) placing a photomask on top of the polymer layer;

[0017] (d) irradiating UV parallel light from 2 to 8 directions to the photomask at an angle greater than 0° and less than 90° with a surface perpendicular to the exposure surface as a reference, so that the impact absorbing layer bone scaffold is cured parallel to the angle of the parallel light; and

[0018] (e) forming an impact buffer around the bone support by removing the photomask and irradiating UV light having a lower intensity than the UV parallel light, thereby completing an impact absorbing layer.

[0019] In order to achieve the above another object, the present invention provides a method for forming a three-dimensional impact absorbing layer in a multi-layer stacked structure using UV parallel light, comprising the following steps:

[0020] (a) coating a composition for forming a shock absorbing layer on a substrate;

[0021] (b) forming a polymer layer on the upper portion of the composition;

[0022] (c) placing a half-cut mask on top of the polymer layer; and

[0023] (d) With the surface perpendicular to the exposure surface as a reference, UV parallel light is irradiated toward the half-cut mask from directions 2 to 8 at an angle greater than 0° and less than 90°, the UV parallel light passing through the holes of the half-cut mask is parallel to the angle of the parallel light to cure the impact absorbing layer bone scaffold, and the UV parallel light except for the holes of the half-cut mask forms an impact buffer portion around the bone scaffold, thereby completing the impact absorbing layer.

[0024] In order to achieve another object mentioned above, the present invention provides a three-dimensional impact absorbing layer manufactured by the above manufacturing method.

[0025] In order to achieve another object mentioned above, the present invention provides a component using a stacked structure including the impact absorbing layer having the three-dimensional shape mentioned above.

[0026] Technical Effects

[0027] The three-dimensional impact absorbing layer according to the manufacturing method of the present invention is composed of a shock absorbing layer skeleton frame and a shock buffer portion around the skeleton frame, and each modulus value is different. Since the skeleton frame maintains a high structural hardness and the shock buffer portion disperses internal / external impacts, a three-dimensional impact absorbing layer with excellent impact resistance, resilience and tensile strength can be manufactured. The impact absorbing layer can also be used in a stacked structure, and can also be used in an element using the stacked structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 When irradiated with parallel light according to an embodiment of the present invention, images of (a) a prism structure, (b) a cone shape (cone array), (c) a triangular structure, and (d) a pyramid structure are formed according to the angle of the parallel light.

[0029] Figure 2 As images showing patterns of a photomask according to an embodiment of the present invention, there are images showing a rectangular pattern (a) and a triangular pattern (b).

[0030] Figure 3 This is an image schematically showing a method for manufacturing an impact absorbing layer of a three-dimensional film sandwich structure formed by parallel light photometry according to an embodiment of the present invention.

[0031] Figure 4 4 is a graph showing a stress-strain curve according to the use time of the curing agent TMPTA when only parallel light is irradiated according to an embodiment of the present invention.

[0032] Figure 5 This is a graph measuring the modulus of the impact absorbing layer when only parallel light is irradiated according to an embodiment of the present invention.

[0033] Figure 6 FIG. 4 is a graph showing a stress-strain curve when parallel light and UV light are irradiated without using a photomask according to an embodiment of the present invention.

[0034] Figure 7 : is a graph showing the modulus according to time measured when parallel light and UV are irradiated without using a photomask according to an embodiment of the present invention.

[0035] Figure 8 FIG. 4 is a graph showing a stress-strain curve when only the entire surface is irradiated with UV light without a photomask according to an embodiment of the present invention.

[0036] Fig. 9 This is a graph showing the modulus of the impact absorbing layer forming composition measured when the entire surface is irradiated with UV light without a photomask according to one embodiment of the present invention.

[0037] Fig.10 4 is a graph showing a stress-strain curve when UV is irradiated after parallel light is irradiated onto a photomask according to an embodiment of the present invention.

[0038] Fig.11 : is a graph showing the measured modulus of the impact absorbing layer when UV is irradiated after irradiating parallel light to a photomask according to an embodiment of the present invention.

[0039] Best Mode for Carrying Out the Invention

[0040] Hereinafter, the present invention will be described in more detail.

[0041] According to one aspect of the present invention, there is provided a method for forming a three-dimensional impact absorbing layer using UV parallel light in a multi-layer stacked structure, comprising the following steps: (a) coating a composition for forming an impact absorbing layer on the upper part of a substrate; (b) forming a polymer layer on the upper part of the composition; (c) placing a photomask on the upper part of the polymer layer; (d) irradiating UV parallel light from 2 to 8 directions to the photomask at an angle greater than 0° and less than 90° with respect to a surface perpendicular to an exposure surface, so that a skeletal scaffold of the impact absorbing layer is cured parallel to the angle of the parallel light; and (e) forming an impact buffer portion around the skeletal scaffold by removing the photomask and irradiating UV light having an intensity lower than that of the UV parallel light, thereby completing the impact absorbing layer.

[0042] In the present invention, a three-dimensional impact absorbing layer can be formed by a two-step process including an exposure process using a photomask and an exposure process after removing the photomask. Specifically, the impact absorbing layer of the present invention is composed of a shock absorbing layer skeleton support and an impact buffering portion around the skeleton support. "Skeleton support" means a portion of the impact absorbing layer whose curing composition is transmitted by UV parallel light and cured at the same angle and shape as the parallel light. Therefore, the structure and shape of the skeleton support can be regarded as directly reflecting the shape, size, and spacing of the holes of the photomask.

[0043] The impact absorption layer is formed by separating the skeleton support and the impact buffer part, and the hardness is different from each other, and the impact absorption can be maximized in the multi-layer stacking structure. It is characterized in that in the process of forming such a skeleton support and the impact buffer part, UV types and photomasks are selectively used in a diversified manner.

[0044] By irradiating UV parallel light and introducing the composition for forming the impact absorbing layer between the substrate and the polymer to produce a three-dimensional shape, a skeleton scaffold as a cured structure can be formed parallel to the angle of the UV parallel light. In the impact absorbing layer, the remaining area except the skeleton scaffold generated by the UV parallel light can be irradiated with UV light with a lower intensity than the UV parallel light to form an impact buffer.

[0045] In the present invention, "UV light having an intensity lower than that of UV parallel light" refers to UV light having an intensity lower than that of UV parallel light during the process of removing the photomask and realizing exposure. Due to the UV light having an intensity lower than that of UV parallel light, the impact buffer formed around the cured impact absorbing layer skeleton support can form a cured structure with relatively low hardness. In this specification, the portion thus formed is referred to as an "impact buffer." In the point where the impact absorbing layer includes the impact absorbing layer skeleton support and the impact buffer, the impact buffer may be a peripheral portion surrounding the skeleton support. Since the structure cured by UV parallel light is hard, thereby improving durability, the impact buffer of the remaining portion except the cured structure disperses the impact, thereby playing a role in improving impact resistance, resilience and tensile strength.

[0046] The UV parallel light is irradiated to the photomask from directions 2 to 8, preferably, from directions 2 to 6, and more preferably, from directions 2 to 4. Moreover, the UV parallel light is irradiated at an angle greater than 0° and less than 90°, preferably, at an angle of 10° to 80°, based on a surface perpendicular to the exposure surface. The shape of the bone support formed in the impact absorbing layer on the substrate can be manufactured in a variety of ways according to the angle at which the UV parallel light is irradiated.

[0047] That is, the cross-sectional shape of the hole of the photomask can be various forms such as a circle, an ellipse, a straight line, a curve or a surface. In addition, the size of the mask hole, the interval between the holes, and the depth of the holes can also be varied. Since the degree of exposure and curing varies depending on the shape, interval, and depth of the mask hole, the physical properties of the impact absorbing layer can be changed, and when the impact absorbing layer is formed in this way for use, the cross-sectional shape, interval, and depth (thickness) of the hole can be designed in consideration of the impact absorption strength.

[0048] In the impact absorbing layer, preferably, the shape of the skeleton support formed according to the angle of the parallel light shows various forms such as a sandwich panel, a pyramid structure or a cone shape (cone array), but the shape is not limited thereto. Various shapes are possible depending on the cross-sectional shape, size, interval, depth of the mask hole, the intensity of the UV parallel light, and the irradiation angle of the UV parallel light.

[0049] The impact absorbing layer can be used for various purposes, for example, by using an adhesive component, it can be used as a 3D adhesive having a three-dimensional shape.

[0050] Figure 1 When irradiated with parallel light according to an embodiment of the present invention, images of (a) a prism structure, (b) a cone shape (cone array), (c) a triangular structure, and (d) a pyramid structure are formed according to the angle of the parallel light. Figure 1 , a variety of patterns can be formed while changing the shape of the photomask or the shape of the control.

[0051] Furthermore, even when UV parallel light is irradiated, the modulus of each product varies with the curing time. If the irradiation time of parallel light becomes longer, the cross-linking is completely carried out and the modulus increases. Figure 1 On the contrary, if the irradiation time of parallel light is short or no parallel light is irradiated, local solidification is formed, and thus a shock absorbing portion with a small modulus can be formed.

[0052] Figure 2 As an image showing a pattern of a photomask according to an embodiment of the present invention, there is an image showing a rectangular pattern (a) and a triangular pattern (b). Figure 2 For the purpose of explanation, D represents the diameter of a hole in a photomask, and L represents the interval between holes in the photomask. Figure 2(a) shows a case where the four holes of the photomask form a rectangle, and (b) shows a case where the intervals of L connected from the center points of the holes are the same. However, this is not limited to this, and the shape of the photomask can be changed in various ways for use, such as when D and L are at the same interval, when the interval of L is changed, when the pattern of the photomask holes is changed, etc. Regardless of the shape or size of the photomask, the size and interval of the holes, a structure (skeletal frame) with a high modulus is generated parallel to the parallel light passing through the photomask holes, and the portion that does not pass through the photomask can form an impact buffer.

[0053] Preferably, the modulus of the shock absorbing layer is 0.1KPa to 1KPa, more preferably, the modulus of the shock absorbing layer is 0.3KPa to 1KPa. Preferably, the modulus of the shock absorbing layer skeleton support forming the shock absorbing layer is 0.15KPa to 0.4KPa, more preferably, the modulus of the shock absorbing layer skeleton support forming the shock absorbing layer is 0.25KPa to 0.35KPa. Preferably, an impact buffer is formed around the skeleton support constituting the shock absorbing layer, so that preferably, the modulus of the shock absorbing layer is 0.10KPa to 0.30KPa.

[0054] In the polymer layer formed on the upper part of the impact absorbing layer forming composition, although the type of polymer is not limited, polyethylene terephthalate (PET) is preferred. Although the polymer itself can be used as the polymer layer, it is preferably applied after corona treatment. Preferably, the thickness of the polymer layer is 30 μm to 100 μm, and more preferably, the thickness of the polymer layer is 30 μm to 50 μm.

[0055] According to another aspect of the present invention, there is provided a method for forming a three-dimensional impact absorbing layer in a multi-layer stacked structure using UV parallel light, comprising the following steps: (a) coating a composition for forming an impact absorbing layer on a substrate; (b) forming a polymer layer on the upper portion of the composition; (c) placing a half-cut mask on the upper portion of the polymer layer; and (d) irradiating the half-cut mask with UV parallel light from 2 to 8 directions at an angle greater than 0° and less than 90° with a surface perpendicular to an exposure surface as a reference, the UV parallel light passing through the holes of the half-cut mask solidifies the impact absorbing layer skeleton scaffold in parallel with the angle of the parallel light, and the impact buffer portion around the skeleton scaffold is formed by the UV parallel light of the portion other than the holes of the half-cut mask, thereby completing the impact absorbing layer.

[0056] In another embodiment of the present invention, the two processes of using a photomask and removing the photomask are shortened to one process, and a three-dimensional impact absorbing layer can also be formed. In this process, in addition to the photomask as a conventional pattern mask, a pattern mask that adjusts the transmittance of UV light to a suitable degree in an on / off form instead of 100% or 0% can be used, and the term "half-cut mask" is used.

[0057] The half-cut mask is different from the photomask. When UV parallel light is irradiated, 100% of the strong UV parallel light is transmitted through the holes of the half-cut mask, thereby forming an impact absorption layer support. However, in the area other than the holes of the mask, only a part of the UV parallel light can be transmitted instead of the UV parallel light being completely transmitted. Therefore, since the part (the hole of the half-cut mask) with a ratio of 100% of the transmission of UV parallel light forms a skeleton support through one exposure, the part less than 100% (the area other than the hole of the half-cut mask) forms an impact buffer, the manufacturing process can be shortened compared to a conventional photomask. At this time, the transmittance of the part other than the hole of the half-cut mask can be appropriately adjusted in consideration of the curing rate of the impact buffer for use.

[0058] Since the curing speed of the impact absorbing layer-forming composition increases with the increase in the intensity of UV parallel light or the concentration of the initiator, the curing speed can be adjusted by adjusting the intensity of the parallel light or the concentration of the initiator.

[0059] According to another aspect of the present invention, there is provided a three-dimensional impact absorbing layer manufactured by the manufacturing method of the present invention.

[0060] The impact absorbing layer-forming composition may include a polymer and / or a copolymer, a photoinitiator, and a curing agent.

[0061] As the block copolymer, for example, polystyrene-polymethylmethacrylate copolymer, polybutadiene-polybutylmethacrylate copolymer, polybutadiene-polydimethylsiloxane copolymer, polybutadiene-polymethylmethacrylate copolymer, polybutadiene-polyvinylpyridine copolymer, polybutylacrylate-polymethylmethacrylate, polybutylacrylate-polyvinylpyridine, polyisoprene-polyvinylpyridine, polyisoprene-polymethylmethacrylate, polyhexylacrylate-polyvinylpyridine, polyisoprene-polyvinylpyridine, polyisoprene-polymethylmethacrylate, polyhexylacrylate-polyvinylpyridine, polyisoprene-polyvinylpyridine, polyisoprene-polymethylmethacrylate, polyisoprene ... polyhexylacrylate-polyvinylpyridine, polyisobutylene-polybutylmethacrylate, polyisobutylene-polymethylmethacrylate, polyisobutylene-polybutylmethacrylate, polyisobutylene-polydimethylsiloxane, polybutylmethacrylate-polybutylacrylate, polyethylethylene-polymethylmethacrylate, polystyrene-polybutylmethacrylate, polystyrene-polybutadiene, polystyrene-polyisoprene,Polystyrene-polydimethylsiloxane, polystyrene-polyvinylpyridine, polyethylene-polyvinylpyridine, polyethylene-polyvinylpyridine, polyvinylpyridine-polymethylmethacrylate, polyethyleneoxide-polyisoprene, polyethyleneoxide-polybutadiene, polyethyleneoxide-polystyrene, polyethyleneoxide-polymethylmethacrylate, polyethyleneoxide-polydimethylsiloxane, polystyrene-polyethyleneoxide, etc.

[0062] Preferably, the photoinitiator is selected from the group consisting of benzyldimethyl ketal (photoinitiator #651), 2-methyl-1-(4-methylthiophenyl)-2-morpholino-1-propanone (2-methyl-1[4-(methytlhio)phenyl]-2-morpholino-propan-1-on (photoinitiator #907), α,α-methoxy-α-hydroxyacetophenone (Irgacure #651) and 2-hydroxy-2-methyl-1-phenyl-propan-1-one (2-hydroxy-2-methyl-1-phenyl-propan-1-one; photoinitiator #1173).

[0063] The solvent of the composition for forming the impact absorbing layer is not particularly limited. If only some examples of suitable solvents are given, the following solvents can be used alone or in mixtures thereof: ethylene glycol monomethyl ethyl, ethylene glycol monoethyl ether, ethylene glycol monomethyl ether, ethylene glycol monoacetate, diethylene glycol, diethylene glycol monoethyl ether, propylene glycol monomethyl ether acetate, propylene glycol, propylene glycol monoacetate, toluene, xylene, methyl ethyl ketone, methyl isoamyl ketone, cyclohexanone, dioxane, methyl lactate, ethyl lactate, methyl pyruvate, ethyl pyruvate, methyl methoxypropionate, ethyl ethoxypropionate, N,N-dimethylformamide, N,N-dimethylformamide, ethyl acetate, 2-hydroxyethyl propionic acid, 2-hydroxy-2-methylethyl propionic acid, ethyl ethoxylate, ethyl hydroxylate, methyl 2-hydroxy-3-methylbutyrate, methyl 3-methoxy-2-methylpropionic acid, 3-ethoxy and propionic acid, 3-methoxy-2-methylethylpropionic acid, 4-methyl-2-pentanol, 4-methyl-2-pentanol acetate, isopropanol, methanol, ethanol, n-butanol, cyclopentanol, cyclopentanone, ethyl acetate, butyl acetate, etc.

[0064] The impact absorbing layer forming composition of the present invention may also include additives such as surfactants. As the surfactant, surfactants used in the art (e.g., fluorine-based surfactants, anionic surfactants, cationic surfactants, nonionic surfactants, etc.) can be used without particular limitation.

[0065] According to another aspect of the present invention, a device having a stacked structure including a three-dimensional impact absorbing layer is provided. The device can also be applied to display panels, for example, all devices for foldable, rollable, and flat panel displays such as organic light-emitting diodes (OLEDs).

[0066] The impact absorbing layer of the present invention includes both a skeleton support and an impact buffer part around the skeleton support, thereby increasing the durability of the component, and the impact resistance, resilience and tensile strength are improved, thereby being strong against internal and external impacts. Therefore, it can also be applied to other application fields such as display protective films, various packaging materials, home appliance protective agents and protective films for electronic equipment.

[0067] In this specification, when it is mentioned that a part "includes" a certain constituent element, it means that other constituent elements are not excluded but may also be included. In addition, the terms used in this specification are used to illustrate the embodiments and are not used to limit the present invention. In this specification, unless otherwise specified in a sentence, the singular form also includes the plural form.

[0068] In this specification, expressions such as "A or B", "at least one of A and / or B", or "one or more of A and / or B" may include all possible combinations of the items listed together. For example, "A or B", "at least one of A and B", or "at least one of A or B" may mean: (1) including at least one A; (2) including at least one B; or (3) including both at least one A and at least one B.

[0069] Hereinafter, preferred embodiments are given to illustrate the present invention in more detail. However, these embodiments are used to illustrate the present invention in more detail, and the scope of the present invention is not limited thereto, which is obvious to those skilled in the art to which the present invention belongs. DETAILED DESCRIPTION

[0070] <Example 1>

[0071] Example 1

[0072] As the composition of the adhesive, 30g of photoinitiator (irgacure) 980, 9g of isobornyl acrylate (IBOA), 0.3g of acetic acid (AA), and 0.4g of photoinitiator (irgacure) 651 were used, and as the curing agent, 0.04g of 1,6-hexanediol diacrylate (HDDA) or 0.04g of TMPTA was used. The adhesive was applied to a thickness of 1mm. It was confirmed how the cured shape changed depending on the film thickness and UV irradiation time. For the cured shape (3Dpattrun), ethyl acetate (EAC: Ethylacetate) or toluene that can dissolve the adhesive that is not cross-linked after curing was used as a solvent, and the adhesive was cleaned and removed using the solvent to confirm the pattern morphology. A photomask with a hole diameter of 800μm and a hole spacing of 1200μm was used.

[0073] Example 2-Parallel light irradiation experiment

[0074] Experiments were conducted by changing the UV irradiation amount, time, photoinitiator, and curing agent by multi-directional irradiation. In order to create a 3D pattern, experiments were conducted to realize the pattern by irradiating in one direction, two directions, and four directions at a 45-degree angle. The more directions are irradiated, the more repeatedly UV is received, so the UV irradiation amount and time must be adjusted accordingly, and the type and content of the photoinitiator and curing agent must be adjusted accordingly.

[0075] <Results and Evaluation>

[0076] The result of illuminating only parallel light

[0077] Figure 4 4 is a graph showing a stress-strain curve according to the use time of the curing agent TMPTA when only parallel light is irradiated according to an embodiment of the present invention.

[0078] Reference Figure 4 For explanation, only parallel light was irradiated without a photomask, and then the overall UV irradiation for manufacturing the impact absorbing layer was not performed. The stress-strain curves according to the time of 140 seconds, 160 seconds, 180 seconds, 220 seconds, 260 seconds, 300 seconds, and 340 seconds were confirmed. For the parallel light machine, irradiation for more than 340 seconds was not possible because 340 seconds was the maximum irradiation time. In the case of manufacturing a structure using a photomask, the structure performed best when irradiated with parallel light for 130 seconds.

[0079] Figure 5 This is a graph measuring the modulus of a pressure-sensitive adhesive when only parallel light is irradiated according to an embodiment of the present invention. The respective values ​​are shown in Table 1 below:

[0080] [Table 1]

[0081]

[0082] Reference Figure 5 As shown in Table 1, when parallel light is irradiated only without a photomask and UV irradiation, the modulus of the pressure-sensitive adhesive is highest at 300 seconds.

[0083] Parallel light and overall UV irradiation

[0084] Parallel light was irradiated without a photomask, and then overall UV irradiation was performed.

[0085] Figure 6 FIG. 4 is a graph showing a stress-strain curve when parallel light and UV light are irradiated without using a photomask according to an embodiment of the present invention.

[0086] Figure 7 This is a graph of the modulus according to time when parallel light and UV are irradiated without using a photomask according to one embodiment of the present invention. The values ​​are shown in Table 2 below:

[0087] [Table 2]

[0088] 120s_60s 340s_90s Modulus(KPa) 0.234531 0.317365

[0089] Figure 7 The times in Table 2 represent the parallel light irradiation time and the overall UV irradiation time, respectively. Parallel light was irradiated without a photomask to form a pyramid structure, and an impact absorption surface was formed in the portion where the pyramid structure was not formed by UV irradiation. After 120 seconds of parallel light irradiation before the structure was optimal, the overall UV irradiation of 60 seconds showed the lowest modulus value. After 340 seconds of irradiation as the maximum irradiation time, the overall UV irradiation of 90 seconds showed the highest modulus value.

[0090] Overall UV irradiation without collimated light

[0091] Figure 8 FIG. 4 is a graph showing a stress-strain curve when only the entire surface is irradiated with UV light without a photomask according to an embodiment of the present invention.

[0092] Fig. 9 This is a graph measuring the modulus of a pressure-sensitive adhesive when only the entire UV is irradiated without a photomask according to an embodiment of the present invention. The respective values ​​are shown in the following Table 3:

[0093] [Table 3]

[0094]

[0095] Reference Figure 8 , Fig. 9 As shown in Table 3, without a photomask, the overall UV irradiation was performed for 60 seconds, 70 seconds, 80 seconds, 90 seconds, 100 seconds, 110 seconds, and 130 seconds, and at this time, parallel light irradiation was not performed. The shortest time that the manufactured adhesive does not adhere to the hand is about 45-50 seconds. Therefore, the experiment was performed after 60 seconds. Since the modulus value is the highest when irradiated for 90 seconds, it is considered that there is no significant significance in conducting the experiment under the condition of a time greater than 90 seconds.

[0096] Irradiate the photomask with parallel light and full UV

[0097] Fig.10 4 is a graph showing a stress-strain curve when UV is irradiated after parallel light is irradiated onto a photomask according to an embodiment of the present invention.

[0098] Fig.11 This is a graph measuring the modulus of a pressure-sensitive adhesive when UV is irradiated after irradiating parallel light to a photomask according to an embodiment of the present invention. The respective values ​​are shown in Table 4 below:

[0099] [Table 4]

[0100] 300s_90s 160s_45s Modulus(KPa) 0.613772 0.430539

[0101] Reference Fig.10 , Fig.11 Table 4 is a diagram showing the situation where the entire structure is irradiated with UV for 90 seconds after irradiating with parallel light for 300 seconds using a photomask, and the entire structure is irradiated with UV for 45 seconds after irradiating with parallel light for 160 seconds using a photomask. Through the above experiment, by combining the conditions with the highest modulus and the conditions with the lowest modulus, the highest modulus value and the lowest modulus value when the structure is formed are measured.

[0102] When a photomask was used and both parallel light and UV were irradiated, it was confirmed that the highest modulus was formed when the parallel light was irradiated for 300 seconds and then the UV was irradiated for 90 seconds.

[0103] In summary, it was found that the 3D structure spring was formed according to the size and interval of the photomask holes, the 3D structure spring was formed by irradiating parallel light to the polymer and curing it, and the 3D structure spring was formed according to the irradiation time of the parallel light. It has been confirmed that the interval of the holes formed, the size of the holes, and the pattern of the holes can also be changed in the three-dimensional structured pressure-sensitive adhesive.

[0104] In order to better understand the claims of the present invention, the foregoing content describes the features and technical points of the present invention in a slightly broad manner. Personnel with ordinary knowledge in the technical field to which the present invention belongs will be able to understand that the technical ideas or essential features of the present invention can be implemented in other specific forms without changing them. Therefore, it should be understood that the embodiments described above are exemplary and non-restrictive in all aspects. The scope of the present invention is shown by the claims, rather than by the above detailed description, and should be interpreted as all changes or deformations derived from the scope of the claims and their equivalent concepts are included in the scope of the present invention.

Claims

1. A method for forming a three-dimensional impact absorbing layer using UV parallel light in a multi-layer stacked structure, characterized in that: The steps include: (a) coating a composition for forming an impact absorbing layer comprising a polymer, a photoinitiator and a curing agent on an upper portion of a substrate; (b) forming a polymer layer on the upper portion of the composition; (c) placing a photomask on top of the polymer layer; (d) irradiating UV parallel light from 2 to 8 directions to the photomask at an angle greater than 0° and less than 90° with a surface perpendicular to the exposure surface as a reference, so that the impact absorbing layer bone scaffold is cured parallel to the angle of the parallel light; as well as (e) forming an impact buffer having a cured structure lower in hardness than the bone scaffold by removing the photomask and irradiating UV light having a lower intensity than the UV parallel light.

2. A method for forming a three-dimensional impact absorbing layer in a multi-layer stacked structure using UV parallel light, characterized in that: The steps include: (a) coating a composition for forming an impact absorbing layer comprising a polymer, a photoinitiator and a curing agent on a substrate; (b) forming a polymer layer on the upper portion of the composition; (c) placing a half-cut mask on the upper portion of the polymer layer; as well as (d) With the surface perpendicular to the exposure surface as a reference, UV parallel light is irradiated toward the half-cut mask from directions 2 to 8 at an angle greater than 0° and less than 90°, the UV parallel light passing through the holes of the half-cut mask is parallel to the angle of the parallel light to cure the impact absorbing layer bone scaffold, and the UV parallel light of the portion other than the holes of the half-cut mask forms an impact buffer portion having a cured structure with a lower hardness than the bone scaffold.

3. A three-dimensional impact absorbing layer, characterized in that: The three-dimensional impact absorbing layer is manufactured using the method according to claim 1 or 2.

4. The three-dimensional impact absorbing layer according to claim 3, characterized in that: The impact absorbing layer skeleton support is selected from one or more of a sandwich panel, a pyramid structure or a cone structure.

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